EP2824379A1 - Lampe - Google Patents

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Publication number
EP2824379A1
EP2824379A1 EP14176776.4A EP14176776A EP2824379A1 EP 2824379 A1 EP2824379 A1 EP 2824379A1 EP 14176776 A EP14176776 A EP 14176776A EP 2824379 A1 EP2824379 A1 EP 2824379A1
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EP
European Patent Office
Prior art keywords
lamp
arrangement
lamp according
leds
envelope
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP14176776.4A
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German (de)
English (en)
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EP2824379B1 (fr
Inventor
Markus Winkler
Martin Enenkel
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Vosla GmbH
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Vosla GmbH
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Publication of EP2824379A1 publication Critical patent/EP2824379A1/fr
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/506—Cooling arrangements characterised by the adaptation for cooling of specific components of globes, bowls or cover glasses
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/27—Retrofit light sources for lighting devices with two fittings for each light source, e.g. for substitution of fluorescent tubes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/60—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air
    • F21V29/65—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air the gas flowing in a closed circuit
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/60—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air
    • F21V29/67—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air characterised by the arrangement of fans
    • F21V29/677—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air characterised by the arrangement of fans the fans being used for discharging
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
    • F21V3/06—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material
    • F21V3/061—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material the material being glass
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
    • F21V3/06—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material
    • F21V3/062—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material the material being plastics
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/04—Arrangement of electric circuit elements in or on lighting devices the elements being switches
    • F21V23/0442—Arrangement of electric circuit elements in or on lighting devices the elements being switches activated by means of a sensor, e.g. motion or photodetectors
    • F21V23/0464—Arrangement of electric circuit elements in or on lighting devices the elements being switches activated by means of a sensor, e.g. motion or photodetectors the sensor sensing the level of ambient illumination, e.g. dawn or dusk sensors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the present invention relates to an LED-based lamp, in particular a so-called retrofit lamp.
  • An incandescent lamp is an artificial light source in which an electrical conductor is heated by electric current and thereby excited to shine.
  • the widespread design of this incandescent lamp with screw base is colloquially referred to as a light bulb due to the shape of the glass bulb.
  • Conventional incandescent lamps generally consist of a socket including the electric power supply in the squeeze foot and a glass bulb, which shields the filament and its holder from the outside environment.
  • Such incandescent lamps have a relatively low luminous efficacy and high thermal radiation, and therefore low energy efficiency, so that the majority of the electrically supplied energy is emitted in the form of heat energy and only to a lesser extent in the form of light. For this reason, among other things, since the beginning of 2008, production and distribution bans for incandescent lamps with low energy efficiency have been implemented in stages in the European Union on the basis of the Ecodesign Directive 2005/32 / EC.
  • a light-emitting diode (or "LED” for short) is a light-emitting semiconductor component whose electrical properties correspond to those of a diode. If electrical current flows through the diode in the forward direction, it emits light, infrared radiation or also UV radiation with a wavelength dependent on the semiconductor material and the doping of the particular semiconductor material used.
  • LEDs In contrast to the conventional incandescent bulb with glass bulb, filament and socket LEDs are not temperature radiators, so that their luminous efficacy is very high. LEDs emit light in a limited spectral range that is nearly monochrome. In addition, they are characterized by a very long life, are insensitive to shocks and do not require a hollow body that could implode. Meanwhile, LEDs are also available with sufficiently high light output, so that they can also be used for applications with high light radiation. At the time of registration, the available luminous flux of LEDS is so high that, with a comparable size and comparable production costs, even with an electrical comparison, they can increasingly compete with incandescent lamps.
  • retrofit lamps are increasingly being offered, which are light sources that resemble the design of a known incandescent lamp and thus have a lamp base, which is used in a conventional light socket can be.
  • retrofit lamps are often mentioned in the literature, for example in the DE 20 2013 000 980 U1 and the DE 10 2009 035 515 A1 .
  • LED based Retrofit lamps are the corresponding LEDs arranged inside the glass bulb, for example in the DE 20 2011 000 010 U1 , of the DE 20 2013 000 980 U1 and the DE 10 2007 038 216 A1 are described.
  • LED based lamps typically require a heat sink to dissipate the heat selectively generated by the plurality of LEDs used and to prevent overheating of the LEDs from adversely affecting their function and life.
  • the LEDs are therefore usually coupled to a heat sink. Due to the heat sink, there are limitations in the design and placement of the LEDs within the glass bulb of the lamp. Since LEDs - within a respective opening angle - can only emit light in one direction, the light shading of the rear side of the LEDs, which is not present in the case of a filament of an incandescent lamp, results. Nevertheless, to send out light in all directions, there are various solutions:
  • the LEDs are each arranged on a plane perpendicular to the longitudinal axis of the lamp plane, so that this lamp preferably emits a light beam directed in the lamp longitudinal axis, but not light in all directions.
  • the LED light bulb has an LED strip with LED chips, which is attached to a core column.
  • An incandescent lamp envelope and the core column form a chamber which is filled with a gas having a low viscosity and a high thermal conductivity coefficient.
  • the gas is helium or hydrogen. It is also possible to use a mixture of helium and hydrogen. Helium has the disadvantage that it is relatively expensive. Furthermore, helium and hydrogen have a low molecular weight and can absorb little heat and dissipate accordingly slower.
  • an LED lamp in which LEDs are connected to a heat sink made of metal and arranged in an at least partially transparent housing.
  • the housing is filled with a gas which has a greater heat capacity than air.
  • a gas which has a greater heat capacity than air.
  • a fan means generates in the housing a gas flow to transport heat generated by the LED light source to an inner surface of the housing.
  • the heat sink has the disadvantage that there are restrictions in the design and the arrangement of the LEDs within the housing.
  • noble gases such as helium, relatively expensive and can also store less heat.
  • an LED lamp having a translucent envelope.
  • the shell is filled with a gas of low molecular weight, including helium or hydrogen.
  • Helium is expensive, however, and helium and hydrogen can absorb only little heat and dissipate heat accordingly slower.
  • the WO 2011/098358 A1 describes a lamp having an LED light source located on a support.
  • the LED light source and the carrier are mounted in a gas-tight container, wherein the vessel is at least partially translucent.
  • a gas mixture of at least one gas having a high thermal conductivity, such as helium or hydrogen, and at least one gas having a different physical property to perform other functions, such as pressure equalization and light filtering.
  • the present invention has the object to provide a particular design-technically improved lamp with improved heat dissipation.
  • a lamp in particular a retrofit lamp is provided with a lamp base, with one with the lamp base connected, at least partially transparent closed envelope, which is designed to act as a heat sink for the lamp, with a lighting device containing a plurality of optoelectronic devices, which are arranged within the shell in such a 4 ⁇ arrangement that they in all spatial directions act, with a single gaseous heat transfer medium, which is introduced in the interior of the shell and which is adapted to transport generated by the lamp arrangement thermal energy to the acting as a heat sink shell, wherein the gaseous heat transfer medium is provided as a single gas or single gas in the shell and the molecules of the gaseous heat transfer medium each have at least three atoms.
  • the finding of the present invention is that a heat sink provided especially for cooling the heat generated by the LED components on the one hand requires a relatively large space requirement in the interior of the lamp. In addition, due to the required cooling effect, these relatively large heat sinks are typically visible from the outside through the transparent or partially transparent envelope, which is not very appealing for design reasons.
  • the idea of the present invention is now to dispense with such massive, required for cooling the optoelectronic devices heatsink.
  • the already existing shell of the lamp is used as well as a single provided inside the shell large molecular gas filling, wherein the molecules of the filling gas thereby have at least three atoms.
  • This formed as a heat transfer medium large-molecular gas filling absorbs the output of the respective optoelectronic devices thermal energy and transports them to the relatively large-scale shell, which the heat to the outside can deliver.
  • the heat transfer medium designed as a large molecular weight filling gas can store larger amounts of heat than low molecular weight gas, such as helium and hydrogen.
  • the filling gas can transfer more heat and the heat can be dissipated more quickly via the shell.
  • organic gases such as propane, butane, etc., which are less expensive than helium and helium mixtures, can be used as large-molecular gases.
  • inorganic gases such as carbon dioxide.
  • the lamps according to the invention are also advantageous for design reasons, since only the corresponding optoelectronic components are visible from the outside, but not the less responsive heat sinks.
  • the lamp is designed as a retrofit lamp.
  • a retrofit lamp is understood to mean a lamp which has a pear-shaped shell, so that this lamp has a light bulb-like design.
  • acting in the context of claim 1, in the case of an optoelectronic component designed as an LED, denotes the emission of light from the optoelectronic component to the outside. In the case of an optoelectronic component designed as a sensor, the term “act” denotes the ability to be able to record a measurement parameter, for example light.
  • the heat transfer medium has a relatively large heat capacity.
  • the heat transfer medium or the sole gas filled in the shell has a molar heat capacity of greater than 30J / (mol * K) at 25 ° C and in particular greater than 35J / (mol * K) at 25 °, preferably greater than 37J / (mol * K) at 25 ° C and more preferably greater than 50J / (mol * K) at 25 ° C.
  • the heat capacity indicates how much thermal energy a heat transfer medium absorbs or releases based on the temperature change.
  • the heat transfer medium is the only filled in the shell gas, ie single gas, designed as a relatively large molecular weight gas.
  • the molecules of the heat transfer medium each have at least three atoms as a large molecular weight gas.
  • the heat transfer medium is designed to transport thermal energy generated by the optoelectronic components, for example by convection, to the casing which acts as a heat sink.
  • the heat transfer medium is formed as an organic gaseous compound, ie organic gas.
  • Such an organic gas is, for example, methane, ethane, propane, butane, pentane, etc.
  • the invention is not limited to these large molecular and organic gases.
  • the shell is not permeable to the filled in the shell single gas or single gas and made for example of glass, ceramic and / or plastic.
  • the casing may be provided with an additional coating.
  • the thermal energy generated by the lamp arrangement is transported by convection to the acting as a heat sink envelope.
  • the heat transfer takes place here without additional funds only due to the heat generated by the heat.
  • Thermal convection often simply referred to as convection, in this case refers to the carrying of thermal energy or, in other words, a change in location of easily movable, gaseous molecules that carry stored heat with them.
  • convection in this case refers to the carrying of thermal energy or, in other words, a change in location of easily movable, gaseous molecules that carry stored heat with them.
  • a device for generating flow can be provided inside the envelope.
  • the device for generating flow is designed to transport the thermal energy generated by the lamp arrangement through the flow generated in this way to the envelope which functions as a heat sink.
  • the means for generating flow may be designed, for example, as a fan, fan or the like.
  • the gas pressure of the heat transfer medium in the interior of the shell is more than 1 bar, preferably more than 20 bar.
  • the gas pressure of the heat transfer medium can be in a range between 0.1 bar to 10 bar and preferably in a range of 0.5 bar to 2 bar.
  • the shell consists of a glass, ceramic or plastic body, which is completely transparent or at least partially transparent.
  • Completely transparent in this context means that the envelope is translucent in the spectral wavelength range of light visible to humans and, if necessary, also in the UV range and in the infrared range.
  • the envelope is designed as a frosted glass body or contains such.
  • Milk glass body refers to an opaque glass, which, although translucent, but at least partially opaque, whereby the glass looks white and cloudy. In this case, the milk glass can be produced by admixing a turbid substance or by subsequent roughening of the surface. As milk glass body are not only glassy body, but also milky plastic body to understand.
  • the envelope connected to the lamp base is gas-tight for the single gaseous heat transfer medium or single gas contained therein, so that the relatively large molecular weight elements of the heat transfer medium can not escape inside the envelope.
  • the envelope therefore, no vacuum must be generated or a special gas can be introduced at low pressure. Rather, a specific, large-molecular gas is deliberately introduced into the interior of the shell. The higher the gas pressure inside the shell, the better it is because of the rising Convection resulting heat transport. This makes the production less expensive.
  • the luminous means arrangement comprises a multiplicity of optoelectronic components designed as LEDs. These optoelectronic components are provided within the envelope in a 4 ⁇ arrangement in such a way to emit light in all spatial directions.
  • This lamp according to the invention thus emits a light comparable to a conventional incandescent lamp in all spatial directions, so that there are therefore no shading areas or regions with lower light emission, which are generally perceived as unpleasant or less comfortable by a user.
  • the number and / or the type and / or the orientation of the LEDs used are provided such that the lamp emits white light during operation.
  • a lamp according to the invention with corresponding LEDs can therefore appear in visual spectral range lights and to the human eye apparently or - depending on the type of mixture actually - generate white light.
  • white light can be generated, for example, by means of a blue light emitting diode and a broadband luminescent dye, for example phosphorus, by mixing the blue light produced by the blue light emitting diode with the yellow light generated by the luminescent dye.
  • white light can be produced by means of an ultraviolet light emitting diode and a luminescent dye for red, green and blue. The light colors generated by the three luminescent dyes red, green and blue become white light by suitable mixing.
  • the illuminant arrangement has red light, blue light, yellow light, violet light and / or green light-emitting light-emitting diodes.
  • the light emitting diodes emit infrared or ultraviolet light. By suitable mixing of the light emitted by these LEDs, a preferred desired coloration can be achieved.
  • the LEDs are arranged in series with each other.
  • the LEDs are preferably connected in series in a so-called LED strip (LED strip).
  • LED strip LED strip
  • a plurality of series circuits of LEDs arranged in series are provided.
  • the switching in series of different LEDs is advantageous insofar as the corresponding lamp arrangement can be operated in this way with a higher supply voltage, which increases the efficiency.
  • a plurality of LEDs arranged in series with each other are arranged parallel to each other. Several such series-connected LED arrays, which are connected in parallel with each other, can be operated with the same supply voltage and increase the luminous efficacy.
  • a Zener diode is connected in antiparallel to each LED and / or to a series connection of a plurality of LEDs.
  • the antiparallel Zener diodes are designed to prevent that the possible failure of a single LED of a series circuit of LEDs leads to a complete malfunction of the entire lamp. In addition, safety is also increased in this way.
  • the luminous means arrangement has a multiplicity of optoelectronic components designed as photosensitive sensors on. These sensors are provided within the envelope in a 4 ⁇ arrangement such as to be light-sensitive in all spatial directions.
  • the lamp according to the invention can thus also be used as a highly sensitive sensor which is sensitive in all spatial directions.
  • the sensor can be used in particular as a light-sensitive sensor, in which case the optoelectronic components are designed as light-sensitive sensors.
  • the optoelectronic components are formed in strip strips with successively arranged and / or switched optoelectronic components.
  • a strip of tape which is sometimes also referred to as a "strip”
  • strip is for example a solid or flexible semiconductor body in whose surface the corresponding semiconductor components are introduced.
  • individual semiconductor components are provided which are fastened to a strip-shaped material which forms the tape strip and are electrically connected to one another.
  • the tape strip is in a three-dimensional arrangement, e.g. bent in a spiral to ensure the appropriate 4 ⁇ arrangement already by the curved structure can.
  • the particular advantage here is that the various optoelectronic components do not have to be arranged and mounted in a complex manner in order to ensure the 4 ⁇ arrangement, but that this already takes place to a certain extent automatically by a suitable bending of the tape strip. The production of such lamps according to the invention is thus significantly simplified.
  • At least one strip-shaped semiconductor body is provided, the three-dimensionally shaped and formed and in which the optoelectronic components are introduced from several sides so that they act in all spatial directions.
  • a suitable cubic semiconductor body may be provided, in which optoelectronic components are introduced into all or at least some of the surfaces of the semiconductor body.
  • semiconductor components can be introduced both on the front side and on the back side of the semiconductor body, so that they emit in both sides.
  • the semiconductor devices could be incorporated in all six surfaces or at least in four circumferential surfaces.
  • the lamp cap is designed as a socket with Edison thread.
  • one is provided as E40, E27, E14 and / or E10 socket.
  • the base of a lamp is used to fix the lamp in a lamp socket and to contact electrically.
  • the design of the lamp holder limits the permissible power and current consumption of the lamp operable therein.
  • the dimensions of the so-called Edison thread are standardized in DIN 40400 and also in IEC 60238: 1998.
  • the advantage of using the Edison thread is that the lamps according to the invention in conventional lamp holders, which were thus designed for conventional incandescent lamps, can be screwed so that users can continue to use their previous lights by the aforementioned EU incandescent lamp manufacturing and sales ban.
  • the luminous means arrangement has a measuring circuit which measures the current through the luminous means arrangement and / or measures the voltage drop across the illuminant arrangement. Additionally or alternatively, a measurement of the LEDs generated temperature can be made. In this way, for example, a defective LED can be detected within the light assembly, which is indicated for example by a suitable display device. In addition, using these means would also be possible to detect overheating of the lamp and to take appropriate measures for cooling. Such measures could be, for example, switching off the lamp or dimming down the light output.
  • the measuring circuit it is also possible, for example, to measure the aging of individual LEDs or the entire luminous means arrangement.
  • the voltage drop across the lamp arrangement of individual or all light-emitting diodes is measured. From the measurement result is closed to the aging state of the lamp assembly.
  • This measured, age-related voltage drop is a good indicator of the aging and thus the expected remaining life of the LED-based illuminant assembly.
  • the measured voltage could be compared with a reference value, and it could be determined from the comparison result whether the LED illuminant arrangement is reaching or threatening to reach its end of life.
  • the measurement of this voltage drop, the comparison and the evaluation can be done automatically, for example, at regular intervals or, for example, each time the lamp is put into operation again. In this way, unnecessary and safety-related premature replacement of the lamp can be avoided, as well as too long operation with reduced luminosity, which may entail, for example, safety problems or at least a loss of comfort in the event of a failed lamp.
  • a drive circuit connected to the base is provided, which is designed to receive a supply voltage tapped off via the base to convert to a DC voltage and operate the lamp assembly with this DC voltage.
  • the supply voltage for example the mains alternating voltage
  • the driver circuit is disposed within the socket.
  • the respective type of converter can be selected with a view to achieving the best system performance. For example, if relatively long lamp modules, such as the L58W fluorescent lamp, are to be replaced, boost converters are preferred, while for example short lamps such as L18W Modules, used as a buck converter transducer (buck converter) can be used.
  • Fig. 1 shows a schematic diagram of the structure of a lamp according to the invention.
  • the lamp is designated by reference numeral 10 and comprises a lamp base 11, a shell 12, a lighting arrangement 13 and a gaseous heat transfer medium 14.
  • the lamp base 11 denotes that part of the lamp 10 which produces the mechanical and electrical contact with a lamp or lamp socket.
  • the lamp base 11 is connected to an at least partially transparent, closed shell 12, which is also referred to as a glass bulb or lamp envelope.
  • This glass bulb 12 can optionally also partially mirrored inside, frosted (that is, roughened) or be made of opaque glass (frosted glass).
  • the glass bulb or lamp bulb can be made of plastic or ceramic in addition to glass. In this case, such a glass bulb or lamp envelope made of plastic or ceramic optionally optionally additionally at least partially coated, e.g. mirrored or matted, i. be roughened.
  • the glass bulb or lamp bulb can be made of an opaque plastic, which gives the glass or lamp envelope a milk glass effect.
  • the interior 15 of the glass bulb 12 is filled with a gas 14 or single gas, whose function will be explained below.
  • a light-emitting device 13 is further provided, which a plurality of only here includes schematically illustrated optoelectronic devices 16.
  • These optoelectronic components 16 are arranged within the glass bulb 12 in such a way that they act in all spatial directions (ie 4n).
  • the optoelectronic components 16 may be designed, for example, as LEDs, light-sensitive sensors, laser diodes and the like.
  • the provided inside 15 of the glass bulb 12 gas 14 is preferably formed as a large molecular gas.
  • the gas is provided as a single gas in the glass bulb 12, in contrast to a gas mixture of a plurality of gases.
  • the gas may or may not have additional contamination by another gas or gases as a single gas or single filled gas.
  • the contamination of the gas or individual gas in the glass bulb 12 is less than 0.5% in such a case.
  • a large-molecular gas is a gas whose molecules each have more than three atoms.
  • sulfur hexafluoride SF 6 , carbon dioxide CO 2 , as well as organic gases, including, for example, methane, ethane, propane, butane, pentane, hexane, etc. represent such large molecular gases, which can be provided as a single gas or gas in the glass bulb 12 or lamp envelope.
  • Such individual gases taken up in the glass bulb or lamp bulb have, as large-molecular gases or gases whose molecules each have more than three atoms, a high molar heat capacity C P of Cp> 30J / (mol ⁇ K) at 25 ° C.
  • these gases can absorb a larger amount of heat and the amount of heat to be dissipated better, as will be explained below.
  • the unit [J / (mol K)] can easily be converted into the technical unit [kJ / (kg K)] by dividing by the molar mass [g / mol].
  • the Cp values for 25 ° C are calculated as examples hereof. It should be noted that there is also a measurable gaseous phase above the liquid phase of a substance.
  • Gaseous substances material Thermal conductivity ⁇ in W / (m ⁇ K) hydrogen 0,186 helium .1567 argon 0.0179 krypton 0.00949 xenon 0.0055 Air (21% oxygen, 78% nitrogen) 0.0262 oxygen 0.0263 nitrogen 0.0260 Steam 0.0248 carbon dioxide 0.0168 Methane (20 ° C, 1 bar) .0341 Sulfur hexafluoride (0 ° C) 0,012 vacuum 0
  • the gas 14 and preferably also the material of the shell 12 have a very high heat absorption capacity.
  • the optoelectronic components designed as LEDs heat up 16.
  • the heat generated during operation of these LEDs 16 is inventively taken up by the designed as a heat transfer medium 14 large molecular gas 14 as a single gas and transported to the shell 12.
  • the shell 12, which preferably has a high thermal conductivity, thus effectively acts as a heat sink and diverts the heat stored by the gas 14 to the outside.
  • the heat transfer medium 14 is thus carried by convection heat conduction to the shell 12, which is thus realized a very effective and nevertheless very simple cooling.
  • inorganic gases such as e.g. Carbon dioxide, sulfur hexafluoride or organic gases such as e.g. Ethane, propane, butane, pentane, methane, etc.
  • the large-molecular gas accommodated in the casing 12 has, in particular, a pressure in a range from 0.1 bar to 10 bar and in particular a pressure in a range from 0.5 bar to 2 bar.
  • Fig. 2 shows a particularly preferred embodiment of the lamp 10 according to the invention.
  • the lamp 10 is designed here as a so-called retrofit lamp 10, which thus a one conventional light bulb has comparable design.
  • a conventional incandescent lamp in which a protective gas is provided to protect the filament inside the envelope 12, in the retrofit lamp according to the invention the bulb-like glass bulb functions together with the gas contained therein as a coolant.
  • the gas is in Fig. 2 as well as the following figures, as previously with reference to Fig. 1 described as the only gas or single gas filled in the glass bulb, in contrast to a gas mixture, as in the cited in the introduction of the prior art.
  • the gas contained in the glass bulb as a gaseous heat transfer medium, the previously with reference to Fig. 1 made in order to avoid unnecessary repetition.
  • the base 11, which is connected to the shell 12, is formed in the present case as Edison lamp base.
  • an E27 socket for use for general-service lamps can be provided here.
  • a spirally formed illuminant arrangement 13 is provided here.
  • This helical structure is suitable, analogous to a conventional filament, to emit light in all spatial directions, ie in the 4 ⁇ direction.
  • This spiral-shaped luminous arrangement 13 can be realized, for example, by a bendable wire, strip or semiconductor body, on whose surface corresponding LED components (in FIG Fig. 2 not shown) and are electrically connected to each other.
  • Fig. 3 shows a further embodiment of a retrofit lamp according to the invention designed as a lamp 10.
  • the base 11 has an external contact 17 'and a foot contact 18'', via which an electrical supply voltage, typically a mains AC voltage is tapped, provided that the lamp 10 is screwed in a lamp socket.
  • an electrical supply voltage typically a mains AC voltage
  • a drive circuit 21 which is likewise provided in the interior of the base 10.
  • This drive circuit 21 has a converter circuit 22 and a driver circuit 23.
  • the converter circuit 22 the AC line voltage is converted into a DC voltage for operating the LED-based lamp arrangement 13.
  • the driver circuit 23 may comprise a step-up converter or step-down converter, depending on which supply voltage is required for the lighting device arrangement 13.
  • a fastening device is also provided in the interior of the lamp 10, which serves for the mechanical fixing and fastening of the light bulb arrangement 13 provided in the interior 15 of the shell 12.
  • this fastening device also functions to carry out corresponding supply lines 25 coming from the base 11 or the drive circuit 21 contained therein. These supply lines 25 connect the drive circuit 21 to the lighting arrangement 13.
  • the fastening device 25 furthermore has an axial opening provided along the lamp axis 28 , cylindrical support device 26, which serves to support the bulb assembly 13 and which carries the bulb assembly 13.
  • the illuminant arrangement 13 has a plurality of LED strips 27.
  • the LED strips 27 are essentially here arranged radially around the support device 26 around and spaced from each of the same distance.
  • the LED strips 27 run in the embodiment in Fig. 3 substantially parallel to one another and substantially axially relative to the axis 28 of the lamp 10.
  • the LED strips 27 each include a plurality of LED devices arranged in series with each other as described below with reference to FIG Fig. 6 is still set forth.
  • the LED strips 27 are connected on one side via the supply lines 25 with the fastening device and the driver circuit 23.
  • the LED strips 27 are also connected to the drive circuit 21 via further supply lines 29 and the support device 26.
  • a positive supply potential VDD is applied to the supply line 29, and the supply lines 25 are supplied with a reference potential, for example the reference ground GND.
  • VDD-GND a positive supply potential
  • Fig. 4 shows a further embodiment of a designed as a retrofit lamp lamp according to the invention 10.
  • the various LED strips 27 are arranged so that they move toward each other in the direction of the lamp axis 28 and the end face 30. These slanted positions of the LED strips 27 result in a better 3D illumination of the light, since in this way in particular the front side 30 of the shell 12 is not darkened, but also white light is emitted via the front side 30.
  • a coating 35 is provided on the inner surface of the shell 12 is in the embodiment in Fig. 4 .
  • this coating 35 is a suitable photoluminescent material, in order in this way to produce a desired light.
  • the LEDs 16 of the LED strips 27 may be blue light generating LEDs.
  • FIGS. 5 and 6 show on the basis of a schematic diagram two further embodiments, as the LED strips 27 may be disposed in the interior 15 of the shell 12 of the lamp 10.
  • LED strips 27 are arranged so that they are each arranged on a side surface 31 of a virtual pyramid 32, which tapers towards the end face 30 of the shell 12.
  • LED strips 27 are also four LED strips 27 are provided, which are each arranged on adjacent four surfaces 33 of a cuboid 34 (cuboid faces) so that a respective LED strip 27 forms a diagonal of the rectangular surface 33 of the cuboid 34, which is characterized by the LED Do not cut strip 27 running straight lines in the projection.
  • Fig. 7 shows on the basis of an embodiment, the structure of an LED strip 27 for a lamp according to the invention.
  • the LED strip 27 comprises a substrate 40, which may be formed, for example, from glass, hard glass, quartz glass, ceramic, plastic or the like.
  • the substrate 40 is preferably transparent.
  • a plurality of LED chips 41 is arranged on the substrate 40. These LED chips 41 are introduced into the substrate 40, applied to its surface, fastened there, or arranged and secured in specially provided recesses in the substrate 40.
  • the attachment of the LED chips 41 can be done for example by means of an adhesive layer, a bond, an adhesive or fastened connections or the like.
  • Each of these LED chips 41 comprises at least one LED semiconductor device.
  • Each LED chip 41 is thus designed to emit light of a specific wavelength in accordance with the physical properties of the semiconductor material used and its doping.
  • each LED chip 41 contains at least two contact terminals A, K, wherein one of these terminals forms the anode contact A and the other terminal forms the cathode contact K.
  • the electrical contacting of adjacent LED chips 41 takes place in each case by means of bonding contacts by contacting a respective anode contact A of a first LED chip 41 with a cathode contact K of a further LED chip 41 adjacent to this LED chip 41.
  • the LED strip 27 has at its two opposite ends in each case a contact terminal (lead) 43, 44 which are each connected to the outermost LED chips 41 of the LED strip 27 via a connecting line 42.
  • a fixing device 45 is provided for fixing these contact terminals 43, 44.
  • a transparent outer sheath-shaped tube may be provided to protect the LED strip 27 and the individual LED chips 41 on the substrate 40.
  • Fig. 7 Let it be assumed that all the LED components on the LED chips 41 are identical and thus emit a light of the same wavelength. It would also be conceivable, however, for different light-emitting LED chips 41 to be present, for example yellow light and blue light-emitting LEDs, whereby white light is emitted when the generated light beams are mixed. In the same way, of course, any other combinations of different light-emitting LEDs would be possible.
  • the substrate 40 is a semiconductor substrate.
  • the LED chips 41 could be introduced directly into the semiconductor body 40 of the substrate 40, for example by diffusion and implantation. This is particularly advantageous from a manufacturing point of view, but for the otherwise brittle semiconductor body of the substrate 40, e.g. an additional carrier is required, which would need to stabilize the substrate 40.
  • the substrate 40 designed as a semiconductor body is made so thin that it is flexible and is fastened, for example, on a flexible film.
  • Fig. 8 shows a further embodiment of an LED strip 27.
  • This LED strip 27 has a cubic shape and thus comprises various rectangular surfaces 50.
  • the different LED chips 41 or LED components 16 are preferably arranged at least on two opposite rectangular surfaces 50 of the semiconductor body 40.
  • Fig. 9 shows a further embodiment of an LED strip 27 for a lamp 10 according to the invention.
  • the substrate 40 of the LED strip 27 is already in a curved shape, so that at least one non-planar, curved surface 51 is present.
  • the corresponding LED chips 41 and LED components 16 are arranged or introduced. Due to the curved structure of the LED strip 27, there is thus likewise a radiation of the light emitted by the various LEDs 16 in different spatial directions.
  • Fig. 10 shows a block diagram for a further embodiment of an LED strip according to the invention 27.
  • the first contact terminal 43 is in operation with a first supply potential V1 and the second contact terminal 44 is acted upon in operation with a second supply potential V2.
  • a series circuit of four LEDs 52 is connected between these contact terminals 43, 44. It is assumed that in the present case all LEDs 52 are identical. Antiparallel to each of these LEDs 52, a Zener diode 53 is connected in each case. These anti-parallel Zener diodes 53 serve the purpose of maintaining the operation of the LED series circuit with the remaining, functional LEDs in case of failure of an LED 52. Otherwise would in the event of failure of a single serially connected LED 52, the entire LED series circuit will be inoperable.
  • a measuring circuit 54 is provided.
  • This measurement circuit 54 serves the purpose of determining the current, the voltage, the temperature and / or possibly further parameters of the LED strip 27. For example, the measurement of the current by means of a resistance element, which is arranged in series with the LEDs 52. The measurement of the voltage, for example, by means of a parallel resistor. In addition, the temperature can be derived from the determined current.
  • the present invention is not limited to retrofit lamps with Edison socket.
  • another type of socket such as a socket, bayonet socket, two-pin socket, and the like, may be used.
  • so-called socketless lamps would be conceivable in which the base is realized via contact wires.
  • the shape of the shell is not limited to a pear-shaped incandescent-like design, but may be of any design, provided that it does not deviate from the core idea of the invention.
  • the invention is also applicable to a krypton lamp, a halogen-type lamp and the like.
  • the lamp has, as previously with reference to Fig. 1 described, a single filling gas, wherein the molecules of the filling gas each have at least three atoms. This applies to all embodiments of the invention.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Led Device Packages (AREA)
EP14176776.4A 2013-07-12 2014-07-11 Lampe Active EP2824379B1 (fr)

Applications Claiming Priority (1)

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DE102013213684 2013-07-12

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US11332066B2 (en) 2020-01-24 2022-05-17 Vosla Gmbh Vehicle body component, method for manufacturing a vehicle body component and method for operating a lighting means arrangement

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DE202014001954U1 (de) 2014-02-28 2014-03-20 Vosla Gmbh Lampe
DE202014001943U1 (de) 2014-02-28 2014-05-08 Vosla Gmbh LED-Streifen, Lampe
HUE045678T2 (hu) * 2014-07-11 2020-01-28 Vosla Gmbh Szalag alakú fényforrás, lámpa, és eljárás a szalag alakú fényforrás elõállítására
DE102014019475A1 (de) * 2014-12-23 2016-06-23 Db Netz Ag Leuchtvorrichtung für eine Lichtsignalanlage des schienengebundenen Verkehrs
US10222036B2 (en) 2015-08-27 2019-03-05 GE Lighting Solutions, LLC Method and system for a three-dimensional (3-D) flexible light emitting diode (LED) bar
DE102015120085A1 (de) * 2015-11-19 2017-05-24 Osram Opto Semiconductors Gmbh LED-Filamente, Verfahren zur Herstellung von LED-Filamenten und Retrofitlampe mit LED-Filament
DE102016105211A1 (de) 2016-03-21 2017-09-21 Osram Opto Semiconductors Gmbh Filament und dessen Herstellung sowie Leuchtmittel mit Filamenten
DE102016122228A1 (de) * 2016-11-18 2018-05-24 Ledvance Gmbh Leuchtmittel für eine LED-Lampe und LED-Lampe
DE102017102044A1 (de) 2017-02-02 2018-08-02 Osram Opto Semiconductors Gmbh Strahlungsemittierendes Filament
US11067229B2 (en) * 2017-08-25 2021-07-20 Signify Holding B.V. LED strip for indirect light emission
JP6889341B1 (ja) * 2018-05-29 2021-06-18 シグニファイ ホールディング ビー ヴィＳｉｇｎｉｆｙ Ｈｏｌｄｉｎｇ Ｂ．Ｖ． 色混合を促進する照明モジュール
DE102019122714A1 (de) * 2019-08-23 2021-02-25 Lufthansa Technik Aktiengesellschaft Flexibler LED-Lichtschlauch

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US11332066B2 (en) 2020-01-24 2022-05-17 Vosla Gmbh Vehicle body component, method for manufacturing a vehicle body component and method for operating a lighting means arrangement

Also Published As

Publication number Publication date
HU4525U (en) 2015-04-28
DE202013009434U1 (de) 2013-11-05
DE102014213560A1 (de) 2015-01-15
DE102014213561A1 (de) 2015-01-15
EP2824379B1 (fr) 2021-05-19
CN203823471U (zh) 2014-09-10

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