Classifications

• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
  • H01L21/67005—Apparatus not specifically provided for elsewhere
  • H01L21/67011—Apparatus for manufacture or treatment
  • H01L21/67017—Apparatus for fluid treatment
  • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
  • H01L21/67005—Apparatus not specifically provided for elsewhere
  • H01L21/67011—Apparatus for manufacture or treatment
  • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
  • H01L21/67005—Apparatus not specifically provided for elsewhere
  • H01L21/67011—Apparatus for manufacture or treatment
  • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
  • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
  • H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement

Definitions

• An apparatus that applies protective coatings to electronic device assemblies may be included in a variety of assembly and production systems.
• components of an electronic device assembly may be assembled with one another or disassembled from one another, optionally treated, then introduced into a coating application element.
• the electronic device assembly and/or the coating may be inspected (e.g., the electronic device assembly, upstream of or downstream from the coating application element; the protective coating, downstream from the coating application element).
• an assembly or production system may include elements that enable further treatment (e.g., material removal, cleaning, drying, etc.) of an electronic device assembly, as well as further assembly of the electronic device assembly, including complete assembly thereof. Any or all elements of such as a system may be in-line with a line, or one or more elements of such a system may be off-line.
• FIG. 2 is a schematic representation of an embodiment of a production or assembly line into which the apparatus of FIG. 1 has been integrated or incorporated;
• Such an embodiment may be configured for incorporation into an assembly line 200 without blocking or otherwise impeding movement along either or both of the aisles 202 that are adjacent to the assembly line 200, or requiring that the assembly line 200 be moved or significantly restructured to accommodate the apparatus 100.
• the apparatus 100 may significantly block or impede movement along one or more of the aisles 202.
• the precursor material Prior to introduction into the deposition chamber, the precursor material may be vaporized. The vaporized precursor material may then be subjected to pyrolysis or otherwise treated to create reactive species for introduction into the deposition chamber of the coating element 114.
• the valving system may enable control of temperature, pressure or other conditions of the pyrolysis chamber while operation of the vaporization and/or deposition chambers is interrupted.
• a valving system 128 may also allow control of flow rates of material through the apparatus.
• the valving system 128 may include a first stop valve 132 between the vaporization chamber 124 and the pyrolysis chamber 126.
• a second stop valve 134 may be positioned between the pyrolysis chamber 126 and the coating element 114.
• the valving system 128 may also include one or more control valves 136, 138, which may be used to control the rate at which materials flow into, through, or out of one or more elements of the supply system 122.
• the assembly element 308 may also apply a conductive material (e.g., aluminum, nickel, gold, solder, etc.) or other intermediate conductive element to various contact elements of the circuit board and/or semiconductor component. Any of a variety of different types of intermediate conductive elements may be secured to or formed on the contact elements, including, without limitation, solder balls, columns, pillars, leads (e.g., J-shaped leads, gull wing-shaped leads, etc.) or other structures formed from electrically conductive material, such as a metal, metal alloy, conductive epoxy, or the like; a so-called "z-axis" conductive film, which includes a dielectric substrate with discrete, electrically isolated conductive elements extending through the thickness of the dielectric substrate; and the like.
• intermediate conductive elements are formed from solder, screen printing apparatus, jet printing devices, and the like can be used to selectively apply solder paste (which includes solder and flux) to desired contact elements.
• the assembly element 308 may also optionally include pick-and-place
• the treatment element 310 may act to mask or select some surfaces to be treated by a subsequent treatment element or by a treatment chamber within the coating element 304.
• the treatment element 310 may include masking apparatuses or systems. Masking may be configured to prevent or limit where a coating is applied. For instance, a coating may not be desired for some surfaces (e.g., on electrical contacts, where intermittent mechanical connection is desired, on optical elements (e.g., a camera lens, a display, etc.), etc.), and such surfaces may be covered or masked.
• Some embodiments comprise physically masking elements to which a protective coating is to be applied, whether before or after assembly, while other embodiments contemplate depositing a selectively removable temporary mask onto a component to which a protective resistant coating is to be applied.
• the rate at which the protective coating is applied to the treated electronic device assembly 302d may be faster or slower than the rate at which the electronic device assemblies 302c are treated at the treatment element 310. Additionally, or alternatively, there may be a delay following treatment and coating. For instance, a capacity of the treatment element 310 may be less than a capacity of the coating element 304. Thus, there may be a delay while some treated electronic device assemblies 302d wait for a larger batch of treated electronic device assemblies 302 to be coated using the coating element 304. Of course, a similar occurrence may be present between any elements of the assembly system 300.
• an inspection element 314 may be provided after assembly of an electronic device assembly (whether before or after coating components thereof).
• the inspection element 314 shown in FIG. 3 may, for instance, inspect the assembled electronic device assembly 302g to inspect its
• a treatment element 510 may be upstream relative to the disassembly element 508.
• the components of the electronic device assembly 502c may be cleaned, washed, dried, de-gassed, re-surfaced, or otherwise treated. Examples of suitable treatments that may be applied are discussed in greater detail herein, and may include, in part, a treatment to remove or neutralize flux, oils, or other contaminants from all or a portion of the electronic device assembly 502c, application of a texture to all or some exposed surfaces within the electronic device assembly 502c, masking of all or a portion of the electronic device assembly 502c, and the like.
• Treatment by the post-treatment element 516 may include treatment as described herein or understood in view of the disclosure herein, including removal of material (including masking and/or coating materials), cleaning, washing, drying, or other treatments.

Landscapes

• Engineering & Computer Science (AREA)
• Physics & Mathematics (AREA)
• Condensed Matter Physics & Semiconductors (AREA)
• General Physics & Mathematics (AREA)
• Manufacturing & Machinery (AREA)
• Computer Hardware Design (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Power Engineering (AREA)
• Coating Apparatus (AREA)
• Application Of Or Painting With Fluid Materials (AREA)

Applications Claiming Priority (5)

Publications (2)

Family

ID=49769677

Family Applications (1)

Country Status (2)

Families Citing this family (3)

Family Cites Families (9)

• 2013
  • 2013-06-18 EP EP13807362.2A patent/EP2862428A4/de not_active Withdrawn
  • 2013-06-18 WO PCT/US2013/046371 patent/WO2013192209A2/en active Application Filing

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