EP2697557A1

EP2697557A1 - Lighting device

Info

Publication number: EP2697557A1
Application number: EP12720815.5A
Authority: EP
Inventors: Gerhard Kuhn; Ales Markytan; Christian Gärtner
Original assignee: Osram GmbH
Current assignee: Osram GmbH
Priority date: 2011-04-15
Filing date: 2012-04-12
Publication date: 2014-02-19
Anticipated expiration: 2032-04-12
Also published as: US20140104829A1; DE102011017195A1; CN103492790B; CN103492790A; US9371968B2; WO2012140146A1; EP2697557B1

Abstract

The invention relates to a lighting device, which has a rod-shaped substrate body (1) having at least one first and one second mounting side (11, 12) and a main extension direction (99), first semiconductor light-emitting elements (31) on first mounting surfaces (21) of the first mounting side (11), and second semiconductor light-emitting elements (32) on second mounting surfaces (22) of the second mounting side (12), wherein the first and the second mounting sides (11, 12) face away from each other, wherein the mounting surfaces (21, 22) are formed by recesses in the mounting sides (11, 12) spaced in the main extension direction (99) and wherein the first semiconductor light-emitting elements (31) are identical to each other and the second semiconductor light-emitting elements (32) are identical to each other.

Description

description

LIGHTING DEVICE

In the following, a lighting device is specified.

This patent application claims the priority of German Patent Application 10 2011 017 195.9, the disclosure of which is hereby incorporated by reference.

At least one object of certain embodiments is to provide a lighting device that can emit light in different directions during operation.

This object is achieved by an object having the features of the independent claim. advantageous

From embodiments and further developments of the subject matter are characterized in the dependent claims and continue to be apparent from the following description and the drawings.

According to at least one disclosed embodiment, a

Lighting device on a carrier body. Of the

Carrier body may be formed in particular rod-shaped, which means that the carrier body has an elongated shape with a main extension direction, wherein the

Dimensions of the carrier body along the

Main extension direction larger, preferably many times larger than the dimensions perpendicular to

Main extension direction is.

According to at least one embodiment, the carrier body has at least one first and one second mounting side. The Mounting sides extend along the

Main extension direction of the carrier body, wherein on the first mounting side first mounting surfaces and on the second mounting side second mounting surfaces are formed.

In particular, each of the mounting sides has a plurality of mounting surfaces.

According to another embodiment, the mounting surfaces of each mounting side are arranged along the main extension direction. In particular, the mounting surfaces may be arranged spaced from one another along the main extension direction.

According to another disclosed embodiment, the

Lighting device first semiconductor light elements on the first mounting surfaces of the first mounting side.

Furthermore, according to another embodiment, the illumination device has second semiconductor light elements on the second mounting surfaces of the second mounting side.

According to another embodiment, each of the

Mounting surfaces through a recess in the respective

Mounting side formed. In particular, this may mean that the first mounting surfaces on the first mounting side as arranged along the main extension direction spaced recesses and the second mounting surfaces as spaced along the main extension direction

Recesses are formed in the second mounting side. According to another embodiment, each of the

Mounting surfaces formed at least partially flat.

In particular, each of the mounting surfaces may be formed as a recess with a flat base. Furthermore, each one is Mounting surface provided for that mounted on it one or more semiconductor light elements and electrically

can be connected. Each of the mounting surfaces has a surface normal, in particular a

Main emission direction of each mounted

Semiconductor lighting element may correspond. Especially

Preferably, the first mounting surfaces are arranged parallel to each other and in particular in a plane with respect to the flat base surfaces. Furthermore, the second

Mounting surfaces particularly preferably arranged in parallel and with respect to the flat base surfaces in a plane.

According to a further disclosed embodiment, the first and second mounting side facing away from each other. That can

in particular mean that the surface normals of the first mounting surfaces with the surface normals of the second

Mounting surfaces include an angle greater than or equal to 90 °. As an angle between surface normals, here and in the following, the smaller of the two angles enclosed by two surface normals is always assumed.

According to another embodiment, the carrier body is designed as a heat sink for the semiconductor light elements mounted thereon. This may mean in particular that the

Material, the dimensions and the mass of the carrier body are selected such that by the operation of the

Semiconductor lighting elements generated heat can be dissipated, so that a permanent operation of the

Semiconductor lighting elements and thus the

Lighting device is possible. In particular, the carrier body may be made of metal, for example aluminum and / or copper, or at least comprise such a metal. According to another embodiment, the carrier body is designed as a rod with a partially round profile or as a plate, that is, with a rectangular profile. According to another embodiment, the carrier body has at least two bar-shaped partial bodies, each with a partially round cross section. Each of the at least two rod-shaped part bodies has a flattened side in the form of a flattened side surface which runs along the

Main extension direction of the support body or each part body extends and by means of which the part bodies are arranged together. The support body can be formed in one piece or in several parts. For example, each of the part bodies may be a half-round

Have cross-sectional profile, for example in the form of a semicircle or a half ellipse, so that the

Carrier body forms a rod with round cross-section after the joining of two rod-shaped part bodies. The carrier body has more than two part body, each partial body can ^¬ for example, a section in the shape of a circular or elliptical sector have, so that the part of the body after assembly also form a circular or elliptical cross-section for the support body.

Furthermore, the cross section of a part body

for example, a round, such as a circular,

Cross-section, from which a circle segment or another area has been removed, so that the partial body

has at least one flattened side. The carrier body, which has at least two such partial bodies, can thereby have a cross-section which is dumbbell-shaped

or whose outer circumferential line has the shape of an eight or at least recalls an eight. Does the Carrier body, for example, three part body, the cross section of the carrier body can be kleebattartig.

According to a further embodiment, the first and second semiconductor light-emitting elements are suitable for light in a wavelength range from ultraviolet radiation to

infrared radiation, more preferably visible light. In this case, one or more of the semiconductor light element monochromatic light or even

emit mixed-colored light, particularly preferably white light. For this purpose, a semiconductor light-emitting element can have a light-emitting semiconductor layer sequence which comprises a wavelength conversion element in the form of a light-emitting semiconductor layer

Dye layer, a dye plate or a

Dye-containing casting is arranged downstream, the

At least a portion of the radiation generated by the semiconductor layer sequence can convert into light having a different wavelength, so that the semiconductor light-emitting element

can emit mixed-colored light. The

Semiconductor light-emitting elements may in particular be designed as epitaxially grown semiconductor layer sequences or may each have an epitaxially grown semiconductor layer sequence. The semiconductor layer sequence can be embodied in particular as a semiconductor chip. The semiconductor layer sequence may comprise an arsenide, phosphide and / or nitride compound semiconductor material, which is formed in accordance with the desired light in terms of its composition and in terms of its layer structure. One or more semiconductor light-emitting elements may in particular be designed as light-emitting diodes (LED)

Semiconductor lighting elements can, for example, a

Have housing body into which the epitaxially grown semiconductor layer sequence, so the semiconductor chip mounted and optionally embedded in a potting material. Alternatively, one or more

Semiconductor lighting elements may also be mounted as epitaxially grown semiconductor layer sequences in the form of semiconductor chips directly on the carrier body without a respective housing body.

According to another embodiment, the first ones are

Semiconductor lighting elements equal to each other. According to yet another embodiment, the second are

Semiconductor lighting elements equal to each other. By means of identical semiconductor light elements on a mounting side, the illumination device can be applied over the whole

Blend mounting side of same-colored light for even illumination.

According to another embodiment, the first semiconductor light emitting elements emit light which is different from the light emitted by the second semiconductor light elements.

According to another embodiment, the first ones are

Semiconductor lighting elements for direct illumination of an object or a work area provided while the second semiconductor light elements for indirect illumination of the room or the environment in which the lighting device is located, are provided. As a result, the illumination device can be used simultaneously as direct and indirect illumination, wherein the respectively emitted light intensities for the direct and the indirect illumination separately from each other regular and

can be adjustable. In contrast to the present illumination device, direct and indirect illumination in known light sources are usually achieved by using a light source with separate optical paths or two optically separate light sources. As for the

Indirect and the direct illumination in each case a different radiation characteristic is desired, further optical components are required in known light sources, which is why a compact design can not be achieved.

According to another disclosed embodiment, the

Lighting device as the first semiconductor light elements in each well of the first mounting surface exactly on a light-emitting semiconductor chip. In particular, each semiconductor chip, as described above, with a

Wavelength conversion element may be provided, so that each of the first semiconductor light-emitting elements in operation preferred

emit cold white light, which may be particularly suitable for direct lighting.

According to a further embodiment, each of the second semiconductor light-emitting elements in each recess of the second mounting surface has exactly one light-emitting semiconductor chip which, as described above, has a light-emitting semiconductor chip

Wavelength conversion element can be combined so that the second semiconductor light elements can emit particularly preferably warm white light, which may be particularly suitable for indirect lighting. According to further embodiments, the first

Semiconductor lighting elements and / or the second

Semiconductor lighting elements each have a plurality of light-emitting semiconductor chips. The respective plurality of Light emitting semiconductor chips can thereby unhoused, in a common housing or in separate housings

arranged to be designed as a respective semiconductor element. In particular, the respective plurality of light-emitting semiconductor chips may have a plurality of

different colored semiconductor chips, particularly preferably the combination of a red, a green or whitish green and a blue emitting semiconductor chip. Additionally or alternatively, other colors may also be used

emitting semiconductor chips and / or semiconductor chips may be provided in combination with wavelength conversion elements. By combining a plurality of light

emitting semiconductor chips for a semiconductor element, the light color on the first and / or second

Mounting side of the lighting device can be selectively changed and controlled in operation, so that, for example, a lighting effect with different colors, temporally changing colors and / or a variable white light, for example, along the known in the art

White-light curve of Planck 'see black body radiators, are adjustable.

According to another embodiment, each mounting surface has electrical connections for one on the mounting surface

arranged semiconductor element on. such

Connections may, for example, in the form of electrical contact surfaces, solder contacts and / or plug contacts

be provided. Electrical supply lines, for example, the mounting surfaces on a mounting side together

interconnected, can run as traces or cables along the surface or alternatively also in the interior or in a combination thereof along the main extension direction of the support body. According to a further disclosed embodiment, the carrier body on the mounting surfaces each have a printed circuit board, wherein the semiconductor light elements are each arranged on a circuit board, mounted and electrically connected.

In particular, the semiconductor light-emitting elements can be used as

be surface mount semiconductor light-emitting elements are soldered, which are soldered onto the circuit boards on the mounting surfaces. In this case, each mounting surface may have its own circuit board, which via conductor tracks and / or

Cable connections, for example, over the interior of the

Carrier body, interconnected. Alternatively, it may be provided on each mounting side, a continuous circuit board, along the

Main extension direction of the support body extends and projects, for example, between each of the mounting surfaces through a portion of the support body.

According to another disclosed embodiment, the

Mounting surfaces forming depressions reflective

Side surfaces on. Particularly preferably, the

Side surfaces specular or specular

be reflective.

According to a further disclosed embodiment, the side surfaces of a recess are formed perpendicular to the respective mounting surface. This allows a high degree of compactness

Lighting device can be achieved. Alternatively, the recesses may also have sloping side surfaces, so that it may be possible to dispose of the

Semiconductor lighting elements emitted laterally in

Direction of the main emission direction of the respective

Redirecting semiconductor light element. The depressions may be the same or different on the at least two mounting sides. The wells on a mounting side, so the first and / or the second

Mounting side, may be particularly preferably similar. Due to the different execution of wells, for example by training different

Recesses on the first mounting side compared to the second mounting side, the desired

Radiation characteristics for the mounting sides are set independently.

According to another disclosed embodiment form are the

Semiconductor lighting elements in the of the wells

formed mounting surfaces at least partially or completely sunk. In particular, the depressions of the first mounting surfaces may have a shape, width and depth, so that light emitted by the first semiconductor light elements only at an angle of less than or equal to 65 °, and preferably of less than or equal to 45 ° to the surface normal of the respective mounting surface in Operation can be radiated. The specified angle corresponds to the angle measured to

Main emission direction, which is also the angle to

Surface normal of the mounting surface corresponds. For light emitted from the semiconductor light emitting elements at a larger angle, the depressions or the side surfaces of the depressions act as shadows or, if these are designed to be reflective, as reflectors which, for example, direct the light in the direction of the light

Can deflect the main radiation direction.

According to another embodiment, the recesses of the second mounting surfaces have a shape, width and depth, so that all the light emitted by the second semiconductor light elements is emitted directly. That can

in particular mean that the depth is selected together with the width and the shape of the recesses of the second mounting surfaces so that the recesses and in particular the

Side surfaces of the recesses do not shade light.

According to a further disclosed embodiment, the recesses of the second mounting surface are designed such that they have a shape, width and depth, so that light at an angle of less than or equal to 90 ° to the main emission of the respective mounting surface or

Surface normal of the respective mounting surface can be radiated during operation.

Such emission characteristics or

Beam angles are suitable in the case of the recesses of the first mounting side in particular for direct illumination and in the case of the second mounting side for indirect lighting.

According to a further disclosed embodiment, the mounting surfaces of a mounting side along the main extension direction are spaced from each other with a respective same distance. Here and below is referred to as the distance between two adjacent mounting surfaces of the distance between the respective centers to each other. In particular, the mounting surfaces and / or the second mounting surfaces may each be arranged uniformly spaced along the main extension direction of the carrier body. Particularly preferably, the distance between two directly adjacent

Mounting surfaces at least 2 cm. According to a further disclosed embodiment, the distances between the first mounting surfaces are equal to the distances between the second mounting surfaces, wherein the first and second mounting surfaces are arranged offset from one another. Particularly preferably, the first mounting surfaces on the first mounting side and the second mounting surfaces on the second mounting side can be offset by a half distance from each other. By a staggered arrangement of the respective mounting surfaces on the first and on the second mounting side can be a more uniform

Heat distribution can be achieved in the operation of the device resulting heat, which is beneficial to the

Total heat and the operating temperature of the

Lighting device and the individual

Semiconductor lighting elements can affect.

According to another disclosed embodiment form are the

Semiconductor lighting elements of the first and / or the second mounting side arranged at mutually different positions on the respective mounting surfaces. That can

in particular mean that the arrangement of

Semiconductor lighting elements on the mounting surfaces of a

Assembly side is not uniform, but is formed in an asymmetrical arrangement, whereby in each case in the recess surfaces formed by mounting surfaces, a different distance to the respective side surfaces can be achieved. This can vary depending on the shape and

Alignment of the side surfaces each have a different emission direction or a different

Abstrahlungskegel the semiconductor light elements can be achieved, whereby different radiation characteristics of the first and / or the second mounting side of the

Lighting device can be achieved. According to another disclosed embodiment, the carrier body has at least a third mounting side with third

Semiconductor lighting elements along along the

Main extension direction arranged formed by recesses third mounting surfaces. The first, second and third mounting side are each arranged facing away from each other. In particular, the surface normals of the second and third mounting surfaces may be formed symmetrically to the plane in which the surface normals of the first mounting surfaces lie. The surface normals of the second and / or third mounting surfaces preferably include one each with the surface normals of the first mounting surfaces

Angles greater than or equal to 90 ° and less than or equal to 135 °. Assuming that the surface normals of the first mounting surfaces in an exemplary orientation of the

Illuminating device in the room show vertically downwards, this means that the surface normals of the second and third mounting side are each more preferably directed at an angle of greater than or equal to 0 ° and less than or equal to 45 ° to the horizontal. This results in a corresponding main emission direction for the second and third semiconductor light elements. Furthermore, the first, second and third mounting sides can be used with respect to the angle enclosed between the surface normals

be evenly arranged so that the respective

Surface normal each an angle of about 120 °

include each other.

According to another embodiment, the second and third semiconductor light-emitting elements are of similar construction. In particular, the second and third

Semiconductor lighting elements or the second and third mounting side provided for indirect lighting be while the first mounting side and thus the first semiconductor light elements can be provided for direct illumination. For the third semiconductor light elements, the third

Mounting surfaces and the recesses forming the third mounting surfaces are those mentioned above in connection with the first and second semiconductor light-emitting elements, mounting surfaces and their recesses, in particular that stated in connection with the second semiconductor light elements and the second mounting surfaces.

According to another disclosed embodiment, the

Lighting device on a reflector, the second mounting side in the emission of the second

Semiconductor lighting elements is arranged downstream. Rejects that

Lighting device on a third mounting side with third semiconductor light elements, so the reflector

in particular the second and the third mounting side in the emission direction of the second and third

Subsequent semiconductor light elements. "In

Downstream of the radiation direction "may mean in particular that the entire light emitted by the second and possibly also by the third semiconductor light-emitting elements falls on the reflector

Reflector may be formed, for example, as a diffuse reflector, which may result in good mixing of each emitted light, for example, in conjunction with second and optionally third Halbleiterleuchtelementen, each having a plurality of different colored semiconductor chips. According to another disclosed embodiment, the

Lighting device on one or more diffusers, for example, scattering plates or scattering films, which are arranged downstream of the individual or more semiconductor light elements. For example, each of the wells of a mounting side or even all the mounting sides may be covered individually or jointly by such a diffuser. By means of optical diffusers, a uniform and homogeneous emission as well as the use of differently colored semiconductor chips for the semiconductor light elements can also be uniform

Mixing and thus over the solid angle uniform light color of the emitted light can be achieved.

According to further embodiments, the

Lighting device electrical connections,

Holding device such as a lamp cap, a

Suspended attachment and / or have a plug. Furthermore, a plurality of lighting devices can be plugged together, so that a lighting device with variable length can be possible.

According to another embodiment, the form is here

described lighting device to the general

indirect interior lighting, for example for

Office lighting, and at the same time as direct

Whether ektbeleuchtung usable or is used

The illumination device described here can

In particular, meet the following five requirements at the same time, namely glare-free, direct and indirect

Lighting, high luminaire efficiency, lighting efficiency of direct lighting and a compact design. This can be supplemented particularly advantageous in that surface-mountable semiconductor light-emitting elements such as surface mount light-emitting diodes as

Light sources are used. In particular, it may be possible to achieve freedom from glare by not having to use additional optical components. In known light sources is usually by the

Use of reflectors, secondary lenses or covers a glare freedom achieved, but either the luminance is reduced or the direct eye contact with the light sources in the light source is avoided. However, all the components mentioned require, in addition to the light source additional optical components, whereby both the

Luminaire efficiency is reduced as well as the outer

Dimensions of the lamp increase. Because the

Lighting device according to the above-described

Embodiments prefer few or none

Semiconductor lighting elements having downstream optical elements, a high luminous efficiency and high lighting efficiency, especially for a direct

Lighting can be achieved. A high or highest

Luminous efficiency can be achieved whenever the light within the illumination device undergoes as few interactions with optical components as reflectors or lenses, since each interaction is associated with an absorption or a refractive index transition. at

However, such components are necessary to known light sources, since otherwise decreases with the reduction of the number of interactions, the possibility that

Radiation characteristic of the known light sources in

to adapt as desired. By the special

geometric design and arrangement of

Semiconductor light-emitting elements on the carrier body are in the case of the illumination device described here additional components not necessary to the

Radiation characteristic of the lighting device in

to adapt as desired.

The goals and advantages that can be achieved simultaneously with the illumination device described here can thus not be achieved simultaneously with light sources in the state of the art, since the targets are at least partially fulfilled

conflicting technical measures in known

Require light sources.

Further advantages and advantageous embodiments and forms

Further developments emerge from the following in

Connection with the figures described embodiments.

The figures 1A to 3B show schematic representations of lighting devices according to various

Out of leadership examples.

In the exemplary embodiments and figures, the same or equivalent components may each have the same

Be provided with reference numerals. The elements shown and their proportions with each other are basically not to be regarded as true to scale, but individual elements such. As layers, components, components and areas, for ease of representation and / or for better understanding exaggerated thick or large dimensions

be shown.

FIGS. 1A to 1C show an illumination device 10 according to an exemplary embodiment, with FIGS. 1B and 1C being sectional views of the illumination device 100 shown in FIG. 1A along the sectional planes BB and CC are. The following description refers equally to FIGS. 1A to 1C.

The illumination device 100 has a rod-shaped carrier body 1 with a first and a second

Mounting side 11, 12 on. The rod-shaped carrier body 1 has a main extension direction 99, along which first and second semiconductor light-emitting elements 31, 32 are arranged on the first and the second mounting side 11, 12.

As can be seen in particular from FIGS. 1B and 1C, the carrier body 1 is formed from two partial bodies 51, 52 which each have a partially round cross-section.

In particular, each partial body 51, 52 has a

circular section, from which a circle segment has been removed, so that each of the partial body 51, 52 has a flattened side 50 and the partial body 51, 52 are arranged with the flattened sides 50 to each other. The preparation of such a carrier body 1 can thereby

carried out in one piece or in the form of a multi-part support body 1, for example in the form of separate

Part bodies 51, 52. Alternatively to the shown

Embodiment are also other forms for the

Carrier body 1 and its cross-section and for the partial body 51, 52 and their cross-sections possible.

The carrier body 1 is made of metal, for example aluminum, which has a high thermal conductivity, so that the

Carrier 1 at the same time as a heat sink for the

Semiconductor lighting elements 31, 32 is formed. On the first and second mounting side 11, 12, the support body 1 has first and second mounting surfaces 21, 22, respectively are each formed by depressions and spaced along the main extension direction 99 to each other

are arranged. The mounting surfaces 21, 22 are

formed in particular by the bottom surfaces of the wells and executed just. In the embodiment shown the

Recesses each equally spaced on each of the mounting sides 11, 12 and arranged offset on the second mounting side 12 in comparison to the first mounting side 11 by half a distance. The distance between two adjacent depressions on the mounting sides is in the present embodiment at least 2 cm. Thereby, and by the staggered arrangement can be avoided that first and second semiconductor light elements 31, 32 directly adjacent to each other, ie in particular in a same

Cross-sectional plane, are arranged to each other, causing the

Formation of a high local heat development can be avoided.

The first and the second mounting side 11, 12 are arranged facing away from each other, wherein indicated in Figures 1B and IC surface normals 41, 42 of the first and second mounting surfaces 21, 22 form an angle of 180 ° with each other, resulting in a radiation of the first and second semiconductor light elements 31, 32 results in the opposite direction.

For electrical contact or for

electrical connection of the semiconductor light elements 31, 32, these are arranged on printed circuit boards 6 within the wells. The printed circuit boards 6 can, as described in the general part, be interconnected, so that a simultaneous control of the first Halbleitleuchtelemente 31 and a simultaneous activation of the second

Semiconductor lighting elements 32 is possible.

Furthermore, the illumination device 100 can have electrical connections as well as a holding device, for example in the form of a lamp cap or a suspension attachment (not shown), via which at the same time also

electrical supply lines can be provided.

Furthermore, the illumination device 100 can be arranged at the ends arranged in the main extension direction 99, respectively

Have connecting elements or plug-in elements (not shown), by means of which, for example, a plurality of lighting devices 100 can be connected together to form a light stick and operated simultaneously.

The illumination device 100 in the shown

Exemplary embodiment is designed purely as an example on the first mounting side 11 as direct illumination and on the second mounting side 12 as indirect lighting. For this purpose, the illumination device 100 purely by way of example as the first semiconductor light elements 31 described in the general part described cold white emitting light emitting diodes, while the second semiconductor light elements 32 are formed as warm white emitted light emitting diodes. The light emitting diodes are included

Surface mount on the circuit boards 6, so easy mounting and a simple electrical

Connection of this result. Alternatively, 11 warm white emitting on the first mounting side

Semiconductor lighting elements 31 and on the second mounting side 12 cold white emitting semiconductor light emitting elements 32nd

be used. Furthermore, it is also possible, as described in the general part, semiconductor light elements 31, 32nd to use on at least one mounting side 11, 12, each having a plurality of semiconductor chips, each emitting different colored light, so that a variable adjustability and controllability of the emitted light or its light color may be possible.

In particular, it is also possible that the individual semiconductor light elements 31, 32 as groups of light

emitting diodes, so-called LED clusters, are formed, which are formed of a plurality of individual LEDs. To achieve a uniform radiation in terms of light intensity and light color, are the first

Semiconductor lighting elements 31 each formed the same and the second Halbleitleuchtelemente 32 each formed the same. However, the first and second

Semiconductor lighting elements 31, 32 in terms of their design and, as already described, in terms of their

radiated light color be different from each other. The recesses forming the first and second mounting surfaces 21, 22 are provided with vertical side surfaces, whereby a high compactness of the illumination device 100 can be achieved. The recesses of the first mounting surfaces 21 are formed with respect to their shape, width and height such that the first

Semiconductor LEDs 31 radiated light only in an angular range of at most 65 °, and preferably of at most 45 ° measured to the surface normal 41 of the first mounting surfaces 21 can be radiated directly while light, which is radiated at larger angles from the first semiconductor light elements 31, shaded by the side surfaces becomes. Furthermore, the side surfaces of the recesses on the first and / or second mounting side 11, 12 may also be reflective be formed and in particular have a specular reflectivity. Alternative to the shown

Embodiment, the side surfaces also inclined or obliquely to the mounting surfaces 21, 22nd

be formed so that the side of the

Semiconductor lighting elements 31, 32 radiated light in

Direction of the respective main emission along the surface normals 41, 42 can be deflected. The recesses of the second mounting surfaces 22 are executed in the illustrated embodiment such that the entire light or preferably light in the range of a maximum of 90 ° relative to the surface normal 42 of the second mounting surfaces can be radiated without contact or direct irradiation on the side surfaces. This makes it possible to achieve a homogeneous emission characteristic for the second mounting side 12 designed as indirect illumination in the embodiment shown. The illumination device 100 according to the one shown

Embodiment can meet in particular the requirements for glare-free, direct and indirect lighting, high luminaire efficiency and lighting efficiency of direct lighting and a compact design.

Furthermore, for example within the recesses or over the recesses and in particular also over the first and / or the second mounting side 11, 12 a

structured cover plate and / or an optical diffuser be arranged.

In the following figures are modifications of the

Embodiment according to the figures 1A to IC shown, so that the following description is limited mainly to the differences from the embodiment described in connection with FIGS. 1A to 1C. FIG. 2 shows a part of a lighting device 101 which is shown on a mounting side in FIG

Embodiment of the first mounting side 11, first formed by recesses mounting surfaces 21, whose side surfaces are formed as reflectors. Furthermore, the first semiconductor light-emitting elements 31 are at mutually different positions on the respective first

Mounting surfaces 21 disposed within the respective recesses. This can be an asymmetric

Radiation characteristic or an accurate

Setting the desired radiation characteristics of the first mounting side 11 shown in the present case reach, with this no additional optical

Components such as lenses or additional reflectors are needed.

FIGS. 3A and 3B show a further exemplary embodiment of a lighting device 102, wherein the

Figures 3A and 3B are sections taken along the

Main extension direction 99 of the lighting device corresponding to the sections of Figures 1B and IC.

The lighting device 102 has, in addition to the first and second mounting side 11, 12, a third mounting side 13, wherein the first, the second and the third mounting side 11, 12, 13 are arranged facing away from each other. in the

The embodiment shown embodiment, the surface normals 41, 42, 43 of the first, second and third mounting surfaces 21, 22, 23 of the first, second and third mounting side 11, 12, 13 to each other at an angle of about 120 °

arranged. Alternatively, the second and third mounting sides 12, 13 may also be arranged such that the second and third semiconductor light emitting elements 32, 33 can radiate at an angle of 0 ° to 45 ° to a horizontal.

The support body 1 of the illumination device 103 of the embodiment shown in FIGS. 3A and 3B has three rod-shaped part bodies 51, 52, 53, each of which has a partially round cross section with flattened side surfaces 50 on which the part bodies 51, 52, 53 are arranged against one another. In the first mounting surfaces 21 formed by depressions and uniformly spaced along the main extension direction are first

Semiconductor lighting elements 31 arranged, which are designed as warm white emitting LEDs. The second and third semiconductor light elements 32, 33 inserted in the through

Wells formed along the

Main extension direction of the illumination device 103 and the support body 1 arranged second and third mounting surfaces 22, 23 are arranged, each have clusters of blue, greenish-white and red LEDs. In this case, the second and third semiconductor light elements 32, 33 are each formed the same.

While the first Halbleiterleuchtelemente 31 so that the first mounting side 11 of the illumination device 103 are provided for direct illumination, the

Semiconductor lighting elements 32, 33 provided on the second and third mounting side 12, 13 for indirect illumination. Their design as multi-colored LED clusters makes it possible to change the light color of the indirect lighting for example along the white curve of a Planck 'blackbody radiator or with different,

adjust adjustable color and light impressions. Optionally it is possible to use the second and third

Semiconductor lighting elements 32, 33 a reflector,

in particular a diffuse reflector, nachordnen, as indicated by the reference numeral 7. This allows a good mixing of the second and third

Semiconductor lighting elements 32, 33 emitted light can be achieved.

Alternatively or additionally, the embodiments shown in connection with FIGS. 1A to 3B can be used for

Lighting devices also other or other features according to those described above in the general part

Out of leadership forms have.

The invention is not limited by the description based on the embodiments of these. Rather, the invention includes every new feature and every combination of features, which in particular includes any combination of features i the claims, even if this feature or this combination itself is not explicitly in the

Claims or embodiments is given.

Claims

claims

1. Lighting device comprising

a rod-shaped carrier body (1) with at least one

first and a second mounting side (11, 12) and a

Main extension direction (99),

first semiconductor light elements (31) on first mounting surfaces

(21) the first mounting side (11) and

second semiconductor light elements (32) on second

Mounting surfaces (22) of the second mounting side (12), wherein the first and the second mounting side (11, 12)

facing away from each other,

wherein the mounting surfaces (21, 22) through along the

Main extension direction (99) spaced recesses in the mounting sides (11, 12) are formed and

wherein the first semiconductor light elements (31) are equal to one another and the second semiconductor light elements (32) are equal to one another.

2. Lighting device according to claim 1, wherein the

Carrier body (1) at least two rod-shaped part body (51, 52) each having a partially circular cross section and each having at least one flattened side (50) and the part body (51, 52) with the

flattened sides (50) are arranged together.

3. Lighting device according to one of the previous

Claims, wherein the semiconductor light elements (31, 32) each on a circuit board (6) on the

Mounting surfaces (21, 22) are arranged. Lighting device according to one of the previous

Claims, wherein the semiconductor light elements (31, 32) of a mounting side (11, 12) to each other

different positions on the respective

Mounting surfaces (21, 22) are arranged.

Lighting device according to one of the previous

Claims, where the distances between the first

Mounting surfaces (21) are equal to the distances between the second mounting surfaces (22) and the first and second mounting surfaces (21, 22) are arranged offset from each other.

Lighting device according to one of the previous

Claims, wherein the recesses of the first and / or the second mounting surfaces (21, 22) have reflective side surfaces.

Lighting device according to one of the previous

Claims, wherein the depressions of the first

Mounting surfaces (21) a shape, width and depth

so that the light from the first

Semiconductor lighting elements (31) with an angle of less than or equal to 65 °, more preferably less than or equal to 45 °, to the surface normal (41) of the respective first mounting surface (21) is emitted during operation.

Lighting device according to one of claims 1 to 7, wherein the recesses of the second mounting surfaces (22) have a shape, width and depth, so that the entire radiated from the second Halbleitleuchtelementen (32) in operation light is emitted directly. Lighting device according to one of claims 1 to 7, wherein the recesses of the second mounting surfaces (22) have a shape, width and depth, so that the light from the second Halbleitleuchtelementen (32) with an angle of less than or equal to 90 °

Surface normals (42) of the respective second

Mounting surface (22) is emitted during operation.

Lighting device according to one of the previous

Claims, wherein the first Halbleiterleuchtelemente (31) in each recess of the first mounting surface (21) and / or the second Halbleitleuchtelemente (32) in each recess of the second mounting surface (22) each exactly one light-emitting semiconductor chip

exhibit .

Lighting device according to one of the previous

Claims, wherein the first Halbleiterleuchtelemente (31) and / or the second Halbleiterleuchtelemente (32) each having a plurality of light-emitting

Have semiconductor chips.

Lighting device according to one of the previous

Claims, wherein the first and second

Semiconductor lighting elements (31, 32) from each other

radiate different colored light.

Lighting device according to one of the previous

Claims, wherein the carrier body (1) has a third

Mounting side (13) with third Halbleitleuchtelementen (33) along along the main extension direction

arranged third formed by depressions

Mounting surfaces (23) and the first, second and third mounting side (11, 12, 13) are each facing away from each other.

14. Lighting device according to claim 13, wherein the second and third semiconductor light-emitting elements (32, 33) are of similar design.

15. Lighting device according to one of the previous

Claims, wherein the second mounting side (12) in the emission direction of the second Halbleitleuchtelemente

(32) a reflector (7) is arranged downstream.