EP2513932B1 - Herstellungsverfahren eines kontaktplättchens eines elektrischen kontakts und eines elektrischen kontakts - Google Patents
Herstellungsverfahren eines kontaktplättchens eines elektrischen kontakts und eines elektrischen kontakts Download PDFInfo
- Publication number
- EP2513932B1 EP2513932B1 EP10793241.0A EP10793241A EP2513932B1 EP 2513932 B1 EP2513932 B1 EP 2513932B1 EP 10793241 A EP10793241 A EP 10793241A EP 2513932 B1 EP2513932 B1 EP 2513932B1
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- EP
- European Patent Office
- Prior art keywords
- powder
- contact
- pad
- support
- grains
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H1/00—Contacts
- H01H1/02—Contacts characterised by the material thereof
- H01H1/021—Composite material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C24/00—Coating starting from inorganic powder
- C23C24/02—Coating starting from inorganic powder by application of pressure only
- C23C24/04—Impact or kinetic deposition of particles
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
- C23C28/021—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material including at least one metal alloy layer
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
- C23C28/023—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material only coatings of metal elements only
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
- C23C28/027—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material including at least one metal matrix material comprising a mixture of at least two metals or metal phases or metal matrix composites, e.g. metal matrix with embedded inorganic hard particles, CERMET, MMC.
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H11/00—Apparatus or processes specially adapted for the manufacture of electric switches
- H01H11/04—Apparatus or processes specially adapted for the manufacture of electric switches of switch contacts
- H01H11/048—Apparatus or processes specially adapted for the manufacture of electric switches of switch contacts by powder-metallurgical processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H1/00—Contacts
- H01H1/02—Contacts characterised by the material thereof
- H01H1/021—Composite material
- H01H1/023—Composite material having a noble metal as the basic material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H1/00—Contacts
- H01H1/02—Contacts characterised by the material thereof
- H01H1/021—Composite material
- H01H1/025—Composite material having copper as the basic material
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49204—Contact or terminal manufacturing
- Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
Claims (23)
- Herstellungsverfahren mindestens eines Kontaktplättchens eines elektrischen Kontakts, der einen Kontaktplättchenträger und mindestens eine Kontaktschicht umfasst, der einen Aufbringungsschritt durch dynamische Kaltgasprojektion eines ersten Pulvers auf den Kontaktplättchenträger umfasst, um die Kontaktschicht zu bilden, dadurch gekennzeichnet, dass das erste Pulver mindestens Partikel enthält, die Körner mindestens eines hitzebeständigen Materials umfassen, die in eine Matrix auf der Basis leitenden Metalls eingearbeitet sind, das aus dem Silber oder dem Kupfer ausgewählt ist.
- Herstellungsverfahren mindestens eines elektrischen Kontakts, der einen Kontaktträger und mindestens ein Kontaktplätchen umfasst, dadurch gekennzeichnet, dass es umfasst:- einen Herstellungsschritt des Kontaktplättchens durch das Verfahren nach Anspruch 1, und- einen Verbindungsschritt des Kontaktplättchens auf dem Kontaktträger.
- Herstellungsverfahren mindestens eines elektrischen Kontakts, der einen Kontaktträger und mindestens eine Kontaktschicht umfasst, der einen Aufbringungsschritt durch dynamische Kaltgasprojektion eines ersten Pulvers auf den Kontaktträger umfasst, um die Kontaktschicht zu bilden, dadurch gekennzeichnet, dass das erste Pulver mindestens Partikel enthält, die Körner mindestens eines hitzebeständigen Materials umfassen, die in eine Matrix auf der Basis leitenden Metalls eingearbeitet sind, das aus dem Silber oder dem Kupfer ausgewählt ist.
- Herstellungsverfahren eines Kontaktplättchens eines elektrischen Kontakts nach Anspruch 1 oder eines elektrischen Kontakts nach einem der Ansprüche 2 und 3, dadurch gekennzeichnet, dass das erste Pulver ferner Reinmetallpartikel enthält, die dem leitenden Metall der Matrix entsprechen, die die Körner hitzebeständigen Materials einschließt.
- Verfahren nach einem der vorangehenden Ansprüche, dadurch gekennzeichnet, dass das erste Pulver ferner Partikel enthält, die Körner mindestens eines dotierenden Mittels umfassen, die in eine metallische Matrix eingearbeitet sind, deren Metall dem leitenden Metall der Matrix entspricht, die die Körner hitzebeständigen Materials einschließt.
- Verfahren nach einem der vorangehenden Ansprüche, dadurch gekennzeichnet, dass mindestens ein dotierendes Mittel mit Körnern hitzebeständigen Materials in ihre Matrix aus leitendem Metall eingearbeitet ist.
- Verfahren nach einem der vorangehenden Ansprüche, dadurch gekennzeichnet, dass mindestens ein dotierendes Mittel in die Matrix eingearbeitet ist, die die Körner hitzebeständigen Materials einschließt.
- Verfahren nach einem der Ansprüche 5 bis 7, dadurch gekennzeichnet, dass das dotierende Mittel ein Metall oder ein Oxid dieses Metalls ist, wobei das Metall aus der Gruppe ausgewählt ist, die Bi, Mo, W, Re, In und Cu umfasst.
- Verfahren nach einem der vorangehenden Ansprüche dadurch gekennzeichnet, dass das hitzebeständige Material aus der Gruppe ausgewählt ist, die CdO, CuO, SnO2, ZnO, Bi2O3, C, WC, MgO, In2O3 sowie Ni, Fe, Mo, Zr, W oder ihre Oxide umfasst.
- Verfahren nach einem der vorangehenden Ansprüche, dadurch gekennzeichnet, dass das erste Pulver zwischen 2 Vol.-% und 50 Vol.-% und vorzugsweise zwischen 5 Vol.-% und 40 Vol.-% und in noch bevorzugter Weise zwischen 10 Vol.-% und 40 Vol.-% Körner hitzebeständigen Materials im Verhältnis zum Gesamtvolumen des ersten Pulvers enthält.
- Verfahren nach einem der vorangehenden Ansprüche, dadurch gekennzeichnet, dass die Partikel, die die Körner mindestens eines hitzebeständigen Materials umfassen, die in die Matrix des leitenden Metalls eingearbeitet sind, anhand eines Verfahrens hergestellt sind, das aus der Gruppe ausgewählt ist, die die Verfahren des physikalischen Aufbringens in der Dampfphase (Physical Vapour Déposition PVD), die Verfahrens des chemischen Aufbringen in der Dampfphase (Chemical Vapour Déposition CVD), die Elektroless-Verfahren, die chemische Ausfällung auf Partikel in Suspension umfasst.
- Verfahren nach Anspruch 3, dadurch gekennzeichnet, dass sich der Kontaktträger in Form vorgeschnittener individueller Teile darstellt.
- Verfahren nach Anspruch 3, dadurch gekennzeichnet, dass sich der Kontaktträger in Form eines kontinuierlichen Streifens darstellt, und dass das Verfahren ferner einen Schneideschritt des Streifens umfasst, um elektrische Kontakte zu bilden.
- Verfahren nach Anspruch 13, dadurch gekennzeichnet, dass die Kontaktschicht auf dem Streifen getrennte Kontaktpunkte bildet.
- Verfahren nach Anspruch 13, dadurch gekennzeichnet, dass die Kontaktschicht auf dem Streifen mindestens eine kontinuierliche Bahn bildet.
- Verfahren nach einem der Ansprüche 12 bis 15, dadurch gekennzeichnet, dass der Kontaktträger aus einem Material hergestellt ist, das aus der Gruppe ausgewählt ist, die das Kupfer, das Aluminium, die Kupferlegierungen, die Aluminiumlegierungen und einen Stahl-Kupfer-Verbund umfasst.
- Verfahren nach einem der Ansprüche 3 und 12 bis 16, dadurch gekennzeichnet, dass es ferner vor dem Schritt des Aufbringens der Kontaktschicht mindestens einen Applikationsschritt durch dynamische Kaltgasprojektion mindestens eines zweiten Pulvers auf den Kontaktträger umfasst, um mindestens eine verbindende Unterschicht zu bilden, wobei das zweite Pulver mindestens Partikel einer leitenden metallischen Verbindung enthält.
- Verfahren nach einem der vorangehenden Ansprüche, dadurch gekennzeichnet, dass es ferner nach dem Schritt des Aufbringens der Kontaktschicht mindestens einen Schritt des Aufbringens durch dynamische Kaltgasprojektion mindestens eines dritten Pulvers umfasst, um mindestens eine Überschicht zu bilden, wobei das dritte Pulver eine Zusammensetzung aufweist, die sich der des ersten Pulvers unterscheidet.
- Verfahren nach Anspruch 1, dadurch gekennzeichnet, dass es ferner vor dem Schritt des Aufbringens der Kontaktschicht mindestens einen Applikationsschritt durch dynamische Kaltgasprojektion mindestens eines zweiten Pulvers auf den Kontaktplättchenträger umfasst, um mindestens eine verbindende Unterschicht zu bilden.
- Verfahren nach einem der Ansprüche 17 bis 19, dadurch gekennzeichnet, dass die Größe der Partikel des ersten, zweiten und dritten Pulvers zwischen 10 µm und 300 µm inklusive ist.
- Verfahren nach Anspruch 1, dadurch gekennzeichnet, dass sich der Kontaktplättchenträger in Form eines kontinuierlichen Streifens darstellt, und dass das Verfahren ferner einen Schneideschritt des Streifens umfasst, um Kontaktplättchen elektrischer Kontakte zu bilden.
- Elektrischer Kontakt, der durch das Verfahren nach einem der Ansprüche 2 und 3 und 12 bis 17 herstellbar ist.
- Kontaktplättchen eines elektrischen Kontakts, das durch das Verfahren nach einem der Ansprüche 1, 19 und 21 herstellbar ist.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP10793241.0A EP2513932B1 (de) | 2009-12-18 | 2010-12-16 | Herstellungsverfahren eines kontaktplättchens eines elektrischen kontakts und eines elektrischen kontakts |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP09179852A EP2337044A1 (de) | 2009-12-18 | 2009-12-18 | Herstellungsverfahren eines Kontaktplättchens eines elektrischen Kontakts und eines elektrischen Kontakts |
EP10793241.0A EP2513932B1 (de) | 2009-12-18 | 2010-12-16 | Herstellungsverfahren eines kontaktplättchens eines elektrischen kontakts und eines elektrischen kontakts |
PCT/EP2010/069885 WO2011073314A1 (fr) | 2009-12-18 | 2010-12-16 | Procedes de fabrication d'un plot de contact electrique et d'un contact electrique |
Publications (2)
Publication Number | Publication Date |
---|---|
EP2513932A1 EP2513932A1 (de) | 2012-10-24 |
EP2513932B1 true EP2513932B1 (de) | 2013-11-27 |
Family
ID=42138780
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP09179852A Withdrawn EP2337044A1 (de) | 2009-12-18 | 2009-12-18 | Herstellungsverfahren eines Kontaktplättchens eines elektrischen Kontakts und eines elektrischen Kontakts |
EP10793241.0A Revoked EP2513932B1 (de) | 2009-12-18 | 2010-12-16 | Herstellungsverfahren eines kontaktplättchens eines elektrischen kontakts und eines elektrischen kontakts |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP09179852A Withdrawn EP2337044A1 (de) | 2009-12-18 | 2009-12-18 | Herstellungsverfahren eines Kontaktplättchens eines elektrischen Kontakts und eines elektrischen Kontakts |
Country Status (8)
Country | Link |
---|---|
US (1) | US20120305300A1 (de) |
EP (2) | EP2337044A1 (de) |
JP (1) | JP2013514614A (de) |
CN (1) | CN102763183B (de) |
BR (1) | BR112012014648A2 (de) |
CA (1) | CA2788260A1 (de) |
MX (1) | MX337345B (de) |
WO (1) | WO2011073314A1 (de) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102013014915A1 (de) * | 2013-09-11 | 2015-03-12 | Airbus Defence and Space GmbH | Kontaktwerkstoffe für Hochspannungs-Gleichstrombordsysteme |
CN103589897B (zh) * | 2013-11-22 | 2015-11-25 | 福达合金材料股份有限公司 | 银金属氧化物钨复合电触头材料的制备方法及其产品 |
DE102016123816A1 (de) * | 2016-12-08 | 2018-06-14 | Air Liquide Deutschland Gmbh | Anordnung und Vorrichtung zum Behandeln einer Oberfläche |
US10446336B2 (en) | 2016-12-16 | 2019-10-15 | Abb Schweiz Ag | Contact assembly for electrical devices and method for making |
WO2018180216A1 (ja) * | 2017-03-27 | 2018-10-04 | 日本電産株式会社 | 電気接点、それを備えた電磁リレー及び電気接点の製造方法 |
WO2018180217A1 (ja) * | 2017-03-27 | 2018-10-04 | 日本電産株式会社 | 電気接点、それを備えた電磁リレー及び電気接点の製造方法 |
CN111029179A (zh) * | 2019-12-11 | 2020-04-17 | 哈尔滨东大高新材料股份有限公司 | 一种低压电器用触头材料与铜复合方法 |
DE102022129225A1 (de) * | 2022-11-04 | 2024-05-08 | Te Connectivity Germany Gmbh | Kontaktelement mit einer Sprühbeschichtung sowie Verbindungsanordnung, Verwendung eines Sprühmittels und Verfahren zum Herstellen eines Kontaktelements |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5206059A (en) * | 1988-09-20 | 1993-04-27 | Plasma-Technik Ag | Method of forming metal-matrix composites and composite materials |
DE69016433T2 (de) * | 1990-05-19 | 1995-07-20 | Papyrin Anatolij Nikiforovic | Beschichtungsverfahren und -vorrichtung. |
US5846288A (en) | 1995-11-27 | 1998-12-08 | Chemet Corporation | Electrically conductive material and method for making |
US6139913A (en) * | 1999-06-29 | 2000-10-31 | National Center For Manufacturing Sciences | Kinetic spray coating method and apparatus |
WO2001086018A2 (de) * | 2000-05-08 | 2001-11-15 | Ami Doduco Gmbh | Verfahren zum herstellen von werkstücken, welche der leitung von elektrischem strom dienen und mit einem überwiegend metallischen material beschichtet sind |
DE10045783A1 (de) * | 2000-05-08 | 2001-11-22 | Ami Doduco Gmbh | Verfahren zum Herstellen von Werkstücken, welche der Leitung von elektrischem Strom dienen und mit einem überwiegend metallischen Material beschichtet sind |
US6685988B2 (en) * | 2001-10-09 | 2004-02-03 | Delphi Technologies, Inc. | Kinetic sprayed electrical contacts on conductive substrates |
US6759085B2 (en) * | 2002-06-17 | 2004-07-06 | Sulzer Metco (Us) Inc. | Method and apparatus for low pressure cold spraying |
US20060093736A1 (en) * | 2004-10-29 | 2006-05-04 | Derek Raybould | Aluminum articles with wear-resistant coatings and methods for applying the coatings onto the articles |
US20060121187A1 (en) * | 2004-12-03 | 2006-06-08 | Haynes Jeffrey D | Vacuum cold spray process |
DE102004059716B3 (de) * | 2004-12-08 | 2006-04-06 | Siemens Ag | Verfahren zum Kaltgasspritzen |
DE102005050045B3 (de) * | 2005-10-19 | 2007-01-04 | Praxair Surface Technologies Gmbh | Verfahren zur Beschichtung eines Bauteils |
US20070116890A1 (en) * | 2005-11-21 | 2007-05-24 | Honeywell International, Inc. | Method for coating turbine engine components with rhenium alloys using high velocity-low temperature spray process |
DE102005062225B3 (de) * | 2005-12-21 | 2007-06-21 | Siemens Ag | Legierungsprodukt vom MCrAIX-Typ und Verfahren zur Herstellung einer Schicht aus diesem Legierungsprodukt |
US7758916B2 (en) * | 2006-11-13 | 2010-07-20 | Sulzer Metco (Us), Inc. | Material and method of manufacture of a solder joint with high thermal conductivity and high electrical conductivity |
DE102008015464A1 (de) * | 2008-03-18 | 2009-09-24 | Siemens Aktiengesellschaft | Bauteil mit einer elektrischen Kontaktfläche für ein elektrisches Kontaktelement, insbesondere Stromschiene |
FR2931303A1 (fr) * | 2008-05-15 | 2009-11-20 | Daniel Bernard | Contact electrique et son procede de fabrication associe |
-
2009
- 2009-12-18 EP EP09179852A patent/EP2337044A1/de not_active Withdrawn
-
2010
- 2010-12-16 JP JP2012543748A patent/JP2013514614A/ja active Pending
- 2010-12-16 CN CN201080064059.7A patent/CN102763183B/zh active Active
- 2010-12-16 MX MX2012007066A patent/MX337345B/es active IP Right Grant
- 2010-12-16 EP EP10793241.0A patent/EP2513932B1/de not_active Revoked
- 2010-12-16 WO PCT/EP2010/069885 patent/WO2011073314A1/fr active Application Filing
- 2010-12-16 US US13/516,807 patent/US20120305300A1/en not_active Abandoned
- 2010-12-16 CA CA2788260A patent/CA2788260A1/fr not_active Abandoned
- 2010-12-16 BR BR112012014648A patent/BR112012014648A2/pt not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
BR112012014648A2 (pt) | 2017-03-14 |
CN102763183A (zh) | 2012-10-31 |
MX2012007066A (es) | 2012-10-03 |
EP2337044A1 (de) | 2011-06-22 |
US20120305300A1 (en) | 2012-12-06 |
EP2513932A1 (de) | 2012-10-24 |
JP2013514614A (ja) | 2013-04-25 |
MX337345B (es) | 2014-08-22 |
CA2788260A1 (fr) | 2011-06-23 |
CN102763183B (zh) | 2015-03-11 |
WO2011073314A1 (fr) | 2011-06-23 |
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