EP2789906B1 - Illumination device - Google Patents

Illumination device Download PDF

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Publication number
EP2789906B1
EP2789906B1 EP14164215.7A EP14164215A EP2789906B1 EP 2789906 B1 EP2789906 B1 EP 2789906B1 EP 14164215 A EP14164215 A EP 14164215A EP 2789906 B1 EP2789906 B1 EP 2789906B1
Authority
EP
European Patent Office
Prior art keywords
circuit board
carrier
area
holding
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Not-in-force
Application number
EP14164215.7A
Other languages
German (de)
French (fr)
Other versions
EP2789906A1 (en
Inventor
Dirk Mania
Andreas Lebherz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
RIDI Leuchten GmbH
Original Assignee
RIDI Leuchten GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from EP13163351.3A external-priority patent/EP2650594B1/en
Application filed by RIDI Leuchten GmbH filed Critical RIDI Leuchten GmbH
Priority to PL14164215T priority Critical patent/PL2789906T3/en
Priority to EP14164215.7A priority patent/EP2789906B1/en
Publication of EP2789906A1 publication Critical patent/EP2789906A1/en
Application granted granted Critical
Publication of EP2789906B1 publication Critical patent/EP2789906B1/en
Not-in-force legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/004—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by deformation of parts or snap action mountings, e.g. using clips
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/27—Retrofit light sources for lighting devices with two fittings for each light source, e.g. for substitution of fluorescent tubes
    • F21K9/278—Arrangement or mounting of circuit elements integrated in the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/005—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by permanent fixing means, e.g. gluing, riveting or embedding in a potting compound
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the present invention relates to a lighting device having the features of the preamble of claim 1 and a board carrier for such a lighting device.
  • a luminaire usually comprises a luminaire housing to which at least one lighting device or lamp can be attached by means of corresponding sockets and / or holders.
  • Conventional lighting devices are, for example, light bulbs and fluorescent tubes.
  • more and more lighting devices are used, which have several LEDs as the light source.
  • LEDs stands for light emitting diode.
  • LEDs in the present context should also include OLEDs, where OLED stands for organic LED.
  • LEDs are usually mounted on a circuit board, the respective board then carries several LEDs.
  • the operation of LED-based lighting devices also generates heat that must be dissipated in order to maximize the life of the LEDs.
  • the respective circuit board can be fastened to a board carrier, via which the accumulating heat can be slid off.
  • the heat transfer from the respective board to the board carrier In order to achieve the highest possible heat transfer between the board and board carrier, a relatively high effort can be operated. For example, it is possible to arrange a thermal paste between the board and the board carrier.
  • the attachment of a planteleit für and / or the setting of screws is associated with a relatively high cost.
  • a generic lighting device is from the US 2013/0050999 A1 known. It has an elongated and rectilinear board, which carries several LEDs on its front side, and an elongate and rectilinear board carrier, to which the respective board is attached.
  • the board carrier has a holding area for receiving the board.
  • the platinum carrier has along opposite longitudinal sides of the respective holding region retaining elements which are plastically deformed for attaching and pressing the respective board on the platinum carrier, so that they each overlap a longitudinal side edge of the respective board.
  • the respective holding element has a gripping area encompassing the respective longitudinal side edge of the board and a forming area connecting the gripping area with the platinum carrier, the plastic deformation of the respective holding element for fixing the respective board on the board carrier being largely in the forming area.
  • the back of each board is just designed.
  • the respective holding element has the same wall thickness in the gripping area and in the forming area.
  • the present invention is concerned with the problem of providing for a lighting device of the type mentioned or for an associated board carrier an improved embodiment, which is characterized in particular by a reduced manufacturing cost.
  • a possible efficient heat transfer between the respective board and the board carrier is to be realized.
  • the invention is based on the general idea of equipping the plate carrier on the respective holding region with holding elements which laterally or peripherally overlap the respective plate by plastic deformation and press against the holding region. At the same time, the respective board is thereby fixed to the board carrier.
  • the plastic forming of such holding elements can be realized particularly simply and thus inexpensively. At the same time an intensive heat transfer is made possible by the pressing of the board against the holding area.
  • the holding elements of the respective holding region can be formed by at least two holding webs, which lie opposite one another on the longitudinal sides of the respective holding region and which extend uninterruptedly along the respective longitudinal side.
  • a line-shaped depression of the printed circuit board in the respective section of the longitudinal side edge against the holding region of the platinum carrier can be generated, which improves the heat transfer.
  • the board is designed to be straight and oblong, the pressing of the board on both longitudinal side edges against the holding area causes the board is also pressed against the holding area between these longitudinal side edges, whereby a particularly intense heat transfer between the board and platinum support can be achieved.
  • the line-shaped depression of the board by means of such holding webs thus differs significantly from a punctiform depressions that can be realized for example by means of screws.
  • the respective retaining web may extend at least from one transverse side edge or longitudinal end of the respective board to the other transverse side edge or longitudinal end of the respective board.
  • the two opposite holding webs extend at least over the entire length of the respective board.
  • the two, opposite holding webs extend over the entire length of the platinum carrier. If two or more boards are arranged one behind the other in the longitudinal direction of the board carrier in the respective holding area, all boards can thus be fixed to the board carrier and biased by means of the two continuous holding webs.
  • the respective holding element may be integrally formed on a body of the platinum carrier having the respective holding region.
  • the holding elements and in particular the holding webs thus no separate components that need to be attached to the board carrier.
  • the integral formation of the retaining elements on the board carrier thus simplifies the production of the lighting device.
  • the board carrier has a body which has the respective holding area and which is formed by an extruded profile.
  • an extruded profile can be produced particularly easily by an extrusion process.
  • the holding elements preferably the continuous holding webs, can be taken into account particularly simply as part of the production of the extruded profile. Accordingly, in the formation of the holding elements no additional manufacturing effort, which reduces the cost of producing the lighting device.
  • the platinum carrier is equipped with a metallic body having the respective holding area.
  • the board carrier is particularly suitable for receiving and removing heat.
  • the platinum carrier can be designed here as a heat sink.
  • Particularly suitable metals here are light metals or light metal alloys, which are characterized by a particularly high coefficient of thermal conductivity.
  • the board carrier may be made of aluminum or of an aluminum alloy.
  • the board carrier has a metallic extruded profile, on which the web-shaped holding elements are integrally formed.
  • the respective holding element has a gripping area encompassing the respective longitudinal side edge of the board and a forming area connecting the gripping area with the platinum carrier.
  • a predetermined geometry of the holding elements in the gripping area can be maintained despite the plastic deformation, since this takes place largely in the forming area.
  • the gripping region may also have a latching contour on which a cover can be latched, which covers the holding region on the respective platinum carrier.
  • a wall thickness of the respective holding element measured transversely to the longitudinal direction of the platinum carrier is smaller in the forming area than in the gripping area.
  • the rear side of the respective board is designed to be planar, while the holding area is provided in cross-section with a convex curvature towards the board, which leads to a corresponding deflection and curvature of the board due to the edge-side depression with the retaining elements.
  • the board can be pressed against the holding area with respect to its cross section in a central region with increased pressure force, which there improves the heat transfer. Due to the relatively high rigidity of conventional board materials, a small or weak curvature with a large radius of curvature suffices for a sufficient surface pressure.
  • the respective board is flat, whereby the holding elements transversely to the longitudinal direction of the platinum support do not have to build very large to Forming the board can overlap laterally. This also simplifies the realization of the design presented here.
  • a "rectilinear body” is understood to mean a body whose longitudinal center axis runs coaxially to a straight line.
  • An "elongated body” in the present context means a body whose length measured in its longitudinal direction is greater than its width and height measured transversely to the longitudinal direction. In particular, an elongated body is at least twice, preferably at least ten times, longer than wide and high.
  • a "flat body” is understood to mean a body which, transverse to its longitudinal direction, has a cross-section whose width is greater than its height. Preferably, the flat body is at least twice, preferably at least ten times, wider than high in its cross-section.
  • the LEDs may be arranged on the respective board along at least one rectilinear row extending in the longitudinal direction of the board.
  • it may be provided that only a single row of LEDs is provided on the elongated and rectilinear circuit board, which is then arranged centrally on the circuit board with respect to its cross section.
  • This can be realized by the contact pressure of the board along its longitudinal side edges a symmetrical contact with the holding area and thus a symmetrical heat transfer to the board carrier.
  • the heat transfer can be specifically improved in the region of the LED row, that is to say where the heat is produced, by the above-mentioned curved holding area.
  • the respective holding element may have a height which is from a fixed end connected to the platinum carrier of the respective holding element to a remote from the fixed end free end of the respective holding element is measured and which is greater than a thickness or height of the respective board. In this way, it is ensured that the respective holding element can overlap the respective board on the edge so far that the respective holding element makes contact with the board on its front side in order to press it against the holding area with the rear side.
  • An inventive board carrier which is suitable for producing a lighting device of the type described above, has at least one holding area, in which at least one board can be attached, which may have a plurality of LEDs. Further, the board carrier has along opposite longitudinal sides of the respective holding portion retaining elements for fixing the respective board on the board carrier.
  • the holding element stand thereby from a body of the platinum carrier lighting device of the platinum carrier and are dimensioned so that they are plastically deformable for mounting and pressing a arranged in each holding area board on the board carrier, in such a way that they overlap a longitudinal side edge of the respective board.
  • the respective holding element has a gripping area and a forming area, wherein the wall thickness of the holding element in the forming area is smaller than in the gripping area.
  • a non-inventive method for producing a lighting device of the type described above can be carried out so that first the respective board is inserted into the respective holding region of the platinum carrier, wherein the holding elements are in an undeformed initial state, the insertion of the respective board in the respective Holding area allows.
  • the platinum carrier can already be produced as an extruded profile in such a way that the holding elements are in this initial state.
  • the holding elements are now plastically deformed after inserting the respective board in the respective holding area, in such a way that they each overlap a longitudinal side edge of the respective board and thereby Press the respective board against the holding area.
  • the respective board is fixed to the board carrier and at the same time biased against it, whereby a particularly intense heat transfer between the board and board carrier is achieved.
  • the forming of the holding elements can be carried out by rolling.
  • a corresponding roller burnishing tool rolls along the holding area, wherein it uniformly transforms the holding elements.
  • Such a Rollier compiler can be particularly easy to automate, whereby the production is particularly efficient realized.
  • the platinum support may, for example, form a device carrier of a luminaire, which has a support profile for wall and ceiling mounting and such a device carrier.
  • the board with the LEDs is firmly installed in the equipment rack.
  • the lighting device presented here is a device carrier of a luminaire.
  • the board carrier can also form a supporting body of an elongated and rectilinear lamp, which can be mounted in total on brackets and / or sockets on a lamp housing or on a device carrier.
  • the present invention also relates to a lamp, on the supporting body at least one board is fixed in the manner described above. Furthermore, the present invention also relates to a luminaire with at least one such lamp. In addition, the present invention also relates to a lamp with a device carrier to which at least one board is attached according to the above type.
  • FIG. 1 and 2 comprises a rectilinear and oblong luminaire 1, which is particularly suitable for producing a light band consisting of a plurality of such luminaires 1 arranged one behind the other in its longitudinal direction, a light beam only in FIG. 1 illustrated support section 2 and a device carrier.
  • a rectilinear and oblong luminaire 1 which is particularly suitable for producing a light band consisting of a plurality of such luminaires 1 arranged one behind the other in its longitudinal direction, a light beam only in FIG. 1 illustrated support section 2 and a device carrier.
  • the support section 2 is used for wall or ceiling mounting of the lamp 1.
  • the support section 2 is suitably a sheet metal part.
  • a power guide rail 4 which is connected to an external power supply when the lamp 1 is properly mounted.
  • the current-carrying rail 4 has a plurality of engagement regions 5, in which a plurality of electrical conductors 6 are arranged.
  • the device carrier 3 is used to arrange electrical consumers and other components.
  • electrical lighting means 7 integrated, which are formed by at least one circuit board 8, on which a plurality of LEDs 9 are arranged.
  • the entire equipment carrier 3 forms a lighting device 10 by the integrated therein light source 7.
  • the device carrier 3 has in the in FIG. 1 shown embodiment on its front side 11 a single holding portion 12 for one or more boards 8, whereby the lamp 1 in FIG. 1 is designed einflammig.
  • the device carrier 3 has exactly two such holding regions 12 on its front side 11, in each of which at least one printed circuit board 8 is arranged. Accordingly, the in FIG. 2 shown lamp 1 two-lamp.
  • the holding regions 12 are recessed in the device carrier 3 or arranged in a recess 13, which is closed with a light optics 14 flush with the front 11.
  • the device carrier 3 carries on its rear side 15 in each case a connection element 16 which has a plurality of plug-in regions 16 which, in the mounted state of the device carrier 3, engage in the engagement regions 5 of the current-carrying rail 4 in order to electrically contact the respectively required conductor 6 there.
  • the device carrier 3 is locked directly to the support section 2.
  • Corresponding locks are in FIG. 1 denoted by 18.
  • the respective catch 18 extends over the entire length of the lamp 1 and has on the equipment carrier 3 and on the support section 2 formed, mutually complementary latching contours, which can simultaneously realize a sufficient sealing effect.
  • FIG. 3d figure shows a lamp 19 which can be interchangeably attached to a lamp, not shown here.
  • the lamp 19 has a support body 20 and a cover 21 fixed thereto.
  • the support body 20 likewise has a holding region 12, in which a circuit board 8, which is again arranged as the light source 7, is disposed several LEDs 9 carries.
  • the support body 20 also defines a lighting device 10.
  • the lamp 1 is just like the lamp 19 designed to be rectilinear and oblong, with a longitudinal central axis perpendicular to the plane of the drawing or perpendicular to the cutting plane. Accordingly, in the lamp 1 and the support section 2 and the equipment carrier 3 and thus the lighting device 10 are designed to be straight and elongated. In the case of the lamp 19, the supporting body 20 and, accordingly, also the lighting device 10 and the cover 21 are thus designed to be rectilinear and oblong.
  • the lighting device 10 which is formed in the lamp 1 by the equipment carrier 3 and which is formed at the lamp 19 by the support body 20, thus at least one rectilinear and elongated board 8, the LEDs 9 carries on its front.
  • the lighting device 10 has an elongated and rectilinear platinum carrier 22, which corresponds to the base body of the device carrier 3, ie the device carrier 3 without attached light source 7 in the lamp 1.
  • the platinum carrier 22 corresponds to the carrier body 20 without illuminants 7 attached thereto.
  • the respective circuit board 8 is thus fastened to the platinum carrier 22.
  • the board carrier 22 has at least one holding area 12 for receiving at least one such board 8.
  • the holding area 12 may be formed to be complementary to the back of the respective board 8.
  • the circuit board 8 is expediently configured on its rear side. Accordingly, the respective holding portion 12 is also designed so that the respective board 8 can come to rest flat against it.
  • the board carrier 22 has holding elements 23 along opposite longitudinal sides of the respective holding area 12. These serve to attach and flat pressing the respective board 8 on the board carrier 22.
  • said holding elements 23 are plastically deformed, such that they each overlap a longitudinal side edge 24 of the respective board 8 side.
  • the holding elements 23 of the respective holding region 12 are holding webs which lie opposite one another on the longitudinal sides of the respective holding region 12 and which extend in each case without interruption along the respective longitudinal side of the holding region 12.
  • the board carrier 22 is an extruded profile, preferably a metal extruded profile, in which the web-shaped holding elements 23 are integrally formed.
  • the holding elements 23, which on account of their preferred design can also be referred to below as holding webs 23, extend over the entire length of the platinum carrier 22 produced in the extrusion process.
  • the holding webs 23 also extend over the entire length of the respective board 8 whereby the respective board 8 is pressed over its entire length at both longitudinal side edges 24 against the holding portion 12 and secured to the platinum carrier 22.
  • the connection between the respective circuit board 8 and the platinum carrier 22 is so effective with the aid of the laterally arranged and formed retaining webs 23 that basically a thermal paste between the board 8 and the platinum carrier 8 can be dispensed with.
  • the respective holding element 23 a the respective longitudinal side edge 24 of the respective Board 8 embracing gripping region 25 and a forming region 26 which connects the gripping region 25 with the platinum carrier 22.
  • the gripping portion 25 each have a latching contour 27, which cooperates with each one formed on the cover 21 counter-latching contour 28 to lock the cover 21 with the board carrier 22.
  • the forming region 26 has a smaller wall thickness transversely to the longitudinal direction of the platinum carrier 22 than the associated gripping region 25.
  • the respective holding element 23 in the deformed state, the respective board 8 laterally securely overlap is an in FIG. 3a indicated height 28 of the respective holding element 23 greater than one in FIG. 3b
  • the height 28 is measured from a fixed to the plate carrier 22 fixed end 30 of the respective holding member 23 to a remote from the fixed end 30 free end 31 of the respective holding member 23.
  • the LEDs 9 are arranged in a single, rectilinear row on the circuit board 8 .
  • the respective LED row extends in the figures parallel to the longitudinal direction of the platinum carrier 22 and thus perpendicular to the plane of the drawing.
  • This one LED row is preferably arranged centrally on the circuit board 8.
  • FIG. 3a is the platinum support 22, which here corresponds to the support body 20, as an extruded profile specifically prepared so that the web-shaped support members 23 in a in the FIGS. 3a and 3b reproduced starting position, which corresponds to an undeformed initial state of the holding elements 23.
  • the holding elements 23 are in this initial state, can according to FIG. 3b the respective board 8 are particularly easily inserted into the respective holding area 12.
  • the holding elements 23 are plastically deformed, such that they each overlap a longitudinal side edge 24 of the board 8.
  • the holding elements 23 press the board 8 against the holding area 12.
  • the forming process can be realized for example by a rolling process. Such a rolling can be particularly easy to implement in the rectilinear plate carrier 22.
  • the cover 21 are mounted on the board carrier 22 and on the support body 20. Rest here the counter-latching contours 28 of the cover 21 in the latching contours 27 of the holding elements 23 a.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)

Description

Die vorliegende Erfindung betrifft eine Leuchteinrichtung mit den Merkmalen des Oberbegriffs des Anspruchs 1 und einen Platinenträger für eine solche Leuchteinrichtung.The present invention relates to a lighting device having the features of the preamble of claim 1 and a board carrier for such a lighting device.

Eine Leuchte umfasst üblicherweise ein Leuchtengehäuse, an dem mittels entsprechender Fassungen und/oder Halterungen zumindest eine Leuchteinrichtung oder Lampe angebracht werden kann. Herkömmliche Leuchteinrichtungen sind beispielsweise Glühbirnen und Leuchtstoffröhren. Um bei Leuchten Energie einzusparen, kommen vermehrt Leuchteinrichtungen zum Einsatz, die als Leuchtmittel mehrere LEDs aufweisen. LEDs steht dabei für lichtemittierende Diode. LEDs sollen im vorliegenden Zusammenhang auch OLEDs umfassen, wobei OLED für organische LED steht.A luminaire usually comprises a luminaire housing to which at least one lighting device or lamp can be attached by means of corresponding sockets and / or holders. Conventional lighting devices are, for example, light bulbs and fluorescent tubes. In order to save energy in luminaires, more and more lighting devices are used, which have several LEDs as the light source. LEDs stands for light emitting diode. LEDs in the present context should also include OLEDs, where OLED stands for organic LED.

LEDs werden dabei üblicherweise an einer Platine angebracht, wobei die jeweilige Platine dann mehrere LEDs trägt. Auch im Betrieb von Leuchteinrichtungen auf LED-Basis entsteht Wärme, die abgeführt werden muss, um für die LEDs eine möglichst hohe Lebensdauer zu erzielen. Die jeweilige Platine kann hierzu an einem Platinenträger befestigt werden, über den die anfallende Wärme abgegleitet werden kann. Von entscheidender Bedeutung ist dabei die Wärmeübertragung von der jeweiligen Platine auf den Platinenträger. Um eine möglichst hohe Wärmeübertragung zwischen Platine und Platinenträger zu erreichen, kann ein vergleichsweise hoher Aufwand betrieben werden. Beispielsweise ist es möglich, zwischen der Platine und dem Platinenträger eine Wärmeleitpaste anzuordnen. Ferner ist es grundsätzlich möglich, die Platine mit dem Platinenträger zu verschrauben, wodurch eine Anpressung der Platine an den Platinenträger erzielbar ist, was den Wärmeübergang verbessert. Das Anbringen einer Wärmeleitschicht und/oder das Setzen von Schrauben ist jedoch mit einem vergleichsweise hohen Aufwand verbunden.LEDs are usually mounted on a circuit board, the respective board then carries several LEDs. The operation of LED-based lighting devices also generates heat that must be dissipated in order to maximize the life of the LEDs. For this purpose, the respective circuit board can be fastened to a board carrier, via which the accumulating heat can be slid off. Of crucial importance is the heat transfer from the respective board to the board carrier. In order to achieve the highest possible heat transfer between the board and board carrier, a relatively high effort can be operated. For example, it is possible to arrange a thermal paste between the board and the board carrier. Furthermore, it is basically possible to screw the board to the board carrier, whereby a contact pressure of the board to the board carrier can be achieved, which improves the heat transfer. The attachment of a Wärmeleitschicht and / or the setting of screws, however, is associated with a relatively high cost.

Eine gattungsgemäße Leuchteinrichtung ist aus der US 2013/0050999 A1 bekannt. Sie weist eine längliche und geradlinige Platine, die an ihrer Vorderseite mehrere LEDs trägt, und einen länglichen und geradlinigen Platinenträger auf, an dem die jeweilige Platine befestigt ist. Der Platinenträger weist einen Haltebereich zur Aufnahme der Platine auf. Der Platinenträger weist entlang von sich gegenüberliegenden Längsseiten des jeweiligen Haltebereichs Halteelemente auf, die zum Befestigen und Andrücken der jeweiligen Platine am Platinenträger plastisch umgeformt sind, so dass sie jeweils einen Längsseitenrand der jeweiligen Platine übergreifen. Das jeweilige Halteelement weist einen den jeweiligen Längsseitenrand der Platine umgreifenden Greifbereich und einen den Greifbereich mit dem Platinenträger verbindenden Umformbereich auf, wobei die plastische Umformung des jeweiligen Halteelements zum Festlegen der jeweiligen Platine am Platinenträger weitgehend im Umformbereich erfolgt. Die Rückseite der jeweiligen Platine ist eben ausgestaltet. Bei der bekannten Leuchteinrichtung besitzt das jeweilige Halteelement im Greifbereich und im Umformbereich dieselbe Wandstärke.A generic lighting device is from the US 2013/0050999 A1 known. It has an elongated and rectilinear board, which carries several LEDs on its front side, and an elongate and rectilinear board carrier, to which the respective board is attached. The board carrier has a holding area for receiving the board. The platinum carrier has along opposite longitudinal sides of the respective holding region retaining elements which are plastically deformed for attaching and pressing the respective board on the platinum carrier, so that they each overlap a longitudinal side edge of the respective board. The respective holding element has a gripping area encompassing the respective longitudinal side edge of the board and a forming area connecting the gripping area with the platinum carrier, the plastic deformation of the respective holding element for fixing the respective board on the board carrier being largely in the forming area. The back of each board is just designed. In the known lighting device, the respective holding element has the same wall thickness in the gripping area and in the forming area.

Aus der US 2011/0192586 A1 ist eine ähnliche Leuchteinrichtung bekannt, bei welcher der Haltebereich im Querschnitt zur Platine hin konvex gekrümmt ist, um einen intensiven, flächigen Kontakt zwischen Haltebereich und Platine zu erzeugen.From the US 2011/0192586 A1 a similar lighting device is known in which the holding area is curved in a convex manner in cross section to the board in order to produce an intensive, flat contact between the holding area and the board.

Die vorliegende Erfindung beschäftigt sich mit dem Problem, für eine Leuchteinrichtung der eingangs genannten Art bzw. für einen zugehörigen Platinenträgereine verbesserte Ausführungsform anzugeben, die sich insbesondere durch einen reduzierten Herstellungsaufwand auszeichnet. Außerdem soll eine möglicht effiziente Wärmeübertragung zwischen der jeweiligen Platine und dem Platinenträger realisiert werden.The present invention is concerned with the problem of providing for a lighting device of the type mentioned or for an associated board carrier an improved embodiment, which is characterized in particular by a reduced manufacturing cost. In addition, a possible efficient heat transfer between the respective board and the board carrier is to be realized.

Dieses Problem wird erfindungsgemäß durch die Gegenstände der unabhängigen Ansprüche gelöst. Vorteilhafte Ausführungsformen sind Gegenstand der abhängigen Ansprüche.This problem is solved according to the invention by the subject matters of the independent claims. Advantageous embodiments are the subject of the dependent claims.

Die Erfindung beruht auf dem allgemeinen Gedanken, den Platinenträger am jeweiligen Haltebereich mit Halteelementen auszustatten, die durch plastische Umformung die jeweilige Platine seitlich bzw. randseitig übergreifen und gegen den Haltebereich andrücken. Gleichzeitig wird die jeweilige Platine dadurch am Platinenträger fixiert. Das plastische Umformen derartiger Halteelemente lässt sich besonders einfach und somit preiswert realisieren. Gleichzeitig wird durch das Andrücken der Platine gegen den Haltebereich eine intensive Wärmeübertragung ermöglicht.The invention is based on the general idea of equipping the plate carrier on the respective holding region with holding elements which laterally or peripherally overlap the respective plate by plastic deformation and press against the holding region. At the same time, the respective board is thereby fixed to the board carrier. The plastic forming of such holding elements can be realized particularly simply and thus inexpensively. At the same time an intensive heat transfer is made possible by the pressing of the board against the holding area.

Entsprechend einer vorteilhaften Ausführungsform können die Halteelemente des jeweiligen Haltebereichs durch wenigstens zwei Haltestege gebildet sein, die sich an den Längsseiten des jeweiligen Haltebereichs gegenüberliegen und die sich jeweils entlang der jeweiligen Längsseite unterbrechungsfrei erstrecken. Hierdurch lässt sich entlang des jeweiligen Halteelements ein linienförmiges Niederdrücken der Platine im jeweiligen Abschnitt des Längsseitenrands gegen den Haltebereich des Platinenträgers erzeugen, was die Wärmeübertragung verbessert. Sofern die Platine geradlinig und länglich ausgestaltet ist, führt das Andrücken der Platine an beiden Längsseitenrändern gegen den Haltebereich dazu, dass die Platine auch zwischen diesen Längsseitenrändern flächig gegen den Haltebereich angedrückt wird, wodurch eine besonders intensive Wärmeübertragung zwischen Platine und Platinenträger erzielbar ist. Das linienförmige Niederdrücken der Platine mittels derartiger Haltestege unterscheidet sich somit signifikant von einem punktförmigen Niederdrücken, dass beispielsweise mit Hilfe von Schrauben realisierbar ist.According to an advantageous embodiment, the holding elements of the respective holding region can be formed by at least two holding webs, which lie opposite one another on the longitudinal sides of the respective holding region and which extend uninterruptedly along the respective longitudinal side. As a result, along the respective holding element, a line-shaped depression of the printed circuit board in the respective section of the longitudinal side edge against the holding region of the platinum carrier can be generated, which improves the heat transfer. If the board is designed to be straight and oblong, the pressing of the board on both longitudinal side edges against the holding area causes the board is also pressed against the holding area between these longitudinal side edges, whereby a particularly intense heat transfer between the board and platinum support can be achieved. The line-shaped depression of the board by means of such holding webs thus differs significantly from a punctiform depressions that can be realized for example by means of screws.

Entsprechend einer vorteilhaften Weiterbildung kann vorgesehen sein, dass an jeder Längsseite des jeweiligen Haltebereichs nur ein solcher Haltesteg angeordnet ist. Somit sind je Platine bzw. je Haltebereich insgesamt nur zwei derartige Haltestege vorgesehen. Hierdurch vereinfachen sich die Herstellung und die Montage.According to an advantageous development, it can be provided that only one such holding web is arranged on each longitudinal side of the respective holding region is. Thus, only two such holding webs are provided per board or per holding area. This simplifies the manufacture and assembly.

Gemäß einer bevorzugten Weiterbildung kann sich dabei der jeweilige Haltesteg zumindest von dem einen Querseitenrand oder Längsende der jeweiligen Platine bis zum anderen Querseitenrand oder Längsende der jeweiligen Platine erstrecken. Mit anderen Worten, die beiden sich gegenüberliegenden Haltestege erstrecken sich zumindest über die gesamte Länge der jeweiligen Platine. Vorzugsweise erstrecken sich die beiden, sich gegenüberliegenden Haltestege über die gesamte Länge des Platinenträgers. Sofern im jeweiligen Haltebereich zwei oder mehr Platinen in der Längsrichtung des Platinenträgers hintereinander angeordnet werden, können somit mit Hilfe der beiden durchgehenden Haltestege alle Platinen am Platinenträger festgelegt und dagegen vorgespannt werden.According to a preferred refinement, the respective retaining web may extend at least from one transverse side edge or longitudinal end of the respective board to the other transverse side edge or longitudinal end of the respective board. In other words, the two opposite holding webs extend at least over the entire length of the respective board. Preferably, the two, opposite holding webs extend over the entire length of the platinum carrier. If two or more boards are arranged one behind the other in the longitudinal direction of the board carrier in the respective holding area, all boards can thus be fixed to the board carrier and biased by means of the two continuous holding webs.

Es hat sich gezeigt, dass durch das intensive Andrücken der plastisch umgeformten Halteelemente, insbesondere der durchgehenden Haltestege, eine besonders effiziente Wärmeübertragung zwischen der jeweiligen Platine und dem Platinenträger erzielbar ist, so dass insbesondere auch auf eine Wärmeleitpaste zwischen Platine und Platinenträger verzichtet werden kann. Hierdurch vereinfacht sich die Herstellung der jeweiligen Leuchteinrichtung. Insoweit liegt auch eine unmittelbare Kontaktierung zwischen der Rückseite der Platine mit dem Haltebereich des Platinenträgers vor, wenn auf eine derartige Wärmeleitpaste verzichtet wird. Grundsätzlich ist jedoch vorstellbar, dennoch zur Optimierung eine Wärmeleitpaste zwischen der Platine und dem Haltebereich anzuordnen. Durch die hohe Anpressung wird hierbei jedoch nur vergleichsweise wenig Wärmeleitpaste benötigt.It has been shown that a particularly efficient heat transfer between the respective board and the board carrier can be achieved by the intensive pressing of the plastically deformed holding elements, in particular the continuous holding webs, so that in particular can be dispensed with a thermal paste between the board and platinum carrier. This simplifies the production of the respective lighting device. In that regard, there is also an immediate contact between the back of the board with the holding area of the platinum carrier, if such a thermal paste is dispensed with. In principle, however, it is conceivable nevertheless to arrange a thermal compound between the board and the holding area for optimization. Due to the high contact pressure, however, only comparatively little thermal paste is needed.

Bei einer anderen Ausführungsform kann das jeweilige Halteelement an einem den jeweiligen Haltebereich aufweisenden Körper des Platinenträgers integral ausgeformt sein. Bei dieser Bauweise bilden die Halteelemente und insbesondere die Haltestege somit keine separaten Bauteile, die am Platinenträger befestigt werden müssen. Durch die integrale Ausformung der Halteelemente am Platinenträger vereinfacht sich somit die Herstellung der Leuchteinrichtung.In another embodiment, the respective holding element may be integrally formed on a body of the platinum carrier having the respective holding region. In this construction form the holding elements and in particular the holding webs thus no separate components that need to be attached to the board carrier. The integral formation of the retaining elements on the board carrier thus simplifies the production of the lighting device.

Besonders vorteilhaft ist eine Ausführungsform, bei welcher der Platinenträger einen Körper aufweist, der den jeweiligen Haltebereich besitzt und der durch ein Strangprofil gebildet ist. Ein derartiges Strangprofil lässt sich besonders einfach durch ein Strangpressverfahren herstellen. Bei einem solchen Strangprofil lassen sich auch die Halteelemente, vorzugsweise die durchgehenden Haltestege, besonders einfach bereits im Rahmen der Herstellung des Strangprofils berücksichtigen. Dementsprechend entsteht bei der Ausformung der Halteelemente kein zusätzlicher Herstellungsaufwand, was die Kosten zur Herstellung der Leuchteinrichtung reduziert.Particularly advantageous is an embodiment in which the board carrier has a body which has the respective holding area and which is formed by an extruded profile. Such an extruded profile can be produced particularly easily by an extrusion process. In such an extruded profile, the holding elements, preferably the continuous holding webs, can be taken into account particularly simply as part of the production of the extruded profile. Accordingly, in the formation of the holding elements no additional manufacturing effort, which reduces the cost of producing the lighting device.

Besonders vorteilhaft ist der Platinenträger mit einem metallischen Körper ausgestattet, der den jeweiligen Haltebereich besitzt. Durch einen derartigen metallischen Körper eignet sich der Platinenträger in besonderer Weise zum Aufnehmen und Abführen von Wärme. Insbesondere kann der Platinenträger hierbei als Kühlkörper ausgestaltet sein. Besonders geeignete Metalle sind hierbei Leichtmetalle bzw. Leichtmetalllegierungen, die sich durch einen besonders hohen Wärmeleitkoeffizienten auszeichnen. Beispielsweise kann der Platinenträger aus Aluminium bzw. aus einer Aluminiumlegierung hergestellt sein.Particularly advantageously, the platinum carrier is equipped with a metallic body having the respective holding area. By such a metallic body, the board carrier is particularly suitable for receiving and removing heat. In particular, the platinum carrier can be designed here as a heat sink. Particularly suitable metals here are light metals or light metal alloys, which are characterized by a particularly high coefficient of thermal conductivity. For example, the board carrier may be made of aluminum or of an aluminum alloy.

Besonders bevorzugt ist somit eine Ausführungsform, bei welcher der Platinenträger ein metallisches Strangprofil besitzt, an dem die stegförmigen Halteelemente integral ausgeformt sind.Particularly preferred is thus an embodiment in which the board carrier has a metallic extruded profile, on which the web-shaped holding elements are integrally formed.

Erfindungsgemäß weist das jeweilige Halteelement einen den jeweiligen Längsseitenrand der Platine umgreifenden Greifbereich und einen den Greifbereich mit dem Platinenträger verbindenden Umformbereich auf. Die Umformung des jeweiligen Halteelements, die zum Festlegen der jeweiligen Platine am Platinenträger führt, erfolgt dann weitgehend, vorzugsweise ausschließlich, im Umformbereich. Auf diese Weise kann eine vorbestimmte Geometrie der Halteelemente im Greifbereich trotz der plastischen Umformung beibehalten werden, da diese weitgehend im Umformbereich stattfindet. Dementsprechend ist beispielsweise denkbar, dem Greifbereich eine zusätzliche Funktionalität zuzuordnen. Beispielsweise kann der Greifbereich auch eine Rastkontur besitzen, an der eine Abdeckung einrastbar ist, die am jeweiligen Platinenträger den Haltebereich abdeckt.According to the invention, the respective holding element has a gripping area encompassing the respective longitudinal side edge of the board and a forming area connecting the gripping area with the platinum carrier. The transformation of the respective Retaining element, which leads to the setting of the respective board on the board carrier, then takes place largely, preferably exclusively, in the forming area. In this way, a predetermined geometry of the holding elements in the gripping area can be maintained despite the plastic deformation, since this takes place largely in the forming area. Accordingly, it is conceivable, for example, to assign an additional functionality to the gripping area. For example, the gripping region may also have a latching contour on which a cover can be latched, which covers the holding region on the respective platinum carrier.

Erfindungsgemäß ist eine quer zur Längsrichtung des Platinenträgers gemessene Wandstärke des jeweiligen Halteelements im Umformbereich kleiner als im Greifbereich. Auf diese Weise ist es möglich, dass zum Umformen des jeweiligen Halteelements ein entsprechendes Umformwerkzeug am Greifbereich angreift und dennoch die Umformung weitgehend im Umformbereich stattfindet, da der stärker dimensionierte Greifbereich die Umformkräfte in den schwächer dimensionierten Umformbereich übertragen kann, so dass die plastische Umformung weitgehend im Umformbereich erfolgt.According to the invention, a wall thickness of the respective holding element measured transversely to the longitudinal direction of the platinum carrier is smaller in the forming area than in the gripping area. In this way, it is possible that for forming the respective holding element engages a corresponding forming tool on the gripping area and yet the deformation takes place largely in the forming area, since the larger sized gripping area can transfer the forming forces in the weaker sized forming area, so that the plastic deformation largely in Forming area is done.

Erfindungsgemäß ist die Rückseite der jeweiligen Platine eben ausgestaltet, während der Haltebereich im Querschnitt mit einer zur Platine hin konvexen Krümmung ausgestattet ist, was durch das randseitige Niederdrücken mit den Halteelementen zu einer entsprechenden Durchbiegung und Krümmung der Platine führt. Hierdurch kann die Platine bezüglich ihres Querschnitts in einem mittleren Bereich mit erhöhter Andruckkraft gegen den Haltebereich angedrückt werden, was dort die Wärmeübertragung verbessert. Aufgrund der relativ hohen Steifigkeit üblicher Platinenwerkstoffe reicht eine geringe oder schwache Krümmung mit großem Krümmungsradius für eine hinreichende Flächenpressung aus.According to the invention, the rear side of the respective board is designed to be planar, while the holding area is provided in cross-section with a convex curvature towards the board, which leads to a corresponding deflection and curvature of the board due to the edge-side depression with the retaining elements. In this way, the board can be pressed against the holding area with respect to its cross section in a central region with increased pressure force, which there improves the heat transfer. Due to the relatively high rigidity of conventional board materials, a small or weak curvature with a large radius of curvature suffices for a sufficient surface pressure.

Zweckmäßig ist die jeweilige Platine flach, wodurch die Halteelemente quer zur Längsrichtung des Platinenträgers nicht besonders groß bauen müssen, um durch Umformung die Platine seitlich übergreifen zu können. Auch hierdurch vereinfacht sich die Realisierung der hier vorgestellten Bauweise.Suitably, the respective board is flat, whereby the holding elements transversely to the longitudinal direction of the platinum support do not have to build very large to Forming the board can overlap laterally. This also simplifies the realization of the design presented here.

Im vorliegenden Zusammenhang wird unter einem "geradlinigen Körper" ein Körper verstanden, dessen Längsmittelachse koaxial zu einer Geraden verläuft. Unter einem "länglichen Körper" wird in vorliegendem Zusammenhang ein Körper verstanden, dessen in seiner Längsrichtung gemessene Länge größer ist als dessen quer zur Längsrichtung gemessene Breite und Höhe. Insbesondere ist ein länglicher Körper mindestens doppelt, vorzugsweise mindestens zehnmal, länger als breit und als hoch. Unter einem "flachen Körper" wird im vorliegenden Zusammenhang ein Körper verstanden, der quer zu seiner Längsrichtung einen Querschnitt besitzt, dessen Breite größer ist als dessen Höhe. Vorzugsweise ist der flache Körper in seinem Querschnitt mindestens doppelt, vorzugsweise mindestens zehnmal, breiter als hoch.In the present context, a "rectilinear body" is understood to mean a body whose longitudinal center axis runs coaxially to a straight line. An "elongated body" in the present context means a body whose length measured in its longitudinal direction is greater than its width and height measured transversely to the longitudinal direction. In particular, an elongated body is at least twice, preferably at least ten times, longer than wide and high. In the present context, a "flat body" is understood to mean a body which, transverse to its longitudinal direction, has a cross-section whose width is greater than its height. Preferably, the flat body is at least twice, preferably at least ten times, wider than high in its cross-section.

Bei einer anderen vorteilhaften Ausführungsform können die LEDs an der jeweiligen Platine entlang wenigstens einer sich in der Längsrichtung der Platine erstreckenden geradlinigen Reihe angeordnet sein. Vorzugsweise kann vorgesehen sein, dass an der länglichen und geradlinigen Platine nur eine einzige LED-Reihe vorgesehen ist, die dann an der Platine bezüglich ihres Querschnitts mittig angeordnet ist. Hierdurch kann durch die Anpressung der Platine entlang ihrer Längsseitenränder eine symmetrische Kontaktierung mit dem Haltebereich und somit eine symmetrische Wärmeabgabe an den Platinenträger realisiert werden. Durch den vorstehend genannten gekrümmten Haltebereich kann in diesem Fall die Wärmeübertragung gezielt im Bereich der LED-Reihe verbessert werden, also dort, wo die Wärme bevorzugt entsteht.In another advantageous embodiment, the LEDs may be arranged on the respective board along at least one rectilinear row extending in the longitudinal direction of the board. Preferably, it may be provided that only a single row of LEDs is provided on the elongated and rectilinear circuit board, which is then arranged centrally on the circuit board with respect to its cross section. This can be realized by the contact pressure of the board along its longitudinal side edges a symmetrical contact with the holding area and thus a symmetrical heat transfer to the board carrier. In this case, the heat transfer can be specifically improved in the region of the LED row, that is to say where the heat is produced, by the above-mentioned curved holding area.

Bei einer anderen vorteilhaften Ausführungsform kann das jeweilige Halteelement eine Höhe aufweisen, die von einem mit dem Platinenträger verbundenen festen Ende des jeweiligen Halteelements bis zu einem vom festen Ende entfernten freien Ende des jeweiligen Halteelements gemessen ist und die größer ist als eine Dicke bzw. Höhe der jeweiligen Platine. Hierdurch ist sichergestellt, dass das jeweilige Halteelement die jeweilige Platine randseitig so weit übergreifen kann, dass das jeweilige Halteelement die Platine an ihrer Vorderseite kontaktiert, um sie mit der Rückseite gegen den Haltebereich anzudrücken.In another advantageous embodiment, the respective holding element may have a height which is from a fixed end connected to the platinum carrier of the respective holding element to a remote from the fixed end free end of the respective holding element is measured and which is greater than a thickness or height of the respective board. In this way, it is ensured that the respective holding element can overlap the respective board on the edge so far that the respective holding element makes contact with the board on its front side in order to press it against the holding area with the rear side.

Ein erfindungsgemäßer Platinenträger, der sich zum Herstellen einer Leuchteinrichtung der vorstehend beschriebenen Art eignet, besitzt zumindest einen Haltebereich, in dem zumindest eine Platine anbringbar ist, die mehrere LEDs aufweisen kann. Ferner besitzt der Platinenträger entlang von sich gegenüberliegenden Längsseiten des jeweiligen Haltebereichs Halteelemente zum Festlegen der jeweiligen Platine am Platinenträger. Die Halteelement stehen dabei von einem Körper des Platinenträger Leuchteinrichtung des Platinenträgers ab und sind so dimensioniert, dass sie zum Befestigen und Anpressen einer im jeweiligen Haltebereich angeordneten Platine am Platinenträger plastisch umformbar sind, und zwar derart, dass sie einen Längsseitenrand der jeweiligen Platine übergreifen. Auch hier weist das jeweilige Halteelement einen Greifbereich und einen Umformbereich auf, wobei die Wandstärke des Halteelements im Umformbereich kleiner ist als im Greifbereich.An inventive board carrier, which is suitable for producing a lighting device of the type described above, has at least one holding area, in which at least one board can be attached, which may have a plurality of LEDs. Further, the board carrier has along opposite longitudinal sides of the respective holding portion retaining elements for fixing the respective board on the board carrier. The holding element stand thereby from a body of the platinum carrier lighting device of the platinum carrier and are dimensioned so that they are plastically deformable for mounting and pressing a arranged in each holding area board on the board carrier, in such a way that they overlap a longitudinal side edge of the respective board. Again, the respective holding element has a gripping area and a forming area, wherein the wall thickness of the holding element in the forming area is smaller than in the gripping area.

Ein nicht erfindungsgemäßes Verfahren zum Herstellen einer Leuchteinrichtung der vorstehend beschriebenen Art kann so durchgeführt werden, dass zunächst die jeweilige Platine in den jeweiligen Haltebereich des Platinenträgers eingelegt wird, wobei sich die Halteelemente in einem unverformten Ausgangszustand befinden, der das Einsetzen der jeweiligen Platine in den jeweiligen Haltebereich ermöglicht. Insbesondere lässt sich der Platinenträger als Strangprofil bereits so herstellen, dass sich die Halteelemente in diesem Ausgangszustand befinden. Beim Verfahren werden nun nach dem Einlegen der jeweiligen Platine in den jeweiligen Haltebereich die Halteelemente plastisch umgeformt, und zwar derart, dass sie jeweils einen Längsseitenrand der jeweiligen Platine übergreifen und dabei die jeweilige Platine gegen den Haltebereich andrücken. Hierdurch wird die jeweilige Platine am Platinenträger fixiert und gleichzeitig dagegen vorgespannt, wodurch eine besonders intensive Wärmeübertragung zwischen Platine und Platinenträger erreicht wird.A non-inventive method for producing a lighting device of the type described above can be carried out so that first the respective board is inserted into the respective holding region of the platinum carrier, wherein the holding elements are in an undeformed initial state, the insertion of the respective board in the respective Holding area allows. In particular, the platinum carrier can already be produced as an extruded profile in such a way that the holding elements are in this initial state. In the method, the holding elements are now plastically deformed after inserting the respective board in the respective holding area, in such a way that they each overlap a longitudinal side edge of the respective board and thereby Press the respective board against the holding area. As a result, the respective board is fixed to the board carrier and at the same time biased against it, whereby a particularly intense heat transfer between the board and board carrier is achieved.

Entsprechend einer vorteilhaften Ausführungsform des Verfahrens kann das Umformen der Halteelemente durch Rollieren erfolgen. Hierbei rollt ein entsprechendes Rollierwerkzeug entlang des Haltebereichs ab, wobei es die Halteelemente gleichförmig umformt. Ein derartiges Rollierverfahren lässt sich besonders einfach automatisieren, wodurch die Herstellung besonders effizient realisierbar ist.According to an advantageous embodiment of the method, the forming of the holding elements can be carried out by rolling. In this case, a corresponding roller burnishing tool rolls along the holding area, wherein it uniformly transforms the holding elements. Such a Rollierverfahren can be particularly easy to automate, whereby the production is particularly efficient realized.

Der Platinenträger kann beispielsweise einen Geräteträger einer Leuchte bilden, die ein Tragprofil zur Wand- und Deckenmontage sowie einen solchen Geräteträger aufweist. Hierbei ist die Platine mit den LEDs fest in dem Geräteträger eingebaut. Insoweit handelt es sich bei der hier vorgestellten Leuchteinrichtung um einen Geräteträger einer Leuchte.The platinum support may, for example, form a device carrier of a luminaire, which has a support profile for wall and ceiling mounting and such a device carrier. Here, the board with the LEDs is firmly installed in the equipment rack. In that regard, the lighting device presented here is a device carrier of a luminaire.

Alternativ kann der Platinenträger auch einen Tragkörper einer länglichen und geradlinigen Lampe bilden, die insgesamt über Halterungen und/oder Fassungen an einem Leuchtengehäuse oder an einem Geräteträger montiert werden kann.Alternatively, the board carrier can also form a supporting body of an elongated and rectilinear lamp, which can be mounted in total on brackets and / or sockets on a lamp housing or on a device carrier.

Dementsprechend betrifft die vorliegende Erfindung auch eine Lampe, an deren Tragkörper wenigstens eine Platine auf die vorbeschriebene Art befestigt ist. Ferner betrifft die vorliegende Erfindung auch eine Leuchte mit wenigstens einer derartigen Lampe. Außerdem betrifft die vorliegende Erfindung auch eine Leuchte mit einem Geräteträger, an dem wenigstens eine Platine entsprechend der vorstehenden Art befestigt ist.Accordingly, the present invention also relates to a lamp, on the supporting body at least one board is fixed in the manner described above. Furthermore, the present invention also relates to a luminaire with at least one such lamp. In addition, the present invention also relates to a lamp with a device carrier to which at least one board is attached according to the above type.

Weitere wichtige Merkmale und Vorteile der Erfindung ergeben sich aus den Unteransprüchen, aus den Zeichnungen und aus der zugehörigen Figurenbeschreibung anhand der Zeichnungen.Other important features and advantages of the invention will become apparent from the dependent claims, from the drawings and from the associated figure description with reference to the drawings.

Es versteht sich, dass die vorstehend genannten und die nachstehend noch zu erläuternden Merkmale nicht nur in der jeweils angegebenen Kombination, sondern auch in anderen Kombinationen oder in Alleinstellung verwendbar sind, ohne den Rahmen der vorliegenden Erfindung zu verlassen.It is understood that the features mentioned above and those yet to be explained below can be used not only in the particular combination given, but also in other combinations or in isolation, without departing from the scope of the present invention.

Bevorzugte Ausführungsbeispiele der Erfindung sind in den Zeichnungen dargestellt und werden in der nachfolgenden Beschreibung näher erläutert, wobei sich gleiche Bezugszeichen auf gleiche oder ähnliche oder funktional gleiche Komponenten beziehen.Preferred embodiments of the invention are illustrated in the drawings and are explained in more detail in the following description, wherein the same reference numerals refer to the same or similar or functionally identical components.

Es zeigen, jeweils schematisch,

Fig. 1
einen Querschnitt einer Leuchte mit Tragprofil und Geräteträger, bei einer einflammigen Ausführungsform der Leuchte,
Fig. 2
einen Querschnitt der Leuchte ohne Tragprofil, bei einer zweiflammigen Ausführungsform,
Fig. 3
einen Querschnitt einer Lampe mit einem Tragkörper, bei verschiedenen Zuständen a bis d während der Herstellung.
Show, in each case schematically,
Fig. 1
a cross section of a luminaire with support profile and equipment carrier, in a single-flame embodiment of the lamp,
Fig. 2
a cross section of the lamp without support profile, in a two-lamp embodiment,
Fig. 3
a cross section of a lamp with a support body, in various states a to d during manufacture.

Entsprechend den Figuren 1 und 2 umfasst eine geradlinige und längliche Leuchte 1, die sich in besonderer Weise zur Herstellung eines Lichtbands, das aus mehreren in ihrer Längsrichtung hintereinander angeordneten derartigen Leuchten 1 besteht, eignet, ein nur in Figur 1 dargestelltes Tragprofil 2 und einen Geräteträger 3.According to the Figures 1 and 2 comprises a rectilinear and oblong luminaire 1, which is particularly suitable for producing a light band consisting of a plurality of such luminaires 1 arranged one behind the other in its longitudinal direction, a light beam only in FIG. 1 illustrated support section 2 and a device carrier. 3

Das Tragprofil 2 dient zur Wand- oder Deckenmontage der Leuchte 1. Das Tragprofil 2 ist zweckmäßig ein Blechformteil. Im Tragprofil 2 verläuft im Beispiel der Figur 1 eine Stromführungsschiene 4, die an eine externe Stromversorgung angeschlossen ist, wenn die Leuchte 1 ordnungsgemäß montiert ist. Die Stromführungsschiene 4 weist mehrere Eingriffsbereiche 5 auf, in denen mehrere elektrische Leiter 6 angeordnet sind.The support section 2 is used for wall or ceiling mounting of the lamp 1. The support section 2 is suitably a sheet metal part. In the support section 2 runs in the example of FIG. 1 a power guide rail 4 which is connected to an external power supply when the lamp 1 is properly mounted. The current-carrying rail 4 has a plurality of engagement regions 5, in which a plurality of electrical conductors 6 are arranged.

Der Geräteträger 3 dient zur Anordnung von elektrischen Verbrauchern sowie weiterer Komponenten. Bei den hier gezeigten Ausführungsformen sind in den Geräteträger 3 elektrische Leuchtmittel 7 integriert, die durch wenigstens eine Platine 8 gebildet sind, an der mehrere LEDs 9 angeordnet sind. Insoweit bildet der gesamte Geräteträger 3 durch die darin integrierten Leuchtmittel 7 eine Leuchteinrichtung 10.The device carrier 3 is used to arrange electrical consumers and other components. In the embodiments shown here are in the Device carrier 3 electrical lighting means 7 integrated, which are formed by at least one circuit board 8, on which a plurality of LEDs 9 are arranged. In that regard, the entire equipment carrier 3 forms a lighting device 10 by the integrated therein light source 7.

Der Geräteträger 3 weist bei der in Figur 1 gezeigten Ausführungsform an seiner Vorderseite 11 einen einzigen Haltebereich 12 für eine oder mehrere Platinen 8 auf, wodurch die Leuchte 1 in Figur 1 einflammig ausgestaltet ist. Bei der in Figur 2 gezeigten Ausführungsform besitzt der Geräteträger 3 an seiner Vorderseite 11 genau zwei derartige Haltebereiche 12, in denen jeweils wenigstens eine Platine 8 angeordnet ist. Dementsprechend ist die in Figur 2 gezeigte Leuchte 1 zweiflammig. Die Haltebereiche 12 sind im Geräteträger 3 vertieft bzw. in einer Vertiefung 13 angeordnet, die mit einer Lichtoptik 14 bündig zur Vorderseite 11 verschlossen ist. An seiner Rückseite 15 trägt der Geräteträger 3 im Beispiel jeweils ein Anschlusselement 16, das mehrere Steckbereiche 16 aufweist, die im montierten Zustand des Geräteträgers 3 in die Eingriffsbereiche 5 der Stromführungsschiene 4 eingreifen, um dort den jeweils benötigten Leiter 6 elektrisch zu kontaktieren. Gemäß Figur 1 ist der Geräteträger 3 unmittelbar mit dem Tragprofil 2 verrastet. Entsprechende Verrastungen sind in Figur 1 mit 18 bezeichnet. Die jeweilige Verrastung 18 erstreckt sich über die gesamte Länge der Leuchte 1 und weist am Geräteträger 3 und am Tragprofil 2 ausgebildete, zueinander komplementäre Rastkonturen auf, die gleichzeitig eine hinreichende Dichtwirkung realisieren können.The device carrier 3 has in the in FIG. 1 shown embodiment on its front side 11 a single holding portion 12 for one or more boards 8, whereby the lamp 1 in FIG. 1 is designed einflammig. At the in FIG. 2 In the embodiment shown, the device carrier 3 has exactly two such holding regions 12 on its front side 11, in each of which at least one printed circuit board 8 is arranged. Accordingly, the in FIG. 2 shown lamp 1 two-lamp. The holding regions 12 are recessed in the device carrier 3 or arranged in a recess 13, which is closed with a light optics 14 flush with the front 11. In its example, the device carrier 3 carries on its rear side 15 in each case a connection element 16 which has a plurality of plug-in regions 16 which, in the mounted state of the device carrier 3, engage in the engagement regions 5 of the current-carrying rail 4 in order to electrically contact the respectively required conductor 6 there. According to FIG. 1 the device carrier 3 is locked directly to the support section 2. Corresponding locks are in FIG. 1 denoted by 18. The respective catch 18 extends over the entire length of the lamp 1 and has on the equipment carrier 3 and on the support section 2 formed, mutually complementary latching contours, which can simultaneously realize a sufficient sealing effect.

Figur 3d zeigt eine Lampe 19, die austauschbar an einer hier nicht gezeigten Leuchte angebracht werden kann. Die Lampe 19 besitzt einen Tragkörper 20 und eine daran fixierte Abdeckung 21. Der Tragkörper 20 weist ebenfalls einen Haltebereich 12 auf, in dem als Leuchtmittel 7 wieder eine Platine 8 angeordnet ist, die mehrere LEDs 9 trägt. Bei der in Figur 3d gezeigten Lampe 19 definiert somit der Tragkörper 20 ebenfalls eine Leuchteinrichtung 10. 3d figure shows a lamp 19 which can be interchangeably attached to a lamp, not shown here. The lamp 19 has a support body 20 and a cover 21 fixed thereto. The support body 20 likewise has a holding region 12, in which a circuit board 8, which is again arranged as the light source 7, is disposed several LEDs 9 carries. At the in 3d figure thus, the support body 20 also defines a lighting device 10.

Die Leuchte 1 ist ebenso wie die Lampe 19 geradlinig und länglich konzipiert, wobei eine Längsmittelachse senkrecht zur Zeichnungsebene bzw. senkrecht zur Schnittebene verläuft. Dementsprechend sind bei der Leuchte 1 auch das Tragprofil 2 und der Geräteträger 3 und somit die Leuchteinrichtung 10 geradlinig und länglich konzipiert. Bei der Lampe 19 sind somit auch der Tragkörper 20 und dementsprechend auch die Leuchteinrichtung 10 sowie die Abdeckung 21 geradlinig und länglich konzipiert.The lamp 1 is just like the lamp 19 designed to be rectilinear and oblong, with a longitudinal central axis perpendicular to the plane of the drawing or perpendicular to the cutting plane. Accordingly, in the lamp 1 and the support section 2 and the equipment carrier 3 and thus the lighting device 10 are designed to be straight and elongated. In the case of the lamp 19, the supporting body 20 and, accordingly, also the lighting device 10 and the cover 21 are thus designed to be rectilinear and oblong.

Entsprechend den Figuren 1 bis 3 umfasst die Leuchteinrichtung 10, die bei der Leuchte 1 durch den Geräteträger 3 gebildet ist und die bei der Lampe 19 durch den Tragkörper 20 gebildet ist, somit wenigstens eine geradlinige und längliche Platine 8, die an ihrer Vorderseite die LEDs 9 trägt. Ferner weist die Leuchteinrichtung 10 einen länglichen und geradlinigen Platinenträger 22 auf, der bei der Leuchte 1 dem Grundkörper des Geräteträgers 3, also dem Geräteträger 3 ohne daran angebaute Leuchtmittel 7 entspricht. Bei der Lampe 19 entspricht der Platinenträger 22 dem Tragkörper 20 ohne daran angebrachte Leuchtmittel 7. Am Platinenträger 22 ist somit die jeweilige Platine 8 befestigt. Hierzu besitzt der Platinenträger 22 zumindest einen Haltebereich 12 zur Aufnahme wenigstens einer solchen Platine 8. Der Haltebereich 12 kann dabei komplementär zur Rückseite der jeweiligen Platine 8 geformt sein. Zweckmäßig ist die Platine 8 an ihrer Rückseite eben ausgestaltet. Dementsprechend ist auch der jeweilige Haltebereich 12 eben ausgestaltet, so dass die jeweilige Platine 8 daran flächig zur Anlage kommen kann. Erfindungsgemäß besitzt der Haltebereich 12 im Querschnitt eine konvexe Krümmung. Entsprechend den Figuren 1 bis 3 weist der Platinenträger 22 entlang von sich gegenüberliegenden Längsseiten des jeweiligen Haltebereichs 12 Halteelemente 23 auf. Diese dienen zum Befestigen und flächigen Andrücken der jeweiligen Platine 8 am Platinenträger 22. Zu diesem Zweck sind besagte Halteelemente 23 plastisch umgeformt, derart, dass sie jeweils einen Längsseitenrand 24 der jeweiligen Platine 8 seitlich übergreifen.According to the FIGS. 1 to 3 comprises the lighting device 10, which is formed in the lamp 1 by the equipment carrier 3 and which is formed at the lamp 19 by the support body 20, thus at least one rectilinear and elongated board 8, the LEDs 9 carries on its front. Furthermore, the lighting device 10 has an elongated and rectilinear platinum carrier 22, which corresponds to the base body of the device carrier 3, ie the device carrier 3 without attached light source 7 in the lamp 1. In the case of the lamp 19, the platinum carrier 22 corresponds to the carrier body 20 without illuminants 7 attached thereto. The respective circuit board 8 is thus fastened to the platinum carrier 22. For this purpose, the board carrier 22 has at least one holding area 12 for receiving at least one such board 8. The holding area 12 may be formed to be complementary to the back of the respective board 8. The circuit board 8 is expediently configured on its rear side. Accordingly, the respective holding portion 12 is also designed so that the respective board 8 can come to rest flat against it. According to the invention has the holding portion 12 in cross-section a convex curvature. According to the FIGS. 1 to 3 the board carrier 22 has holding elements 23 along opposite longitudinal sides of the respective holding area 12. These serve to attach and flat pressing the respective board 8 on the board carrier 22. For this purpose, said holding elements 23 are plastically deformed, such that they each overlap a longitudinal side edge 24 of the respective board 8 side.

Zweckmäßig handelt es sich bei den Halteelementen 23 des jeweiligen Haltebereichs 12 um Haltestege, die sich an den Längsseiten des jeweiligen Haltebereichs 12 gegenüberliegen und die sich jeweils entlang der jeweiligen Längsseite des Haltebereichs 12 unterbrechungsfrei erstrecken. Somit sind zumindest zwei einander im jeweiligen Haltebereich 12 gegenüberliegende Haltestege 23 vorgesehen, die sich in der Längsrichtung des Platinenträgers 22 erstrecken. Zweckmäßig handelt es sich beim Platinenträger 22 um ein Strangprofil, vorzugsweise um ein metallisches Strangprofil, bei dem die stegförmigen Halteelemente 23 integral ausgeformt sind. In diesem Fall erstrecken sich die Halteelemente 23, die aufgrund ihrer bevorzugten Bauform im Folgenden auch als Haltestege 23 bezeichnet werden können, über die gesamte Länge des im Strangpressverfahren hergestellten Platinenträgers 22. Somit erstrecken sich die Haltestege 23 auch über die gesamte Länge der jeweiligen Platine 8, wodurch die jeweilige Platine 8 über ihre gesamte Länge an beiden Längsseitenrändern 24 gegen den Haltebereich 12 angedrückt und am Platinenträger 22 befestigt ist. Die Verbindung zwischen der jeweilige Platine 8 und dem Platinenträger 22 ist mit Hilfe der seitlich angeordneten und umgeformten Haltestege 23 so effektiv, dass grundsätzlich auf eine Wärmeleitpaste zwischen der Platine 8 und dem Platinenträger 8 verzichtet werden kann.Expediently, the holding elements 23 of the respective holding region 12 are holding webs which lie opposite one another on the longitudinal sides of the respective holding region 12 and which extend in each case without interruption along the respective longitudinal side of the holding region 12. Thus, at least two mutually in the respective holding portion 12 opposite holding webs 23 are provided which extend in the longitudinal direction of the platinum carrier 22. Expediently, the board carrier 22 is an extruded profile, preferably a metal extruded profile, in which the web-shaped holding elements 23 are integrally formed. In this case, the holding elements 23, which on account of their preferred design can also be referred to below as holding webs 23, extend over the entire length of the platinum carrier 22 produced in the extrusion process. Thus, the holding webs 23 also extend over the entire length of the respective board 8 whereby the respective board 8 is pressed over its entire length at both longitudinal side edges 24 against the holding portion 12 and secured to the platinum carrier 22. The connection between the respective circuit board 8 and the platinum carrier 22 is so effective with the aid of the laterally arranged and formed retaining webs 23 that basically a thermal paste between the board 8 and the platinum carrier 8 can be dispensed with.

Wie sich den Figuren 3a bis 3d besonders deutlich entnehmen lässt, kann das jeweilige Halteelement 23 einen den jeweiligen Längsseitenrand 24 der jeweiligen Platine 8 umgreifenden Greifbereich 25 und einen Umformbereich 26 aufweisen, der den Greifbereich 25 mit dem Platinenträger 22 verbindet. Die plastische Umformung des jeweiligen Halteelements 23, mit deren Hilfe die Fixierung und das Andrücken der Platine 8 am Platinenträger 22 bewirkt werden soll, erfolgt dabei weitgehend innerhalb des Umformbereichs 26, so dass der jeweilige Greifbereich 25 seine Geometrie und seine Funktionalität beibehalten kann. Beispielsweise kann gemäß der in den Figuren 3a bis 3d gezeigten Ausführungsform der Greifbereich 25 jeweils eine Rastkontur 27 aufweisen, die mit je einer an der Abdeckung 21 ausgebildeten Gegenrastkontur 28 zusammenwirkt, um die Abdeckung 21 mit dem Platinenträger 22 zu verrasten.How the FIGS. 3a to 3d can be particularly clearly seen, the respective holding element 23 a the respective longitudinal side edge 24 of the respective Board 8 embracing gripping region 25 and a forming region 26 which connects the gripping region 25 with the platinum carrier 22. The plastic deformation of the respective holding element 23, with the help of the fixation and the pressing of the board 8 is to be effected on the platinum carrier 22, thereby takes place largely within the forming region 26 so that the respective gripping portion 25 can maintain its geometry and functionality. For example, according to the in the FIGS. 3a to 3d shown embodiment, the gripping portion 25 each have a latching contour 27, which cooperates with each one formed on the cover 21 counter-latching contour 28 to lock the cover 21 with the board carrier 22.

Damit die plastische Umformung des jeweiligen Halteelements 23 im Umformbereich 26 erfolgt, besitzt der Umformbereich 26 quer zur Längsrichtung des Platinenträgers 22 eine geringere Wandstärke als der zugehörige Greifbereich 25. Durch das Vorsehen eines derartigen Umformbereichs 26 wird außerdem eine extreme Vereinfachung des Umformvorgangs erreicht, da ein hierzu verwendetes Umformwerkzeug ohne Weiteres am Greifbereich 25 angreifen kann, um im Umformbereich 26 die gewünschte plastische Umformung zu bewirken.So that the plastic deformation of the respective holding element 23 takes place in the forming region 26, the forming region 26 has a smaller wall thickness transversely to the longitudinal direction of the platinum carrier 22 than the associated gripping region 25. By providing such a forming region 26 also an extreme simplification of the forming process is achieved as a For this purpose used forming tool can readily attack the gripping portion 25 to cause the desired plastic deformation in the forming area 26.

Damit das jeweilige Haltelement 23 im umgeformten Zustand die jeweilige Platine 8 seitlich sicher übergreifen kann, ist eine in Figur 3a angedeutete Höhe 28 des jeweiligen Halteelements 23 größer als eine in Figur 3b angedeutete Dicke 29 der jeweiligen Platine 8. Die Höhe 28 ist dabei von einem mit dem Platinenträger 22 verbundenen festen Ende 30 des jeweiligen Halteelements 23 bis zu einem vom festen Ende 30 entfernten freien Ende 31 des jeweiligen Halteelements 23 gemessen.So that the respective holding element 23 in the deformed state, the respective board 8 laterally securely overlap, is an in FIG. 3a indicated height 28 of the respective holding element 23 greater than one in FIG. 3b The height 28 is measured from a fixed to the plate carrier 22 fixed end 30 of the respective holding member 23 to a remote from the fixed end 30 free end 31 of the respective holding member 23.

Bevorzugt ist für das jeweilige Leuchtmittel 7 eine Ausführungsform, bei der die LEDs 9 in einer einzigen, geradlinigen Reihe an der Platine 8 angeordnet sind. Die jeweilige LED-Reihe erstreckt sich in den Figuren parallel zur Längsrichtung des Platinenträgers 22 und somit senkrecht zur Zeichnungsebene. Diese eine LED-Reihe ist dabei bevorzugt mittig an der Platine 8 angeordnet. Durch das seitliche, an den Längsseitenrändern 24 bewirkte Andrücken der Platine 8 gegen den Haltebereich 12 erfolgt auch eine bezüglich der LED-Reihe symmetrische Anpressung der Platine 8 gegen den Platinenträger 22, was die effiziente Wärmeabfuhr begünstigt.For the respective luminous means 7, an embodiment in which the LEDs 9 are arranged in a single, rectilinear row on the circuit board 8 is preferred. The respective LED row extends in the figures parallel to the longitudinal direction of the platinum carrier 22 and thus perpendicular to the plane of the drawing. This one LED row is preferably arranged centrally on the circuit board 8. By the lateral, on the longitudinal side edges 24 effected pressing the board 8 against the holding portion 12 also takes place with respect to the LED row symmetrical contact pressure of the board 8 against the board carrier 22, which favors the efficient heat dissipation.

Ein vorteilhaftes Verfahren zum Herstellen einer Leuchteinrichtung 10 wird im Folgenden anhand der Figuren 3a bis 3d näher erläutert.An advantageous method for producing a lighting device 10 will be described below with reference to FIG FIGS. 3a to 3d explained in more detail.

Gemäß Figur 3a wird der Platinenträger 22, der hier dem Tragkörper 20 entspricht, als Strangprofil gezielt so hergestellt, dass sich die stegförmigen Halteelemente 23 in einer in den Figuren 3a und 3b wiedergegebenen Ausgangsstellung befinden, die einem unverformten Ausgangszustand der Halteelemente 23 entspricht. Sofern sich die Halteelemente 23 in diesem Ausgangszustand befinden, kann gemäß Figur 3b die jeweilige Platine 8 besonders einfach in den jeweiligen Haltebereich 12 eingelegt werden. Anschließend können gemäß Figur 3c die Halteelemente 23 plastisch umgeformt werden, derart, dass sie jeweils einen Längsseitenrand 24 der Platine 8 übergreifen. Dabei drücken die Halteelemente 23 die Platine 8 gegen den Haltebereich 12 an. Der Umformprozess kann dabei beispielsweise durch einen Rolliervorgang realisiert werden. Ein derartiges Rollieren lässt sich beim geradlinigen Platinenträger 22 besonders einfach realisieren. Nach dem Umformen der Halteelemente 23 kann gemäß Figur 3d die Abdeckung 21 am Platinenträger 22 bzw. am Tragkörper 20 angebracht werden. Hierbei rasten die Gegenrastkonturen 28 der Abdeckung 21 in die Rastkonturen 27 der Halteelemente 23 ein.According to FIG. 3a is the platinum support 22, which here corresponds to the support body 20, as an extruded profile specifically prepared so that the web-shaped support members 23 in a in the FIGS. 3a and 3b reproduced starting position, which corresponds to an undeformed initial state of the holding elements 23. If the holding elements 23 are in this initial state, can according to FIG. 3b the respective board 8 are particularly easily inserted into the respective holding area 12. Then, according to Figure 3c the holding elements 23 are plastically deformed, such that they each overlap a longitudinal side edge 24 of the board 8. The holding elements 23 press the board 8 against the holding area 12. The forming process can be realized for example by a rolling process. Such a rolling can be particularly easy to implement in the rectilinear plate carrier 22. After forming the retaining elements 23 may according to 3d figure the cover 21 are mounted on the board carrier 22 and on the support body 20. Rest here the counter-latching contours 28 of the cover 21 in the latching contours 27 of the holding elements 23 a.

Claims (10)

  1. Lighting device,
    - with at least one elongated and straight circuit board (8) carrying multiple LEDs (9) at the front side,
    - with an elongated and straight circuit board carrier (22) to which the respective circuit board (8) is mounted,
    - wherein the circuit board carrier (22) comprises at least one holding area (12) for receiving at least one such circuit board (8),
    - wherein the circuit board carrier (22) comprises holding elements (23) along opposite longitudinal sides of the respective holding area (12),
    - wherein the holding elements (23), for mounting the respective circuit board (8) and pressing it against the circuit board carrier (22), are plastically deformed such that they each grip an edge (24) of the longitudinal side of the respective circuit board (8),
    - wherein the respective holding element (23) comprises a gripping area (25) gripping around the respective edge (24) of the longitudinal side of the respective circuit board (8) and a deformation area (26) connecting the gripping area (25) to the circuit board carrier (22),
    - wherein the plastic deformation of the respective holding element (23) for attaching the respective circuit board (8) on the circuit board carrier (22) largely takes place in the deformation area (26),
    - wherein the rear side of the respective circuit board (8) is flat,
    characterized in that
    - the respective holding area (12) is convexly curved in cross-section with respect to the circuit board (8),
    - a wall thickness of the respective holding element (23) measured transversely to the longitudinal direction of the circuit board carrier (22) is smaller in the deformation area (26) than in the gripping area (25).
  2. Lighting device according to claim 1,
    characterized in that
    the holding elements of the respective holding area (12) are formed by at least two holding bars (23) lying opposite each other on the longitudinal sides of the respective holding area (12) and each extending continuously along the respective longitudinal side.
  3. Lighting device according to claim 2,
    characterized in that
    only one holding bar (23) is arranged on each longitudinal side of the respective holding area (12).
  4. Lighting device according to claim 3,
    characterized in that
    the respective holding bar (23) extends at least from the one longitudinal end of the respective circuit board (8) to the other longitudinal end of the respective circuit board (8).
  5. Lighting device according to any of claims 1 to 4,
    characterized in that
    the respective holding element (23) is integrally formed on a body of the circuit board carrier (22) comprising the respective holding area (12).
  6. Lighting device according to any of claims 1 to 5,
    characterized in that
    - the circuit board carrier (22) comprises a body formed by an extruded profile, and/or
    - the circuit board carrier (22) comprises a metallic body.
  7. Lighting device according to any of claims 1 to 6,
    characterized in that
    the LEDs (9) are arranged on the respective circuit board (8) along at least one straight line extending in the longitudinal direction of the circuit board (8).
  8. Lighting device according to any of claims 1 to 7,
    characterized in that
    the respective holding element (23) has a height (28), which is measured from a fixed end (30) of the respective holding element (23) that is connected with the circuit board carrier (22) to a free end (31) of the respective holding element (23) that is at a distance to the fixed end (23), and which is greater than a thickness (29) of the respective circuit board (8).
  9. Lighting device according to any of claims 1 to 8,
    characterized in that
    - the lighting device (10) comprises a device carrier (3) of a light (1) having a support profile (2) for mounting on a wall or ceiling, on which the device carrier (3) is detachably mounted, or
    - the lighting device (10) is formed by a carrier body (20) of a lamp (19) further comprising a cover (21) attached to the carrier body (20).
  10. Circuit board carrier for a lighting device (10) according to any of claims 1 to 9,
    - wherein the circuit board carrier (22) comprises at least one holding area (12) in which at least one circuit board (8) comprising multiple LEDs (9) can be mounted,
    - wherein the circuit board carrier (22) comprises holding elements (23) along opposite longitudinal sides of the respective holding area (12) for attaching the respective circuit board (8) on the circuit board carrier (22),
    - wherein the holding elements (23) protrude from a body of the circuit board carrier (22) and are dimensioned such that they are plastically deformable for mounting a circuit board (8) arranged in the respective holding area (12) and pressing it against the circuit board carrier (22), such that they grip an edge (24) of the longitudinal side of the respective circuit board (8),
    - wherein the respective holding element (23) comprises a gripping area (25) gripping around the respective edge (24) of the longitudinal side of the circuit board (8) and a deformation area (26) connecting the gripping area (25) to the circuit board carrier (22),
    - wherein the plastic deformation of the respective holding element (23) for attaching the respective circuit board (8) on the circuit board carrier (22) largely takes place in the deformation area (26),
    characterized in that
    - the respective holding area (12) is convexly curved in cross-section with respect to the circuit board (8),
    - a wall thickness of the respective holding element (23) measured transversely to the longitudinal direction of the circuit board carrier (22) is smaller in the deformation area (26) than in the gripping area (25).
EP14164215.7A 2013-04-11 2014-04-10 Illumination device Not-in-force EP2789906B1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
PL14164215T PL2789906T3 (en) 2013-04-11 2014-04-10 Illumination device
EP14164215.7A EP2789906B1 (en) 2013-04-11 2014-04-10 Illumination device

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP13163351.3A EP2650594B1 (en) 2012-04-13 2013-04-11 Light with lamp
DE102013213789.3A DE102013213789A1 (en) 2013-04-11 2013-07-15 lighting device
EP14164215.7A EP2789906B1 (en) 2013-04-11 2014-04-10 Illumination device

Publications (2)

Publication Number Publication Date
EP2789906A1 EP2789906A1 (en) 2014-10-15
EP2789906B1 true EP2789906B1 (en) 2017-07-05

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EP (1) EP2789906B1 (en)
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DE202016102226U1 (en) * 2016-04-27 2017-07-28 Zumtobel Lighting Gmbh Equipment carrier arrangement with contact protection element
EP3671029A1 (en) 2018-12-20 2020-06-24 Lug Light Factory Sp. z o.o. Fitting for a luminaire

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GB2495647A (en) * 2010-08-13 2013-04-17 Shenzhen Yyc Led Lighting Co Ltd LED lamp tube
DE102010062331B4 (en) * 2010-12-02 2012-07-05 Osram Ag Manufacturing method for an LED lamp and a corresponding LED lamp
US9072171B2 (en) * 2011-08-24 2015-06-30 Ilumisys, Inc. Circuit board mount for LED light

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PL2789906T3 (en) 2017-11-30

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