EP2394495A2 - Optoelektronisches leuchtmodul - Google Patents

Optoelektronisches leuchtmodul

Info

Publication number
EP2394495A2
EP2394495A2 EP10710171A EP10710171A EP2394495A2 EP 2394495 A2 EP2394495 A2 EP 2394495A2 EP 10710171 A EP10710171 A EP 10710171A EP 10710171 A EP10710171 A EP 10710171A EP 2394495 A2 EP2394495 A2 EP 2394495A2
Authority
EP
European Patent Office
Prior art keywords
light
light module
connection carrier
optoelectronic
emitting diodes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP10710171A
Other languages
German (de)
English (en)
French (fr)
Inventor
Andreas Stahlkopf
Dirk Beiner
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Osram GmbH
Original Assignee
Traxon Technologies Europe GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Traxon Technologies Europe GmbH filed Critical Traxon Technologies Europe GmbH
Publication of EP2394495A2 publication Critical patent/EP2394495A2/de
Withdrawn legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
    • H01L27/153Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
    • H01L27/156Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/10Controlling the intensity of the light
    • H05B45/18Controlling the intensity of the light using temperature feedback
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/20Controlling the colour of the light
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/30Driver circuits
    • H05B45/32Pulse-control circuits
    • H05B45/325Pulse-width modulation [PWM]

Definitions

  • An optoelectronic light-emitting module is specified.
  • An object to be solved is to provide an opto-electronic lighting module that is compact and simple in construction.
  • the lighting module comprises a connection carrier.
  • the connection carrier is, for example, a printed circuit board.
  • the connection carrier may be formed with a base body of electrically insulating material.
  • the main body is then provided at the top and bottom with connection points and conductor tracks.
  • the underside of the main body is the side of the main body opposite the upper side of the main body.
  • the light module comprises a multiplicity of light-emitting diodes arranged in a matrix, wherein the light-emitting diodes are applied to an upper side of the connection carrier and adjacent light-emitting diodes are arranged at a distance of at least 20 mm and at most 50 mm from each other.
  • “Matrix-like" means in this
  • connection that the plurality of light emitting diodes preferably in the form of rows and columns or at grid points of a regular grid, for example a rectangular grid, on the top of the connection carrier are applied.
  • the LEDs are arranged in the form of 4 x 4 or 8 x 8 LEDs.
  • Distance in this context is the minimum distance between two side surfaces of two respectively adjacent light emitting diodes .
  • the distance between two side surfaces of two mutually adjoining light emitting diodes is then at least 20 mm and at most 50 mm, preferably at least 30 and at most 40 mm.
  • intermediate spaces are formed between the light-emitting diodes arranged in the manner of a matrix.
  • the light-emitting diodes are then arranged at a distance from one another.
  • a plan view of the light module are the
  • connection carrier limited.
  • the light-emitting diodes may be light-emitting diodes which emit radiation in the visible region of the spectrum of the electromagnetic radiation.
  • the optoelectronic lighting module comprises at least one constant current source for at least one light-emitting diode chip, at least one of the light-emitting diodes, wherein the at least one constant current source is arranged on an underside of the connection carrier.
  • the underside of the connection carrier is the surface of the connection carrier opposite the top side of the connection carrier.
  • the "constant current source” is a current source which, for example, has at least 40 mA, preferably at least 100 tnA, most preferably at least 250 mA, can provide current.
  • each light-emitting diode is formed with a plurality of light-emitting diode chips that emit light in different colors.
  • a constant current source arranged on the underside of the connection carrier energizes all the light-emitting diode chips of the same color of the lighting module.
  • Adjustability of the energization of each of the light-emitting diode chips so that, for example, each LED chip can shine in its maximum brightness.
  • the light module comprises a connection carrier and a plurality of light-emitting diodes arranged in a matrix, the light-emitting diodes being applied to an upper side of the connection carrier and adjacent light-emitting diodes being arranged at a distance of at least 20 mm and at most 50 mm from each other , Furthermore, the optoelectronic light-emitting module has at least one constant-current source for at least one light-emitting diode chip of at least one of the light-emitting diodes, wherein the at least one constant current source is arranged on an underside of the connection carrier.
  • the optoelectronic light-emitting module described here is based, inter alia, on the knowledge that until now a light-emitting device is missing, the optical one
  • the light module for example, for an external viewer - A -
  • each light-emitting diode has at least one light-emitting diode chip for each of the colors red, green and blue.
  • Each light-emitting diode preferably has three light-emitting diode chips, with one light-emitting diode chip each emitting one of the colors red, green, blue of the electromagnetic radiation in the spectral range.
  • a constant-current source is provided for energizing all the light-emitting diode chips of a color. For example, to sufficiently energize the LED chips each color requires a different current level. By energizing all the LED chips of a color through a common
  • Constant current source is thus a uniform energization of all LED chips of a color allows. It is conceivable, therefore, that the light module is formed, for example, with RGB light-emitting diodes and for energizing one color, the light module must then have only three constant current sources.
  • exactly one constant current source is arranged on the underside of the connection carrier for each color.
  • the light-emitting module preferably then comprises three constant-current sources for energizing the light-emitting diode chips of the three different colors.
  • a control device for addressing the lighting module is provided on the underside of the connection carrier. For controlling the light emitting diodes, the control device outputs, for example, a serial
  • the output signal may be identical to the input signal.
  • the output signal is the input signal shortened by the control signal. If the input signal has, for example, a length of 512 bytes, for example 3 bytes representing the control signal of an RGB LED to be energized (ie one byte for each color), then the output signal is reduced by this control signal and accordingly only has a length of 509 bytes on. If the input signal has a length of only 3 bytes, it is possible that no output signal is output.
  • the control signal which is included in the input signal, is preferably at the beginning or the end of a
  • the control device By means of the control signal, the light-emitting diodes or light-emitting diode chips can be controlled and operated unambiguously and, if appropriate, independently of one another.
  • the control device it is possible for the control device to drive only individual light-emitting diodes (also individual control) or a predefinable selection of a plurality of light-emitting diodes (group control).
  • the control device further enables switching between the single drive and the group drive.
  • luminous patterns are advantageous or luminous images also sequential lighting sequences realized.
  • control device further enables a series connection of a plurality of lighting modules, in which the
  • Control device the output signal, after any processing, passes on to the next module.
  • the light-emitting diode chips are characterized by
  • each light-emitting diode chip of the lighting module can thus be controlled individually and energized independently of the others. It is also possible in this case that the control device only individual LED chips (also
  • the control device further enables switching between the single drive and the group drive.
  • sequential lighting sequences can be realized in addition to, for example, color luminous patterns or color luminous images.
  • a control device for carrying out a gamma correction for each light-emitting diode chip is provided on the underside of the connection carrier.
  • the control device is configured to process the control signal with an eye sensitivity curve.
  • the control unit converts to an 8-bit comprehensive
  • Control signal to at least 12 bits, in particular to at least or exactly 14 bits to. This allows a sufficient adjustment of the brightness curve of a LED chips are achieved by the comparatively high sensitivity of the human eye for low brightness. Further, it is advantageously possible, the gamma correction control device and the control device for addressing in a single
  • Integrate control device so that both tasks can be performed in a control device.
  • At least one voltage generator is provided on the underside of the lighting module, which converts an input voltage of the lighting module into a working voltage for at least one component of the lighting module.
  • the lighting module comprises a voltage generator for all light-emitting diode chips of a color. If the light module comprises RGB light emitting diodes, the light module can have at least three voltage generators for energizing all three color types. Each of the three voltage generators then converts an input voltage into a working voltage suitable for the respective color of a light-emitting diode chip.
  • the lighting module has separate power and data connection sockets on the underside of the connection carrier. This means that the power supply of the light module and the data supply of the light module are fed separately into the light module.
  • the power connector is a 24V connector and the data connector is a digital multiplexer.
  • connection also DMX connection
  • the data port may be another for controlling Light emitting diodes or LED chips suitable connection with serial data transmission act.
  • the connection carrier is formed with an electrically insulated main body, which is provided with conductor tracks and connection points on the upper side and the lower side. This allows mounting and mounting of the components of the lighting module, such as the constant current source, the control device and the voltage generator at the bottom of the connection carrier. Circuits electrically contact the components attached and attached to the connection points. Furthermore, connecting points and conductor tracks, for example, for fastening the light-emitting diodes are also attached to the upper side of the main body. The interconnects allow in this case, the electrical contacting of the LEDs with each other.
  • the base body may be formed with a plastic material or with a ceramic material or consist of such. Furthermore, the base body may be an FR4 printed circuit board, which is printed on the top and bottom with printed conductors and connection points.
  • connection carrier has at least one
  • the lighting module has a temperature sensor on the underside of the connection carrier. To determine the attachment point of the temperature sensor, for example, at the bottom of the connection carrier in the operation of the
  • Light module determines the hottest or the warmest point (also hotspot). During production of the light module, the temperature sensor is then fastened to the underside of the connection carrier at this point. The temperature sensor allows, for example, a determination of the
  • Operating temperature of the light module and / or, for example, also provides the ability to transmit the information about the heat of the light module via a data transfer, for example, to one of the control devices of the light module, which then via a possible lowering of the average Bestromungsdorf, by means of a pulse width modulation, the light emitting diodes heat development of the light module. This allows the safe operation of the light module without damage to the light module or other components adjacent to the light module.
  • FIG. 1 shows a schematic sectional view of an exemplary embodiment of an optoelectronic lighting module described here
  • FIG. 2 shows a schematic top view of the optoelectronic lighting module according to FIG. 1
  • FIG. 3 schematically shows the addressing of the individual light-emitting diodes of the optoelectronic light-emitting module, according to FIG. 1,
  • FIG. 4 schematically shows the addressing of light emitting diodes of a large number of optoelectronic lighting modules.
  • FIG. 1 shows a schematic sectional view of an optoelectronic light module 10 described here having a connection carrier 2 with light-emitting diodes 1 applied to an upper side 1a of the connection carrier 2.
  • Each of the light-emitting diodes 1 is formed with three light-emitting diode chips 14, each emitting one of the colors red, green or blue and thus forming RGB light-emitting diodes.
  • the LEDs 1 are arranged in a matrix, so that between two adjacent light-emitting diodes 1, a gap 11 is formed. The distance D between two adjacent light-emitting diodes is presently 30 mm.
  • connection carrier 2 is a printed circuit board which, for contacting and fastening the individual components, for example the light-emitting diodes 1, has corresponding connection locations 101 and printed conductors 102 both on the upper side 2 a and on a lower side 2 b of the connection carrier 2.
  • the connection carrier 2 is electrically insulated Base 22 formed.
  • the main body 22 may be formed with a plastic material or with a ceramic material.
  • an optical element 12 for example in the form of a converging lens, is applied on a radiation exit surface 13 of each light-emitting diode 1.
  • connection carrier 2 On the underside 2b of the connection carrier 2, a control device 31, 311, a constant current source 32, a voltage generator 33, a temperature sensor 34 and a terminal 4 are mounted. At the terminal 4, the power and the data line 42 and 41 are attached.
  • the connection 4 consists of a data connection socket 44 and of a power connection socket 43. Via the conductor tracks 102 located on the underside 2b and the top side 2a of the connection carrier 2, all components applied to the connection carrier 2 are energized. Furthermore, 41 digital data for driving / addressing of the LEDs are fed into the control device 31 by means of the data feed through the data line.
  • a control device 311 by means of a gamma correction of the respective data signal assigned to a light-emitting diode chip 14, allows an adaptation of the brightness current-supply characteristic of the light-emitting diodes 1 to the brightness perception of the human eye ,
  • the control device 311 converts the 512-byte data signal fed into the control device 311 into a signal of greater information. For example, stand For controlling a light-emitting diode chip of a color digital information of 8 bits available, it is conceivable that the control device 311 converts this 8-bit signal into a 14-bit signal. The control device 311 then forwards the digital information to the control device 31. For controlling each individual color by the control device 31 then 6 bits are more available, which opens up the possibility of the luminous or brightness characteristics of the LEDs 1 more precisely adapted to the perception of brightness of the human eye. In the present case, the gamma correction and the addressing of the light-emitting diodes 1 are performed by a single control device 31, 311.
  • the lighting module 10 has a
  • connection carrier so that the components which are mounted on the top 1a of the connection carrier, electrically connected to the components which are arranged on the bottom 2b of the connection carrier.
  • the constant current source 32 energizes the light-emitting diodes 1, wherein the voltage generator 33 converts an input voltage fed to it into a working voltage for operation of the light-emitting diodes 1.
  • a temperature sensor 34 which is arranged at the hottest point (also hotspot) of the optoelectronic lighting module 10 in operation, permits a temperature control of the lighting module 10, so that structural damage to the lighting module 10 is avoided.
  • the temperature sensor 34 sends a signal to the control device 31 by means of a data transfer line, which then supplies the current to the individual LEDs 1 controls. If the maximum permissible operating temperature of the lighting module is exceeded, the control device 31 can then, for example, downshift the average level of current flow by means of pulse width modulation and thus "dim" the brightness of the light-emitting diodes.
  • the lighting module 10 or individual light-emitting diodes 1 can be switched off by means of a safety cutoff integrated in the control device 31 or by the control device 31 itself when the operating temperature has been exceeded.
  • FIG. 2 shows a schematic plan view of an optoelectronic lighting module 10 according to FIG.
  • connection carrier 2 has a square basic shape, wherein the respective side length L is 23 cm.
  • 64 RGB light-emitting diodes are arranged in a matrix-like manner on the connection carrier 2, so that in each case eight light-emitting diodes are arranged along each side surface.
  • FIG. 3 shows a schematic illustration of the addressing of the individual light-emitting diodes 1 by the control device
  • a data signal having a digital size of 512 bytes is fed into the control device 31.
  • 1 byte is required.
  • the light-emitting diodes 1 are RGB light-emitting diodes, at least 3 bytes each are required for controlling one light-emitting diode at a time.
  • the control device 31 branches so that needed for controlling and addressing the LEDs 1 of the lighting module 10 Amount of data. The proportion of the amount of data that is not needed to control the lighting module 10 is led out of the control device 31.
  • the data signal derived from the control device 31 is a signal of magnitude (510 -3n), where n is the
  • Number of light emitting diodes 1 located on the light module represents 64 in this case. Accordingly, in this example, 328 bytes are available to control another 328 LED chips.
  • Figure 4 shows schematically the addressing of a plurality of optoelectronic lighting modules 10, which are connected in series with each other.
  • the amount of data that is no longer needed to control the lighting module 10a is forwarded by the control device 31a.
  • the remaining amount of data that is not required for controlling the light-emitting module 10a is then transmitted from the control device 31a to the control device 31b after a possible processing of the data volume by the control device 31a.
  • the data is fed into the control device 31a and then the data is transmitted to the control device 31b by means of digital multiplex connections and cables.
  • the transmission of data via another suitable for controlling the light emitting diodes 1 connection with serial data transmission can be done.
  • This control signal in turn allows the control of all other LEDs 1 of the lighting module 10b. If, after activation of all light emitting diodes 1 of the light module 10b, there is still digital information left, then these, in turn, can also be forwarded out of the control device 31b into, for example, a further control device for controlling a further light module. In this respect, a series connection of the lighting modules 10 by means of an incoming digital data signal is possible by this structure.

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Led Device Packages (AREA)
  • Circuit Arrangement For Electric Light Sources In General (AREA)
  • Led Devices (AREA)
EP10710171A 2009-02-05 2010-02-02 Optoelektronisches leuchtmodul Withdrawn EP2394495A2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102009007498.8A DE102009007498B4 (de) 2009-02-05 2009-02-05 Optoelektronisches Leuchtmodul
PCT/DE2010/000113 WO2010088885A2 (de) 2009-02-05 2010-02-02 Optoelektronisches leuchtmodul

Publications (1)

Publication Number Publication Date
EP2394495A2 true EP2394495A2 (de) 2011-12-14

Family

ID=42246338

Family Applications (1)

Application Number Title Priority Date Filing Date
EP10710171A Withdrawn EP2394495A2 (de) 2009-02-05 2010-02-02 Optoelektronisches leuchtmodul

Country Status (4)

Country Link
EP (1) EP2394495A2 (zh)
CN (1) CN102308385A (zh)
DE (1) DE102009007498B4 (zh)
WO (1) WO2010088885A2 (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102015003000B4 (de) 2015-03-07 2022-08-18 Audi Ag Fernsteuerbare Zweipol-Beleuchtungsvorrichtung
DE102015003001B4 (de) 2015-03-07 2022-07-14 Audi Ag Fernsteuern einer Zweipol-Beleuchtungsvorrichtung
US11601909B2 (en) 2018-02-09 2023-03-07 Zte Corporation Increasing mobile device positioning accuracy

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050073495A1 (en) * 2003-10-03 2005-04-07 Gerard Harbers LCD backlight using two-dimensional array LEDs

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19990076777A (ko) 1995-12-29 1999-10-15 헌터 에프. 닐 Led 도트 매트릭스를 사용하는 트루 컬러 평판 디스플레이및 led 도트 매트릭스 구동 방법 및 그 장치
US5836676A (en) * 1996-05-07 1998-11-17 Koha Co., Ltd. Light emitting display apparatus
DE60219325T2 (de) 2001-08-01 2008-01-03 Koninklijke Philips Electronics N.V. Verfahren und einrichtung zur gammakorrektur
US7259734B2 (en) 2003-02-13 2007-08-21 Jae-Jin Lim Multi-scanning control process and LED displaying device
US20090184892A1 (en) * 2006-05-18 2009-07-23 Eth Zurich Display device
US7607790B2 (en) * 2006-12-18 2009-10-27 Hong Kong Applied Science And Technology Research Institute Co., Ltd. Backlighting apparatus and manufacturing process

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050073495A1 (en) * 2003-10-03 2005-04-07 Gerard Harbers LCD backlight using two-dimensional array LEDs

Also Published As

Publication number Publication date
DE102009007498B4 (de) 2022-12-08
WO2010088885A3 (de) 2010-12-23
WO2010088885A2 (de) 2010-08-12
DE102009007498A1 (de) 2010-08-19
CN102308385A (zh) 2012-01-04

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