EP2498574B1 - Plaque de support pour un porte-circuit d'un appareil ménager, agencement doté d'une telle plaque de support ainsi que champ de cuisson doté d'un agencement - Google Patents

Plaque de support pour un porte-circuit d'un appareil ménager, agencement doté d'une telle plaque de support ainsi que champ de cuisson doté d'un agencement Download PDF

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Publication number
EP2498574B1
EP2498574B1 EP12156205.2A EP12156205A EP2498574B1 EP 2498574 B1 EP2498574 B1 EP 2498574B1 EP 12156205 A EP12156205 A EP 12156205A EP 2498574 B1 EP2498574 B1 EP 2498574B1
Authority
EP
European Patent Office
Prior art keywords
carrier plate
flow duct
embodied
electronic component
carrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP12156205.2A
Other languages
German (de)
English (en)
Other versions
EP2498574A2 (fr
EP2498574B2 (fr
EP2498574A3 (fr
Inventor
Daniel Anton Falcon
Alfonso Lorente Perez
David Ortiz Sainz
Carmelo Pina Gadea
Eva Maria Sanchez Garcia
María Valencia Betran
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BSH Hausgeraete GmbH
Original Assignee
BSH Hausgeraete GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Application filed by BSH Hausgeraete GmbH filed Critical BSH Hausgeraete GmbH
Publication of EP2498574A2 publication Critical patent/EP2498574A2/fr
Publication of EP2498574A3 publication Critical patent/EP2498574A3/fr
Application granted granted Critical
Publication of EP2498574B1 publication Critical patent/EP2498574B1/fr
Publication of EP2498574B2 publication Critical patent/EP2498574B2/fr
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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B6/00—Heating by electric, magnetic or electromagnetic fields
    • H05B6/02—Induction heating
    • H05B6/10—Induction heating apparatus, other than furnaces, for specific applications
    • H05B6/12—Cooking devices
    • H05B6/1209—Cooking devices induction cooking plates or the like and devices to be used in combination with them
    • H05B6/1245—Cooking devices induction cooking plates or the like and devices to be used in combination with them with special coil arrangements
    • H05B6/1263—Cooking devices induction cooking plates or the like and devices to be used in combination with them with special coil arrangements using coil cooling arrangements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B6/00—Heating by electric, magnetic or electromagnetic fields
    • H05B6/02—Induction heating
    • H05B6/10—Induction heating apparatus, other than furnaces, for specific applications
    • H05B6/12—Cooking devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2206/00—Aspects relating to heating by electric, magnetic, or electromagnetic fields covered by group H05B6/00
    • H05B2206/02—Induction heating
    • H05B2206/022—Special supports for the induction coils

Definitions

  • the invention relates to a carrier plate for a circuit board equipped with electronic components of a household appliance, which has receptacles for the circuit carrier. Moreover, the invention also relates to an arrangement with a carrier plate and an electronic component carrier, as well as an induction hob with a corresponding arrangement.
  • Household appliances in particular induction hobs, a variety of electronic components are present, which must be cooled during operation.
  • This relates in particular to the power electronics components which are provided for supplying energy to the inductors of the induction hob.
  • the corresponding is from the WO 2004/060020 A1 known.
  • the EP 2 292 979 A1 discloses a cooling device for a domestic appliance and a domestic appliance, in particular an induction hob with the cooling device.
  • the WO 2008/103009 A1 discloses an induction heater that protects temperature sensitive components from overheating.
  • a carrier plate according to the invention is designed for carrying or picking up a circuit carrier of a domestic appliance equipped with electronic components.
  • the carrier plate is designed for receiving the circuit carrier, and has corresponding representational recordings for this purpose.
  • On the support plate a wall comprehensive elongated flow channel is formed, which is designed to conduct cooling air from electronic components of the circuit substrate.
  • the walls bounding the flow channel are at least partially formed by the carrier plate itself. The walls are arranged so that the channel shape of the flow channel is formed and thus forms an elongated and at least partially closed hollow body.
  • a specific component namely the flow channel
  • the flow guidance of the cooling air can be substantially more targeted and efficient, and the cooling of the electronic components can thus take place substantially more efficiently.
  • this integral flow channel it is also avoided by this integral flow channel that cooling air is blown out virtually uncontrolled and thus blown into unwanted zones.
  • the flow channel is also partly formed by the carrier plate itself, a very component-minimized as well as mechanically stable and robust configuration can be achieved.
  • the flow channel is designed to be open on one longitudinal side and a receiving shaft for lateral insertion of an electronic component carrier is formed.
  • the electronic component carrier can at least partially also extend into the receiving shaft and thus the cooling effect when passing the cooling air is particularly high.
  • a quasi Hineineruxn the electronic component carrier in the flow channel in turn a very space-minimized design provided. Not least can be achieved by such an arrangement, a very mechanically stable positioning of the electronic component carrier, since the electronic component carrier can be at least partially held and positioned by the part formed by the support plate of the flow channel.
  • the receiving shaft viewed in the longitudinal direction of the flow channel, is delimited on an open side wall and / or on an open top wall by a flow channel inlet flange and a flow channel outlet flange.
  • this receiving shaft is clearly delimited front and rear, and thus the insertion of the electronic component carrier can also be carried out in a very targeted and quasi-guided manner. This is particularly advantageous in particular when the electronic component carrier has dimensions which allow an exact insertion into the receiving shaft.
  • the introduction can be carried out particularly simply and reliably without being accompanied by any spreading or jamming of the electronic component carrier.
  • an open side wall of the flow channel has a reduced in height, in particular a maximum of one third of the height of the flow channel supported wall web, which is preferably provided functionally for positioning of the component carrier.
  • this wall web extends over the entire length of the receiving shaft. It therefore also extends in particular from the flow channel inlet flange to the flow channel outlet flange.
  • the electronic component carrier has a compatible recess into which the wall web can then engage.
  • the wall web is at least partially non-rectilinear design.
  • the adaptation to the electronic component carrier can be done individually.
  • the wall web extends at its two opposite ends with a small or short section angled in the direction of the outer wall portions of the Strömungskanaleinlassflansches and the Strömungskanalauslassflansches.
  • the wall web is therefore in particular slightly outward with respect to the outside of the flow channel inlet flange and the flow channel outlet flange offset wall area. This is particularly advantageous for receiving and introducing the electronic component carrier in the receiving shaft. In addition, this ensures that especially in a non-rectilinear wall web, which then preferably does not hineinerstreckt into the flow channel with its non-linear sections, no undesirable turbulence of the cooling air flow are effected.
  • the flow channel is delimited on the front side by a flow channel inlet flange of wall regions.
  • This is in particular funnel-shaped. This specific shape allows a particularly large intake of the cooling air blower in a cooling air flow.
  • a flow opening for introducing the cooling air into the flow channel is formed in the bottom of the carrier plate adjacent to the flow channel inlet flange.
  • this flow opening is not arranged overlapping the surface of the flow channel inlet flange.
  • the flow channel is bounded on the rear side by a flow channel outlet flange of wall regions, which is formed with its ceiling wall sloping downwards. This is particularly advantageous with regard to the cooling air flow to the outlet. In this way, it is possible to divert the warmed up cooling air flow to be discharged.
  • a flow opening for discharging the cooling air from the flow channel is formed in the bottom of the support plate.
  • this further flow opening is quasi covered from above by the flow channel hood-like, in particular covered by the Strömungskanalauslassflansch.
  • the very targeted discharge through the bottom of the support plate can be achieved and an undesirable influx of other components on the top of the support plate, on which the flow channel is formed, can be avoided.
  • the carrier plate is integrally formed.
  • a very component-minimized realization can be realized.
  • this can be a Implementation be realized from plastic, which can then be made in particular as a plastic injection molded part.
  • the flow channel is arranged to extend horizontally when viewed from above on the carrier plate. Additionally or instead, it can also be provided that the flow channel is arranged in a rear view of the carrier plate in a rear third of the surface dimensions of the carrier plate. This is particularly advantageous with regard to the arrangement of further components, on the one hand on the support plate itself, on the other hand on the circuit carrier and also adjacent to the support plate itself. Especially with regard to the positioning of the blower in a household appliance can be a particularly by this arrangement of the flow channel advantageous arrangement can be realized with respect to the installation space compactness.
  • the invention relates to an arrangement with a carrier plate according to the invention or an advantageous embodiment thereof.
  • the arrangement further comprises an electronic component carrier on which at least one electronic component to be cooled is arranged.
  • the electronic component carrier is at least partially formed as a heat sink, which is arranged in the receiving shaft of the flow channel and partially, in particular with parallel to the longitudinal direction of the flow channel extending cooling fins, is positioned hineinerumblend in the flow channel.
  • the electronic component carrier is arranged in the receiving shaft such that it is arranged to occlude the flow channel on its open side wall and / or its open ceiling wall. An undesirable cooling air flow outlet is avoidable.
  • a particularly noteworthy cooling concept can be made possible by this arrangement, and, moreover, the electronic component carrier can be kept mechanically stable and positioned by the flow channel.
  • the electronic component carrier is arranged engaging in the over the entire length of the receiving shaft between the Strömungskanaleinlassflansch and the Strömungskanalauslassflansch extending wall web.
  • this wall bar is thus also a holder and fixation created, so that the electronic component carrier is positioned in particular slip-proof.
  • the invention relates to an induction hob with an inventive arrangement or an advantageous embodiment thereof.
  • Fig. 1 is shown in a schematic plan view of an induction hob 1 in the open state from above.
  • the induction hob 1 comprises a trough-like receptacle 2, which downwardly represents the final housing of the induction hob 1.
  • this recording 2 is a preferably formed of metal plate-like bottom group 3 is arranged.
  • a fan is arranged under the floor group 3, under the floor group 3, a fan is arranged.
  • the bottom group 3 has an upper side 4, which faces a cooktop panel, not shown, which can be made of glass ceramic, for example.
  • On this upper side 4 formed in the embodiment of plastic integrally produced support plate 5 is arranged.
  • This is provided for receiving an electronic circuit substrate, not shown, and has to record both in number and in position and shape merely exemplified shots 6.
  • the simplified and schematically shown shots 6 are merely exemplary. This means that not only the elements designated by the reference numeral 6 can be provided for receiving the circuit carrier, but in addition to or instead can also serve other elements of the support plate 5 thereto.
  • the carrier plate 5 comprises a in the embodiment in the horizontal direction (x-direction) oriented and extending in the y-direction in a rear third of the surface of the support plate 5 flow channel 7. walls of the flow channel 7 are partially formed by the support plate 5 itself and integral with the support plate 5 is formed.
  • the flow channel 7 is arranged on an upper side 8, which faces the hob plate, not shown.
  • the flow channel 7 is shown with a longitudinal axis A.
  • a first side wall 9, which extends perpendicular to the plane of the figure, is formed by the carrier plate 5.
  • the flow channel 7 comprises a flow channel inlet flange 10 as a wall portion, which is funnel-shaped, as shown in FIG Fig. 1 can already be seen.
  • the flow channel 7 comprises a flow channel outlet flange 11 as a wall region.
  • a bottom 12 of the flow channel 7 is formed by the bottom and thus the top 8 of the support plate 5 also partially.
  • the carrier plate 5 may be fastened in particular by clipping or latching or by plug-in connections on the bottom group 3.
  • a first flow opening 13 is formed adjacent to the flow channel inlet flange 10.
  • a fan which is preferably arranged below the bottom group 3, in the direction of the flow channel 7 and introduced via the Strömungskanaleinlassflansch 10 in the flow channel 7.
  • the flow opening 13 is in accordance with the top view in FIG Fig. 1 not overlapping with the flow channel inlet flange 10 and thus not partially overlapping the flow channel inlet flange 10 with surface overlapping.
  • the flow opening 13 is covered at the top by a channel-like cover, not shown, in plan view, which is also arranged so that the cooling air is passed through the flow opening 13 and the channel-like cover directly to the flow channel inlet flange 10.
  • Fig. 2 is an enlarged section of the support plate 5 according to Fig. 1 shown, wherein a perspective view is shown here.
  • the funnel-shaped configuration of the flow channel inlet flange 10 is shown. As can be seen, the flow channel 7 is formed open on the side opposite the side wall 9 side. Likewise, it is open in the area of the ceiling and thus the opposite side of the floor 12. By this configuration, a receiving shaft 14 is formed. In this one can be in Fig. 2 not shown electronic component carrier are at least partially hineinerrangend into the flow channel 7.
  • the Strömungkanalauslassflansch 11 is formed sloping obliquely backwards and thus has a downwardly sloping inclined positioned ceiling wall 15.
  • a further second flow opening 16 is formed below the Strömungskanalauslassflansches 11, via which, according to the arrow, which represents the flow channel course, the cooling air circulation is displayed.
  • the flow opening 16 is covered by the Strömungskanalauslassflansch 11 like a hood.
  • a wall web 17 is formed, which extends with a wall height, which is significantly lower than the side wall 9.
  • this wall web 17 is at least partially not rectilinearly extending and arranged offset relative to the side walls 18 and 19 of the Strömungskanaleinlassflansches 10 and the Strömungskanalauslassflansches 11 to the outside.
  • this wall web 17 serves to provide a certain positioning possibility for the electronic component carrier.
  • the receiving shaft 14 thus extends between the Strömungskanaleinlassflansch 10 and the Strömungskanalauslassflansch 11 and is thus front and rear limited by these two components.
  • Fig. 3 is a representation according to Fig. 2 however, an electronic component carrier 20 is arranged in an end position in the receiving shaft 14.
  • this electronic component carrier 20 is designed as a heat sink having a plurality of cooling fins, wherein cooling fins 21 and 22 are shown. These extend in the interior of the flow channel 7, in particular parallel to the longitudinal axis A of the flow channel 7.
  • the electronic component carrier 20 is dimensioned in its dimensions so that it is in particular accurately inserted into the receiving shaft 14. Preferably, it thus closes laterally in the flow channel 7 and opposite the side wall 9. Due to the configuration of the receiving shaft 14, the electronic component carrier 20 is also arranged in a relatively fixed position.
  • the electronic component carrier 20 extends outside of the flow channel 7, wherein the electronic components 24, 25, 26, 27 and 28 are arranged on this further subregion 23 of the electronic component carrier 20.
  • These electronic components 24 to 28 are merely exemplary in number as well as in position and dimensioning.
  • the electronic component carrier 20 is arranged on a circuit carrier 29 which is positioned and fixed on the carrier plate 5. On this circuit board 29 more, unspecified electrical components are arranged.
  • the bottom of the Strömungskanaleinlassflansches 10 is formed by the top 4 of the bottom group 3.

Landscapes

  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Induction Heating Cooking Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cookers (AREA)

Claims (15)

  1. Plaque de support (5) pour un porte-circuit (29) équipé de composants électroniques (24 à 28) d'un appareil ménager (1), laquelle plaque de support (5) est réalisée pour la disposition sur un côté supérieur (4) d'un groupe de fond (3) et présente des logements (6) pour le porte-circuit (29), caractérisée en ce qu'un canal d'écoulement (7) allongé, comprenant des parois (9, 10, 11, 17), délimité en partie par celles-ci, est réalisé sur la plaque de support (5), lequel canal d'écoulement est réalisé pour conduire de l'air de refroidissement destiné à refroidir des composants électroniques (24 à 28) du porte-circuit (29), des parois (9, 10, 11, 17) du canal d'écoulement (7) étant réalisées elles-mêmes par la plaque de support (5).
  2. Plaque de support (5) selon la revendication 1, caractérisée en ce que le canal d'écoulement (7) est réalisé de manière ouverte sur un grand côté et en ce qu'un puits de logement (14) destiné à l'introduction latérale d'un support (20) de composants électroniques est réalisé sur ce grand côté.
  3. Plaque de support (5) selon la revendication 2, caractérisée en ce que le puits de logement (14), en vue dans le sens longitudinal (A) du canal d'écoulement (7), est délimité sur une paroi latérale ouverte et/ou sur une paroi de plafond ouverte par une bride d'entrée (10) de canal d'écoulement et par une bride de sortie (11) de canal d'écoulement.
  4. Plaque de support (5) selon la revendication 2 ou 3, caractérisée en ce qu'une paroi latérale ouverte du canal d'écoulement (7) présente une nervure de paroi (17) réduite en hauteur, notamment s'élevant au maximum à un tiers de la hauteur du canal d'écoulement (7), pour le positionnement du support (20) de composants électroniques.
  5. Plaque de support (5) selon l'une quelconque des revendications précédentes, caractérisée en ce que le canal d'écoulement (7) est délimité côté frontal par une bride d'entrée (10) de canal d'écoulement.
  6. Plaque de support (5) selon la revendication 5, caractérisée en ce que la bride d'entrée (10) de canal d'écoulement est réalisée en forme d'entonnoir.
  7. Plaque de support (5) selon la revendication 5 ou 6, caractérisée en ce que, de manière adjacente à la bride d'entrée (10) de canal d'écoulement, une ouverture d'écoulement (13) destinée à introduire l'air de refroidissement dans le canal d'écoulement (7) est réalisée dans le fond (4) d'un groupe de fond (3) disposé sous la plaque de support (5).
  8. Plaque de support (5) selon l'une quelconque des revendications précédentes, caractérisée en ce que le canal d'écoulement (7) est délimité côté arrière par une bride de sortie (11) de canal d'écoulement, laquelle est réalisée avec sa paroi de plafond (15) en descendant de manière oblique vers le bas.
  9. Plaque de support (5) selon la revendication 8, caractérisée en ce que directement en dessous de la paroi de plafond (15), une ouverture d'écoulement (16) destinée à guider l'air de refroidissement hors du canal d'écoulement (7) est réalisée dans un groupe de fond (3) disposé sous la plaque de support (5), notamment en ce que la bride de sortie (11) de canal d'écoulement recouvre l'ouverture d'écoulement (16) de manière similaire à un capot.
  10. Plaque de support (5) selon l'une quelconque des revendications précédentes, caractérisée en ce qu'elle est réalisée d'une seule pièce, notamment en matière plastique.
  11. Plaque de support (5) selon l'une quelconque des revendications précédentes, caractérisée en ce que le canal d'écoulement (7), en vue de dessus sur la plaque de support (5), est disposé en s'étendant horizontalement et/ou est disposé dans un tiers arrière de la surface de la plaque de support (5).
  12. Agencement comprenant une plaque de support (5) selon l'une quelconque des revendications précédentes et comprenant un support (20) de composants électroniques sur lequel est disposé au moins un composant électronique (24 à 28) à refroidir, la plaque de support (5) étant disposée sur un côté supérieur (4) d'un groupe de fond (3).
  13. Agencement selon la revendication 12, caractérisé en ce que le support (20) de composants électroniques est un corps de refroidissement, lequel est disposé par sections dans le puits de logement (14) et s'étend par sections dans le canal d'écoulement (7), notamment avec des ailettes de refroidissement (21, 22) s'étendant parallèlement au sens longitudinal (A) du canal d'écoulement (7) et est disposé en obturant le canal d'écoulement (7) latéralement et en haut.
  14. Agencement selon la revendication 12 ou 13, caractérisé en ce que le support (20) de composants électroniques est disposé en ayant prise dans la nervure de paroi (17) s'étendant sur toute la longueur du puits de logement (14) entre la bride d'entrée (10) de canal d'écoulement et la bride de sortie (11) de canal d'écoulement.
  15. Table de cuisson par induction (1) comprenant un agencement selon l'une quelconque des revendications 12 à 14.
EP12156205.2A 2011-03-10 2012-02-20 Plaque de support pour un porte-circuit d'un appareil ménager, agencement doté d'une telle plaque de support ainsi que champ de cuisson doté d'un agencement Active EP2498574B2 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
ES201130327A ES2412104B1 (es) 2011-03-10 2011-03-10 Placa de soporte para un soporte de circuito de un aparato doméstico, disposición con una placa de soporte de tal tipo, y campo de cocción por inducción con una disposición

Publications (4)

Publication Number Publication Date
EP2498574A2 EP2498574A2 (fr) 2012-09-12
EP2498574A3 EP2498574A3 (fr) 2013-02-27
EP2498574B1 true EP2498574B1 (fr) 2017-06-21
EP2498574B2 EP2498574B2 (fr) 2020-03-25

Family

ID=45656203

Family Applications (1)

Application Number Title Priority Date Filing Date
EP12156205.2A Active EP2498574B2 (fr) 2011-03-10 2012-02-20 Plaque de support pour un porte-circuit d'un appareil ménager, agencement doté d'une telle plaque de support ainsi que champ de cuisson doté d'un agencement

Country Status (2)

Country Link
EP (1) EP2498574B2 (fr)
ES (2) ES2412104B1 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210115329A (ko) * 2020-03-12 2021-09-27 엘지전자 주식회사 전기 레인지
KR20210115332A (ko) * 2020-03-12 2021-09-27 엘지전자 주식회사 전기 레인지 및 이에 포함되는 에어 가이드
KR20220161028A (ko) * 2021-05-28 2022-12-06 엘지전자 주식회사 전기 레인지

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020170905A1 (en) 2001-04-03 2002-11-21 Peterson Gregory A. Heat sink for printed circuit board components
WO2004060020A1 (fr) 2002-12-20 2004-07-15 BSH Bosch und Siemens Hausgeräte GmbH Plan de cuisson a induction
JP2008071679A (ja) 2006-09-15 2008-03-27 Mitsubishi Electric Corp 誘導加熱調理器
US20080142512A1 (en) 2006-12-14 2008-06-19 Won Tae Kim Cooking appliance
KR20090121718A (ko) 2008-05-22 2009-11-26 장영미 액자로 변신 가능한 다용도 봉투카드
EP2194328A2 (fr) 2008-12-05 2010-06-09 LG Electronics Inc. Plaque de cuisson encastrée
US20100219179A1 (en) 2009-03-02 2010-09-02 Delta Electronics, Inc. Electrical apparatus and air circulating system having such electrical apparatus

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20080078760A (ko) * 2007-02-24 2008-08-28 엘지전자 주식회사 유도 가열기
EP2292979B1 (fr) * 2009-09-03 2016-10-12 BSH Hausgeräte GmbH Dispositif de refroidissement pour un champ de cuisson à induction

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020170905A1 (en) 2001-04-03 2002-11-21 Peterson Gregory A. Heat sink for printed circuit board components
WO2004060020A1 (fr) 2002-12-20 2004-07-15 BSH Bosch und Siemens Hausgeräte GmbH Plan de cuisson a induction
JP2008071679A (ja) 2006-09-15 2008-03-27 Mitsubishi Electric Corp 誘導加熱調理器
US20080142512A1 (en) 2006-12-14 2008-06-19 Won Tae Kim Cooking appliance
KR20090121718A (ko) 2008-05-22 2009-11-26 장영미 액자로 변신 가능한 다용도 봉투카드
EP2194328A2 (fr) 2008-12-05 2010-06-09 LG Electronics Inc. Plaque de cuisson encastrée
US20100219179A1 (en) 2009-03-02 2010-09-02 Delta Electronics, Inc. Electrical apparatus and air circulating system having such electrical apparatus

Also Published As

Publication number Publication date
EP2498574A2 (fr) 2012-09-12
ES2412104A1 (es) 2013-07-10
ES2635715T3 (es) 2017-10-04
ES2635715T5 (es) 2020-09-24
EP2498574B2 (fr) 2020-03-25
EP2498574A3 (fr) 2013-02-27
ES2412104B1 (es) 2014-05-21

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