EP3485431A1 - Procédé et dispositif de fabrication d'un transpondeur, une forme de moule et transpondeur - Google Patents

Procédé et dispositif de fabrication d'un transpondeur, une forme de moule et transpondeur

Info

Publication number
EP3485431A1
EP3485431A1 EP17739985.4A EP17739985A EP3485431A1 EP 3485431 A1 EP3485431 A1 EP 3485431A1 EP 17739985 A EP17739985 A EP 17739985A EP 3485431 A1 EP3485431 A1 EP 3485431A1
Authority
EP
European Patent Office
Prior art keywords
carrier substrate
antenna
front side
transponder
electrical device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP17739985.4A
Other languages
German (de)
English (en)
Inventor
Martin Mueller
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Muehlbauer GmbH and Co KG
Original Assignee
Muehlbauer GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Muehlbauer GmbH and Co KG filed Critical Muehlbauer GmbH and Co KG
Publication of EP3485431A1 publication Critical patent/EP3485431A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07718—Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls

Definitions

  • transponder a method of manufacturing a transponder will be described.
  • a method for producing RFID transponders is described.
  • a device for producing a transponder as well as an embossing or printing form and a transponder are also described.
  • transponders are used for example for labels such as price-tags, ⁇ value or security documents or the like and usually have a single- or multilayer body.
  • value and security documents In order to meet rising security requirements, transponders (inlays) are increasingly used in value and security documents (debit, credit cards, passports, identity cards, access control cards, etc.).
  • value and security documents are often produced centrally, with the exception of personalization data, and then provided with personalization locally, for example at registration offices, at authorities or in companies that are authorized to issue such value and security documents.
  • personalization the individual owners of the value and security document will receive individually identifying textual, numerical and / or pictorial data (such as the name and address of the holder, date of birth, place of birth, photograph of the holder, biometric data of the holder, etc.) Value and security document entered.
  • the antenna enables non-contact data access, i. a contactless, automated writing and / or reading of (personalization) data in / from the semiconductor chip of the transponder.
  • Transponder inlays are used as constructional units that can be produced.
  • Transponder inlays have a substrate layer for arranging a transponder unit comprising the transponder antenna and the semiconductor chip, which is located on a contact surface of the substrate layer.
  • the semiconductor chip may for example be integrated in a chip module or be a non-breakable flip chip.
  • Such an RFID transponder is known for example from WO 2006/136 466 AI.
  • This document discloses an RFID tag with an RFID chip and a dipole antenna disposed on a non-conductive substrate.
  • the dipole antenna disclosed therein has two equal conductor track portions between which the RFID chip is disposed and connected.
  • transponders are known from the prior art, which have a plurality of substrate layers. Such a transponder and a method for producing the same are described, for example, in EP 1 291 818 A1.
  • This document discloses a transponder in which two spiral antennas are printed on an insulating material. One of the two spiral antennas has connections for an electronic circuit, for example a chip of a transponder.
  • the electronic circuit is first connected within the one spiral antenna with the connections provided for this purpose. Subsequently, the plate is folded along a line of symmetry, the antennas being superimposed and their terminals covering each other.
  • the connections are formed without conductors bridging the turns of the spiral antennas. Since the printed spirals face each other, an insulating layer is interposed between them.
  • the terminals of the spiral antennas superimposed upon folding are connected by a pin.
  • German Offenlegungsschrift DE 10 2004 006 457 A1 discloses a method and an apparatus for the continuous production of electronic film components.
  • chip modules are applied with connection contacts on one with Antennenschaltun ⁇ gen provided cling film. Subsequently, the connection contacts of the chip modules are electrically contacted with the antenna terminals.
  • German published patent application DE 10 2007 046 679 A1 discloses an RFID transponder which has a multilayer film body which has one or more electrically semiconducting functional layers.
  • the aim is to provide a manufacturing method and an apparatus for producing a transponder, as well as a printing forme of the type described above, which enable a simple and rapid production of a transponder.
  • Another goal is to provide a transponder that can be easily manufactured in various forms.
  • a method for producing a transponder comprises the following steps:
  • Patterning the antenna circuit having at least one antenna circuit end of an electrically conductive layer on the front side of the first carrier substrate, wherein for forming the antenna circuit, an electrical conductor forming portions of the layer in the pattern relief of the printing form sunk and protected from material removal;
  • the semiconductor chip used may be substantially flat and / or cuboid, i. H.
  • the semiconductor chip has electrodes arranged on one side.
  • the semiconductor chip is thus easy to manufacture and easy to contact with an electronic device.
  • the semiconductor chip may also have electrodes arranged on both sides.
  • the positioning accuracy between the semiconductor chip and its electrodes with those of an electrical device may be between 30 pm to 100 pm.
  • the carrier substrates provided have an insulating structure, on the surface of each of which an electrically conductive layer may be located.
  • the first carrier substrate and / or the second carrier substrate may contain one or more of the following materials: paper, polyvinyl chloride (PVC), polyethylene (PE), polyethylene terephthalate (PET) or glycol-modified polyethylene terephthalate (PETG), polyethylene naphthalate (PEN), acrylonitrile-butadiene-styrene Copolymer (ABS), polyvinyl butyral (PVB), polymethyl with acrylate (PMA), polymide (PI), polyvinyl alcohol (PVA), polystyrene (PS), polyvinylphenol (PVP), polypropylene (PP), polycarbonate (PC) or derivatives.
  • PVC polyvinyl chloride
  • PE polyethylene
  • PET polyethylene terephthalate
  • PET glycol-modified polyethylene terephthalate
  • PEN polyethylene naphthalate
  • the carrier substrates may be formed substantially flat so that the first and second sides of the carrier substrates correspond to two opposite large side surfaces. Furthermore, the carrier substrates may have a flexible structure. This has the advantage that the step of providing the carrier substrates with and without the antenna subsections arranged thereon can take place by unwinding from a roll as continuous material.
  • this variant can result in a reduction in the space requirement of a device for producing the transponder.
  • the first and the second carrier substrate may be the same or different.
  • the first and / or the second carrier substrate may have an adhesive layer on the front side and a silicone paper on the rear side.
  • the antenna circuit can be arranged on the front side of the first carrier substrate by means of a sticking operation.
  • the first carrier substrate is e.g. pressed against the printing form with the pattern relief of the antenna circuit by means of a milling cutter and simultaneously milled the antenna circuit of an electrically conductive layer on the front side of the at least first carrier substrate, wherein the antenna circuit is formed by electrical conductor forming portions, wherein the electrical layer in the pattern relief of the printing plate sunk and protected against the removal of material (by the cutter).
  • the method is independent, for example, from the production of a transponder by etching from the material of the carrier substrate.
  • the transponder can also comprise a carrier substrate made of paper.
  • the manufacturing processes are shortened and simplified.
  • the first carrier substrate may be double-layered, ie the actual carrier substrate together with the electrically conductive layer.
  • the second carrier substrate is pressed by means of a milling cutter against a printing plate with a pattern relief of a subassembly of the electrical device and at the same time the subassembly of the electrical device milled from an electrically conductive layer of the front side of the at least double-layered second carrier substrate, wherein the subassembly of the electrical Device is formed in that an electrical line forming portions of the electrical layer in the pattern relief of the printing form sunk and protected against the material removal (eg by the cutter) remain.
  • the transponder is very thin and can be produced with an extremely low cost of materials.
  • the first and / or second carrier substrate either as a roll or as a sheet with repetitive electrical circuits / devices and / or antenna circuits, may be formed and provided lengthwise on the roll or sheet .
  • a plurality of electrical device or antenna circuits can each be formed next to one another, in particular in a direction transverse to the length of the first or second carrier substrate on the roller or the sheet.
  • the respective electrical devices of the plurality of electrical devices may each be identical to each other.
  • Antenna circuits of the plurality of antenna circuits may each be identical to each other.
  • the first and / or second carrier substrate may comprise repeating electrical devices and / or antenna circuits, wherein the devices and / or antenna circuits are arranged at least once repeating along two arrangement directions that are substantially orthogonal to each other.
  • the first and the second carrier substrate are formed in at least double-layered in one piece and have a fold line.
  • the ends of the antenna circuit and the ends of the electrical device are arranged symmetrically to the fold line.
  • the joining of the two carrier substrates takes place by means of a folding process along the fold line.
  • a step of punching out of the carrier substrate takes place in such a way that the fold line belongs to the punched grid as punching waste.
  • a plurality of antenna circuits and a plurality of electrical devices may each be arranged on an axis orthogonal to the fold line, wherein in each case one antenna circuit is opposite mirror-symmetrical to the fold line of an electrical device.
  • a plurality of electrode ends of electrical devices can each be arranged in register, in each case opposite at least one antenna circuit end.
  • the antenna is designed as an inductive antenna, for example as a loop antenna.
  • the circuit may include a bridge and an insulator, wherein the step of providing the second carrier substrate with the electrical device comprises the steps of: arranging or forming a Bridge as a subassembly of the electrical device on the front side of the second carrier substrate and placing the semiconductor chip on the front side of the second carrier substrate and placing an insulator on the semiconductor chip and the electrical device on the front side of the second carrier substrate, wherein the insulator is formed such that opposite ends of electrodes of the electrical device remain uncovered by the insulator and are separated by electrode ends of the antenna circuit by at least one turn.
  • the antenna circuit thus forms an RF antenna.
  • a transponder with an RF antenna can be formed.
  • the semiconductor chip can be arranged under or on the bridge. In such a case, the first two steps are reversed.
  • a transponder which has an at least two-part antenna.
  • the antenna is designed in a variant as a dipole antenna.
  • the electrical circuit comprises an insulator and a UHF band (strap) or a UHF loop.
  • the isolator may be present.
  • the UHF loop may be a loop interrupted or not closed.
  • the chip is placed on the gap.
  • the method comprises arranging or forming a UHF band or a UHF loop as subdevice of the electrical circuit on the front side of the second carrier substrate, placing a semiconductor chip on the front side of the second carrier substrate and / or the arranging or forming a UHF antenna circuit for a UHF antenna in the first step in providing the first carrier substrate on its front side, so that the electrode ends of the UHF antenna are connected in the last step to the ends of the electrical circuit.
  • the antenna may be isolated from the loop by, for example, an adhesive to inductively couple the antenna and the loop.
  • the antenna can be in direct contact with the loop antenna in a UHF variant without an insulator.
  • the chip on the loop antenna is turned away from the other antenna.
  • a device for producing a transponder with a first device for providing a first carrier substrate and a printing for the step of the material removal on the first carrier substrate is described, wherein the printing form at least a pattern relief of an antenna for a transponder um- summarizes.
  • the device further comprises a second device for providing a second carrier substrate on which an electrical device is arranged.
  • An equipping device for equipping the front side of the second carrier substrate with a semiconductor chip is likewise provided.
  • a device for applying an adhesive to the front side of the first carrier substrate and a connecting device which connects the two front sides of the two carrier substrates in such a way that the ends of the electrodes of the electrical device are electrically connected to the ends of the antenna circuit comprise the device for producing a transponder .
  • the front sides of the first and the second carrier substrate can be laminated to form a transponder.
  • the device can be developed in such a way that the method described above can be carried out with it.
  • the connecting device may in particular be a folding unit / folding device which is suitable for folding a one-piece carrier substrate with a folding line along the fold line, so that the front sides of the carrier substrates are connected to one another facing each other.
  • a printing form is also described for producing a transponder for the method step of milling by means of a milling cutter on a double-layered carrier substrate for producing the transponder by means of a device described above, wherein the printing plate has a pattern relief from an antenna and / or a subassembly of an electrical device for a Transponder includes.
  • the printing form can be used in the device described above.
  • the pattern relief in the printing form may be formed as an RF antenna pattern for generating an RF antenna with two ends of the RF antenna separated by at least one turn, or the pattern relief is formed as a UHF antenna pattern.
  • the printing form may comprise a flexible sheet and be attachable to the lateral surface of a roller.
  • the printing plate is formed as a cylinder and in particular made of metal, a metal alloy, a hard plastic with the pattern relief in the mantle surface.
  • a transponder with two carrier substrates is also described, which is produced in particular according to a method of the preceding claims, wherein at least one carrier substrate is double-layered, the front side of the carrier substrate comprises an electrical material from the group of metal, metal alloy, conductive polymer, aluminum and the transponder encapsulates an antenna circuit and an electrical device with a semiconductor chip.
  • the transponder may further include a cover material on the back side of the second and first carrier substrates.
  • the cover material can be printed, for example with a barcode.
  • the cover material may be transparent and the back side of the second carrier substrate and / or the cover material may be printed.
  • the transponder receives a signal via the antenna and transmits it via the contact point of the antenna ends to the semiconductor chip.
  • the signal is processed and generates a signal to be remitted, which is then transmitted via the two electrode contacts of the semiconductor and the electrode ends of the antenna, from where it is finally remitted.
  • Fig. 1 shows a flow of a part of the method according to a first embodiment
  • Fig. 2 shows a sequence of a part of the method according to a second embodiment variant
  • FIG. 3 schematically shows the partial sequences from FIG. 1 or FIG. 2 upstream
  • FIG. 5 shows a plan view of an antenna and chip RF inlay according to a first embodiment of a transponder
  • FIG. 6 shows a plan view of an RF inlay with antenna and semiconductor chip according to a second embodiment of a transponder
  • Fig. 7 shows a perspective view of a milling device.
  • Fig. 1 shows individual procedure steps in a device 400 for the manufacture lung ⁇ a transponder 15.
  • a double-layered, first support substrate 1 having a front side 2 and a back 3 is provided.
  • the double-layered carrier substrate 1 has on the front side 2, an electrically conductive layer, for example an aluminum layer and on the back 3 a paper layer or a plastic layer, which in turn may be printed on the back 3.
  • the carrier substrate 1 is provided either on a rolled-up roll as a continuous web or as a sheet.
  • a UHF antenna 5 is arranged on the front side 2 of the first carrier substrate 1 as antenna circuit 4 or worked out in a method to be described below by a special method to be described below.
  • a second carrier substrate 6 having a front side 7 and a rear side 8 is provided.
  • a UHF loop 11 or a capacitive UHF band 14 is arranged or formed on the front side 7 and corresponding electrode ends 34. The formation of a corresponding UHF band 14 or loop 11 will be described with reference to the following figures.
  • the front side 7 of the second carrier substrate 6 is equipped with a semiconductor chip 9 and an insulating film 10 in a device 430. Can be dispensed with the insulating film 10, if at step S120, a UHF-loop was 11 arranged or formed on the front ⁇ page 7 of the carrier substrate. 6
  • step S140 a plurality of steps are shown on the abscissa t, which are executed in a plurality of devices 440.
  • the path of the first carrier substrate 1 and the path of the second carrier substrate 6 with the front sides 2 and 7 are pass ⁇ exactly or connected in register, wherein an adhesive can be applied to the front side 2 of the first carrier substrate 1 before connecting by means of a device.
  • the tracks of the first carrier substrate 1 and the tracks of the second carrier substrate 6 are, for example, precisely connected to 30 to 100 ⁇ m, so that the electrodes of the electrical device 12, which comprises the semiconductor chip 9 and UHF bands 11, exactly match the electrodes of the UHF device. Antennas 5 are connected.
  • a laminating roller 444 By means of laminating rollers in a laminating device 444, the two carrier substrates 1 and 6 are connected, and subsequently the connected carrier substances are punched into individual transponders 15 with a UHF antenna 5.
  • a punching device 446 is provided.
  • the punching device 446 is optionally present, since the carrier substances connected in the laminating device 444 can also be rolled up onto a roll or can be stacked in sheet format.
  • FIG. 2 shows the sequence of a method and the device 400 for producing a transponder 15 with an HF antenna.
  • a first and a second carrier substrate 1, 6 are produced provided with two layers.
  • the outer layer is the back 3 or 8 and made of a paper or plastic.
  • On it is an electrically conductive coating from the group of the materials metal, metal alloy, conductive polymer or aluminum. As front 2 and 7, the conductive coating on the back 3 and 8 is arranged.
  • an RF antenna 18 is arranged or formed on the front side of the first carrier substrate 1.
  • step S220 in a device 405 RF bridges 19 are arranged on the front side 7 on the carrier substrate 6.
  • step S230 a semiconductor chip 9 and then an insulator 10 are respectively arranged on the second carrier substrate 6 on the RF bridges 19.
  • the insulator is instead arranged in the region of the windings on the HF antenna, which lie between the terminals of the HF antenna.
  • step S240 an adhesive is applied to the first carrier substrate 1 by means of a device for applying an adhesive 20, on the front side 2, and on the second carrier substrate 6, the electrical devices 12 are brought together on the front side 7 with electrical electrodes of the RF antennas 18 in order that the terminals of the electrical devices 12 / RF bridges contact the terminals of the RF antennas, and laminated with laminating rollers 13 by means of a laminator 444, and then punched by means of a punching device 446 to transponders 15 with an RF antenna 18.
  • the punching device 446 is optionally present again, since the carrier substances connected in the laminating device 444 can also be rolled up onto a roll or can be stacked in sheet format.
  • FIG. 3 shows a schematic view of an upstream method step in order to form electrical conductor tracks either only on a carrier substrate 1 or the second carrier substrate 6 or both carrier substrates 1, 6.
  • a milling device 22 is provided with a milling cutter 24 and an oppositely arranged printing plate 26 in the form of a cylinder.
  • the carrier substrate 1, 6 is in a pattern relief 28, which is formed on the surface of the printing plate 26, with an electrically conductive coating directed toward cutter 24 sunk into the pattern relief 28 of the printing plate 26, so that an electrical conductor forming portions remain protected from the cutter, whereas elevations from the cutter 24th be milled away in the milling device 22.
  • the first carrier substrate 1 shows the first carrier substrate 1 with a UHF antenna 5 arranged thereon as an antenna circuit 4 and a second carrier substrate 6 with optionally an electrically insulated and coated UHF band 11.
  • the first and second carrier substrates 1, 6 encapsulate the UHF Antenna 5 and the UHF band 11.
  • the UHF antenna 5 and the UHF loop 11 are inductively coupled together.
  • Carrier substrate 1 shows in plan view a first carrier substrate 1 with an RF antenna 18 and a second carrier substrate 6.
  • the carrier substrate 1 has not yet been punched out.
  • Carrier substrate 1 comprises a sheet or a sheet of paper or plastic as the back 3, on which the RF antenna 18 is located.
  • a web or sheet of paper or plastic forms the back side 8 of the second carrier substrate 6.
  • the RF bridge 19 which is equipped with a semiconductor chip 9.
  • the first antenna end 20 of the antenna circuit 4 is located within the turns 17 of the antenna circuit 4 and the second antenna end 21 is external, with windings 17 in between.
  • the RF bridge 19 is needed to connect the antenna ends 20, 21 with the semiconductor chip therebetween 9 is switched.
  • at least one side i. H.
  • FIG. 5 shows a plan view of the first carrier substrate 1, the semiconductor chip 9 already being arranged above the turns 17.
  • Fig. 6 shows an alternative embodiment.
  • Two connection surfaces of the antenna circuit 18 are within the turns 17.
  • the bridge 19 is located at the antenna end 21 outside the turns.
  • the webs of the two carrier substrates 1, 6 are laminated in register with each other, so that the contact regions of the RF bridge 19 electrically contact the two ends 20, 21 of the antenna circuit 18.
  • a two-layered transponder 15 is provided in the form of a label.
  • the transponder 15 is destroyed when attempting to open the transponder.
  • a so-called "target tear effect” is achieved at the contact point between the ends of 20, 21 of the antenna circuit 18 and the RF bridge 19, which is more firmly connected to the second carrier substrate 6.
  • the first or second carrier substrate 1, 6 can each be printed on the back 3, 8 with a specific printed image or with barcodes.
  • the second carrier substrate 6 may pass through the DDA device as a web, i. H. under a wafer and the semiconductor chip is transferred from a chip ejector (the ejector) directly to the bridge.
  • the first and second carrier substrate 1, 6 are starting products of, for example, two web rolls, each with a conductive coating on the front side.
  • the conductive coated surface is larger than the largest dimension of the antenna circuit 4 or identical to the largest dimension of the antenna circuit. 4
  • the electrically conductive coating is either a (non-ferrous) metal (e.g., copper, aluminum, or the like) or an alloy containing these metals, a conductive polymer. Either the antenna circuit 4 or the bridge 11, 19 is through
  • FIG. 7 shows a milling device 22, which represents a part of the device 400 for producing a transponder.
  • a suitable printing plate 26 is required.
  • the printing form 26 includes a pattern relief 28 with depressions and elevations. In the pattern relief 28, the support substrate 1, 6 is pressed so that reductions are protected as electrical lines 30 in front of the cutter 24, wherein elevations 33 are milled away from the cutter 24.
  • the Bridge 11, 19 is then again equipped with a semiconductor chip 9 and with an insulating film 10 and connected to the antenna circuit 4 in order to obtain a two-layered transponder 15.
  • the transponder 15 is produced by folding the double-layered carrier substrate. The carrier substrate is thus integrally formed in the initial shape.
  • a fold line 42 is arranged symmetrically to the ends 20, 21 of the antenna circuit 4 and ends 43, 44 of the electrical device 12.
  • the carrier substrates 1, 6 formed as a common substrate are folded and subsequently brought together and laminated by a laminating device.
  • the fold line 42 is outside the finished transponder 15.
  • the transponder 15 can be punched out of the carrier substrate such that the fold line 42 belongs to a punched grid not shown as a punching waste.
  • the finished product i. H. on the transponder 15 after punching in the punching device barely or no longer recognizable whether the transponder 15 was made of two different webs of different carrier substrates 1, 6 or from a single web.
  • the two last-mentioned method steps are implemented in a common device.
  • a double-layer provided with an electrically conductive layer web as described above, wherein in a milling process by means of the cutter 24, both the electric antenna circuit 4 either as a UHF antenna 5 or as an RF antenna 18 and an electrical device 12 as Partial device of the electrical device is produced without the semiconductor chip 9 in milling process in one operation.
  • the electrical device 12 comprises as a subassembly either a UHF loop or a UHF band or an HF bridge.
  • the embossing or printing plate 26 thus comprises a pattern relief 28 which, according to this particular embodiment, generates the electrical leads 30 on the surfaces of the first and second carrier substrates 1, 6.
  • the printing form 26 is either a flexible sheet, which is attached as a surface around a roller or the printing plate 26 is formed as a cylinder with the corresponding pattern relief 28. It is understood that the printing plate 26 is wider than the working range of the roller and the web of the carrier substrate.
  • the printing plate 26 can be clamped as a sheet, for example with clamping means on the roller.
  • the embossing or printing plate 26 is made in different variants of metal, a metal alloy or hard plastic.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Details Of Aerials (AREA)

Abstract

L'invention concerne un procédé de fabrication d'un transpondeur comportant les étapes suivantes : utiliser au moins un premier substrat porteur à deux couches ayant une face avant et une face arrière; presser le premier substrat porteur contre une forme de moulage dotée d'un relief modèle d'un circuit d'antenne; structurer le circuit d'antenne avec au moins une extrémité de circuit d'antenne à partir d'une couche électroconductrice sur la face avant du premier substrat porteur, des sections de la couche formant une ligne électrique étant enfoncées dans le relief modèle de la forme de moule pour réaliser le circuit d'antenne et restent protégées contre un enlèvement de matière; utiliser un second substrat porteur ayant une face avant et une face arrière; monter sur la face avant du second substrat porteur un dispositif électrique ayant deux extrémités d'électrode au cours d'une ou de plusieurs étapes, le dispositif électrique comportant une puce semi-conductrice; relier la face avant du premier substrat porteur à la face avant du second substrat porteur de manière que les extrémités des électrodes du dispositif électrique sont électriquement reliées à des extrémités du circuit d'antenne et réalisent ainsi un transpondeur par un laminage simultané des faces avant des premier et second substrats porteurs.
EP17739985.4A 2016-07-14 2017-07-14 Procédé et dispositif de fabrication d'un transpondeur, une forme de moule et transpondeur Withdrawn EP3485431A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102016008595.9A DE102016008595A1 (de) 2016-07-14 2016-07-14 Verfahren und Vorrichtung zum Herstellen eines Transponders, Druckform und Transponder
PCT/EP2017/067842 WO2018011396A1 (fr) 2016-07-14 2017-07-14 Procédé et dispositif de fabrication d'un transpondeur, une forme de moule et transpondeur

Publications (1)

Publication Number Publication Date
EP3485431A1 true EP3485431A1 (fr) 2019-05-22

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
EP17739985.4A Withdrawn EP3485431A1 (fr) 2016-07-14 2017-07-14 Procédé et dispositif de fabrication d'un transpondeur, une forme de moule et transpondeur

Country Status (3)

Country Link
EP (1) EP3485431A1 (fr)
DE (1) DE102016008595A1 (fr)
WO (1) WO2018011396A1 (fr)

Families Citing this family (2)

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Publication number Priority date Publication date Assignee Title
DE102017006128A1 (de) * 2017-06-28 2019-01-03 Mühlbauer Gmbh & Co. Kg Verfahren und Vorrichtung zum Herstellen eines HF-Transponders
DE102020004376B4 (de) 2020-07-21 2022-09-08 Mühlbauer Gmbh & Co. Kg Fertigungssystem für elektronische Vorrichtungen sowie Fertigungsverfahren für elektronische Vorrichtungen

Family Cites Families (6)

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Publication number Priority date Publication date Assignee Title
EP1291818A1 (fr) 2001-08-15 2003-03-12 Datamars SA Transpondeur
JP4184776B2 (ja) * 2002-12-16 2008-11-19 大日本印刷株式会社 Ｉｃカード
DE102004006457A1 (de) * 2004-02-04 2005-08-25 Bielomatik Leuze Gmbh + Co Kg Verfahren und Vorrichtung zum kontinuierlichen Herstellen elektronischer Folienbauteile
US7551141B1 (en) * 2004-11-08 2009-06-23 Alien Technology Corporation RFID strap capacitively coupled and method of making same
DE102005018803A1 (de) 2005-04-22 2006-10-26 Mühlbauer Ag Transponder mit einer Dipol-Antenne
DE102007046679B4 (de) * 2007-09-27 2012-10-31 Polyic Gmbh & Co. Kg RFID-Transponder

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