EP2439031A1 - Utilisation de popcorn dans des matières premières dérivées du bois et composites - Google Patents

Utilisation de popcorn dans des matières premières dérivées du bois et composites Download PDF

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Publication number
EP2439031A1
EP2439031A1 EP20110191160 EP11191160A EP2439031A1 EP 2439031 A1 EP2439031 A1 EP 2439031A1 EP 20110191160 EP20110191160 EP 20110191160 EP 11191160 A EP11191160 A EP 11191160A EP 2439031 A1 EP2439031 A1 EP 2439031A1
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EP
European Patent Office
Prior art keywords
popcorn
wood
layer
resin
granules
Prior art date
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Ceased
Application number
EP20110191160
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German (de)
English (en)
Inventor
Alireza Kharazipour
Christian Bohn
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Georg August Universitaet Goettingen
Universitaetsmedizin Goettingen Georg August Universitaet
Original Assignee
Georg August Universitaet Goettingen
Universitaetsmedizin Goettingen Georg August Universitaet
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Publication date
Application filed by Georg August Universitaet Goettingen, Universitaetsmedizin Goettingen Georg August Universitaet filed Critical Georg August Universitaet Goettingen
Publication of EP2439031A1 publication Critical patent/EP2439031A1/fr
Ceased legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
    • B27N3/00—Manufacture of substantially flat articles, e.g. boards, from particles or fibres
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/253—Cellulosic [e.g., wood, paper, cork, rayon, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y10T428/268—Monolayer with structurally defined element
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31971—Of carbohydrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31971—Of carbohydrate
    • Y10T428/31975—Of cellulosic next to another carbohydrate
    • Y10T428/31978—Cellulosic next to another cellulosic
    • Y10T428/31982—Wood or paper
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31971—Of carbohydrate
    • Y10T428/31975—Of cellulosic next to another carbohydrate
    • Y10T428/31978—Cellulosic next to another cellulosic
    • Y10T428/31986—Regenerated or modified
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31971—Of carbohydrate
    • Y10T428/31989—Of wood

Definitions

  • the present invention relates to the field of wood and / or composites, particularly chipboard and fiberboard, and composites containing lignocellulose and popcorn.
  • Wood and / or composite materials, in particular chipboard or fiberboard have been known for more than a hundred years as a substitute for solid wood in the furniture industry, construction, etc.
  • For the quality of wood and / or composite materials play several factors, including in particular the bulk density, the transverse tensile strength and thickness swelling a role.
  • the density has for wood and / or composites of great importance, since the advantageous properties of a chipboard or fiberboard, such as the strength properties, usually increase with increasing density.
  • wood and / or composites of lower density would be advantageous, since less lignocellulose and binder is needed for the production of such wood and / or composites and these can be transported more cheaply.
  • such low density composites have a wide range of uses that require less dense (and therefore heavy) material.
  • the advantageous properties associated with increasing bulk density should deteriorate as little as possible, if not even obtain.
  • a wood and composite material according to claim 1 Accordingly, a lignocellulose-containing molded body, in particular a wood and composite material, such as a chipboard and / or fiberboard proposed, wherein the lignocellulose-containing molded body contains popcorn as a structuring and / or dimensionally stabilizing material is provided.
  • lignocellulose-containing shaped body in particular covers all flat and non-planar materials containing comminuted lignocellulose-containing materials, such as wood, cereal straw, hemp or flax, which are formed after gluing with a synthetic or natural binder and under temperature and pressure are pressed.
  • wood and / or composite material is understood to mean, in particular, materials which mainly consist of mechanically or thermomechanically comminuted lignocellulose-containing material, which are shaped after gluing with a synthetic or natural binder and pressed under pressure and temperature into wood and / or composite materials ,
  • the wood or composite material may consist of 100% popcorn.
  • the term "wood and / or composite material" within the meaning of the present invention should be understood in the broadest sense and expressly include such materials that are (only) made of popcorn and contain no wood components (more).
  • popcorn in the sense of the present invention comprises in particular all materials which, like the puffed corn ( Zea mays, convar microspermum ), if appropriate after adequate greasing, explode at high temperatures due to fast heating of the water present in the seed and so converted the starch contained in the seed into a foamy consistency.
  • Such behavior is known inter alia from quinoa- Kom, amaranth, rice or wheat, materials based on these raw materials are explicitly referred to in the context of the present invention as “popcorn” and includes, the term “popcorn” should not limited to corn only and has been chosen for reasons of simplicity, clarity and readability.
  • structural and dimensionally stabilizing material means in particular any material which, due to its structure, gives the material a certain strength and dimensional stability.
  • the proportion of popcorn in the lignocellulose-containing shaped body can be between> 0 and ⁇ 100% of the structuring and / or dimensionally stabilizing material.
  • a lignocellulose-containing molding according to the invention may also consist of 100% popcorn; the term "lignocellulosic shaped body" is to be understood in the widest possible sense and should explicitly also include those shaped bodies which consist essentially or completely of popcorn.
  • the popcorn has a particle size distribution in which ⁇ 50% and ⁇ 90% of the popcorn have a particle size of ⁇ 2 mm and ⁇ 10 mm.
  • Popcorn of larger grain size is often less suitable for processing into lignocellulose-containing moldings such as wood and / or composites, and for many applications within the present invention, popcorn of smaller grain size tends to absorb the binder or glue added during the manufacture of the wood and / or composite the quality of the wood and / or composite material may deteriorate.
  • the popcorn has a particle size distribution in which ⁇ 70% and ⁇ 90% of the popcorn have a particle size of ⁇ 2 mm and ⁇ 10 mm.
  • the popcorn has a particle size distribution in which ⁇ 50% and ⁇ 90%, more preferably ⁇ 70% and ⁇ 90% of the popcorn have a particle size of ⁇ mm and ⁇ 10 mm.
  • the popcorn has a particle size distribution in which ⁇ 50% and ⁇ 80% of the popcorn have a particle size of ⁇ 3 mm and ⁇ 8 mm.
  • the popcorn has an average particle size distribution of ⁇ 3 mm and ⁇ 6 mm. This has been found to be beneficial for many applications within the present invention.
  • the popcorn has an average particle size distribution of ⁇ 3.5 mm and ⁇ 5 mm.
  • the fat content of the popcorn before processing is ⁇ 10 (wt)%.
  • fat content of popcorn is not understood the total amount of fat in popcorn, but the proportion of fat, which was used to hydrophobize the seed epidermis, which leads to a better inclusion of the water contained in the seed.
  • the present invention also relates to the use of popcorn as a formaldehyde scavenger, particularly but not limited to wood and / or composites made with urea-formaldehyde resin, melamine-formaldehyde resin, melamine-reinforced urea-formaldehyde resin, tannin-formaldehyde resin and phenol-formaldehyde resin a mixture of said resins have been bonded.
  • formaldehyde scavenger particularly but not limited to wood and / or composites made with urea-formaldehyde resin, melamine-formaldehyde resin, melamine-reinforced urea-formaldehyde resin, tannin-formaldehyde resin and phenol-formaldehyde resin a mixture of said resins have been bonded.
  • popcorn can be used not only as a structuring and dimensionally stabilizing material in lignocellulose-containing moldings such as wood and / or composites, but also has the advantageous property in the manufacture and use of wood and / or composites as a formaldehyde scavenger in the To act plate.
  • the proportion of popcorn in the wood and / or composite material can be between> 0 and ⁇ 100% of the structuring and dimensionally stable material.
  • the popcorn has a particle size distribution in which ⁇ 50% and ⁇ 90% of the popcorn have a particle size of ⁇ 2 mm and ⁇ 10 mm.
  • Popcorn larger grain size is often worse process wood and / or composites
  • popcorn smaller grain size tends in many applications within the present inventions to absorb the added in the manufacture of the wood and / or composite binder or the glue, which is the quality of Wood and / or composite material may deteriorate.
  • the popcorn has a particle size distribution in which ⁇ 70% and ⁇ 90% of the popcorn have a particle size of ⁇ 2 mm and ⁇ 10 mm.
  • the popcorn has a particle size distribution in which ⁇ 50% and ⁇ 90%, more preferably ⁇ 70% and ⁇ 90% of the popcorn have a particle size of ⁇ 4 mm and ⁇ 10 mm.
  • the popcorn has a particle size distribution in which ⁇ 50% and ⁇ 80% of the popcorn have a particle size of ⁇ 3 mm and ⁇ 8 mm.
  • the popcorn has an average particle size distribution of ⁇ 3 mm and ⁇ 6 mm. This has been found to be beneficial for many applications within the present invention.
  • the popcorn has an average particle size distribution of ⁇ 3.5 mm and ⁇ 5 mm.
  • the fat content of the popcorn before processing is ⁇ 10 (wt)%.
  • the present invention also relates to a particle and / or fiber board with a bulk density of ⁇ 550 kg / m 3, more preferably ⁇ 500 kg / m 3, and most preferably ⁇ 450 kg / m 3 , and a transverse tensile strength per bulk density * 1000 of ⁇ 0.75 m 3 N / mm 2 kg, preferably ⁇ 0.8 m 3 N / mm 2 kg, and most preferably ⁇ 0.85 m 3 N / mm 2 kg.
  • step a) is carried out by microwave treatment, preferably at ⁇ 1500 W and ⁇ 3000 W, the treatment preferably being between ⁇ 1 min and ⁇ 5 min.
  • a binder and optionally a curing accelerator is added at step c).
  • binders known in the art such as urea-formaldehyde resin, melamine-formaldehyde resin, melamine-reinforced urea-formaldehyde resin, tannin-formaldehyde resin, phenol-formaldehyde resin and polymeric diphenylmethane diisocyanates can be used.
  • Curing accelerators which may be used are all substances known in the field, in particular ammonium sulfate and / or potash.
  • Example 1 Production of UF resin bonded, three-layer chipboard with low density and with 50% popcorn granules in the middle layer
  • the glue liquor of the middle layer consisted of 8.5% UF solid resin based on dry chip, 1% ammonium sulfate solution (hardener) based on dry solid resin and 1% hydrophobing agent based on dry chip.
  • the glue liquor of the topcoat consisted of 10% UF solid resin, based on dry chip, 0.5% ammonium sulfate solution based on solid, solid resin and 1% water repellent based on dry chip.
  • the chip cake was pressed at 195 ° C for 12 s / mm and a pressure of 220 bar.
  • the transverse tensile strengths of the chipboard with popcorn granules in the middle layer and a bulk density of 550 kg / m 3 are 0.45 N / mm 2 both above the references and above the standard prescribed by EN 312-4.
  • the swelling values of the popcorn chipboard are also below the respective values of the reference plates and below the standard of 15% after 24 h of water storage with 8.3% (see Table 1).
  • Example 2 Production of UF resin-bound, three-layer chipboard with low bulk density and with 50% pop-com pellets in the middle and top layer
  • the glue liquor of the middle layer consisted of 8.5% of solid resin, based on dry chip, 1% of ammonium sulfate solution, based on dry solid resin and 1% of water repellent based on dry chip.
  • the size liquor of the cover layer consisted of 10% of solid resin, based on dry chip, 0.5% of ammonium sulfate solution based on solid, solid resin and 1% of water repellent based on dry chip.
  • the chip cake was pressed at 195 ° C. for 12 s / mm and a pressure of 220 bar (see Table 1).
  • Example 3 Production of UF resin bonded, three-layer chipboards with low density of pure industrial chips as a reference
  • Table 1 Mechanical-technological properties of the three-layer UF resin bonded chipboard with popcorn admixture in the middle layer (Ex 1), in middle and top layer (Ex 2) and pure industrial chips as reference (Ex 3) description density transverse tensile strength Swelling 2 h Swelling 24 h [kg / m 3 ] [N / mm 2 ] [%] [%] example 1 550 0.45 1.72 8.34 example 1 450 0.35 1.40 7.40 Example 2 550 0.48 1.68 8.12 Example 2 450 0.36 1.50 7.54 Example 3 (reference) 550 0.30 8.89 16.28 Example 3 (reference) 450 0.26 7.82 15.66
  • Example 4 Production of PF resin-bonded, three-layer chipboard with low bulk density and with 50% popcorn granules in the middle layer
  • a 50% aqueous potash solution was used as a curing accelerator.
  • the glue liquor of the middle layer consisted of 8.5% PF solid resin based on dry chip, 2% potash solution (hardener) based on dry solid resin and 1% hydrophobing agent based on dry chip.
  • the glue liquor of the cover layer consisted of 10% PF solid resin based on dry chip, 1% potash solution (hardener) based on dry solid resin and 1% hydrophobing agent based on dry chip.
  • the chip cake was pressed at 210 ° C. for 12 s / mm and a pressure of 220 bar (see Table 2).
  • Example 5 Production of PF resin-bonded, three-layer chipboards with low bulk density and with 50% popcorn granules in the middle and top layer
  • a 50% aqueous potash solution was used as a curing accelerator.
  • Water repellant was a paraffin-based emulsion of the brand "HYDROWAX 138 ® " SASOL GmbH with a solids content of about 50% is used.
  • the glue liquor of the middle layer consisted of 8.5% of solid resin, based on dry chip, 2% of potash solution, based on dry solid resin and 1% of water repellent based on dry chip.
  • the glue liquor of the cover layer consisted of 10% of solid resin, based on dry chip, 1% potash solution based on dry solid resin and 1% of water repellent based on dry chip.
  • the chip cake was pressed at 210 ° C for 12 s / mm and a pressure of 220 bar (Table 2).
  • Example 6 Production of PF resin-bonded, three-layer chipboard of low bulk density from pure industrial chips as a reference
  • Example 5 550 0.58 1.60 9.21
  • Example 7 Production of PMDI-bound, three-layer chipboard with low bulk density and with 50% popcorn granules in the middle layer
  • Example 8 Production of PMDI-bound, three-layer chipboard with low density and with 50% popcorn granules in the middle and top layer
  • Spangut and popcorn granules and polymer diphenylmethane diisocyanate as a binder were 20 mm thick three-layer chipboard produced with a bulk density of 450 kg / m 3 and 550 kg / m 3 .
  • the middle layer and top layer shavings were mixed with 50% popcorn granules.
  • the binder used was the polymer diphenylmethane diisocyanate "Desmodur1520 A20" from BAYER AG. Aggregates and water repellents were completely dispensed with.
  • Top and middle layer chipboard were glued with 3% of dry chip PMDI. The chip cake was then pressed at 210 ° C for 12 s / mm and a pressure of 220 bar.
  • Example 9 Production of PMDI bonded, three-layer chipboard with low bulk density from pure industrial chips as a reference
  • Example 5 As a reference to Example 5, 20 mm thick three-layer chipboard having a bulk density of 450 kg / m 3 and 550 kg / m 3 and the PMDI "Desmodur1520 A20" as a binder were prepared from pure industrial manufactured Spangut. All other production parameters are completely identical to Examples 7 and 8. The values of the mechanical and technological properties of Examples 7, 8 and 9 are shown in Table 3.
  • Table 3 Mechanical-technological properties of the three-layer, PMDI-bonded chipboard with popcorn admixture in the middle layer (Ex 7) in the middle and top layer (Ex 8) and pure industrial shavings as reference (Ex 9) description density transverse tensile strength Swelling 2 h Swelling 24 h [kg / m 3 ] [N / mm 2 ] [%] [%]
  • Example 10 Production of UF resin-bound, three-layer composites with low bulk density from 100% popcorn granules in the middle and top layer
  • the glue liquor of the middle layer consisted of 8.5% UF solid resin based on dry popcorn granules, 1% ammonium sulfate solution (hardener) based on solid solid resin and 1% hydrophobing agent based on dry popcorn granules.
  • the glue liquor of the cover layer consisted of 10% UF solid resin based on dry popcorn granules, 0.5% ammonium sulfate solution based on solid, solid resin and 1% hydrophobizing agent based on dry popcorn granules.
  • the popcorn granules cake was pressed at 195 ° C for 12 s / mm and a pressure of 220 bar.
  • Example 10 the perforator value, ie the release of formaldehyde, was additionally measured (methodology see below). As can be clearly seen, is in the Compounds of this invention significantly lower perforator value, ie less formaldehyde is released because it is bound by the popcorn.
  • Table 4 Mechanical-technological properties of the three-layer, composite materials of popcorn granules bound with UF resin (Example 10) and the corresponding reference example (Example 3) made of wood chips description
  • Bulk density [kg / m 3 ]
  • Transverse tensile strength [N / mm 2 ]
  • Swelling 2 h [%]
  • Swelling 24 h [%]
  • Perforator value [mg / 100g]
  • Example 11 Production of phenol-resin (PF) bonded three-layer composites with low bulk density from 100% popcorn granules in the middle and top layer
  • the glue liquor of the middle layer consisted of 8.5% PF solid resin based on dry popcorn granules, 2% potash solution (hardener) based on dry solid resin and 1% hydrophobing agent based on dry popcorn granules.
  • the glue liquor of the cover layer consisted of 10% PF solid resin, based on atro popcorn granules, 1% potash solution (hardener) based on solid solid resin and 1% hydrophobing agent based on dry popcorn granules.
  • the popcorn granules cake was pressed at 210 ° C for 12 s / mm and a pressure of 220 bar.
  • the transverse tensile strengths of the composite materials of pure popcorn granules and a bulk density of 550 kg / m 3 are 0.47 N / mm 2 to 0.64 N / mm 2, both above the references and above the standard prescribed by EN 312-4.
  • the swelling values of the Popcom composites after 24 h of water storage at approx. 6% are also below the respective values of the reference plates and well below the standard of 15%.
  • Example 12 Production of PMDI bonded, three-layer composites with low bulk density from 100% popcorn granules in the middle and top layer
  • the WKI bottles were opened and the test specimens removed. Thereafter, the bottles were closed again. To achieve complete absorption of formaldehyde in the water, the WKI bottles cooled for one hour. Subsequently, the photometric determination of the amount of formaldehyde released took place on the absorption solution.
  • the perforator method (DIN EN 120) is a test standard for the determination of unbound formaldehyde in uncoated and / or unpainted wood-based materials.
  • DIN EN 120 is a test standard for the determination of unbound formaldehyde in uncoated and / or unpainted wood-based materials.
  • the perforator method (DIN EN 120) is a test standard for the determination of unbound formaldehyde in uncoated and / or unpainted wood-based materials.
  • DIN EN 120 is a test standard for the determination of unbound formaldehyde in uncoated and / or unpainted wood-based materials.
  • the round bottom flask is connected to the perforator and then 1000 ml of distilled water are introduced into the perforator insert.
  • the radiator and gas absorption device and the original piston of the gas absorption device are connected.
  • the original flask is filled with approx.
  • the determination of the release of formaldehyde was carried out in accordance with the specifications of EN 717-3. 10 ml of the absorption solution was pipetted into a bottle and mixed with 10 ml of a 0.04 M acetylacetone solution and 10 ml of a 20% ammonium acetate solution. Subsequently, the samples were incubated at 40 ° C for 15 minutes in a shaking water bath. After one hour of cooling to room temperature with dark storage of the samples were photometrically measured at 412 nm against deionized water and the formaldehyde release of the samples as a levy in mg of formaldehyde based on kg dry matter of the sample for the WKI bottle value calculated. The perforator value is given in mg of formaldehyde, based on 100 g dry matter of the sample.
  • Table 7 contains the results of the formaldehyde release of popcorn composites as determined by the bottle and perforator methods.
  • the bottle value in mg HCHO / 1000 g and the perforator value in mg HCHO / 100 g are roughly comparable with conventional wood-based materials.
  • the trend between the two values is the same for all the examples listed.
  • the perforator value for all samples is slightly below the WKI bottle value.

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  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Wood Science & Technology (AREA)
  • Forests & Forestry (AREA)
  • Dry Formation Of Fiberboard And The Like (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
EP20110191160 2006-10-04 2007-10-02 Utilisation de popcorn dans des matières premières dérivées du bois et composites Ceased EP2439031A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE200610047279 DE102006047279A1 (de) 2006-10-04 2006-10-04 Verwendung von Popcorn für Holz- und Verbundwerkstoffe
EP07820865.9A EP2081743B1 (fr) 2006-10-04 2007-10-02 Panneaux de particules et/ou de fibres contenant du pop-corn et procédé de fabrication

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WOPCT/EP2007/060485 Previously-Filed-Application 2007-10-02
EP07820865.9 Division 2007-10-02

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EP2439031A1 true EP2439031A1 (fr) 2012-04-11

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EP20110191160 Ceased EP2439031A1 (fr) 2006-10-04 2007-10-02 Utilisation de popcorn dans des matières premières dérivées du bois et composites
EP07820865.9A Active EP2081743B1 (fr) 2006-10-04 2007-10-02 Panneaux de particules et/ou de fibres contenant du pop-corn et procédé de fabrication

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US (2) US8168303B2 (fr)
EP (2) EP2439031A1 (fr)
AR (1) AR063116A1 (fr)
CA (1) CA2666052C (fr)
CL (1) CL2007002870A1 (fr)
DE (1) DE102006047279A1 (fr)
EA (1) EA013664B1 (fr)
ES (1) ES2446093T3 (fr)
NO (1) NO20091732L (fr)
PL (1) PL2081743T3 (fr)
PT (1) PT2081743E (fr)
SI (1) SI2081743T1 (fr)
WO (1) WO2008040747A2 (fr)

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Publication number Priority date Publication date Assignee Title
DE102006047279A1 (de) * 2006-10-04 2008-04-10 Georg-August-Universität Göttingen Stiftung Öffentlichen Rechts Verwendung von Popcorn für Holz- und Verbundwerkstoffe
DE102013101937A1 (de) 2013-02-27 2014-08-28 Georg-August-Universität Göttingen Stiftung Öffentlichen Rechts Holz- und Verbundwerkstoffplatte
US10128646B1 (en) 2017-03-14 2018-11-13 Arlington Industries, Inc. Two-gang TV bridge kit with pre-molded electrical cord for minimizing wiring terminations
DE102018132738A1 (de) * 2018-12-18 2020-06-18 Georg-August-Universität Göttingen Stiftung Öffentlichen Rechts Einsatz von expandiertem und hydrophobem Popcorn zur Herstellung von dreidimensionalen Formteilen
DE102020105205A1 (de) 2020-02-27 2021-09-02 Georg-August-Universität Göttingen Stiftung Öffentlichen Rechts Einsatz von elektromagnetischer Strahlung bei der Herstellung von popcornhaltigen Formteilen

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EP1318000A2 (fr) * 2001-12-05 2003-06-11 IHD Institut für Holztechnologie Dresden gGmbH Liant pour la fabrication des matériaux à base de bois ou le collage de bois et de matériaux à base de bois

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EA200900468A1 (ru) 2009-12-30
NO20091732L (no) 2009-07-03
CA2666052C (fr) 2012-04-17
CA2666052A1 (fr) 2008-04-10
US8568895B2 (en) 2013-10-29
CL2007002870A1 (es) 2008-01-18
PL2081743T3 (pl) 2014-11-28
ES2446093T3 (es) 2014-03-06
WO2008040747A2 (fr) 2008-04-10
EP2081743A2 (fr) 2009-07-29
WO2008040747A3 (fr) 2008-06-12
US20100112339A1 (en) 2010-05-06
DE102006047279A1 (de) 2008-04-10
US8168303B2 (en) 2012-05-01
US20120196120A1 (en) 2012-08-02
EP2081743B1 (fr) 2013-12-11
AR063116A1 (es) 2008-12-30
SI2081743T1 (sl) 2014-03-31
PT2081743E (pt) 2014-02-17
EA013664B1 (ru) 2010-06-30

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