EP2415887A1 - Cu-co-si-kupferlegierung für die elektronik und herstellungsverfahren dafür - Google Patents

Cu-co-si-kupferlegierung für die elektronik und herstellungsverfahren dafür Download PDF

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EP2415887A1
EP2415887A1 EP10758330A EP10758330A EP2415887A1 EP 2415887 A1 EP2415887 A1 EP 2415887A1 EP 10758330 A EP10758330 A EP 10758330A EP 10758330 A EP10758330 A EP 10758330A EP 2415887 A1 EP2415887 A1 EP 2415887A1
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mass
grain size
copper alloy
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EP2415887B1 (de
EP2415887A4 (de
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Takuma Onda
Hiroshi Kuwagaki
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JX Nippon Mining and Metals Corp
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JX Nippon Mining and Metals Corp
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    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/02—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working in inert or controlled atmosphere or vacuum
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper

Definitions

  • the present invention relates to precipitation hardening copper alloys, in particular, to Cu-Co-Si system alloys suitable for use in a variety of electronic components.
  • a copper alloy for electronic materials that are used in a connector, switch, relay, pin, terminal, lead frame, and various other electronic components is required to satisfy both high strength and high electrical conductivity (or thermal conductivity) as basic characteristics.
  • high integration and reduction in size and thickness of an electronic component have been rapidly advancing, requirements for copper alloys used in these electronic components have been increasingly becoming severe.
  • precipitation-hardened copper alloys Because of considerations related to high strength and high electrical conductivity, the amount in which precipitation-hardened copper alloys are used has been increasing, replacing conventional solid-solution strengthened copper alloys typified by phosphor bronze and brass as copper alloys for electronic components. With a precipitation-hardened copper alloy, the aging of a solution-treated supersaturated solid solution causes fine precipitates to be uniformly dispersed and the strength of the alloys to increase. At the same time, the amount of solved elements in the copper is reduced and electrical conductivity is improved. For this reason, it is possible to obtain materials having excellent strength, spring property, and other mechanical characteristics, as well as high electrical and thermal conductivity.
  • Cu-Ni-Si system alloys commonly referred to as Corson alloys are typical copper alloys having relatively high electrical conductivity, strength, and bending workability, and are among the alloys that are currently being actively developed in the industry.
  • Corson alloys fine particles of Ni-Si intermetallic compounds are precipitated in the copper matrix, thereby increasing strength and electrical conductivity.
  • Patent document 1 discloses that Co is similar to Ni in forming a compound with Si and increasing mechanical strength, and when Cu-Co-Si system alloys are aged, they have better mechanical strength and electrical conductivity than Cu-Ni-Si system alloys, and where acceptable in cost, Cu-Co-Si system alloys may be also selected.
  • the document also discloses that the optimum additive amount of Co is 0.05 to 2.0 wt%.
  • Patent document 2 discloses that cobalt content should be 0.5 to 2.5 wt% because the precipitation of the cobalt-containing silicide as second-phase is insufficient when the cobalt content is less than 0.5 wt%, and excessive second-phase particles precipitate, formability is reduced, and the copper alloy is endowed with undesirable ferromagnetic properties when the cobalt content exceeds 2.5 wt%.
  • the document discloses that the cobalt content is preferably about 0.5 wt% to about 1.5 wt%, and the cobalt content is about 0.7 wt% to about 1.2 wt% in the most preferable embodiment.
  • Copper alloys disclosed in Patent document 3 have been developed with the aim of applications mainly for an end terminal of vehicle installation, communication instrument, and the like, or connector materials.
  • the copper alloys are Cu-Co-Si system alloys in which cobalt concentration is 0.5 to 2.5 wt% and high electrical conductivity and moderate strength are achieved.
  • the cobalt concentration is preferably 0.5 to 2.0 wt%.
  • Copper alloys disclosed in Patent document 4 have been developed with the aim of achieving high strength, high electrical conductivity and high bending workability and limit cobalt concentration to 0.1 to 3.0 wt%.
  • the document discloses that the cobalt concentration is limited within the above described range because it is undesirable that the alloys do not have the above described effects when the cobalt concentration is less than the range, and the crystallized phase is generated at casting and it leads to breaks at casting when the cobalt concentration exceeds the range.
  • the inventors have diligently studied means for decrease in variability of recrystallized grains, and eventually have found out that, in a manufacturing process for Cu-Co-Si system alloys that contain Co in high concentration, when the solution treatment is conducted in relatively-high temperature, the grain size does not increase so much because of pinning effect of the second-phase particles and the pinning effect works evenly in an entire copper base matrix, resulting in uniformalization of the size of growing recrystallized grains by precipitating fine second-phase particles in copper base matrix as equally spaced apart and uniformly as possible before the solution treatment step. As a result, Cu-Co-Si system alloys having small variability of mechanical characteristics can be provided.
  • the present invention that has been made based on these findings is a copper alloy for electronic materials, containing 0.5 to 4.0 mass% Co, 0.1 to 1.2 mass% Si, the balance being Cu and unavoidable impurities, wherein an average grain size is 15 to 30 ⁇ m and an average difference between maximum grain size and minimum grain size in every observation field of 0.5 mm 2 is not more than 10 ⁇ m.
  • the present invention is the copper alloy wherein Cr is furthermore contained in a maximum amount of 0.5 mass%.
  • the present invention is the copper alloy wherein a single element or two or more elements selected from Mg, Mn, Ag and P are furthermore contained in total in a maximum amount of 0.5 mass%.
  • the present invention is the copper alloy wherein one or two elements selected from Sn and Zn are furthermore contained in total in a maximum amount of 2.0 mass%.
  • the present invention is the copper alloy wherein a single element or two or more elements selected from As, Sb, Be, B,Ti, Zr, Al and Fe are furthermore contained in total in a maximum amount of 2.0 mass%.
  • the present invention is a method for manufacturing the copper alloy, comprising sequentially conducting:
  • the present invention is a copper alloy product using the copper alloy according to the present invention.
  • the present invention is an electronic component using the copper alloy according to the present invention.
  • the invention can provide Cu-Co-Si system alloys that have desirable mechanical and electrical characteristics as a copper alloy for electronic materials, and have uniform mechanical characteristics.
  • Co and Si form an intermetallic compound with appropriate heat-treatment, and make it possible to increase strength without adversely affecting electrical conductivity.
  • the additive amount of Co and Si are such that Co is less than 0.5 mass% and Si is less than 0.1 mass% respectively, the desired strength cannot be achieved, and conversely, when the additive amount of Co and Si are such that Co is more than 4.0 mass% and Si is more than 1.2 mass% respectively, higher strength can be achieved, but electrical conductivity is dramatically reduced and hot workability furthermore deteriorates. Therefore, the additive amounts of Co and Si are such that Co is 0.5 to 4.0 mass% and Si is 0.1 to 1.2 mass% in the present invention.
  • the high strength is more desired in Cu-Co-Si system alloys than in Cu-Ni-Si system alloys and in Cu-Ni-Si-Co system alloys. Therefore, the high concentration of Co is desired and the concentration of Co is preferably not less than 2.5 mass%, more preferably not less than 3.2 mass%. That is, the additive amounts of Co and Si are such that, preferably, Co is 2.5 to 4.0 mass% and Si is 0.5 to 1.0 mass%, and more preferably, Co is 3.2 to 4.0 mass% and Si is 0.65 to 1.0 mass%.
  • Cr preferentially precipitates along crystal grain boundaries in the cooling process at the time of casting. Therefore, the grain boundaries can be strengthened, cracking during hot rolling is less liable to occur, and a reduction in yield can be limited. That is, Cr that has precipitated along the grain boundaries during casting is solved again by solution treatment and the like, resulting in producing precipitated particles or compounds with Si, having a bcc structure mainly composed of Cr in the subsequent aging precipitation.
  • the portion of the added Si solved in the matrix which has not contributed to aging precipitation, suppresses an increase in electrical conductivity, but the Si content solved in the matrix can be reduced and electrical conductivity can be increased without compromising strength by adding Cr as a silicide-forming element and causing silicide to further precipitate.
  • Cr can be added in a maximum amount of 0.5 mass%.
  • the additive amount be 0.03 to 0.5 mass%, and more preferably 0.09 to 0.3 mass%.
  • the addition of traces of Mg, Mn, Ag and P can improve strength, stress relaxation characteristics, and other manufacturing characteristics without compromising electrical conductivity.
  • the effect of the addition is mainly produced by the formation of a solid solution in the matrix, but the effect can be further produced when the elements are contained in the second-phase particles.
  • the total concentration of Mg, Mn, Ag and P exceeds 0.5 masss%, the effect of improving the characteristics becomes saturated and manufacturability is compromised. Therefore, in the Cu-Co-Si system alloys according to the present invention, a single element or two or more elements selected from Mg, Mn, Ag and P can be added in total in a maximum amount of 0.5 mass%.
  • the additive amount be a total of 0.01 to 0.5 mass%, and more preferably a total of 0.04 to 0.2 mass%.
  • the addition of traces of Sn and Zn also improves the strength, stress relaxation characteristics, plating properties, and other product characteristics without compromising electrical conductivity.
  • the effect of the addition is mainly produced by the formation of a solid solution in the matrix.
  • the total amount of Sn and Zn exceeds 2.0 mass%, the characteristics improvement effect becomes saturated and manufacturability is compromised. Therefore, in the Cu-Co-Si system alloys according to the present invention, one or two elements selected from Sn and Zn can be added in total in a maximum amount of 2.0 mass%.
  • the additive amount be a total of 0.05 to 2.0 mass%, and more preferably a total of 0.5 to 1.0 mass%.
  • a single element or one or greater elements selected from As, Sb, Be, B,Ti, Zr, Al and Fe can be added in total in a maximum amount of 2.0 mass%.
  • the additive amount be a total of 0.001 to 2.0 mass%, and more preferably a total of 0.05 to 1.0 mass%.
  • the additive amount of the Mg, Mn, Ag, P, Sn, Zn, As, Sb, Be, B,Ti, Zr, Al and Fe described above exceeds 3.0 mass% as a total. Therefore, it is preferred that the total be not more than 2.0 mass%, and more preferably not more than 1.5 mass%
  • the Hall-Petch rule in which a crystal grain has an influence on the strength and the strength is proportional to (the grain size) -1/2 is generally effected. Further, a coarse crystal grain deteriorates bending workability and it triggers rough surface at bending work. Accordingly, a refinement of the crystal grain is generally desirable for an improvement of strength of copper alloys.
  • the crystal grain is preferably not more than 30 ⁇ m, and more preferably not more than 23 ⁇ m.
  • Cu-Co-Si system alloys according to the present invention are precipitation-hardened copper alloys, and then it is also necessary to note precipitation state of second-phase particles.
  • the second-phase particles precipitated in the crystal grain at aging treatment endow improvement of strength of copper alloys.
  • the second-phase particles precipitated in the crystal grain boundary hardly endow improvement of strength of copper alloys. Therefore, in order to improve strength of copper alloys, it is desirable to precipitate the second-phase particles in the crystal grain.
  • the grain size decreases, the crystal grain boundary area increases. Accordingly, the second-phase particles become easy to be precipitated preferentially in the crystal grain boundary at aging treatment.
  • the crystal grain has a certain level of size.
  • the grain size is preferably not less than 15 ⁇ m, and more preferably not less than 18 ⁇ m.
  • the average grain size is controlled wihtin the range of 15 to 30 ⁇ m.
  • the average grain size is preferably 18 to 23 ⁇ m.
  • the grain size indicates a diameter of a minimum circle surrounding individual crystal grain, being provided by a microscope observation of a cross-section surface in the thickness direction parallel to the rolling direction.
  • the average grain size indicates an average amount of those grain sizes.
  • an average difference between maximum grain size and minimum grain size in every observation field of 0.5 mm 2 is not more than 10 ⁇ m, and preferably not more than 7 ⁇ m. Though the average difference is ideally 0 ⁇ m, it is realistically difficult to be achieved. Therefore, a lower limit of the average difference is 3 ⁇ m from an actual minimum value, and typically 3 to 7 ⁇ m is optimum.
  • the maximum grain size indicates a maximum grain size observed in an observation field of 0.5 mm 2 .
  • the minimum grain size indicates a minimum grain size observed in the same observation field. In the present invention, differences between maximum grain size and minimum grain size are measured in plural observation fields, and an average value of the differences indicates the average difference between maximum grain size and minimum grain size.
  • the crystal grain size is uniform when the difference between maximum grain size and minimum grain size is small, and then variability of mechanical characteristics at every measuring point in the same materials is reduced. As a result, quality stability of copper alloy products or electronic components produced by using copper alloys of the present invention is improved.
  • an aging treatment material is heated for not less than 1 hour in a temperature range of about 350 to about 550 °C, and second-phase particles formed into a solid solution in the solution treatment are precipitated as microparticles on a nanometer order.
  • the aging treatment results in increased strength and electrical conductivity.
  • Cold rolling is sometimes performed before and/or after the aging treatment in order to obtain higher strength.
  • stress relief annealing (low-temperature annealing) is sometimes performed after cold rolling in the case that cold rolling is conducted after aging.
  • Grinding, polishing, shot blast pickling and the like may be conducted as needed in order to remove oxidized scale on the surface between each of the above-described steps.
  • the manufacturing process described above is also used basically in the copper alloys according to the present invention, and it is important to precipitate fine second-phase particles in copper base matrix as equally spaced and uniformly as possible before the solution treatment step as described above in order to control the average grain size and the variability of grain size within the range as defined in the present invention.
  • it is necessary to produce them with particular attention to the following points.
  • the crystallites must form a solid solution in the matrix in the steps that follow.
  • the material is held for not less than 1 hour at 950 °C to 1050 °C and then subjected to hot rolling, and when the temperature at the end of hot rolling is set to not less than 850 °C, a solid solution can be formed in the matrix even when Co, and Cr as well, are added.
  • the temperature condition of not less than 950 °C is a higher temperature setting than in the case of other Corson alloys. When the holding temperature before hot rolling is less than 950 °C, solid solution is not sufficient.
  • the material may melt.
  • the temperature at the end of hot rolling is less than 850 °C, it is difficult to obtain high strength because the elements, which have formed a solid solution, will precipitate again. Therefore, it is preferred that hot rolling be ended at 850 °C and the material be rapidly cooled in order to obtain high strength.
  • the cooling is conducted at the average cooling rate of not less than 15 °C/s, preferably not less than 20 °C/s when the material temperature is reduced from 850 °C to 400 °C.
  • the average cooling rate when the material temperature is reduced from 850 °C to 400 °C indicates a value (°C/s) being calculated by a formula of "(850-400) (°C)/cooling time (s)", wherein the cooling time is measured as time when the material temperature is reduced from 850 °C to 400 °C.
  • Water cooling is the most effective method for increasing the cooling rate.
  • the cooling rate can be increased by managing the water temperature because the cooling rate varies due to the temperature of the water to be used for water-cooling.
  • the water temperature is preferably kept at not more than 25 °C because the desired cooling rate sometimes cannot be achieved when the water temperature is not less than 25 °C.
  • a spray shown or mist
  • cold water be constantly allowed to flow into the water tank to prevent the water temperature from increasing, so that the material is cooled at a constant water temperature (not more than 25 °C).
  • the cooling rate can be increased by providing additional water-cooling nozzles or increasing the flow rate of water per unit of time.
  • the cold rolling is conducted after the hot rolling.
  • the cold rolling is conducted with the aim of increasing strains which will be precipitation sites in order to generate precipitates uniformly.
  • the cold rolling is preferably conducted at reduction rate of not less than 70 %, and more preferably not less than 85 %. When the cold rolling is not conducted and the solution treatment is conducted just after the hot rolling, precipitates cannot be generated uniformly. A combination of the hot rolling and the subsequent cold rolling may be repeated accordingly.
  • the first aging treatment is conducted after the cold rolling. If the secondary-phase particles remain before conducting the step, such secondary-phase particles grow further when the step is conducted, and then the sizes of the secondary-phase particles is different from those of secondary-phase particles which are generated first in the step. However, in the present invention, fine secondary-phase particles can be precipitated in uniform size and uniformly because remaining secondary-phase particles are discreated in the former step.
  • the aging temperature of the first aging treatment When the aging temperature of the first aging treatment is too low, however, precipitation amount of the secondary-phase particles providing pinning effect decreases and pinning effect generated in the solution treatment can be provided partially. Accordingly, the sizes of the crystal grains vary. On the other hand, when the aging temperature is too high, the secondary-phase particles become coarse and precipitate ununiformly, and then the sizes of the crystal grains vary. Further, the longer the aging time is, the larger the secondary-phase particles grow, and then it is necessary to set the aging time appropriately.
  • the first aging treatment is conducted at 350 to 500 °C for 1 to 24 hours, preferably at not less than 350 °C to less than 400 °C for 12 to 24 hours, at not less than 400 °C to less than 450 °C for 6 to 12 hours, and at not less than 450 °C to less than 500 °C for 3 to 6 hours, and then fine secondary-phase particles can be precipitated uniformly in the matrix.
  • the growth of recrystallized grains generated in the solution treatment of the next step can be pinned uniformly, and then refined grain compositions having little variability of grain size can be provided.
  • the solution treatment is conducted after the first aging treatment.
  • fine and uniform recrystallized grains are grown with a solid solution of the second-phase particles. Accordingly, it is necessary that the temperature of the solution treatment is 950 to 1050 °C.
  • the recrystallized grains grow first and then the second-phase particles precipitated in the first aging treatment form solid solution. Accordingly, the growth of the recrystallized grains can be controlled by the pinning effect. However, the pinning effect disappears after the second-phase particles form the solid solution, and then the recrystallized grains grow when the solution treatment is conducted for a long time.
  • an appropriate solution treatment time is 60 to 300 seconds at not less than 950 °C to less than 1000 °C, preferably 120 to 180 seconds, and 30 to 180 seconds at not less than 1000 °C to less than 1050 °C, preferably 60 to 120 seconds.
  • the average cooling rate in the material temperature being reduced from 850 °C to 400 °C should be not less than 15 °C/s, preferably not less than 20 °C/s in order not to precipitate the second-phase particles.
  • the second aging treatment is conducted after the solution treatment.
  • Conditions of the second aging treatment may be such that are generally used because of their availability for refinement of the precipitates. However, it is necessary to note that the temperature and time should be set so that the precipitates may not coarsen.
  • the aging conditions are, for example, the temperature is in the range of 350 to 550 °C and the time is 1 to 24 hours, more preferably the temperature is in the range of 400 to 500 °C and the time is 1 to 24 hours.
  • the cooling rate after the aging treatment has little influences on small or large for sizes of the precipitates.
  • precipitation sites may be increased and age hardening may be advanced by using the precipitation sites in order to improve strength.
  • work hardening may be advanced by using the precipitates in order to improve strength.
  • the cold rolling may be conducted before and/or after the second aging treatment.
  • the Cu-Co-Si system alloys according to the present invention can be used to produce various wrought copper alloy products, for example, plates, strips, tubes, rods, and wires. Further, the Cu-Co-Si system alloys according to the present invention can be used in lead frames, connectors, pins, terminals, relays, switches, foil material for secondary batteries, and other electronic components and the like.
  • Copper alloys having the compositions shown in Table 1 (working examples) and Table 2 (comparative examples) were melted in a high-frequency melting furnace at 1300 °C and then cast in a mold to produce ingots having a thickness of 30 mm.
  • the ingots were heated to 1000 °C, hot rolled thereafter to a plate thickness of 10 mm at finishing temperature (the temperature at the completion of hot rolling) of 900 °C, water-cooled to 850 °C to 400 °C at average cooling rate of 18 °C/s after the completion of hot rolling, and then cooled by being left in the atmosphere.
  • First aging treatment was subsequently conducted at various aging temperatures for 3 to 12 hours (this aging treatment was not conducted on some of comparative examples), and then solution treatment was conducted at various temperatures for 120 seconds, and immediately water-cooled to 850 °C to 400 °C at average cooling rate of 18 °C/s, and then cooled by being left in the atmosphere.
  • the sheets were then cold rolled to 0.10 mm, subjected to second age treatment in an inert atmosphere at 450 °C for 3 hours, and lastly cold rolled to 0.08 mm to produce test pieces.
  • Resin filling was conducted to the test pieces in such a manner that their observation surfaces were cross-section surfaces in the thickness direction parallel to the rolling direction, and mirror finish was conducted on the observation surfaces by mechanical polish.
  • solution was prepared by blending hydrochloric acid and water by a ratio of 10 volume parts of hydrochloric acid of 36 % to 100 volume parts of water, and then ferric chloride having weight of 5% of the solution weight was dissolved to the solution.
  • the test pieces were immersed in the prepared solution for 10 seconds, and then metal structures appeared.
  • the metal structures were magnified 100 times by an optical microscope, pictures of their observation fields of 0.5 mm 2 were taken, each diameter of minimum circle surrounding individual crystal grain was measured, and then mean value was calculated on every observation field.
  • the average grain size is mean value of the grain sizes in 15 observation fields.
  • Electrical conductivity (EC:% IACS) was determined by measuring volume resistivity with the aid of double bridge. Variability of electrical conductivity according to measurement spots corresponds to a difference between maximum electrical conductivity and minimum electrical conductivity of 30 points. The average electrical conductivity is mean value of electrical conductivities in these 30 points.
  • Bending workability was measured by a surface roughness of bending part.
  • W bending test was conducted to Bad Way (BW: a direction where the bending axis is parallel to the rolling direction) with reference to JIS-H3130. Then the surface of the bending part was analyzed by a confocal laser scanning microscope and Ra ( ⁇ m) regulated in JIS-B0601 was calculated. Variability of roughness of bending according to measurement spots corresponds to a difference between maximum Ra and minimum Ra of 30 points. The average roughness of bending is mean value of Ra in these 30 points. (Table 1-1) No.
  • composition(mass%) aging temperature (°C) solution treatment temperature (°C) Average grain size ( ⁇ m) max grain size - min grain size ( ⁇ m) average strength (MPa) average electrical conductivity (%IACS) average stress relaxation performance (%) average roughness of bending ( ⁇ m) variability of strength (MPa) variability of stress relaxation performance (%) variability of roughness of bending ( ⁇ m) Co Si Cr others 51 3.0 0.71 0 0.1Mg 300 1020 20 21 882 51 83 3.14 63 5.1 2.04 52 3.0 0.71 0 01Mg 300 1050 31 35 868 49 82 2.97 59 49 1.50 53 3.0 0.71 0.2 0 300 1020 19 15 839 51 83 2.95 57 5.3 1.11 54 3.0 0.71 0.2 0 300 1050 29 22 845 51 82 2.92 55 4.4 1.83 55 4.7 1.12 0 0 450 1020 14 11 780 38 81 2.31 46 5.5 1.41 56 4.7 1.12 0.2 0 450 1020 15 9 795 40 85 2.
  • Alloys of No.1 to 6 are working examples according to the present invention wherein concentrations of Co are relatively low (0.7 and 0.2 mass%). Those average strengths are low because of low concentrations of Co and variabilities of all kinds of characteristics are small.
  • Alloys of No.7 to 36 are working examples according to the present invention wherein concentrations of Co are high (not less than 3.0 mass%). All of them have appropriate strength and electrical conductivity for electronic materials and variabilities of all kinds of characteristics are small.

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EP10758330.4A 2009-03-31 2010-02-17 Cu-co-si-kupferlegierung für die elektronik und herstellungsverfahren dafür Active EP2415887B1 (de)

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JP2009088287A JP4708485B2 (ja) 2009-03-31 2009-03-31 電子材料用Ｃｕ−Ｃｏ−Ｓｉ系銅合金及びその製造方法
PCT/JP2010/052375 WO2010113553A1 (ja) 2009-03-31 2010-02-17 電子材料用Ｃｕ－Ｃｏ－Ｓｉ系銅合金及びその製造方法

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JP4677505B1 (ja) 2010-03-31 2011-04-27 Ｊｘ日鉱日石金属株式会社 電子材料用Ｃｕ−Ｎｉ−Ｓｉ−Ｃｏ系銅合金及びその製造方法
JP4830035B2 (ja) 2010-04-14 2011-12-07 Ｊｘ日鉱日石金属株式会社 電子材料用Ｃｕ−Ｓｉ−Ｃｏ系合金及びその製造方法
JP5325178B2 (ja) * 2010-08-12 2013-10-23 Ｊｘ日鉱日石金属株式会社 強度、導電率及び曲げ加工性に優れたＣｕ−Ｃｏ−Ｓｉ系銅合金及びその製造方法
JP5508326B2 (ja) * 2011-03-24 2014-05-28 Ｊｘ日鉱日石金属株式会社 Ｃｏ−Ｓｉ系銅合金板
JP5451674B2 (ja) 2011-03-28 2014-03-26 Ｊｘ日鉱日石金属株式会社 電子材料用Ｃｕ−Ｓｉ−Ｃｏ系銅合金及びその製造方法
JP4799701B1 (ja) 2011-03-29 2011-10-26 Ｊｘ日鉱日石金属株式会社 電子材料用Ｃｕ−Ｃｏ−Ｓｉ系銅合金条及びその製造方法
CN102644005A (zh) * 2011-06-15 2012-08-22 上海飞驰铜铝材有限公司 一种用于电机制造的铜材及其制造方法
JP5437520B1 (ja) * 2013-07-31 2014-03-12 Ｊｘ日鉱日石金属株式会社 Ｃｕ−Ｃｏ−Ｓｉ系銅合金条及びその製造方法
JP6385383B2 (ja) * 2016-03-31 2018-09-05 Ｊｘ金属株式会社 銅合金板材および銅合金板材の製造方法
JP6306632B2 (ja) * 2016-03-31 2018-04-04 Ｊｘ金属株式会社 電子材料用銅合金
EP3886819A1 (de) 2018-11-30 2021-10-06 Amerilab Technologies, Inc. Schnell zerfallende brausetabletten und verfahren zur herstellung davon
KR102005332B1 (ko) * 2019-04-09 2019-10-01 주식회사 풍산 굽힘가공성이 우수한 Cu-Co-Si-Fe-P계 구리 합금 및 그 제조 방법
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US20120031533A1 (en) 2012-02-09
JP4708485B2 (ja) 2011-06-22
EP2415887B1 (de) 2016-02-10
CN102099499A (zh) 2011-06-15
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TWI422692B (zh) 2014-01-11
EP2415887A4 (de) 2013-06-05

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