WO1998038598A2 - Carte plastique pour module electronique de carte combinee - Google Patents
Carte plastique pour module electronique de carte combinee Download PDFInfo
- Publication number
- WO1998038598A2 WO1998038598A2 PCT/DE1998/000572 DE9800572W WO9838598A2 WO 1998038598 A2 WO1998038598 A2 WO 1998038598A2 DE 9800572 W DE9800572 W DE 9800572W WO 9838598 A2 WO9838598 A2 WO 9838598A2
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- antenna
- wire
- plastic card
- card
- plastic
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07766—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement
- G06K19/07769—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement the further communication means being a galvanic interface, e.g. hybrid or mixed smart cards having a contact and a non-contact interface
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
Definitions
- the invention relates to a laminated plastic card which contains a plurality of cover foils and an antenna foil and in which an antenna coil consisting of wire has been arranged on the antenna foil prior to lamination, the antenna coil being located in the middle of the layer in the plastic card and one being laminated into the plastic card Cavity was incorporated to accommodate a Combi Card module, which has internal contacts and external contacts arranged at different heights
- a step-shaped cavity is milled into such plastic cards and the electronic module is glued into it.
- the electronic Combi Card module used can be directly connected via its contact surfaces pointing outwards via electrical contacting and connecting devices and also via its internal contacting surfaces facing the inside of the card an antenna coil are connected, communicate with data processing devices via electromagnetic fields and via corresponding receiving devices
- a secure contact must be made between the module and the antenna coil inside the card.
- the antenna coils are arranged in the laminate or almost in the middle of the laminate the internal connections of the electronic Combi Card module are in the edge layer of the plastic card after gluing.
- the relatively large position tolerance of the antenna connections caused by the lamination process relative to the position of the cavity means that the antenna connection area must have such a large area, that sufficiently large flat elements of the internal connections of the electronic Combi Card module with the flat elements of the antenna connections are to be contacted with one another with certainty.
- the invention is based on the object of specifying a laminated plastic card with a wire-shaped antenna coil in which connection areas for the antenna coil in a suitable size and depth in the plastic card are made possible with simple means for contacting the antenna coil with the inner connections of the electronic combi card module
- the object is achieved in that the thickness of the antenna film and the cover films lying thereover are designed such that the underside of the antenna film layer is removed from the plastic card surface after lamination at a distance equal to the height of the internal contacts of the Combi Card module, and that the antenna coil in some areas is printed flush to the underside of the antenna film
- the invention enables large-area antenna connection areas to be produced in defined layers of the plastic card with simple means
- connection area By widening the connection area with loop-shaped antenna wire returns and by designing the The wire feed from the antenna to the connection area, starting from the cavity, remains in the connection areas, even if parts of the wire layers are damaged when milling the cavity, the feed and a sufficiently wide connection area are retained
- connection area It is advantageous to only print the wire loops in the connection area to the underside of the antenna film in a web-like manner. This ensures that the wire loops are optimally anchored in the antenna film without the plastic card being adversely affected by the design, in that the antenna side of the antenna film is damaged by the printing tools the free milling of the cavities, even when milling into the antenna wire, there are connection areas that are fully functional.
- This can be supported by the fact that silver-plated wires are used for the antenna wire and that after milling the cavity, the antenna connection areas are cleaned of any plastic residues by laser radiation it is also advantageous to deform the antenna wire at the same time in the case of web-like printing of connection areas in such a way that its width is increased.
- Printing through can be by thermal, by ultrasound or by combination energy input into the printing tool
- the wire antenna is expediently produced by means of a wire-laying process by directly inserting the wire into the antenna side of the antenna foil and it is advantageous to use bare metal, preferably surface-coated wire.
- the wire-laying process enables the antenna to be produced in an environmentally friendly, cost-effective and precise manner, which is very good when using surface-coated wire
- the wire loops in the connection area can also be easily produced with this method.
- the contacting of the internal contacts of the electronic Combi Card module with the free-milled and preferably through intensive electromagnetic Radiation-cleaned connection areas of the antenna are expediently carried out by means of electrically conductive, thermoplastic adhesive with a processing temperature and time during bonding which is the same or similar to the temperature of the heat seal adhesive used for the electrically insulating gluing of the further surfaces of the electronic combi card module into the cavity of the plastic card.
- the wire placed on the antenna layer side is not to be partially immersed in the antenna film during lamination, it is advantageous to fix the antenna wire. This can be done by printing on the special surfaces formed by the wire windings after the wire laying or with an adhesive layer that is fixed at the lamination temperature.
- the antenna wire can thus be kept at an eccentric layer level in the region of the center of the cavity.
- Figure 2 shows the web-wise antenna wire lowering in cross section
- Figure 3 shows a plastic chip card cutout with Combi Card module.
- a silver-plated copper wire with a diameter of 100 m is laid in five turns along the periphery of the plastic card 1 on the antenna side 7 of the antenna film layer 6 as the antenna wire 3.
- the antenna wire is located in the layer or almost layer-middle position in the plastic card 1 Bei Laying the antenna wire 3 is pressed thermally or by ultrasonic energy about 80 m deep into the thermoplastic antenna film 6
- the antenna wire 3 was moved back and forth in tight meandering loops 13 to create a wide connection area 4.
- the wire feed 14 to the loop-shaped antenna connection area 4 was carried out from the periphery of the intended position of the Combi Card Module 2
- the loop-shaped antenna connection area 4 is partially lowered in short webs 15 and in parts is located flush with the underside 8 of the antenna film 6
- the central antenna windings 20 run in the area of the future center of the Combi Card module 2.
- the central antenna windings 20 are placed on the special surface 16 and their height was fixed in the future laminated plastic card 1 as a special surface 16 with an adhesive layer 17 that was rigid during lamination
- FIG. 3 shows the height stratifications of the antenna wires 3 in the area of the web-like depressions 15 of the antenna connections 4, in the area of the center step height 11 and in the chip card 1.
- the step-by-step process results adjacent antenna connection areas 4 in the form of metallic bare wire pieces. This creates a reliable possibility of contacting, even in the cases in which the antenna wires 3 have been milled.
- FIG. 3 shows a simplified illustration of a Combi Card module 2 with a coating of the inner contact surface 18 with electrically conductive, thermoplastic adhesive 22 and with a heat seal adhesive film 23 before it is inserted and sealed into the cavity 9 of the plastic card 1.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Credit Cards Or The Like (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
L'invention vise à créer une carte plastique stratifiée comportant un bobinage d'antenne filiforme, dans laquelle des régions de contact d'une dimension et d'une profondeur appropriées sont réalisées dans la carte plastique par des moyens simples afin de connecter le bobinage d'antenne avec les contacts intérieurs du module électronique de carte combinée. Le film d'antenne et les films de revêtement superposés sont configurés avec une épaisseur telleque la face inférieure du film d'antenne après stratification est éloignée de la surface de la carte plastique avec un écartement correspondant à la hauteur des contacts intérieurs du module de carte combinée et que le bobinage d'antenne est comprimé dans des régions partielles par le film d'antenne de manière à être à fleurde sa face inférieure. L'invention concerne une carte plastique stratifiée comportant plusieurs films de revêtement et un film d'antenne, un bobinage d'antenne constitué de fil ayant été disposé sur le film d'antenne avant stratification. Ce bobinage d'antenne se trouve au milieu des couches de la carte plastique dans laquelle a été pratiquée après stratification une cavité qui abrite un module de carte combinée, lequel comporte des contacts intérieurs et des contacts extérieurs disposés à des hauteurs différentes.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE29703548.7 | 1997-02-27 | ||
DE29703548U DE29703548U1 (de) | 1997-02-27 | 1997-02-27 | Plastikkarte für ein elektronisches Combi-Card-Modul |
Publications (2)
Publication Number | Publication Date |
---|---|
WO1998038598A2 true WO1998038598A2 (fr) | 1998-09-03 |
WO1998038598A3 WO1998038598A3 (fr) | 1998-11-05 |
Family
ID=8036657
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/DE1998/000572 WO1998038598A2 (fr) | 1997-02-27 | 1998-02-27 | Carte plastique pour module electronique de carte combinee |
Country Status (2)
Country | Link |
---|---|
DE (1) | DE29703548U1 (fr) |
WO (1) | WO1998038598A2 (fr) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2002084585A1 (fr) * | 2001-04-10 | 2002-10-24 | Orga Kartensysteme Gmbh | Pellicule support destinee a des composants electroniques pour laminage dans des cartes a puce |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6036099A (en) * | 1995-10-17 | 2000-03-14 | Leighton; Keith | Hot lamination process for the manufacture of a combination contact/contactless smart card and product resulting therefrom |
DE19831565C1 (de) * | 1998-07-14 | 1999-10-28 | Muehlbauer Ag | Verfahren zum Freilegen von Antennenanschlußflächen einer Chipkarte |
DE10109030C2 (de) * | 2001-02-24 | 2003-11-13 | Cubit Electronics Gmbh | Kontaktloser Transponder |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0671705A2 (fr) * | 1994-02-14 | 1995-09-13 | Gemplus Card International | Procédé de fabrication d'une carte sans contact et carte sans contact |
DE19500925A1 (de) * | 1995-01-16 | 1996-07-18 | Orga Kartensysteme Gmbh | Chipkarte zur kontaktlosen Datenübertragung |
-
1997
- 1997-02-27 DE DE29703548U patent/DE29703548U1/de not_active Expired - Lifetime
-
1998
- 1998-02-27 WO PCT/DE1998/000572 patent/WO1998038598A2/fr active Application Filing
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0671705A2 (fr) * | 1994-02-14 | 1995-09-13 | Gemplus Card International | Procédé de fabrication d'une carte sans contact et carte sans contact |
DE19500925A1 (de) * | 1995-01-16 | 1996-07-18 | Orga Kartensysteme Gmbh | Chipkarte zur kontaktlosen Datenübertragung |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2002084585A1 (fr) * | 2001-04-10 | 2002-10-24 | Orga Kartensysteme Gmbh | Pellicule support destinee a des composants electroniques pour laminage dans des cartes a puce |
Also Published As
Publication number | Publication date |
---|---|
WO1998038598A3 (fr) | 1998-11-05 |
DE29703548U1 (de) | 1997-04-10 |
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DFPE | Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101) | ||
121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
122 | Ep: pct application non-entry in european phase |