EP2335226A1

EP2335226A1 - Structure comprising at least two integrated microcircuit devices with contactless communication

Info

Publication number: EP2335226A1
Application number: EP09812765A
Authority: EP
Inventors: Sandrine Rancien; Thibault Le Loarer; Henri Rosset
Original assignee: ArjoWiggins Security SAS
Current assignee: ArjoWiggins Security SAS
Priority date: 2008-09-12
Filing date: 2009-09-07
Publication date: 2011-06-22
Also published as: FR2936075A1; RU2011113206A; CA2736832A1; RU2470370C1; WO2010029489A1; BRPI0918167A2; FR2936075B1; US20110215909A1; MX2011002639A

Abstract

The invention relates to a structure (1) comprising at least two separate integrated microcircuit devices with contactless communication, each comprising at least one chip (2, 3) and at least one antenna (5), said at least two integrated microcircuit devices being placed in or on the structure (1) such that any simultaneous reading of more than one of the integrated microcircuit devices by an external reader is impossible in at least one position of the structure (1) relative to the external reader.

Description

Structure comprising at least two integrated microcircuit devices with contactless communication

The present invention relates to the field of security and / or identification documents. Background

To guard against counterfeiting or falsification of security documents and / or identification and to increase the level of security of these documents, it is known to incorporate integrated microcircuit devices, including RFID (devices for radio frequency identification). These devices, for example in the form of a chip associated with an antenna, make it possible to store and possibly modify information specific to the wearer or the object to which they relate, the type of document issued or the history of the events.

For example, plastic identity cards comprising a contactless integrated microcircuit RFID device made from an assembly of polymeric layers are known, for which, in the event of failure or deterioration of the RFID device, it can be difficult. even impossible to read the data contained in the device so that the identification of the holder of the identity card can become complicated, if not impossible.

In addition, the data contained in the RFID device incorporated in these cards are generally linked to a specific database or in connection with a single application and generally only allow a single authentication of the document based on the data contained in this device .

There are also so-called multi-application contact smart cards such as Visa bank cards in which one incorporates a Moneo ™ electronic purse or electronic badges that allow access to lounges and also to freely take the card. public transportation to the lounge. These cards have a single contact chip or a dual chip capable of operating with contact or contactless, this chip being equipped with various applications.

Such a multi-application contact smart card is not always desired, especially by application providers who, for security reasons, prefer not to share the same chip with other different application providers. Indeed, the risk exists that a given application can allow access to data relating to a different application present on the same contact chip multi-applications. For this type of multi-application chip, it is therefore necessary to ensure total sealing between the various compartments of the chip in charge of the various applications. The term "application" means a set of computer programs intended to help a user to perform a usage operation. It is in particular a software or a set of software. summary

There is a need to further strengthen the security and identification processes of security documents and / or identification, in particular to increase the difficulty of counterfeiting of these documents.

In particular, there is a need to take advantage of several independent RFID devices on the security document or identification to fight against falsification or counterfeiting, to address the problems of failure and deterioration of integrated microcircuit devices.

There is also a need for security documents and / or identification "multi-applications" embedding several RFID devices with integrated microcircuit contactless independent devices that can control different applications and possibly address different databases, allowing to answer to various uses or functions.

One of the aims of the present invention is therefore to propose a security structure allowing a level of security and resistance to forgery or high counterfeiting and multiple use of the security structure and in particular of several independent applications of each other . The object of the invention is thus, according to one of its aspects, a structure comprising at least two distinct non-contact communication microcircuit devices each comprising at least one chip and at least one antenna, said at least two integrated microcircuit being arranged so that any simultaneous reading of more than one of the integrated microcircuit devices by an external reader is impossible in at least one position of the structure relative to the external reader.

The positioning of the structure to allow reading of at least one microcircuit device integrated by the external reader can be done in various ways known per se, for example by inserting the structure in a housing of the external reader, by moving the structure relative to the external reader, by placing one of the faces of the structure against the external reader, among others.

Simultaneous reading of more than one of the integrated microcircuit devices by an external reader may be impossible in any position of the structure relative to the external reader.

The structure can thus be flexible or rigid to facilitate or not the reading of one or more integrated microcircuit devices.

Preferably, the reading of at least one integrated microcircuit device of the structure can be done without deformation of the structure, particularly mechanical, for example without folding of the structure.

The external reader can be put in communication with the structure.

The external reader may be configured to read each of the integrated microcircuit devices, and in particular configured to operate according to the ISO 14443 standard. The subject of the invention is also a structure comprising at least two integrated microcircuit devices with contactless communication, the devices with integrated microcircuit being separated in pairs by a distance greater than the sum of the reading distances of the integrated microcircuit devices with an external reader, in particular greater than 10 mm, and / or being separated from each other by a electromagnetic disturbance system.

The distance between the two integrated microcircuit devices may correspond to the distance separating the chips from the devices, in particular the planes and / or the chip centers, or the distance separating the antennas from the devices, in particular the planes and / or the antenna centers. . In particular, the integrated microcircuit devices may be adjacent to opposite ends of the structure or positioned on opposite sides of the structure, one device being present on the front of the structure and the other device on the back.

The invention can make it possible to prevent simultaneous reading of the data contained in the two integrated microcircuit devices by the external reader without resorting to "anti-collision" systems at integrated microcircuit devices.

Such systems are for example described in ISO 14443, ISO 15693 and

ISO 18000. The invention also makes it possible to access data and / or applications of a single integrated microcircuit device without having recourse to an external reader of the terminal type capable of selecting the application that it wishes to operate.

In particular, only one of the integrated microcircuit devices can be read by the external reader in at least one position of the structure relative to the external reader, for example when the user presents the front or the back of the structure to the reader. external or when it has one or other of the ends of the structure to the external reader.

In particular, in at least one position of the structure relative to the external reader, only the applications relating to one of the integrated microcircuit devices are active, while the applications relating to the other integrated microcircuit device are maintained at rest. .

Thanks to the invention, it is possible to benefit from a security structure having at least two security levels associated with the two integrated microcircuit devices, thus making it possible, for example, to increase the security of the authentication process and to increase the security of the authentication process. the difficulty of counterfeiting.

Thanks to the invention, it is still possible to authorize the reading of one of the integrated microcircuit devices after reading the other integrated microcircuit device, in particular according to the result of this first reading, the reading of the first RFID device thus serving as Basic Access Control for reading the second device

RFID.

Thanks to the invention, it is also possible to have a structure capable of serving several applications, including a specific application associated with each integrated microcircuit device without contact. For example, the structure may be incorporated into a security and / or identification document such as an access card and allow for example both a use as a photocopy card and canteen card.

The structure may further incorporate a first integrated microcircuit device on its front and a second integrated microcircuit device on its back and be integrated with an interactive playing card, so that the playing card that contains it has different applications depending on the face of the card that will be presented to an external reader (for example a function to allow a figurine to access a game and a life or weapons purchase function for the figurine in question). According to another embodiment of the invention, the structure may incorporate a first integrated microcircuit device at one of its ends and a second integrated microcircuit device at its other end, so that the access card which contains it must be presented to the external reader according to a specific orientation according to the desired use, especially as a student card or library card.

Thanks to the invention again, it is possible to benefit from a structure comprising two RFID devices whose content is redundant or two RFID devices allowing access to the same database, thus making it possible to remedy the problems of failure and / or or deterioration possibly encountered on one of the contactless RFID devices.

In an exemplary implementation of the invention, the structure comprises two integrated microcircuit devices, on either side of a larger than wide electromagnetic disturbance system. Each device may be sandwiched within a set of two inner layers, for example a synthetic material. The sets of inner layers can be separated by the disturbance system. The latter is for example a strip of metal, for example aluminum. The inner layer sets and the disturbance system can be sandwiched between outer layers. Spacers can connect these outer layers to the periphery of the structure. Integrated microcircuit device

Non-contact integrated microcircuit devices result from the association of a chip with at least one antenna.

A chip comprises for example a semiconductive base, generally a doped silicon wafer, sometimes made of a semiconductor polymer, and also generally comprises a memory, or even one or more microprocessors, for processing data. To function, it can receive the energy of a battery or a battery or be powered by a source of electrical energy brought by contact and / or without contact, that is to say in the latter case, to distance via a communication interface via an antenna. The chips with antenna are called "transponders" and generally use radio frequency or ultra high frequency waves.

In the case where the integrated microcircuit device is said to be "passive", the chip is supplied without contact inductively or capacitively. In the case where the integrated microcircuit device is said to be "active", the chip may include a battery, also called "micro-battery", integrated in its microcircuit or be connected to a micro-battery built into the structure. By "battery" is meant a source of energy of electrochemical origin, rechargeable or not. The chip can still be powered by a photovoltaic or piezoelectric system.

At least one integrated microcircuit device may be able to communicate with an external reader. "External reader" designates any device that makes it possible to communicate with an integrated microcircuit device and to remotely power it in the particular case of passive systems, to activate it, to authenticate it, to read data that are therein. are contained, to receive these data and if necessary, to modify them, or even to delete them partially or totally. The external drive can operate remotely or require contact.

The two RFID devices are, in particular, non-contact integrated microcircuit devices advantageously adapted to contactless communication technology, for example such as that described in the ISO 14443 standard.

One of the integrated microcircuit devices according to the invention can also be contactless communication and contact communication, allowing both a reading with and without contact. This device may in particular comprise two electronic modules, one for contact technology (ISO 7816 standard), the other for contactless technology (ISO 14443 standard), for example for a hybrid smart card or a dual electronic module. contact / contactless side for dual chip card.

At least one of the integrated microcircuit devices may advantageously comprise an antenna embedded on the integrated microcircuit, the device being for example of the AOB ("Antenna On Board") type.

There are "MM chip" chips, provided by the FEC company, which use the technology corresponding to the ISO 14443 standard but which can also use the technology corresponding to the ISO 18000-6c standard, these chips can indeed communicate to frequencies between 13.56 kHz and 2.45 GHz. At least one of the integrated microcircuit devices may also advantageously comprise, for example in addition to an on-board antenna, a coupling antenna, more commonly known as an "antenna booster", in coupling or connected to the integrated microcircuit device, which makes it possible to increase the reading distance of the integrated microcircuit with an external reader.

The coupling antennas of the integrated microcircuit devices may be separated in pairs by a distance greater than the sum of the reading distances of the integrated microcircuit devices with an external reader, in particular greater than 10 mm, and / or separated one by one. on the other by an electromagnetic disturbance system.

The two integrated microcircuit devices may be located facing or not, symmetrically or not, particularly with respect to the electromagnetic disturbance system and / or with respect to a longitudinal or transverse axis of the structure. The antenna of at least one integrated microcircuit device may be of the filament type, printed, in particular screen-printed, etched, glued, transferred, chemically deposited, ultrasonically deposited, electroplated or worn by the integrated microcircuit devices.

The antenna of at least one integrated microcircuit device may be carried by a constituent layer of the structure, for example a fibrous layer, a polymer layer or an adhesive layer.

The antenna can be located on one of the faces of the structure or a constituent layer of the structure, or be incorporated totally therein.

The antenna can also be made on one side of a constituent layer of the structure before assembly of this layer with another layer of the structure.

The reading of one of the integrated microcircuit devices can be performed only after reading the other integrated microcircuit device. In particular, the reading of one of the integrated microcircuit devices can only be performed by an external reader if the result of the reading of the other microcircuit device integrated by the external reader corresponds to an expected result.

The integrated microcircuit devices according to the invention may comprise identical or different data. They can also allow access to the same or different applications or databases.

In the case where integrated microcircuit devices contain identical data or allow access to the same applications or databases, the invention can advantageously allow the identification and / or use of the structure in case of deterioration or failure of one of the integrated microcircuit devices, in particular via the other integrated microcircuit device.

In the case where the integrated microcircuit devices comprise different data and / or allow access to different applications or databases, the structure according to the invention can be multi-applications, allowing for example different uses or different identification process depending on the integrated microcircuit device that is read by an external reader.

At least one of the integrated microcircuit devices, preferably the two integrated microcircuit devices, may be located on one of the faces of the structure or a constituent layer of the structure.

According to a preferred embodiment, at least one of the integrated microcircuit devices, preferably both integrated microcircuit devices, may be incorporated at least partially in the structure or a constituent layer of the structure. The two integrated microcircuit devices may be respectively located on different faces of the structure or one or two layers constituting the structure.

The two integrated microcircuit devices may be incorporated at least partially into two different constituent layers of the structure. At least one integrated microcircuit device, preferably both integrated microcircuit devices, can be visible at least partially on one of the faces of the structure.

According to one exemplary embodiment, at least one integrated microcircuit device, preferably the two integrated microcircuit devices, can be flush with at least one face of the structure or of a layer constituting the structure, or even with each of the faces of the structure or a constituent layer of the structure.

The two integrated microcircuit devices can also respectively flush with different faces of the structure or one or two layers constituting the structure. At least one of the integrated microcircuit devices can be visible on the structure. For example, the structure may comprise a transparent or translucent material making it possible to see at least one of the integrated microcircuit devices. The two integrated microcircuit devices can be separated from each other by a distance sufficient to prevent simultaneous reading of the two integrated microcircuit devices by the same external reader. The distance may in particular be greater than the sum of the reading distances of the integrated microcircuit devices with an external reader. The distance separating the two integrated microcircuit devices may for example be greater than 10 mm.

According to an exemplary embodiment, at least one of the integrated microcircuit devices may comprise a coupling antenna increasing the reading distance of the integrated microcircuit by an external reader. When the structure does not include an electromagnetic disturbance system, the booster antenna is chosen such that the sum of the reading distances of the integrated microcircuit devices with an external reader remains less than the distance separating the integrated microcircuit devices.

Each of the two integrated microcircuit devices may for example be located at a different end of the structure. In particular, integrated microcircuit devices may be adjacent to opposite ends of the structure.

According to one exemplary embodiment, at least one of the integrated microcircuit devices may be carried by a wire or a strip incorporated into the structure, the wire or the strip being able to consist for example of (e) polymer, paper, fabric, knit or a mixture of these constituents.

According to another embodiment, at least one of the integrated microcircuit devices can be carried by a transparent security film for the protection of variable data, laminated on the outer face of a constituent layer of the structure. According to yet another exemplary embodiment, at least one of the integrated microcircuit devices may be carried by an optical effect foil laminated with or without the addition of an adhesive on the outer face of a constituent layer. of the structure. Electromagnetic disturbance system

The two integrated microcircuit devices can still be separated from each other by an electromagnetic disturbance system. In particular, the two integrated microcircuit devices can be located on either side of the electromagnetic disturbance system. "Electromagnetic interference system" means an element that disrupts the coupling of at least one of the two integrated microcircuit devices without contacting the reader when the structure comprising the RFID devices is presented in front of the reader so that an external reader can read only one of the integrated microcircuit devices.

The electromagnetic disturbance system may for example be arranged between the two integrated non-contact microcircuit devices and only allow reading of only one of the non-contact integrated microcircuit devices, in particular that which is on the side of the structure placed in front of the device. reader, thus blocking the communication of the reader with the second non-contact microcircuit device by blocking, in particular totally or partially, the electromagnetic field generated by the external reader and the remote power supply of the device in the particular case of so-called passive devices.

The electromagnetic interference system may comprise means for attenuating electromagnetic coupling of the magnetic material, conductive material or resonator circuit type.

The electromagnetic interference system may be formed using at least one of the following elements: a support, in particular a film, made of plastic laminated or laminated with at least one metal film, for example an aluminum film or copper, a metallized support, in particular by metallization under vacuum or by chemical treatment, the support being able to be chosen from a plastic film, a paper, a textile or a nonwoven, a support, in particular of paper or plastic charged with an electrically conductive filler such as carbon black or carbon fibers, metal fibers, metallized fibers, metal flakes, metal powder or with a conductive agent such as a salt, in particular sodium or ammonium chloride, a crisscrossed wire support, in particular a woven fabric, a knit fabric, a grid, at least a portion of the wires being made of electrically nducer, for example metal, a nonwoven support comprising conductive fibers, for example metal fibers, optionally mixed with synthetic fibers, a support, in particular a film, having a perforated metal structure, a metal film, an electrically conductive lacquer or an electrically conductive paint, for example based on copper, nickel or silver, - an electrically conductive polymer such as the polypyrrole, polyacetylene and polythiophene, an electrically conductive adhesive, a material comprising carbon nanotubes.

The electromagnetic interference system may also be formed using at least one of the following elements: a support, in particular a film, made of plastic laminated or laminated with at least one magnetic film, a support with a magnetic coating, deposited for example under vacuum or by chemical treatment, - a support, in particular paper or plastic, loaded with a magnetic charge such as ferrites, a support, in particular a film, having a perforated structure of magnetic material, a magnetic film - a varnish or a magnetic paint, an adhesive comprising magnetic particles, a material comprising magnetic nanoparticles. The electromagnetic disturbance system may extend partially or totally over the surface of the structure. In a particular case, the disturbance system may have various shapes and / or dimensions, adapted to disturb the reading and / or the non-contact writing of one of the RFID devices when the structure is presented according to a certain orientation in front of the reader .

For example, the electromagnetic interference system may have a rectangular, square, curved, for example circular or elliptical contour.

The electromagnetic disturbance system can form a solid pattern. Alternatively, the electromagnetic disturbance system may be in the form of a band closing on itself, this band being for example substantially rectangular or circular. In a particular case, the electromagnetic interference system may take the form of an antenna-type resonator circuit.

According to another exemplary embodiment, the electromagnetic interference system may form a perforated pattern, for example a grid pattern.

The electromagnetic disturbance system can define at least one pattern contributing to the aesthetics of the structure, this pattern may be for example an alphanumeric character, a symbol, a logo or a drawing.

The electromagnetic interference system may be wholly or partially transparent, translucent or opaque.

Electronic devices other than integrated non-contact microcircuit devices At least one integrated non-contact microcircuit device may be associated, for example connected, with one or more electronic devices selected from the following list: electroluminescent system, in particular LED or OLED, a display device, for example a screen, a sensor, a coupling antenna, a switch, an integrated microcircuit device with contact.

At least one of the integrated microcircuit devices may comprise one or more onboard electronic devices mentioned above. Alternatively, the electronic device or devices may be independent of the integrated microcircuit device, preferably being connected to the integrated microcircuit device by a wire, optical or radio link, for example by inductive coupling.

The electronic device or devices can be supplied with electricity by a battery present on one of the integrated microcircuit devices, in particular by an on-chip microbattery.

The one or more electronic devices can still be powered by an external battery or battery, not present on one of the integrated microcircuit devices, for example a flexible thin film battery that is distinct from a chip or by a chip. photovoltaic cell or a piezoelectric device, for example at least partially printed.

The electronic device or devices can still be powered by capacitive or inductive coupling, for example during a communication between one of the integrated microcircuit devices and an external reader.

The electronic device (s), and possibly the associated supply device (s), for example one or more batteries, may be housed in the thickness of one of the layers of the structure, or alternatively may be made by printing on the one of the layers of the structure. In an exemplary embodiment, the electronic device or devices are added to the structure as additional security means that may or may not interact with the outside. For example, the electronic device may be a switch that operates a light emitting device.

The electronic device or devices may correspond to a detector. The detector may be configured to detect a change of at least one physicochemical magnitude. The detection can be performed outside the reading field of an external reader capable of obtaining at least one information relating to said change from one of the integrated microcircuit devices, and the integrated microcircuit device can be configured to signal to the external reader during a communication with the latter, an attempt to damage the physical integrity of the structure following the detection of a corresponding change in said at least one physicochemical quantity.

The integrated microcircuit device is advantageously able to keep in memory the change or changes.

By "physicochemical quantity" is meant an intrinsic characteristic parameter or property of the structure or of an element present in or on the structure, the value of this parameter or of this property being modified during an intrusion or an physical violation of the structure.

In another exemplary implementation of the invention, the electronic device or devices are incorporated into the structure for the purpose of adding a particular functionality, for example associated with one of the integrated microcircuit devices or other device. electronic. For example, an electronic device may be a photovoltaic cell that recharges a battery used by a sensor. Structure

The structure according to the invention may be totally opaque, totally transparent or partially transparent, in particular by the presence of a transparent or translucent zone. The structure according to the invention may be monolayer or multilayer, consisting for example of one or more constituent layers, in particular fibrous and / or polymeric layers.

The constituent layers of the structure may have identical or different thicknesses, for example between 50 and 400 microns. The structure may comprise a fibrous layer. In particular, the fibrous layer may be based on cellulosic fibers, for example cotton fibers, and / or synthetic fibers, for example polyamide and / or polyester fibers, and / or natural organic fibers other than cellulosic fibers. and / or mineral fibers.

The structure may also comprise a polymer layer, for example in the form of a film, in particular a foamed film or not. In particular, the polymer layer may comprise polyethylene (PE), polyvinyl chloride (PVC), polyethylene terephthalate (PET), polycarbonate (PC), polyester carbonate (PEC), polyethylene terephthalate glycol (PETG), a copolymer of acrylonitrile butadyene styrene (ABS) or a light-collecting film, for example of the "waveguide" type, for example a luminescent film based on polycarbonate sold by Bayer under the name LISA®.

The structure may further comprise a coextruded layer, made from at least one polymeric material, and having a core layer and at least one layer of skin, the core layer having voids. The "core layer" corresponds to a base layer further from the surface of the layer than the "skin layer" which corresponds to a surface layer. The layer may in particular be made as described in applications EP 0 470 760 and EP 0 703 071. For example, it is possible to use for the layer a film based on polyethylene marketed under the name of POLYART® by the company ARJOWIGGINS or a silica-filled polyethylene film marketed under the name TESLIN® by the company PPG INDUSTRIES.

The structure may have a final thickness of between 0.1 and 3 mm, preferably between 200 and 880 μm. The structure may have a constant or variable thickness and in particular the structure may be thinner at the edges.

The structure may be incorporated into a security and / or identification document. In particular, the structure can match or be integrated with a passport slip.

The structure may comprise a transparent pouch, for example a hot-laminated polyester pouch coated with polyethylene such as that marketed under the name Fasfim by the company Fasver.

The structure may also comprise a laminate in the form of two transparent films directly laminated on the outer faces of the structure, these films adhering to the structure via an adhesive or without adhesive by fusion or welding. In one particular case, the two transparent films are fused at the edges.

The structure may comprise several identifiers on one of the constituent layers of the structure, in particular on the front and back sides of the structure, associated respectively with integrated microcircuit devices, in particular with the data contained in each of the integrated microcircuit devices. In particular, the identifiers may be different for each integrated microcircuit device.

In this way, it is possible to identify the function or functionalities of the structure resulting from the data contained in the integrated microcircuit devices, for example in the case of multi-application cards that can be used as a canteen card and a photocopy card, or else as student card and library card, among others, depending on the identifier (s) on the structure.

For example, the structure may include one or more identifiers on its front associated with a first integrated microcircuit device and one or more identifiers on its back associated with a second integrated microcircuit device indicating to a user that the front side must be presented, respectively the back of the structure to an external reader so that it can read and possibly modify the data contained in the first device, respectively the second integrated microcircuit device.

Similarly, the structure may comprise at one of its ends one or more identifiers associated with a first integrated microcircuit device and at its other end one or more identifiers associated with a second integrated microcircuit device indicating to a user that must be presented either one of the ends of the structure to an external reader so that it can read and possibly modify the data contained in the first device, respectively the second integrated microcircuit device.

According to one embodiment of the invention, the identifier or identifiers may for example indicate to the user the orientation of the structure or the card containing the structure that should be adopted before the reader and / or the sense of introducing the structure or card containing the structure into the reader according to the desired use of this card.

The structure may comprise one or more identifiers at at least one of the integrated microcircuit devices, in particular superimposed on the integrated microcircuit device.

The identifier (s) may serve as visual identification means of the integrated microcircuit devices and / or their functionality, on each face and at each of the opposite ends of the structure. The identifier or identifiers may for example correspond to information on the structure, for example printed, pasted, engraved, transferred, written by hand, among others. The identifier or identifiers may for example be variable mentions, a drawing, a logo, a pattern, a color, a raised or protruding relief.

The identifier or identifiers can for example contribute to the aesthetics of the structure.

The structure can result from the assembly of an element comprising one of the integrated microcircuit devices reported on another element comprising the other integrated microcircuit devices.

The structure can also be assembled directly by a user from at least two layers constituting the structure, each comprising in particular one of the integrated microcircuit devices. The assembly can for example be done by bonding the constituent layers or by melting or welding of the constituent layers of the structure without the use of glue or adhesive.

The structure can also be made from a material, in particular a sheet, comprising at least two integrated microcircuit devices, or even more, distributed regularly or not on the material. Advantageously, the integrated microcircuit devices are separated from each other by a distance greater than the sum of the read distances of the integrated microcircuit devices with an external reader.

A user may for example use such a material to manufacture a structure according to the invention, for example by masking some of the integrated microcircuit devices with for example one or more electromagnetic interference devices as a function of the number of integrated microcircuit devices desired, or cutting the material to obtain a material having the desired number of integrated microcircuit devices. Security elements

The structure and / or the constituent layers of the structure may comprise one or more security elements.

Some of the security features are visible to the naked eye, in daylight or artificial light, without the use of a particular device. These security elements comprise for example colored fibers or boards, fully or partially printed or metallized wires. These security elements are called first level.

Other types of security elements are detectable only with a relatively simple device, such as a lamp emitting in the ultraviolet or infrared. These security elements comprise, for example, fibers, boards, strips, wires or particles. These security elements may be visible to the naked eye or not, being for example luminescent under a lighting of a Wood lamp emitting in a wavelength of 365 nm. These security elements are said to be second level.

Other types of security elements still require for their detection a more sophisticated detection device. These security elements are for example capable of generating a specific signal when they are subjected, simultaneously or not, to one or more external excitation sources. The automatic detection of the signal makes it possible to authenticate, if necessary, the document. These security elements comprise for example tracers in the form of active material, particles or fibers, capable of generating a specific signal when these tracers are subjected to optronic, electrical, magnetic or electromagnetic excitation. These security elements are said to be third level. The security elements present within the structure and / or one or more layers constituting the structure may have first, second or third level security features.

The structure may in particular comprise as security elements, inter alia: dyes and / or luminescent pigments and / or interferential pigments and / or liquid crystal pigments, in particular in printed form or mixed with at least one constituent layer of the structure, components, dyes and / or photochromic or thermochromic pigments, especially in printed form or mixed with at least one constituent layer of the structure,

an ultraviolet (UV) absorber, especially in the form coated or mixed with at least one constituent layer of the structure,

a specific light-collecting material, for example of the "waveguide" type, for example a luminescent light-collecting material such as the polycarbonate-based polymer films marketed by Bayer under the name LISA®,

an interference multilayer film,

a structure with variable optical effects based on interferential pigments or liquid crystals,

a birefringent or polarizing layer,

a diffraction structure,

- an embossed image,

means producing a "moiré effect", such an effect being able for example to reveal a pattern produced by the superposition of two security elements on the structure, for example by bringing lines of two security elements closer together,

a partially reflective refractive element,

a transparent lenticular grid,

a lens, for example a magnifying glass, a colored filter.

a security thread incorporated for example in the mass of at least one constituent layer of the structure or in a window, possibly comprising a Positive or negative printed matter, fluorescence, metallic, goniochromatic or holographic effect, with or without one or more demetallized parts,

a foil metallized, goniochromatic or holographic,

a layer with a variable optical effect based on interferential pigments or on liquid crystals,

a flat security element of relatively small size, such as a board, visible or non-visible, in particular a luminescent board,

particles or agglomerates of pigment particles or dyes of the HI-LITE type, visible or non-visible, in particular luminescent, security fibers, in particular metallic, magnetic fibers (with soft and / or hard magnetism), or absorbent or excitable fibers; ultraviolet, visible or infrared, and in particular the near infrared (NIR),

an automatically readable security having specific and measurable luminescence characteristics (for example fluorescence, phosphorescence), light absorption (for example ultraviolet, visible or infrared), Raman activity, magnetism, micro-interaction waves, X-ray interaction or electrical conductivity.

One or more security elements as defined above may be present in the structure and / or in one or more layers constituting the structure or in one or more security elements incorporated in the structure and / or in one or more layers constituting of the structure, such as a wire, a fiber or a board.

At least one of the constituent layers of the structure may also comprise a first level security element such as a watermark or a pseudo-watermark superimposed at least partially on a translucent region of the structure.

The term "watermark or pseudo-watermark" according to the invention, a drawn image that appears in the thickness of the structure.

The watermark or pseudo-watermark can be made in various ways known to those skilled in the art. For this purpose the structure may comprise at least one fibrous or polymeric layer, a substructure, an adhesive layer, an outer layer or a spacer layer as defined below. The structure may in particular comprise: one or more fibrous layers, a substructure comprising a transparent or translucent region, one or more watermarks or pseudo-watermarks carried by at least one of the fibrous layers, the fibrous layer or layers, or substructure comprising at least two integrated non-contact microcircuit devices, advantageously separated from one another by a distance greater than the sum of the reading distances of the integrated microcircuit devices with an external reader, or separated from one another by a electromagnetic disturbance system. When two fibrous or polymer layers each comprise a watermark or pseudo-watermark, the two watermarks or pseudo-watermarks may be different. In particular watermarks or pseudo-watermarks can be complementary in their visual effect or in relation to a concept or an image.

According to an exemplary embodiment of the invention, two outer layers constituting the structure may each comprise a watermark or pseudo-watermark and the structure may comprise a transparent zone so that the two watermarks are visually combined at a region transparency of the substructure when the structure is observed in transmitted light by showing a new pattern.

Advantageously, the two outer layers comprising the watermarks or pseudo-watermarks are fibrous layers. According to another embodiment, the outer layers comprising the watermarks or pseudo-watermarks are polymer layers.

Alternatively, each of the two watermarks or pseudo-watermarks is superimposed at least partially on the transparent region of the structure. According to a particular case of the invention, the substructure may be an electromagnetic interference system made of a transparent material so as to let the light pass and allow the visual combination of the watermarks when the structure is observed in transmitted light.

According to another exemplary embodiment of the invention, two outer layers constituting the structure may each comprise a watermark or pseudo-watermark and the structure may comprise a translucent but non-transparent zone, so that each of the two watermarks or pseudo-watermark -filigranes is observable in light transmitted to through the structure at the level of the translucent region that the face of the structure adjacent to the outer layer that comprises it.

Alternatively, each of the two watermarks or pseudo-watermarks is superimposed at least partially on the translucent region of the structure.

In particular, one of the outer layers may comprise a first watermark or pseudo-watermark visible on a first face representing a national emblem and the other outer layer may comprise a second watermark or pseudo-watermark visible on the other side under the form of an inscription, for example the corresponding national currency. In the case of a voucher, one of the watermarks may represent the logo of the issuing company and the other watermark, the value of the voucher. According to an exemplary embodiment of the invention, the two watermarks or pseudo-watermarks are at least partially opposite one another.

According to a particular case of the invention, the structure may comprise a translucent zone and the two watermarks or pseudo-watermarks are identical but placed symmetrically. In the case of an authentication, it can then be verified that the two watermarks or pseudo-watermarks are identical on both sides of the structure. For example, we can read the same text on both sides or observe a character always turning the head on the same side.

According to another exemplary embodiment of the invention, a single external layer constituting the structure may comprise a watermark or pseudo-watermark and the structure may comprise a translucent but non-transparent region, so that the watermark is not observable in light transmitted through the structure at the translucent region than from the face of the structure adjacent to the fibrous layer. Security and / or identification document

The invention further relates, in another of its aspects, a security document and / or identification comprising the structure as defined above.

The security and / or identification document may for example be a passport, an identification card relating to an object or to a person such as including an identity card, a driving license, an interactive playing or collectible card, a means of payment, in particular a payment card, a voucher or a voucher, a transport card, a loyalty card , a service card, a subscription card. The document can be in particular a multi-application card such as: a social security card that is used both by the pharmacist to transmit to the health insurance fund the information relating to the health expenses of the cardholder and also to the sharing between the various pharmacists and doctors of the pharmaceutical file relating to the card holder, - a student card also serving as a photocopy card and / or a canteen card and / or a library card, an access card to cultural or sports events or exhibitions also serving as a transport card, a subscription card also serving as a payment card, - a playing card presenting different values, in particular as many different values as integrated microcircuit devices.

The document may in particular be a passport comprising a sheet constituted by the structure according to the invention comprising an electromagnetic interference system as defined above. Such an identification document may serve both as a passport and as a passport

Visa, a first integrated circuit device comprising the digitized photograph of the passport holder and his personal data, a second integrated circuit device separate from the first one containing the entry authorizations in a particular country. The first device can be read-only and the second device read / write to allow the update of the Visas.

The passport thus formed may also include a second electromagnetic disturbance system located between the passport cover and an inside passport cover page. In this way, when the passport is closed, that is to say folded on itself, any reading of the two integrated microcircuit devices is impossible because of the presence of the second system of electromagnetic disturbance between the cover and the pages of the keep. Moreover, when the passport is open, only one of the integrated microcircuit devices can be read according to the position of the sheet constituted by the structure relative to the reader, ie according to whether the face of the leaflet presented to the reader is the front or back side.

Together

The invention further relates, in another aspect, to an assembly comprising the structure as defined above and the external reader. The external reader can read or even modify the data contained in the integrated microcircuit devices according to the possibilities described above.

The assembly may in particular comprise a structure according to the invention to be assembled oneself. For example, the assembly may comprise several assembly elements each comprising at least one integrated microcircuit device and the structure may be made by joining at least two of these assembly elements, in particular by gluing or by fusion or welding. .

The assembly elements may include integrated microcircuit devices whose respective data are all different or associated with different applications of the structure. For example, each assembly element can be associated with a single application, for example as a canteen card, photocopy card, student card, library card, transport card, among others.

Method According to another of its aspects, the subject of the invention is also a method of reading a structure of a set as defined above, comprising the step of reading, receiving, or even modifying the data of a single integrated microcircuit device at a time with the external reader.

In particular, the data of the two integrated microcircuit devices read by an external reader can correspond to two different applications, for example for a photocopy card and a canteen card, or for a student card and a transport card. In particular, the reading of one of the integrated microcircuit devices can be conditioned by the reading of the other integrated microcircuit devices, in particular by the result of the reading of this device.

Reading the two integrated microcircuit devices can still allow successive authentication of the structure. In particular, if the first reading result of one of the integrated microcircuit devices does not correspond to the expected result, the reading of the second integrated microcircuit device may be authorized or not so as to proceed to an additional step of authenticating the structure (Basic Access Control). The invention will be better understood on reading which follows, the detailed description of non-limiting examples of implementation thereof, and on examining the figures of the accompanying drawing, schematic and partial, in which: FIGS. 1, 2 and 3 show in section three examples of structure according to the invention, - FIGS. 4 and 5 respectively represent the front and the back of the structure of FIG. 2, FIGS. 6 and 7 represent in section two variants. embodiment of a structure according to the invention, Figure 8 shows another alternative embodiment of a structure according to the invention, Figures 9, 10 and 11 show in section an example of a passport comprising a structure according to the invention FIG. 12 is a sectional view of another example of a structure according to the invention, FIG. 13 is a sectional view of another example of a structure according to the invention, FIGS. 14 and 15 respectively show the front and the back. On the reverse of the structure of FIG. 13, FIG. 16 represents another example of a structure according to the invention; FIGS. 17 and 18 respectively represent the front and the back of the structure of FIG. FIG. 19 represents another example of a structure according to the invention, FIG. 20 represents an example of a material provided with integrated microcircuit devices that can be used for the manufacture of a structure according to the invention; FIG. an example of assembly elements that can be used to manufacture a structure according to the invention, FIG. 22 represents an example of an assembly according to the invention, and FIG. 23 is a view similar to FIG. an alternative embodiment of the invention. In the drawing, the proportions between the various elements represented have not always been respected for the sake of clarity.

FIG. 1 shows an example of structure 1 according to the invention.

The structure 1 comprises two integrated microcircuit devices consisting of chips 2 and 3 each provided with an antenna 5, incorporated entirely between outer layers 6 and 7 and inner layers 8 of the structure 1, the inner layers 8 being separated by a electromagnetic interference system 4.

In this example in particular, the integrated microcircuit devices are contactless communication and include in particular chips 2 and 3 of the MOB module chip type 6, sold by the company PHILIPS. The antennas 5 are for example copper wire type. In addition, the chips 2 and 3 and their respective antennas 5 are placed facing one another and symmetrically with respect to the center of the structure 1. Alternatively, the integrated microcircuit devices could be positioned differently. In this example again, the layers 6, 7 and 8 of the structure 1 may be fibrous and / or polymeric layers, for example layers of paper and / or plastic. The thicknesses of these layers 6, 7 and 8 are, in this example, identical but they could also be different.

The layers 6 and 7 have recesses so as to accommodate the MOB module chip 6 in their thickness.

The electromagnetic interference system 4 is, in this example, a total or partial attenuation system for the coupling of integrated microcircuit devices with the external drive depending on their position in front of the external drive. The attenuation system may be, for example, a layer of zinc sprayed on the inside of at least one of the layers 8 constituting the structure.

The integrated microcircuit devices are placed on either side of the electromagnetic interference system 4 so that simultaneous reading of the two integrated microcircuit devices by an external reader is impossible.

Indeed, when the front face of the structure 1 corresponding to the layer 6 is presented in front of the reader, only the integrated microcircuit device comprising the chip 2 can be read by an external reader. Similarly, when the reverse side of the structure 1 corresponding to the layer 7 is presented in front of the reader, only the integrated microcircuit device comprising the chip 3 can be read by an external reader.

FIG. 2 shows the structure 1 of FIG. 1, the latter comprising in addition two outer layers 13 and 14.

The outer layers 13 and 14 are for example fibrous layers and / or polymers, for example layers of paper and / or plastic. The layers 13 and 14 are advantageously printable and especially opaque layers. In this way, the presence of the outer layers 13 and 14 makes it possible to mask the integrated microcircuit devices and possibly the electromagnetic interference system 4.

For example, the structure 1 of FIG. 2 can be used as a multi-application card when it is intended to correspond or be incorporated into a security and / or identification document. For example, the structure 1 can serve as an interactive playing card and / or dual-application card, for example both a photocopy card and a canteen card, or both a student card and a card. library card. Each face of the structure 1 may thus comprise one or more identifiers allowing for example a user to know which face must be presented to an external reader according to the desired use of the structure 1.

In particular in this example, the data contained in the chip 2 may correspond to data or applications related to a use of the structure 1 as a canteen card and therefore, the front face of the structure 1 may comprise an identifier in the form of a print representing the word "canteen", as can be seen in FIG. Similarly, the data contained in the chip 3 may correspond to data or applications related to a use of the structure 1 as a photocopy card and therefore, the reverse side of the structure 1 may include an identifier under the form of an impression 31 representing the word "photocopy", as can be seen in FIG.

FIG. 3 shows the structure 1 of FIG. 1, the latter further comprising an outer protective layer 9. This protective layer, presented in the figure in the form of a pocket, can also be in the form of a laminate , depending on the document to be protected. This layer 9, in particular polymer, may be provided on its inner side with a heat-sealing adhesive or pressure-sensitive, to allow its lamination on the structure 1. The outer layer 9 is a transparent layer. The layer 9 is advantageously a secured layer of polyester or polypropylene marketed by Fasver under the name Fasfilm.

FIG. 6 shows a variant of the structure 1 according to the invention with integrated microcircuits consisting of chips 2 and 3 of AOB (Antenna On Board) type provided with their embedded antennas 5 and 5 'coupling antennas to increase the reading distance of these chips.

The chips 2 and 3, their on-board antennas 5 and the coupling antennas 5 ', are incorporated entirely between the outer layers 6 and 7 and the inner layers 8 of the structure 1, the inner layers 8 being separated by an electromagnetic interference system 4.

In this particular example, the integrated microcircuit devices are contactless communication and consist in particular of chips 2 and 3 of the MM chip type, marketed by FEC. The AOB chips 2 and 3, their on-board antennas 5 and their 5 'coupling antennas printed on the outer faces of the layers 8 are placed opposite and symmetrically with respect to the center of the structure 1. In a variant, the devices 2 and 3 could be positioned differently.

In this example again, the layers 6, 7 and 8 of the structure 1 may be fibrous and / or polymeric layers, for example layers of paper and / or plastic. The thicknesses of these layers 6, 7 and 8 are in this example identical but they could also be different. The layers 8 are on their outer face in contact with the layers 6 and 7, the chips 2 and 3 and their on-board antennas 5 fixed by a dot of glue and the coupling antennas 5 'printed, for example, by screen printing.

In this example, the electromagnetic interference system 4 is a total or partial attenuation system for coupling the integrated microcircuit devices with the external reader according to their position in front of the external reader. The attenuation system may be, for example, a thin aluminum film placed between the layers 8 constituting the structure.

The chips 2 and 3, their on-board antennas 5 and their coupling antennas 5 'are placed on either side of the electromagnetic interference system 4 so that simultaneous reading of the two chips 2 and 3 by an external reader is impossible.

Indeed, on the front face of the structure 1 corresponding to the layer 6, only the chip 2 can be read by an external reader. Similarly, on the reverse side of the structure 1 corresponding to the layer 7, only the chip 3 can be read by an external reader. FIG. 7 shows a variant of FIG. 6 according to the invention with integrated microcircuits consisting of chips 2 and 3 of the AOB type, their on-board antennas 5 and coupling antennas 5 'for increasing the reading distance of these chips. In this variant, the non-contact microcircuit devices and their 5 'booster antennas are directly carried by transparent outer protective layers 9 and no longer by the constituent layers 8 of the structure.

The outer layers 9 are, for example, laminates in the form of a transparent film sold under the name Smartfilm by Fasver.

The layers 8 are printable and customizable fibrous layers for example Jetguard paper marketed by the company Arjowiggins. The integrated microcircuit devices consisting of chips 2 and 3 and their embedded antennas 5 are placed on either side of the electromagnetic interference system 4 so that simultaneous reading of the two integrated microcircuit devices by an external reader is impossible.

Another example of a structure according to the invention is shown in FIG. In this example, integrated microcircuit devices consisting of chips 2 and 3 of type

AOB and their embedded antennas 5 are carried by a transparent security film 9.

The inner face of the film 9 carrying the integrated microcircuit devices is brought into contact with layers 8 of the structure. Such a film is for example marketed under the name Smartfilm by Fasver

A coupling antenna 5 'can also be printed on the inside of the film 9 to increase the reading distance of the AOB chips. According to another example not shown, integrated microcircuit devices consisting of chips 2 and 3 of the AOB type, their embedded antennas 5 and possibly their coupling antennas 5 'can be carried by a safety foil, for example a foil of Optical effect security. As in the example of FIG. 8, the inner face of the foil carrying the integrated microcircuit devices is brought into contact with the layers 8 of the structure.

FIGS. 9, 10 and 11 show a passport incorporating a structure 1 according to the invention, in particular a structure such as that of FIG.

The passport 10 comprises a cover 11, for example a textile or paper cover, one of the sheets 15 corresponds to or integrates the structure 1 according to the invention. In this example, the structure 1 corresponds to a sheet 15, for example to the data page relating to the carrier, not located between two other sheets 15. Of course, the structure 1 could correspond to any one of the sheets 15.

In this example again, the passport 10 includes a second electromagnetic interference system 4 'situated between the cover 11 of the passport 10 and a cover page 16 of the passport 10. The second electromagnetic interference system 4' can be identical to the disturbance system electromagnetic 4 previously described or be different. In addition, the cover page 16, the electromagnetic interference system 4 'and the cover 11 can be assembled together, in particular by gluing, so as to define a new cover for the passport 10 within which the sheets 15 appear.

In this example, the electromagnetic disturbance system 4 'extends over the entire surface of the cover 11 of the passport. As a variant, the electromagnetic interference system 4 'could extend over only a portion of the cover 11 of the passport 10. In another variant, the passport 10 could be devoid of an electromagnetic interference system 4'. When the passport 10 is closed, the reading of the integrated microcircuit devices included in the structure 1 of the sheet 15 is impossible due to the presence of the electromagnetic disturbance system 4 '.

When the passport 10 is open and the structure 1 is placed against the front page 16 of the passport 10 by its front face where the chip 2, as shown in Figure 10, only the chip 3 can be read by an external reader , placed in particular on the reverse face of the structure 1 (as represented by the arrow V in FIG. 10), because of the presence of the electromagnetic interference systems 4 and 4 '.

When the passport 10 is open and the structure 1 is placed against the front page 16 of the passport 10 by its reverse side which shows the chip 3, as shown in Figure 11, only the chip 2 can be read by an external reader , in particular placed on the front face of the structure 1 (as represented by the arrow R in FIG. 11), because of the presence of the electromagnetic interference systems 4 and 4 '.

As a variant, the structure 1 could comprise external layers, as has been described for FIG. 2. The structure 1 could still correspond to a structure such as that described for FIG. 12, devoid of any electromagnetic interference system. In this case, it is the value of the distance d separating the two integrated microcircuit devices 2 and 3 that can make it possible to prevent any simultaneous reading by an external reader of the two integrated microcircuit devices. FIG. 12 shows another example of structure 1 according to the invention.

In this example, the structure 1 is monolayer, consisting for example of a polymer or fibrous layer.

The structure 1 comprises two integrated microcircuit devices consisting of chips 2 and 3 of the AOB type and their embedded antennas not shown in this figure, such as MM chip chips marketed by FEC, separated from each other. a distance d.

Advantageously, the distance d is greater than the sum of the reading distances d2 and d2 of chips 2 and 3 with an external reader, so that any simultaneous reading of the two chips 2 and 3 by the external reader is impossible.

The two chips 2 and 3 and their onboard antennas are carried respectively by two safety wires 9 and 10 with a width of 5 mm, incorporated by example on paper machine in the mass of paper in the machine direction, according to the method well known to those skilled in the art.

FIG. 13 shows another example of structure 1 according to the invention. The structure 1 comprises two fibrous layers 6 and 7 and a substructure 8 located between the fibrous layers 6 and 7.

The fibrous layers 6 and 7 each comprise a watermark, respectively 6a and 7a, representing, for example, the texts "METRO / BUS" and "TRAIN GRANDES LIGNES", as represented in FIGS. 14 and 15. The watermarks 6a and 7a are in look at each other.

In this example again, the substructure 8 corresponds to a translucent and light-diffusing layer and comprises two integrated microcircuit devices, for example in the form of two AOB chips 2 and 3, located at opposite ends of the structure 1 and separated by a distance d greater than the sum of the reading distances of the chips 2 and 3 with an external reader.

The thickness of each integrated microcircuit device is of the order of 75 microns. As a variant, the structure 1 could comprise more than two integrated microcircuit devices, for example three or four.

In this example, the two integrated microcircuit devices are separated from each other by a distance d equal to 10 mm.

The substructure 8 advantageously comprises a translucent region of a thickness and a refractive index adapted to diffuse the light. In this example, the translucent region extends to the entirety of the substructure 8 and thus makes it possible to prevent any visual combination of the watermarks 6a and 7a of the fibrous layers 6 and 7 by observation in transmitted light.

FIGS. 14 and 15 show respectively the front and the back of the structure 1 of FIG. 13 observed in transmitted light.

In FIG. 14 it can be seen that, by observation in transmitted light of the front of the structure 1, only the watermark 6a of the fibrous layer 6 is observable. Similarly, in FIG. 15 it can be seen that, by observation in light transmitted from the back of the structure 1, only the watermark 7a of the fibrous layer 7 is observable. In this way, the combination of the watermarks 6a and 7a of the fibrous layers 6 and 7 is in this case impossible because of the presence of the translucent sub-structure 8 and diffusing the light.

Another example of structure 1 according to the invention is shown in FIG.

The structure 1 comprises four integrated microcircuit devices, consisting of chips 2, 2 ', 3 and 3' of AOB type and their embedded antennas not shown in this figure, incorporated entirely in layers 6 and 7 of the structure 1, the layers 6 and 7 being separated by an electromagnetic interference system 4. The two integrated microcircuit devices incorporated in the layer 6 are located at opposite ends of the layer 6 and separated by a distance d greater than the sum of the reading distances chips 2 and 3 with an external reader. The two devices incorporated in the layer 7 are also located at opposite ends of the layer 7 and separated by a distance greater than the sum of the reading distances of the chips 2 'and 3' with an external reader. The distances d and d 'can be identical or different.

The outer layers 13 and 14 are, for example, fibrous and / or polymeric layers, in particular layers of paper and / or plastic. The layers 13 and 14 are advantageously printable and especially opaque layers. The structure 1 of FIG. 16 may allow multi-application use when it is intended to correspond or be incorporated into a security and / or identification document.

Each face of the structure 1 can thus comprise several identifiers allowing for example a user to know which side of the document must be presented, and according to which orientation (left side, right side, front side, back side), to an external reader in according to the desired use of structure 1.

In particular in this example, the data and the applications contained in the chip 2 can correspond to data and applications related to a use of the structure 1 as a canteen card and the data and the applications contained in the chip 3 may correspond to data and applications related to use of the structure 1 as a photocopy card. As a result, the front face of the structure 1 may comprise an impression 30 on its left side representing the word "CANTINE" and a printing 31 on its right side representing the word "PHOTOCOPY", as can be seen in Figure 17.

Similarly, the data and the applications contained in the chip 2 'can correspond to data and applications related to a use of the structure 1 as a student card and the data and applications contained in the chip 3' can correspond to data and applications related to a use of the structure 1 as a transport card. Therefore, the reverse side of the structure 1 may comprise an identifier in the form of an impression 30 'on its right side representing the word

"TRANSPORT" and an identifier in the form of an impression 31 'on its left side representing the word "STUDENT", as can be seen in Figure 18.

FIG. 19 shows another example of structure 1 according to the invention.

The structure 1 comprises two fibrous layers 6 and 7 between which is located a substructure 8 comprising an integrated microcircuit device with contactless communication consisting of the module chip 2 and the antenna 5 carried by the sub-layer 8b.

The fibrous layer 6 comprises a safety thread 26 in the form of two laminated flat strips with a width of 2 mm, one of the bands having a recess in which is partially housed an integrated microcircuit device for example in the form of A chip AOB 3. The wire 26 may be completely incorporated into the mass of the fibrous layer 6 or be introduced in the window in the manner of a "Window-Thread" so that it is flush with the outside face of the layer 6.

The security thread 26 may also include one or more security elements. The structure 1 further comprises two outer layers 20 and 21 respectively covering the fibrous layers 6 and 7, and a spacer layer 22 located between the outer layers 20 and 21, in particular so as to compensate for the differences in width between the outer layers 20 and 21 and the fibrous layers 6 and 7 and the substructure 8.

In this example, the outer layers 20 and 21 are transparent polymer layers, and the spacer layer is a polycarbonate layer.

In this example, the substructure 8 is entirely translucent and diffuses light and comprises four layers 8a, 8b, 8c and 8d. The layer 8d is for example made of polycarbonate, with a thickness of 130 microns, and has on its inner face a fluorescent printing 25, for example yellow under ultraviolet (UV) 365 nm.

The layer 8c is for example made of polycarbonate, with a thickness of 200 microns, and has a recess in which is housed a portion 2a of the chip 2, corresponding for example to the boss ("potting") of a module of the MOB type 4 , marketed by NXP, a subsidiary of PHILIPS. The layer 8c still has on its inner face the antenna 5 associated with the chip 2.

The layer 8b may for example be polycarbonate, with a thickness of 130 microns, and have a recess in which is housed a portion 2b of the chip 2, corresponding for example to the base of a module of the MOB type 4.

The layer 8a is for example polycarbonate, with a thickness of 100 microns.

The fibrous layers 6 and 7 each comprise, for example, a recess 23 facing each other and facing the fluorescent printing of the layer 8d of the substructure 8. The recesses 23 make it possible, for example, to forming a transparent window, observable in reflection and in transmission, on both sides of the structure 1. The recesses 23 forming the transparent window may for example have the shape of a medallion. The fibrous layer 6 may, for example, comprise one or more security elements, for example blue visible hairpieces, green fluorescent invisible small boards under ultraviolet (UV) 365 nm. The fibrous layer 7 may also comprise one or more security elements, for example, red fluorescent invisible tweens, invisible blue fluorescent boards, invisible UV-fluorescent orange HI-LITEs under ultraviolet (UV) 365 nm.

The fibrous layer 7 can also comprise a holographic foil 27, for example applied by heat transfer, protected by the outer layer 21, and located in particular outside the recess 23. The foil 27 may for example have a thickness of 6 μm and do not need to be compensated in thickness.

The spacer layer 22 may for example be made of transparent fluorescent red polycarbonate under ultraviolet (UV) 365 nm. By observation under daylight in reflection, it is thus possible to see on the side of the outer layer 20, blue fibers and the security thread 26 and the side of the outer layer 21, the foil holographic 27 and blue boards. By observation under ultraviolet light in reflection, it is possible for example to see the transparent edges of the structure 1 corresponding to the width of the spacer layer 22 which appear in red fluorescence and the yellow fluorescent print at the window formed by The recesses 23. Luminescent safeties can also be seen at the level of the fibrous layers 6 and 7, the safeties (fibers, HI-LITE boards) having a different luminescence according to the face of the structure 1 observed.

Advantageously, the distance d separating the two integrated microcircuit devices is greater than the sum of the reading distances of the integrated microcircuit devices with an external reader, so that the simultaneous reading of the two integrated microcircuit devices is impossible by the same external reader. .

FIG. 20 shows an example of a material 35 comprising several integrated microcircuit devices 36 that can be used to manufacture a structure according to the invention. The material 35 may for example correspond to a sheet comprising several integrated microcircuit devices 36 regularly distributed on the sheet and separated by a distance greater than the sum of the read distances of the integrated microcircuit devices 36 by an external reader.

A user can thus use the material 35 as a constituent layer of a structure according to the invention, either as it stands or by reducing the number of integrated microcircuit devices 36 that it wishes to integrate into the structure. In the latter case, he may choose to cut the material according to the dotted lines 37 marked on the material 35, or by placing on some of the integrated microcircuit devices 36 one or more electromagnetic disturbance systems, for example in the form of strips or patches, stickers or not.

The distance between the integrated microcircuit devices 36 being sufficiently large on the material 35 with respect to the reading distances of these devices by an external reader, any simultaneous reading of more than one integrated microcircuit device by an external reader will be impossible even after reduction of the number of devices 36. FIG. 21 shows examples of assembly elements 38 each comprising an integrated microcircuit device 36. Preferably, all integrated microcircuit devices 36 of these assembly elements 38 are different. Each assembly element 38 is particularly associated with a desired functionality, for example canteen card, photocopy card ..., indicated by identifiers 39 appearing on the assembly elements 38.

A user can thus realize his own structure by assembling at least two of these assembly elements 38, for example to manufacture a canteen and photocopy card, or a canteen and transport card.

FIG. 22 shows an exemplary assembly 50 according to the invention comprising a structure 1 according to the invention, which may be such as those described previously, and an external reader 40 for reading the data contained in the integrated microcircuit devices. of the structure 1.

The structure 1 according to the invention shown in FIG. 23 comprises two chips 2 and 3, for example of the AOB type.

The chips 23 are for example each sandwiched between two layers 6 and 8, for example layers of a synthetic material, for example polycarbonate. The layers 6 and 8 associated with each chip are for example identical to those associated with the other layer, and in particular may have the same composition and the same thickness.

Each stack of layers 6 and 8 is separated from the other by an electromagnetic interference system 4. The latter is for example a strip of a metal, for example aluminum, this strip being for example thicker than wide, the thickness being measured perpendicular to the plane of the structure 1.

The stack of layers 6, 8 and the perturbation system 4 can be sandwiched between two outer layers 13 and 14. Spacers 22 can be arranged between the layers 13 and 24, on either side of the set of These struts 22 have, for example, the same thickness as the cumulative thickness of the layers 6 and 8.

The expression "comprising one" is synonymous with "having at least one", unless the opposite is specified.

Claims

1. Structure (1) comprising at least two separate devices with integrated microcircuit contactless communication, each comprising at least one chip (2,3) and at least one antenna (5), said at least two integrated microcircuit devices being arranged in or on the structure (1) so that any simultaneous reading of more than one of the integrated microcircuit devices by an external reader (40) is impossible in at least one position of the structure (1) with respect to the external reader (40).

2. Structure (1) according to claim 1, said at least two integrated microcircuit devices being separated in pairs by a distance (d) greater than the sum of the reading distances (d ₂ , d ₃ ) of the microcircuit devices. integrated with an external reader (40) and / or being separated in pairs by an electromagnetic interference system (4).

3. Structure (1) according to claim 2, the distance (d) being greater than or equal to 10 mm.

4. Structure (1) according to any one of claims 1 to 3, at least two integrated microcircuit devices being adjacent to opposite ends of the structure (1).

5. Structure (1) according to any one of claims 1 to 3, at least two integrated microcircuit devices being positioned on opposite sides of the structure (1).

6. Structure (1) according to claim 2, the electromagnetic interference system consisting of or comprising at least one magnetic material, a conductive material or a resonator circuit.

7. Structure (1) according to any one of the preceding claims, at least one of the integrated microcircuit devices comprising an onboard antenna (5) on the chip (2,3).

8. Structure (1) according to any one of the preceding claims, at least one of the integrated microcircuit devices comprising a coupling antenna (5 ').

9. Structure (1) according to any one of the preceding claims, said at least two integrated microcircuit devices each having a coupling antenna (5 ').

10. Structure (1) according to the preceding claim, the coupling antennas (5 ') being separated in pairs by a distance greater than the sum of the reading distances (d ₂ , ds) of integrated microcircuit devices with a reader external (40) and / or being separated in pairs by an electromagnetic interference system (4).

11. Structure (1) according to any one of the preceding claims, at least one of the integrated microcircuit devices being carried by a security thread or a security band incorporated (e) in the structure (1).

12. Structure (1) according to any one of the preceding claims, being monolayer or multilayer.

13. Structure (1) according to the preceding claim, the constituent layers

(6, 7, 8) being fibrous and / or polymeric.

14. Structure (1) according to any one of the preceding claims, at least one of the integrated microcircuit devices being carried by a transparent safety film (9) or a laminated optical safety foil on the outer face of the device. a constituent layer of the structure (1).

15. Structure (1) according to any one of the preceding claims, the two integrated microcircuit devices having different data and / or allowing access to different databases or applications.

16. Structure (1) according to any one of the preceding claims, comprising several identifiers (30, 31, 39) on its front and back faces respectively associated with integrated microcircuit devices.

17. Structure (1) according to any one of the preceding claims, comprising one or more security elements, in particular one or more watermarks or pseudo-watermarks.

18. Structure according to any one of the preceding claims, the two integrated microcircuit devices being disposed on either side of an electromagnetic disturbance system thicker than wide.

19. The structure of claim 18, each device being sandwiched within a set of two inner layers.

20. Structure according to claim 18 or 19, the disturbance system (4) being a metal strip.

21. Security and / or identification document comprising the structure (1) as defined in any one of the preceding claims.

22. Document according to the preceding claim, being a passport, an identity card, a driver's license, an interactive playing card or collector's card, a means of payment, including a payment card, a gift certificate or a gift card. voucher, a transport card, a loyalty card, a service card, a subscription card.

23. Assembly (50) comprising the structure (1) as defined in any one of claims 1 to 19 and the external reader (40).

24. A method of reading a structure (1) of a set as defined in the preceding claim, comprising the step of reading, receiving, or even modify the data of a single integrated microcircuit device (2). , 3) both with the external reader (40).

25. Reading method according to the preceding claim, the reading of one of the integrated microcircuit devices being conditioned by the reading result of the other integrated microcircuit devices.