EP2620694B1 - Fahrzeugscheinwerfer - Google Patents

Fahrzeugscheinwerfer Download PDF

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Publication number
EP2620694B1
EP2620694B1 EP13152286.4A EP13152286A EP2620694B1 EP 2620694 B1 EP2620694 B1 EP 2620694B1 EP 13152286 A EP13152286 A EP 13152286A EP 2620694 B1 EP2620694 B1 EP 2620694B1
Authority
EP
European Patent Office
Prior art keywords
light emitting
semiconductor light
emitting elements
vehicle headlamp
lateral direction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP13152286.4A
Other languages
English (en)
French (fr)
Other versions
EP2620694A3 (de
EP2620694A2 (de
Inventor
Hidetada Tanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koito Manufacturing Co Ltd
Original Assignee
Koito Manufacturing Co Ltd
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Filing date
Publication date
Application filed by Koito Manufacturing Co Ltd filed Critical Koito Manufacturing Co Ltd
Publication of EP2620694A2 publication Critical patent/EP2620694A2/de
Publication of EP2620694A3 publication Critical patent/EP2620694A3/de
Application granted granted Critical
Publication of EP2620694B1 publication Critical patent/EP2620694B1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/60—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by a variable light distribution
    • F21S41/65—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by a variable light distribution by acting on light sources
    • F21S41/663—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by a variable light distribution by acting on light sources by switching light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
    • F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
    • F21S41/141—Light emitting diodes [LED]
    • F21S41/143—Light emitting diodes [LED] the main emission direction of the LED being parallel to the optical axis of the illuminating device
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
    • F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
    • F21S41/141—Light emitting diodes [LED]
    • F21S41/151—Light emitting diodes [LED] arranged in one or more lines
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
    • F21S41/19—Attachment of light sources or lamp holders
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
    • F21S41/19—Attachment of light sources or lamp holders
    • F21S41/192—Details of lamp holders, terminals or connectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/30—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by reflectors
    • F21S41/32—Optical layout thereof
    • F21S41/321—Optical layout thereof the reflector being a surface of revolution or a planar surface, e.g. truncated
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/30—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by reflectors
    • F21S41/32—Optical layout thereof
    • F21S41/33—Multi-surface reflectors, e.g. reflectors with facets or reflectors with portions of different curvature
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
    • F21S45/40—Cooling of lighting devices
    • F21S45/42—Forced cooling
    • F21S45/43—Forced cooling using gas
    • F21S45/435—Forced cooling using gas circulating the gas within a closed system

Definitions

  • the present invention relates to a vehicle headlamp. More particularly, the present invention relates to a technique that prevents occurrence of lines of light in a light distribution pattern by setting an inclination angle of each of a plurality of reflectors, which reflect light emitted from a plurality of semiconductor light emitting elements, with respect to an optical axis to a predetermined angle.
  • a vehicle headlamp has a configuration that a light emitting module, which is referred to as a so-called array (LED array) having a plurality of semiconductor light emitting elements arranged in parallel with each other in a lateral direction, is disposed within a lamp outer case formed by a cover and a lamp body (for example, see JP-A-2011-192656 ).
  • LED array so-called array
  • a light distribution pattern having a desired size or shape may be formed depending on the number of semiconductor light emitting elements, a distance between the semiconductor light emitting elements, or the like as necessary.
  • a desired plurality of light distribution patterns may also be formed in which a reduction in generation of glare light and the like is attained by individually performing light on/off control with respect to each semiconductor light emitting element and irradiating light only in a direction required according to an existing position of an oncoming vehicle, a preceding vehicle, a walker, or the like.
  • the plural semiconductor light emitting elements are arranged at predetermined intervals.
  • illuminance of boundary portions which are between distributions of light emitted from each semiconductor light emitting element is decreased, illuminance of light becomes non-uniform, and the boundary portions appear as a plurality of vertically long lines of light which are spaced from each other at the left and the right.
  • An object of the present invention is to provide a vehicle headlamp which prevents generation of lines of light by improving uniformity of light in a light distribution pattern.
  • the uniformity of light may be further enhanced in the light distribution pattern, and the generation of the lines of light may be prevented.
  • a lateral distance (L) between the adjacent semiconductor light emitting elements is larger than a lateral length (H) of each of the semiconductor light emitting elements.
  • the vehicle headlamp further comprises a plurality of substrates (17), wherein each of the semiconductor light emitting elements is disposed on a corresponding one of the substrates.
  • the vehicle headlamp further comprises a base plate (16), wherein the semiconductor light emitting elements (18) or the plurality of substrates (17) on which the semiconductor light emitting elements are disposed are disposed on a mounting surface of the base plate.
  • the base plate is formed in a stepped shape, and the thickness of a portion of the base plate through which the optical axis (P) passes is larger than or equal to those of any other portions of base plate.
  • widths in the lateral direction of the distributions of light which forms portions of both lateral end sides of the light distribution pattern are increased, and the overlap of the distributions of the light is increased. Therefore, the lines of light may be further effectively eliminated.
  • the first inclination angle ( ⁇ ⁇ ) is smaller than the second inclination angle ( ⁇ i ).
  • the optical axis (P) passes through a semiconductor light emitting element corresponding to the central reflector (22A).
  • a lamp outer case 4 which is constituted by a lamp body 2 and a cover 3 attached to a front end portion of the lamp body 2, is formed as a lamp chamber 5, and a first lamp unit 6 and a second lamp unit 7 are disposed in the lamp chamber 5 so as to be separated from each other at the left and the right (see Figs. 1 and 2 ).
  • the first lamp unit 6 includes a reflective mirror 8, a light source 9 attached to the reflective mirror 8, and a shade 10 to shade a portion of light emitted from the light source 9.
  • the first lamp unit 6 is provided to form a low beam for irradiating a short distance.
  • a discharge bulb may be used as the light source 9.
  • the reflective mirror 8 is provided with three connection portions 8a, 8a, and 8a which protrude to the outside.
  • the first lamp unit 6 is tiltably supported at the lamp body 2 through aiming shafts 11, 11, and 11 which are respectively screwed and connected to the connection portions 8a, 8a, and 8a of the reflective mirror 8.
  • aiming shafts 11, 11, and 11 which are respectively screwed and connected to the connection portions 8a, 8a, and 8a of the reflective mirror 8.
  • the first lamp unit 6 is tilted in a lateral direction or in an upward and downward direction about the connection portions 8a and 8a, which are used as a supporting point, except the connection portion 8a to which the associated aiming shaft 11 is screwed. Consequently, an optical axis adjustment (aiming adjustment) of the first lamp unit 6 is performed.
  • the second lamp unit 7 is formed in which each required portion is attached to a bracket 12 disposed in the lamp chamber 5, and is provided to form a high beam for irradiating a long distance.
  • the bracket 12 is formed of a metal material having high heat conductivity, and is provided, at both upper and lower end portions thereof, with supported portions 12a, 12a, and 12a.
  • a heat sink (heat radiation fin) 13 is attached on a rear surface of the bracket 12.
  • a heat radiation fan 14 is attached on a rear surface of the heat sink 13.
  • a light emitting module 15 is attached to a central portion on a front surface of the bracket 12. As shown in Fig. 3 , the light emitting module 15 includes a base plate 16 attached on the front surface of the bracket 12, substrates 17 which are disposed on a front surface of the base plate 16 to be separated from each other in the lateral direction, and semiconductor light emitting elements 18 which are respectively mounted on front surfaces of the substrates 17.
  • Each semiconductor light emitting element 18 includes a semiconductor layer 18a located at a rear side thereof, and a phosphor layer 18b laminated on a front surface of the semiconductor layer 18a.
  • the semiconductor light emitting element 18, which is located at a central portion in the lateral direction among the semiconductor light emitting elements 18 is provided as a central semiconductor light emitting element 18A.
  • LEDs Light Emitting Diodes
  • LEDs Light Emitting Diodes
  • the semiconductor light emitting elements 18 are individually supplied with a drive current from a lighting circuit (not shown). Consequently, the semiconductor light emitting elements 18 which are supplied with the drive current are turned on, whereas the semiconductor light emitting elements 18 which are not supplied with the drive current are maintained in a state of being turned off.
  • control to change the current value of the drive current supplied from the lighting circuit may be individually performed with respect to the semiconductor light emitting elements 18.
  • a reflective member 19 is attached on the front surface of the bracket 12.
  • the reflective member 19 is constituted of a reflector formation portion 20 having a plate shape, which is located on front surface sides of the semiconductor light emitting elements 18 in a front and rear direction, and an attached portion 21 which protrudes rearwards from an outer periphery portion of the reflector formation portion 20.
  • the attached portion 21 is attached to the bracket 12.
  • the reflector formation portion 20 is formed with a plurality of reflectors 22 which are arranged in parallel with each other in the lateral direction. Each of the reflectors 22 are located to face a corresponding one of the semiconductor light emitting elements 18, 18, etc. (see Figs. 3 and 4 ).
  • Each reflector 22 is formed by four reflective portions, namely, an upper side reflective portion 23 located at an upper side, a lower side reflective portion 24 located at a lower side, an inner side reflective portion 25 (an inner side) which is located at an inner side in the lateral direction based on the central reflector 22A, and an outer side reflective portion 26 (an outer side) which is located at an outer side in the lateral direction based on the central semiconductor light emitting element 18A.
  • the central reflector 22A is formed by the upper side reflective portion 23, the lower side reflective portion 24, and lateral side reflective portions 27 and 27 located at the left and the right.
  • the upper side reflective portion 23, the lower side reflective portion 24, the inner side reflective portion 25, the outer side reflective portion 26, and the lateral side reflective portions 27 and 27 are formed, for example, to have a parabolic surface.
  • a lens holder 28 is attached on the front surface of the bracket 12 (see Fig. 1 ).
  • the lens holder 28 is formed in a substantially cylindrical shape which penetrates in the front and rear direction, and is attached to the bracket 12 so as to cover the light emitting module 15.
  • a projector lens 29 is attached to a front end portion of the lens holder 28.
  • the projector lens 29 is formed in a substantially convex and semi-spherical shape in a front direction, and includes a focal plane S having a rear focus, and projects light emitted from the semiconductor light emitting elements 18, 18, etc.
  • the light emitting module 15 is located behind the focal plane S.
  • the second lamp unit 7 is tiltably supported at the lamp body 2 through aiming shafts 30, 30, and 30 which are respectively screwed and connected to the supported portions 12a, 12a, and 12a of the bracket 12.
  • aiming shafts 30, 30, and 30 which are respectively screwed and connected to the supported portions 12a, 12a, and 12a of the bracket 12.
  • the vehicle headlamp 1 is provided with a leveling actuator (not shown).
  • a leveling actuator (not shown).
  • Each of the first and second lamp units 6 and 7 is tilted in the upward and downward direction by the drive of the leveling actuator.
  • Leveling adjustment may also be performed to adjust a direction of the optical axis depending on a weight of a vehicle load.
  • eleven semiconductor light emitting elements 18 are disposed to be separated from each other at the left and the right. Distances L between the semiconductor light emitting elements 18 located adjacent to each other are longer than lengths H of the semiconductor light emitting elements 18 in the lateral direction thereof (see Fig. 5 ). In addition, the distances L are regular or become gradually larger from the central semiconductor light emitting element 18A toward the outside in the lateral direction.
  • an inclination angle ⁇ o with respect to the optical axis P of the outer side reflective portion 26 is smaller than an inclination angle ⁇ i with respect to the optical axis P of the inner side reflective portion 25.
  • Inclination angles with respect to the optical axes P of the lateral side reflective portions 27 and 27 in the central reflector 22A are equal to each other.
  • the inclination angle ⁇ o may also be equal to or more than the inclination angle ⁇ i with respect to the optical axis P of the inner side reflective portion 25 in order to further increase a diffusion angle of light emitted from the semiconductor light emitting elements 18.
  • the inclination angles ⁇ o with respect to the optical axes P of the outer side reflective portions 26 become gradually smaller from the central reflector 22A toward the outside in the lateral direction.
  • the inclination angle ⁇ o may also be equal to or more than an angle ⁇ o of the inner side thereof in order to further increase the diffusion angle of light emitted from the semiconductor light emitting elements 18.
  • the emitted light is reflected from the reflectors 22 or is incident upon the projector lens 29 without reflection from the reflectors 22.
  • a light distribution pattern for high beam TH is formed (see Fig. 6 ).
  • a light distribution pattern for low beam TL is formed.
  • the light distribution pattern for high beam TH is formed by a combination of distributions T1, T2, etc. of light emitted from each of the semiconductor light emitting elements 18.
  • the distributions T1, T2, etc. of the light overlapped with each other in the lateral direction.
  • a horizontal width at a central portion in the lateral direction is smallest, and horizontal widths are gradually increased from the distribution T1 toward the outside in the lateral direction.
  • a vertical width at the central portion in the lateral direction is largest, and vertical widths are gradually decreased from the distribution T1 toward the outside in the lateral direction.
  • Fig. 7 is a graph illustrating the light distribution in the light distribution pattern when the three semiconductor light emitting elements, which are located at the center in the lateral direction, are turned on.
  • the horizontal axis represents a position, "0" represents a center in the lateral direction, and the vertical axis represents illuminance.
  • the solid line represents the distributions of light emitted from each semiconductor light emitting element, and the broken line represents the combined distribution of the light emitted from the three semiconductor light emitting elements.
  • the upper graph represents a light distribution pattern when the light is emitted from a prior-art light emitting module in which an inclination angle of each reflective portion of a reflector is the same with respect to an optical axis.
  • the lower graph represents a light distribution pattern when the light is emitted from the light emitting module 15 of the vehicle headlamp 1 according to the present invention.
  • the illuminance is non-uniform, and lines of light occurs as indicated by portions A.
  • irregularities of the illuminance are generated.
  • the inclination angles ⁇ o of the outer side reflective portions 26 with respect to the optical axes P are smaller than the inclination angles ⁇ i of the inner side reflective portions 25 with respect to the optical axes P, respectively.
  • uniformity of the illuminance can be achieved, and lines of light can be eliminated.
  • Fig. 8 is a graph illustrating a light distribution pattern when the entirety of the eleven semiconductor light emitting elements is turned on.
  • the horizontal axis represents a position, "0" represents a center in the lateral direction, and the vertical axis represents illuminance.
  • the solid line represents the distributions of light emitted from each semiconductor light emitting element, and the broken line represents the combined illuminance distribution of the light emitted from the eleven semiconductor light emitting elements.
  • the largest drive current is supplied to the semiconductor light emitting element located at the center, and the current value of the drive current to be supplied to the semiconductor light emitting elements is gradually decreased toward the semiconductor light emitting elements located at the outside in the lateral direction.
  • the illuminance is also decreased toward the outside.
  • the upper graph represents a light distribution pattern when the light is emitted from the prior-art light emitting module of the vehicle headlamp in which the inclination angle of each reflective portion of the reflector is the same with respect to the optical axis.
  • the lower graph represents a light distribution pattern when the light is emitted from the light emitting module 15 of the vehicle headlamp 1 according to the present invention.
  • the illuminance is non-uniform, and lines of light tend to occur as indicated by portions B.
  • irregularities of the illuminance are generated.
  • the inclination angles ⁇ o of the outer side reflective portions 26 with respect to the optical axes P are smaller than the inclination angles ⁇ i of the inner side reflective portions 25 with respect to the optical axes P, respectively.
  • uniformity of the illuminance can be achieved, and lines of light can be eliminated.
  • a light emitting module 15A according to the first modification example has a difference only in that the substrates 17 are not provided on the base plate 16, as compared to the above-mentioned light emitting module 15. Accordingly, the light emitting module 15A will be described in detail only with respect to configurations different from the light emitting module 15, and other configurations identical to those as the above-mentioned light emitting module 15 are given using the same reference numerals and the description thereof will be omitted herein.
  • the light emitting module 15A includes the base plate 16 attached on the front surface of the bracket 12, and the semiconductor light emitting elements 18 which are mounted on the front surface of the base plate 16 to be separated from each other in the right and left direction.
  • the front surface of the base plate 16 is formed with a predetermined conductive circuit.
  • the semiconductor light emitting elements 18 are mounted on each connection portion of the conductive circuit.
  • the semiconductor light emitting elements 18 are individually supplied with the drive current from the lighting circuit through the conductive circuit.
  • a light emitting module 15B according to the second modification example has a difference only in that the base plate 16 has a different configuration, as compared to the above-mentioned light emitting module 15. Accordingly, the light emitting module 15B will be described in detail only with respect to configurations different from the light emitting module 15, and other configurations identical to those as the above-mentioned light emitting module 15 are given using the same reference numerals and the description thereof will be omitted herein.
  • the light emitting module 15B includes a base plate 16B attached on the front surface of the bracket 12, the substrates 17 which are disposed on a front surface of the base plate 16B to be separated from each other in the right and left direction, and the semiconductor light emitting elements 18 which are respectively mounted on the front surfaces of the substrates 17.
  • the base plate 16B is formed in a stepped shape in which a central portion in the lateral direction is located at the most front side and both lateral end portions are located at the most rear sides. Front surfaces located between respective steps 16a of the base plate 16B are formed as mounting surfaces 16b.
  • the substrates 17 are separated from each other in the left and the right direction and one or a plurality of substrates 17 are disposed on each of the mounting surfaces 16b.
  • the number of steps of the base plate 16B may be plural. As shown in Fig. 10 , the number of steps may also be three, or two or four or more.
  • a reflective member 19B is attached on the front surface of the bracket 12.
  • the reflective member 19B includes: a reflector formation portion 20B having a plate shape which is located on the front surface sides of the semiconductor light emitting elements 18 in the front and rear direction; and the attached portion 21 which protrudes rearwards from an outer periphery portion of the reflector formation portion 20B.
  • the attached portion 21 is attached to the bracket 12.
  • the reflector formation portion 20B is formed in a stepped shape in which a central portion is located at the most front side and both lateral end portions are located at the most rear sides.
  • the above light emitting module 15B is formed in a stepped shape in which the central portion in the lateral direction of the base plate 16B is located at the most front side, the distances between the semiconductor light emitting elements 18 located at both end sides in the lateral direction and the focal plane S of the projector lens 29 are increased.
  • the widths in the lateral direction of light distribution which forms portions of both lateral end sides of the light distribution pattern are increased, and the overlapping region of the light distributions is increased. Therefore, the lines of light may be further effectively eliminated.
  • the distances between the semiconductor light emitting elements 18 located at both end sides in the lateral direction may be larger than the distances between the semiconductor light emitting elements 18 located at the central portion.
  • the substrates 17 are disposed on the front surface of base plate 16B and the semiconductor light emitting elements 18 are mounted on the front surfaces of the substrates 17.
  • the semiconductor light emitting elements 18 may also be mounted on the front surface of base plate 16B.
  • the light emitting module 15B which has the steps in the lateral direction has been described.
  • the light emitting module 15B may also be formed with the steps in the upward and downward direction, and the substrates and the semiconductor light emitting elements or the semiconductor light emitting elements may be disposed on the mounting surfaces which are directed frontwards and located between the steps formed in the upward and downward direction.
  • the light emitting modules 15, 15A, and 15B are located behind the focal plane of the projector lens 29. Also, in at least a portion of the reflectors 22, the inclination angles ⁇ o of of the outer side reflective portions 26 with respect to the optical axes P are smaller than the inclination angles ⁇ i of of the inner side reflective portions 25 with respect to the optical axes P.
  • the illuminance of boundary portions, which are between the distributions of light emitted from each of the semiconductor light emitting elements 18, may be increased, the illuminance of the light distribution may become uniform, and the generation of the lines of light may be prevented.
  • the inclination angles ⁇ o of the outer side reflective portions 26 with respect to the optical axes P become gradually smaller toward the outside in the lateral direction, the uniformity of light distribution pattern may be further enhanced, and the generation of the lines of light may be prevented.
  • the distances between the semiconductor light emitting elements 18 are longer than the lengths of the semiconductor light emitting elements 18 in the lateral direction thereof. Therefore, it may be possible to reduce the number of semiconductor light emitting elements 18 in forming the light distribution pattern. Also, it may be possible to form the excellent light distribution pattern while reducing the manufacturing costs of the vehicle headlamp 1.
  • the plurality of substrates 17 on which the plural semiconductor light emitting elements 18 are respectively mounted are provided, it is possible to freely set the positions of the semiconductor light emitting elements 18 and arbitrarily set the distances between the semiconductor light emitting elements 18.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Led Device Packages (AREA)

Claims (6)

  1. Fahrzeug-Scheinwerfer (1), der umfasst:
    ein lichtemittierendes Modul (15), das umfasst:
    eine Vielzahl lichtemittierender Halbleiterelemente (18), die jeweils so ausgeführt sind, dass sie Licht emittieren, und die so angeordnet sind, dass sie in einer seitlichen Richtung des Fahrzeugscheinwerfers voneinander getrennt sind;
    eine Vielzahl von Reflektoren (22), die jeweils für ein entsprechendes der Halbleiterelemente vorgesehen sind und von dem entsprechenden lichtemittierenden Halbleiterelement emittiertes Licht reflektieren, wobei einer der Reflektoren, der sich an einer mittleren Position in der seitlichen Richtung befindet, als ein mittlerer Reflektor (22A) definiert ist; und
    eine Projektionslinse (29), die so ausgeführt ist, dass sie das von dem lichtemittierenden Modul emittierte Licht nach vorn projiziert, wobei das lichtemittierende Modul hinter einer Fokusebene der Projektionslinse angeordnet ist,
    wobei jeder der Reflektoren (22) mit Ausnahme des mittleren Reflektors (22A) eine Außenseite (26) sowie eine der Außenseite zugewandte Innenseite (25) hat und ein Abstand zwischen der Innenseite und dem mittleren Reflektor kleiner ist als ein Abstand zwischen der Außenseite und dem mittleren Reflektor in der seitlichen Richtung, und
    dadurch gekennzeichnet, dass
    bei wenigstens einem der Reflektoren (22) mit Ausnahme des mittleren Reflektors (22A) ein erster Neigungswinkel (θο) der Außenseite (26) in Bezug auf eine optische Achse (P) des Fahrzeugscheinwerfers kleiner ist als ein zweiter Neigungswinkel (θi) der Innenseite (25) in Bezug auf die optische Achse (P),
    wobei der erste Neigungswinkel (θο) jedes der Reflektoren (22) mit Ausnahme des mittleren Reflektors (22A) von dem mittleren Reflektor zu der Außenseite hin in der seitlichen Richtung allmählich abnimmt.
  2. Fahrzeugscheinwerfer nach Anspruch 1, wobei ein seitlicher Abstand (L) zwischen den benachbarten lichtemittierenden Halbleiterelementen größer ist als eine seitliche Länge (H) jedes der lichtemittierenden Halbleiterelemente.
  3. Fahrzeugscheinwerfer nach Anspruch 1 oder 2, der des Weiteren umfasst:
    eine Vielzahl von Substraten (17), wobei jedes der lichtemittierenden Halbleiterelemente auf einem entsprechenden der Substrate angeordnet ist.
  4. Fahrzeugscheinwerfer nach einem der Ansprüche 1 bis 3, der des Weiteren umfasst:
    eine Grundplatte (16), wobei die lichtemittierenden Halbleiterelemente (18) oder die Vielzahl von Substraten (17), auf denen die lichtemittierenden Halbleiterelemente angeordnet sind, auf einer Montagefläche der Grundplatte angeordnet sind,
    wobei die Grundplatte in einer abgestuften Form ausgebildet ist, und
    die Dicke eines Abschnitts der Grundplatte, durch den die optische Achse (P) verläuft, größer ist als oder genauso groß wie die aller anderen Abschnitte der Grundplatte.
  5. Fahrzeugscheinwerfer nach Anspruch 1, wobei bei jedem der Reflektoren (22) der erste Neigungswinkel (θο) kleiner ist als der zweite Neigungswinkel (θi).
  6. Fahrzeugscheinwerfer nach Anspruch 1, wobei die optische Achse (P) durch ein dem mittleren Reflektor (22A) entsprechendes lichtemittierendes Halbleiterelement hindurch verläuft.
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CN103216777B (zh) 2016-03-23
JP5801731B2 (ja) 2015-10-28
JP2013152816A (ja) 2013-08-08
CN103216777A (zh) 2013-07-24
EP2620694A2 (de) 2013-07-31

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