EP2691688A1 - Spritzguss-lampenkörper mit keramischen kühlern und leds - Google Patents
Spritzguss-lampenkörper mit keramischen kühlern und ledsInfo
- Publication number
- EP2691688A1 EP2691688A1 EP12715636.2A EP12715636A EP2691688A1 EP 2691688 A1 EP2691688 A1 EP 2691688A1 EP 12715636 A EP12715636 A EP 12715636A EP 2691688 A1 EP2691688 A1 EP 2691688A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- ceramic
- radiator
- unit according
- leds
- metallization
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
- F21S2/005—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction of modular construction
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/86—Ceramics or glass
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/56—Cooling arrangements using liquid coolants
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2105/00—Planar light sources
- F21Y2105/10—Planar light sources comprising a two-dimensional [2D] array of point-like light-generating elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2113/00—Combination of light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Definitions
- the invention relates to a light unit with LED's for lamps.
- Large-format luminaires with neon tubes or bulbs as bulbs are known, for example, in building and street lighting.
- a disadvantage is their short life, because the heat generated by the LED ' s is not dissipated well enough, so that it can lead to thermal overload.
- each individual LED must be attached separately at their installation site.
- the invention has for its object to improve a lighting unit with LED ' s for lamps in terms of their life and installation costs. According to the invention, this object is solved by the features of claim 1.
- each radiator bulb component consists of a ceramic carrier body having sintered metallization on one or more of its surfaces and the metallization regions forming a circuit board to which one or more LED's is electrically conductively connected / are a lighting unit is provided having a good due to the metallization Wäremeabschreib in the ceramic, resulting in a long lifetime.
- the assembly effort is considerably simplified because the entire light unit composed only of identical radiator-Leuchtstoff-Bausteinenen that are connected to clusters. It therefore does not need to be mounted separately each cooler-light bulb module.
- the ceramic carrier body are integrally provided with ceramic heat-dissipating cooling elements, such as cooling fins. About this cooling elements, the heat is dissipated.
- Each individual radiator illuminant block is carrier of one or more LED's and at the same time contains a cooling device in the form of cooling elements. The generated heat of the LEDs is directed through the metallization to the ceramic of the support body and from there to the cooling elements.
- Each radiator-bulb component is thus self-sufficient in terms of heat dissipation.
- the ceramic carrier bodies form a ceramic cooling box, which contains a cavity, which can be cooled by a coolant, and the sintered metallization regions are arranged on the cooling box. This is among other things always advantageous if a liquid coolant is available, which can be introduced into the cavity of the cooler.
- the LEDs with the metallization of an adhesive bond or a heat-conducting, with solder for example, a low-melting solder SbSn
- solder for example, a low-melting solder SbSn
- the ease of installation is preferably improved by the fact that the individual radiator-lamp components are encapsulated positively to form the cluster with plastic such as PE, PP or polyacrylate.
- the individual clusters can be arranged in a plastic molded housing, which then forms the lighting unit.
- the clusters have mounting positions, such as holes, which makes it easy to mount the clusters.
- a lighting unit is thus proposed which consists of individual identically designed radiator-light-emitting modules. On each of these, the LEDs via an adhesive connection or, even better heat-conducting, with solder (for example, a low-melting solder SbSn) are connected.
- solder for example, a low-melting solder SbSn
- Several of these cooler-light-emitting devices are connected in clusters, each cluster has its mounting positions.
- One or more clusters may be fixed or interchangeable in a plastic mold housing.
- Ceramic support bodies which are integrally provided with ceramic heat-dissipating cooling elements, such as cooling fins.
- Sintered metallization regions are arranged on the carrier body or on one or more of its surfaces. This metallization forming a circuit board on soft the LEDs applied, are soldered, for example. Instead of the ceramic
- the ceramic carrier body can also form a ceramic cooling box, which includes a cavity which is cooled by a coolant.
- the sintered metallization regions are on the cooler then arranged, forming a board on which the LEDs are soldered, for example, 's.
- cooler-illuminant components into clusters can preferably take place by injection molding, in which the inserted cooler-illuminant components are molded around in a mold with plastic, such as PE, PP or polyacrylate.
- the electrical leads can run inside or outside the plastic.
- necessary controls of the LED ' s can be placed anywhere on the radiator bulbs or in the plastic.
- a plurality of radiator-lamp components are connected to form a cluster and fixedly or interchangeably arranged in a plastic molded case or molded with plastic such as PE, PP or polyacrylate.
- the entire structure of the light unit with LED's, cooler and perhaps especially designtem plastic construction including, for example, a lamp cover is simple and requires little installation effort.
- the cooler-illuminant devices can point in different directions in the clusters to illuminate a large solid angle. They can also be arranged spatially separated in a plastic frame to reduce the impression of strong point brightness. Simplified is the structure of ensembles consisting of several modules. Clusters can be formed which considerably simplify the mechanical assembly work. The invention will be further explained with reference to figures.
- FIG. 1 shows 16 individual cooler-light source modules 3.
- Each cooler-light-emitting module 3 consists of a ceramic carrier body 1, which is integrally provided with ceramic cooling elements 4, here cooling fins. Sintered metallization regions are arranged on each of the cooler-light source modules 3 or on one or more of its surfaces.
- Metallization areas form a board onto which the LED ' s 2 are soldered.
- the LED or the LED is shown 's, but only the location at which the LED is mounted.
- FIG. 2 shows four clusters 5, which each contain four radiator-light-emitting device modules 3. Either the four radiator-lamp components 3 are inserted into a frame 7 made of plastic or preferably encapsulated by a plastic.
- each cluster For mounting 5 four mounting positions 6 are arranged at each cluster, with which the four clusters 5 and sixteen radiator-lamp components 3 can be connected to a light unit or lamp.
- FIG. 3 shows a single radiator-light-emitting module 3 with a carrier body 1, which is connected in one piece with cooling elements 4, here cooling fins.
- cooling elements 4 here cooling fins.
- On the support body 1 sintered metallization regions 9 are arranged, with which an LED 2 is connected.
- a frame 8 with mounting positions 6, the radiator-lamp blocks 3 are to be attached.
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Led Device Packages (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Devices That Are Associated With Refrigeration Equipment (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
Abstract
Description
Claims
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102011006339 | 2011-03-29 | ||
| PCT/EP2012/055401 WO2012130838A1 (de) | 2011-03-29 | 2012-03-27 | Spritzguss-lampenkörper mit keramischen kühlern und leds |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| EP2691688A1 true EP2691688A1 (de) | 2014-02-05 |
| EP2691688B1 EP2691688B1 (de) | 2015-08-19 |
Family
ID=45992202
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP12715636.2A Not-in-force EP2691688B1 (de) | 2011-03-29 | 2012-03-27 | Spritzguss-lampenkörper mit keramischen kühlern und leds |
Country Status (11)
| Country | Link |
|---|---|
| US (1) | US20140009946A1 (de) |
| EP (1) | EP2691688B1 (de) |
| JP (1) | JP2014509774A (de) |
| KR (1) | KR20140016336A (de) |
| CN (1) | CN103547850A (de) |
| BR (1) | BR112013024771A2 (de) |
| DE (1) | DE102012204851A1 (de) |
| PH (1) | PH12013501880A1 (de) |
| RU (1) | RU2013147870A (de) |
| TW (1) | TW201307742A (de) |
| WO (1) | WO2012130838A1 (de) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015078904A1 (de) * | 2013-11-27 | 2015-06-04 | Ceramtec Gmbh | Vergossenes led-modul mit keramikplatine und treibermodul für netzspannung |
| EP3123842A1 (de) * | 2014-03-28 | 2017-02-01 | CeramTec GmbH | Haftfeste schicht auf keramik und/oder lötstopplack als schutzlack oder vergussmasse |
| US11339933B2 (en) * | 2019-11-06 | 2022-05-24 | Open Platform Systems Llc | Universal LED fixture mount kit |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5660461A (en) * | 1994-12-08 | 1997-08-26 | Quantum Devices, Inc. | Arrays of optoelectronic devices and method of making same |
| US6385047B1 (en) * | 1999-12-06 | 2002-05-07 | Cool Shield, Inc. | U-shaped heat sink assembly |
| JP4548219B2 (ja) * | 2005-05-25 | 2010-09-22 | パナソニック電工株式会社 | 電子部品用ソケット |
| TWI449137B (zh) * | 2006-03-23 | 2014-08-11 | 製陶技術創新製陶工程股份公司 | 構件或電路用的攜帶體 |
| TWI301047B (en) * | 2006-07-28 | 2008-09-11 | Delta Electronics Inc | Light-emitting heat-dissipating device and manufacturing method thereof |
| CN201021764Y (zh) * | 2007-02-14 | 2008-02-13 | 姚志峰 | 一种组合式发光光源 |
| WO2008128945A1 (de) * | 2007-04-24 | 2008-10-30 | Ceramtec Ag | Bauteil mit einem keramischen körper mit metallisierter oberfläche |
| EP2535928A3 (de) * | 2007-04-26 | 2014-08-20 | CeramTec GmbH | Kühldose für Bauelemente oder Schaltungen |
| US8206009B2 (en) * | 2007-09-19 | 2012-06-26 | Cooper Technologies Company | Light emitting diode lamp source |
| CN201382279Y (zh) * | 2009-01-24 | 2010-01-13 | 郑深全 | 陶瓷半导体热电冷却led |
| DE102009029839A1 (de) * | 2009-04-03 | 2010-10-07 | Osram Opto Semiconductors Gmbh | Leuchtmittel und Lampe mit einem solchen Leuchtmittel |
| WO2010150366A1 (ja) * | 2009-06-24 | 2010-12-29 | Necディスプレイソリューションズ株式会社 | 光源装置およびこれを備えた投写型表示装置 |
| TWM378614U (en) * | 2009-06-29 | 2010-04-11 | Te-Lung Chen | The ceramic radiator with conductive circuit |
| TWI525287B (zh) * | 2009-10-27 | 2016-03-11 | 製陶技術股份有限公司 | 由具有led的可變規模的陶瓷二極體載體構成的陣列 |
| CN201561381U (zh) * | 2009-10-30 | 2010-08-25 | 林良寿 | 一体化led陶瓷灯杯 |
| CN101846300A (zh) * | 2010-04-16 | 2010-09-29 | 江苏尚恩光电科技有限公司 | 一种led灯具的蜂窝型散热装置 |
| US9494370B2 (en) * | 2010-12-09 | 2016-11-15 | GeramTec GmbH | Homogeneous liquid cooling of LED array |
| US8974077B2 (en) * | 2012-07-30 | 2015-03-10 | Ultravision Technologies, Llc | Heat sink for LED light source |
-
2012
- 2012-03-27 CN CN201280016155.3A patent/CN103547850A/zh active Pending
- 2012-03-27 WO PCT/EP2012/055401 patent/WO2012130838A1/de not_active Ceased
- 2012-03-27 PH PH1/2013/501880A patent/PH12013501880A1/en unknown
- 2012-03-27 EP EP12715636.2A patent/EP2691688B1/de not_active Not-in-force
- 2012-03-27 KR KR1020137027184A patent/KR20140016336A/ko not_active Withdrawn
- 2012-03-27 DE DE102012204851A patent/DE102012204851A1/de not_active Withdrawn
- 2012-03-27 RU RU2013147870/07A patent/RU2013147870A/ru not_active Application Discontinuation
- 2012-03-27 JP JP2014501576A patent/JP2014509774A/ja active Pending
- 2012-03-27 US US14/005,438 patent/US20140009946A1/en not_active Abandoned
- 2012-03-27 BR BR112013024771-1A patent/BR112013024771A2/pt not_active Application Discontinuation
- 2012-03-29 TW TW101110943A patent/TW201307742A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| WO2012130838A1 (de) | 2012-10-04 |
| DE102012204851A1 (de) | 2012-10-04 |
| EP2691688B1 (de) | 2015-08-19 |
| PH12013501880A1 (en) | 2013-10-14 |
| TW201307742A (zh) | 2013-02-16 |
| BR112013024771A2 (pt) | 2019-08-13 |
| CN103547850A (zh) | 2014-01-29 |
| JP2014509774A (ja) | 2014-04-21 |
| RU2013147870A (ru) | 2015-05-10 |
| KR20140016336A (ko) | 2014-02-07 |
| US20140009946A1 (en) | 2014-01-09 |
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