EP2852830A1 - Procédé de reconnaissance d'une structure à appliquer sur un substrat, comprenant plusieurs unités optiques de prise de vues, ainsi que dispositif associé - Google Patents

Procédé de reconnaissance d'une structure à appliquer sur un substrat, comprenant plusieurs unités optiques de prise de vues, ainsi que dispositif associé

Info

Publication number
EP2852830A1
EP2852830A1 EP13723127.0A EP13723127A EP2852830A1 EP 2852830 A1 EP2852830 A1 EP 2852830A1 EP 13723127 A EP13723127 A EP 13723127A EP 2852830 A1 EP2852830 A1 EP 2852830A1
Authority
EP
European Patent Office
Prior art keywords
image
optical
optical recording
devices
sensor head
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP13723127.0A
Other languages
German (de)
English (en)
Inventor
Bernhard Gruber
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
QUISS Qualitaets InspektionsSysteme und Service GmbH
Original Assignee
QUISS Qualitaets InspektionsSysteme und Service GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by QUISS Qualitaets InspektionsSysteme und Service GmbH filed Critical QUISS Qualitaets InspektionsSysteme und Service GmbH
Publication of EP2852830A1 publication Critical patent/EP2852830A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/001—Industrial image inspection using an image reference approach
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T11/00—2D [Two Dimensional] image generation
    • G06T11/60—Editing figures and text; Combining figures or text
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/70—Determining position or orientation of objects or cameras
    • G06T7/73—Determining position or orientation of objects or cameras using feature-based methods
    • G06T7/74—Determining position or orientation of objects or cameras using feature-based methods involving reference images or patches
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/60—Control of cameras or camera modules
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/45—Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from two or more image sensors being of different type or operating in different modes, e.g. with a CMOS sensor for moving images in combination with a charge-coupled device [CCD] for still images
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/56—Cameras or camera modules comprising electronic image sensors; Control thereof provided with illuminating means
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/60—Control of cameras or camera modules
    • H04N23/65—Control of camera operation in relation to power supply
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/60—Control of cameras or camera modules
    • H04N23/698—Control of cameras or camera modules for achieving an enlarged field of view, e.g. panoramic image capture

Definitions

  • the present invention relates to a method for recognizing and evaluating a structure to be applied to a substrate with at least one or more optical image recording units according to the preamble of claim 1 and a corresponding apparatus therefor.
  • the problem here is the web-like course of the structure to be applied to the substrate, since the structure changes depending on the movement of the applicator relative to the substrate from the surveillance area of a camera in the surveillance area of another camera for the viewer of the respective images of a camera arises no easy to understand representation of the course of the adhesive trace.
  • At least one optical recording device in particular a plurality of preferably three optical recording devices is provided, wherein the images of the optical recording devices are connected to a plan view such that the representation of the optical recording devices is output in a common image, wherein the optical recording devices as a center Application device for applying the structure to the substrate.
  • the images of the optical pickup devices consisting of a plurality of image acquisition sensors, are assembled into an overall image to give a 360 ° view around the application unit.
  • the overall picture is already assembled in the sensor head, which reduces the wiring.
  • the implementation of several optical units within the sensor allows a very compact sensor.
  • At least two, preferably three optical recording devices (CCD or CMOS chips) are already assembled in the sensor head to form a preferably round overall image
  • the image acquisition frequency is increased in accordance with the data reduction by the inclusion of only a defined section of the image of each optical recording device, wherein the cutout is preferably a disk segment.
  • the read range is defined during the calibration and thus electronically adjusted. Due to the defined section of the image for the further image analysis, a mechanical calibration of the recording devices can be omitted, whereby set-up times and complex alignment elements can be saved since the calibration is done electronically by the defined selection of the section of the image Furthermore, by the defined limitation of the image to be evaluated respective optical pickup device, the image pickup frequency can be increased.
  • the optical pickup devices in a sensor head around the Ordering device are arranged, wherein the optical pickup devices each have a CCD chip or CMOS chip, which are each connected in the sensor head with a device for composition of the overall picture, then reduce the required components whereby a compact design of the device according to the invention is also possible.
  • the compact design again geometrically complex component can be checked because the sensor head has smaller outer dimensions. If three image sensors, in particular CCD or C OS image sensors, are already combined to form an image in the sensor head and transmitted as an overall image to the external image evaluation unit, this reduces the required components and enables a more compact design of the sensor system. In addition, only one full image per shot is transmitted, so that the wiring is reduced.
  • Another significant advantage is that the image sensors record the images synchronously and thus a temporal assignment of the individual biosensors is not required
  • the optical pickup devices in the sensor head are connected to a device for triggering and flashing control of the illumination, which is designed in particular in the form of a multiplicity of flashed LEDs in the sensor head.
  • the image sensors are triggered synchronously with the illumination with a short exposure time.
  • a separate trigger line from an external image evaluation unit was previously required.
  • Another advantage of the invention is that the optical recording devices, the trigger and flash control device and the device for the composition of the overall image are connected in the sensor head such that a single connection from the sensor head to an external processing device, in particular an Ethernet connection, to Detecting and checking the structure to be applied is provided, so that the controller for the flash controller is integrated into the sensor.
  • Main advantage of Power over Ethernet is that you can save a power supply cable and so in hard to reach places or In areas where many cables would be able to install Ethernet-attached devices.
  • monitoring automatically shifts from one disk segment of an optical recording device to another disk segment of the adjacent optical recording device when the job structure to be monitored extends from one disk segment of one optical recording device to another disk segment of the adjacent optical recording device.
  • Figure 1 shows a schematic representation of the method according to the invention for monitoring a trace of adhesive.
  • FIG. 2 shows a schematic representation of the method according to the invention of FIG. 1.
  • Figure 3 shows a schematic representation of the image according to the inventive method of Fig. 1 and 2 without adhesive trace.
  • FIG. 4 shows an image of cameras according to the prior art for adhesive monitoring.
  • FIG. 5 is an illustration of a device according to the invention.
  • Figure 6 shows an illustration of a device according to the invention with trigger and flash control.
  • FIG. 7 shows an illustration of a device according to the invention with connecting lines.
  • FIGS. 1 to 3 the essential features for applying and detecting a glue trace according to the invention are shown.
  • Three staggered squares 10, 20 and 30 each show a strip of images from three optical pickup devices, which are preferably arranged in a sensor head around an applicator, which is indicated schematically by the circle 40. Between the circle 40 of the applicator and the outer monitoring circuit 50, the monitoring of the adhesive track, not shown, takes place.
  • Fig. 2 the squares 10, 20 and 30 are shown separately, each showing a strip of images of three optical pickup devices used for image evaluation.
  • Fig. 3 shows an overall image of the active area of the adhesive inspection, wherein the images of the optical pickup devices in disc segments 11, 21, 31 are connected to a plan view, that the representation of the optical pickup devices is output in a common image, wherein the optical pickup devices as a center an applicator for applying the structure to the substrate.
  • the disk segments 11, 21, 31 result in each case through the image strips 10, 20, 30, wherein the boundary region extends from the center to the outside and is bounded by the outer ring 50 and the inner circle 40.
  • the adhesive track to be monitored thus always runs from the inner cage 40 to the outside and is checked and displayed in at least one slice segment 11, 21, 31, so that the viewing is simplified for users who can easily grasp the course of the order structure by the generated plan view. which has led to ambiguities in the known representation according to the unstructured image strips such as in Figures 5 and 6 of EP 1701803 and in Fig. 4 in particular in the transition from a camera to the next camera for the viewer.
  • the image strip 19, 29, 39 is shown below one another, which according to FIG. 1 corresponds to the image strip 10, 20, 30 with respective overlapping regions.
  • the view according to the invention of FIG. 3 gives the viewer a view which on the one hand enables the viewing angle from the perspective of the application device and on the other hand simplifies the documentation of the order structure.
  • the images of the optical Aufhahrnevorraumen consisting of several image sensing sensors, to form an overall image consisting of disk segments 11, 21, 31, to a 360 ° view around the Order unit.
  • the device according to the invention for detecting a structure to be applied to a substrate according to FIGS. 5 to 7 will now be explained below.
  • an exemplary sensor head 80 of the device according to the invention is shown, in which 3 CCD chips 51, 52, 53 are arranged concentrically around an opening for an applicator, not shown. Further, in the sensor head 80 of a device for composition of the overall image 71 is provided, with which the 3 CCD chips 51, 52, 53 are connected to already generate an overall image in the sensor head, which is passed to an external evaluation unit, which is the wiring reduced
  • FIG. 6 the structure of FIG. 5 is extended by a schematically illustrated device for trigger and flash control 72 for a lighting module, which may be designed in particular in the form of a plurality of flashed LEDs in the sensor head.
  • the image sensors are triggered synchronously with the illumination with a short exposure tent.
  • a separate trigger line from an external image evaluation unit was previously required. By optically coupling the illumination in the sensor, the trigger for the image sensors is generated, thereby eliminating the trigger line
  • Fig. 7 shows the structure of the device according to the invention of Fig. 6, wherein the electrical connections between the CCD chips 51, 52, 53 and the means for composition of the overall image 71 are respectively shown, which in turn with the means for trigger and flash control 72 is connected to a lighting module. Therefore, it is a further advantage of the invention that the optical pickup devices 51, 52, 53, the trigger and flash control device 72 and the total image composition device 71 are so connected in the sensor head that a single connection from the sensor head to an external one Processing device, in particular an Ethernet connection, is provided for detecting and checking the structure to be applied, so that the controller for the flash controller is integrated into the sensor This reduces the wiring, since only Gigabit Ethernet connection plus Power over Ethernet for the inventive device is sufficient.
  • the teach-in run may generate the image sequence which then allows for automatic parameterization.
  • This parameterization may optionally be preset by the user and used for the inspection run along with a history file for the inspection of an applied adhesive trace
  • the invention describes a method and a device having at least one optical recording device, in particular a plurality of preferably three optical recording devices, wherein the images of the optical recording devices are connected to a plan view such that the representation of the optical recording devices is output in a common image, wherein the optical pickup devices as center have an application device for applying the structure to the substrate.

Abstract

L'invention concerne un procédé et un dispositif de reconnaissance d'une structure à appliquer sur un substrat, de préférence un cordon de colle ou une bande de produit d'étanchéité, comprenant au moins un dispositif optique de prise de vues, en particulier plusieurs dispositifs optiques de prise de vues. Selon l'invention, les images des dispositifs optiques de prise de vues sont rassemblées pour produire une vue de dessus de telle manière que la représentation des dispositifs optiques de prise de vues est rendue dans une image commune. Les dispositifs optiques de prise de vues comportent en tant que centre un dispositif d'application servant à l'application de la structure sur le substrat.
EP13723127.0A 2012-05-21 2013-05-15 Procédé de reconnaissance d'une structure à appliquer sur un substrat, comprenant plusieurs unités optiques de prise de vues, ainsi que dispositif associé Withdrawn EP2852830A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102012009859.6A DE102012009859B4 (de) 2012-05-21 2012-05-21 Verfahren zum Erkennen einer auf einem Substrat aufzubringenden Struktur mit mehreren optischen Bild-Aufnahmeeinheiten sowie einer Vorrichtung hierfür
PCT/EP2013/060044 WO2013174696A1 (fr) 2012-05-21 2013-05-15 Procédé de reconnaissance d'une structure à appliquer sur un substrat, comprenant plusieurs unités optiques de prise de vues, ainsi que dispositif associé

Publications (1)

Publication Number Publication Date
EP2852830A1 true EP2852830A1 (fr) 2015-04-01

Family

ID=48446348

Family Applications (1)

Application Number Title Priority Date Filing Date
EP13723127.0A Withdrawn EP2852830A1 (fr) 2012-05-21 2013-05-15 Procédé de reconnaissance d'une structure à appliquer sur un substrat, comprenant plusieurs unités optiques de prise de vues, ainsi que dispositif associé

Country Status (7)

Country Link
US (1) US20150146969A1 (fr)
EP (1) EP2852830A1 (fr)
KR (1) KR20150023428A (fr)
CN (1) CN104487826A (fr)
DE (1) DE102012009859B4 (fr)
WO (1) WO2013174696A1 (fr)
ZA (1) ZA201408360B (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9885562B2 (en) 2015-07-06 2018-02-06 Recognition Robotics, Inc. Measuring system and method using light source and cylindrical mirror
CN109724531B (zh) * 2018-10-18 2021-05-28 苏州光图智能科技有限公司 360°轮廓测量方法
CN109449093B (zh) * 2018-10-24 2020-12-04 武汉新芯集成电路制造有限公司 晶圆检测方法
DE102021132185A1 (de) 2021-12-07 2023-06-07 Sener Cicek Anlage und Verfahren zum Bearbeiten eines Bauteils

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04242950A (ja) * 1991-01-07 1992-08-31 Toshiba Corp パターン認識方法
DE19909534B4 (de) * 1999-03-04 2011-07-07 BYK-Gardner GmbH, 82538 Vorrichtung und Verfahren zur Bestimmung der Qualität strukturierter Oberflächen
US6778683B1 (en) * 1999-12-08 2004-08-17 Federal Express Corporation Method and apparatus for reading and decoding information
US6541757B2 (en) * 2001-02-21 2003-04-01 Fanuc Robotics North America, Inc. Detection assembly for detecting dispensed material
US6638787B1 (en) * 2001-12-04 2003-10-28 Pulnix America, Inc. High-frame-rate CCD imaging devices made in low-production runs from otherwise ordinary and inexpensive CCD devices
EP1455179A1 (fr) * 2003-03-07 2004-09-08 MV Research Limited Système de vision artificielle et procédé pour l'inspection
DE10361018C9 (de) * 2003-12-23 2021-03-04 QUISS Qualitäts-Inspektionssysteme und Service GmbH Verfahren zum Erkennen einer auf einem Substrat aufzubringenden Struktur mit mehreren Kameras sowie eine Vorrichtung hierfür
US20090268983A1 (en) * 2005-07-25 2009-10-29 The Regents Of The University Of California Digital imaging system and method using multiple digital image sensors to produce large high-resolution gapless mosaic images
DE102006018558B4 (de) * 2006-04-21 2022-10-06 QUISS Qualitäts-Inspektionssysteme und Service GmbH Verfahren zum automatischen Aufbringen oder Erzeugen und Überwachen einer auf einem Substrat aufgebrachten Struktur mit Ermittlung von geometrischen Abmessungen

Non-Patent Citations (2)

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Title
None *
See also references of WO2013174696A1 *

Also Published As

Publication number Publication date
CN104487826A (zh) 2015-04-01
DE102012009859B4 (de) 2019-05-16
DE102012009859A1 (de) 2013-11-21
US20150146969A1 (en) 2015-05-28
KR20150023428A (ko) 2015-03-05
WO2013174696A1 (fr) 2013-11-28
ZA201408360B (en) 2016-08-31

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