EP2332247A1 - Kondensatoranordnung und verfahren zum herstellen einer kondensatoranordnung - Google Patents
Kondensatoranordnung und verfahren zum herstellen einer kondensatoranordnungInfo
- Publication number
- EP2332247A1 EP2332247A1 EP09760464A EP09760464A EP2332247A1 EP 2332247 A1 EP2332247 A1 EP 2332247A1 EP 09760464 A EP09760464 A EP 09760464A EP 09760464 A EP09760464 A EP 09760464A EP 2332247 A1 EP2332247 A1 EP 2332247A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- power
- capacitor
- extensions
- power rail
- connection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000003990 capacitor Substances 0.000 title claims abstract description 115
- 238000004519 manufacturing process Methods 0.000 title claims description 11
- 239000000758 substrate Substances 0.000 claims description 24
- 238000000034 method Methods 0.000 claims description 20
- 229910000679 solder Inorganic materials 0.000 claims description 10
- 238000005476 soldering Methods 0.000 description 9
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000003252 repetitive effect Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
- H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/02—Mountings
- H01G2/04—Mountings specially adapted for mounting on a chassis
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/02—Mountings
- H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
Definitions
- the present invention relates to a capacitor assembly and a method of manufacturing a capacitor assembly.
- EP 1 632 117 B1 deals with an electronic assembly for switching electrical power.
- the assembly includes two spaced apart power supply rails and a capacitor assembly that bridges the two power supply rails.
- module capacitors are built on a separate board and connected by means of correspondingly long connection connections with power modules.
- additional space for the board another board layout is required.
- the board is connected to additional weight.
- the long connection connections result in a higher inductance, which results in a limitation of the switching frequencies of the power modules.
- the present invention is based on the finding that a capacitor can be applied to a substrate of a power module (power module) by the use of specially shaped capacitor connection plates without loss of service life. According to the invention, damage to the capacitor due to high temperature stress be prevented by the soldering process. As a result, the capacitor reliability can be ensured after the manufacturing process.
- the special capacitor connection plates enable a compact, space-optimized design of the power module.
- space- and weight-optimized contacts and, in particular, a low-inductive contacting of the module capacitor on the power module or power electronics module can be carried out. This leads to a low parasitic inductance between power elements and capacitor.
- a better thermal connection of the capacitor to a module cooler is also possible.
- the present invention provides a capacitor arrangement having the following features:
- a capacitor having a first contact surface and a second contact surface, the first and second contact surfaces being opposed;
- first baffle connected to the first contact surface, the first baffle having extensions at one end adapted to engage recesses in a first angled region of a first power rail of a power electronics module;
- a second baffle connected to the second contact surface, the second baffle having extensions at one end adapted to engage recesses in a first angled region of a second power rail of the power electronics module.
- the capacitor may be suitable for use in a power module.
- the power rails may be configured to provide an electrical connection between the capacitor and a substrate of the power module.
- the power rails may be so-called Powerbus Bar connections.
- the recesses of the power rails can be realized as grooves or through holes. be siert.
- a direct connection of the module capacitor, which may consist of the capacitor and the terminal plates, in the power module is possible.
- a low inductance and a compact design can be achieved.
- a direct connection of the module capacitor in the power electronics module can be done by the special connection plates and power rails.
- the capacitor can be arranged as close to the power electronics module. 0
- the contact surfaces and the connection plates can be aligned parallel to each other. In this way, the contact surfaces can be connected over the entire surface with the connection plates.
- the capacitor can be space-saving, arranged in parallel over the substrate.
- the connecting plates arranged perpendicularly with respect to a capacitor orientation allow a shortest connection of the capacitor to the substrate
- the capacitor arrangement may comprise the first and the second power rail, wherein the power rails may be aligned parallel to the terminal plates and the extensions of the terminal plates may engage in the recesses of the power rails.
- the capacitor arrangement according to the invention can replace known module capacitors without requiring adjustments to the substrate, for example of the power module.
- the capacitor assembly may include solder joints and / or welded joints configured to connect at least some of the extensions of the first terminal sheet 5 to the first power rail and at least some of the extensions of the second terminal sheet to the second power rail.
- solder joints and / or welded joints configured to connect at least some of the extensions of the first terminal sheet 5 to the first power rail and at least some of the extensions of the second terminal sheet to the second power rail.
- the solder joints can each be arranged on a side of the power rails which is opposite the capacitor.
- the solder joints can be created in a simple externally accessible manner.
- the terminal plates may each have an angled region, which is in each case suitable for positively locking to a second angled region of the power rails. The angled regions can stabilize the construction of the capacitor arrangement and represent a further electrical contact.
- the capacitor arrangement can have screw connections which are designed to connect the angled regions of the connection plates respectively to the second angled regions of the power rails.
- a double connection of the module capacitor can be created to the power rails.
- the angled regions of the module capacitor can be screwed to a DC link connection.
- the present invention further provides a method of manufacturing a capacitor assembly comprising the following steps:
- first terminal plate and a second terminal plate each having at one end projections adapted to engage in the recesses of the power rails;
- connection plates Connecting the connection plates with the contact surfaces, so that the first connection plate is aligned with the first contact surface and the second connection plate with the second contact surface; and Connecting the terminal plates to the power rails such that the first terminal plate is aligned parallel to the first power rail and the second terminal plate is parallel to the second power rail and the extensions of the first terminal plate engage with the recesses of the first power rail and the extensions of the second connection plate in the Recesses of the second power rail intervene.
- the present invention provides a manufacturing concept for integrating capacitors into hybrid power modules based on a specific implementation of capacitor terminals and power rails.
- a process description according to the invention defines how the particular type of condenser is attached to the substrate.
- the manufacturing process according to the invention runs in this case so that the power rails are first applied without a capacitor to the substrate of the power module.
- the module capacitor consisting of the capacitor and the terminal plates, is then connected to the five power rails by means of simple soldering.
- the method of the invention may include a step of connecting the power rails to a substrate before connecting the terminal plates to the power rails. Due to the proposed order, a strong temperature influence on the capacitor can be avoided if the power rails are soldered to the substrate.
- the substrate may be the substrate of the power module.
- the substrate may be designed as a printed circuit board.
- the method may include a step of forming solder joints formed to at least some of the extensions of the first land with the first land
- connection plates can each have an angled region, which adjoin in each case a second angled region of the power rails and the method can include a step of creating a first screw connection for connecting the angled region of the first connection plate to the second angled regions of the first power rail and a second screw connection for connecting the angled portion of the second terminal plate with the second angled portions of the second power rail.
- the screw connection allows, in addition to the solder joint, a separate or additional electrical and mechanical connection of the capacitor.
- FIG. 2 shows an illustration of the capacitor arrangement according to the invention during production
- FIG. 5 shows an illustration of a power electronics module with the capacitor arrangement according to the invention
- FIG. 6 shows a capacitor arrangement according to a further exemplary embodiment of the present invention.
- FIG. 7 is an illustration of a power rail and a terminal plate according to an embodiment of the present invention.
- the same or similar reference numerals will be used for the elements shown in the various drawings and similar, and a repetitive description of these elements will be omitted.
- Fig. 1 shows a capacitor arrangement according to an embodiment of the present invention.
- the capacitor arrangement has a capacitor 100, a first connection plate 102 and a second connection plate 103.
- the terminal plates 102, 103 are each connected to contact surfaces of the capacitor 100.
- the capacitor assembly may further include a first power rail 105 and a second power rail 106.
- the power rails 105, 106 may be arranged on a substrate 108, for example the substrate of a power module, and connected to the terminal plates 102, 103.
- the capacitor 100 between the terminal plates 102, 103 and the terminal plates may in turn be arranged between the power rails 105, 106.
- the capacitor 100 is aligned parallel and above a surface of the substrate 108.
- the contact surfaces of the capacitor 100 may be aligned opposite and parallel to each other.
- the first contact surface is connected to the first connection plate 102 and the second contact surface is connected to the second connection plate 103.
- the terminal plates 102, 103 may be aligned parallel to the contact surfaces.
- the terminal plates 102, 103 may be made of metal.
- the terminal plates 102, 103 and the contact surfaces may be soldered to provide an electrical and mechanical connection. To create the solder joints known soldering can be used.
- the terminal plates 102, 103 each have extensions 110 on the end facing the substrate 108.
- the extensions 110 can be formed by rectangular recesses in the closing plates 102, 103 may be formed.
- the extensions 110 may be formed over the entire length of the end of the terminal plates 102, 103 or only in partial areas of the terminal plates 102, 103.
- the power rails 105, 106 may be made of metal and be adapted in size and shape to the terminal plates 102, 103. Thus, the terminal plates 102, 103 may be applied directly to the power rails 105, 106.
- the power rails 105, 106 may have a bend at the end facing the substrate 108. According to this embodiment, the power rails 105, 106 are bent at right angles, respectively in the direction of the adjacent connection plates 102, 103. In the area of the bend, the power rails 105, 106 have recesses. In the recesses, the extensions 110 of the connection plates 102, 103 engage. A size and shape of the recesses may therefore be adapted to the extensions 110.
- the connecting plates can be inserted from above, along the power rails 105, 106, with the projections 110 into the recesses and then rest on the angled region of the power rails 105, 106.
- the power rails 105, 106 may have connection contacts 112. Via the connection contacts 1 12, the power rails 105, 106 can be electrically and mechanically connected to the substrate 108 by means of known methods, for example soldering methods.
- connection plates 102, 103 and the power rails 105, 106 can each have an angled region 14.
- the angled portions 1 14 are formed by extensions of the terminal plates 102, 103 and the power rails 105, 106. In this case, the extensions are bent at right angles to the side facing away from the capacitor 100, in order to create the angled regions 114.
- the above angled areas 1 14 of the terminal plates 102, 103 and the power rails 105, 106 may each overlap and thus form laminated cores.
- the sheet metal pacts may have a hole for receiving a screw.
- FIG. 2 shows the capacitor arrangement according to the invention during manufacture, in which the module capacitor, which consists of the capacitor 100 and the connection plates 102, 103 soldered to the capacitor 100, is subsequently pushed between the power rails 105, 106. Subsequently, this means that the power rails 105, 106 were previously connected to the substrate 108.
- the recesses 211 of the power rails 105, 106 are shown in FIG.
- the recesses 211 according to this embodiment are rectangular holes, which are arranged in the region of the rectangular bends of the power rails 105, 106 and extend on both sides of the bend.
- the capacitor 100, the power rails 105, 106 and the connection plates 102, 103 can be provided.
- the connecting plates 102, 103 are connected to the contact surfaces of the capacitor 100.
- a soldering process can be used.
- the connection plates 102, 103 are connected to the power rails 105, 106.
- the connection can be realized by a plug connection by means of the extensions 11 and the recesses 211, a solder connection and additionally by a screw connection of the angled regions 114.
- the angled regions 114 can be formed with the power rails 105, 106 before or after the assembly of the capacitor module 100, 102, 103.
- the terminal plates 102, 103 for the capacitor 100 can be applied to the capacitor 100 according to a known process.
- the capacitor 100 can be equipped with specially shaped (grooved) connection plates 102, 103.
- the power rails 105, 106 can be applied to the substrate 108 by a known process. This may include applying the "metallic" power rails 105, 106 under high temperature to copper traces of the carrier substrate 108.
- Dummy capacitor can be positioned including terminals or it can be ensured by means of a corresponding soldering device, the correct positioning of the power rail connections.
- the actual capacitor 100 with the connection plates 102, 103 can be introduced into the power circuit slots 211 and connected to the power rails 105, 106 by means of a known soldering process or welding process.
- the individual laminated cores can be shaped appropriately and screwed to the intermediate circuit connection.
- the upper capacitor terminals 114 can be angled with the upper power rail connections by 90 ° and then bolted to the DC link connections.
- FIG. 3 shows an illustration of the inventive capacitor arrangement from below.
- contact points of the modulo capacitor with the power rail 106 are shown in an external view.
- the contact points exist in the areas in which the extensions 110 of the connection plate engage in the recesses of the power rail 106.
- the projections 1 10 can be soldered from the outside to the power rail 106.
- FIG. 4 shows an illustration of a partial region of the capacitor arrangement according to the invention.
- further contact points between the module capacitor and the power rail 105 are shown in a view from the inside.
- the contact points are realized by means of the connection contacts 112.
- the connection contacts 112 are realized as angled extensions of the power rail 105.
- the connection contacts 112 can lie flat on a conductor track of the substrate 108 and be soldered to the conductor track.
- the connection contacts 112 may be bent several times, for example at right angles, in order to compensate for thermal and mechanical stresses.
- 5 shows a representation of the capacitor arrangement according to the invention as part of a power electronics module.
- a schematic diagram of the power electronics module is shown having the capacitor arrangement according to the invention.
- the power electronics module has a housing 520.
- the housing 520 encloses the capacitor of the capacitor arrangement at least partially.
- a connecting line is shown, which is connected by means of a screw connection with the capacitor arrangement.
- FIG. 6 shows an illustration of a capacitor arrangement according to the invention according to a further exemplary embodiment of the present invention.
- the capacitor arrangement differs from the preceding embodiments in particular in the design of the power rails. Shown are inter alia a connection plate 603 and a power rail 606 of the capacitor arrangement.
- FIG. 7 shows an illustration of the terminal plate 603 and the power rail 606 of the capacitor arrangement shown in FIG. 6.
- the power rail 606 has recesses into which the extensions 110 of the connection plate 603 can be inserted.
- the power rail 606 may be punched several times on three sides.
- the punched out areas form extensions 730, which can be aligned parallel to the extensions 1 10 of the connection plate 603.
- the extensions 110 of the connection plate 603 can thereby protrude laterally as well as longitudinally beyond the extensions 730 of the power rail 606.
- the non-punched out areas of the power rail 606 are bent over and can form the connection contacts 112 at the ends.
- the extensions 730 may be cut, lasered, or otherwise released.
- the described embodiments are chosen only by way of example and can be combined with each other.
- the capacitor, the terminal plates and the power rails can be made in the illustrated form or in any other suitable form.
- a plurality of capacitors can also be used.
- the steps of integrating the modulo capacitor may be performed in a different order than described.
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
Description
Claims
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102008050452A DE102008050452B4 (de) | 2008-10-08 | 2008-10-08 | Kontaktierungsanordnung für einen Kondensator, Leistungsmodul und Verfahren zum Herstellen eines Leistungsmoduls |
| PCT/DE2009/001398 WO2010040343A1 (de) | 2008-10-08 | 2009-10-08 | Kondensatoranordnung und verfahren zum herstellen einer kondensatoranordnung |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| EP2332247A1 true EP2332247A1 (de) | 2011-06-15 |
Family
ID=41571529
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP09760464A Withdrawn EP2332247A1 (de) | 2008-10-08 | 2009-10-08 | Kondensatoranordnung und verfahren zum herstellen einer kondensatoranordnung |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US8649158B2 (de) |
| EP (1) | EP2332247A1 (de) |
| DE (1) | DE102008050452B4 (de) |
| WO (1) | WO2010040343A1 (de) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102011107193A1 (de) * | 2011-07-13 | 2013-01-17 | Epcos Ag | Elektrische Vorrichtung |
| DE102012222704A1 (de) * | 2012-12-11 | 2014-06-12 | Epcos Ag | Elektrischer Kondensator |
| US9247681B2 (en) * | 2013-03-28 | 2016-01-26 | Blackberry Limited | Electric shielding enclosure including power pack |
| DE102014201631B4 (de) * | 2014-01-30 | 2022-02-03 | Robert Bosch Gmbh | Anordnung zum Kontaktieren elektrischer Komponenten |
| JP6443211B2 (ja) * | 2014-10-31 | 2018-12-26 | 株式会社デンソー | 電力変換装置 |
| DE102015115140B4 (de) * | 2015-09-09 | 2023-12-21 | Infineon Technologies Ag | Stromrichteranordnung mit verbesserter Befestigung |
| US10601335B1 (en) * | 2016-01-15 | 2020-03-24 | Apple Inc. | Low inductance power inverter |
| DE102016100617B4 (de) * | 2016-01-15 | 2019-05-16 | Semikron Elektronik Gmbh & Co. Kg | Leistungshalbleitermodul mit einem Gehäuse und einem Kondensator |
| CN106686937A (zh) * | 2017-03-14 | 2017-05-17 | 深圳市华上科技有限公司 | 采用连接件进行固定的用电设备 |
| DE102017126394A1 (de) * | 2017-11-10 | 2019-05-16 | Valeo Siemens Eautomotive Germany Gmbh | Zwischenkreiskondensatormodul, Leistungselektronikmodul und Leistungselektronikeinrichtung |
| DE102018200332A1 (de) | 2018-01-11 | 2019-07-11 | Robert Bosch Gmbh | Kontaktierungsanordnung und Verfahren zum Ausbilden der Kontaktierungsanordnung |
| DE102018219218A1 (de) | 2018-11-12 | 2020-05-14 | Audi Ag | Kondensatoranordnung |
| CN113196427B (zh) * | 2018-12-25 | 2023-10-13 | 松下知识产权经营株式会社 | 电容器 |
| US11923775B2 (en) | 2018-12-28 | 2024-03-05 | Mitsubishi Electric Corporation | In-vehicle power conversion device |
| WO2021149165A1 (ja) * | 2020-01-21 | 2021-07-29 | 株式会社デンソー | 電力変換器 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1998004029A1 (en) * | 1996-07-22 | 1998-01-29 | Hydro-Quebec | Low stray interconnection inductance power converting module for converting a dc voltage into an ac voltage, and a method therefor |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2777109B1 (fr) | 1998-04-06 | 2000-08-04 | Gec Alsthom Transport Sa | Batterie de condensateurs, dispositif electronique de puissance comportant une telle batterie et ensemble electronique de puissance comportant un tel dispositif |
| US6160696A (en) * | 1998-05-04 | 2000-12-12 | General Electric Company | Modular bus bar and switch assembly for traction inverter |
| DE19826731C2 (de) * | 1998-06-16 | 2000-10-26 | Gruendl & Hoffmann | Halbbrückenbaugruppe |
| DE19847028A1 (de) * | 1998-10-13 | 2000-04-27 | Semikron Elektronik Gmbh | Kondensator für niederinduktive Zwischenkreisaufbauten |
| DE19847029A1 (de) * | 1998-10-13 | 2000-04-27 | Semikron Elektronik Gmbh | Umrichter mit niederinduktivem Kondensator im Zwischenkreis |
| AU1198700A (en) * | 1999-03-16 | 2000-10-04 | Maxwell Energy Products | Low inductance four terminal capacitor lead frame |
| US6958899B2 (en) * | 2003-03-20 | 2005-10-25 | Tdk Corporation | Electronic device |
| DE10326321A1 (de) * | 2003-06-11 | 2005-01-13 | Compact Dynamics Gmbh | Elektronische Baugruppe zum Schalten elektrischer Leistung |
| JP4756935B2 (ja) | 2005-06-29 | 2011-08-24 | 本田技研工業株式会社 | コンデンサ搭載型インバータユニット |
| JP4859443B2 (ja) * | 2005-11-17 | 2012-01-25 | 日立オートモティブシステムズ株式会社 | 電力変換装置 |
-
2008
- 2008-10-08 DE DE102008050452A patent/DE102008050452B4/de not_active Expired - Fee Related
-
2009
- 2009-10-08 EP EP09760464A patent/EP2332247A1/de not_active Withdrawn
- 2009-10-08 WO PCT/DE2009/001398 patent/WO2010040343A1/de not_active Ceased
- 2009-10-08 US US13/123,507 patent/US8649158B2/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1998004029A1 (en) * | 1996-07-22 | 1998-01-29 | Hydro-Quebec | Low stray interconnection inductance power converting module for converting a dc voltage into an ac voltage, and a method therefor |
Also Published As
| Publication number | Publication date |
|---|---|
| DE102008050452B4 (de) | 2010-09-16 |
| US8649158B2 (en) | 2014-02-11 |
| WO2010040343A1 (de) | 2010-04-15 |
| DE102008050452A1 (de) | 2010-04-22 |
| US20110242725A1 (en) | 2011-10-06 |
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