EP2501986B1 - Lamp having gas filling - Google Patents

Lamp having gas filling Download PDF

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Publication number
EP2501986B1
EP2501986B1 EP11701815.0A EP11701815A EP2501986B1 EP 2501986 B1 EP2501986 B1 EP 2501986B1 EP 11701815 A EP11701815 A EP 11701815A EP 2501986 B1 EP2501986 B1 EP 2501986B1
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EP
European Patent Office
Prior art keywords
gas
lamp
vessel
thermal conductivity
helium
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EP11701815.0A
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German (de)
French (fr)
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EP2501986A1 (en
Inventor
Stefan Lorenz
Guenter Hoetzl
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Ledvance GmbH
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Ledvance GmbH
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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V31/00—Gas-tight or water-tight arrangements
    • F21V31/04—Provision of filling media
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/506—Cooling arrangements characterised by the adaptation for cooling of specific components of globes, bowls or cover glasses
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/20—Electroluminescent [EL] light sources

Definitions

  • the present invention relates to a gas-filled lamp.
  • a gas-filled lamp is out of the EP 1 471 564 A2 known.
  • the LED lamp described there is formed from a solid light source which is mounted on a support structure.
  • a translucent vessel encloses the light source and support structure, and an electrical supply line and return line are routed into and out of the housing in order to supply the light source with electrical energy.
  • This known LED lamp uses the thermal conductivity of helium for efficient cooling of the LED, with the heat being transported to the vessel walls via the helium filling.
  • a disadvantage of the helium filling is the high price of this gas, and cheaper gases such as hydrogen and nitrogen show poorer heat conduction. Better heat conduction can be achieved if these gases are mixed with air, which, however, results in an explosive mixture, so that undesired vessel ruptures occur.
  • helium places high demands on the tightness of the vessel.
  • the DE 102 60 432 A1 shows a single LED with a gas as a filling and the WO 2009 / 037053A1 an LED headlight bulb also with a gas filling.
  • the lamp is filled with a filling gas which is a mixture of at least one gas with high thermal conductivity and at least one gas with a different physical property.
  • a filling gas which is a mixture of at least one gas with high thermal conductivity and at least one gas with a different physical property.
  • the gas with high conductivity is selected from the group of helium and hydrogen, the use of helium being particularly preferred as a better heat conductor with inert properties.
  • the proportion of the gas with high thermal conductivity is 1-80%, preferably 1-10% and in particular 8 and 10%, in the filling gas mixture.
  • the proportion of the second component, i. of the gas with a different physical property 100% - x (proportion of gas with high conductivity).
  • a particular advantage of the present invention can be seen in the fact that if, for example, helium is used as the gas with high thermal conductivity, this is used in a relatively small volume, which noticeably reduces the production costs of the lamp.
  • the gas with a different physical property which is present in the filling gas mixture together with the gas of high thermal conductivity, generally has a lower reactivity than the gas with high thermal conductivity.
  • gases of the second component for example, high internal vessel pressures, optical changes in light such as light filtering and improved light output can be achieved.
  • gases with other physical properties are nitrogen, argon, neon, carbon dioxide, nitrogen dioxide or sulfur hexafluoride.
  • the gas pressure in the vessel is between 10 -2 and 1200 hPa, a preferred gas pressure being between 10 -1 and 100 hPa.
  • the solid light source of the invention Lamp is a light-emitting diode (LED) or a solid-state laser.
  • LED light-emitting diode
  • a solid-state laser usually this is a chip that is mounted directly on a heat-conducting carrier.
  • the chip is not coated or sealed with an epoxy or any other coating material, so that there is direct contact with the filling gas mixture.
  • the lamp according to the invention is surrounded by an at least partially translucent vessel in which the solid light source and the filling gas mixture are located.
  • a preferred embodiment for the vessel is made of glass.
  • vessels made of plastic and transparent and partially transparent ceramics can be structured in order to give the light source a certain optical appearance.
  • the carrier can take various forms, such as a plate of various dimensions or a rod.
  • a preferred carrier preferably comprises a holder which is arranged between an electrical supply line and a discharge line.
  • the solid light source such as an LED
  • the carrier can be formed from a circuit board material.
  • FIG. 1 shows an embodiment of a lamp 1 according to the invention in a schematic longitudinal sectional view.
  • the lamp has an LED light source 2 which is located on a carrier 3.
  • the light source and the carrier are mounted in a gas-tight vessel 4.
  • the vessel is at least partially translucent.
  • the gas mixture 5 is in contact with the LED light source 2 and the vessel 4 and possibly also with the carrier 3. More than that Half of the heat generated by the LED light source is transferred directly to the vessel wall via the LED -> filling gas -> vessel or indirectly via the LED -> carrier -> filling gas -> vessel via the filling gas 5.
  • the filling gas comprises a mixture of at least one gas with high thermal conductivity and at least one gas with a different physical property.
  • helium or hydrogen is used as the gas with high thermal conductivity.
  • the gas with a different physical property can be, for example, nitrogen, argon, neon, CO 2 , O 2 or SF 6 .
  • FIG. 2 shows a schematic representation of another embodiment of the lamp 1 according to the invention.
  • the vessel 4 is cylindrical.
  • the diameter is 25mm.
  • the LEDs 2 are mounted in series on a carrier 3 and are surrounded by the filling gas 5.
  • the vessel is made of glass.
  • the carrier which is made from a circuit board material such as FR4 or MCPCB, is attached to the glass bulb with retaining wires so that the LEDs can illuminate the entire vessel wall directly or indirectly.
  • the carrier can also be attached to the end caps (not shown).
  • an electrical lead and an electrical return which are highly thermally conductive, are provided below the carrier (not shown).
  • the carrier for example, copper or a similar material that is highly thermally conductive can be used as the electrical supply and return.
  • the support structure can also comprise cooling elements.
  • the lamp according to the invention can also have further elements, for example in the EP 1 471 564 A2 are described.
  • Embodiment 1 In a lamp according to the invention, a filling gas mixture of helium / nitrogen (N 2 ) is used. The proportion of helium is 50%. The pressure in the lamp is 100hPa. There is good thermal conductivity with a high internal vessel pressure, which results in a low mechanical load. Furthermore, there is a lower helium consumption in comparison with the previously known helium-filled lamps.
  • the advantageous ranges for the quantitative composition of this gas mixture and the pressures are 20% ⁇ He ⁇ 80%; 50hPa ⁇ P ⁇ 500hPa.
  • Embodiment 2 A filling gas mixture with helium / argon is used.
  • the proportion of helium in the filling gas mixture is 10%.
  • the internal pressure in the vessel was set at 100 hPa. It has been found that this gas mixture ensures high thermal conductivity with a high internal pressure in the vessel, which means low mechanical stress. In this embodiment, the helium consumption is even lower compared to the gas component with low reactivity.
  • this filling gas mixture the following ranges have proven to be advantageous: 5% ⁇ He ⁇ 20%; 50hPa ⁇ P ⁇ 500hPa.
  • Embodiment 3 The gas mixture has the composition helium / argon, the proportion of helium in the gas mixture being 10%.
  • the pressure is 10hPa.
  • the advantageous ranges are as follows: 5% ⁇ He ⁇ 20%; 1hPa ⁇ P ⁇ 50hPa.
  • Embodiment 4 A filling gas mixture of hydrogen / helium with a hydrogen content of 4% is used.
  • the pressure is 10hPa. It has been found that this filling gas mixture has excellent thermal conductivity and the hydrogen remains inactive.
  • the advantageous ranges for this filling gas mixture are as follows: 0.1% ⁇ hydrogen ⁇ 4%; 0.1hPa ⁇ P ⁇ 20hPa.
  • Embodiment 5 A gas mixture of helium and air was used to fill an LED lamp.
  • the proportion of helium in the gas mixture is 1%, the pressure is 100hPa.
  • This gas mixture has shown good thermal conductivity with a high internal pressure in the vessel. There is again a very low consumption of helium. In comparison to air, an increased thermal conductivity is found.
  • the advantageous ranges are as follows: 0.1% ⁇ helium ⁇ 2%; 80hPa ⁇ P ⁇ 200hPa.
  • Embodiment 6 A gas mixture of helium / nitrogen dioxide (NO 2 ) is used to fill the LED lamp.
  • the helium content is 20%, the pressure is 100hPa.
  • This gas mixture shows a high thermal conductivity with a high internal pressure in the vessel, an optical change in light being observed.
  • this gas mixture has the disadvantage that it is poisonous, so that a complete sealing of the lamp must be guaranteed.
  • the advantageous ranges here are as follows: 20% ⁇ helium ⁇ 80%; 10hPa ⁇ P ⁇ 200hPa.
  • Embodiment 7 A filling gas mixture of helium / sulfur hexafluoride (SF 6 ) is used, the proportion of helium in the gas mixture being 20%.
  • the pressure is 1hPa.
  • a good thermal conductivity was found with this gas mixture, while at the same time the dielectric strength is increased. Minimal gas consumption is recorded.
  • Advantageous ranges have resulted as follows: 20% ⁇ helium ⁇ 80%; 10hPa ⁇ P ⁇ 200hPa.
  • Embodiment 8 A gas mixture of helium / carbon dioxide (CO 2 ) is used, the proportion of helium being 50%.
  • the pressure is 900hPa.
  • the advantageous ranges are as follows: 40% ⁇ helium ⁇ 70%; 800hPa ⁇ P ⁇ 1200hPa.

Description

Technisches GebietTechnical area

Die vorliegende Erfindung betrifft eine Lampe mit Gasfüllung.The present invention relates to a gas-filled lamp.

Stand der TechnikState of the art

Eine Lampe mit Gasfüllung ist aus der EP 1 471 564 A2 bekannt. Die dort beschriebene LED-Lampe ist aus einer Feststoff-Lichtquelle, die auf einer Trägerstruktur montiert ist, gebildet. Ein lichtdurchlässiges Gefäß umschließt die Lichtquelle und Trägerstruktur, und eine elektrische Zuleitung sowie Rückführung sind in und aus dem Gehäuse geführt, um die Lichtquelle mit elektrischer Energie zu versorgen. Es befindet sich ein Füllgas mit geringem Molekulargewicht, wie Helium oder Wasserstoff, eingeschlossen in dem Gefäß, welches in thermischem Kontakt mit der Lichtquelle ist.A gas-filled lamp is out of the EP 1 471 564 A2 known. The LED lamp described there is formed from a solid light source which is mounted on a support structure. A translucent vessel encloses the light source and support structure, and an electrical supply line and return line are routed into and out of the housing in order to supply the light source with electrical energy. There is a low molecular weight filler gas, such as helium or hydrogen, enclosed in the vessel which is in thermal contact with the light source.

Diese bekannte LED-Lampe nutzt die Wärmeleitfähigkeit von Helium zur effizienten Kühlung der LED, wobei die Wärme über die Heliumfüllung an die Gefäßwände transportiert wird. Ein Nachteil der Heliumfüllung ist allerdings der hohe Preis dieses Gases, und günstigere Gase, wie beispielsweise Wasserstoff und Stickstoff, zeigen eine schlechtere Wärmeleitung. Eine bessere Wärmeleitung kann erreicht werden, wenn diese Gase mit Luft vermischt werden, was allerdings ein explosives Gemisch ergibt, sodass es zu unerwünschten Gefäßbrüchen kommt. Des Weiteren stellt Helium eine hohe Anforderung an die Dichtigkeit des Gefäßes.This known LED lamp uses the thermal conductivity of helium for efficient cooling of the LED, with the heat being transported to the vessel walls via the helium filling. A disadvantage of the helium filling, however, is the high price of this gas, and cheaper gases such as hydrogen and nitrogen show poorer heat conduction. Better heat conduction can be achieved if these gases are mixed with air, which, however, results in an explosive mixture, so that undesired vessel ruptures occur. Furthermore, helium places high demands on the tightness of the vessel.

Die DE 102 60 432 A1 zeigt eine einzelne LED mit einem Gas als Füllung und die WO 2009/037053A1 eine LED-Scheinwerferlampe ebenfalls mit einem Gas als Füllung.The DE 102 60 432 A1 shows a single LED with a gas as a filling and the WO 2009 / 037053A1 an LED headlight bulb also with a gas filling.

Aus der DE 10 2008 008 599 A1 ist eine Leuchtdiodenanordnung in einem mit Luft gefüllten Hohlkörper bekannt.From the DE 10 2008 008 599 A1 a light emitting diode arrangement in a hollow body filled with air is known.

Darstellung der ErfindungPresentation of the invention

Es ist Aufgabe der vorliegenden Erfindung, eine Lampe mit einer Gasfüllung zur Verfügung zu stellen, die kostengünstig herstellbar ist und eine ausgezeichnete Wärmeleitfähigkeit in Kombination mit anderen physikalischen Eigenschaften, wie Druckausgleich und Lichtfilterung, aufweist.It is the object of the present invention to provide a lamp with a gas filling that can be manufactured inexpensively and has excellent thermal conductivity in combination with other physical properties such as pressure compensation and light filtering.

Diese Aufgabe ist mit der Lampe gemäß den Merkmalen des Patentanspruchs 1 gelöst worden. Die Unteransprüche betreffen bevorzugte Ausführungsformen der erfindungsgemäßen Lampe.This object has been achieved with the lamp according to the features of claim 1. The subclaims relate to preferred embodiments of the lamp according to the invention.

Erfindungsgemäß ist die Lampe mit einem Füllgas gefüllt, das ein Gemisch aus mindestens einem Gas mit hoher Wärmeleitfähigkeit und mindestens einem Gas mit einer anderen physikalischen Eigenschaft ist. Diese Lösung hat den Vorteil, dass die Lichtquellen in der Lampe aufgrund der hohen Wärmeleitfähigkeit einer ersten Komponente des Füllgases effizient gekühlt wird, während, aufgrund der Anwesenheit einer zweiten Gaskomponente, das Füllgas weitere Funktionen in der Lampe gleichzeitig erfüllen kann, die sonst separate Komponenten in der Lampe übernehmen müssten. Dieses erhöht die Produktionskosten der Lampe erheblich. Weitere Funktionen der Lampe sind beispielsweise Druckausgleich und Lichtfilterung.According to the invention, the lamp is filled with a filling gas which is a mixture of at least one gas with high thermal conductivity and at least one gas with a different physical property. This solution has the advantage that the light sources in the lamp are efficiently cooled due to the high thermal conductivity of a first component of the filling gas, while, due to the presence of a second gas component, the filling gas can simultaneously fulfill other functions in the lamp that would otherwise be separate components the lamp would have to take over. This increases the production costs of the lamp considerably. Other functions of the lamp include pressure compensation and light filtering.

Erfindungsgemäß ist das Gas mit hoher Leitfähigkeit aus der Gruppe Helium und Wasserstoff gewählt, wobei die Verwendung von Helium als besserer Wärmeleiter mit inerten Eigenschaften besonders bevorzugt ist.According to the invention, the gas with high conductivity is selected from the group of helium and hydrogen, the use of helium being particularly preferred as a better heat conductor with inert properties.

Ferner erfindungsgemäß beträgt der Anteil des Gases mit hoher Wärmeleitfähigkeit 1 - 80%, bevorzugt 1 - 10% und insbesondere 8 und 10%, im Füllgasgemisch. Im Allgemeinen kann gesagt werden, dass der Anteil der zweiten Komponente, d.h. des Gases mit einer anderen physikalischen Eigenschaft, 100% - x (Anteil Gas mit hoher Leitfähigkeit) beträgt.Furthermore, according to the invention, the proportion of the gas with high thermal conductivity is 1-80%, preferably 1-10% and in particular 8 and 10%, in the filling gas mixture. In general it can be said that the proportion of the second component, i. of the gas with a different physical property, 100% - x (proportion of gas with high conductivity).

Ein besonderer Vorteil der vorliegenden Erfindung ist darin zu sehen, dass, wenn beispielsweise Helium als Gas mit hoher Wärmeleitfähigkeit verwendet wird, dieses in relativ geringem Volumen eingesetzt wird, was die Produktionskosten der Lampe merklich verringert.A particular advantage of the present invention can be seen in the fact that if, for example, helium is used as the gas with high thermal conductivity, this is used in a relatively small volume, which noticeably reduces the production costs of the lamp.

Das Gas mit einer anderen physikalischen Eigenschaft, das zusammen mit dem Gas hoher Wärmeleitfähigkeit in dem Füllgasgemisch vorhanden ist, hat in der Regel eine geringere Reaktivität als das Gas mit hoher Wärmeleitfähigkeit. Mit den Gasen der zweiten Komponente können beispielsweise hohe Gefäßinnendrucke, optische Lichtveränderungen, wie Lichtfilterungen und verbesserte Lichtleistungen erreicht werden. Beispiele für ein Gas mit anderen physikalischen Eigenschaften sind Stickstoff, Argon, Neon, Kohlendioxid, Stickstoffdioxid oder Schwefelhexafluorid.The gas with a different physical property, which is present in the filling gas mixture together with the gas of high thermal conductivity, generally has a lower reactivity than the gas with high thermal conductivity. With the gases of the second component, for example, high internal vessel pressures, optical changes in light such as light filtering and improved light output can be achieved. Examples of a gas with other physical properties are nitrogen, argon, neon, carbon dioxide, nitrogen dioxide or sulfur hexafluoride.

Der Gasdruck im Gefäß beträgt in der Praxis zwischen 10-2 und 1200 hPa, wobei ein bevorzugter Gasdruck zwischen 10-1 und 100hPa liegt.In practice, the gas pressure in the vessel is between 10 -2 and 1200 hPa, a preferred gas pressure being between 10 -1 and 100 hPa.

Die Feststoff-Lichtquelle der erfindungsgemäßen Lampe ist eine lichtemittierende Diode (LED) oder ein Feststoff-Laser. Üblicherweise handelt es sich hierbei um einen Chip, der direkt auf einem wärmeleitenden Träger montiert ist. In einer Ausführungsform ist der Chip nicht mit einem Epoxid oder einem anderen Beschichtungsmaterial beschichtet oder versiegelt, sodass ein direkter Kontakt mit dem Füllgasgemisch vorliegt.The solid light source of the invention Lamp is a light-emitting diode (LED) or a solid-state laser. Usually this is a chip that is mounted directly on a heat-conducting carrier. In one embodiment, the chip is not coated or sealed with an epoxy or any other coating material, so that there is direct contact with the filling gas mixture.

Die erfindungsgemäße Lampe ist von einem mindestens teilweise lichtdurchlässigen Gefäß umgeben, in dem sich die Feststoff-Lichtquelle und das Füllgasgemisch befinden. Eine bevorzugte Ausführungsform für das Gefäß ist aus Glas. Es ist allerdings auch möglich, Gefäße aus Kunststoff sowie transparenten und teiltransparenten Keramiken vorzusehen. Die Gefäßwände können strukturiert sein, um der Lichtquelle ein bestimmtes optisches Aussehen zu verleihen.The lamp according to the invention is surrounded by an at least partially translucent vessel in which the solid light source and the filling gas mixture are located. A preferred embodiment for the vessel is made of glass. However, it is also possible to provide vessels made of plastic and transparent and partially transparent ceramics. The vessel walls can be structured in order to give the light source a certain optical appearance.

Der Träger kann verschiedenen Formen einnehmen, wie beispielsweise eine Platte verschiedenster Dimensionen oder ein Stab. Ein bevorzugter Träger umfasst bevorzugt eine Fassung, die zwischen einer elektrischen Zuleitung und Ableitung angeordnet ist.The carrier can take various forms, such as a plate of various dimensions or a rod. A preferred carrier preferably comprises a holder which is arranged between an electrical supply line and a discharge line.

Die Feststoff-Lichtquelle, wie beispielsweise eine LED kann als mehrere Lichtquellen in Reihe auf dem Träger angeordnet sein. In diesem Fall kann der Träger aus einem Platinenmaterial gebildet sein.The solid light source, such as an LED, can be arranged as a plurality of light sources in series on the carrier. In this case, the carrier can be formed from a circuit board material.

Kurze Beschreibung der ZeichnungenBrief description of the drawings

Im Folgenden soll die Erfindung anhand von Ausführungsbeispielen näher erläutert werden. Die Figuren zeigen:

Fig. 1
eine schematische Längsschnittansicht einer Ausführungsform der erfindungsgemäßen Lampe;
Fig. 2
eine Schemazeichnung einer Ausführungsform der vorliegenden Erfindung, wobei mehrere LED-Lichtquellen in Reihe auf einem Träger angeordnet sind.
In the following, the invention is to be explained in more detail on the basis of exemplary embodiments. The figures show:
Fig. 1
a schematic longitudinal sectional view of an embodiment of the lamp according to the invention;
Fig. 2
a schematic drawing of an embodiment of the present invention, wherein several LED light sources are arranged in series on a carrier.

Bevorzugte Ausführung der ErfindungPreferred embodiment of the invention

Figur 1 zeigt in einer schematischen Längsschnittansicht eine Ausführungsform einer erfindungsgemäße Lampe 1. Die Lampe weist eine LED-Lichtquelle 2 auf, die sich auf einem Träger 3 befindet. Lichtquelle sowie Träger sind in einem gasdichten Gefäß 4 montiert. Das Gefäß ist zumindest teilweise lichtdurchlässig. Im Gefäß befindet sich ein Gasgemisch aus mindestens einem Gas mit hoher Wärmeleitfähigkeit und mindestens einem Gas mit einer anderen physikalischen Eigenschaft 5. Das Gasgemisch 5 hat Kontakt mit der LED-Lichtquelle 2 und dem Gefäß 4 sowie gegebenenfalls auch mit dem Träger 3. Mehr als die Hälfte der an der LED-Lichtquelle anfallenden Wärme wird direkt über den Weg LED -> Füllgas -> Gefäß oder indirekt über den Weg LED -> Träger -> Füllgas -> Gefäß über das Füllgas 5 an die Gefäßwand übertragen. Figure 1 shows an embodiment of a lamp 1 according to the invention in a schematic longitudinal sectional view. The lamp has an LED light source 2 which is located on a carrier 3. The light source and the carrier are mounted in a gas-tight vessel 4. The vessel is at least partially translucent. In the vessel there is a gas mixture of at least one gas with high thermal conductivity and at least one gas with a different physical property 5. The gas mixture 5 is in contact with the LED light source 2 and the vessel 4 and possibly also with the carrier 3. More than that Half of the heat generated by the LED light source is transferred directly to the vessel wall via the LED -> filling gas -> vessel or indirectly via the LED -> carrier -> filling gas -> vessel via the filling gas 5.

Das Füllgas umfasst ein Gemisch aus mindestens einem Gas mit hoher Wärmeleitfähigkeit und mindestens einem Gas mit einer anderen physikalischen Eigenschaft. Als Gas mit hoher Wärmeleitfähigkeit wird erfindungsgemäß Helium oder Wasserstoff verwendet. Das Gas mit einer anderen physikalischen Eigenschaft kann beispielsweise Stickstoff, Argon, Neon, CO2, O2 oder SF6 sein.The filling gas comprises a mixture of at least one gas with high thermal conductivity and at least one gas with a different physical property. According to the invention, helium or hydrogen is used as the gas with high thermal conductivity. The gas with a different physical property can be, for example, nitrogen, argon, neon, CO 2 , O 2 or SF 6 .

Figur 2 zeigt eine schematische Darstellung einer anderen Ausführungsform der erfindungsgemäßen Lampe 1. In dieser Ausführungsform ist das Gefäß 4 zylindrisch ausgestaltet. Der Durchmesser beträgt 25mm. Die LEDs 2 sind in Reihe auf einem Träger 3 montiert und werden vom Füllgas 5 umgeben. Das Gefäß besteht aus Glas. Der Träger, der aus einem Platinenmaterial, beispielsweise FR4 oder MCPCB, hergestellt ist, ist mit Haltedrähten am Glaskolben befestigt, sodass die LEDs die komplette Gefäßwand direkt oder indirekt ausleuchten können. Der Träger kann auch an den Endkappen befestigt sein (nicht gezeigt). Figure 2 shows a schematic representation of another embodiment of the lamp 1 according to the invention. In this embodiment, the vessel 4 is cylindrical. The diameter is 25mm. The LEDs 2 are mounted in series on a carrier 3 and are surrounded by the filling gas 5. The vessel is made of glass. The carrier, which is made from a circuit board material such as FR4 or MCPCB, is attached to the glass bulb with retaining wires so that the LEDs can illuminate the entire vessel wall directly or indirectly. The carrier can also be attached to the end caps (not shown).

In beiden Ausführungsformen sind eine elektrische Zuleitung sowie eine elektrische Rückführung, die hoch wärmeleitfähig sind, unterhalb des Trägers vorgesehen (nicht gezeigt). Beispielsweise kann Kupfer oder ein ähnliches Material, das hoch wärmeleitfähig ist, als elektrische Zuleitung und Rückführung verwendet werden. Die Trägerstruktur kann außerdem Kühlelemente umfassen. Die erfindungsgemäße Lampe kann noch weitere Elemente aufweisen, die beispielsweise in der EP 1 471 564 A2 beschrieben sind.In both embodiments, an electrical lead and an electrical return, which are highly thermally conductive, are provided below the carrier (not shown). For example, copper or a similar material that is highly thermally conductive can be used as the electrical supply and return. The support structure can also comprise cooling elements. The lamp according to the invention can also have further elements, for example in the EP 1 471 564 A2 are described.

Die Erfindung wird nun nachfolgend anhand von Ausführungsbeispielen näher erläutert.The invention will now be explained in more detail below using exemplary embodiments.

Ausführungsbeispiel 1: In einer erfindungsgemäße Lampe wird ein Füllgasgemisch aus Helium/Stickstoff (N2) verwendet. Der Anteil an Helium beträgt 50%. Der Druck in der Lampe beträgt 100hPa. Es zeigt sich eine gute Wärmeleitfähigkeit mit einem hohen Gefäßinnendruck, wodurch eine niedrige mechanische Belastung gegeben ist. Des Weiteren liegt ein geringerer Heliumverbrauch im Vergleich mit den bisher bekannten heliumgefüllten Lampen vor. Die vorteilhaften Bereiche für die quantitative Zusammensetzung dieses Gasgemischs und die Drücke liegen bei 20% < He < 80%; 50hPa < P < 500hPa.Embodiment 1: In a lamp according to the invention, a filling gas mixture of helium / nitrogen (N 2 ) is used. The proportion of helium is 50%. The pressure in the lamp is 100hPa. There is good thermal conductivity with a high internal vessel pressure, which results in a low mechanical load. Furthermore, there is a lower helium consumption in comparison with the previously known helium-filled lamps. The advantageous ranges for the quantitative composition of this gas mixture and the pressures are 20% <He <80%; 50hPa <P <500hPa.

Ausführungsbeispiel 2: Es wird ein Füllgasgemisch mit Helium/Argon verwendet. Der Heliumanteil im Füllgasgemisch beträgt 10%. Der Gefäßinnendruck wurde mit 100hPa eingestellt. Es hat sich herausgestellt, dass dieses Gasgemisch eine hohe Wärmeleitfähigkeit mit einem hohen Gefäßinnendruck gewährleistet, was eine niedrige mechanische Belastung bedeutet. In dieser Ausführungsform ist der Heliumverbrauch noch niedriger im Vergleich zur Gaskomponente mit geringer Reaktivität. Mit diesem Füllgasgemisch haben sich folgende Bereiche als vorteilhaft erwiesen: 5% < He < 20%; 50hPa < P < 500hPa.Embodiment 2: A filling gas mixture with helium / argon is used. The proportion of helium in the filling gas mixture is 10%. The internal pressure in the vessel was set at 100 hPa. It has been found that this gas mixture ensures high thermal conductivity with a high internal pressure in the vessel, which means low mechanical stress. In this embodiment, the helium consumption is even lower compared to the gas component with low reactivity. With this filling gas mixture, the following ranges have proven to be advantageous: 5% <He <20%; 50hPa <P <500hPa.

Ausführungsbeispiel 3: Das Gasgemisch hat die Zusammensetzung Helium/Argon, wobei der Anteil von Helium im Gasgemisch 10% ausmacht. Der Druck beträgt 10hPa. Im Vergleich zu den Beispielen 1 und 2 ergibt sich eine erhöhte Wärmeleitfähigkeit mit niedrigem Gasverbrauch. Die vorteilhaften Bereiche liegen hier wie folgt vor: 5% < He < 20%; 1hPa < P < 50hPa.Embodiment 3: The gas mixture has the composition helium / argon, the proportion of helium in the gas mixture being 10%. The pressure is 10hPa. In comparison to Examples 1 and 2, there is an increased thermal conductivity with low gas consumption. The advantageous ranges are as follows: 5% <He <20%; 1hPa <P <50hPa.

Ausführungsbeispiel 4: Es wird ein Füllgasgemisch aus Wasserstoff/Helium mit einem Wasserstoffanteil von 4% verwendet. Der Druck beträgt 10hPa. Es ist festgestellt worden, dass dieses Füllgasgemisch eine exzellente Wärmeleitfähigkeit aufweist und der Wasserstoff inaktiv bleibt. Die vorteilhaften Bereiche für dieses Füllgasgemisch sind wie folgt: 0,1 % < Wasserstoff < 4%; 0,1hPa < P < 20hPa.Embodiment 4: A filling gas mixture of hydrogen / helium with a hydrogen content of 4% is used. The pressure is 10hPa. It has been found that this filling gas mixture has excellent thermal conductivity and the hydrogen remains inactive. The advantageous ranges for this filling gas mixture are as follows: 0.1% <hydrogen <4%; 0.1hPa <P <20hPa.

Ausführungsbeispiel 5: Zur Befüllung einer LED-Lampe wurde ein Gasgemisch aus Helium und Luft verwendet. Der Anteil an Helium im Gasgemisch beträgt 1%, der Druck beträgt 100hPa. Es hat sich mit diesem Gasgemisch eine gute Wärmeleitfähigkeit mit einem hohen Gefäßinnendruck gezeigt. Es liegt wieder ein sehr geringer Heliumverbrauch vor. Im Vergleich zu Luft wird eine erhöhte Wärmeleitfähigkeit festgestellt. Die vorteilhaften Bereiche liegen hier wie folgt vor: 0,1% < Helium < 2%; 80hPa < P < 200hPa.Embodiment 5: A gas mixture of helium and air was used to fill an LED lamp. The proportion of helium in the gas mixture is 1%, the pressure is 100hPa. This gas mixture has shown good thermal conductivity with a high internal pressure in the vessel. There is again a very low consumption of helium. In comparison to air, an increased thermal conductivity is found. The advantageous ranges are as follows: 0.1% <helium <2%; 80hPa <P <200hPa.

Ausführungsbeispiel 6: Es wird zur Befüllung der LED-Lampe ein Gasgemisch aus Helium/Stickstoffdioxid (NO2) verwendet. Der Anteil Helium beträgt 20%, der Druck beträgt 100hPa. Dieses Gasgemisch zeigt eine hohe Wärmeleitfähigkeit mit einem hohen Gefäßinnendruck, wobei eine optische Lichtveränderung beobachtet wird. Dieses Gasgemisch hat allerdings den Nachteil, dass es giftig ist, sodass eine vollständige Abdichtung der Lampe gewährleistet sein muss. Die vorteilhaften Bereiche sind hier wie folgt: 20% < Helium < 80%; 10hPa < P < 200hPa.Embodiment 6: A gas mixture of helium / nitrogen dioxide (NO 2 ) is used to fill the LED lamp. The helium content is 20%, the pressure is 100hPa. This gas mixture shows a high thermal conductivity with a high internal pressure in the vessel, an optical change in light being observed. However, this gas mixture has the disadvantage that it is poisonous, so that a complete sealing of the lamp must be guaranteed. The advantageous ranges here are as follows: 20% <helium <80%; 10hPa <P <200hPa.

Ausführungsbeispiel 7: Es wird ein Füllgasgemisch aus Helium/Schwefelhexafluorid (SF6)verwendet, wobei der Anteil an Helium im Gasgemisch 20% beträgt. Der Druck beträgt 1hPa. Mit diesem Gasgemisch wurde eine gute Wärmeleitfähigkeit festgestellt, wobei gleichzeitig die elektrische Durchschlagsfestigkeit erhöht ist. Es wird ein minimaler Gasverbrauch verzeichnet. Vorteilhafte Bereiche haben sich wie folgt ergeben: 20% < Helium < 80%; 10hPa < P < 200hPa.Embodiment 7: A filling gas mixture of helium / sulfur hexafluoride (SF 6 ) is used, the proportion of helium in the gas mixture being 20%. The pressure is 1hPa. A good thermal conductivity was found with this gas mixture, while at the same time the dielectric strength is increased. Minimal gas consumption is recorded. Advantageous ranges have resulted as follows: 20% <helium <80%; 10hPa <P <200hPa.

Ausführungsbeispiel 8: Es wird ein Gasgemisch aus Helium/Kohlendioxid (CO2) verwendet, wobei der Anteil an Helium 50% beträgt. Der Druck beträgt 900hPa. Es zeigt sich eine deutlich verbesserte Wärmeleitfähigkeit mit Druckausgleich zum Außendruck. Die vorteilhaften Bereiche sind wie folgt: 40% < Helium < 70%; 800hPa < P < 1200hPa.Embodiment 8: A gas mixture of helium / carbon dioxide (CO 2 ) is used, the proportion of helium being 50%. The pressure is 900hPa. There is a clearly improved thermal conductivity with pressure equalization to the external pressure. The advantageous ranges are as follows: 40% <helium <70%; 800hPa <P <1200hPa.

Claims (9)

  1. Lamp (1) having at least one solid state light source (2), wherein the solid state light source (2) is a light emitting diode (LED) or a solid state laser mounted on a carrier (3); an at least partially translucent vessel (4) which encloses the light source and the carrier in a gas-tight manner, and a filling gas (5) enclosed in the vessel, the filling gas being a mixture of at least one gas with high thermal conductivity and at least one gas with a different physical property, the gas (5) with high thermal conductivity being selected from the group consisting of helium and hydrogen, characterized in that the proportion of the gas with high thermal conductivity ranges from 1 to 80% in the filling gas mixture.
  2. Lamp (1) according to claim 1, characterized in that the gas with high thermal conductivity is helium.
  3. Lamp (1) according to one of claims 1 to 2, characterized in that the gas with a different physical property is nitrogen, argon, neon, carbon dioxide, nitrogen dioxide or sulphur hexafluoride.
  4. Lamp (1) according to at least one of claims 1 to 3, characterized in that the gas pressure in the vessel (4) is between 10-2 and 1200hPa, preferably between 10-1 and 100hPa.
  5. Lamp (1) according to at least one of claims 1 to 4, characterized in that the proportion of the gas with high thermal conductivity is 1 to 10%, in particular 8 and 10%, in the filling gas mixture.
  6. Lamp (1) according to at least one of claims 1 to 5, characterized in that the at least partially translucent vessel (4) is made of glass.
  7. Lamp (1) according to at least one of claims 1 to 5, characterized in that the at least partially translucent vessel (4) is made of a transparent or partially transparent ceramic.
  8. Lamp (1) according to at least one of claims 1 to 7, characterized in that several light sources (2) are arranged in series on the support.
  9. Lamp (1) according to claim 8, characterized in that the support (3) is formed from a circuit board material.
EP11701815.0A 2010-02-15 2011-01-27 Lamp having gas filling Active EP2501986B1 (en)

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DE102010001931A DE102010001931A1 (en) 2010-02-15 2010-02-15 Lamp with gas filling
PCT/EP2011/051107 WO2011098358A1 (en) 2010-02-15 2011-01-27 Lamp having gas filling

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EP2501986A1 EP2501986A1 (en) 2012-09-26
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Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ES2531050T5 (en) * 2010-09-08 2021-05-04 Zhejiang Ledison Optoelectronics Co Ltd LED bulb and LED light bar capable of emitting light above 4 PI
SG185159A1 (en) * 2011-04-26 2012-11-29 Novalite Technology Pte Ltd Gas cooled light emitting diodes
US9395074B2 (en) 2012-04-13 2016-07-19 Cree, Inc. LED lamp with LED assembly on a heat sink tower
US9395051B2 (en) 2012-04-13 2016-07-19 Cree, Inc. Gas cooled LED lamp
US8757839B2 (en) 2012-04-13 2014-06-24 Cree, Inc. Gas cooled LED lamp
US9410687B2 (en) 2012-04-13 2016-08-09 Cree, Inc. LED lamp with filament style LED assembly
US9234638B2 (en) 2012-04-13 2016-01-12 Cree, Inc. LED lamp with thermally conductive enclosure
US9951909B2 (en) 2012-04-13 2018-04-24 Cree, Inc. LED lamp
US9310065B2 (en) 2012-04-13 2016-04-12 Cree, Inc. Gas cooled LED lamp
US9310028B2 (en) 2012-04-13 2016-04-12 Cree, Inc. LED lamp with LEDs having a longitudinally directed emission profile
US9322543B2 (en) 2012-04-13 2016-04-26 Cree, Inc. Gas cooled LED lamp with heat conductive submount
WO2014045489A1 (en) * 2012-09-21 2014-03-27 パナソニック株式会社 Illumination light source and illumination device
JP5818167B2 (en) * 2012-11-01 2015-11-18 岩崎電気株式会社 LED lamp
USD748296S1 (en) 2013-03-14 2016-01-26 Cree, Inc. LED lamp
US9052093B2 (en) 2013-03-14 2015-06-09 Cree, Inc. LED lamp and heat sink
DE202013009434U1 (en) 2013-07-12 2013-11-05 Vosla Gmbh lamp
WO2015053076A1 (en) * 2013-10-11 2015-04-16 岩崎電気株式会社 Hermetically sealed led lamp
CN103557456A (en) * 2013-11-05 2014-02-05 深圳市裕富照明有限公司 High-light effect LED (light emitting diode) lamp
HUE045678T2 (en) * 2014-07-11 2020-01-28 Vosla Gmbh Tape-form illuminant device, lamp and method for producing the tape-form illuminant device
US9401468B2 (en) 2014-12-24 2016-07-26 GE Lighting Solutions, LLC Lamp with LED chips cooled by a phase transformation loop
US9958116B2 (en) 2015-03-20 2018-05-01 Eye Lighting International Of North America, Inc. Glass jacketed LED lamp
ITUB20152829A1 (en) * 2015-08-04 2017-02-04 Getters Spa Hydrogen dosing in LED lighting bulbs
JP6028177B1 (en) * 2015-12-25 2016-11-16 株式会社野田スクリーン Light source device
US10535805B2 (en) 2017-01-13 2020-01-14 Intematix Corporation Narrow-band red phosphors for LED lamps
US20180204984A1 (en) * 2017-01-13 2018-07-19 Intematix Corporation Narrow-band red phosphors for led lamps
DE202017105803U1 (en) * 2017-09-25 2019-01-09 Rehau Ag + Co lighting device
CN109882748A (en) * 2017-12-05 2019-06-14 福建永德吉灯业股份有限公司 A kind of low light attenuation LED glass ball bulb lamp
WO2020069724A1 (en) * 2018-10-01 2020-04-09 Flowil International Lighting (Holding) B.V. Linear led light source
US11781714B2 (en) 2019-03-18 2023-10-10 Bridgelux, Inc. LED-filaments and LED-filament lamps
CN113826225A (en) 2019-03-18 2021-12-21 英特曼帝克司公司 Encapsulated white light emitting device including photoluminescent layered structure
US11342311B2 (en) 2019-03-18 2022-05-24 Intematix Corporation LED-filaments and LED-filament lamps utilizing manganese-activated fluoride red photoluminescence material
CN113841238A (en) 2019-03-18 2021-12-24 英特曼帝克司公司 LED filament
US20240044481A1 (en) * 2022-08-05 2024-02-08 Metro Marine Llc Sealing a lighting fixture with dry gas

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB716642A (en) * 1952-04-02 1954-10-13 Polaroid Corp Improvements in or relating to electric lamps
DE102008008599A1 (en) * 2007-12-20 2009-06-25 Osram Opto Semiconductors Gmbh Light-emitting semiconductor component has epitaxially grown semiconductor layer sequence with sublayer suitable for light generation and electrical contacts, which are contacting semiconductor layer sequence
JP2009277586A (en) * 2008-05-16 2009-11-26 San Corporation Kk Electric lamp type led luminaire

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5710543B2 (en) * 1972-03-16 1982-02-26
US3860847A (en) * 1973-04-17 1975-01-14 Los Angeles Miniature Products Hermetically sealed solid state lamp
DE68926844T2 (en) * 1988-11-22 1997-02-20 Gen Electric Filling for tungsten halogen lamps operated at high temperature
GB2366610A (en) * 2000-09-06 2002-03-13 Mark Shaffer Electroluminscent lamp
DE10260432A1 (en) 2002-12-21 2004-07-08 Ming, Fuh Lih, Tali Rapid cooling LED for lighting has heat carried away via dielectric, substrate, leads and surface of gas-tight cover; substrate lamellas improve thermal exchange during generation of light energy
US20040201990A1 (en) 2003-04-10 2004-10-14 Meyer William E. LED lamp
US20060273720A1 (en) * 2006-08-28 2006-12-07 Kwong Henry Y H CCFL device with a solid heat-dissipation means
US20100213809A1 (en) 2007-09-19 2010-08-26 Osram Gesellschaft Mit Beschraenkter Haftung Headlamp and its use
JP5371990B2 (en) * 2007-09-27 2013-12-18 コーニンクレッカ フィリップス エヌ ヴェ Light emitting device and method for cooling light emitting device
IT1391544B1 (en) * 2008-11-06 2012-01-11 Mantinger LED LIGHTING DEVICE (LIGHT EMITTING DIODE = DIODE EMITTER OF LIGHT), IN PARTICULAR FOR TUNNELS.

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB716642A (en) * 1952-04-02 1954-10-13 Polaroid Corp Improvements in or relating to electric lamps
DE102008008599A1 (en) * 2007-12-20 2009-06-25 Osram Opto Semiconductors Gmbh Light-emitting semiconductor component has epitaxially grown semiconductor layer sequence with sublayer suitable for light generation and electrical contacts, which are contacting semiconductor layer sequence
JP2009277586A (en) * 2008-05-16 2009-11-26 San Corporation Kk Electric lamp type led luminaire

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JP3181659U (en) 2013-02-21
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WO2011098358A1 (en) 2011-08-18
EP2501986A1 (en) 2012-09-26
US8587186B2 (en) 2013-11-19

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