EP2620814A4 - Method for forming conductive pattern, conductive pattern substrate, and touch panel sensor - Google Patents

Method for forming conductive pattern, conductive pattern substrate, and touch panel sensor

Info

Publication number
EP2620814A4
EP2620814A4 EP12838597.8A EP12838597A EP2620814A4 EP 2620814 A4 EP2620814 A4 EP 2620814A4 EP 12838597 A EP12838597 A EP 12838597A EP 2620814 A4 EP2620814 A4 EP 2620814A4
Authority
EP
European Patent Office
Prior art keywords
conductive pattern
touch panel
panel sensor
substrate
forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP12838597.8A
Other languages
German (de)
French (fr)
Other versions
EP2620814A1 (en
EP2620814B1 (en
Inventor
Hiroshi Yamazaki
Yoshimi Igarashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of EP2620814A1 publication Critical patent/EP2620814A1/en
Publication of EP2620814A4 publication Critical patent/EP2620814A4/en
Application granted granted Critical
Publication of EP2620814B1 publication Critical patent/EP2620814B1/en
Not-in-force legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0445—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colourĀ 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colourĀ  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1343—Electrodes
    • G02F1/13439—Electrodes characterised by their electrical, optical, physical properties; materials therefor; method of making
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/092—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers characterised by backside coating or layers, by lubricating-slip layers or means, by oxygen barrier layers or by stripping-release layers or means
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/095—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having more than one photosensitive layer
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/095—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having more than one photosensitive layer
    • G03F7/0952—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having more than one photosensitive layer comprising silver halide or silver salt based image forming systems, e.g. for camera speed exposure
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/095—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having more than one photosensitive layer
    • G03F7/0955—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having more than one photosensitive layer one of the photosensitive systems comprising a non-macromolecular photopolymerisable compound having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2022—Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2022—Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure
    • G03F7/203—Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure comprising an imagewise exposure to electromagnetic radiation or corpuscular radiation
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0446—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04112—Electrode mesh in capacitive digitiser: electrode for touch sensing is formed of a mesh of very fine, normally metallic, interconnected lines that are almost invisible to see. This provides a quite large but transparent electrode surface, without need for ITO or similar transparent conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Structural Engineering (AREA)
  • Architecture (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Human Computer Interaction (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Nonlinear Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mathematical Physics (AREA)
  • Ceramic Engineering (AREA)
  • Optics & Photonics (AREA)
  • Electromagnetism (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Materials For Photolithography (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Position Input By Displaying (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
EP12838597.8A 2011-10-03 2012-10-01 Method for forming conductive pattern Not-in-force EP2620814B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011219176 2011-10-03
PCT/JP2012/075421 WO2013051516A1 (en) 2011-10-03 2012-10-01 Method for forming conductive pattern, conductive pattern substrate, and touch panel sensor

Publications (3)

Publication Number Publication Date
EP2620814A1 EP2620814A1 (en) 2013-07-31
EP2620814A4 true EP2620814A4 (en) 2014-01-15
EP2620814B1 EP2620814B1 (en) 2014-12-10

Family

ID=48043674

Family Applications (1)

Application Number Title Priority Date Filing Date
EP12838597.8A Not-in-force EP2620814B1 (en) 2011-10-03 2012-10-01 Method for forming conductive pattern

Country Status (8)

Country Link
US (3) US9052587B2 (en)
EP (1) EP2620814B1 (en)
JP (2) JP5257558B1 (en)
KR (2) KR101932778B1 (en)
CN (2) CN103210350B (en)
IN (1) IN2014DN03390A (en)
TW (2) TWI592994B (en)
WO (1) WO2013051516A1 (en)

Families Citing this family (43)

* Cited by examiner, ā€  Cited by third party
Publication number Priority date Publication date Assignee Title
CN103210350B (en) 2011-10-03 2019-06-18 ę—„ē«‹åŒ–ęˆę Ŗ式会ē¤¾ Method for forming conductive pattern, conductive pattern substrate, and touch panel sensor
WO2013084283A1 (en) 2011-12-05 2013-06-13 ę—„ē«‹åŒ–ęˆę Ŗ式会ē¤¾ Method for forming protective film for touch panel electrodes, photosensitive resin composition, and photosensitive element
WO2013084282A1 (en) 2011-12-05 2013-06-13 ę—„ē«‹åŒ–ęˆę Ŗ式会ē¤¾ Method for forming resin cured film pattern, photosensitive resin composition, and photosensitive element
WO2014196154A1 (en) * 2013-06-04 2014-12-11 ę—„ē«‹åŒ–ęˆę Ŗ式会ē¤¾ Photosensitive electroconductive film, method for forming electroconductive pattern using same, and electroconductive pattern substrate
JP6205925B2 (en) * 2013-07-12 2017-10-04 ę—„ē«‹åŒ–ęˆę Ŗ式会ē¤¾ Photosensitive conductive film, conductive pattern forming method using the same, and conductive pattern substrate
JP2015052774A (en) * 2013-08-07 2015-03-19 ę—„ē«‹åŒ–ęˆę Ŗ式会ē¤¾ Method for manufacturing resist pattern or conductive pattern on decorative substrate, and transfer type photosensitive conductive film
JP6071816B2 (en) * 2013-09-09 2017-02-01 åÆŒå£«ćƒ•ć‚¤ćƒ«ćƒ ę Ŗ式会ē¤¾ Manufacturing method of cured resin, solid-state imaging device using the same, and manufacturing method of liquid crystal display device
JP6206028B2 (en) * 2013-09-19 2017-10-04 ę—„ē«‹åŒ–ęˆę Ŗ式会ē¤¾ Manufacturing method of conductive pattern, conductive pattern substrate including conductive pattern manufactured by the method, touch panel sensor including the conductive pattern substrate, and photosensitive conductive film
JP6261258B2 (en) * 2013-09-26 2018-01-17 ļ¼®ļ½‰ļ½“ļ½“ļ½ˆļ½ę Ŗ式会ē¤¾ Transparent conductive support, touch sensor, and manufacturing method thereof
CN105593950B (en) * 2013-10-03 2018-04-13 ę—„ē«‹åŒ–ęˆę Ŗ式会ē¤¾ Photosensitive conductive film, used the photosensitive conductive film conductive pattern forming method and conductive pattern substrate
JP5858197B2 (en) * 2013-10-16 2016-02-10 ę—„ē«‹åŒ–ęˆę Ŗ式会ē¤¾ Laminated body including conductive fiber, photosensitive conductive film, method for manufacturing conductive pattern, conductive pattern substrate, and touch panel
TW201520840A (en) * 2013-11-26 2015-06-01 Henghao Technology Co Ltd Method of forming a touch panel
TWI567600B (en) * 2013-11-26 2017-01-21 ꁆ锄ē§‘ęŠ€č‚”ä»½ęœ‰é™å…¬åø Touch apparatus
CN104571672B (en) * 2013-11-27 2018-05-08 北äŗ¬äŗ¬äøœę–¹å…‰ē”µē§‘ęŠ€ęœ‰é™å…¬åø A kind of touch-screen and preparation method thereof
WO2015137278A1 (en) * 2014-03-14 2015-09-17 ę—„ē«‹åŒ–ęˆę Ŗ式会ē¤¾ Photosensitive conductive film
JP2015219308A (en) * 2014-05-15 2015-12-07 ę—„ē«‹åŒ–ęˆę Ŗ式会ē¤¾ Photosensitive conductive film, photosensitive conductive laminate, conductive film forming method, and conductive laminate
TWI557610B (en) * 2014-05-30 2016-11-11 And a method of manufacturing a conductive substrate of a touch device
CN104345967A (en) * 2014-05-31 2015-02-11 ę·±åœ³åø‚éŖč¾¾å…‰ē”µč‚”ä»½ęœ‰é™å…¬åø Sensing component for touch screens, preparation method of sensing component and touch screen
WO2016006024A1 (en) * 2014-07-07 2016-01-14 ę—„ē«‹åŒ–ęˆę Ŗ式会ē¤¾ Photosensitive conductive film, conductive film set and method of manufacturing surface protection film and base film having conductive pattern using same, and method of manufacturing base film having conductive pattern
CN106662811A (en) * 2014-07-24 2017-05-10 ę—„ē«‹åŒ–ęˆę Ŗ式会ē¤¾ Photosensitive resin composition, photosensitive film, pattern substrate, photosensitive conductive film, and conductive pattern substrate
JP2016031503A (en) * 2014-07-30 2016-03-07 ę—„ē«‹åŒ–ęˆę Ŗ式会ē¤¾ Method for forming conductive pattern, conductive pattern substrate, and touch panel sensor
KR102218718B1 (en) * 2014-10-10 2021-02-19 ģ—˜ģ§€ģ „ģž ģ£¼ģ‹ķšŒģ‚¬ Conductive film and method for manufacturing the same, and touch panel and display apparatus including the conductive film
CN104754263A (en) * 2014-11-26 2015-07-01 ęŽę­£ęµ© Novel intelligent digital screen
US9853070B2 (en) 2014-12-09 2017-12-26 Sharp Kabushiki Kaisha Method of manufacturing display panel substrate
JP6027633B2 (en) 2015-01-13 2016-11-16 ę—„ęœ¬å†™ēœŸå°åˆ·ę Ŗ式会ē¤¾ Method for manufacturing touch input sensor and photosensitive conductive film
KR102297878B1 (en) * 2015-01-16 2021-09-03 ģ‚¼ģ„±ė””ģŠ¤ķ”Œė ˆģ“ ģ£¼ģ‹ķšŒģ‚¬ Touch panel and method of manufacturing the same
TWI629619B (en) * 2015-02-27 2018-07-11 č—¤å€‰č‚”ä»½ęœ‰é™å…¬åø Touching the wiring harness for the detector, the brush the wiring board for the detector, and the detector
WO2016181496A1 (en) * 2015-05-12 2016-11-17 ę—„ē«‹åŒ–ęˆę Ŗ式会ē¤¾ Elctroconductive-film-forming liquid set, method for forming electroconductive pattern, and touch panel
JP6042486B1 (en) * 2015-05-29 2016-12-14 ę—„ęœ¬å†™ēœŸå°åˆ·ę Ŗ式会ē¤¾ Touch sensor manufacturing method and touch sensor
JP6457897B2 (en) * 2015-07-17 2019-01-23 ļ¼®ļ½‰ļ½“ļ½“ļ½ˆļ½ę Ŗ式会ē¤¾ Touch input sensor and manufacturing method thereof
JP2017201350A (en) * 2016-05-02 2017-11-09 ę—„ē«‹åŒ–ęˆę Ŗ式会ē¤¾ Photosensitive conductive film, method for forming conductive pattern, and method for producing conductive pattern substrate
CN107540862B (en) * 2016-06-27 2020-08-11 ęø…华大学 Preparation method of carbon nano tube composite structure
CN106324932B (en) * 2016-10-09 2019-11-22 äøŠęµ·äø­čˆŖ光ē”µå­ęœ‰é™å…¬åø Display panel and display device including same
CN107092901B (en) * 2017-06-02 2020-04-03 äŗ¬äøœę–¹ē§‘ęŠ€é›†å›¢č‚”ä»½ęœ‰é™å…¬åø Fingerprint recognition method and preparation method of touch panel
JP2017228312A (en) * 2017-09-07 2017-12-28 ę—„ē«‹åŒ–ęˆę Ŗ式会ē¤¾ Photosensitive conductive film, conductive pattern forming method using the same, and conductive pattern substrate
JP6399175B2 (en) * 2017-09-07 2018-10-03 ę—„ē«‹åŒ–ęˆę Ŗ式会ē¤¾ Manufacturing method of conductive pattern, conductive pattern substrate including conductive pattern manufactured by the method, touch panel sensor including the conductive pattern substrate, and photosensitive conductive film
SE541026C2 (en) * 2017-10-13 2019-03-12 Stora Enso Oyj Method and arrangement for producing a label with integrated electrically conductive pattern
CN108415187A (en) * 2018-04-23 2018-08-17 ęˆéƒ½ēæč”åˆ›ęƒ³ē§‘ęŠ€ęœ‰é™č“£ä»»å…¬åø A kind of display
JP6573017B2 (en) * 2018-10-02 2019-09-11 ę—„ē«‹åŒ–ęˆę Ŗ式会ē¤¾ Capacitive touch panel
WO2021132384A1 (en) * 2019-12-25 2021-07-01 åÆŒå£«ćƒ•ć‚¤ćƒ«ćƒ ę Ŗ式会ē¤¾ Method for manufacturing conductive substrate, conductive substrate, touch sensor, antenna, and electromagnetic wave shielding material
JP6977089B2 (en) 2020-03-25 2021-12-08 ć‚­ćƒ¤ćƒŽćƒ³ę Ŗ式会ē¤¾ Manufacturing method of structure and manufacturing method of liquid discharge head
KR102777275B1 (en) 2020-07-24 2025-03-10 ģ‚¼ģ„±ģ „ģžģ£¼ģ‹ķšŒģ‚¬ Fingerprint sensor package and smart card including the same
CN112469205B (en) * 2020-11-12 2021-10-12 北äŗ¬é„굋ꊀęœÆē ”ē©¶ę‰€ Conductive adhesive bonding method for printed board and connector vertical interconnection circuit

Citations (1)

* Cited by examiner, ā€  Cited by third party
Publication number Priority date Publication date Assignee Title
EP2320433A1 (en) * 2008-08-22 2011-05-11 Hitachi Chemical Company, Ltd. Photosensitive conductive film, method for forming conductive film, method for forming conductive pattern, and conductive film substrate

Family Cites Families (64)

* Cited by examiner, ā€  Cited by third party
Publication number Priority date Publication date Assignee Title
US3909680A (en) 1973-02-16 1975-09-30 Matsushita Electric Industrial Co Ltd Printed circuit board with silver migration prevention
US4401521A (en) * 1980-11-28 1983-08-30 Asahi Kasei Kogyo Kabushiki Kaisha Method for manufacturing a fine-patterned thick film conductor structure
US4555414A (en) * 1983-04-15 1985-11-26 Polyonics Corporation Process for producing composite product having patterned metal layer
JPS60113993A (en) * 1983-11-25 1985-06-20 äø‰č±é›»ę©Ÿę Ŗ式会ē¤¾ Method of producing multilayer circuit board
JP3290041B2 (en) * 1995-02-17 2002-06-10 ć‚¤ćƒ³ć‚æćƒ¼ćƒŠć‚·ćƒ§ćƒŠćƒ«ćƒ»ćƒ“ć‚øćƒć‚¹ćƒ»ćƒžć‚·ćƒ¼ćƒ³ć‚ŗćƒ»ć‚³ćƒ¼ćƒćƒ¬ćƒ¼ć‚·ćƒ§ćƒ³ Multilayer printed circuit board, method for manufacturing multilayer printed circuit board
JP2934588B2 (en) 1995-04-24 1999-08-16 ę Ŗ式会ē¤¾ę—„ē«‹č£½ä½œę‰€ Display device
US5626948A (en) * 1996-01-03 1997-05-06 Ferber Technologies L.L.C. Electrical system having a multilayer conductive composition
WO2001047709A1 (en) * 1999-12-28 2001-07-05 Tdk Corporation Functional film and method for preparation thereof
WO2001048764A1 (en) * 1999-12-28 2001-07-05 Tdk Corporation Transparent conductive film and production method thereof
US20020110673A1 (en) * 2001-02-14 2002-08-15 Ramin Heydarpour Multilayered electrode/substrate structures and display devices incorporating the same
JP2004163533A (en) 2002-11-11 2004-06-10 Toyobo Co Ltd Photosensitive resin layered body
KR100606441B1 (en) * 2004-04-30 2006-08-01 ģ—˜ģ§€.ķ•„ė¦½ģŠ¤ ģ—˜ģ‹œė”” ģ£¼ģ‹ķšŒģ‚¬ ClichĆ© manufacturing method and pattern formation method using the same
US7259106B2 (en) * 2004-09-10 2007-08-21 Versatilis Llc Method of making a microelectronic and/or optoelectronic circuitry sheet
US20060062898A1 (en) * 2004-09-17 2006-03-23 Eastman Kodak Company Method of making a display sheet comprising discontinuous stripe coating
JP3928970B2 (en) 2004-09-27 2007-06-13 ę Ŗ式会ē¤¾ć‚¢ćƒ«ćƒćƒƒć‚Æ Method for producing laminated transparent conductive film
JP4242822B2 (en) * 2004-10-22 2009-03-25 ćƒ‘ćƒŠć‚½ćƒ‹ćƒƒć‚Æę Ŗ式会ē¤¾ Manufacturing method of semiconductor device
JP3947539B2 (en) * 2004-12-20 2007-07-25 å¤§ę—„ęœ¬å°åˆ·ę Ŗ式会ē¤¾ Transfer sheet for electrode formation of plasma display panel and electrode formation method
EP2477230B1 (en) 2005-08-12 2015-02-25 Cambrios Technologies Corporation Nanowires-based transparent conductors on a flexible donor substrate
KR101545219B1 (en) * 2006-10-12 2015-08-18 ģŗ„ėøŒė¦¬ģ˜¤ģŠ¤ ķ…Œķ¬ė†€ė”œģ§€ģ¦ˆ ģ½”ķ¬ė ˆģ“ģ…˜ Nanowire-based transparent conductors and applications thereof
US8018568B2 (en) * 2006-10-12 2011-09-13 Cambrios Technologies Corporation Nanowire-based transparent conductors and applications thereof
JP4388966B2 (en) * 2007-03-16 2009-12-24 åƌ士通ę Ŗ式会ē¤¾ Coordinate input device
JP4637209B2 (en) 2007-06-05 2011-02-23 åÆŒå£«ćƒ•ć‚¤ćƒ«ćƒ ę Ŗ式会ē¤¾ Positive photosensitive resin composition and cured film forming method using the same
JP5151265B2 (en) * 2007-06-14 2013-02-27 ę—„ē«‹é›»ē·šę Ŗ式会ē¤¾ Multilayer wiring board and method for manufacturing multilayer wiring board
KR20140042931A (en) 2007-06-21 2014-04-07 ėÆøģ“°ė¹„ģ‹œ ź°€ź°€ź¾ø ź°€ė¶€ģ‹œķ‚¤ź°€ģ“ģƒ¤ Pigment dispersion, coloring composition for color filter, color filter, liquid crystal display and organic el display
US8199118B2 (en) * 2007-08-14 2012-06-12 Tyco Electronics Corporation Touchscreen using both carbon nanoparticles and metal nanoparticles
JP5358145B2 (en) 2007-09-28 2013-12-04 åÆŒå£«ćƒ•ć‚¤ćƒ«ćƒ ę Ŗ式会ē¤¾ Conductive material manufacturing method and conductive material manufacturing apparatus
WO2009060717A1 (en) * 2007-11-07 2009-05-14 Konica Minolta Holdings, Inc. Transparent electrode and method for producing transparent electrode
EP2302645A1 (en) 2008-07-04 2011-03-30 Toda Kogyo Corporation Transparent electrically conductive transfer plate and production method therefor, transparent electrically conductive base, method for producing transparent electrically conductive base using transparent electrically conductive transfer plate, and molded article using transparent electrically conductive base
JP5160325B2 (en) * 2008-07-16 2013-03-13 ę—„ę±é›»å·„ę Ŗ式会ē¤¾ Transparent conductive film and touch panel
WO2010010838A1 (en) * 2008-07-25 2010-01-28 ć‚³ćƒ‹ć‚«ćƒŸćƒŽćƒ«ć‚æćƒ›ćƒ¼ćƒ«ćƒ‡ć‚£ćƒ³ć‚°ć‚¹ę Ŗ式会ē¤¾ Transparent electrode and production method of same
KR100999506B1 (en) 2008-09-09 2010-12-09 ģ‚¼ģ„±ģ „źø°ģ£¼ģ‹ķšŒģ‚¬ Printed Circuit Board and Manufacturing Method Thereof
JP4730443B2 (en) * 2009-02-04 2011-07-20 ć‚½ćƒ‹ćƒ¼ę Ŗ式会ē¤¾ Display device
US20120027994A1 (en) 2009-03-17 2012-02-02 Konica Minolta Holdings, Inc. Transparent conductive film and method for manufacturing transparent conductive film
CN102438822B (en) 2009-03-31 2015-11-25 åøäŗŗę Ŗ式会ē¤¾ Transparent conductive laminate and transparent touch panel
JP5584991B2 (en) 2009-04-02 2014-09-10 ć‚³ćƒ‹ć‚«ćƒŸćƒŽćƒ«ć‚æę Ŗ式会ē¤¾ Transparent electrode, method for producing transparent electrode, and organic electroluminescence element
US8648525B2 (en) * 2009-06-24 2014-02-11 Konica Minolta Holdings, Inc. Transparent electrode, purifying method of conductive fibers employed in transparent electrode and organic electroluminescence element
CN102576582A (en) 2009-06-30 2012-07-11 Dicę Ŗ式会ē¤¾ Method for forming transparent conductive layer pattern
JP2011017975A (en) 2009-07-10 2011-01-27 Hitachi Chem Co Ltd Light shielding transfer film, method for producing the same, and method for forming light shielding pattern
JP5391932B2 (en) 2009-08-31 2014-01-15 ć‚³ćƒ‹ć‚«ćƒŸćƒŽćƒ«ć‚æę Ŗ式会ē¤¾ Transparent electrode, method for producing transparent electrode, and organic electroluminescence element
KR101761434B1 (en) 2009-12-08 2017-07-25 ģ œģ“ģ—ģŠ¤ģ•Œ ź°€ė¶€ģ‹œė¼ź°€ģ“ģƒ¤ Radiation-sensitive resin composition, polymer, monomer and method for producing radiation-sensitive resin composition
JP4943565B2 (en) * 2009-12-11 2012-05-30 ę—„ęœ¬å†™ēœŸå°åˆ·ę Ŗ式会ē¤¾ Mounting structure of thin display and resistive touch panel, resistive touch panel unit with surface protrusion, and thin display unit with back protrusion
WO2011078170A1 (en) 2009-12-25 2011-06-30 åÆŒå£«ćƒ•ć‚¤ćƒ«ćƒ ę Ŗ式会ē¤¾ Electroconductive composition, and transparent electric conductor, touch panel and solar cell which are made using same
KR20120123431A (en) * 2010-01-20 2012-11-08 ķ›„ģ§€ķ•„ė¦„ ź°€ė¶€ģ‹œķ‚¤ź°€ģ“ģƒ¤ Electrically conductive element, photosensitive material for formation of electrically conductive element, and electrode
US8460747B2 (en) * 2010-03-04 2013-06-11 Guardian Industries Corp. Large-area transparent conductive coatings including alloyed carbon nanotubes and nanowire composites, and methods of making the same
EP2545561A4 (en) * 2010-03-08 2014-05-14 Univ Rice William M TRANSPARENT GRAPHENE-BASED ELECTRODES AND GRID HYBRID STRUCTURES
US20120015098A1 (en) * 2010-07-14 2012-01-19 Qian Cheng Carbon nanotube based transparent conductive films and methods for preparing and patterning the same
JP5691524B2 (en) 2011-01-05 2015-04-01 ć‚½ćƒ‹ćƒ¼ę Ŗ式会ē¤¾ Graphene film transfer method and transparent conductive film manufacturing method
US20120217453A1 (en) 2011-02-28 2012-08-30 Nthdegree Technologies Worldwide Inc. Metallic Nanofiber Ink, Substantially Transparent Conductor, and Fabrication Method
WO2012133367A1 (en) * 2011-03-28 2012-10-04 ę±ćƒ¬ę Ŗ式会ē¤¾ Conductive laminated body and touch panel
WO2012132970A1 (en) 2011-03-30 2012-10-04 åÆŒå£«ćƒ•ć‚¤ćƒ«ćƒ ę Ŗ式会ē¤¾ Printed circuit board, manufacturing method therefor, and metal-surface treatment liquid
US9175183B2 (en) * 2011-05-23 2015-11-03 Carestream Health, Inc. Transparent conductive films, methods, and articles
US20140120027A1 (en) * 2011-06-24 2014-05-01 Kuraray Co., Ltd. Conductive film formation method, conductive film, insulation method, and insulation film
JP2015501505A (en) * 2011-09-13 2015-01-15 悶 ćƒŖćƒ¼ć‚øć‚§ćƒ³ćƒ„ ć‚Ŗ惖 悶 ćƒ¦ćƒ‹ćƒćƒ¼ć‚·ćƒ†ć‚£ ć‚Ŗ惖 ć‚«ćƒŖćƒ•ć‚©ćƒ«ćƒ‹ć‚¢ Solution processing method for improved nanowire electrode and apparatus using the electrode
JP5888976B2 (en) * 2011-09-28 2016-03-22 åÆŒå£«ćƒ•ć‚¤ćƒ«ćƒ ę Ŗ式会ē¤¾ Conductive composition, conductive member and method for producing the same, touch panel and solar cell
JP2013073828A (en) * 2011-09-28 2013-04-22 Fujifilm Corp Conductive composition, method for producing the same, conductive member, touch panel, and solar cell
CN103210350B (en) 2011-10-03 2019-06-18 ę—„ē«‹åŒ–ęˆę Ŗ式会ē¤¾ Method for forming conductive pattern, conductive pattern substrate, and touch panel sensor
JP2013122745A (en) 2011-11-11 2013-06-20 Panasonic Corp Touch panel and manufacturing method thereof
KR101688173B1 (en) * 2011-12-26 2016-12-21 ģ½”ģ˜¤ė”±ģøė”ģŠ¤ķŠøė¦¬ ģ£¼ģ‹ķšŒģ‚¬ Plastic substrate
US20150036276A1 (en) 2012-03-06 2015-02-05 Dexerials Corporation Transparent conductive film, conductive element, composition, colored self-assembled material, input device, display device, and electronic instrument
JP2013214434A (en) 2012-04-03 2013-10-17 Sony Corp Laminate structure manufacturing method, laminate structure and electronic apparatus
US9920207B2 (en) * 2012-06-22 2018-03-20 C3Nano Inc. Metal nanostructured networks and transparent conductive material
US9295153B2 (en) * 2012-11-14 2016-03-22 Rohm And Haas Electronic Materials Llc Method of manufacturing a patterned transparent conductor
US20140202742A1 (en) * 2013-01-22 2014-07-24 Cambrios Technologies Corporation Two-sided laser patterning on thin film substrates
US10971277B2 (en) * 2013-02-15 2021-04-06 Cambrios Film Solutions Corporation Methods to incorporate silver nanowire-based transparent conductors in electronic devices

Patent Citations (1)

* Cited by examiner, ā€  Cited by third party
Publication number Priority date Publication date Assignee Title
EP2320433A1 (en) * 2008-08-22 2011-05-11 Hitachi Chemical Company, Ltd. Photosensitive conductive film, method for forming conductive film, method for forming conductive pattern, and conductive film substrate

Non-Patent Citations (1)

* Cited by examiner, ā€  Cited by third party
Title
See also references of WO2013051516A1 *

Also Published As

Publication number Publication date
WO2013051516A1 (en) 2013-04-11
KR20140058394A (en) 2014-05-14
IN2014DN03390A (en) 2015-06-05
JP2013156655A (en) 2013-08-15
US9817499B2 (en) 2017-11-14
US20150271919A1 (en) 2015-09-24
JPWO2013051516A1 (en) 2015-03-30
CN103336409B (en) 2015-05-06
KR101932778B1 (en) 2018-12-27
US20140327889A1 (en) 2014-11-06
US9639189B2 (en) 2017-05-02
EP2620814A1 (en) 2013-07-31
CN103210350A (en) 2013-07-17
KR20130055699A (en) 2013-05-28
TW201403690A (en) 2014-01-16
CN103210350B (en) 2019-06-18
JP5257558B1 (en) 2013-08-07
US9052587B2 (en) 2015-06-09
US20160246394A1 (en) 2016-08-25
KR101348546B1 (en) 2014-01-07
TW201322314A (en) 2013-06-01
TWI592994B (en) 2017-07-21
TWI414007B (en) 2013-11-01
CN103336409A (en) 2013-10-02
EP2620814B1 (en) 2014-12-10

Similar Documents

Publication Publication Date Title
EP2620814A4 (en) Method for forming conductive pattern, conductive pattern substrate, and touch panel sensor
EP2530560A4 (en) Conductive sheet, method for using conductive sheet, and touch panel
EP2680111A4 (en) Substrate with transparent electrode, method for producing same, and touch panel
GB2499388B (en) Touch sensor for non-uniform panels
EP2796969A4 (en) Touch control panel and manufacturing method therefor
GB201009875D0 (en) Touch panel and method for manufacturing the same
EP2796971A4 (en) Conductive sheet and touch panel
EP2765490A4 (en) Conductive sheet and touch panel
GB2508088B (en) Touch Panel and Manufacturing method thereof
EP2708990A4 (en) Conductive sheet and touch panel
SG10201401901WA (en) Glass for substrate, and glass substrate
EP2812779A4 (en) Mesh patterns for touch sensor electrodes
EP2440990A4 (en) Conductive sheet, method for using conductive sheet, and capacitive touch panel
EP2708991A4 (en) Conductive sheet and touch panel
EP2708992A4 (en) Conductive sheet and touch panel
EP2902115A4 (en) Pattern forming method, electronic wiring substrate, optical device, and pattern forming device
PL2938494T3 (en) Method for producing a printing substrate and printing substrate resulting therefrom
EP2708989A4 (en) Conductive sheet and touch panel
KR20180085069A (en) Method for manufacturing electroconductive pattern and electroconductive pattern-formed substrate
EP2738595A4 (en) Embedded capacitive touch panel, display, and manufacturing method
TWI563536B (en) Pattern forming method, method of manufacturing electronic device by using the same, and electronic device
EP2712281A4 (en) Wiring substrate, multi-pattern wiring substrate, and manufacturing method therefor
AU340753S (en) Controller for an electronic computer
ZA201404328B (en) Electronic transaction method
GB201316132D0 (en) Touch panel and manufacturing method thereof

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20130426

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

A4 Supplementary search report drawn up and despatched

Effective date: 20131213

RIC1 Information provided on ipc code assigned before grant

Ipc: G03F 7/20 20060101ALI20131209BHEP

Ipc: G03F 7/095 20060101ALI20131209BHEP

Ipc: G03F 7/09 20060101ALI20131209BHEP

Ipc: G03F 7/004 20060101ALI20131209BHEP

Ipc: G03F 7/38 20060101AFI20131209BHEP

Ipc: G03F 7/028 20060101ALI20131209BHEP

Ipc: G03F 7/11 20060101ALI20131209BHEP

Ipc: G02F 1/1343 20060101ALI20131209BHEP

Ipc: G03F 7/027 20060101ALI20131209BHEP

RIC1 Information provided on ipc code assigned before grant

Ipc: G03F 7/09 20060101ALI20140513BHEP

Ipc: G03F 7/20 20060101ALI20140513BHEP

Ipc: G03F 7/028 20060101ALI20140513BHEP

Ipc: G03F 7/027 20060101ALI20140513BHEP

Ipc: G03F 7/004 20060101ALI20140513BHEP

Ipc: G03F 7/11 20060101ALI20140513BHEP

Ipc: G03F 7/095 20060101ALI20140513BHEP

Ipc: G03F 7/38 20060101AFI20140513BHEP

Ipc: G02F 1/1343 20060101ALI20140513BHEP

GRAP Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOSNIGR1

DAX Request for extension of the european patent (deleted)
INTG Intention to grant announced

Effective date: 20140701

GRAS Grant fee paid

Free format text: ORIGINAL CODE: EPIDOSNIGR3

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

REG Reference to a national code

Ref country code: GB

Ref legal event code: FG4D

REG Reference to a national code

Ref country code: CH

Ref legal event code: EP

REG Reference to a national code

Ref country code: IE

Ref legal event code: FG4D

REG Reference to a national code

Ref country code: AT

Ref legal event code: REF

Ref document number: 700935

Country of ref document: AT

Kind code of ref document: T

Effective date: 20150115

REG Reference to a national code

Ref country code: DE

Ref legal event code: R096

Ref document number: 602012004269

Country of ref document: DE

Effective date: 20150122

REG Reference to a national code

Ref country code: NL

Ref legal event code: T3

REG Reference to a national code

Ref country code: AT

Ref legal event code: MK05

Ref document number: 700935

Country of ref document: AT

Kind code of ref document: T

Effective date: 20141210

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20141210

Ref country code: NO

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20150310

Ref country code: ES

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20141210

REG Reference to a national code

Ref country code: LT

Ref legal event code: MG4D

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LV

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20141210

Ref country code: HR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20141210

Ref country code: GR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20150311

Ref country code: RS

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20141210

Ref country code: SE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20141210

Ref country code: AT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20141210

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: CZ

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20141210

Ref country code: RO

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20141210

Ref country code: EE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20141210

Ref country code: PT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20150410

Ref country code: SK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20141210

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: PL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20141210

Ref country code: IS

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20150410

REG Reference to a national code

Ref country code: DE

Ref legal event code: R097

Ref document number: 602012004269

Country of ref document: DE

PLBE No opposition filed within time limit

Free format text: ORIGINAL CODE: 0009261

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: DK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20141210

26N No opposition filed

Effective date: 20150911

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20141210

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20141210

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: BE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20141210

Ref country code: LU

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20151001

REG Reference to a national code

Ref country code: CH

Ref legal event code: PL

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: MC

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20141210

REG Reference to a national code

Ref country code: IE

Ref legal event code: MM4A

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: CH

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20151031

Ref country code: LI

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20151031

REG Reference to a national code

Ref country code: FR

Ref legal event code: ST

Effective date: 20160630

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: FR

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20151102

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20151001

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: BG

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20141210

Ref country code: SM

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20141210

Ref country code: HU

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT; INVALID AB INITIO

Effective date: 20121001

GBPC Gb: european patent ceased through non-payment of renewal fee

Effective date: 20161001

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: CY

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20141210

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: GB

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20161001

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: MT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20141210

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: FI

Payment date: 20171020

Year of fee payment: 6

Ref country code: DE

Payment date: 20171019

Year of fee payment: 6

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: NL

Payment date: 20171019

Year of fee payment: 6

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: MK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20141210

Ref country code: TR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20141210

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: AL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20141210

REG Reference to a national code

Ref country code: DE

Ref legal event code: R119

Ref document number: 602012004269

Country of ref document: DE

REG Reference to a national code

Ref country code: NL

Ref legal event code: MM

Effective date: 20181101

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: FI

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20181001

Ref country code: DE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20190501

Ref country code: NL

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20181101