EP2520889B1 - Vorrichtung und System zur Wärmeübertragung - Google Patents

Vorrichtung und System zur Wärmeübertragung Download PDF

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Publication number
EP2520889B1
EP2520889B1 EP12166179.7A EP12166179A EP2520889B1 EP 2520889 B1 EP2520889 B1 EP 2520889B1 EP 12166179 A EP12166179 A EP 12166179A EP 2520889 B1 EP2520889 B1 EP 2520889B1
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EP
European Patent Office
Prior art keywords
heat transfer
fluid
reservoir
heating means
diphasic
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EP12166179.7A
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English (en)
French (fr)
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EP2520889A1 (de
Inventor
Fabien Bonnet
Philippe Gully
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Commissariat a lEnergie Atomique et aux Energies Alternatives CEA
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Commissariat a lEnergie Atomique CEA
Commissariat a lEnergie Atomique et aux Energies Alternatives CEA
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/043—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure forming loops, e.g. capillary pumped loops

Definitions

  • the invention relates to a device and a system, particularly cryogenic, heat transfer, and a method for cooling or pre-cooling an object by means of such a device or such a system.
  • the device and the system of the invention make it possible in particular to achieve a thermal bond of high thermal conductivity between a cold source and an object to be cooled (hot source).
  • thermo switch which is to interrupt the heat transfer by an external action.
  • a transfer of heat over a distance of up to several meters can be achieved through different devices.
  • the metallic braid works by simple conduction of heat in a solid with high thermal conductivity.
  • the major disadvantage of such a device lies in the fact that it has a large mass, and all the more so that it is desired to obtain a low thermal resistance.
  • a gradient heat between the cold source and the object to be cooled can not be avoided.
  • the function "thermal switch" can not be ensured.
  • thermosiphon the "simple" heat pipe
  • fluid loop the fluid loop
  • thermosyphon In a thermosyphon, the two-phase fluid circulates under the effect of gravitational forces induced by the density difference between the liquid and the vapor.
  • the system may be a single channel where the descending liquid and the rising vapor circulate against the current, or a loop with a liquid channel and a steam channel.
  • the object In all cases, the object must be located lower than the cold source, which is a sometimes unacceptable constraint.
  • the thermosiphon does not work in microgravity and is therefore not suitable for space applications.
  • the "simple” heat pipe is a tube containing a capillary structure, commonly called “wick”, in thermal contact with the internal walls of the tube.
  • the liquid is located only in the wick and flows from the condenser to the evaporator.
  • the steam produced flows back to the condenser in a channel arranged in the center of the tube.
  • thermosiphon As in the case of the thermosiphon, the function "thermal switch" can not be carried out simply; however, reliable operation in micro gravity is possible. Rather used in rectilinear geometry to homogenize the temperature of an object, its integration in a complex system of thermal control can be problematic, because requiring non-rectilinear geometries. In addition, the heat pipe is not suitable for transporting heat over long distances (several meters) because of the significant head losses caused by the flow of liquid in the porous wick and the viscous interactions between the liquid and the vapor (training losses).
  • the fluid loop commonly known as the Loop Heat Pipe (LHP) or CPL (Capillary Pumped Loop) overcomes the disadvantages mentioned above of the "simple” heat pipe. It operates on the basis of the same principle as the latter, but the capillary structure is located only at the evaporator to generate the capillary pumping necessary for the circulation of the fluid; in addition, the evaporator and the condenser are connected by two separate pipes for the liquid and the steam. In this way, the pressure losses are lower, the heat transfer can take place over long distances and the use of non-rectilinear geometries is less problematic.
  • the function "thermal switch” can be achieved by simple heating localized on the liquid line that boils the liquid and causes the defusing of the loop.
  • cryogenic LHP or CPL The use of fluid loops at cryogenic temperatures poses the problem of pre-cooling the object ("hot source") in thermal contact with the evaporator. Indeed, for the capillary pumping to begin, it is necessary that the wick is drenched with the cryogenic fluid in the liquid state. But, in a fluid loop, the wick is only in the evaporator, that is to say in the "hot” part of the device. Pre-cooling is necessary to allow wetting of the wick.
  • Several solutions have been proposed to produce cryogenic LHP or CPL.
  • CCPL Cryogenic Capillary Pumped Loop
  • a secondary circuit comprising a secondary fluid line, a condenser, a diphasic reservoir and a secondary capillary pump.
  • this circuit allows the pre-cooling of the loop, in particular the liquid filling of the main evaporator.
  • This solution is described in the article of J. Yun, E. Kroliczek and L. Crawford "Development of a Cryogenic Loop Heat Pipe (HPLC) for Passive Optical Bench Cooling Applications", 32nd ICES 2002, SAE Paper No. 2002-01-2507, San Antonio, Texas, 2002 , as well as in the patent US 7,004,240 .
  • Another passive diphasic heat transfer device is the oscillating heat pipe, also known as the "Pulsating Heat Pipe” PHP.
  • This device consists of a single tube, of diameter less than the length capillary, forming several loops or undulations and filled with a two-phase fluid consisting of liquid, forming "liquid plugs", and steam, forming bubbles.
  • One end of each loop or ripple is in thermal contact with a hot source and the opposite end with a cold source. Under these conditions instability is created, causing an oscillatory movement of the liquid plugs and bubbles. This results in extremely efficient heat transfer.
  • the capillary can be closed at both ends (PHP "open”), or else loop back on itself (PHP "closed”, more efficient).
  • the two-phase heat transfer devices such as those described above can be described as "passive" when they perform their thermal stabilization function; however, when they are used at cryogenic temperatures, they require means - often active - pre-cooling which considerably complicate the structure and operation and / or impose constraints sometimes unacceptable (presence of a gravitational field, relative arrangement of some components).
  • a heat transfer device comprising a reservoir for storing a two-phase fluid, an evaporator that can be thermally connected to a heat source having a higher temperature than a cold source, a first and second condenser can be thermally connected to the cold source.
  • the invention aims to overcome the aforementioned disadvantages of the prior art by proposing a cryogenic heat transfer device of particularly simple structure, allowing both to pre-cool an object, independently and even against gravity, over long distances, but also to evacuate the heat released by the object once pre-cooled.
  • This device can be described as "active” because it exploits actuators (heat sources) to ensure the circulation of a two-phase fluid; however, no moving mechanical parts are necessary (except, in some embodiments, valves). It can perform alone the functions of pre-cooling and thermal stabilization, or be used only for the pre-cooling step of an object, the thermal stabilization can then be provided by a conventional passive device.
  • Another object of the invention is a heat transfer system comprising two devices as described above, thermally connected between said hot source and said cold source, or respective cold sources, wherein said control means are configured to activate the respective heating means periodically and in quadrature phase.
  • Another object of the invention is a heat transfer system, a device as described above and a passive two-phase heat transfer device, such as a fluidic loop heat pipe or an oscillating heat pipe, thermally connected between said hot source and said cold source, or respective cold sources.
  • said passive two-phase heat transfer device can be connected to said first and second tanks by a valve system enabling it to be filled with two-phase fluid.
  • Another object of the invention is a heat transfer system comprising a device as described above, in which an oscillatory heat pipe, thermally connected between said hot source and said cold source, is integrated in said fluid duct.
  • Yet another object of the invention is a method of cooling an object comprising a pre-cooling step as described above, followed by a thermal stabilization step by means of a two-phase passive transfer device. the heat.
  • a heat transfer device essentially comprises two tanks R1 and R2, preferably having the same capacity, connected to each other via a fluid duct CF.
  • This set contains a fluid in the two-phase state, liquid and vapor. It consists, in the direction R1 to R2, of a first condenser C1 (dark gray), a first section of the fluidic duct, an evaporator EV, a second section of the fluid duct (light gray), and a condenser C2.
  • the two-phase fluid LC has a critical temperature lower than the operating temperature of the object O to be cooled, and is partly in the liquid state at the temperature of the cold source.
  • it may be for example water, ammonia, or a cryogenic fluid such as nitrogen, oxygen, hydrogen, neon or liquid helium.
  • the device of the invention is particularly suitable for cryogenic applications (object temperatures of less than or equal to 200K or even 120K), or more generally to applications in which the object to be cooled must be brought to an operating temperature of less than the ambient temperature (conventionally, 20 ° C).
  • the quantity of two-phase fluid contained in the device must be sufficient to fill, in the liquid state, the fluidic conduit and at least a portion (typically 50% or 75%) of the internal volume of one of the reservoirs. At the same time, the device must not be completely filled with liquid, because in this case no circulation of the two-phase fluid could occur.
  • the first condenser C1 which is in the immediate vicinity of the first tank R1, is in thermal contact with a cold source SF, having means (for example a bath of cryogenic fluid or a cryo-refrigerator) capable of bringing its temperature T F at a value less than or equal to the saturation temperature of the two-phase fluid.
  • a cold source SF having means (for example a bath of cryogenic fluid or a cryo-refrigerator) capable of bringing its temperature T F at a value less than or equal to the saturation temperature of the two-phase fluid.
  • the evaporator EV located in the central portion of the fluidic conduit CF, is in thermal contact with a "hot plane" PC, which is a good thermal conductor element thermally connected to an object O to be cooled.
  • the hot PC plan serves as a "hot spring”; its temperature T C is greater than or equal to the saturation temperature of the two-phase fluid.
  • the first tank R1 is connected to the cold source via a first thermal resistor RTH1; similarly, the second tank R2 is connected to the cold source via a second thermal resistance RTH2.
  • the values of these resistors constitute important parameters for the dimensioning of the device of the invention, as will be discussed later.
  • the two tanks are equipped with respective heating means, MC1, MC2, for example electrical resistors.
  • a DC control device (computer, microprocessor card, etc.) transmits signals SMC1, SMC2 for controlling the two heating means MC1 and MC2.
  • a "hot" pressure reduction tank, RRP is connected to the fluidic conduit CF.
  • RRP is a conventional feature of cryogenic systems, designed to prevent excessive pressure build-up when the system is at ambient temperature.
  • the RRP reservoir may be absent: in this case, the device is under pressure at room temperature, in the supercritical domain; its cooling is then long, because the fluid must cool first by conduction in the gas, before condensing in the cold parts of the system.
  • the initial situation is considered in which the device, excluding the evaporator EV, is "cold" at the temperature T F.
  • the two tanks R1 and R2 are partially filled with liquid with a sky of vapor above. Both condensers C1 and C2 are completely full of liquid, while the rest of the duct, including the evaporator EV, is filled with steam.
  • the two heating means MC1, MC2 are extinguished and the system is thermalized: the tanks R1, R2 and the condensers C1, C2 are at the temperature of the cold source, T F , while the evaporator EV is located at the temperature of the hot plane, T C.
  • the first heating means MC1 is activated to inject heat into the first tank R1. This causes the evaporation of a small portion of the liquid contained therein, and therefore an increase in pressure which causes the expulsion of another large portion of liquid in the conduit CF to the second reservoir.
  • the liquid cools in the condenser C1. Under the effect of the overpressure induced by heating, the liquid then goes to the evaporator EV where it heats up, then evaporates partially or totally. In the latter case, the steam is superheated, that is to say that its temperature is higher than the saturation vapor temperature T SAT at the pressure prevailing in the fluid duct, at the outlet of EV. In doing so, the fluid extracts heat from the hot plane PC and object O.
  • the vapor (or the two-phase liquid / vapor) leaving the evaporator continues to flow to the second tank R2. Before doing so, however, it passes through the second condenser C2, where it gives heat to the cold source by condensing. At the output of C2, the fluid is two-phase. The vapor phase component of this fluid, entering the tank R2, condenses thanks to the cold power passing through the thermal resistance RTH2. The incoming liquid thus fills the tank R2.
  • the first reservoir R1 is empty of the liquid component of the two-phase fluid. Since the outlet tapping of the tank R1 is located in the lower part, when the liquid level passes below this tapping, the tank is almost empty. Pure steam comes out of R1, which is depressurized; therefore, its temperature drops. This drop in temperature is detected and is the signal that triggers the extinction of MC1 and the ignition of MC2. From this moment, the reservoir R2, which has partially filled with liquid, becomes the reservoir "source”, while R1 becomes the reservoir "recuperator". The flow rate of fluid in CF reverses. R2 empties under the effect of MC2. The cycle ends when R2 is almost empty. Then a new cycle can begin again to be repeated as much as necessary.
  • the signal triggering the extinction of MC1 and the ignition of MC2 could be the increase of the temperature of the tank R1 which occurs after the latter has emptied completely of liquid.
  • the Figures 1B and 1 C relate to variants of the device of the Figure 1A .
  • the two condensers are integrated in the same room, interposed between the tanks and the cold source.
  • the condensers are independent of each other, but always interposed between the tanks and the cold source.
  • the two condensers are independent of each other and tanks.
  • the figure 8A shows the evolution of the temperature T C of the full hot, which goes from 70K to 4.3K in less than one hour, for a thermal mass of 400J.
  • the Figure 8B shows the fluctuations of the temperatures T R1 , T R2 of the reservoirs and those, much less important, of the temperature T F of the cold source.
  • FIG. 1A refers to the case of a device operating in a gravitational field.
  • the heating means MC1 and MC2 are preferably located in the upper part of each tank, while the connections connecting the pipe CF to the tanks are in the lower part thereof. This arrangement makes it possible to ensure that the increase in pressure in the reservoir causes an injection of liquid, and no steam, into the conduit CF.
  • FIG. 2A and 2B The illustrated solution on Figures 2A and 2B is to use a porous material MP, wettable by the cryogenic liquid so as to be gorged by it, completely (almost) filling each R reservoir.
  • the heating means MC is located in the center of the tank, in contact with the porous material. When this heating means is activated, a temperature gradient is created in the porous material, with temperatures higher than the saturated vapor temperature (ie at the boiling or liquefying temperature of the fluid). ) in the center and lower on the periphery.
  • the heating means may be disposed at one end of the reservoir and tapping of the CF conduit at the opposite end.
  • the device of the Figure 1A can be used alone as a thermal link allowing the pre-cooling of the object O, from an arbitrarily high temperature towards the temperature of the cold source, as well as its maintenance at low temperature (thermal stabilization). Thanks to the active nature of the device, the thermal switch function is performed very simply: simply do not activate the tank heating means.
  • the device can also be a component of a more complex cryogenic heat transfer system.
  • FIG. 3 A first example of such a system is illustrated on the figure 3 .
  • This system consists of two devices according to the Figure 1A , identified by the references Da, Db.
  • the different components of these devices are identified by the letters “a” and “b", thus, for example, "R1a” is the first reservoir of the device “a” and so on.
  • the control devices Dca, DCb emit signals sMC1a / sMC2a, sMC1b / sMC2b of the four heating means MC1a / MC2a, MC1b / MC2b which are in "quadrature phase", that is to say shifted temporally by a quarter (or three quarters, which is equivalent) of the duration of a complete cycle.
  • the two devices are identical, and have equal cycle times.
  • the two control devices Dca, DCb can be made in the form of a single device.
  • the device of the Figure 1A is used to perform the pre-cooling of the object O and hot plane PC, the thermal stabilization function being provided by a passive device of conventional type connected in parallel between the cold source SF and said hot plane.
  • the figure 4 shows such a system, in which the thermal stabilization function is provided by a fluid loop LHP comprising an evaporator EVc, in thermal contact with the hot plane PC and containing the capillary wick M, a compensation chamber CC arranged upstream of said evaporator, a fluid duct CFc connected to a hot pressure reduction chamber PRPc.
  • the device of the invention is used to pre-cool the hot plane to a temperature allowing the presence of liquid in the compensation chamber and in the evaporator of the fluid loop LHP. Once initiated, it takes over.
  • the thermal stabilization function after pre-cooling is provided by a closed-type heat pump, PHPF.
  • each device is equipped with its own pressure reduction tank RRP, RRPa, RRPb, RRPc, RRPd. Indeed, depending on the operating regime of the system, these tanks can be at different temperatures. The use of a common "hot" tank would require the use of a complex system of valves.
  • the system of Figures 7A - 7C comprises a device D of the type illustrated on the Figure 1A and an oscillating heat pipe PHPF 'connected in parallel between the cold source and the hot plane.
  • the two ends of the oscillating heat pipe are connected to the first and second condensers of the device via the three-way valves V3V1, V3V2; in this way, the heat pipe is looped on itself via the fluidic conduit CF.
  • valves are in a first position isolating the oscillating heat pipe, which is filled with steam.
  • the device D operates in the manner described above to pre-cool the hot plane PC and the object O.
  • valves move to a second position, in which they connect the oscillating heat pipe to the two reservoirs R1, R2 of the device D ( Figure 7B ).
  • the activation of the heating means of the source reservoir (R1, in this case) causes the expulsion of liquid from the latter and the filling of the oscillating heat pipe.
  • valves pass into a third position in which the fluidic conduit CF of the device D is connected to the oscillating heat pipe to form an additional loop or wave of the latter.
  • the heating means are inactivated and the system operates passively, as a conventional oscillatory heat pipe.
  • the fluidic conduit CF is capillary, as shown by the alternation of liquid plugs and bubbles visible on the Figure 7C ; however, its length is much less than that of the duct of the figure 6 (which alone forms an oscillating heat pipe), therefore the pressure losses are lower.
  • the device of the invention could be used for pre-cooling and filling a CPL or LHP type fluid loop.

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Claims (16)

  1. Wärmetransfervorrichtung, umfassend:
    - ein erstes Reservoir (R1) zum Speichern eines zweiphasigen Fluids (LC), welches mit einem ersten Heizmittel (MC1) ausgestattet ist und über einen ersten Wärmewiderstand (RTH1) mit einer Kältequelle (SF) verbunden ist;
    - ein zweites Reservoir (R2) zum Speichern des zweiphasigen Fluids, welches mit einem zweiten Heizmittel (MC2) ausgestattet ist und über einen zweiten Wärmewiderstand (RTH2) mit der oder einer weiteren Kältequelle verbunden ist; und
    - eine von dem zweiphasigen Fluid (CF) durchquerbare Fluidleitung (CF), welche das erste und zweite Reservoir verbindet, wobei die Leitung wenigstens umfasst:
    - einen Verdampfer (EV), welcher mit einer Wärmequelle (PC, O) thermisch verbindbar ist, welche eine höhere Temperatur als diejenige der Kältequelle aufweist;
    - einen ersten (C1) und einen zweiten (C2) Kondensator, welche sich auf beiden Seiten des Verdampfers befinden und thermisch mit der Kältequelle verbindbar sind;
    wobei das erste und zweite Heizmittel und die Fluidleitung derart eingerichtet sind, dass die Aktivierung des ersten Heizmittels den Ausstoß des zweiphasigen Fluids aus dem ersten Reservoir durch die Fluidleitung in Richtung des zweiten Reservoirs bewirkt, und die Aktivierung des zweiten Heizmittels den Ausstoß des zweiphasigen Fluids aus dem zweiten Reservoir durch die Fluidleitung in Richtung des ersten Reservoirs bewirkt.
  2. Wärmetransfervorrichtung nach Anspruch 1, beinhaltend ein genanntes zweiphasiges Fluid in einer Menge, welche wenigstens ausreichend ist, um im flüssigen Zustand die Fluidleitung und einen Teil des Volumens eines von dem ersten und zweiten Reservoir zu füllen, jedoch unzureichend ist, um im flüssigen Zustand die beiden Reservoirs und die Fluidleitung zu füllen.
  3. Wärmetransfervorrichtung nach einem der vorhergehenden Ansprüche, wobei das erste und zweite Reservoir ein Fassungsvermögen aufweisen, welches größer ist als dasjenige der Fluidleitung.
  4. Wärmetransfervorrichtung nach einem der vorhergehenden Ansprüche, wobei das erste und zweite Reservoir ein gleiches Fassungsvermögen aufweisen.
  5. Wärmetransfervorrichtung nach einem der vorhergehenden Ansprüche, wobei das zweiphasige Fluid ein Kühlmittelfluid ist, welches eine kritische Temperatur von kleiner oder gleich 200 K aufweist.
  6. Wärmetransfervorrichtung nach einem der vorhergehenden Ansprüche, umfassend außerdem wenigstens eine genannte Kältequelle (SF), welche Kühlmittel umfasst, die ausgestaltet sind, eine Temperatur bereitzustellen, welche die Existenz einer flüssigen Phase des Fluids im Inneren der Reservoirs ermöglicht.
  7. Wärmetransfervorrichtung nach einem der vorhergehenden Ansprüche, wobei die Fluidleitung mit dem ersten und zweiten Reservoir über entsprechende Abzweigungen verbunden ist, welche an unteren Enden der letzteren realisiert sind.
  8. Wärmetransfervorrichtung nach einem der Ansprüche 1-6, wobei jedes von dem ersten und zweiten Reservoir ein poröses wärmeleitfähiges Material (MP), welches von der flüssigen Phase des zweiphasigen Fluids benetzbar ist, im thermischen Kontakt mit dem Heizmittel enthält.
  9. Wärmetransfervorrichtung nach einem der vorhergehenden Ansprüche, wobei die Fluidleitung mit einem Reservoir zur Druckreduktion (RRP) verbunden ist.
  10. Wärmetransfervorrichtung nach einem der vorhergehenden Ansprüche, umfassend außerdem eine Steuervorrichtung (DC), welche ausgestaltet ist, alternativ das erste und das zweite Heizmittel auf solche Weise zu aktivieren, dass ein Transfer des zweiphasigen Fluids aus dem ersten Reservoir in das zweite Reservoir und umgekehrt bewirkt wird.
  11. Wärmetransfersystem, umfassend zwei Vorrichtungen (Da, Db) nach Anspruch 10, welche thermisch zwischen die Wärmequelle und die Kältequelle oder die jeweiligen Kältequellen verbunden sind, wobei die Steuervorrichtungen (Dca, DCb) ausgestaltet sind, die jeweiligen Heizmittel auf periodische Weise und mit 90° Phasenverschiebung zu aktivieren.
  12. Wärmetransfersystem, umfassend eine Vorrichtung (D) nach einem der Ansprüche 1-10 und eine passive Zweiphasenwärmetransfervorrichtung (LHP, PHPF, PHPO, PHPF'), wie beispielsweise ein Wärmerohr mit einem Fluidkreislauf oder ein Oszillationswärmerohr, welche thermisch zwischen die Wärmequelle und die Kältequelle oder die jeweiligen Kältequellen verbunden sind.
  13. Wärmetransfersystem nach Anspruch 12, wobei die passive Zweiphasenwärmetransfervorrichtung mit dem ersten und zweiten Reservoir über ein Ventilsystem (V3V1, V3V2) verbunden ist, welches ihre Befüllung mit zweiphasigem Fluid ermöglicht.
  14. Wärmetransfersystem, umfassend eine Vorrichtung nach einem der Ansprüche 1-10, wobei ein Oszillationswärmerohr (PHPO), welches thermisch zwischen die Wärmequelle und die Kältequelle verbunden ist, in der Fluidleitung integriert ist.
  15. Verfahren zur Kühlung oder Vorkühlung eines Objekts mittels einer Vorrichtung nach einem der Ansprüche 1-10, umfassend die folgenden Schritte:
    a. thermisches Verbinden des Objekts mit dem Verdampfer der Vorrichtung, so dass es als Wärmequelle dient;
    b. thermisches Verbinden des ersten und zweiten Reservoirs, sowie des ersten und zweiten Kondensators, mit der Kältequelle oder mit den jeweiligen Kältequellen, so dass eine zumindest teilweise Befüllung wenigstens des ersten Reservoirs durch eine flüssige Phase des zweiphasigen Fluids bewirkt wird;
    c. Aktivieren des ersten Heizmittels, so dass die flüssige Phase durch den Verdampfer, wo sie wenigstens teilweise unter Kühlung des Objekts verdampft, und den zweiten Kondensator, wo der so gebildete Dampf in den zweiphasigen Zustand zurückkehrt, in Richtung des zweiten Reservoirs fließt;
    d. wenn das erste Reservoir im Wesentlichen von der flüssigen Phase entleert ist, Deaktivieren des ersten Heizmittels;
    e. Aktivieren des zweiten Heizmittels, so dass die flüssige Phase des zweiphasigen Fluids durch den Verdampfer, wo sie wenigstens teilsweise unter Kühlung des Objekts verdampft, und den ersten Kondensator, wo der so gebildete Dampf in den zweiphasigen Zustand zurückkehrt, in Richtung des ersten Reservoirs fließt; und
    f. wenn das zweite Reservoir im Wesentlichen von der flüssigen Phase entleert ist, Deaktivieren des zweiten Heizmittels;
    wobei die Schritte c. bis f. auf zyklische Weise wiederholt werden.
  16. Verfahren zur Kühlung eines Objekts, umfassend einen Vorkühlungsschritt nach Anspruch 15, gefolgt von einem thermischen Stabilisierungsschritt mittels einer passiven Zweiphasenwärmetransfervorrichtung.
EP12166179.7A 2011-05-02 2012-04-30 Vorrichtung und System zur Wärmeübertragung Not-in-force EP2520889B1 (de)

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FR2984472B1 (fr) * 2011-12-20 2015-10-02 Astrium Sas Dispositif de regulation thermique passif
US20150168079A1 (en) * 2013-12-17 2015-06-18 General Electric Company System and method for transferring heat between two units
US10126024B1 (en) 2014-09-26 2018-11-13 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Cryogenic heat transfer system
DE102016213993A1 (de) * 2016-07-29 2018-02-01 Siemens Aktiengesellschaft System mit einer elektrischen Maschine mit kryogener Komponente und Verfahren zum Betreiben des Systems
EP3343161B1 (de) * 2016-12-28 2023-07-12 Ricoh Company, Ltd. Loop-wärmerohrdocht, loop-wärmerohr, kühlvorrichtung und elektronische vorrichtung und verfahren zur herstellung von porösem kautschuk und verfahren zur herstellung von einem loop-wärmerohrdocht
CN107238450A (zh) * 2017-06-05 2017-10-10 安徽万瑞冷电科技有限公司 一种低温流体传输管线漏热测试装置及方法
US11051428B2 (en) * 2019-10-31 2021-06-29 Hamilton Sunstrand Corporation Oscillating heat pipe integrated thermal management system for power electronics

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US7004240B1 (en) * 2002-06-24 2006-02-28 Swales & Associates, Inc. Heat transport system
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US20030192674A1 (en) * 2002-04-02 2003-10-16 Mitsubishi Denki Kabushiki Kaisha Heat transport device
US6948556B1 (en) * 2003-11-12 2005-09-27 Anderson William G Hybrid loop cooling of high powered devices

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