EP2340175A2

EP2340175A2 - Method for the production of security elements having mutually registered designs

Info

Publication number: EP2340175A2
Application number: EP09777643A
Authority: EP
Inventors: Winfried HOFFMÜLLER; Patrick Renner; Manfred Heim
Original assignee: Giesecke and Devrient GmbH
Current assignee: Giesecke and Devrient GmbH
Priority date: 2008-08-05
Filing date: 2009-08-04
Publication date: 2011-07-06
Anticipated expiration: 2029-08-04
Also published as: RU2496653C9; RU2496653C2; WO2010015381A3; US20110127762A1; CN102177033B; RU2011108210A; WO2010015381A2; DE102008036481A1; EP2340175B1; US9238383B2; CN102177033A

Abstract

The invention relates to a method for producing a security element (1), a security element (1) obtained according to the claimed method, transfer materials containing the claimed security elements, and objects of value secured by means of the claimed security elements. The claimed security element (1) comprises at least two functional layers (12, 22), each of which forms a design. The designs are congruous, or one design represents a photographic negative of the other design. In the claimed method, the design of one functional layer (12) is transferred into the other functional layer (22) with the help of an adhesive layer (30). An accurate copy of the design of the first functional layer is reproduced in the adhesive layer, and said copy of the design in the adhesive layer is used for reproducing an accurate copy of said design or the photographic negative thereof in the second functional layer. The design is successfully transferred from one functional layer into the other one as a result of the fact that the adhesive has zones with different adhesiveness because the irradiation penetrates the first functional layer, and only the very adhesive zones adhere to the second functional layer. The zones of the functional layer that do not adhere are removed.

Description

Method for producing security elements with matched motifs

The invention relates to a method for producing a security element with two or more motif layers matched to one another, in particular motif layers having characters visually recognizable in transmitted light and preferably also in incident light, a security element obtainable by the method, the security element designed as a transfer element, the use of the security element or transfer element for product assurance, a valuables item equipped with the security element and a method for producing such a valuables item.

Valuables, in particular value documents, such as banknotes, shares, identity cards, credit cards, certificates, checks, and other forgery-prone papers, such as identification documents of various kinds, but also branded goods and packaging of branded goods are often provided with security elements to secure, checking their authenticity while protecting against unauthorized reproduction. The security elements may, for example, take the form of security threads or stickers or any other form insertable or attachable to a valuable article or security paper, a "valuable article" within the meaning of the present invention being any objectionable to counterfeiting, in particular a value document, while a "security paper "represents the precursor to a value document, which can not yet be processed.

Security elements are typically multilayer elements with multiple functional layers. Functional layers are generally layers that have any properties that can be detected visually or by machine. Functional layers therefore contain, for example, dyes, luminescent substances, thermochromic substances, liquid crystals. metals, interference pigments, electrically conductive substances, magnetic substances, light-diffractive or refractive structures or combinations thereof. The functional layers are usually designed as geometric or figurative patterns or motifs, ie there are functional areas within a layer with the detectable property (for example luminescence) and recesses in between. If a plurality of functional layers are arranged one above the other, it is generally desirable for the functional regions and the recesses in the individual functional layers to be formed exactly in register, ie with high register accuracy, and with contour-sharp edges between the functional regions and the recesses. In this way, one functional layer can be hidden under another, for example magnetic substances under a colored layer, or security elements with multiple functional layers and "negative writing" can be produced. Negative-type security elements comprise a transparent substrate having at least one non-transparent coating having recesses (the negative writing). These recesses may have any shapes, such as letters, numbers or patterns of any kind, especially line patterns. The term "negative writing" as used in this application accordingly comprises recesses of any shape, ie any non-solidity in a non-transparent coating The more transparent, ie the more translucent, the carrier substrate, the more pronounced is the contrast between coated and uncoated regions In the case of very transparent substrates, the negative writing is clearly recognizable in incident light, and in transmitted light only in the case of less transparent substrates If such a negative-type security element has two different functional layers, for example a motif in the form of a gold-colored metallic coating and the same motif as a red printing ink , so this motif appears golden to the viewer from one side, red from the other side.

Such multilayer motifs are difficult to imitate due to the required high registration accuracy. Motifs with negative fonts in particular offer good counterfeit protection, as inaccuracies during production are particularly easily recognizable in transmitted light, and "primitive" counterfeiting attempts, such as copying with color copiers, are immediately recognizable even to the inexperienced eye.

The tamper-proof is the higher the finer the structures in the functional layers are with the matched-to-each other motifs. However, designing the finest structures with sharp contours and keeping them in perfect register with each other also poses a challenge for authorized manufacturers. There are a number of methods known that should make it possible to:

Recesses in several superimposed functional layers register accurate, d. H. congruent in all layers, train.

From WO 92/11142 it is known to produce negative writings in functional layers by means of heat-activatable printing inks. The printing inks are printed in the form of the desired Negativschrif t below the functional layers and contain waxes or intumescent additives which soften when heated or split off a gas and thereby produce foam structures. As a result, the adhesion in the areas which can be printed with the activatable ink is reduced, and the functional layers can be removed mechanically in these areas.

DE 102007055 112 A1 discloses a method for register-based, ie congruent, formation of a negative writing in a plurality of functional layers by means of a printed in the form of trainees negative typeface under the functional layers ink containing a component that causes a process on irradiation or heating or in contact with a washing liquid, which causes the part of the ink on the overlying coating a force is exercised, which breaks the coating. This force can be exerted by a gas generated from constituents of the printing ink when they come into contact with washing liquid, irradiated and / or heated, or by a swelling agent in the printing ink, which swells upon contact with a washing liquid. Once the multilayer coating has been broken, it is relatively easily accessible for washing with washing liquid.

The methods mentioned work satisfactorily, as long as no very fine structures are to be formed. However, very fine structures can often not be contour-sharp and accurate in registration with the mentioned method.

It is therefore an object of the present invention to provide a method for the production of security elements which makes it possible to form congruent motifs in at least two superimposed layers.

The object of the present invention is, in particular, to provide such a method, with which congruent motifs can be formed with sharp contours and with high register accuracy.

It is also an object of the present invention to provide such a method, wherein the motifs to be formed have very fine structures. It is also an object of the present invention to provide a security element having at least two motif layers with mutually corresponding motifs which have a high register accuracy.

It is also an object of the present invention to provide such a security element in which the motif layers have very fine structures and are of sharp contours.

It is also an object of the present invention to provide such security elements in the form of transfer elements and to provide security papers and valuables with the security elements or transfer elements according to the invention and methods for producing the security papers and the valuables.

The objects are achieved by the method for producing a security element having the features specified in claim 1, by the security element having the features specified in claim 8, by the transfer material having the features specified in claim 15, by the security paper or the valuable article according to claim 16 and by the method according to claim 17.

Specific embodiments of the present invention are set forth in the respective dependent claims.

The basic idea of the present invention is to transfer the motif of a functional layer into another functional layer with the aid of an adhesive layer. In this case, an exact image of the motif of the first functional layer is reproduced in the adhesive layer, and this image of the motif in the adhesive layer is in turn used to produce a precise image Reproduce the image of this motif or its photographic negative in another functional layer. The transfer of the motif from one functional layer to the other is achieved by structuring the adhesive between the functional layers with the aid of the motif of the first functional layer such that it adheres only to certain regions of the second functional layer, with the other regions of the second functional layer However, no adhesive bond is received. The non-bonded regions of the second functional layer are then removed, while the bonded regions can not be removed, whereby an exact reproduction or a photographic negative of the motif of the first functional layer arises in the second functional layer.

The security element according to the invention is produced from at least two partial elements. A first sub-element consists at least of a carrier substrate and a functional layer with recesses therein. Additional layers may be present. The functional layer can also be composed of several individual layers.

The carrier substrate of the first security element partial element is preferably a film, for example made of polypropylene, polyethylene, polystyrene, polyester, in particular polycarbonate or polyethylene terephthalate. Transparent or translucent films are particularly preferred. When such films are used, the recesses formed in the exact register in the individual functional layers can be clearly recognized as negatives.

On the carrier substrate, a functional layer is formed. The functional layer can basically be of any type as used in security elements. As examples may be mentioned metal layers from for example aluminum, iron, copper, gold, nickel, etc., metal alloys, or layers of metallic effect paints, layers with color pigments or fluorescent pigments, liquid crystal layers, coatings with a color shift effect, layer combinations, such as a color-shaded layer with a specific color, Layers with machine-detectable features, for example, with magnetic pigments, which can be hidden under a cover layer if necessary. In the mentioned layer with color pigments, it may, for. Example, a black ink based on "Microlith Black" (Ciba), which forms a dark background for example, liquid crystal layers in the security element according to the invention, which allows the generation of impressive color shift effects.

The application of the functional layers is carried out by known methods that are suitable for the respective functional layer, for example by physical vapor deposition (PVD) in metals or by printing on color pigments or fluorescent pigments.

If functional layers are printed on, they can, if desired, already be printed in the form of the functional layer motif, i. H. in the form of functional areas and recesses between these areas. In all other cases, there is a full-surface application of the functional layer, whereby of course also printed functional layers can be printed over the entire surface.

The functional layer can be formed directly on the carrier substrate, or one or more intermediate layers can be provided. For some functional layers, intermediate layers are absolutely necessary, for example if the motif of the functional layer is is a metallized hologram, kinegram, pixelgram or other metallized diffraction structure. In such a case, first an embossing lacquer layer is applied and embossed into the embossing lacquer layer, before or after the metallization, the desired diffractive structure. In the case of liquid crystal layers as well, an intermediate layer is generally required which ensures a suitable orientation of the liquid crystals. Suitable orientation layers can be, for example, embossed lacquer layers embossed diffractive structures. Alternatively, if appropriate, the carrier film can also be suitably treated.

According to a preferred embodiment of the present invention, one of the motif layers is a metallized diffraction structure, such as a metallized hologram, and a further motif layer is particularly preferably a metallized diffraction structure, such as a metallized hologram. When holograms are referred to below, it will be understood that the same applies to other diffraction structures and refractive structures as well as so-called "matt structures" (lattice images with achromatic grating regions), as defined and described, for example, in WO 2007/107235 A1 are (see in particular claim 1).

As mentioned above, in the case of holograms, an embossing lacquer layer containing the desired structure information is to be provided. The structure information is transmitted when glued to the second security element subelement. Materials for embossing lacquer layers are known to a person skilled in the art. Suitable embossing lacquers are disclosed, for example, in DE 102004 035 979 A1, which discloses heat-sealing lacquers which can likewise be used as embossing lacquer. In a further step, the functional layer is structured to produce a motif, ie, certain areas are removed from the functional layer. The remaining functional areas and the recesses together form the motif, which can be any geometric or figurative representation. The motif can also form an encoding, or the shape of the recesses can be designed so that the recesses are perceived by a viewer as the "motif".

Methods for producing the recesses are known. Suitable examples are laser ablation, etching and washing procedures. Etching processes are particularly suitable for metallic functional layers. On the metallic layer, a photoresist is applied and exposed through a mask in the form of the desired motif. In the case of positive-working photoresists, the areas of the later recesses must be exposed; for later-acting photoresists, the later functional areas must be exposed. After exposure, the photoresist in the soluble areas is removed by developer and the metal layer in the exposed areas is etched away by etchants such as caustics or acids to form the desired recesses.

Washing processes are universally applicable. Suitable washing processes are disclosed, for example, in WO 99/13157, WO 92/11142, WO 97/23357 and in DE 10 2007 055 112. Particularly suitable is the process disclosed in DE 10 2007 055 112, with which thicker coatings, for example multi-layer coatings, are also suitable , can be removed. If this method is used in the present invention, a special printing ink is applied to the carrier substrate or an intermediate layer, if present, at least under the functional layer, in the regions in which recesses are to be formed in the functional layer. prints. The printing ink contains a reactive constituent and / or a precursor of a reactive constituent which, on contact with a washing liquid, causes a process which leads to a break-up of the regions of the functional layer lying above the ink, and / or a reactive constituent which is present Irradiation or when heated causes a process that leads to a rupture of lying over the ink areas of the functional layer. The reactive component in the ink is, for example, a component of a two-component gas evolution system such as a carbonate or a hydrogencarbonate, wherein the second component of the two-component gas evolution system, for example an acid such as citric acid or tartaric acid, is contained in the scrubbing liquid. On contact with the washing liquid, a small amount of acid penetrates the ink through the functional layer, a gas develops and the functional layer is broken up at the appropriate point and can now be easily removed, if necessary with mechanical assistance. Similarly, swelling agents contained in the printing ink, for example starch or cellulose derivatives, swell on contact with a washing liquid, such as water, and break up the functional layer. Alternatively, the ink may contain blowing agents which release a gas upon irradiation and / or heating, such as azoisobutyric acid nitrile, which in turn results in an increase in pressure under the functional layer and rupture of the functional layer in the areas printed with the ink. The broken-up areas of the functional layer can now be easily washed out together with the printing ink, whereby the desired recesses are formed.

Next, the second security element subelement is manufactured. The second security element subelement has, like the first security element subelement, at least two layers, namely a carrier substrate and a functional layer formed thereon. In addition, other layers may be present or need to be present as stated above for the first security element subelement.

In general, the same applies to the materials, the structure and the production of the layers of the second security element subelement as to the first security element subelement, wherein, however, it should be noted that no recesses are formed in the functional layer or the functional layer sequence. The recesses are only produced by cooperation with the first security element subelement. In addition, the carrier substrate of the second security element subelement is later separated together with parts of the functional layer of the second security element subelement, for. B. by isolation winding, (eg, the parts of the functional layer, which are arranged in the composite security element via recesses in the functional layer of the first security element subelement), while the carrier substrate from other parts of the functional layer of the second security element subelement ( For example, the parts that are arranged in the composite security element over functional areas of the first security element element must detach. Therefore, it is necessary that the functional layer has only a slight adhesion to the carrier substrate.

The required low adhesion force is already achieved in many functional layer materials, in particular metallizations, by omitting adhesion-promoting measures between the carrier substrate and the functional layer. The meeting of adhesion-promoting measures between The individual layers of a security element is otherwise customary, and the corresponding provisions known to a person skilled in the art.

If the adhesive force between the carrier substrate and the functional layer is too high, it can be reduced by treating the carrier substrate with suitable additives. For example, the carrier substrate can be washed off with water and / or solvents with or without suitable additives. Suitable additives are, for example, surface-active substances, defoamers or thickeners.

The same applies to any intermediate layers present between the carrier substrate and the functional layer, for example embossing lacquer layers for a hologram. If such an embossing lacquer layer or other intermediate layer is to be taken off together with the carrier substrate, the adhesive force between the intermediate layer and the functional layer, ie for example between the embossing lacquer layer and a metallization applied thereon, must be correspondingly low. If the adhesive force is too high, the intermediate layer should be treated with the additives mentioned.

If a treatment of the carrier substrate or an intermediate layer with adhesion-reducing additives is carried out, residues of the additives can remain on the functional layer after the carrier substrate or the intermediate layer has been separated off. These can normally be washed away simply with an aqueous solution whose pH is suitably adjusted and which may optionally also contain surfactants. Even a laundry with solvents is possible. In persistent cases, high-pressure nozzles and / or mechanical support (felts, brushes) can be used, but this is usually not necessary. Low additive Remainders can also be "burnt away" by means of a corona treatment. Incidentally, in many cases it is also possible to completely dispense with the removal of additive residues. Suitable formulated conformal coatings can also adhere adequately to "additive-loaded" functional layers.

Now, the first security element subelement, which has a functional layer with functional regions and recesses, and the second security element subelement, which has a functional layer without recesses, are connected to one another with the aid of an adhesive layer. A suitable adhesive layer may possibly already be present on the first security element subelement, namely if the recesses were produced in the functional layer of the first security element subelement with the aid of a stickable resist. The recesses are produced by coating with photoresist, exposing by means of an external mask, developing and etching away the areas of the functional layer which are no longer protected by photoresist. On the other areas of the functional layer, the functional areas, there is still photoresist material, which is necessarily congruent with the functional areas. If it can be bonded well to the material of the functional layer of the second security element partial element under pressure and at elevated temperature, this photoresist material can be used as the adhesive layer. If an unsuitable photoresist has been used or if the photoresist areas are no longer sufficiently intact for exact bonding, the photoresist is removed and then moved as in all other cases in which the recesses in the functional layer of the first security element subelement are used Photoresists were generated. The photoresist used may be a positive photoresist such as AZ 1512 (AZ 1500 series) or AZ P 4620 from Clariant or S 1822 from Shipley, which is applied in an areal density of about 0.1 g / m ² to about 40 g / m ² .

In these cases, a radiation-curing, preferably a UV-curing, or a radiation-activatable, adhesive is used for bonding the first security element partial element and the second security element partial element. When applying the adhesive and the combination of the sub-elements together, it has to be taken into account that, according to the invention, the adhesive force of the adhesive is changed by irradiation using the functional layer of the first security element sub-element as a mask so that substantially no adhesive force is left either in the recess regions while in the functional areas the adhesive force remains essentially unchanged, or alternatively the adhesive is activated in the recess areas, but remains inactive in the functional areas. The first case is described below. For the latter, with respect to the adhesive and the non-adhesive regions of the adhesive layer, and thus with regard to the bonded and the separated regions of the functional layer of the second security element partial element, the reverse applies in each case.

This results in several variants with regard to the application parts of the adhesive, with respect to the orientation of the security element sub-elements to each other and with respect to the order of the steps required for the final connection, ie the irradiation of the adhesive layer and the assembly and bonding of the security element sub-elements, if necessary. under increased pressure and elevated temperature, with each other. Version 1:

The adhesive is applied to the first security element sub-element on the functional layer. In this case, the adhesive-coated security element partial element is irradiated from the side of the carrier foil, ie, through the functional layer, with radiation of a suitable wavelength. As a result, the adhesive cures in the areas in which the functional layer has recesses, and is thereby deactivated. In the areas in which the functional layer has no recesses (ie in the functional areas), the radiation is completely or at least largely shielded and the adhesive force of the adhesive therefore remains unchanged or at least substantially unchanged. The second security element partial element is then placed on the adhesive layer such that its functional layer contacts the adhesive layer. The two sub-elements are pressed together, optionally at elevated temperature, whereby the adhesive layer in the non-deactivated areas glued to the functional layer of the second security element sub-element. Since the adhesive-capable areas of the adhesive layer correspond in dimension and shape to the functional areas of the functional layer of the first security element partial element, the bonding to the functional layer of the second security element partial element takes place in such a way that it exactly matches the motif of the functional layer of the first security element partial element reproduces. Then, if necessary, irradiated again to further crosslink the adhesive in the previously or barely irradiated areas and thus protect the structure against destruction in the following steps. Finally, the carrier foil of the second security element partial element is pulled off, optionally together with intermediate layers between carrier foil and functional layer, the functional layer in the non-bonded regions is deducted with, while it can not be deducted in the bonded areas, of course, so that a security element with two completely congruent motifs arises. The second motif layer may optionally be covered with a protective layer.

This orientation of the security element sub-elements to each other should also be selected when an existing photoresist is used as an adhesive.

Variant 2:

The radiation-crosslinkable adhesive is applied to the first security element partial element, but to the carrier film, not to the functional layer as in the first variant. Again, the adhesive is deactivated by irradiation with a suitable wavelength using the first functional layer as an exposure mask in the areas of the recesses of the first functional layer, while maintaining its adhesive strength unchanged or at least substantially unchanged in the other areas. Due to the greater distance between the exposure mask and the adhesive layer, the image of the motif of the functional layer in the adhesive may not be as accurate as in the first variant. Subsequently, the second security element partial element is placed with its functional layer on the adhesive layer of the first security element partial element and moved as in the first variant. In the already crosslinked, ie hardened, areas of the adhesive layer, no bonding takes place with the functional layer of the second security element partial element, so that the two functional layers of the resulting security element have congruent recesses. Variant 3:

The adhesive layer is applied to the functional layer of the second security element partial element. In this case, in order for the functional layer of the first security element subelement to be used as an exposure mask, the two security element subelements must first be assembled before the irradiation. The assembly can be effected, for example, in such a way that the functional layer of the first security element partial element adjoins the adhesive layer. In this case, care must be taken that no premature bonding takes place, ie it must be used an adhesive that does not stick the two security element sub-elements when merely joining, but only under increased pressure and optionally at elevated temperature causes bonding. Suitable adhesives are given below. The composite security element sub-elements are then irradiated through the functional layer of the first security element sub-element, whereby the adhesive is cured in the not shielded by the functional layer areas and deactivated, but not in the shielded by the functional layer areas. Due to the immediate proximity of the adhesive layer and the exposure nipples, as in the first variant, an extremely good fidelity of the image of the motif of the first security element partial element in the adhesive layer is achieved. This motif is passed on to the functional layer of the second security element partial element, whereby the separation of the functional layer of the second security element partial element from the carrier substrate or the carrier substrate and further layers also requires the adhesive layer to be severed. This can lead to a slightly lower edge sharpness than in the first variant. Variant 4:

The adhesive is applied to the functional layer of the second security element partial element, as in variant 3. However, the two security element partial elements are assembled in such a way that the carrier substrate of the first security element partial element is glued to the adhesive layer. Otherwise, as in variant 3, d. H. It must be used an adhesive that does not stick the two security element sub-elements in the mere loose assembly yet. Then, it is irradiated through the functional layer of the first security element partial element, with the adhesive curing in the unshielded regions. Subsequently, the two security element sub-elements are interconnected under increased pressure and optionally elevated temperature. If necessary, re-radiation is applied to achieve good curing in the screened adhesive areas. Finally, the carrier substrate, and possibly further layers, of the second security element partial element are removed together with the non-bonded regions of the functional layer. If desired, the regions of the functional layer remaining on the adhesive layer can be covered with a protective layer. In this variant, the distance between the exposure mask and the adhesive layer is greater in the case of irradiation than in variant 3. The image of the motif of the functional layer of the first security element partial element in the adhesive layer, and thus the transmission into the functional layer of the second security element partial element, is therefore not complete as precise as in variant 3.

It should be noted for the exposure that this can be done from a defined angle other than 90 °. At a defined distance the external / internal mask and the layer to be exposed, a defined offset of the motifs of the two functional layers can be achieved in an exposure at a defined angle deviating from 90 °. As a result, for example, interesting blinds and see through effects are possible.

Generally, it should also be noted that the compression of the two security elements sub-elements can be done in one or more stages. That the two sub-elements are preferably pressed together at elevated temperature in a heat roller with a (single-stage compression) or more so-called calender rolls (multi-stage compression), or but the two sub-elements are pressed against each other at several heat rollers, each equipped with one or more so-called calender rolls ( multi-stage compression). The multi-stage compression can, depending on the respective embodiment, lead to a particularly strong connection of the safety element partial elements. When using several heating rollers and temperature profiles during compression can be realized.

The most exact image in combination with the best edge sharpness can be achieved in variant 1, since exposure mask and adhesive layer to be exposed directly adjacent to each other or at most separated by a thin protective layer of the functional layer of the first Sicherheitsselement- partial element, and also the adhesive layer must not be severed , The fuzziness in the separation are less than 10 microns.

The process sequence of variants 3 and 4 can also be applied when the adhesive is applied to the first security element sub-element, ie, the two security element sub-elements can first loosely assembled, then irradiated, and finally connected together under pressure and optionally elevated temperature. Of course, then also a suitable adhesive must be used, ie an adhesive, which ensures that no bonding takes place with the areas of the functional layer of the second security element sub-element, which is to be removed to form recesses. Suitable bonding conditions are typically about 60 ⁰ C to 160 ⁰ C and a line pressure of, typically, 0.1 N / mm to 15 N / mm, more preferably from about 5 N / mm.

Suitable adhesives are disclosed, for example, in DE 10 2004 035 979 A1. They are adhesives, in particular dispersion adhesives, which contain at least one radiation-crosslinkable component and are crosslinked by short-wave radiation, such as ultraviolet radiation or short-wave visible radiation, or by electron radiation, preferably by UV radiation. The coatings are substantially tack free after physical drying and have a smooth, substantially non-sticky surface. The absence of tack can be checked by the following test: Coated pieces of film of about 100 cm ² are stacked and loaded with a weight of 10 kg and stored at 40 ^° C. for 72 hours. If the film pieces can then easily be separated from one another without damaging the coatings, the coating must be considered tack-free. Under elevated pressure and elevated temperature (about 60 ⁰ C to 160 ⁰ C) coated with the adhesives substrates can be bonded to other substrates.

Examples of suitable radiation-curable adhesives are acrylated polyurethane dispersions, such as DW 7770 and DW 7773 (UCB, Surface Specialties), anionic and nonionic dispersions, such as NeoRad R-440 (NeoResins), Laromer 8983 (BASF), LUX 101 UV dispersion (Alberdingk), Halwedrol UV 95/92 W (Hütteness-Albertus) and Beyhydrol UV VP LS 2280 (Bayer), cationic radiation curing resins such as UCAR VERR-40 (The Dow Chemical Company ). Particularly preferred adhesives are radiation-curing compositions with photoinitiators.

Suitable photoinitiators are, for. Irgacure 500 (Ciba) and Irgacure 819 DW (Ciba). According to a formulation example, a radiation-curable adhesive has the following composition:

Product name% by weight

DW 7773 (UCB) 94.5

Irgacure 500 (Ciba) 1.5

Irgacure 819 DW 4.0

The formulations may optionally contain mixtures of the dispersions and further additives, such as additives (defoamers, leveling agents, anti-block additives, tackifiers, etc.). In addition, powder coatings may be added in dispersed form, which on the one hand can provide a defined melting point or else can melt and participate in radiation curing.

The radiation-curing compositions disclosed in DE 10 2004 035 979 A1 can be used not only as adhesives but also as embossing lacquer. They can therefore also be used advantageously in the present invention when embossing lacquer structures are required, for example for metallized holograms. According to a further variant of the present invention, "intarsia" motifs can also be produced In this variant, as described above, one does not use an adhesive which is cured by radiation, ie deactivated, but an adhesive which activates by radiation In this case, when the carrier substrate, or the carrier substrate and other unneeded layers are peeled off, the functional layer regions of the second security element partial element are contacted, which contact non-irradiated regions of the adhesive layer, while the function of FIG Onsschichtbereiche of the second security element partial element, which come into contact with irradiated areas of the adhesive layer, adhere to the adhesive layer and can be glued firmly to it, optionally under elevated pressure and elevated temperature ent, which has a motif on one side of the adhesive layer and a photographic negative of this motif on the other side of the adhesive layer. If a very well transparent film is used as the carrier substrate for the first security element partial element, the finished security element shows an "inlay" motif on both sides, ie the observer sees the motif of the first functional layer, wherein the recesses are exactly through the second functional layer be filled. When using an opaque carrier substrate, the same effect is obtained for variants 1 and 3 described above, but the motif can only be seen from one side. In variants 2 and 4 described above, the observer sees on one side of the security element the motif of the first security element subelement, and on the other side of the security element the corresponding negative.

Embodiments of the security element according to the invention, which are reflective layers as functional layers or one of the functional layers Layer can also be equipped very well with a so-called "polarization feature". These are security features that use polarization effects for authenticity assurance. Light-reflecting surfaces, for example metallized holograms, are coated over the entire surface or in regions with a birefringent layer, a so-called "phase delay layer". Phase retardation layers are capable of changing the polarization and phase of transmitted light. The reason is that the light is split into two mutually perpendicular polarization directions, which pass through the layer at different speeds, their phases are thus shifted from each other. The shift is, depending on the type and thickness of the layer, different sizes and has different effects. A λ / 4 layer, that is, a layer that delays the light in a direction one-quarter wavelength from the direction perpendicular thereto, can make circularly or elliptically polarized light from linearly polarized light and linearly polarize again from circularly polarized light. The phenomenon of polarization and polarizing materials are known. A security element that uses polarization effects for authenticity assurance is described, for example, in DE 10 2006 021 429 A1. When viewed under ambient light, the phase delay layer regions of such a security element are barely perceptible, but when viewed under polarized light, the phase delay layer regions become discernible.

If light is incident on a light-reflecting surface, which is partially coated with polarizing material, through a polarizer, the light is reflected in the coated and in the uncoated regions with different polarization. When viewed through a polarizer observed by light / dark contrasts. inexperience It is permissible for the achievement of good optical effects that the light-reflecting surface does not change the polarization state of the incident light in an uncontrolled manner. Suitable reflective layers are layers of vapor-deposited metallizations, layers of metallic effect paints, layers with interference pigments or thin-film element layers. High-index layers of, for example, TiO 2 or SiCb are also suitable as reflection layers.

In the present invention, metallic functional layers, for example metallized diffraction structures or matt structures, are preferably combined with a polarization feature. The polarization feature may, for example, be embodied as a λ / 4-layer, applied in motif form, over the entire surface or in regions, with only one orientation or with two or more different orientations. If the security element has reflective functional layers on both sides, both reflective functional layers can be provided with the same or different polarization features. Transparent areas (recesses) are not disturbing. If the reflective layers are located on the same side of the carrier substrate, the carrier substrate should be isotropic or at least not exhibit excessive dispersion in the optical region.

The method according to the invention, in which the motif of a functional layer is used as an irradiation mask in order to transfer the motif into an adhesive layer, and from there into a further functional layer, can also be carried out in combination with an external irradiation mask. With external radiation masks, the same high precision can not be achieved as with the internal radiation mask, but if extreme precision can be dispensed with, the combination of inter- ner and external radiation mask interesting effects can be achieved. If, for example, the functional layer of the first security element partial element has not only very fine but also larger recesses, the adhesive layer can be irradiated not only by the first functional layer as radiation mask, but also by a further external radiation mask, wherein the external radiation mask is a motif has in the region of the recesses of the first functional layer. In this way, a combination of the motifs of the first functional layer and the external radiation mask is obtained in the second functional layer.

The inventive method can also be carried out several times, d. H. More than two security element subelements can be combined with each other. Bonding more than two security element subelements can be useful, in particular, if a machine-detectable functional layer is to be hidden as a middle layer between two visually recognizable functional layer motifs.

The functional layers which have to be separated in areas remaining on the adhesive layer on the one hand and in areas to be subtracted with the carrier substrate on the other hand may not have too high internal strength in the horizontal direction (in the direction of extension of the adhesive layer) in order to achieve a clean and sharp-edged separation to ensure. Functional layers whose internal strength is undesirably high are preferably applied in a screened manner. The edge of each raster point represents a predetermined breaking point, whereby the transfer to the adhesive layer in this case comprises a grid point as the smallest unit. If a functional layer is made up of several individual layers, it may be sufficient to implement only one of the individual layers as a stationary grid. The invention will be explained in more detail with reference to drawings. In the figures, the functional layers are shown as metal layers, in each case in combination with an embossing lacquer layer. It is to be expressly understood, however, that the present invention is by no means limited to such functional layers. Rather, any functional layers in any combination, for example, layers of printing inks, metallic effect colors, interference pigments, liquid crystal layers and combinations of layers, for example, color layers with layers of interference pigments are used. In addition, further layers, as are customary in the field of security elements, may be contained in the security element constructions, for example protective layers or release layers in the case of transfer elements, adhesion-reducing layers for facilitating separation of the functional layer regions which are to remain on the adhesive layer, etc .. Es ver - It is understood that the additional layers must not interfere with the process flow, for example, may not shield the radiation used to irradiate the adhesive layer too strong. Thus, for example, a material which is sufficiently permeable to the radiation used must be used as the carrier substrate of the first security element partial element. It should also be noted that the representations are of course not to scale. In particular, the individual layers are shown greatly exaggerated.

In the figures show:

1 shows a detail of a document of value with inventive security element in supervision,

FIGS. 2 to 6 each show procedures in the production of a Safety element according to the invention, illustrated in sections through the security element of Fig. 1 along the line AA ¹ in the cutout B, wherein

2a to 2e shows the variant 1 described above,

3a to 3e shows the variant 2 described above,

4a to 4e shows the variant 3 described above,

5a to 5e shows the variant 4 described above,

Fig. 6a to 6f the variant described above with a stickable

Photoresist shows, and

7a to 7c show a method sequence in the production of a security element 1 according to the invention, in which, instead of the second security element part element shown in FIG. 2c, the security element part element shown in FIG. 7a is used.

1 shows a section of a Vvertdokument 2 invention with a security element according to the invention 1. The security element 1 is also shown only as a section. It shows a sun on golden background, whereby the sun 3 is a transparent disk with fine transparent rays. The symbol 41 for the currency "EURO" can be recognized in the interior of the transparent solar disc, silver-colored. The gold-colored and silver-colored areas are each designed as a diffraction structure. Based on the following figures, it will be exemplified how such a security element according to the invention can be obtained. Shown are each sections through the security element, or its sub-elements, along the line AA ¹ in the section B.

FIG. 2 a shows a first security element partial element 10, comprising a first carrier substrate 11, a PET film permeable to UV radiation, an embossing lacquer layer 15 applied thereto with embossed diffraction structure 15 'with a gold-colored metallization. The metallization forms a first functional layer 12 with golden first functional areas 13 and first recesses 14 therein. The diffraction structure 15 'of the embossing lacquer layer 15 can also be seen in the first functional regions 13 as a diffraction structure 13'. On the functional layer 12, an adhesive layer 30 is applied.

FIG. 2 b shows the same illustration as FIG. 2 a, wherein the arrows indicate that the security element subelement 10 is irradiated with UV radiation. In the adhesive layer 30 are separated by dashed lines, through the first functional areas 13 shielded and therefore not significantly changed in their adhesive force adhesive regions 33 and irradiated and thus deactivated adhesive regions 34 indicated. The line 40 under the first carrier substrate 11 indicates an external radiation mask, the meaning of which will be explained later.

2c shows a section through the second security element subelement 20 to be combined with the first security element subelement 10. The second security element subelement 20 consists of the second carrier substrate 21, the second functional layer 22 and an embossing lacquer layer 25 therebetween. In the embossing lacquer layer 25 is a diffraction structure 25 'a shaped, which is reproduced in the second functional layer 22 as a diffraction structure 22 '. The second functional layer 22 is a silver-colored metallization. The embossing lacquer 25 was washed off with an aqueous surfactant solution before the application of the metallization 22, with the result that the metallization 22 badly adheres to the embossing lacquer. Embodiments with different metallizations are particularly preferred.

FIG. 2 d shows how the irradiated first security element partial element 10 from FIG. 2 b and the second security element partial element 20 from FIG. 2 c are assembled to form a composite 5. The two sub-elements are slightly compressed, whereby the diffraction structure 22 'of the second functional layer in the non-hardened regions 33 of the adhesive layer 30 is transferred to the adhesive layer. In these areas, the first security element sub-element and the second security element sub-element are glued together. No adhesion takes place in the irradiated, and thus deactivated, regions 34 of the adhesive layer. The adhesive is hard and inert, so that the diffraction structure 22 'in the regions 34 does not transfer to the adhesive layer, which is indicated by the smooth surface in the regions 34. For better curing of the areas 33 of the adhesive layer can now be irradiated again, which now has to be irradiated either through the first functional layer or through the second functional layer, which greatly reduces the efficiency of the irradiation and requires longer exposure times. Therefore, if the manufacturing process enables the first and second security element part members to be bonded together immediately after the irradiation, it is preferable to use a cationic curing adhesive. Cationic radiation curing is a relatively slow process, which continues even after the end of irradiation. In the cationic radiation hardening an acid is released, which in the Beschichrung the Crosslinking reaction catalysed. If, therefore, the adhesive in FIG. 2b is heavily irradiated, a crosslinking reaction is also initiated in the shielded adhesive regions 33, but only a very slight crosslinking is achieved within the selected irradiation times. Therefore, bonding with the second security element subelement is still possible without problems, and the adhesive regions 33 harden within the composite 5 on their own. Also suitable are dual-cure systems.

Now, the second carrier substrate 21 and the embossing lacquer layer 25 are peeled off, for example by a separating winding. The result is shown in Fig. 2e. The regions of the second functional layer 22 lying over the adhesive regions 34 were removed together with the second carrier substrate and the embossing lacquer layer, while the regions of the second functional layer 22 bonded to the adhesive regions 33 were pulled off the embossing lacquer layer. The glued areas now form second functional areas 23 with second recesses 24 in between. The first recesses 14 and the second recesses 24 are exactly congruent and together form an opening 3 passing through both functional layers. Of course, the first functional regions 13 and the second functional regions 23 are also exactly congruent.

As a second security element sub-element, for example, a hot stamping foil can be used. In this case, only the second carrier substrate 21 would be stripped off during the separation winding, while the embossing lacquer layer 25 remains on the formed security element 1. It can also serve as a protective layer. In general, the provision of a protective layer (not shown in the figure) over the second functional areas or the second functional layer is expedient. If multilayer security elements are to be produced, the method described can also be repeated. Thus, on the security element 1 shown in FIG. 2e, a further adhesive layer can be applied and irradiated through the functional layers. Thus, another security element subelement (as shown in FIG. 2c) can be combined.

In Fig. 2b is indicated by the reference numeral 40, an external exposure mask. The use of external masks is required when one of the functional layers is to contain functional areas at locations where the other functional layer has recesses. If the recesses are correspondingly large, there are no problems with regard to the achievable precision. In the cross section shown in FIG. 2b, the two recesses 14 in the first functional layer 12 respectively correspond to beams of the solar motif shown in FIG. The rays are very fine and therefore rather unsuitable for use with an additional external exposure mask. If one imagines that one of the recesses corresponds to the solar disk, then there would be a relatively large recess in terms of area, into which a further representation can be integrated, for example the EURO symbol 41 shown in FIG. 1. If the first security element partial element 10 is irradiated with the gold-colored first functional layer 12, as shown in Fig. 2b, but in the region of that recess 14, which corresponds to the sun disc, directly under the support substrate 11, an exposure mask such as the exposure mask 40 is mounted in the form of the EURO symbol, so hardens the adhesive layer in a corresponding area is not enough. When glued to the second security element partial element 20, the silver-colored second functional layer 22 also adheres in these areas. In addition to the second functional regions 23, a second functional region 41 integrated into the solar disk is excluded. formed, in the case described the EURO symbol, which seems to float within the transparent solar disk. When using different materials for the functional layers, both functional layers become visible from one viewing side at the same time. In the present case (FIG. 1), a transparent sun in a gold-colored hologram, in the interior of which a silver-colored hologram in the form of the EURO symbol hovers, is seen in plan view of the first functional layer.

Figures 3a to 3e show the same security elements sub-elements 10 and 20 as the figures 2a to 2e. Like reference numerals designate like elements. In contrast to FIGS. 2 a to 2 e, however, here the adhesive layer 30 is applied to the first carrier substrate so that during irradiation with the first functional layer 12 as radiation mask (FIG. 3 b), the irradiation mask is not directly adjacent to the adhesive layer to be irradiated , With the arrangement shown in FIG. 2, therefore, a more precise imaging and thus also a more precise reproduction of very fine structures can generally take place.

As can be seen from FIGS. 2e and 3e, the variants shown also result in different layer sequences in the finished security element 1. In the variant shown in FIG. 2, both functional layers 12 and 22 are arranged on the same side of the carrier substrate 11, while they are at the variant shown in Fig. 3 are on different sides of the carrier substrate.

In the variants of the present invention shown in FIGS. 4 and 5, the adhesive layer 30 is applied to the second security element subelement 20. Otherwise, the illustrations correspond to the Figures 4a to 4e and 5a to 5e the representations of Figures 2a to 2e and 3a to 3e. Like reference numerals designate like elements.

In the variants of the present invention shown in FIGS. 4 and 5, the adhesive layer 30 is applied to the second functional layer 22 of the second security element partial element. In order to be able to use the first functional layer 12 of the first security element partial element 10 as an irradiation mask, the two security element partial elements must be joined together before the irradiation to form the composite 5. This is possible with different orientation of the first security element subelement, as shown in Fig. 4c and Fig. 5c. In the variant according to FIG. 4c, the first functional layer 12 is adhesively bonded, and in the variant according to FIG. 5c the first carrier substrate 11 is glued. In order to avoid a full-surface bonding, an adhesive must be used which does not cause sticking when the two safety element sub-elements, as required for the irradiation, contact each other. The above tack-free adhesives satisfy this condition. So that the partial elements do not shift against each other during the irradiation, they can be provisionally fixed by means of a weak laminating adhesive. After curing of the irradiated adhesive regions 34, the two security element sub-elements 10 and 20 are then glued together by means of the non-irradiated adhesive regions 33 under increased pressure and elevated temperature. The diffraction structure 13 'of the first functional regions 13 is transferred into the adhesive layer, as shown in FIG. 4d. The adhesive thus acts like an embossing lacquer layer.

Because of the immediate proximity of the radiation mask (first functional layer 12) and the irradiated adhesive layer, a better imaging precision is possible in the variant according to the invention according to FIG. 4c as in the variant of FIG. 5c. A disadvantage with regard to the edge sharpness which can be achieved during the separation is the effect in both variants that not only the second functional layer 22 but also the adhesive layer 30 has to be severed (see FIGS. 4e and 5e).

Figures 2 to 5 describe the present invention by the use of a radiation deactivatable (curing) adhesive. Similarly, a radiation-activatable adhesive can also be used. In this case, the regions 34 of the adhesive layer 30 would stick to the second functional layer 22, but the regions 33 would not.

Figures 6a to 6e show the variant of the present invention, in which a thermoplastic resist is used as an adhesive. Like reference numerals again designate like elements as in the previous figures.

6a shows a first security element partial element 10 with the first carrier substrate 11, embossing lacquer layer 15 with embossed diffraction structure 15 ', a metallization applied thereon as the first functional layer 12 and a resist lacquer layer 35 in the form of the desired motif. Fig. 6a shows aiso the state of the first security element partial element 10 in which the photoresist 35 has already been irradiated and developed. Specifically, as shown in FIG. 6f, the photoresist 35 is irradiated through a mask, the mask being patterned to irradiate only those portions of the photoresist 35 in which recesses 14 are to be formed. In the embodiment shown, therefore, a positive photoresist is used. The use of a negative photoresist would require irradiation in the areas where the resist areas are to be formed. After the irradiation, the photoresist is developed with a suitable developer, whereby the security element subelement 10 shown in Fig. 6a is obtained.

By etching, the regions of the first functional layer 12 which are to form first recesses 14 are subsequently removed (FIG. 6 b). FIG. 6c shows a second security element subelement 20 that is identical to the security element subelement shown in FIG. 2c. The two elements shown in FIGS. 6b and 6c are assembled into a composite 5, as shown in FIG. 6b. The layer sequence is the same as in the composite 5 shown in FIG. 2 d. The pressure-sensitive, in particular thermoplastic resist lacquer is activated by increased pressure and elevated temperature and now bonds with the latter in the regions in which it is in contact with the second functional layer 22 functional layer. At the same time, the diffraction structure is transferred into the adhesive. After stripping off the second carrier substrate 21 and the embossing lacquer layer 25, for example by means of a separation winding, the security element 1 shown in FIG. 6e is obtained, which appears to be identical to the security element 1 shown in FIG. 2e. In the case of the security element shown in FIG. 2e, however, there are still adhesives in the recesses which can optionally be used for additional effects (for example, can be colored), whereas in the security element shown in FIG. 6e no adhesive is present in the recesses. According to a further variant of the present invention, security element subelements with adhesive, in particular thermoplastic, resist adhesive, such as that shown in FIG. 6b, can be combined with security elements which already have a plurality of functional layers, such as the security element 1 shown in FIG. 2e , The method according to the invention allows a register-accurate and edge-sharp formation of very fine structures with a width or a diameter of about 50 μm or less.

Instead of a second security element subelement, in which the motif of the functional layer is a metallized hologram or another metallized diffraction structure, a second security element subelement can alternatively be used, which has a carrier substrate with a layer formed thereon, which is used to form a metallized hologram or another metallized diffraction structure is suitable, has. For example, instead of the second security element subelement illustrated in FIG. 2c, an embossed metal donation foil 20 shown in FIG. 7a can be used without embossing, which has a carrier substrate 21 with a metallization 220 formed thereon. The metallization 220 of the metal donut foil 20 is glued to the adhesive layer 30 analogously to the method according to the invention shown in FIG. 2 d. By separating the second carrier substrate 21 from the bonded composite 5, the metallization 220 is formed into regions 23 as shown in FIG. 7b. The regions 23 shown in FIG. 7b are suitable regions for forming diffraction structures. Subsequently, embossing is performed under pressure and temperature to form the regions 23 into metallized diffraction structures. The result is shown in Fig. 7c. In this case, the embossing tool can be, for example, an embossing cylinder, a normal embossed foil or a metallised embossed foil. The use of a metal donut foil without embossing as the second security element subelement allows optimum freedom in setting the metal adhesion and perfect uniformity, so that a metallization transfer succeeds even at low temperatures. The security elements according to the invention can be provided in the form of transfer materials, ie films or tapes having a multiplicity of finished security elements prepared for the transfer. In the case of a transfer material, the layer structure of the later security element is prepared on a carrier material in the reverse order in which the layer structure is later to be stored on a valuable object, the layer structure of the security element being in continuous form or already in the final outline form used as security element can be prepared on the substrate. The transfer of the security element onto the valuable item to be secured takes place with the aid of an adhesive layer, which is typically provided on the transfer material, but can also be provided on the valuable item. Preferably, a hot melt adhesive is used for this purpose. If the security element is prepared in an endless form, an adhesive layer can be provided for transfer either only in the areas of the security element to be transferred, or the adhesive is activated only in the areas to be transferred. The carrier material of the transfer elements is usually deducted from the layer structure of the security elements during or after their transfer to the valuable article. In order to facilitate the detachment, a separating layer (release layer) can be provided between the carrier material and the part of the security elements to be detached. Optionally, the carrier material can also remain on the transmitted security element.

The security elements according to the invention can be used to authenticate goods of any kind. Preferably, they are used to authenticate value documents, for example banknotes, checks or identity cards. They can be arranged on a surface of the value document or completely or partially in the value document will be embedded. With particular advantage they are used in value documents hole hole hole. In this case, the advantages of the security elements according to the invention with transparent carrier substrates and motifs to be considered from both sides of the value document can be particularly beautifully emphasized. Even negatives with the finest structures can be clearly recognized in transmitted light. You are in the achievable according to the invention precision of a counterfeiter practically imitated. A detachment of the security elements to transfer them to another valuable item, is practically not possible, because the security elements according to the invention always contain at least two adhesive layers, or they contain an adhesive layer and are connected with a further adhesive layer with the valuable object to be secured. If, for the bonding of the security element to the object of value, an adhesive is used which, in terms of its chemical and physical properties, is similar to the adhesive in the layer structure of the security element, the layer structure of the security element is always destroyed during detachment attempts.

Claims

Patent claims

1. A method for producing a security element (1) for a security paper or a valuable article (2), comprising the following steps:

a) providing a first security element subelement (10), comprising

a first carrier substrate (11),

a first functional layer (12) having first functional regions (13) and first recesses (14),

optionally a layer (35) of photoresist adhesive on the first functional layer (12), which is congruent with the first functional areas (13),

b) providing a second security element subelement (20), comprising:

a second carrier substrate (21),

a second functional layer (22) on the second carrier substrate (21) or on an intermediate layer (25) between the second

Carrier substrate and the functional layer, wherein the second functional layer (22) from the second carrier substrate (21) or the intermediate layer (25) is removable,

c) forming an adhesive layer (30) of a radiation-conditionable adhesive on the first (10) or the second (20) unit element, provided that no layer (35) of photoresist adhesive is provided on the first functional layer (12) of the first security element subelement (10),

cl) on the side of the first functional layer (12) of the first security element partial element (10) or

c2) on the side of the first carrier substrate (11) of the first security element subelement (10), or

c3) on the side of the second functional layer (22) of the second security element partial element (20),

d) assembling the first (10) and second (20) security element subelements into a composite (5) such that

dl) if the adhesive is provided on the first security element subelement (10), the adhesive layer (30, 35) and the second functional layer (22) of the second security element subelement (20) face one another, or

d2) when the adhesive is provided on the second security element subelement (20), either the adhesive layer (30) and the first functional layer (12) of the first security element subelement (10) or the adhesive layer (30) and the first carrier substrate (11 ) of the first security element partial element (10) face one another,

e) irradiating the adhesive layer (30) in cases where a radiation-conditionable adhesive is provided, el) after assembling the composite (5) through the first security element subelement (10) or

e2) in cases cl) and c2), in which the radiation-conditionable adhesive is provided on the first security element subelement (10), alternatively by assembling the composite (5) by irradiating the first security element subelement (10) passing through the first functional layer (12),

wherein the first functional layer (12) of the first security element

Sub-element (10) acts as an irradiation mask, so that in the adhesive layer (30) with the first functional areas (13) congruent unirradiated areas (33) and with the first recesses (14) congruent irradiation conditioned areas (34) are formed,

f) bonding the first (10) and the second (20) security element subelement, preferably under elevated pressure and elevated temperature, wherein the bonding either through the non-irradiated areas (33), or through the conditioned areas (34) of Adhesive layer (30), or is caused by the areas with photoresist adhesive (35),

g) separating the second carrier substrate (21) from the bonded composite (5), wherein the second functional layer (22) to form second functional regions (23) either

gl) adheres to the non-irradiated areas (33) of the adhesive layer (30) at the conditioned areas (34) of the adhesive layer (30) but does not adhere and is separated together with the second carrier substrate (21), or

g2) adheres to the conditioned areas (34) of the adhesive layer (30) but does not adhere to the non-irradiated areas (33) of the adhesive layer (30) and is severed together with the second carrier substrate (21), or

g3) adheres in the areas with photoresist adhesive (35) but does not adhere in the areas without photoresist adhesive (35) and is separated off together with the second carrier substrate (21).

2. The method according to claim 1, characterized in that a radiation-curable adhesive is used as the radiation-conditionable adhesive and the conditioning of the regions (34) consists in a loss of the adhesive force of the adhesive in these areas due to cross-linking of the adhesive.

3. The method according to claim 1, characterized in that a radiation-activatable adhesive is used as the radiation-conditionable adhesive and the conditioning of the regions (34) consists in obtaining the adhesiveness of the adhesive in these areas.

4. The method according to any one of claims 1 to 3, characterized marked, that as the first carrier substrate (11) a transparent or translucent film is used.

5. The method according to any one of claims 1 to 4, characterized in that the first security element sub-element (10) is made by

Providing a first carrier substrate (11),

Applying a first embossing lacquer layer (15) to the first carrier substrate (11),

Applying a first metallization (12) to the first embossing lacquer layer (15),

Embossing the first embossing lacquer layer (15) before or after the application of the first metallization (12), and

Forming first recesses (14) in the first metallization (12).

6. The method according to any one of claims 1 to 5, characterized marked, that the second security element sub-element (20) is made by

Providing a second carrier substrate (21),

Applying a second embossing lacquer layer (25) to the second carrier substrate (21),

Applying a second metallization (22) to the second embossing lacquer layer (25), Embossing the second embossing lacquer layer (25) before or after the application of the second metallization (22), and

Forming second recesses (24) in the second metallization (22).

7. The method according to any one of claims 1 to 6, characterized in that the irradiation in step e) is also carried out by a second irradiation mask (40).

8. security element (1) for attachment to or at least partial introduction into a security paper or a valuable article (2), which is obtainable by a method according to any one of claims 1 to 7 and is composed of several layers, each extending over the entire security element (1) or over portions of the security element, the layers having at least the following layers:

a carrier substrate (11),

a first functional layer (12) having first functional regions (13) and first recesses (14) forming a predetermined motif,

a second functional layer (22) having second functional areas (23) and second recesses (24) forming a motif, wherein the motif of the second functional layer (22) is defined by the motif of the first

Functional layer (12) is conditional and, when viewed on top of the security element (1), is congruent with it or is its photographic negative, and an adhesive layer (30; 35) disposed between the first (12) and second (22) functional layers and adhered to at least the second functional layer.

9. Security element (1) according to claim 8, characterized in that the carrier substrate (11) is a transparent or translucent film.

10. Security element (1) according to claim 9, characterized in that the first (14) and the second (24) recesses together in

Transmitted light and preferably also in incident light visually recognizable characters (3) form.

11. Security element (1) according to claim 8 or 9, characterized in that the motif of the first functional layer (12) and the

Motive of the second functional layer (22) together form an intarsia pattern.

12. Security element (1) according to one of claims 8 to 11, characterized in that the second functional layer (22) further second

Functional areas (41), which are not due to the motif of the first functional layer (12).

13. Security element (1) according to one of claims 8 to 12, characterized in that the first functional layer (12) and the second

Function layer (22) by means of the adhesive layer (30, 35) are glued directly together.

14. Security element (1) according to one of claims 8 to 13, characterized in that the first functional layer (12) and / or the second functional layer (22) is a metallized diffraction structure.

15. Transfer material for transferring security elements to a security paper or a valuable article (2), characterized in that it has a plurality of security elements (1) designed as transfer elements according to one of claims 8 to 14.

16. Security paper or valuables (2), such as a banknote, a

Check or identity card, characterized in that it comprises a security element (1) according to one of Claims 1 to 14.

17. A method for producing a security paper or a valuables item (2), characterized in that a security element (1) according to any one of claims 8 to 14 applied thereto or at least partially introduced therein.