Classifications

• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
  • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
  • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
  • H01L31/042—PV modules or arrays of single PV cells
  • H01L31/05—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
  • H01L31/02—Details
  • H01L31/02016—Circuit arrangements of general character for the devices
  • H01L31/02019—Circuit arrangements of general character for the devices for devices characterised by at least one potential jump barrier or surface barrier
  • H01L31/02021—Circuit arrangements of general character for the devices for devices characterised by at least one potential jump barrier or surface barrier for solar cells
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
  • H01L31/02—Details
  • H01L31/02002—Arrangements for conducting electric current to or from the device in operations
  • H01L31/02005—Arrangements for conducting electric current to or from the device in operations for device characterised by at least one potential jump barrier or surface barrier
  • H01L31/02008—Arrangements for conducting electric current to or from the device in operations for device characterised by at least one potential jump barrier or surface barrier for solar cells or solar cell modules
  • H01L31/02013—Arrangements for conducting electric current to or from the device in operations for device characterised by at least one potential jump barrier or surface barrier for solar cells or solar cell modules comprising output lead wires elements
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
  • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
  • H01L31/042—PV modules or arrays of single PV cells
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
  • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
  • H01L31/042—PV modules or arrays of single PV cells
  • H01L31/0445—PV modules or arrays of single PV cells including thin film solar cells, e.g. single thin film a-Si, CIS or CdTe solar cells
  • H01L31/046—PV modules composed of a plurality of thin film solar cells deposited on the same substrate
  • H01L31/0463—PV modules composed of a plurality of thin film solar cells deposited on the same substrate characterised by special patterning methods to connect the PV cells in a module, e.g. laser cutting of the conductive or active layers
• • H—ELECTRICITY
  • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
  • H02S—GENERATION OF ELECTRIC POWER BY CONVERSION OF INFRARED RADIATION, VISIBLE LIGHT OR ULTRAVIOLET LIGHT, e.g. USING PHOTOVOLTAIC [PV] MODULES
  • H02S40/00—Components or accessories in combination with PV modules, not provided for in groups H02S10/00 - H02S30/00
  • H02S40/30—Electrical components
  • H02S40/34—Electrical components comprising specially adapted electrical connection means to be structurally associated with the PV module, e.g. junction boxes
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
  • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
  • Y02E10/00—Energy generation through renewable energy sources
  • Y02E10/50—Photovoltaic [PV] energy
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T29/00—Metal working
  • Y10T29/49—Method of mechanical manufacture
  • Y10T29/49002—Electrical device making
  • Y10T29/49117—Conductor or circuit manufacturing
  • Y10T29/49174—Assembling terminal to elongated conductor

Definitions

• Photovoltaic layer systems for the direct conversion of sunlight into electrical energy are well known. Commonly, these are referred to as “solar cells”, wherein the term “thin film solar cells” refers to layer systems with small thicknesses of only a few microns, the carrier substrates for sufficient mechanical strength.
• Known carrier substrates include inorganic glass, plastics (polymers) or metals, in particular metal alloys, and can be designed as rigid plates or flexible films, depending on the respective layer thickness and the specific material properties.
• thin-film solar cells having a semiconductor layer of amorphous, micromorphous or polycrystalline silicon, cadmium telluride (CdTe), gallium arsenide (GaAs) or a chalcopyrite compound, in particular copper-indium / gallium disulphurite / Diselenide, abbreviated by the formula Cu (In, Ga) (S, Se) 2 , proved to be advantageous.
• copper indium diselenide (CuInSe 2 or CIS) is characterized by a particularly high absorption coefficient due to its adapted to the spectrum of sunlight band gap.
• Thin-film solar modules have the special advantage that the solar cells can already be connected in integrated form during layer production.
• thin-film solar modules have already been described several times. For example only in this regard to the documents DE 4324318 Cl and
• the various layers for the production of the solar cells are applied directly to a substrate, which is glued with a front-side transparent cover layer to a weather-resistant composite.
• the layer structure between sub ⁇ strate and cover layer comprises a back electrode, a front electrode and a semiconductor layer.
• Typical Wei ⁇ se be performed, the voltage terminals of the solar cell assembly on the back electrode layer by means of metal strips on the back of the substrate.
• each solar module is usually connected by connected to the junction box connection cable to ei ⁇ nem module string in series.
• each solar module connected with the solar cells to ⁇ antiparallel free-wheeling or bypass diode, which state in the normal operation in which the solar module supplies power is reverse biased.
• ⁇ antiparallel free-wheeling or bypass diode which state in the normal operation in which the solar module supplies power is reverse biased.
• verhin damage to the solar module are ⁇ changed, for example, if no current is supplied due to a ⁇ Ver shading or a module defect as may the provided by the other solar modules current through the freewheeling diode to flow.
• the international patent application WO 2009/134939 A2 describes a solar module in which several Anschlußdo ⁇ sen, each having a bypass diode are electrically connected to each other.
• the two outer junction boxes each have a connection cable for interconnection with other solar modules.
• An electrical connection of the junction boxes with each other follows through flat electrical conductors inside the solar module.
• the junction boxes are contacted on their underside, with which they are placed on the back of the solar module.
• the German Offenlegungsschrift DE 102009041968 AI shows a solar module with patched on the underside junction boxes, each having a bypass diode. Contacting of the junction boxes takes place on their underside.
• An electrical connection of the junction boxes underneath one another takes place through a conductor track in the interior of the solar module.
• the object of the present invention to further develop conventional solar panels in Advantageous ter manner, in particular simplifies the auto ⁇ automated production and the manufacturing cost to be reduced ⁇ .
• a solar module with a plurality of series-connected solar cells for photovoltaic power generation is shown.
• the solar module is preferably a thin film solar module with in in tegrated ⁇ form interconnected thin-film solar cells.
• the semiconductor layer consists of a chalcopyrite compound, which is, for example, an I-III-VI semiconductor from the group copper indium / gallium disulphur diselenide (Cu (In, Ga) (S, Se) 2) beispielswei ⁇ se copper-indium-diselenide (CuInSe 2 or CIS) or pretext ⁇ te compounds can act.
• the solar cells are typically located between a first substrate and a second substrate often formed as a cover layer (eg cover plate), the may contain the inorganic glass substrates, for example, polymers or metal alloys, and may be configured as a rigid or flexible sheets Plat ⁇ th as a function of layer thickness and material properties.
• cover layer eg cover plate
• the solar module has two (resulting) ⁇ voltage terminals of opposite polarity, respectively by a connecting conductor to a module outside (ie module ⁇ outer surface) or substrate outside (ie Substratau touch- surface) are performed.
• the two connection conductors are electrically connected to the module outer side in each case to a separate Anschlußussein ⁇ direction, each terminal device is in a separate terminal housing (eg junction box or junction box), so that the solar module has two terminal housing, in each of which a connection device is arranged.
• the ⁇ at the connection housing are each mounted on the outside module or module outer surface to which the two resulting voltage Connections are guided through the connecting conductors.
• module outside refers to an outer side (ie, outer surface) of the thus ⁇ larmoduls. In the module outside is at the same time at an outer side (ie, outer surface) of a sub ⁇ strats (first or second substrate).
• the two connecting conductors for this purpose are electrically connected to an electrode layer, for example a back electrode layer, of the interconnected solar cells.
• the two connection conductors are electrically connected to each other by the solar cells connected in series.
• the two connection leads each open into a separate connection housing.
• the two connection housings are used to connect the solar module with an electrical load, in particular for the serial connection of the solar module with other solar modules.
• the two connection conductors of the solar module are electrically interconnected with the interposition of at least one free-wheeling or bypass diode connected in antiparallel with the solar cells.
• the freewheeling diode is preferably arranged in one of the two connection housings.
• the two connection conductors or the two connection devices to which the connection conductors are electrically connected are electrically connected to one another by a flat-band conductor arranged between the two connection housings, which is fastened to the module outer side (ie module outer surface) or substrate outer side (ie outer substrate surface).
• the ribbon conductor is thus not located in the interior of the solar module (ie between the two substrates), but is arranged on the outer surface of the solar module facing the environment.
• the ribbon conductor makes it possible, in a particularly advantageous manner, to integrate the electrical connection between the two connection conductors in an automated process sequence with little technical complexity. Since the ribbon conductor has a defined geometry, it can be gripped by an automated gripping member in a simple manner for attachment to the module outside (ie module outer surface). In addition, a particularly simple and reliable automated attachment of the ribbon conductor, for example by means Verkle ⁇ advertising, on the typically glass module outside or module outer surface allows. In contrast, an electrical connection of the two connecting conductors with a cross-sectionally round connection cable in the automation would cause considerable problems, since the geometry of such a connection cable is not defined and thus complex and costly Position detection means (eg optical sensors) should be vorzuse ⁇ hen to bring the gripping member in position.
• Position detection means eg optical sensors
• connection cable to a glass module outside or module outer surface due to the relatively small contact surface (example ⁇ way by bonding) to realize only with considerable effort, which can not be ruled out that such attachment to the high mechanical loads in practice in the long term not withstand.
• connection cable were only connected to the two connection housings, there would always be the risk that the connection cable would be used abusively as a carrying device.
• a simple automation of the electrical connection of the two connecting conductors with the interposition of the freewheeling diode can be achieved only by the attached on the outside of the module ribbon conductor, which time and cost can be saved in the industrial Serienzu- production.
• the ribbon conductor is surrounded at least between the two connection housings by an envelope made of an electrically insulating material. It may be advantageous if the disposed within the associated terminal housing end portions of the ribbon ⁇ conductor are free for easy electrical contact.
• the electrically insulating sleeve located/2017in- least in a portion of the flat strip conductor, which extends from a connection housing to the other Range ⁇ housing. In particular, the insulating sheath may also extend into the two connection housings. Through the shell of the ribbon conductor to the outside environment is electrically insulated.
• the ribbon conductor is attached to the outside of the module (ie module outer surface), which is achieved, for example, characterized in that the flat ⁇ strip conductor is bonded to the module outside.
• the ER- inventive solar module of the flat strip conductor buildin ⁇ saturated by a module on the outer side (ie, modulus outer surface) cover made of an electrically insulating material is covered.
• a module on the outer side (ie, modulus outer surface) cover made of an electrically insulating material is covered.
• Preferably glued to this effect to the Modulau ⁇ Hzseite (ie module outer surface) cover can fulfill various functions.
• One function is to protect the ribbon conductor from mechanical impact to improve fatigue life.
• a white ⁇ tere function may be to attach the ribbon conductor to the module outside. In this case, overall may be possible to dispense with a separate mounting of the ribbon ⁇ conductor to the module outside, and it may be the other hand also provided to attach the ribbon conductor itself to the module exterior to achieve on particularly good connection with the module outside len.
• the flat strip conductor is not fastened on the outside of the module itself, but only through the cover. It can also be advantageous if the flat-band conductor is electrically connected to the two connection conductors, in particular through the connection devices, in such a way that it is not fixed or fixed in the band plane or in the band direction. In this way, thermal chucks ⁇ voltages can be at least substantially reduced at the usually high temperature fluctuations to which the solar module is often exposed in practice.
• the ribbon cable allows a particularly simple electrical connection of the connection conductors in the two connection housings.
• the Dolphinge ⁇ housing equipped for this purpose with an associated with the Connecting conductor electrically connected contact element, in ⁇ example, a spring contact element or a terminal contact ⁇ element, which can be brought into electrical contact with one of the two end portions of the ribbon conductor.
• the contact element is adapted to automatically get in electrical contact with the ribbon ⁇ conductor during the attachment of the terminal housing to the Modulaußensei ⁇ te, whereby a simple automation of the electrical contact of the ribbon conductor is made possible in the connection housings, so that time and cost the automated module production can be saved.
• the invention further extends to a method for the automated production of a solar module with a plurality of series-connected solar cells for photovoltaic power generation, in which the solar module has two voltage terminals of opposite polarity, each of which is connected to a module outer side through a connecting conductor. Module outer surface are guided, wherein the ⁇ in the connection conductor are each electrically connected to a separate connection device, each connection device is located in a separate connection housing.
• the method comprises the following steps: A step in which the two connection housings are respectively fastened to the outside of the module (ie module outer surface).
• the ribbon cable is glued to the module outside (ie module outer surface) for this purpose.
• a the flat strip conductor covering Cover B ⁇ ckung to the module outer side ie, modulus outer surface
• contact elements are automatically brought into electrical contact with the ribbon conductor during the attachment of the connection housing to the outside of the module.
• FIGS. 7-8 are schematic illustrations for illustrating variants of the connection conductors in the solar module of FIG. 1. Detailed description of the drawings
• the solar module 1 which in this case is, for example, a thin-film solar module, comprises a plurality of solar cells 2 which are connected in series with each other in an integrated form and which are each marked with a diode symbol.
• the solar module 1 is based here at ⁇ play, on the so-called substrate configuration which will be explained in more detail in connection with FIG. 2.
• Two (thin-film) solar cells 2 are shown by way of example in FIG. 2, it being understood that the solar module generally has a large number (eg, approximately 100) of solar cells 2.
• the solar module 1 comprises an electrically insulating sub ⁇ strat 7 (in the introduction to as "first sub- strat") having applied thereto a layer structure for forming a photovoltaic active
• the layer structure is integrally ⁇ arranged on the light-entry-side front side (III) of the substrate. 7
• the substrate 7 here consists, for example, of glass with a relatively low light transmittance, although other insulating materials with sufficient strength, as well as inert behavior compared to the process steps carried out, can equally be used.
• the layer structure comprises a back electrode layer 9 arranged on the front side (III) of the substrate 7.
• the back electrode layer 9 contains, for example, a layer of an opaque metal such as molybdenum and is applied to the substrate 7, for example by sputtering.
• the back electrode layer 9 has, for example, a layer thickness of about 1 ⁇ m.
• the back electrode layer 9 comprises a shape
• the photovoltaically active absorber layer 8 contains a p-doped semiconductor layer 10, for example a p-type chalcopyrite semiconductor, such as a compound of the group copper indium diselenide
• the semiconductor ⁇ layer 10 has a layer thickness of 500 nm to 5 ym, and in particular of about 2 .mu.m.
• a buffer layer 11 is deposited, which here, for example, a single layer of cadmium sulfide (CdS) and a single layer intrinsic zinc oxide (i-ZnO).
• a front electrode layer 12 is applied, for example by vapor deposition.
• the Fronte ⁇ lektroden für 12 is for radiation in the semiconductor ter Mrs 11 sensitive spectral transparent
• the transparent front electrode layer 12 may (Transparent Conductive Electrode TCO) are referred to in general terms as a TCO layer and is based on a doped metal oxide, in ⁇ play, n-type, aluminum-doped zinc oxide
• the layer thickness of the front electrode layer 12 is ⁇ example 300 nm.
• the layer system is subdivided by known methods for producing a (thin-film) solar module 1 into individual photovoltaically active regions, ie solar cells 2.
• the subdivision is made by cuts 13 using a suitable structuring technology such as Laser writing and mechanical processing, for example by lifting or scribing.
• the individual solar cells 2 are connected in series via an electrode region 14 of the back electrode layer 9.
• the solar module 1 has, for example, 100 series strigic ⁇ preparing solar cells 2, and an open circuit voltage of 56 volts.
• both the resulting positive (+) and the resulting negative (-) voltage connection of the solar module 1 are passed over the back ⁇ electrode layer 9 and there electrically kontak ⁇ animal, which will be explained in more detail below.
• an intermediate layer 15 which at ⁇ game as polyvinyl butyral (PVB) or ethylene vinyl acetate (EVA) is applied on the Frontelektro- dentik 12, contains.
• the thickness of the intermediate layer 15 is, for example, 0.76 mm.
• the layer structure of substrate 7, the back electrode layer 9 and active photovoltaic absorber layer 8 sealed via the intermediate layer 15 having a cover disk 16 (in the introductory description referred to as "second substrate") connected ih ⁇ rer back side (II) is bonded.
• the cover plate 16 is transparent to sunlight and contains, for example, hardened, extra-white, low-iron glass.
• the cover ⁇ disc 16 for example, has an area of 1.6 x 0.7 m.
• the solar cells 2 can be irradiated by incident on the front side (I) of the cover plate 16 light, which is indicated in Fig. 2 by the arrows.
• edge area between sub- strat 7 and shroud 16 is circumferentially sealed with a Randversie ⁇ gelung 34 as a vapor diffusion barrier, in ⁇ preferably with a plastic material, such as polyisobutylene, the corrosion-sensitive Photovolt aisch active absorber layer 8 before atmospheric oxygen and
• the edge seal 34 can be seen in FIGS. 7 and 8.
• the entire solar module 1 is mounted for mounting at the place of use in an aluminum hollow chamber frame, which is not shown here.
• the two resulting voltage connections (+, -) are conducted through two connecting conductors 17 to the rear side (IV) or back surface of the substrate 7, which are illustrated in FIGS. 1, 7 and 8.
• the solar module 1 has the same structure in the region of the two connecting conductors 17.
• the connecting conductor 17 comprises a band-shaped metal foil 30, for example consisting of aluminum, with a thickness of, for example, 0.1 mm and a width of, for example, 20 mm.
• the metal foil 30 is (at ⁇ play one side here), covered with an insulating film 31 made of an electrically insulating material such as polyimide, the insulating film 31 is disposed on the outer side, i.e. on the substrate 7 side facing away from the foil conductor 17 ,
• the connection conductor 17 comprises a tin-plated copper strip.
• the band-shaped metal foil 30 is connected on both sides with an insulating film 31 ⁇ .
• the insulating film 31 is glued to the metal foil 30, for example. It is also conceivable to laminate the metal foil 30 into two insulating films 31.
• the metal foil 30 of the two connection conductors 17 is electrically connected to a band-shaped electrical conductor, a so-called bus bar 36.
• the two busbars 36 each contact one (here formed for example by the back electrode layer 9) resulting voltage connection (+, -) of the solar module 1 and extend only in Area of the plane of the back electrode layer 9.
• the busbars 36 thus serve for electrically connecting the two voltage terminals with the Anschlußusseitern 17.
• Each bus bar 36 is here, for example, as a metal foil, in particular aluminum foil formed.
• the metal foil 30 of the two lead conductors 17 and the busbar 36 are electrically connected therewith can be ⁇ of two parts and different from each other, in particular they may be prepared from egg nem mutually different material.
• the metal foil 30 of the two connection conductors 17 and the bus bar 36 connected electrically may be a one-part or one-piece metal foil, so that the busbar 36 merely represents a foil section of the metal foil 30 of the connection conductor 17.
• the two busbars 36 are electrically conductively connected to the back electrode layer 9, for example, by welding, bonding, soldering or gluing with an electrically conductive adhesive.
• the electrical connection to the back electrode layer 9 preferably takes place by ultrasonic bonding.
• the two connection conductors 17 are each guided at the lateral module edge 32 out of the composite of substrate 7 and cover disk 16, around the substrate edge 33 of the substrate 7, and down to the rear side (IV) of the substrate 7 , The two
• Terminal conductors 17 each have a connection point 18 for electrical contacting, which, for example, on the back (IV) of the substrate 7 at a distance of about 20 mm from the side edge (substrate edge 33)
• Connection points 18 can be arranged in principle anywhere on the back (IV) of the substrate 7.
• the electrical contacting of the two connection conductors 17 at the connection points 18 takes place in each case by a first connection device 19 in a connection box 3, which for this purpose has an electrical contact element, for example a spring or clamping contact element.
• a spring contact element is shown, which contacts the metal foil 30 of the connecting conductor 17 ⁇ .
• an electrical connection by soldering, bonding with a conductive adhesive or ultrasonic bonding would be possible.
• connecting conductor 17 made of aluminum it is convenient to provide the connection to tin ⁇ 18 to improve the electrical conductivity.
• connection points 18 do not have to be bright, but can equally be coated with a protective layer of varnish or an art ⁇ material foil to protect the metallic contact surface from oxidation and corrosion during Heinrichsprozes ⁇ ses.
• the protective layer can be penetrated for electrical contacting with an object, for example a contact pin or a contact needle.
• the protective layer from a glued-on and removable plastic film which is removed before the actual electrical contact with the contact element.
• junction boxes 3 which for example consist of plastic and are manufactured by injection molding ⁇ method.
• the two junction boxes 3 are mounted on the back (IV) or outer surface of the substrate 7, for example by gluing, which allows a simple and fast automated assembly.
• the bonding of the junction boxes 3 to the substrate 7 can be done, for example, with an acrylate adhesive or a polyurethane adhesive. In addition to a simple and durable connection, these adhesives perform a sealing function and protect the electrical components contained from moisture and corrosion.
• the interior of the junction boxes 3 can also be filled with a sealant such as polyisobutylene, at least partially, to increase the dielectric strength and to reduce the risk of a penetration ⁇ streams of moisture and consequent creep.
• connection conductor 17 in each case an opening 35, for example designed as a bore, is provided in the substrate 7, through which the connection conductor 17 is guided on the rear side (IV) or outer surface of the substrate 7.
• the connection conductor 17 has a metal foil 30, depending ⁇ but no insulation 31.
• the two junction boxes 3 each have a connection cable 4 with a pole connection 5, which is electrically connected to the first connection device 19.
• the solar module 1 with an electrical load such as an inverter can be connected.
• the two pole terminals 5 can be used in particular for the serial connection of the solar module 1 with further solar modules (not shown).
• a free-wheeling diode 6 is arranged, which is connected in anti-parallel to the forward direction of the solar cell 2 of the solar module 1 with the two connection ⁇ conductors 17 in series.
• the electrical connection Zvi ⁇ rule the two connection conductors 17 and the two first connecting means 19 is illustrated in Fig. 1 in schematic form by an electrical line 20.
• the electrical connection between the two connection conductors 17 or the two first connection devices 19 comprises a flat-band conductor 21 arranged between the two connection boxes 3, which extends with its two end sections 22 into the connection boxes 3.
• 3 shows a plan view of the rear side (IV) or outer surface of the substrate 7 and a sectional view through the substrate 7 in the region of the ribbon conductor 21, wherein the section line is indicated in the top view.
• the ribbon conductor 21 has a defined geometric shape, so that it can be gripped by a gripping member in a relatively simple manner for assembly.
• the flat strip conductor 21 comprises an electrically conductive metal strip 26, which is surrounded by an insulating sleeve 23 made of an electrically insulating material, wherein the two end portions 22 of the metal bands 26 are exposed within the junction boxes 3.
• the metal band 26 is, for example, an aluminum or tin-plated copper tape having a thickness of at ⁇ play 10 to 30 ym, a width of for example 50 mm and a length of for example 60 cm.
• the metal strip 26 is covered with an electrically insulating film of, for example, polyimide, the electrically insulating film being located on all sides, in particular also on the side of the flat strip conductor 21 facing the substrate 7.
• the flat strip conductor 21 is glued with its broad surface on the back (IV) or back outer surface of the substrate 7 by an adhesive layer 29, which allows a simple and fast automated assembly to the substrate 7.
• the gluing of the flat strip conductor 21 can take place in ⁇ example with an acrylic adhesive or a polyurethane adhesive. It is also conceivable, the flat type conductor 21 having a two-sided adhesive tape on the substrate 7 to smal ⁇ ben.
• the flat conductor 21 is distinguished by a very high aspect ratio (ratio width to thickness), so that even with a very flat design, a low electrical resistance of, for example, less than 10 mQ is realized. At a current of 3 A for example, this would lead to a power loss, for example 30 mV, corresponding to a loss of efficiency of at ⁇ play, about 0.06%.
• the two end sections 22 of the ribbon conductor 21 are each completely within the junction boxes 3, wherein the insulating sleeve 23 into the junction boxes
• connection points 24 for electrical contacting which is illustrated in greater detail in FIG. 4 by a sectional view in the region of an end section 22.
• FIG. 4 is a section in the region of an end section 22 Darge ⁇ represents, wherein the solar module 1 in the region of the two Endab ⁇ sections 22 has a same structure.
• the two end sections 22 are electrically contacted by a second connection device 25 having an electrical contact element made of an electrically conductive material, here for example a spring contact element, which comes into contact with the surface of the metal strip 26 in a spring-loaded manner.
• a spring contact element When using such a spring contact element, the end portions 22 each attached to the substrate 7 (ange ⁇ sticks) be.
• the two spring contact elements 25 are electrically connected with the interposition of the freewheeling diode 6 with the two first connection means 19, to which the two connection conductors 17 are connected.
• the two second connection directions 25 for the electrical connection of the metal strip 26 of the flat Bandleiter 21 and the two first connection means 25 for the electrical connection of the metal foils 30 of the connection conductors 17 may be formed as components of a common connection device.
• each spring contact element can be designed such that it automatically engages the metal strip 26 or metal foil 30 by the (automated) assembly of the connection socket 3 on the substrate 7 passes, whereby the automati ⁇ - oriented production of the solar module 1 is facilitated.
• connection points 24 need not be metallic bright, but may be coated with a protective layer of paint or plastic foil in order to protect the metallic contact surface from oxidation and corrosion during the manufacturing process.
• the protective layer may be for the electrical contact with an object, for example a clock pin or Kon ⁇ a contact needle penetrated.
• the protective layer from a glued-on and removable plastic film, which is removed before the actual electrical contact.
• Fig. 5 is based on a corresponding plan view and sectional view of a variant of the solar module 1 Darge ⁇ represents.
• a cover film 27 is additionally provided, which is arranged over the ribbon conductor 21 already bonded to the substrate 7 and adhesively bonded to the back side (IV) of the substrate 7.
• the cover film 27 is thus not on the substrate 7 side facing of the flat strip conductor 21.
• the cover film 27 is wider than the flat strip conductor 21 and has two laterally projecting film regions 28.
• the cover film 27 may be glued to the ribbon conductor 21.
• the cover film 27 is bonded only to the substrate 7 and is the flat conductor 21 unconnected.
• the cover film 27 is made of an electrically insulating material, such as plastic. Anschaubit comparable in FIG. 5, the cover sheet 27 may extend into the inside An ⁇ junction boxes 3, wherein the end portions 22 for electrical contacting remain free.
• the cover film 27 serves for a mechanical protection of the ribbon conductor 21, wherein in addition the attachment of the flat ribbon conductor 21 is reinforced on the substrate 7.
• FIG. 6 shows a further variant of the solar module 1 on the basis of a plan view and sectional illustration.
• This variant differs from the variant shown in Fig. 5 only in that the ribbon conductor 21 has no insulating sleeve 21 and is not glued to the substrate 7.
• An attachment of the ribbon conductor 21 or metal bands 26 on the substrate 7 is carried out only by the adhered to the substrate 7 cover 27.
• the cover film 27 is bonded to the metal strip 26.
• the cover film 27 is not glued to the metal strip 26.
• the two end sections 22 are each in the junction boxes 3 at least in the directions of the band plane of the metal strip 6 movably contacted electrically, so that the metal strip 26 can perform thermal volume changes, without generating mechanical stresses.
• This can be achieved beispielswei ⁇ se by electrical contacting by the two spring contact elements 25.
• ⁇ measure the durability can be improved.
• the covering foil 27 of the flat strip conductor 21 has a greater width, ie the dimension of the two laterally projecting foil regions 28 is greater than that of the flat ribbon conductor 21 in FIG. 5.
• the width of the cover film 27 is smaller than that of the flat ⁇ strip conductor 21 of Fig. 5.
• the invention provides a solar module, in particular a thin-film solar module, in which the connection lines for connecting the solar cells to the connection devices in the connection boxes are electrically interconnected by a ribbon conductor with the interposition of a freewheeling diode.
• the ribbon conductor allows a technically easy to implement automated fastening ⁇ tion on the substrate, the ribbon conductor can be reliably and securely connected to the substrate, for example by gluing.

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• 2012
  • 2012-10-18 WO PCT/EP2012/070706 patent/WO2013057224A1/de active Application Filing
  • 2012-10-18 JP JP2014536239A patent/JP2014533073A/ja active Pending
  • 2012-10-18 CN CN201280051190.9A patent/CN103890959A/zh active Pending
  • 2012-10-18 KR KR1020147010158A patent/KR20140066238A/ko not_active Application Discontinuation
  • 2012-10-18 EP EP12784507.1A patent/EP2769418A1/de not_active Withdrawn
  • 2012-10-18 US US14/350,353 patent/US20140246074A1/en not_active Abandoned

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