EP2633746A4 - Verbundfolie für eine emi-abschirmung auf plattenebene - Google Patents
Verbundfolie für eine emi-abschirmung auf plattenebene Download PDFInfo
- Publication number
- EP2633746A4 EP2633746A4 EP11836909.9A EP11836909A EP2633746A4 EP 2633746 A4 EP2633746 A4 EP 2633746A4 EP 11836909 A EP11836909 A EP 11836909A EP 2633746 A4 EP2633746 A4 EP 2633746A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- composite film
- emi shielding
- board level
- level emi
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002131 composite material Substances 0.000 title 1
Classifications
-
- G—PHYSICS
- G21—NUCLEAR PHYSICS; NUCLEAR ENGINEERING
- G21F—PROTECTION AGAINST X-RADIATION, GAMMA RADIATION, CORPUSCULAR RADIATION OR PARTICLE BOMBARDMENT; TREATING RADIOACTIVELY CONTAMINATED MATERIAL; DECONTAMINATION ARRANGEMENTS THEREFOR
- G21F1/00—Shielding characterised by the composition of the materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0088—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Electromagnetism (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- High Energy & Nuclear Physics (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Laminated Bodies (AREA)
- Non-Insulated Conductors (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US40670510P | 2010-10-26 | 2010-10-26 | |
PCT/US2011/057418 WO2012058131A2 (en) | 2010-10-26 | 2011-10-24 | Composite film for board level emi shielding |
Publications (3)
Publication Number | Publication Date |
---|---|
EP2633746A2 EP2633746A2 (de) | 2013-09-04 |
EP2633746A4 true EP2633746A4 (de) | 2017-11-29 |
EP2633746B1 EP2633746B1 (de) | 2023-07-19 |
Family
ID=45994675
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP11836909.9A Active EP2633746B1 (de) | 2010-10-26 | 2011-10-24 | Verbundfolie für eine emi-abschirmung auf plattenebene |
Country Status (8)
Country | Link |
---|---|
US (1) | US8847184B2 (de) |
EP (1) | EP2633746B1 (de) |
JP (2) | JP6082696B2 (de) |
KR (1) | KR101584872B1 (de) |
CN (1) | CN103190209B (de) |
FI (1) | FI2633746T3 (de) |
TW (1) | TWI507120B (de) |
WO (1) | WO2012058131A2 (de) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9678499B2 (en) | 2012-06-27 | 2017-06-13 | Mitsubishi Electric Research Laboratories, Inc. | Method for controlling redundantly actuated machines for cutting a pattern of disconnected contours |
TWI573523B (zh) * | 2014-04-10 | 2017-03-01 | Joinsoon Electronic Manufacturing Co Ltd | Prevention and control of electrical signals are disturbed by the method and its circuit structure |
JP6190528B2 (ja) * | 2014-06-02 | 2017-08-30 | タツタ電線株式会社 | 導電性接着フィルム、プリント回路基板、及び、電子機器 |
KR102314774B1 (ko) | 2014-11-26 | 2021-10-21 | 삼성전자주식회사 | 반도체 패키지 |
US9635789B2 (en) | 2015-01-30 | 2017-04-25 | Laird Technologies, Inc. | Board level electromagnetic interference (EMI) shields with increased under-shield space |
KR101862121B1 (ko) * | 2015-02-02 | 2018-05-29 | 토요잉크Sc홀딩스주식회사 | 전자파 차폐 시트, 프린트 배선판 및 전자 기기 |
EP3075798A1 (de) * | 2015-04-01 | 2016-10-05 | Ronald R. Savin | Beschichtungszusammensetzungen |
CN208791533U (zh) | 2015-06-12 | 2019-04-26 | 新格拉夫解决方案有限责任公司 | 复合物制品、制品以及服装 |
US9968004B2 (en) | 2015-09-25 | 2018-05-08 | Laird Technologies, Inc. | Thermal interface materials including electrically-conductive material |
US11189420B2 (en) | 2016-03-31 | 2021-11-30 | Neograf Solutions, Llc | Noise suppressing assemblies |
JP6528733B2 (ja) | 2016-06-21 | 2019-06-12 | 株式会社デンソー | エジェクタ式冷凍サイクル |
US10080317B2 (en) | 2016-06-29 | 2018-09-18 | Microsoft Technology Licensing, Llc | Polymeric electromagnetic shield for electronic components |
TWI619561B (zh) * | 2016-07-28 | 2018-04-01 | Rotating target | |
US10477738B2 (en) | 2017-03-06 | 2019-11-12 | Laird Technologies, Inc. | Board level shields and systems and methods of applying board level shielding |
KR20190076250A (ko) | 2017-12-22 | 2019-07-02 | 삼성전자주식회사 | 반도체 패키지 및 반도체 모듈 |
KR102616814B1 (ko) * | 2018-03-09 | 2023-12-21 | 삼성전자주식회사 | 반도체 패키지 및 반도체 모듈 |
CN111972051A (zh) | 2018-03-16 | 2020-11-20 | 华为技术有限公司 | 用于电磁干扰屏蔽的组件及方法 |
KR102075669B1 (ko) * | 2018-10-26 | 2020-02-10 | 오재숙 | 신호 전송 커넥터 및 그 제조방법 |
KR102521564B1 (ko) * | 2021-01-14 | 2023-04-12 | 성균관대학교산학협력단 | 방열 및 전자파 차폐 복합재료, 이를 구비하는 전자 소자 패키지 및 이의 제조방법 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20030079893A1 (en) * | 2001-01-25 | 2003-05-01 | Osamu Hashimoto | Electric-wave absorber |
US20030142482A1 (en) * | 2002-01-29 | 2003-07-31 | 3Com Corporation | Integrated shield wrap |
WO2006124694A1 (en) * | 2005-05-13 | 2006-11-23 | 3M Innovative Properties Company | Electrically conductive polymer resin and method for making same |
WO2007123645A2 (en) * | 2006-03-28 | 2007-11-01 | Parker-Hannifin Corporation | Dispensable cured resin |
WO2008146014A2 (en) * | 2007-06-01 | 2008-12-04 | Hexcel Composites Limited | Improved structural adhesive materials |
EP2131642A1 (de) * | 2007-03-29 | 2009-12-09 | Kabushiki Kaisha Asahi Rubber | Elektromagnetische abschirmfolie und rfid-platte |
JP2009290103A (ja) * | 2008-05-30 | 2009-12-10 | Tatsuta System Electronics Kk | 電磁波シールド材及びプリント配線板 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3157344B2 (ja) * | 1993-04-27 | 2001-04-16 | 三洋電機株式会社 | 導電シート及び表示器の製造方法 |
US5639989A (en) | 1994-04-19 | 1997-06-17 | Motorola Inc. | Shielded electronic component assembly and method for making the same |
JPH087658A (ja) * | 1994-06-22 | 1996-01-12 | Hitachi Chem Co Ltd | 異方導電性接着フィルム |
US6900383B2 (en) | 2001-03-19 | 2005-05-31 | Hewlett-Packard Development Company, L.P. | Board-level EMI shield that adheres to and conforms with printed circuit board component and board surfaces |
US20060225874A1 (en) * | 2005-04-11 | 2006-10-12 | Shives Gary D | Sandwiched thermal article |
US20060247352A1 (en) * | 2005-04-29 | 2006-11-02 | Ariel - University Research And Development Ltd. | EMI shielding material |
JP4319167B2 (ja) | 2005-05-13 | 2009-08-26 | タツタ システム・エレクトロニクス株式会社 | シールドフィルム、シールドプリント配線板、シールドフレキシブルプリント配線板、シールドフィルムの製造方法及びシールドプリント配線板の製造方法 |
JP2007073547A (ja) * | 2005-09-02 | 2007-03-22 | Yuji Suda | 電子部品の加圧装置 |
JP4914262B2 (ja) * | 2006-03-29 | 2012-04-11 | タツタ電線株式会社 | シールドフィルム及びシールドプリント配線板 |
JP2007324161A (ja) * | 2006-05-30 | 2007-12-13 | Yuji Suda | ビルドアップ多層配線板の製造方法 |
JP5129935B2 (ja) * | 2006-06-13 | 2013-01-30 | 日東電工株式会社 | シート状複合材料及びその製造方法 |
JP5487419B2 (ja) * | 2008-02-12 | 2014-05-07 | タツタ電線株式会社 | 導電性接着シート及びそれを備えた配線板、導電性接着シートの製造方法 |
KR20120037464A (ko) * | 2009-06-12 | 2012-04-19 | 로오드 코포레이션 | 전자파 장애로부터 기판을 차폐하는 방법 |
KR101332362B1 (ko) | 2012-09-21 | 2013-12-02 | 재단법인 철원플라즈마 산업기술연구원 | 나노금속―그래핀을 이용한 열 확산기 및 이의 제조방법 |
-
2011
- 2011-10-24 JP JP2013536689A patent/JP6082696B2/ja active Active
- 2011-10-24 WO PCT/US2011/057418 patent/WO2012058131A2/en active Application Filing
- 2011-10-24 EP EP11836909.9A patent/EP2633746B1/de active Active
- 2011-10-24 FI FIEP11836909.9T patent/FI2633746T3/fi active
- 2011-10-24 KR KR1020137013255A patent/KR101584872B1/ko active IP Right Grant
- 2011-10-24 CN CN201180051609.6A patent/CN103190209B/zh active Active
- 2011-10-25 TW TW100138733A patent/TWI507120B/zh active
-
2013
- 2013-03-13 US US13/798,895 patent/US8847184B2/en active Active
-
2016
- 2016-02-26 JP JP2016035811A patent/JP2016122859A/ja not_active Withdrawn
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20030079893A1 (en) * | 2001-01-25 | 2003-05-01 | Osamu Hashimoto | Electric-wave absorber |
US20030142482A1 (en) * | 2002-01-29 | 2003-07-31 | 3Com Corporation | Integrated shield wrap |
WO2006124694A1 (en) * | 2005-05-13 | 2006-11-23 | 3M Innovative Properties Company | Electrically conductive polymer resin and method for making same |
WO2007123645A2 (en) * | 2006-03-28 | 2007-11-01 | Parker-Hannifin Corporation | Dispensable cured resin |
EP2131642A1 (de) * | 2007-03-29 | 2009-12-09 | Kabushiki Kaisha Asahi Rubber | Elektromagnetische abschirmfolie und rfid-platte |
WO2008146014A2 (en) * | 2007-06-01 | 2008-12-04 | Hexcel Composites Limited | Improved structural adhesive materials |
JP2009290103A (ja) * | 2008-05-30 | 2009-12-10 | Tatsuta System Electronics Kk | 電磁波シールド材及びプリント配線板 |
Non-Patent Citations (1)
Title |
---|
See also references of WO2012058131A2 * |
Also Published As
Publication number | Publication date |
---|---|
CN103190209A (zh) | 2013-07-03 |
TW201228589A (en) | 2012-07-01 |
US8847184B2 (en) | 2014-09-30 |
KR20130132450A (ko) | 2013-12-04 |
EP2633746B1 (de) | 2023-07-19 |
JP2014502221A (ja) | 2014-01-30 |
WO2012058131A3 (en) | 2012-06-28 |
JP2016122859A (ja) | 2016-07-07 |
EP2633746A2 (de) | 2013-09-04 |
TWI507120B (zh) | 2015-11-01 |
FI2633746T3 (fi) | 2023-07-24 |
WO2012058131A2 (en) | 2012-05-03 |
CN103190209B (zh) | 2016-05-18 |
US20130207005A1 (en) | 2013-08-15 |
KR101584872B1 (ko) | 2016-01-13 |
JP6082696B2 (ja) | 2017-02-15 |
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