EP2769602A1 - Mise en contact d'une antenne - Google Patents

Mise en contact d'une antenne

Info

Publication number
EP2769602A1
EP2769602A1 EP12775144.4A EP12775144A EP2769602A1 EP 2769602 A1 EP2769602 A1 EP 2769602A1 EP 12775144 A EP12775144 A EP 12775144A EP 2769602 A1 EP2769602 A1 EP 2769602A1
Authority
EP
European Patent Office
Prior art keywords
substrate
antenna
contact
electronic component
foil
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP12775144.4A
Other languages
German (de)
English (en)
Inventor
Michael Baldischweiler
Carsten Bohn
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Giesecke and Devrient Mobile Security GmbH
Original Assignee
Giesecke and Devrient GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Giesecke and Devrient GmbH filed Critical Giesecke and Devrient GmbH
Publication of EP2769602A1 publication Critical patent/EP2769602A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G06K19/07754—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna the connection being galvanic
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0305—Solder used for other purposes than connections between PCB or components, e.g. for filling vias or for programmable patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10098—Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1163—Chemical reaction, e.g. heating solder by exothermic reaction
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding

Definitions

  • the present invention relates to an electronic component group comprising a card-shaped substrate with an antenna arranged thereon and an electronic component, wherein a cohesive metallic connection is formed between a connection surface of the antenna and a contact surface of the electronic component, and a method for producing such a cohesive metallic connection ,
  • the present invention relates to a correspondingly adapted card-shaped substrate and a correspondingly adapted electronic component.
  • the object of the present invention is therefore to ensure a reliable electrical contact when contacting an antenna by simple means.
  • This object is achieved by an electronic component group, a production method for such an electronic component group, a card-shaped substrate with an antenna arranged thereon, a suitably designed electronic module and a method for connecting the electrical connection surface of an antenna arranged on a card-shaped substrate to an electrical contact surface of an antenna
  • Electronic components solved via a cohesive metallic connection according to the features of the independent claims.
  • advantageous embodiments and developments of the invention are given.
  • At least one multilayer contact foil is arranged adjacent to the connection surface of the antenna for producing the material-locking metallic connection between the electrical connection surface of an antenna arranged on a card-shaped substrate and an electrical contact surface of an electronic component, eg a microchip or other semiconductor component.
  • This film is then ignited to form the cohesive metallic compound.
  • This multilayer contact foil is a layer of mutually adjacent layers of mutually exothermically reacting materials of less than one micrometer thickness. put contact foil.
  • the layers are particularly preferably less than 500 nm or ⁇ 200 nm or ⁇ 100 nm or ⁇ 50 nm or even ⁇ 30 nm thick.
  • Such contact sheets are available from Clinton, New York, US based Indium Corporation under the name "Nanofoil®”.
  • the contact sheets are ignited by local heating to, for example, more than 250 ° C, whereby the materials of the adjacent layers begin to exothermically react with each other.
  • the contact foil heats to a very high temperature (e.g.
  • the material-coherent metallic connection accordingly comprises at least one such ignited multi-layer contact foil adjoining the connection surface of the antenna.
  • the antenna is disposed on a first side of the substrate, and from a second side opposite the first side, a recess extending up to the antenna is created through the substrate.
  • the multi-layer contact foil is then arranged within this recess and the cohesive metallic compound is formed in the recess as a via through the substrate.
  • the multilayer contact foil adjoin the connection surface of the antenna. Otherwise, no reliable contact is made with this pad.
  • the multilayer contact film does not have to be adjacent to the contact surface of the electronic component. Rather, a reliable electrically conductive connection can be generated between the multilayer contact film and the contact surface of the electronic component using conventional methods.
  • the cohesive metallic connection according to a preferred embodiment between the multi-layer contact foil and the contact surface of the electronic component comprises a further metallic material, preferably silver conductive paste.
  • the further metallic material may be provided on the first Side opposite side of the substrate so applied, in particular imprinted, that it fills the recess.
  • the multilayer contact foil can of course also adjoin the contact surface of the electronic component. In this case, the entire cohesive metallic connection between the connection surface of the antenna and the contact surface of the electronic component is formed by the multilayer contact foil. This can be useful, in particular, if the electronic component and the antenna are arranged on the same side of the substrate. In principle, however, a via can also be created only by means of the multilayer contact foil, for example in the case of a correspondingly thin substrate.
  • the multilayer contact foil must be ignited to form the integral metallic compound, i. it must be heated sufficiently fast to a sufficiently high ignition temperature (e.g., 250 ° C). This can be achieved by light radiation, e.g. by means of a laser. Likewise, in principle, ignition by means of a hot firing pin is possible. However, in many embodiments, the multilayer contact film is not accessible from the outside in such a way that it could be ignited by means of a laser or a firing pin.
  • the ignition takes place in such cases, for example by introduction into an electromagnetic field.
  • the multilayer contact foil exposed to the electromagnetic waves and possibly adjacent electrically conductive materials such as an antenna (or antennas) act and heat up due to induced electrical currents.
  • the multi-layer contact film is formed coil-shaped, wherein the resonance frequency can be determined by suitable measures.
  • the coil-shaped multi-layer contact foil can be such be configured such that one or more areas in relation to the conductor cross-section of the remaining coil areas have a significantly reduced conductor cross-section.
  • the significantly reduced interconnect cross section is less than 50% of the interconnect cross section of the remaining coil regions, more preferably less than 10%.
  • a current threshold is exceeded, the heat development in the regions with a significantly reduced conductor cross-section is so high that the multilayer contact foil ignites in these regions.
  • the arrangement of the region or areas with reduced conductor cross-section may vary depending on the embodiment.
  • the arrangement leads in the manner of a fuse to the fact that in the aforementioned areas, the multilayer contact film forms a cohesive metallic connection to the pad of the arranged on the substrate antenna.
  • the electromagnetic field is preferably evaluated with regard to the electrical conductivity of the metallically cohesive connection produced by the multilayer contact foil. Because the ignition of the multilayer contact foil and the resulting formation of the cohesive metallic connection change the resistance of the multilayer contact foil, the contact resistance to the connection surface of the antenna arranged on the substrate and the contact resistance to the further metallic material or the contact surface of the electronic component. These changes in resistance may cause a detectable change in the modulation of the applied electromagnetic field. Based on this modulation, accordingly, the quality of the metallurgically bonded connection can be evaluated.
  • the ignition of the multilayer contact foil can not only be achieved by generating electrical currents in the multilayer contact foil by means of Magnetic radiation but also by differently generated electrical currents.
  • the electric current is preferably applied by means of a first sliding contact on the first side of the substrate on which the antenna is located and a second sliding contact on the first side opposite the second side of the substrate.
  • the electric current conducted by the multilayer contact foil can be controlled by the
  • Multilayer contact film produced cohesive metallic compound are evaluated, namely simultaneously with or following the welding and / or soldering.
  • the ignition of the multilayer contact film causes a change in the resistance of the multi-layer contact foil and the transition states to the contact surface of the antenna and to the further metallic material or the contact surface of the electronic component. Accordingly, on the basis of the electrical conductivity of the material-conclusive metallic compound their quality can be evaluated.
  • the multilayer contact film can first be arranged on a connection surface of the antenna prior to production of the cohesive metallic connection or - if the entire cohesive metallic connection to be produced is to be provided by the multilayer contact foil - on the contact surface of the electronic component.
  • the present invention also relates to corresponding semi-finished products.
  • the present invention therefore relates to a substrate having an antenna arranged thereon with at least one connection surface on which the multilayer contact foil is arranged. It is according to a preferredteriesf orm the antenna disposed on one side of the substrate and the multi-layer contact foil in a recess of the substrate as part of a through hole to be produced through the substrate.
  • the present invention relates to an electronic component with at least one contact surface for contacting an antenna, on which at least one multilayer contact foil is arranged.
  • FIG. 5 shows a card-shaped substrate with an antenna arranged thereon and a microchip connected to the antenna according to a first embodiment
  • FIG. 2 shows a card-shaped substrate with an antenna arranged thereon and a microchip connected to the antenna according to a second embodiment
  • Figure 3 the card-shaped substrate with arranged thereon antenna
  • FIG. 4 shows the microchip from FIG. 2 with multilayer contact films arranged on the contact surfaces.
  • the 1 shows an electronic component group 1 comprising a card-shaped substrate 2 with an antenna 3 printed on the underside of the substrate 2 and a microchip 4 arranged on the upper side of the substrate 2.
  • the card-shaped substrate 2 may be, for example, a chip card substrate, a film or a chip card substrate film, for example a Card inlay, act.
  • the antenna 3 is shown schematically with only a single turn, but usually such printed antennas 3 have several turns.
  • the substrate 2 is shown cut at the front edge in the perspective view to show the through-connection of the antenna 3 through the substrate 2.
  • the electronic component group 1 comprises other components, not shown.
  • the electronic component group 1 may in particular be an RFID system, such as e.g. an RFID-ID card (Radio Frequency Identification card), an RFID SD card (Secure Digital card with RFID module), an RFID SD card (micro Secure Digital card with RFID card) Module), an RFID USB stick (USB stick with RFID module), an RFID key fobs (key fob with RFID module), an RFID security token (device for identifying and authenticating users with a RFID module), another device with an RFID module or even another device with an antenna or a component of one of the above-mentioned devices.
  • RFID-ID card Radio Frequency Identification card
  • an RFID SD card Secure Digital card with RFID module
  • RFID SD card micro Secure Digital card with RFID card
  • USB stick USB stick with RFID module
  • RFID key fobs key fob with RFID module
  • RFID security token device for identifying and authenticating users with a RFID module
  • recesses 7 are provided in the substrate 1, which extend from the upper side of the substrate 1 to the antenna 3 printed on the underside of the substrate 2.
  • the corresponding freed from the substrate material surfaces 8 of the antenna 3 serve as pads 8 of the antenna 3.
  • a wound antenna can be used, the winding wire is connected, for example, to corresponding arranged on the underside of the substrate 2 pads.
  • an antenna 3 generated by an etching process on the underside of the substrate 2 can also be used.
  • the antenna can by any further, from the State of the art known to those skilled in the process are produced, for example by laser.
  • the recesses 7 are arranged in the region of the section through the substrate 2, and it is therefore not apparent that the recesses 7 do not adjoin an outer edge of the substrate 2.
  • the recesses 7 may e.g. be generated by a laser, by milling or by etching. It may happen that residues of the substrate material or even residues of a substance used in the production of the recesses 7, such as. an etchant, remain on the pads 8. In addition, the pads 8 oxidize in contact with air.
  • a multi-layer contact foil 10 is arranged adjacent to the connection surfaces 8 and ignited in a later method step.
  • Arranging takes place by means of a placement machine, wherein a plurality of multilayer contact films 10 can be provided on rolls.
  • multilayer contact films 10 comprise several less than one micron thick contiguous layers of exothermally reactive materials and are known by the name of "nanofoil". They can be used to create soldered or welded joints and are characterized by the fact that in them a strong exothermic reaction can be triggered. This is also referred to as igniting the multi-layer contact film 10.
  • the multi-layer contact film 10 is heated suddenly to a relatively high temperature (eg 1500 ° C), which is sufficient to weld metal surfaces together or - in the presence of a solder - to solder. Accordingly, the multilayer contact film 10 may have a solder layer on one or both sides in addition to the exothermically reacting layers.
  • the ignition of the film can, for example, by rapid heating (at least one point) over a minimum temperature of eg 200 ° C or 250 ° C take place.
  • Known multilayer contact films 10 consist of alternating thin layers of metals or semimetals, eg alternating layers of aluminum and nickel, of aluminum and titanium or of titanium and amorphous silicon. Typical layer thicknesses are, for example, 50 nm per layer pair, and the total thickness of such a multilayer contact film can be, for example, 60 to 150 micrometers.
  • the nickel and aluminum layers form a nickel-aluminum compound after ignition.
  • connection surfaces 8 Due to the high temperatures achieved for a short time, a reliable electrical contact with the connection surfaces 8 is created due to the welding, even if they are oxidized or contaminated to a certain extent.
  • the multilayer contact films 10 in the present exemplary embodiment do not adjoin corresponding contact surfaces 5 of the microchip 4. Rather, in addition to the top of the substrate 2 made of conductive silver conductor tracks 6 are applied, in particular imprinted. These interconnects 6 extend as far as the recesses 7, so that when the silver conductive paste is applied to the upper side of the substrate, the recesses 7 above the multilayer contact films 10 have been filled with the silver conductive paste.
  • the microchip 4 is applied, for example, soldered, that between the contact surfaces 5 of the chip 4 and the interconnects 6, a metallurgical cohesive connection is formed.
  • the two multi-layer contact films 10 were ignited in the recesses 7.
  • the multilayer contact films 10 form a reliable electrical contact both to the respective connection surface 8 and to the respective conductor track 6.
  • the ignition took place in the present case, by means of ignition contacts 20 and a power source 21, an electrical direct or alternating current through the multilayer contact film 10 is passed.
  • the ignition contacts 20 may in particular also be sliding contacts, and the current source 21 may be, for example, a battery.
  • multilayer contact films 10 typically have only a very low volume resistivity of e.g. 0.2 ohms, even at such low voltages, large currents flow and the generated heat triggers the ignition of the multilayer contact foil 10 after a very short time (for example, less than one millisecond).
  • the multi-layer contact foil 10 On the basis of the current flow through the ignition contacts 20 through the multi-layer contact foil 10 can also be controlled whether the multi-layer contact foil 10 was ignited. In this case, e.g. already be evaluated during the ignition of the current flow.
  • Soldering the multilayer contact foil 10 to the pad 8 normally causes a well detectable change in this current flow.
  • E- benso may possibly even after the ignition on the basis of a current flow through the ignition contacts 20 through the multi-layer contact film 10 therethrough f estun whether the multilayer contact film 10 was ignited and the pads 8 were soldered or welded to the multilayer contact film 10.
  • the ignition and welding or soldering of the multilayer contact film 10 with the pads 8 usually causes a permanent measurable on the basis of the current flow resistance change.
  • the multilayer contact film 10 can also be ignited by the action of an electromagnetic field.
  • an electromagnetic field By targeted irradiation with electromagnetic radiation electric currents are induced in the Mehr fürjorfo- lie 10 and possibly in adjoining metallic components that heat the multi-layer contact film 10 and ignite.
  • a modulation of the acting electromagnetic field with respect to the electrical conductivity of the generated by the multi-layer contact foil 10 metallurgically cohesive connection can be evaluated to verify in this way, in turn, the success of the welding or soldering.
  • Another alternative is to irradiate the multilayer contact film using electromagnetic waves, such as e.g. a laser, microwaves UV radiation, etc.
  • electromagnetic waves such as e.g. a laser, microwaves UV radiation, etc.
  • the introduced radiation leads to ignition and subsequent welding or soldering.
  • the ignition could also be effected by means of a hot firing needle or by a force, e.g. by impact on the area of the substrate 2 in which the multilayer contact film 10 is arranged.
  • FIG. 2 shows a modification of the electronic component group 1.
  • the antenna 3 and the microchip 4 connected to the antenna 3 are arranged on the same side of the substrate 2. plated through ments are not planned.
  • the contact surfaces 5 of the microchip 4 are connected via ignited multilayer contact films 10 directly to the pads 8 of the antenna 3.
  • the cohesive metallic compounds are accordingly formed only by the multilayer contact films 10.
  • the ignition can be carried out in analogy to the embodiment shown in Figure 1 by passing an electric current through the respective multi-layer contact foil 10 by means of two ignition contacts.
  • the two ignition contacts can, for example, contact a region of the connection surface 8 of the antenna 3 not covered by the contact film 10 and a foot 9 of the chip 4 electrically connected to the contact surface 5 of the chip 4.
  • the multilayer contact foil 10 which is more easily accessible in the exemplary embodiment of FIG. 2, can also be ignited by the action of heat, for example by means of a hot ignition needle, by means of a laser or by the action of force.
  • the substrate 2 together with the antenna 3 and the microchip 4 are initially provided. Subsequently, if necessary, a recess 7 is created for a via.
  • the multilayer contact film 10 is adjacent arranged on the pad 8 of the antenna 3.
  • conductor tracks 6 are applied.
  • the chip 4 is arranged on the substrate 2 and then the multilayer contact foil 10 is ignited. det. After or during the ignition process, the quality of the coherent metallic connection can be checked.
  • the chip 4 may also be connected to the conductor tracks only after the multi-layer contact foil 10 has been fired.
  • the present invention also relates to corresponding semi-finished products, i. in particular the substrate 2 shown in FIG. 3 and belonging to the embodiment in FIG. 1 with antenna 3 arranged thereon and recesses 7 over the connection surfaces 8, wherein a multilayer contact film 10 is already arranged in each of the recesses 7.
  • the present invention also relates to the microchip 4 shown in Figure 4, belonging to the embodiment in Figure 2 with contact surfaces 5 for contacting an antenna, on each of which a multi-layer contact film 10 is arranged.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Details Of Aerials (AREA)

Abstract

L'invention concerne la mise en contact d'une antenne. Pour réaliser une liaison par liaison de matière métallique entre une surface de raccordement (8) d'une antenne (3) disposée sur un substrat (2) en forme de carte et une surface de contact (5) d'un composant électronique (4), on place un film de mise en contact multicouche (10) de manière adjacente à la surface de raccordement (8) de l'antenne (3). Le film de connexion multicouche (10) est un film de contact fabriqué au moins à partir de plusieurs couches de moins d'un micromètre d'épaisseur adjacentes les unes aux autres et constituées de matériaux qui réagissent entre eux de manière exothermique, en particulier ce que l'on appelle un « nanofilm ». Après avoir mis en place le film de connexion multicouche (10), on « allume » le film de mise en contact multicouche afin de déclencher la réaction exothermique dans ledit film (10) et de réaliser ainsi la liaison par liaison de matière métallique.
EP12775144.4A 2011-10-18 2012-10-16 Mise en contact d'une antenne Withdrawn EP2769602A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102011116259A DE102011116259A1 (de) 2011-10-18 2011-10-18 Kontaktierung einer Antenne
PCT/EP2012/004324 WO2013056818A1 (fr) 2011-10-18 2012-10-16 Mise en contact d'une antenne

Publications (1)

Publication Number Publication Date
EP2769602A1 true EP2769602A1 (fr) 2014-08-27

Family

ID=47046520

Family Applications (1)

Application Number Title Priority Date Filing Date
EP12775144.4A Withdrawn EP2769602A1 (fr) 2011-10-18 2012-10-16 Mise en contact d'une antenne

Country Status (3)

Country Link
EP (1) EP2769602A1 (fr)
DE (1) DE102011116259A1 (fr)
WO (1) WO2013056818A1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102015205820A1 (de) * 2015-03-31 2016-10-06 KLEB- UND GIEßHARZTECHNIK DR. LUDECK GMBH Heizelement für die SMD-Montage, elektronische Baugruppe mit einem solchen Heizelement und Verfahren zum Erzeugen einer elektronischen Baugruppe
WO2022214483A1 (fr) * 2021-04-08 2022-10-13 Mikael Hammer Composant de trou d'interconnexion et procédé de fabrication d'un tel composant de trou d'interconnexion

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Publication number Priority date Publication date Assignee Title
US6421013B1 (en) * 1999-10-04 2002-07-16 Amerasia International Technology, Inc. Tamper-resistant wireless article including an antenna
US20050142495A1 (en) * 2003-10-09 2005-06-30 David Peter Van Heerden Methods of controlling multilayer foil ignition
US7441688B2 (en) * 2003-11-04 2008-10-28 Reactive Nanotechnologies Methods and device for controlling pressure in reactive multilayer joining and resulting product
DE10257111B4 (de) * 2002-12-05 2005-12-22 Mühlbauer Ag Chipkarte und Verfahren zur Herstellung einer Chipkarte
US20070018774A1 (en) * 2005-07-20 2007-01-25 Dietsch Gordon T Reactive fuse element with exothermic reactive material
US20080110962A1 (en) * 2006-07-24 2008-05-15 Neeraj Saxena Process for joining materials using a metallic heat source within a controlled atmosphere
WO2009029804A2 (fr) * 2007-08-31 2009-03-05 Reactive Nanotechnologies, Inc. Procédé de liaison de composants électroniques à basse température
DE102008031633B4 (de) * 2008-07-04 2010-04-08 Siemens Aktiengesellschaft Anordnung zum Befestigen eines elektrischen Bauelements auf einem Träger
DE102010004193B4 (de) * 2010-01-08 2012-11-15 Asm Assembly Systems Gmbh & Co. Kg Bestückungsautomat und Lötverfahren zum thermischen Verbinden von Bauelementen an ein Substrat
DE102010010193A1 (de) * 2010-03-04 2011-09-08 Asm Assembly Systems Gmbh & Co. Kg Vorrichtung zum thermischen Verbinden und Verfahren zum Überprüfen einer thermischen Verbindung von elektronischen und/oder mechanischen Bauelementen

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Title
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See also references of WO2013056818A1 *

Also Published As

Publication number Publication date
WO2013056818A1 (fr) 2013-04-25
DE102011116259A1 (de) 2013-04-18

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