EP2513932B1 - Herstellungsverfahren eines kontaktplättchens eines elektrischen kontakts und eines elektrischen kontakts - Google Patents

Herstellungsverfahren eines kontaktplättchens eines elektrischen kontakts und eines elektrischen kontakts Download PDF

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Publication number
EP2513932B1
EP2513932B1 EP10793241.0A EP10793241A EP2513932B1 EP 2513932 B1 EP2513932 B1 EP 2513932B1 EP 10793241 A EP10793241 A EP 10793241A EP 2513932 B1 EP2513932 B1 EP 2513932B1
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powder
contact
pad
support
grains
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EP10793241.0A
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English (en)
French (fr)
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EP2513932A1 (de
Inventor
Gilles Rolland
Michel Jeandin
Christine Bourda
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Metalor Technologies International SA
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Metalor Technologies International SA
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00Contacts
    • H01H1/02Contacts characterised by the material thereof
    • H01H1/021Composite material
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C24/00Coating starting from inorganic powder
    • C23C24/02Coating starting from inorganic powder by application of pressure only
    • C23C24/04Impact or kinetic deposition of particles
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/02Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
    • C23C28/021Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material including at least one metal alloy layer
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/02Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
    • C23C28/023Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material only coatings of metal elements only
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/02Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
    • C23C28/027Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material including at least one metal matrix material comprising a mixture of at least two metals or metal phases or metal matrix composites, e.g. metal matrix with embedded inorganic hard particles, CERMET, MMC.
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H11/00Apparatus or processes specially adapted for the manufacture of electric switches
    • H01H11/04Apparatus or processes specially adapted for the manufacture of electric switches of switch contacts
    • H01H11/048Apparatus or processes specially adapted for the manufacture of electric switches of switch contacts by powder-metallurgical processes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00Contacts
    • H01H1/02Contacts characterised by the material thereof
    • H01H1/021Composite material
    • H01H1/023Composite material having a noble metal as the basic material
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00Contacts
    • H01H1/02Contacts characterised by the material thereof
    • H01H1/021Composite material
    • H01H1/025Composite material having copper as the basic material
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49204Contact or terminal manufacturing
    • Y10T29/49208Contact or terminal manufacturing by assembling plural parts

Claims (23)

  1. Herstellungsverfahren mindestens eines Kontaktplättchens eines elektrischen Kontakts, der einen Kontaktplättchenträger und mindestens eine Kontaktschicht umfasst, der einen Aufbringungsschritt durch dynamische Kaltgasprojektion eines ersten Pulvers auf den Kontaktplättchenträger umfasst, um die Kontaktschicht zu bilden, dadurch gekennzeichnet, dass das erste Pulver mindestens Partikel enthält, die Körner mindestens eines hitzebeständigen Materials umfassen, die in eine Matrix auf der Basis leitenden Metalls eingearbeitet sind, das aus dem Silber oder dem Kupfer ausgewählt ist.
  2. Herstellungsverfahren mindestens eines elektrischen Kontakts, der einen Kontaktträger und mindestens ein Kontaktplätchen umfasst, dadurch gekennzeichnet, dass es umfasst:
    - einen Herstellungsschritt des Kontaktplättchens durch das Verfahren nach Anspruch 1, und
    - einen Verbindungsschritt des Kontaktplättchens auf dem Kontaktträger.
  3. Herstellungsverfahren mindestens eines elektrischen Kontakts, der einen Kontaktträger und mindestens eine Kontaktschicht umfasst, der einen Aufbringungsschritt durch dynamische Kaltgasprojektion eines ersten Pulvers auf den Kontaktträger umfasst, um die Kontaktschicht zu bilden, dadurch gekennzeichnet, dass das erste Pulver mindestens Partikel enthält, die Körner mindestens eines hitzebeständigen Materials umfassen, die in eine Matrix auf der Basis leitenden Metalls eingearbeitet sind, das aus dem Silber oder dem Kupfer ausgewählt ist.
  4. Herstellungsverfahren eines Kontaktplättchens eines elektrischen Kontakts nach Anspruch 1 oder eines elektrischen Kontakts nach einem der Ansprüche 2 und 3, dadurch gekennzeichnet, dass das erste Pulver ferner Reinmetallpartikel enthält, die dem leitenden Metall der Matrix entsprechen, die die Körner hitzebeständigen Materials einschließt.
  5. Verfahren nach einem der vorangehenden Ansprüche, dadurch gekennzeichnet, dass das erste Pulver ferner Partikel enthält, die Körner mindestens eines dotierenden Mittels umfassen, die in eine metallische Matrix eingearbeitet sind, deren Metall dem leitenden Metall der Matrix entspricht, die die Körner hitzebeständigen Materials einschließt.
  6. Verfahren nach einem der vorangehenden Ansprüche, dadurch gekennzeichnet, dass mindestens ein dotierendes Mittel mit Körnern hitzebeständigen Materials in ihre Matrix aus leitendem Metall eingearbeitet ist.
  7. Verfahren nach einem der vorangehenden Ansprüche, dadurch gekennzeichnet, dass mindestens ein dotierendes Mittel in die Matrix eingearbeitet ist, die die Körner hitzebeständigen Materials einschließt.
  8. Verfahren nach einem der Ansprüche 5 bis 7, dadurch gekennzeichnet, dass das dotierende Mittel ein Metall oder ein Oxid dieses Metalls ist, wobei das Metall aus der Gruppe ausgewählt ist, die Bi, Mo, W, Re, In und Cu umfasst.
  9. Verfahren nach einem der vorangehenden Ansprüche dadurch gekennzeichnet, dass das hitzebeständige Material aus der Gruppe ausgewählt ist, die CdO, CuO, SnO2, ZnO, Bi2O3, C, WC, MgO, In2O3 sowie Ni, Fe, Mo, Zr, W oder ihre Oxide umfasst.
  10. Verfahren nach einem der vorangehenden Ansprüche, dadurch gekennzeichnet, dass das erste Pulver zwischen 2 Vol.-% und 50 Vol.-% und vorzugsweise zwischen 5 Vol.-% und 40 Vol.-% und in noch bevorzugter Weise zwischen 10 Vol.-% und 40 Vol.-% Körner hitzebeständigen Materials im Verhältnis zum Gesamtvolumen des ersten Pulvers enthält.
  11. Verfahren nach einem der vorangehenden Ansprüche, dadurch gekennzeichnet, dass die Partikel, die die Körner mindestens eines hitzebeständigen Materials umfassen, die in die Matrix des leitenden Metalls eingearbeitet sind, anhand eines Verfahrens hergestellt sind, das aus der Gruppe ausgewählt ist, die die Verfahren des physikalischen Aufbringens in der Dampfphase (Physical Vapour Déposition PVD), die Verfahrens des chemischen Aufbringen in der Dampfphase (Chemical Vapour Déposition CVD), die Elektroless-Verfahren, die chemische Ausfällung auf Partikel in Suspension umfasst.
  12. Verfahren nach Anspruch 3, dadurch gekennzeichnet, dass sich der Kontaktträger in Form vorgeschnittener individueller Teile darstellt.
  13. Verfahren nach Anspruch 3, dadurch gekennzeichnet, dass sich der Kontaktträger in Form eines kontinuierlichen Streifens darstellt, und dass das Verfahren ferner einen Schneideschritt des Streifens umfasst, um elektrische Kontakte zu bilden.
  14. Verfahren nach Anspruch 13, dadurch gekennzeichnet, dass die Kontaktschicht auf dem Streifen getrennte Kontaktpunkte bildet.
  15. Verfahren nach Anspruch 13, dadurch gekennzeichnet, dass die Kontaktschicht auf dem Streifen mindestens eine kontinuierliche Bahn bildet.
  16. Verfahren nach einem der Ansprüche 12 bis 15, dadurch gekennzeichnet, dass der Kontaktträger aus einem Material hergestellt ist, das aus der Gruppe ausgewählt ist, die das Kupfer, das Aluminium, die Kupferlegierungen, die Aluminiumlegierungen und einen Stahl-Kupfer-Verbund umfasst.
  17. Verfahren nach einem der Ansprüche 3 und 12 bis 16, dadurch gekennzeichnet, dass es ferner vor dem Schritt des Aufbringens der Kontaktschicht mindestens einen Applikationsschritt durch dynamische Kaltgasprojektion mindestens eines zweiten Pulvers auf den Kontaktträger umfasst, um mindestens eine verbindende Unterschicht zu bilden, wobei das zweite Pulver mindestens Partikel einer leitenden metallischen Verbindung enthält.
  18. Verfahren nach einem der vorangehenden Ansprüche, dadurch gekennzeichnet, dass es ferner nach dem Schritt des Aufbringens der Kontaktschicht mindestens einen Schritt des Aufbringens durch dynamische Kaltgasprojektion mindestens eines dritten Pulvers umfasst, um mindestens eine Überschicht zu bilden, wobei das dritte Pulver eine Zusammensetzung aufweist, die sich der des ersten Pulvers unterscheidet.
  19. Verfahren nach Anspruch 1, dadurch gekennzeichnet, dass es ferner vor dem Schritt des Aufbringens der Kontaktschicht mindestens einen Applikationsschritt durch dynamische Kaltgasprojektion mindestens eines zweiten Pulvers auf den Kontaktplättchenträger umfasst, um mindestens eine verbindende Unterschicht zu bilden.
  20. Verfahren nach einem der Ansprüche 17 bis 19, dadurch gekennzeichnet, dass die Größe der Partikel des ersten, zweiten und dritten Pulvers zwischen 10 µm und 300 µm inklusive ist.
  21. Verfahren nach Anspruch 1, dadurch gekennzeichnet, dass sich der Kontaktplättchenträger in Form eines kontinuierlichen Streifens darstellt, und dass das Verfahren ferner einen Schneideschritt des Streifens umfasst, um Kontaktplättchen elektrischer Kontakte zu bilden.
  22. Elektrischer Kontakt, der durch das Verfahren nach einem der Ansprüche 2 und 3 und 12 bis 17 herstellbar ist.
  23. Kontaktplättchen eines elektrischen Kontakts, das durch das Verfahren nach einem der Ansprüche 1, 19 und 21 herstellbar ist.
EP10793241.0A 2009-12-18 2010-12-16 Herstellungsverfahren eines kontaktplättchens eines elektrischen kontakts und eines elektrischen kontakts Revoked EP2513932B1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP10793241.0A EP2513932B1 (de) 2009-12-18 2010-12-16 Herstellungsverfahren eines kontaktplättchens eines elektrischen kontakts und eines elektrischen kontakts

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP09179852A EP2337044A1 (de) 2009-12-18 2009-12-18 Herstellungsverfahren eines Kontaktplättchens eines elektrischen Kontakts und eines elektrischen Kontakts
EP10793241.0A EP2513932B1 (de) 2009-12-18 2010-12-16 Herstellungsverfahren eines kontaktplättchens eines elektrischen kontakts und eines elektrischen kontakts
PCT/EP2010/069885 WO2011073314A1 (fr) 2009-12-18 2010-12-16 Procedes de fabrication d'un plot de contact electrique et d'un contact electrique

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EP2513932A1 EP2513932A1 (de) 2012-10-24
EP2513932B1 true EP2513932B1 (de) 2013-11-27

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EP09179852A Withdrawn EP2337044A1 (de) 2009-12-18 2009-12-18 Herstellungsverfahren eines Kontaktplättchens eines elektrischen Kontakts und eines elektrischen Kontakts
EP10793241.0A Revoked EP2513932B1 (de) 2009-12-18 2010-12-16 Herstellungsverfahren eines kontaktplättchens eines elektrischen kontakts und eines elektrischen kontakts

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EP09179852A Withdrawn EP2337044A1 (de) 2009-12-18 2009-12-18 Herstellungsverfahren eines Kontaktplättchens eines elektrischen Kontakts und eines elektrischen Kontakts

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Country Link
US (1) US20120305300A1 (de)
EP (2) EP2337044A1 (de)
JP (1) JP2013514614A (de)
CN (1) CN102763183B (de)
BR (1) BR112012014648A2 (de)
CA (1) CA2788260A1 (de)
MX (1) MX337345B (de)
WO (1) WO2011073314A1 (de)

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Also Published As

Publication number Publication date
BR112012014648A2 (pt) 2017-03-14
CN102763183A (zh) 2012-10-31
MX2012007066A (es) 2012-10-03
EP2337044A1 (de) 2011-06-22
US20120305300A1 (en) 2012-12-06
EP2513932A1 (de) 2012-10-24
JP2013514614A (ja) 2013-04-25
MX337345B (es) 2014-08-22
CA2788260A1 (fr) 2011-06-23
CN102763183B (zh) 2015-03-11
WO2011073314A1 (fr) 2011-06-23

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