EP2549589A1 - Dispositifs de communication sans fil et procédé pour la dissipation de chaleur dans de tels dispositifs - Google Patents

Dispositifs de communication sans fil et procédé pour la dissipation de chaleur dans de tels dispositifs Download PDF

Info

Publication number
EP2549589A1
EP2549589A1 EP11290332A EP11290332A EP2549589A1 EP 2549589 A1 EP2549589 A1 EP 2549589A1 EP 11290332 A EP11290332 A EP 11290332A EP 11290332 A EP11290332 A EP 11290332A EP 2549589 A1 EP2549589 A1 EP 2549589A1
Authority
EP
European Patent Office
Prior art keywords
antenna
base element
heat
transceiver
heat transfer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP11290332A
Other languages
German (de)
English (en)
Inventor
Thomas Bitzer
Andreas Pascht
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alcatel Lucent SAS
Original Assignee
Alcatel Lucent SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alcatel Lucent SAS filed Critical Alcatel Lucent SAS
Priority to EP11290332A priority Critical patent/EP2549589A1/fr
Publication of EP2549589A1 publication Critical patent/EP2549589A1/fr
Withdrawn legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q23/00—Antennas with active circuits or circuit elements integrated within them or attached to them
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/02—Arrangements for de-icing; Arrangements for drying-out ; Arrangements for cooling; Arrangements for preventing corrosion
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/42—Housings not intimately mechanically associated with radiating elements, e.g. radome
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H01Q21/0006—Particular feeding systems
    • H01Q21/0025—Modular arrays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H01Q21/06—Arrays of individually energised antenna units similarly polarised and spaced apart

Definitions

  • the present invention relates to a wireless communication antenna device and a method for heat dissipation in such a device.
  • a wireless communication antenna device comprising: (i) a base element; (ii) at least one antenna unit comprising an antenna structure and a transceiver and/or amplifier device and being mounted on one side of the base element; and (iii) at least one heat transfer element assigned to the antenna unit and extending from the transceiver and/or amplifier device of said assigned antenna unit to at least one heat sink.
  • the base element is a carrier for the at least one antenna unit.
  • the heat transfer element thermally connects the transceiver and/or amplifier device to the heat sink.
  • the complete heat sink or at least a part of the heat sink is arranged on the opposite side of the base element. This opposite side of the base element is the opposite side of the one side (with the at least one antenna unit).
  • the antenna device comprises one antenna unit or a plurality of antenna units, each unit with an antenna structure and a transceiver and/or amplifier device. Therefore, the antenna device is an active antenna device with active antenna unit(s).
  • This at least one active antenna device is the next step in miniaturization of the wireless communication antenna device.
  • said wireless communication active antenna device With said wireless communication active antenna device, the disadvantage of a high signal attenuation due to lossy cables can be overcome.
  • said active antenna device is a new approach for higher flexibility and energy-saving in mobile telecommunication.
  • the principle is that each antenna structure (or antenna element) is directly connected with a transceiver and/or amplifier device in the corresponding active antenna unit. That means that the transceiver and/or amplifier device can be located within a common antenna radome covering the one side of the base element.
  • the idea is to implement the transceiver together with the passive antenna structure in a compact unit. Several of these units can then be mounted in the antenna radome, depending on the wanted total output power, overall radiation characteristic, etc.
  • the at least one heat transfer element and the heat sink are used for the necessary heat dissipation.
  • This heat transfer element conducts the heat generated within the corresponding antenna unit to the base element of the antenna device or directly to the opposite side of the base element, which is the side opposite to the side with the antenna unit(s).
  • each antenna unit (comprising an antenna structure and a transceiver and/or amplifier device) is assigned to at least one corresponding heat transfer element.
  • the heat transfer element can transport at least as much thermal output (in the sense of a power P) by conductive heat transfer from the transceiver and/or amplifier device to the heat sink as said transceiver and/or amplifier device produces due to its power loss (P loss ) in its operating state (defined by operating temperature, etc.). In some embodiments, the heat transfer element can transport even more thermal output by conductive heat transfer than a maximum thermal output produced by the transceiver and/or amplifier device due to its power loss (P loss ) in its operating state.
  • the base element is a heat conducting base element.
  • This heat conducting base element especially is a metal base element.
  • a metal base element is known from the passive wireless communication antenna devices of macro base stations. In these passive devices, the metal base element is a metal panel.
  • the heat sink comprises the heat conducting base element.
  • the heat transfer element contacts the heat sink thermally at its heat conducting base element.
  • the at least one heat transfer element extends from the corresponding antenna unit through the base element to the heat sink.
  • the heat transfer element or each of the heat transfer elements thermally connects the corresponding antenna unit with the heat sink directly.
  • the heat transfer element comprises at least one thermally conducting pin (or rod).
  • the pin or rod especially is a metal pin or metal rod.
  • the heat transfer element is a thermally conducting pin or thermally conducting rod.
  • the heat transfer element comprises at least one thermally conducting panel unit forming a casing part of the transceiver and/or amplifier device.
  • This casing part can be composed frame-like.
  • the thermally conducting panel unit(s) preferably is/are (a) metal panel unit(s).
  • said heat sink comprises a cooling element and/or, a heat pipe and/or, a liquid cooler and/or an air cooler and/or a fan.
  • a cooling element can comprise cooling fins.
  • the antenna device comprises a plurality of antenna units and a plurality of corresponding heat transfer elements.
  • the heat transfer elements thermally connect the corresponding transceiver and/or amplifier devices with only one common heat sink.
  • the antenna device further comprises an antenna radome covering the at least one antenna unit on the one side of the base element.
  • the corresponding antenna device comprises a base element and at least one antenna unit mounted on one side of the base element.
  • Said antenna unit comprises an antenna structure and a transceiver and/or amplifier device.
  • the waste heat of the transceiver and/or amplifier device is dissipated from the antenna device by means of at least one heat sink and at least one heat transfer element.
  • the heat transfer element extends from the corresponding antenna unit to the heat sink, wherein the heat sink is at least partially arranged on the opposite side of the base element.
  • the heat transfer element extends from the corresponding antenna unit to (a) the base element, wherein the base element is part of the heat sink or to (b) the heat sink located on the opposite side of the base element.
  • a wireless communication antenna device 10 for a mobile communication device is shown.
  • Said mobile communication device (not shown in its entirety) can be a base station, a mobile telephone, a handheld computer, etc.
  • the wireless communication antenna device 10 comprises a base element 12 and a plurality of antenna units 14 mounted on one side 16 of said base element 12.
  • the base element 12 shown in Figs. 1 to 3 is a base panel.
  • Each of the antenna units 14 is formed as an antenna block and comprises an antenna structure 18 and a transceiver and/or amplifier device (not shown).
  • Each antenna structure 18 is provided on one side 20 of the corresponding antenna unit 14 facing away from the base element 12. This antenna structure 18 is the non-active part of the antenna unit 14.
  • the transceiver and/or amplifier device is provided on the opposite side 22 of the corresponding antenna unit 14 facing towards the base element 12. This transceiver and/or amplifier device is the active part of the antenna unit 14.
  • the base element 12 is a heat conducting base element 24, preferably made of metal (a metal base element).
  • the heat conducting base element 24 is formed as a metal strip, whereby the antenna units 14 are mounted in a line along the longitudinal axis of said metal strip.
  • the wireless communication device 10 further comprises a plurality of heat transfer elements 26 (shown in Fig. 2 ), each corresponding to one of the antenna units 14 and extending from the transceiver and/or amplifier device of the corresponding antenna unit 14 to the heat conducting base element 24.
  • the heat transfer elements 26 thermally connect the transceiver and/or amplifier device of the corresponding antenna unit 14 with the common base element 12, 24.
  • This base element 12, 24 itselfis a heat sink 28 or at least part of a heat sink 28 of all active antenna units 14.
  • the heat transfer elements 26 of the embodiment shown in Fig. 2 are formed as thermally conducting pins 30. These thermally conductive pins 30 shown in Fig. 2 are preferably metal pins.
  • the opposite side 32 of the base element 12 and/or a margin area of other heat sink 28 elements build an outer surface of the antenna device 10.
  • Possible other heat sink elements are a cooling element comprising cooling fins (not shown), a heat pipe system (not shown), etc.
  • Fig. 3 shows another preferred embodiment of the antenna device 10.
  • the heat transfer element 26 is a casing part 34 of the transceiver and/or amplifier device comprising heat conducting panel units (preferably made of metal) surrounding the opposite side 22 of the corresponding antenna unit 14 with the transceiver and/or amplifier device.
  • the waste heat of the antenna unit 14, especially of the transceiver and/or amplifier device, is dissipated from the antenna device 10 by means of a heat sink 28 and at least one heat transfer element 26.
  • the heat transfer element 26 extends from the transceiver and/or amplifier device of the antenna unit 14, to the base element 12.
  • the base element 12 is part of the heat sink 28.
  • the heat sink 28 further comprises a cooling element with cooling fins mounted on the base element 12 and a fan. In other embodiments, the heat sink 28 further comprises a heat pipe and an external liquid cooler or air cooler. All these kind of elements are arranged on the opposite side of the base element 12. Therefore, these elements are not visible in Figs. 1 - 3 .
  • each of the heat transfer elements 26 is able to transport at least as much heat by conductive heat transfer from the transceiver and/or amplifier device to the heat sink 28 as the maximum thermal output produced by the transceiver and/or amplifier device due to its power loss.
  • the heat transfer element 26 is a thermal bridge from the single antenna unit 14 to the base element 12 (or directly to the heat sink 28). It is made of a material with low thermal resistance, favorably some metal, on which the lossy components of the transceiver and/or amplifier device are directly mounted so that an optimal heat transfer to the heat transfer element 26 and the heat sink 28 is possible. Since the amplifier part may be the component that generates the highest amount of waste heat, this part is preferably mounted on the heat transfer element 26. But all other parts that generate heat, either due to active operation or due to resistive losses, can be mounted on the heat transfer element 26 as well.
  • the shape of the heat transfer element 26 there is a high degree of freedom. However, it is important that it does not influence the radiation pattern of the antenna structure(s) 18 in a negative way.
EP11290332A 2011-07-20 2011-07-20 Dispositifs de communication sans fil et procédé pour la dissipation de chaleur dans de tels dispositifs Withdrawn EP2549589A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP11290332A EP2549589A1 (fr) 2011-07-20 2011-07-20 Dispositifs de communication sans fil et procédé pour la dissipation de chaleur dans de tels dispositifs

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP11290332A EP2549589A1 (fr) 2011-07-20 2011-07-20 Dispositifs de communication sans fil et procédé pour la dissipation de chaleur dans de tels dispositifs

Publications (1)

Publication Number Publication Date
EP2549589A1 true EP2549589A1 (fr) 2013-01-23

Family

ID=44512726

Family Applications (1)

Application Number Title Priority Date Filing Date
EP11290332A Withdrawn EP2549589A1 (fr) 2011-07-20 2011-07-20 Dispositifs de communication sans fil et procédé pour la dissipation de chaleur dans de tels dispositifs

Country Status (1)

Country Link
EP (1) EP2549589A1 (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017117360A1 (fr) * 2015-12-29 2017-07-06 Blue Danube Systems, Inc. Structure à faible impédance thermique dans une antenne réseau à commande de phase
CN107834152A (zh) * 2017-11-16 2018-03-23 西安电子科技大学 一种利用fss和微型热管实现阵面散热的共形承载天线
US10693221B2 (en) 2015-07-22 2020-06-23 Blue Danube Systems, Inc. Modular phased array
WO2021244153A1 (fr) * 2020-06-02 2021-12-09 Oppo广东移动通信有限公司 Équipement de locaux clients

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6184832B1 (en) * 1996-05-17 2001-02-06 Raytheon Company Phased array antenna
EP1328042A1 (fr) * 2002-01-09 2003-07-16 EADS Deutschland GmbH Sub-système d'antenne à commande de phase

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6184832B1 (en) * 1996-05-17 2001-02-06 Raytheon Company Phased array antenna
EP1328042A1 (fr) * 2002-01-09 2003-07-16 EADS Deutschland GmbH Sub-système d'antenne à commande de phase

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10693221B2 (en) 2015-07-22 2020-06-23 Blue Danube Systems, Inc. Modular phased array
WO2017117360A1 (fr) * 2015-12-29 2017-07-06 Blue Danube Systems, Inc. Structure à faible impédance thermique dans une antenne réseau à commande de phase
KR20180098391A (ko) * 2015-12-29 2018-09-03 블루 다뉴브 시스템스, 인크. 위상 어레이에서의 낮은 열 임피던스 구조
US10084231B2 (en) 2015-12-29 2018-09-25 Blue Danube Systems, Inc. Low thermal impedance structure in a phased array
CN108701888A (zh) * 2015-12-29 2018-10-23 蓝色多瑙河系统有限公司 相控阵列中的低热阻抗结构
US10312581B2 (en) 2015-12-29 2019-06-04 Blue Danube Systems, Inc. Low thermal impedance structure in a phased array
CN107834152A (zh) * 2017-11-16 2018-03-23 西安电子科技大学 一种利用fss和微型热管实现阵面散热的共形承载天线
WO2021244153A1 (fr) * 2020-06-02 2021-12-09 Oppo广东移动通信有限公司 Équipement de locaux clients

Similar Documents

Publication Publication Date Title
JP7285348B2 (ja) 多重入出力アンテナ装置
CN100373999C (zh) 用于移动通信终端的散热系统和方法
US10806049B2 (en) Remote radio unit and active antenna system
US20120033384A1 (en) Graphite wrapped heat spreading pillow
JP5920123B2 (ja) 車載用アンテナ装置
US20190104644A1 (en) Electronic device
JP2012520584A (ja) 無線周波数ユニット及び統合アンテナ
EP2549589A1 (fr) Dispositifs de communication sans fil et procédé pour la dissipation de chaleur dans de tels dispositifs
CN111525227B (zh) 客户前置设备
US20130260702A1 (en) Active antenna array and method for transmitting radio signal
US20090036167A1 (en) System and method for base station heat dissipation using chimneys
JP2016127341A (ja) 無線装置
US20220338369A1 (en) Heat dissipation apparatus, circuit board assembly, and electronic device
JP2017063288A (ja) アンテナシステム
CN203013703U (zh) 散热元件及应用该散热元件的通讯装置
US6845812B2 (en) Heatsink with multiple, selectable fin densities
JP5531524B2 (ja) 無線通信装置
EP3861840B1 (fr) Ensemble refroidi par caloduc flexible
EP1429591A2 (fr) Dispositifs de communication
US10383251B1 (en) Heat dissipation structure of electronic device
CN104733869A (zh) Gps天线结构及具有该gps天线结构的无线通信装置
JP2018142055A (ja) ヒートシンク、回路基板、及び無線通信装置
KR20090119206A (ko) 무선통신기기의 함체장치의 열방출 구조
KR101690086B1 (ko) 방열판 구조
KR102401788B1 (ko) 방열 구조물 및 이를 포함하는 이더넷 전원 액세스 포인트

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20120719

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

AX Request for extension of the european patent

Extension state: BA ME

RBV Designated contracting states (corrected)

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

111Z Information provided on other rights and legal means of execution

Free format text: AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

Effective date: 20130410

RAP1 Party data changed (applicant data changed or rights of an application transferred)

Owner name: ALCATEL LUCENT

D11X Information provided on other rights and legal means of execution (deleted)
17Q First examination report despatched

Effective date: 20170130

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN

18D Application deemed to be withdrawn

Effective date: 20170810