EP2484787B1 - Cu-ni-si-co alliage de cuivre pour matériel électronique et son procédé de production - Google Patents

Cu-ni-si-co alliage de cuivre pour matériel électronique et son procédé de production Download PDF

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EP2484787B1
EP2484787B1 EP09849834.8A EP09849834A EP2484787B1 EP 2484787 B1 EP2484787 B1 EP 2484787B1 EP 09849834 A EP09849834 A EP 09849834A EP 2484787 B1 EP2484787 B1 EP 2484787B1
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mass
crystal
average
strength
copper alloy
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EP2484787A1 (fr
EP2484787A4 (fr
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Hiroshi Kuwagaki
Naohiko Era
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JX Nippon Mining and Metals Corp
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JX Nippon Mining and Metals Corp
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    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent

Definitions

  • the present invention relates to a precipitation hardened copper alloy and particularly, but not exclusively, to a Cu-Ni-Si-Co copper alloy suitable for use in various electronic components.
  • the amount of precipitation hardened copper alloy used as the copper alloy for electronic materials, in place of solid solution strengthened copper alloys such as conventional phosphor bronze and brass, has been increasing.
  • precipitation hardened copper alloys microfine precipitates uniformly disperse by age-treating a solutionized supersaturated solid solution to increase alloy strength, and at the same time the amount of solutionized element in copper decreases to improve electrical conductivity.
  • a material having mechanical characteristics such as strength and spring property as well as good electrical and thermal conductivity is obtained.
  • a Cu-Ni-Si copper alloy generally referred to as the Corson alloy is a representative copper alloy that possesses the combination of relatively high electrical conductivity, strength, and bendability, making it one of the alloys that are currently under active development in the industry.
  • this copper alloy improvement of strength and electrical conductivity is attempted by allowing microfine Ni-Si intermetallic compound particles to precipitate in the copper matrix.
  • Patent Document 1 It is disclosed in Japanese Laid-open Patent Application 11-222641 (Patent Document 1) that Co is similar to Ni in forming a compound with Si and increasing mechanical strength, and when Cu-Co-Si alloys are aged, they have slightly better mechanical strength and electrical conductivity than Cu-Ni-Si alloys.
  • Patent Document 2 It is disclosed in Japanese Laid-open Patent Application 11-222641 (Patent Document 1) that Co is similar to Ni in forming a compound with Si and increasing mechanical strength, and when Cu-Co-Si alloys are aged, they have slightly better mechanical strength and electrical conductivity than Cu-Ni-Si alloys.
  • the document also states that, where acceptable in cost, Cu-Co-Si and Cu-Ni-Co-Si alloys may be also selected.
  • a preparation method of said alloy is described (see claim 10) in which, after a cold working, a recrystallization process is performed at 700-920°C, and then a cold working not more than 25% and an aging treatment at 420-550°C are performed, and then a further cold working not more than 25% and a low-temperature annealing are performed.
  • Patent Document 2 Japanese Translation of PCT International Application Publication No. 2005-532477 (Patent Document 2) describes a wrought copper alloy consisting of, by weight, nickel: 1%-2.5%, cobalt: 0.5-2.0%, silicon: 0.5%-1.5%, and the balance being copper and unavoidable impurities, wherein the total amount of nickel and cobalt contained is 1.7% to 4.3% with a ratio of (Ni + Co)/Si being between 2:1 and 7:1, wherein said wrought copper alloy has an electrical conductivity greater than 40% IACS. Cobalt is combined with silicon to form silicides that are effective for age hardening, to restrict grain growth and to increase softening resistance.
  • Patent Document 3 In International Publication Pamphlet WO2006/101172 (Patent Document 3) it is described that in a solutionizing treatment, it is effective to set the cooling rate to about 10°C or greater per second because the strength-enhancing effect of the Cu-Ni-Si copper alloy is further demonstrated when the cooling rate after heating is intentionally increased (see paragraph 0028).
  • Patent Document 4 describes a preparation method of Cu-Ni-Si-Co alloy, wherein cold rolling not less than 85% is performed after hot rolling, and then cold rolling not more than 30% is performed after annealing at 450-480°C for 5-30 minutes, and further an aging treatment is performed at 450-500°C, for 30-120 minutes (claim 5).
  • US2008/0190524 A1 discloses a range of Cu-Ni-Si alloys suitable for use in electronic parts, based on a particular crystal orientation relationship.
  • JP2008-266783A discloses certain Cu-Ni-Si alloys for use in electrical/electronic devices, having a specified mean crystal grain size and standard deviation of crystal grain size.
  • one problem to be solved by the present invention is to provide Cu-Ni-Si-Co alloy which has mechanical and electrical properties that render the alloy suitable for use as a copper alloy for electronic materials and which has even mechanical properties.
  • another problem to be solved by the present invention is to provide a method for manufacturing such Cu-Ni-Si-Co alloy.
  • the present inventors have found that the Cu-Ni-Si-Co alloys according to the prior art have a tendency to vary the size of crystal grains and therefore big grains and small grains are mixed. The inventors thus have found that the heterogeneity of the mechanical properties is associated with this heterogeneity of size of crystal grains.
  • the Cu-Ni-Si-Co alloys it is necessary to perform the solutionizing treatment at higher temperature than usual Cu-Ni-Si alloy because of the addition of Co, and therefore recrystallized particles have a tendency to become oversized.
  • second phase particles such as crystallized material and deposits which have been deposited in the first part of solutionizing process inhibit the growth of crystal grains as obstacles. Therefore, in the Cu-Ni-Si-Co alloys, recrystallized particles have a tendency to vary compared to the usual Cu-Ni-Si alloy.
  • the present inventors have, therefore, examined eagerly the means for reducing the dispersion of the recrystallized particles and have thus identified that when fine second phase particles had been allowed to deposit in copper matrix phase at regular intervals and evenly as much as possible, crystalline particles did not so grow due to the pinning effect of the second phase particles. Furthermore, the size of the recrystallized particles also could be homogeneous because the pinning effect acted throughout the copper matrix phase evenly. As the result, it was revealed that Cu-Ni-Si-Co alloy having little dispersion of mechanical properties is obtained.
  • the present invention which was completed based on the above knowledge, provides the copper alloy for electronic materials of claim 1.
  • the present invention provides the method of claim 2 for manufacturing the copper alloy.
  • the present invention provides a wrought copper product having the copper alloy according to the present invention.
  • the present invention provides an electronic component having the copper alloy according to the present invention.
  • aspects and embodiments of the present invention provide for a Cu-Ni-Si-Co copper alloy having an even mechanical property, because it has homogeneous crystal-grain diameters within an appropriate range.
  • Ni, Co and Si form an intermetallic compound by appropriate thermal treatment, and high strengthening can be attempted without deteriorating electrical conductivity.
  • Ni, Co and Si are Ni: less than 1.0% by mass, Co: less than 0.5% by mass, and Si: less than 0.3% by mass, respectively.
  • Ni: more than 2.5% by mass, Co: more than 2.5% by mass, and Si: more than 1.2% by mass high strengthening can be attempted but electrical conductivity is significantly reduced. Furthermore, hot workability is deteriorated.
  • the addition amounts of Ni, Co and Si are therefore set at Ni: 1.0-2.5% by mass, Co: 0.5-2.5% by mass, and Si: 0.3-1.2% by mass.
  • the addition amounts of Ni, Co and Si are preferably Ni: 1.5-2.0% by mass, Co: 0.5-2.0% by mass, and Si: 0.5-1.0% by mass.
  • Cr can strengthen crystal grain boundary because it preferentially precipitates at the grain boundary, allows for less generation of cracks during hot working, and can suppress the reduction of yield.
  • Cr that underwent grain boundary precipitation during fusion casting will be resolutionized by for example solutionizing, but forms precipitation particles of bcc structure having Cr as the main component or a compound with Si during the subsequent aging precipitation.
  • Si that did not contribute to aging precipitation will suppress the increase in electrical conductivity while remaining solutionized in the matrix, but the amount of solutionized Si can be decreased by adding silicide-forming element Cr to further precipitate the silicide, and electrical conductivity can be increased without any loss in strength.
  • Mg, Mn, Ag and P will improve product properties such as strength and stress relaxation property without any loss of electrical conductivity with the addition of just a trace amount.
  • the effect of addition is mainly exerted by solutionizing into the matrix, but a further effect can also be exerted by being contained in second phase particles.
  • the total concentration of Mg, Mn, Ag and P is more than 0.5%, the effect of improving the property will saturate and in addition manufacturability will be lost. Accordingly, it is possible to add a total of up to 0.5% by mass of one or two or more selected from Mg, Mn, Ag and P to the Cu-Ni-Si-Co alloy according to the present invention.
  • less than 0.01% by mass will only have a small effect, preferably a total of 0.01-0.5% by mass, even more preferably a total of 0.04-0.2% by mass, may be added.
  • Sn and Zn will also improve product properties such as strength, stress relaxation property, and platability without any loss of electrical conductivity with the addition of just a trace amount.
  • the effect of addition is mainly exerted by solutionizing into the matrix.
  • the total concentration of Sn and Zn is more than 2.0% by mass, the effect of improving the property will saturate and in addition manufacturability will be lost.
  • a total of up to 2.0% by mass of one or two selected from Sn and Zn can be added to the Cu-Ni-Si-Co alloy according to the present invention.
  • less than 0.05% by mass will only have a small effect, preferably a total of 0.05-2.0% by mass, more preferably a total of 0.5-1.0% by mass, may be added.
  • Sb, Be, B, Ti, Zr, Al and Fe will also improve product properties such as electrical conductivity, strength, stress relaxation property, and platability by adjusting the addition amount according to the desired product property.
  • the effect of addition is mainly exerted by solutionizing into the matrix, but a further effect can also be exerted by being contained in second phase particles, or by forming second phase particles of new composition.
  • the total of these elements is more than 2.0% by mass, the effect of improving the property will saturate and in addition manufacturability will be lost.
  • a total of up to 2.0% by mass of one or two or more selected from As, Sb, Be, B, Ti, Zr, Al and Fe can be added to the Cu-Ni-Si-Co alloy according to embodiments of the present invention.
  • a total of 0.001-2.0% by mass preferably a total of 0.05-1.0% by mass, is added.
  • Crystal-grain influences the strength and, in general, the Hall-Petch rule, wherein the strength is proportional to -1/2 power of crystal-grain diameter, is effected.
  • Coarse crystal-grain deteriorates the bendability and causes surface roughness when subjected to bending. Therefore, in general, miniaturization of crystal-diameter is desirable for copper alloy to increase strength. Concretely, 30 ⁇ m or less is preferable. 23 ⁇ m or less is more preferable.
  • the average crystal-grain diameter is controlled to be set within the range from 15 ⁇ m to 30 ⁇ m.
  • the average crystal-grain diameter is, preferably, from 18 ⁇ m to 23 ⁇ m.
  • both the effect of increase of the strength obtained by miniaturization of crystal-diameter and the effect of increase of the strength obtained by precipitation hardening can be obtained in a balanced manner. Further, within said range of crystal-grain diameter, it is possible to obtain a good bendability and stress relaxation property.
  • crystal-grain diameter indicates a diameter of minimal circle surrounding each crystal-grain which can be observed using a microscope, the average of crystal-grain diameter being an average of said diameters.
  • the average of the differences between the maximum crystal-grain diameter and the minimum crystal-grain diameter for 15 fields of view each having an area of 0.5 mm 2 is 7 ⁇ m or smaller.
  • the average of the differences is ideally 0 ⁇ m. However, this is actually difficult to achieve, and therefore the lower limit is set to 3 ⁇ m from the actual minimal value, and 3-7 ⁇ m is optimal.
  • the maximum crystal-grain diameter as used herein, is a maximum crystal-grain diameter observed in the 15 fields of view having an area of 0.5 mm 2 , and the minimal crystal-grain diameter observed in the same fields.
  • the average of the differences between the maximum crystal-grain diameter and the minimum crystal-grain diameter is obtained by calculating an average of the differences between the maximum crystal-grain diameter and the minimum crystal-grain diameter which were obtained in 15 fields of view.
  • Aging treatment is carried out by heating at a temperature range of 350 to 550°C for 1 hour or more, and precipitating the second phase particles that were solutionized in the solutionizing step as microfine particles in the order of nanometers.
  • This aging treatment increases strength and electrical conductivity.
  • Cold rolling may be performed before and/or after aging in order to obtain higher strength.
  • annealing to remove deformation low temperature annealing
  • grinding, polishing, shotblast pickling etc. are suitably performed to remove oxidation scales on the surface as appropriate.
  • the above manufacturing process is basically carried out for the copper alloy according to the present invention as well, but in order to control the dispersion of the average crystal-grain diameter and crystal-grain diameter within the range defined by the present invention, it is important to allow the fine second phase particles to deposit in copper matrix phase at regular intervals and evenly as much as possible in the first part of the solutioning process, as described above. In order to obtain the copper alloys according to the present invention, it is particularly required to produce the same with attention to the following points.
  • the cooling rate is low, Si compounds including Co and Cr will be reprecipitated.
  • the heating treatment aging treatment
  • high strength cannot be obtained because coarse crystallizations, which do not contribute any strength, are grown using the precipitated precipitates as a nucleus. Therefore, it is necessary to set the cooling rate as fast as possible, preferably at least 15°C/s. Since precipitation of second-phase particles is considerable until about 400°C, the cooling rate at less than 400°C is not problematic. Therefore, in the present invention, when the temperature of the material is reduced from 850°C to 400°C the average cooling rate is 15°C/s or greater, preferably 20°C/s or greater.
  • the "average cooling rate from 850°C to 400°C” after hot rolling refers to the value (°C/s) obtained by measuring the time when the temperature of the material is reduced from 850°C to 400°C and calculating the expression "(850 - 400) (°C)/Cooling time (s)."
  • Water-cooling is the most effective method for increasing the cooling rate.
  • the cooling rate can be increased by managing the water temperature because the cooling rate varies due to the temperature of the water to be used for water-cooling.
  • the water temperature is preferably kept at 25°C or lower because the desired cooling rate sometimes cannot be achieved when the water temperature is 25°C or higher.
  • a spray shown or mist
  • cold water be constantly allowed to flow into the water tank, or the water temperature be otherwise prevented from increasing so that the material is cooled at a constant water temperature (25°C or lower).
  • the cooling rate can be increased by providing additional water-cooling nozzles or increasing the flow rate of water per unit of time.
  • Cold rolling is carried out after hot rolling. This cold rolling is carried out for the purpose of increasing the distortions which become the precipitation site, in order to allow the precipitate to be precipitated evenly.
  • the cold rolling is preferably carried out with the rolling reduction not less than 85%, more preferably not less than 95%.
  • the solution treatment is carried out immediately after the hot rolling without the cold rolling, the precipitates do not precipitate evenly.
  • the combination of the hot rolling and subsequent cold rolling may be optionally repeated.
  • First aging treatment is carried out after cold rolling.
  • the second phase particles remain before the present process is performed, such second phase particles further grow when the present process is carried out, and therefore said process results in differences between the particle diameters of the particles generated in the present process and those which remain before the process.
  • the second phase particles since the second phase particles have almost disappeared in the first part of the process, it is possible to allow the fine second phase particles having similar size to be precipitated evenly.
  • Fine second phase particles can be evenly precipitated in matrix phase by performing the first aging treatment at 350 - 500°C for 1- 24 hours, preferably at 350°C or more and less than 400°C for 12 - 24 hours, at 400°C or more and less than 450°C for 6 - 12 hours, and at 450°C or more and less than 500°C for 3 - 6 hours.
  • the growth of recrystallized particles which occurs in the next step of the solution treatment can be evenly prevented by the pinning effect, and therefore sized structure with crystal-grain diameter having little dispersion can be obtained.
  • Solution treatment is carried out after the first aging treatment.
  • the solution treatment while the second phase particles are solutionized, fine and even recrystallized particles are grown. Therefore, it is required that the solution treatment is performed at 950 - 1050°C.
  • recrystallized particles are firstly grown, and then the second phase particles precipitated in the first aging treatment are solutionized, and therefore the growth of the recrystallized particles can be controlled by the pinning effect.
  • the pinning effect disappears after the second phase particles are solutionized, and therefore the recrystallized particles become oversized when the solution treatment is continued for long term.
  • an appropriate time for solution treatment is 60 - 300 seconds, preferably 120 - 180 seconds, at 950°C or more and less than 1000°C, and 30 - 180 seconds, preferably 60 - 120 seconds, at 1000°C or more and less than 1050°C.
  • average cooling rate when the temperature of material is cooled from 850°C to 400°C should be set to be 15°C/s or more, preferably 20°C/s or more, in order to avoid the precipitate of the second phase particles.
  • Second aging treatment is carried out after the solution treatment.
  • condition for the second aging treatment While any traditional condition useful for miniaturization of the precipitates can be employed, it should be noted that temperature and time are set so that the precipitates will not become oversized. 1 - 24 hours at 350 - 550°C, more preferably 1 - 24 hours at 400 - 500°C, is an example of the condition for the aging treatment. Cooling rate after the aging treatment has little effect on the size of the precipitates.
  • the precipitation sites are increased so that the strength may be increased by promoting the age hardening by using the precipitation site.
  • the precipitates are utilized so that the strength may be increased by promoting work hardening.
  • Cold rolling can be carried out before and/or after the second aging treatment.
  • stress relief annealing is carried out in order to improve the stress relaxation property.
  • the stress relief annealing can be carried out under the traditional condition for heating. For example, the annealing is carried out for 1 - 24 hours at 250 - 400°C, preferably for 1 - 24 hours at 250 - 300°C.
  • the Cu-Ni-Si-Co alloy of the present invention can be processed into various wrought copper and copper alloy products, for example boards, strips, tubes, bars and wires. Furthermore, the Cu-Ni-Si-Co copper alloy according to the present invention can be used in electronic components such as lead frames, connectors, pins, terminals, relays, switches, and foil for secondary battery.
  • Copper alloys having each of the component compositions listed in Table 1 (Example) and Table 2 (Comparative example) were melted at 1300°C with a high frequency fusion furnace, and cast into ingots having a thickness of 30 mm. Next, these ingots were heated at 1000°C, after which the finishing temperature (temperature at completion of hot rolling) was set to 900°C and hot rolled to 10 mm plates. After completion of hot rolling, the temperature of the material was cooled with water from 850°C to 400°C at the average cooling rate of 18°C/s, and then cooled by leaving it in the air. Next, scales on the surface were removed by facing to a thickness of 9 mm, and cold rolling was carried out to obtain plates having a thickness of 0.15 mm.
  • Table 1 Example
  • Table 2 Comparative example
  • the first aging treatment was performed at various temperatures for 3 - 12 hours, and then a solution treatment was performed at several temperatures for 120 seconds, immediately after which the temperature of the material was cooled with water from 850°C to 400°C at the average cooling rate of 18°C/s, and then by leaving it in the air.
  • the material was cold rolled to 0.10 mm, and then in an inert atmosphere, a second aging treatment was carried out at 450°C for 3 hours.
  • the material was further subjected to cold rolling to 0.08 mm and finally, in an inert atmosphere, stress relief annealing was carried out at 300°C for three hours.
  • the test strips were prepared.
  • the test strip was embedded in resin so that the viewing screen thereof would be a cross section which is parallel to the rolling direction, and then the mirror finish of the viewing screen was performed by mechanical polishing. Then, into the solution which was prepared by mixing 10 parts by volume of 36% hydrochloric acid with 100 parts by volume of water, ferric chloride was dissolved so that 5 % by weight of ferric chloride was contained in the solution. In the solution thus prepared, the test strip was immersed for ten seconds to emerge the metal structure. Subsequently, said metal structure was 100 times magnified with an optical microscope and a photo was taken for each field of view having an area of 0.5 mm 2 , and the diameters of minimal circle surrounding each crystal-grain were all determined. Then, the average in each field of view was calculated and the average in 15 fields of view was defined as the average crystal-grain diameter.
  • the difference between the maximum crystal-grain diameter and the minimum crystal-grain diameter was determined for each field of view.
  • the average of the differences between the maximum crystal-grain diameter and the minimum crystal-grain diameter was defined as the average obtained from 15 fields of view.
  • Strength was tested using a tensile test carried out in the rolling direction, and 0.2% yield strength (YS: MPa) was measured. Dispersion of strength among the measurement points is defined as the difference between maximum strength and minimum strength at 30 measurement points, and the average strength is the average at the 30 measurement points.
  • the electrical conductivity (EC: % IACS) was determined by measuring volume resistivity with the aid of double bridge. Dispersion of electrical conductivity among the measurement points is a difference between maximum conductivity and minimum conductivity at 30 measurement points, and the average electrical conductivity is the average at the 30 measurement points.
  • Bending workability was estimated by the roughness of the surface at the bending site.
  • W bending test of Badway (direction of warped axis is identical with rolling direction) was carried out and Ra ( ⁇ m) defined by JIS B 0601 was obtained by analyzing the surface of the bending site with a confocal laser scanning microscope.
  • Dispersion of bending roughness among the measurement points is defined as the differences between maximum Ra and minimum Ra at the 30 sites, and the average of bending roughness is an average of Ras at these 30 sites.
  • Alloys of Nos. 2 - 10 and 12 - 34 are working examples of the present invention, wherein they have an appropriate strength electric conductivity for electronic materials and dispersion of their properties is little.
  • Alloys of Nos. 38, 39, 42, 44, 49 and 50 underwent the first aging treatment at too low a temperature, and therefore they had small numbers of the second phase particles. Therefore, when they underwent the solution treatment, their crystal-grain diameters became oversized and strength and bending workability were deteriorated. Further, dispersion of crystal-grain diameters increased. As the result, the dispersion of their properties increased.

Claims (4)

  1. Alliage de cuivre pour matériaux électroniques contenant :
    Ni : 1,0 à 2,5% en masse ;
    Co : 0,5 à 2,5% en masse ;
    Si : 0,3 à 1,2% en masse ;
    éventuellement jusqu'à 0,5% en masse de Cr ;
    éventuellement un total de jusqu'à 0,5% en masse d'un ou plusieurs éléments sélectionnés parmi Mg, Mn, Ag et P ;
    éventuellement un total de jusqu'à 2,0% en masse d'un ou deux éléments sélectionnés parmi Sn et Zn ;
    éventuellement un total de jusqu'à 2,0% en masse d'un ou plusieurs éléments sélectionnés parmi As, Sb, Be, B, Ti, Zr, Al et Fe ;
    et le reste étant du Cu et des impuretés inévitables ;
    et ayant un diamètre moyen de grain cristallin de 15 à 30 µm ;
    dans lequel la moyenne des différences entre un diamètre maximum de grain cristallin et un diamètre minimum de grain cristallin obtenue dans 15 champs de vision, chaque champ ayant une superficie de 0,5 mm2, est de 7 µm ou moins.
  2. Procédé de fabrication de l'alliage de cuivre selon la revendication 1, comprenant les étapes consistant en :
    - étape 1, un coulage par fusion d'un lingot ayant une composition souhaitée ;
    - étape 2, un chauffage à une température de matériau de 950 à 1050°C pendant 1 heure ou plus, puis un laminage à chaud, la température à la fin du laminage à chaud étant réglée à 850°C ou plus, puis un refroidissement du matériau, le taux de refroidissement moyen de 850°C à 400°C étant de 15°C/s ou plus ;
    - étape 3, un laminage à froid de 85% ou plus d'usinabilité ;
    - étape 4, un traitement de vieillissement par chauffage à 350 à 500°C pendant 1 à 24 heures ;
    - étape 5, une mise en solution à 950 à 1050°C, et le refroidissement, le taux de refroidissement moyen de 850°C à 400°C étant de 15°C/s ou plus ;
    - étape 6 éventuelle, un laminage à froid ;
    - étape 7, un traitement de vieillissement ;
    - étape 8 éventuelle, un laminage à froid ; et
    - étape 9, un recuit de détente.
  3. Produit de cuivre battu comportant l'alliage de cuivre selon la revendication 1.
  4. Composant électronique comportant l'alliage de cuivre selon la revendication 1.
EP09849834.8A 2009-09-28 2009-09-28 Cu-ni-si-co alliage de cuivre pour matériel électronique et son procédé de production Active EP2484787B1 (fr)

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Families Citing this family (13)

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Publication number Priority date Publication date Assignee Title
US8821477B2 (en) 2007-08-06 2014-09-02 Boston Scientific Scimed, Inc. Alternative micromachined structures
US8795254B2 (en) 2008-12-10 2014-08-05 Boston Scientific Scimed, Inc. Medical devices with a slotted tubular member having improved stress distribution
JP2013523282A (ja) 2010-03-31 2013-06-17 ボストン サイエンティフィック サイムド，インコーポレイテッド 曲げ剛性プロファイルを有するガイドワイヤ
JP6246454B2 (ja) * 2011-11-02 2017-12-13 Ｊｘ金属株式会社 Ｃｕ−Ｎｉ−Ｓｉ系合金及びその製造方法
JP5770113B2 (ja) * 2012-01-13 2015-08-26 Jx日鉱日石金属株式会社 金属箔複合体、並びに成形体及びその製造方法
US9901706B2 (en) 2014-04-11 2018-02-27 Boston Scientific Scimed, Inc. Catheters and catheter shafts
JP6310004B2 (ja) * 2016-05-27 2018-04-11 Ｊｘ金属株式会社 電子部品用Ｃｕ−Ｃｏ−Ｎｉ−Ｓｉ合金
CN106244849A (zh) * 2016-10-13 2016-12-21 龙岩学院 一种超声波强化高性能铜合金的制备方法
CN108642419A (zh) * 2018-05-31 2018-10-12 太原晋西春雷铜业有限公司 一种折弯性优良的铜镍硅合金带材及其制备方法
JP7451964B2 (ja) 2019-01-16 2024-03-19 株式会社プロテリアル Ｃｕ合金板およびその製造方法
CN110195166A (zh) * 2019-04-17 2019-09-03 宁波兴业盛泰集团有限公司 一种引线框架用抗折弯CuNiCoSi系合金及其制造方法
CN112410646A (zh) * 2020-10-16 2021-02-26 扬州千裕电气有限公司 一种电子复合材料
CN113234958A (zh) * 2021-04-25 2021-08-10 江苏青益金属科技股份有限公司 适用于石油输送管道恒温包套的合金线材及其制备方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01122264A (ja) 1987-11-05 1989-05-15 Nec Corp 画像出力装置
JP3408021B2 (ja) 1995-06-30 2003-05-19 古河電気工業株式会社 電子電気部品用銅合金およびその製造方法
US7182823B2 (en) * 2002-07-05 2007-02-27 Olin Corporation Copper alloy containing cobalt, nickel and silicon
WO2006101172A1 (fr) 2005-03-24 2006-09-28 Nippon Mining & Metals Co., Ltd. Alliage de cuivre pour materiel electronique
JP4068626B2 (ja) * 2005-03-31 2008-03-26 日鉱金属株式会社 電子材料用Ｃｕ−Ｎｉ−Ｓｉ−Ｃｏ−Ｃｒ系銅合金及びその製造方法
JP5156317B2 (ja) * 2006-09-27 2013-03-06 Ｄｏｗａメタルテック株式会社 銅合金板材およびその製造法
US9034123B2 (en) * 2007-02-13 2015-05-19 Dowa Metaltech Co., Ltd. Cu—Ni—Si-based copper alloy sheet material and method of manufacturing same
JP5170881B2 (ja) * 2007-03-26 2013-03-27 古河電気工業株式会社 電気・電子機器用銅合金材およびその製造方法
JP4981748B2 (ja) * 2007-05-31 2012-07-25 古河電気工業株式会社 電気・電子機器用銅合金
US20090183803A1 (en) * 2007-12-21 2009-07-23 Mutschler Ralph A Copper-nickel-silicon alloys
JP4596490B2 (ja) * 2008-03-31 2010-12-08 Ｊｘ日鉱日石金属株式会社 電子材料用Ｃｕ−Ｎｉ−Ｓｉ−Ｃｏ系銅合金及びその製造方法

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WO2011036804A1 (fr) 2011-03-31
EP2484787A1 (fr) 2012-08-08
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JP5506806B2 (ja) 2014-05-28
CN102549180A (zh) 2012-07-04
JPWO2011036804A1 (ja) 2013-02-14

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