EP2343780A1 - Halbleiterschaltungsanordnung - Google Patents

Halbleiterschaltungsanordnung Download PDF

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Publication number
EP2343780A1
EP2343780A1 EP10192530A EP10192530A EP2343780A1 EP 2343780 A1 EP2343780 A1 EP 2343780A1 EP 10192530 A EP10192530 A EP 10192530A EP 10192530 A EP10192530 A EP 10192530A EP 2343780 A1 EP2343780 A1 EP 2343780A1
Authority
EP
European Patent Office
Prior art keywords
contact
abutment
semiconductor circuit
circuit arrangement
arrangement according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP10192530A
Other languages
German (de)
English (en)
French (fr)
Inventor
Ingo Bogen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semikron GmbH and Co KG
Semikron Elektronik GmbH and Co KG
Original Assignee
Semikron GmbH and Co KG
Semikron Elektronik GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semikron GmbH and Co KG, Semikron Elektronik GmbH and Co KG filed Critical Semikron GmbH and Co KG
Publication of EP2343780A1 publication Critical patent/EP2343780A1/de
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/10—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation effected solely by twisting, wrapping, bending, crimping, or other permanent deformation
    • H01R4/18—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation effected solely by twisting, wrapping, bending, crimping, or other permanent deformation by crimping
    • H01R4/182—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation effected solely by twisting, wrapping, bending, crimping, or other permanent deformation by crimping for flat conductive elements, e.g. flat cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/59—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
    • H01R12/592—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures connections to contact elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/10—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation effected solely by twisting, wrapping, bending, crimping, or other permanent deformation
    • H01R4/18—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation effected solely by twisting, wrapping, bending, crimping, or other permanent deformation by crimping
    • H01R4/188—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation effected solely by twisting, wrapping, bending, crimping, or other permanent deformation by crimping having an uneven wire-receiving surface to improve the contact

Definitions

  • the invention relates to a semiconductor circuit arrangement according to the preamble of patent claim 1.
  • connection device is used for connecting contact elements provided on a substrate to a connection element for connecting an external load connection. It is a flexible film composite in which on a top and bottom of a plastic-made electrically insulating film conductor tracks are applied. The conductor tracks are connected to the contacts provided on the substrate, for example by means of soldering.
  • connection element In order to produce an electrical contact with the connection element, a terminal contact section of the connection device provided on the end is supported on an abutment provided in the region of a wall of a housing.
  • a bent spring element accommodated in a housing recess forces a second contact section of the connection element against the first contact section.
  • the electrical contact between the first and the second contact portion is not always guaranteed a full-surface contact between the contact sections by design. This can lead to unwanted heating and thus to a disruption of the electrical contact, in particular in the transmission of large currents.
  • the electrical contact is at least temporarily interrupted completely.
  • the object of the invention is to eliminate the disadvantages of the prior art.
  • a semiconductor circuit arrangement is to be specified, which is characterized by a particularly reliable contact between the connection element and a connection device for connection to a circuit.
  • the first contact portion and / or the second contact portion and / or the abutment have a mutually different contact surface, so that upon exercise of the clamping force of at least one of the two superimposed contact portions deformed and under the formation of an electrical contact the shape of the other contact section is adjusted.
  • the proposed semiconductor circuit arrangement is characterized by a particularly reliable, störunan réelleen and long-lasting electrical contact between the connection element and the connecting device.
  • the inventively proposed electrical contact has a high current carrying capacity and can be produced easily and inexpensively. In particular, it is not necessary to produce a relatively expensive soldering, welding or sintering connection between the connection element and the connection device.
  • connection device is understood in particular to mean a film composite in which one or more conductor tracks are applied to a flexible insulating plastic layer or film.
  • the plastic layer may also be provided on its top and bottom with conductor tracks.
  • the composite film may also be formed of a plurality of plastic layers with interposed conductor tracks. The respective layers can have a layer thickness between 10 ⁇ m and 500 ⁇ m.
  • contact section is understood to mean an electrically conductive section of the connection element and / or connection device. In the region of the contact portion, a full-surface metallization is expediently provided.
  • the contact sections are expediently formed corresponding to each other in terms of their size and shape.
  • contact surface is understood to mean that surface of the contact section which is in contact with a further contact surface of the abutment and / or of another contact section. Ie.
  • Each of the contact sections has two "contact surfaces".
  • the two "contact surfaces" of a contact portion may be identical or different.
  • the abutment and / or the abutment can also have a "contact surface”.
  • At least one of the overlying contact surfaces has a different shape or a different profile, so that it comes at the meeting of the contact portions against the abutment to a deformation of one of the two contact portions, in which the contact surfaces form-fitting together. It essentially becomes one full contact between the contact surfaces achieved.
  • the abutment is provided on a lower housing portion.
  • the abutment may be provided in the region of a wall section.
  • An abutment corresponding to the abutment can be provided on an upper housing section.
  • a clamping force can be generated on contact sections inserted therebetween. Ie. the contacting between the contact portions can be carried out in the proposed embodiment simultaneously with the mounting of the housing sections.
  • the clamping force is advantageously caused in this case by pinching the first and the second contact portion between abutment and abutment.
  • the provision of a separate clamping device for generating the clamping force is advantageously unnecessary.
  • the clamping force is generated by an elastic means which forms the counter or the abutment.
  • an elastic means a permanently elastic layer made of an elastic foam, a rubber or the like can be used.
  • At least one of the contact surfaces is curved or has a curved profile. If the contact surface of the abutment is arched, a further contact surface of the abutment is expediently formed corresponding thereto.
  • pinching for example, substantially flat executed Contact sections between the curved contact surfaces of the abutment and the abutment deformation of the contact portions and thus a full-surface contact is achieved.
  • a similar effect can be achieved if, for example, only one of the two contact sections has curved contact surfaces or if one of the contact surfaces of the contact sections is curved and the contact surfaces of the anti-reflection abutment are planar.
  • At least one of the contact surfaces is wave-shaped or has a wave-shaped profile. For example, can be ensured by pinching a contact portion with a substantially flat contact surface between an abutment and an abutment with mutually correspondingly shaped wavy contact surfaces safely and reliably a full-surface contact between the contact portions.
  • At least one of the contact surfaces has at least one cup-like projection.
  • a plurality of such projections are provided.
  • the cup-like projections may be hemispherical, frusto-conical, truncated pyramidal or the like. If such cup-like projections are provided in a corresponding embodiment both on the contact surfaces of the contact portions and on the contact surfaces of the counter and thrust bearing, advantageously a backup of the contact portions with respect to the counter and / or thrust bearing can be achieved. Ie. In this embodiment, the connection element in the attachment state can not be easily moved relative to the abutment.
  • At least one of the contact surfaces has elongated elevations. This may be, for example, provided on the first contact portion traces. Ie. in this embodiment, therefore, the first contact portion is deliberately not metallized over the entire surface. If the contact surface of the second contact portion is formed flat, in the case of exerting a clamping force, the second contact portion is formed on the first contact portion and thus ensures a full-surface electrical contact at least in the region of the conductor tracks.
  • a connection device which is formed from a film composite.
  • the film composite comprises at least one electrically insulating film made of plastic, which is based on at least one side has a metallization.
  • the metallization can be configured for example in the form of conductor tracks. Such a metallization can of course be provided on both sides of the electrically insulating plastic film.
  • a first contact portion of the film composite 1 is designated. In the region of the first contact section, the metallization comes to light, whereas, by the way, it can be covered by a further insulating plastic layer for insulation purposes. How out Fig. 1 it can be seen, the connecting device may also have two first contact portions 2 at its two ends.
  • the first contact section 2 has a first A and an opposite (not visible here) second contact surface B.
  • connection element which is usually made of a metal sheet.
  • the connection element 3 serves to produce a load connection.
  • the reference numeral 4 a second contact portion of the connecting element 3 is designated.
  • a third contact surface C and an opposite fourth contact surface D (not shown here) of the second contact portion 4 are each curved.
  • An abutment 5 may be part of a lower housing section 6, which is only schematically indicated here. It may be provided in particular in the region of a wall of the lower housing section 6.
  • a fifth contact surface of the abutment 5 is designated by the reference symbol E.
  • an abutment is referred to, which may be part of a (not shown in detail here) upper housing portion.
  • a sixth contact surface, which here also curved, is denoted by the reference F.
  • contact surfaces E, F of the abutment 5 and the abutment 7 arched.
  • contact surfaces A, B of the first 2 and the second contact portion 4 are curved.
  • the contact surfaces A, B of the first contact portion 2 are formed in their profiles different from the profiles of the contact surfaces C, D of the second contact portion 4, ie they can, for. B. be slightly planar or curved.
  • the second contact section 4 is first placed on the abutment 5. Then the first contact section 2 is placed on it and the abutment 7 is forced against the abutment 5, for example by means of a screw connection. Due to the clamping force thus generated, at least the first contact portion 2 is adapted or formed in shape to the profile of the contact surfaces C, D of the second contact portion and the profile of the fifth contact surface E of the abutment 5 and the sixth contact surface F of the abutment 7. This results in a secure and full-surface contact between the first 2 and the second contact portion. 4
  • the fifth contact surface E of the abutment 5 and the fourth contact surface D of the second contact portion 3 are flat.
  • the sixth contact surface F of the abutment 7 and the third contact surface C of the second contact portion 4 are configured corrugated.
  • the contact surfaces A, B of the first Contact section 2 may be just designed or provided with a slight curl, so that it is adapted when exerting a clamping force to the shape of the third contact surface C and thus a full-surface contact is made.
  • an electrically insulating film 8 of the connecting device 1 on its upper side a plurality of conductor tracks 9.
  • the conductor tracks 9 rise slightly above the surface of the electrically insulating film 8 and thus form elongated elevations.
  • the abutment 5 and the anvil 7 have here flat contact surfaces E, F.
  • the contact surfaces C, D of the second contact portion 4 are flat.
  • the abutment 5 is expediently made of an elastomer 9a here.
  • the contact surfaces A, C, E of the abutment 5, the first 2 and the second contact portion 4 mutually corresponding cup-shaped projections 10 on.
  • the cup-shaped projections 10 are formed here pyramid and truncated pyramid. They are mounted in congruent positions, so that the first contact portion 2 and the second contact portion 4 are held in a stacked position on the abutment 5 is substantially immovable.
  • a clamping force of an abutment corresponding to its sixth contact surface F (not shown here), in particular, the shape of the first contact portion 2 adapted to the shape of the second contact portion 4 and the shape of the abutment 5 and thus a full-area and reliable electrical contact can be made.

Landscapes

  • Coupling Device And Connection With Printed Circuit (AREA)
EP10192530A 2010-01-12 2010-11-25 Halbleiterschaltungsanordnung Withdrawn EP2343780A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102010000834 2010-01-12

Publications (1)

Publication Number Publication Date
EP2343780A1 true EP2343780A1 (de) 2011-07-13

Family

ID=43627005

Family Applications (1)

Application Number Title Priority Date Filing Date
EP10192530A Withdrawn EP2343780A1 (de) 2010-01-12 2010-11-25 Halbleiterschaltungsanordnung

Country Status (2)

Country Link
EP (1) EP2343780A1 (zh)
CN (1) CN102157486A (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102014114828A1 (de) * 2014-10-13 2016-04-14 Semikron Elektronik Gmbh & Co. Kg Anordnung mit einem Leistungshalbleitermodul, mit einer Gleichspannungsverschienung und mit einer Kondensatoreinrichtung
DE102016104283A1 (de) * 2016-03-09 2017-09-14 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitermodul mit einem Gehäuse

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102015105347B4 (de) * 2015-04-09 2022-03-24 Semikron Elektronik Gmbh & Co. Kg Anordnung mit einem leitstungselektronischen Bauteil und mit einer Gleichspannungsverschienung

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0286422A2 (en) * 1987-04-10 1988-10-12 E.I. Du Pont De Nemours And Company Electrical connector terminal for a flexible printed circuit board
DE3937089A1 (de) * 1988-11-08 1990-05-10 Amp Inc Elektrischer anschluss fuer folienleiter
EP0393927A1 (en) * 1989-04-21 1990-10-24 The Whitaker Corporation Method of interconnecting flat power cables
US5743747A (en) * 1997-01-13 1998-04-28 Hughes Electronics Dimpled connector
DE19905064A1 (de) * 1998-02-09 1999-08-12 Whitaker Corp Verbindungsmechanismus für flexible gedruckte Schaltungen
US6118666A (en) * 1998-01-12 2000-09-12 Asahi Kogaku Kogyo Kabushiki Kaisha Flexible printed wiring board and connecting structure thereof
EP1139492A2 (en) * 2000-03-28 2001-10-04 Sumitomo Wiring Systems, Ltd. A method for connecting a terminal fitting and a flat conductor, a terminal connection apparatus and a terminal fitting
DE102006027482B3 (de) 2006-06-14 2007-08-16 Semikron Elektronik Gmbh & Co. Kg Gehauste Halbleiterschaltungsanordnung mit Kontakteinrichtung
WO2007131537A1 (en) * 2006-05-16 2007-11-22 Fci Connector of flat conductors

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0286422A2 (en) * 1987-04-10 1988-10-12 E.I. Du Pont De Nemours And Company Electrical connector terminal for a flexible printed circuit board
DE3937089A1 (de) * 1988-11-08 1990-05-10 Amp Inc Elektrischer anschluss fuer folienleiter
EP0393927A1 (en) * 1989-04-21 1990-10-24 The Whitaker Corporation Method of interconnecting flat power cables
US5743747A (en) * 1997-01-13 1998-04-28 Hughes Electronics Dimpled connector
US6118666A (en) * 1998-01-12 2000-09-12 Asahi Kogaku Kogyo Kabushiki Kaisha Flexible printed wiring board and connecting structure thereof
DE19905064A1 (de) * 1998-02-09 1999-08-12 Whitaker Corp Verbindungsmechanismus für flexible gedruckte Schaltungen
EP1139492A2 (en) * 2000-03-28 2001-10-04 Sumitomo Wiring Systems, Ltd. A method for connecting a terminal fitting and a flat conductor, a terminal connection apparatus and a terminal fitting
WO2007131537A1 (en) * 2006-05-16 2007-11-22 Fci Connector of flat conductors
DE102006027482B3 (de) 2006-06-14 2007-08-16 Semikron Elektronik Gmbh & Co. Kg Gehauste Halbleiterschaltungsanordnung mit Kontakteinrichtung

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102014114828A1 (de) * 2014-10-13 2016-04-14 Semikron Elektronik Gmbh & Co. Kg Anordnung mit einem Leistungshalbleitermodul, mit einer Gleichspannungsverschienung und mit einer Kondensatoreinrichtung
US9661740B2 (en) 2014-10-13 2017-05-23 Semikron Elektronik Gmbh & Co., Kg Arrangement with a power semiconductor module, having a DC-voltage busbar and a capacitor
DE102014114828B4 (de) * 2014-10-13 2018-02-15 Semikron Elektronik Gmbh & Co. Kg Anordnung mit einem Leistungshalbleitermodul, mit einer Gleichspannungsverschienung und mit einer Kondensatoreinrichtung
DE102016104283A1 (de) * 2016-03-09 2017-09-14 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitermodul mit einem Gehäuse
DE102016104283B4 (de) 2016-03-09 2019-05-16 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitereinrichtung mit einem Leistungshalbleitermodul mit einem Gehäuse

Also Published As

Publication number Publication date
CN102157486A (zh) 2011-08-17

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