EP2333476A4 - Wärmetauscher und herstellungsverfahren dafür - Google Patents

Wärmetauscher und herstellungsverfahren dafür Download PDF

Info

Publication number
EP2333476A4
EP2333476A4 EP09800340.3A EP09800340A EP2333476A4 EP 2333476 A4 EP2333476 A4 EP 2333476A4 EP 09800340 A EP09800340 A EP 09800340A EP 2333476 A4 EP2333476 A4 EP 2333476A4
Authority
EP
European Patent Office
Prior art keywords
heat exchanger
manufacturing same
manufacturing
same
exchanger
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP09800340.3A
Other languages
English (en)
French (fr)
Other versions
EP2333476A1 (de
Inventor
Masahiro Morino
Yasuji Taketsuna
Hirofumi Inoshita
Hirohito Matsui
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyota Motor Corp
Original Assignee
Toyota Motor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyota Motor Corp filed Critical Toyota Motor Corp
Publication of EP2333476A1 publication Critical patent/EP2333476A1/de
Publication of EP2333476A4 publication Critical patent/EP2333476A4/de
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D53/00—Making other particular articles
    • B21D53/02—Making other particular articles heat exchangers or parts thereof, e.g. radiators, condensers fins, headers
    • B21D53/04—Making other particular articles heat exchangers or parts thereof, e.g. radiators, condensers fins, headers of sheet metal
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/06—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Shaping Metal By Deep-Drawing, Or The Like (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
EP09800340.3A 2008-07-24 2009-07-14 Wärmetauscher und herstellungsverfahren dafür Withdrawn EP2333476A4 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008190946A JP4485583B2 (ja) 2008-07-24 2008-07-24 熱交換器及びその製造方法
PCT/JP2009/062701 WO2010010826A1 (ja) 2008-07-24 2009-07-14 熱交換器及びその製造方法

Publications (2)

Publication Number Publication Date
EP2333476A1 EP2333476A1 (de) 2011-06-15
EP2333476A4 true EP2333476A4 (de) 2017-05-10

Family

ID=41570290

Family Applications (1)

Application Number Title Priority Date Filing Date
EP09800340.3A Withdrawn EP2333476A4 (de) 2008-07-24 2009-07-14 Wärmetauscher und herstellungsverfahren dafür

Country Status (6)

Country Link
US (1) US20110132591A1 (de)
EP (1) EP2333476A4 (de)
JP (1) JP4485583B2 (de)
KR (1) KR101232403B1 (de)
CN (1) CN102138057B (de)
WO (1) WO2010010826A1 (de)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2432012A4 (de) 2009-05-11 2014-04-16 Toyota Motor Co Ltd Wärmetauscher, halbleiteranordnung, verfahren zur herstellung des wärmetauschers und verfahren zur herstellung der halbleiteranordnung
WO2010134191A1 (ja) 2009-05-22 2010-11-25 トヨタ自動車株式会社 熱交換器及びその製造方法
JP5707972B2 (ja) * 2011-01-26 2015-04-30 トヨタ自動車株式会社 熱交換器
US20140069615A1 (en) 2011-05-12 2014-03-13 Toyota Jidosha Kabushiki Kaisha Cooler and method for producing the same
WO2014038179A1 (ja) * 2012-09-05 2014-03-13 パナソニック株式会社 冷却装置、これを搭載した電気自動車、および電子機器
EP2719985B1 (de) * 2012-10-09 2015-08-26 Danfoss Silicon Power GmbH Durchflussverteilungsmodul mit einer gemusterten Deckplatte
JP6155988B2 (ja) * 2013-09-02 2017-07-05 富士通株式会社 情報処理装置
JP2015159254A (ja) * 2014-02-25 2015-09-03 三桜工業株式会社 冷却装置及び冷却装置の製造方法
WO2015194259A1 (ja) 2014-06-19 2015-12-23 富士電機株式会社 冷却器及び冷却器の固定方法
CN105636402B (zh) * 2014-10-28 2018-01-09 奇瑞新能源汽车技术有限公司 一种驱动电机和电机控制器的水冷散热结构
CN104334002A (zh) * 2014-11-06 2015-02-04 广州高澜节能技术股份有限公司 一种具有扰流交错台阶回型流道水冷板
CN104334003A (zh) * 2014-11-06 2015-02-04 广州高澜节能技术股份有限公司 一种具有扰流交错台阶直流道水冷板
CN107429976B (zh) 2015-03-16 2021-02-09 达纳加拿大公司 带有具有用于提高平坦度的表面图案的板的换热器和制造该换热器的方法
CN104858306A (zh) * 2015-05-17 2015-08-26 合肥长城制冷科技有限公司 一种新型压锁式翅片限位模具
JP6491553B2 (ja) * 2015-06-30 2019-03-27 昭和電工株式会社 放熱器の製造装置
US10014238B2 (en) * 2016-07-19 2018-07-03 Ge Energy Power Conversion Technology Ltd Method, system, and electronic assembly for thermal management
DK3577406T3 (da) * 2017-02-03 2021-06-21 Asetek Danmark As Væskekølesystemer til varmegenererende indretninger
JP7124425B2 (ja) * 2018-05-02 2022-08-24 富士電機株式会社 冷却装置、半導体モジュールおよび車両
DE102018119034A1 (de) * 2018-08-06 2020-02-06 Webasto SE Wärmeübertrager
US11306979B2 (en) * 2018-12-05 2022-04-19 Hamilton Sundstrand Corporation Heat exchanger riblet and turbulator features for improved manufacturability and performance
JP6984778B1 (ja) * 2021-05-20 2021-12-22 富士電機株式会社 冷却装置および冷却装置を備える半導体装置
CN115255837B (zh) * 2022-08-22 2023-09-19 中国电子科技集团公司第三十八研究所 一种异质内置式微小通道冷板及其成型方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2090651A (en) * 1980-12-17 1982-07-14 Pentagon Radiator Stafford Ltd Improvements Relating to Heat Exchangers
JPH08178568A (ja) * 1994-12-26 1996-07-12 Showa Alum Corp 熱交換器用金属製チューブ材及びその製造方法
DE19719260C1 (de) * 1997-05-07 1998-09-24 Valeo Klimatech Gmbh & Co Kg Gepreßtes Flachrohr für Wärmetauscher in Kraftfahrzeugen
KR20020045042A (ko) * 2000-12-07 2002-06-19 신영주 열교환기 튜브
DE102005020727A1 (de) * 2005-05-04 2006-11-09 Dr.Ing.H.C. F. Porsche Ag Stranggepresstes Mehrkammerrohr, insbesondere für einen Wärmeübertrager

Family Cites Families (19)

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Publication number Priority date Publication date Assignee Title
US3445101A (en) * 1966-08-15 1969-05-20 Howard M Kohn Cooling units for fume hood on basic oxygen steelmaking furnace
US4470452A (en) * 1982-05-19 1984-09-11 Ford Motor Company Turbulator radiator tube and radiator construction derived therefrom
GB2159265B (en) * 1984-05-22 1987-05-28 Eric Smith Heat exchangers
US5103374A (en) * 1990-05-23 1992-04-07 At&T Bell Laboratories Circuit pack cooling using turbulators
US5730213A (en) * 1995-11-13 1998-03-24 Alliedsignal, Inc. Cooling tube for heat exchanger
CA2272804C (en) * 1999-05-28 2004-07-20 Long Manufacturing Ltd. Heat exchanger with dimpled bypass channel
US6209629B1 (en) * 1999-07-09 2001-04-03 Visteon Global Technologies, Inc. Beaded plate for a heat exchanger and method of making same
JP4042268B2 (ja) * 1999-09-07 2008-02-06 株式会社デンソー 沸騰冷却装置
DE19963374B4 (de) * 1999-12-28 2007-09-13 Alstom Vorrichtung zur Kühlung einer, einen Strömungskanal umgebenden Strömungskanalwand mit wenigstens einem Rippenelement
JP3774843B2 (ja) * 2001-05-25 2006-05-17 マルヤス工業株式会社 多管式熱交換器
AU2002368421B2 (en) * 2002-12-02 2007-10-04 Lg Electronics Inc. Heat exchanger of ventilating system
CN2622658Y (zh) * 2002-12-19 2004-06-30 涂丽雪 可产生涡流现象的热交换鳍片板
CN2798021Y (zh) * 2005-06-02 2006-07-19 高克联管件(上海)有限公司 一种双面强化的降膜式传热管
US20090114372A1 (en) * 2005-09-13 2009-05-07 Mitsubishi Electric Corporation Heat sink
JP4429251B2 (ja) * 2005-10-17 2010-03-10 三菱電機株式会社 電力変換装置
JP2007165481A (ja) * 2005-12-12 2007-06-28 Seiko Epson Corp 熱交換器、光源装置、プロジェクタ、電子機器
JP4675283B2 (ja) 2006-06-14 2011-04-20 トヨタ自動車株式会社 ヒートシンクおよび冷却器
JP2010080455A (ja) * 2006-12-22 2010-04-08 Nec Corp 電子機器の冷却装置及び冷却方法
JP4789813B2 (ja) * 2007-01-11 2011-10-12 トヨタ自動車株式会社 半導体素子の冷却構造

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2090651A (en) * 1980-12-17 1982-07-14 Pentagon Radiator Stafford Ltd Improvements Relating to Heat Exchangers
JPH08178568A (ja) * 1994-12-26 1996-07-12 Showa Alum Corp 熱交換器用金属製チューブ材及びその製造方法
DE19719260C1 (de) * 1997-05-07 1998-09-24 Valeo Klimatech Gmbh & Co Kg Gepreßtes Flachrohr für Wärmetauscher in Kraftfahrzeugen
KR20020045042A (ko) * 2000-12-07 2002-06-19 신영주 열교환기 튜브
DE102005020727A1 (de) * 2005-05-04 2006-11-09 Dr.Ing.H.C. F. Porsche Ag Stranggepresstes Mehrkammerrohr, insbesondere für einen Wärmeübertrager

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2010010826A1 *

Also Published As

Publication number Publication date
US20110132591A1 (en) 2011-06-09
JP2010025521A (ja) 2010-02-04
WO2010010826A1 (ja) 2010-01-28
CN102138057B (zh) 2013-01-02
JP4485583B2 (ja) 2010-06-23
KR101232403B1 (ko) 2013-02-12
KR20110021943A (ko) 2011-03-04
EP2333476A1 (de) 2011-06-15
CN102138057A (zh) 2011-07-27

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Owner name: TOYOTA JIDOSHA KABUSHIKI KAISHA

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