EP2312908B1 - Hotplate with sensors - Google Patents

Hotplate with sensors Download PDF

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Publication number
EP2312908B1
EP2312908B1 EP10187083.0A EP10187083A EP2312908B1 EP 2312908 B1 EP2312908 B1 EP 2312908B1 EP 10187083 A EP10187083 A EP 10187083A EP 2312908 B1 EP2312908 B1 EP 2312908B1
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Prior art keywords
sensors
heating elements
cover plate
grid
hotplate according
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EP10187083.0A
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German (de)
French (fr)
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EP2312908A1 (en
Inventor
Jose Alfonso Santolaria Lorenzo
Rene Schmalenstrot
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BSH Hausgeraete GmbH
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BSH Hausgeraete GmbH
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Priority to EP10187083.0A priority Critical patent/EP2312908B1/en
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B6/00Heating by electric, magnetic or electromagnetic fields
    • H05B6/02Induction heating
    • H05B6/06Control, e.g. of temperature, of power
    • H05B6/062Control, e.g. of temperature, of power for cooking plates or the like
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2213/00Aspects relating both to resistive heating and to induction heating, covered by H05B3/00 and H05B6/00
    • H05B2213/05Heating plates with pan detection means

Description

Die Erfindung betrifft ein Kochfeld mit Sensoren nach dem Oberbegriff des Anspruchs 1. Ein solches Kochfeld ist aus der DE 37 33 108 C1 bekannt.The invention relates to a hob with sensors according to the preamble of claim 1. Such a hob is from the DE 37 33 108 C1 known.

Aus dem Stand der Technik sind Induktionskochfelder bekannt, die eine automatische Detektion von auf das Kochfeld aufgestellten Kochgeschirrelementen ermöglichen. Dazu werden entweder die Heizinduktoren des Kochfelds selbst als Sensoren genutzt oder es werden im Zentrum der Induktoren separate induktive Sensoren angeordnet, um das Kochgeschirrelement zu detektieren.Induction hobs are known from the prior art, which enable automatic detection of cooking utensils placed on the hob. For this purpose, either the Heizinduktoren the hob themselves are used as sensors or separate inductive sensors are arranged in the center of the inductors to detect the cookware element.

In beiden Fällen ist die Detektion des Kochgeschirrelements räumlich relativ niedrig auflösend. Die räumliche Auflösung ist durch den Abstand der Heizinduktoren begrenzt. Ferner ist die gleichzeitige Verwendung der Heizinduktoren als Sensoren mit einem zusätzlichen Aufwand verbunden, da die Heizinduktoren wahlweise mit einer Ausleseelektronik oder mit der Leistungselektronik verbunden werden müssen, was eine zusätzliche Schaltung und/oder zusätzliche Verkabelung erfordert. Ein hoher Montageaufwand durch aufwendige Verkabelung wird auch dann notwendig, wenn die Sensoren in die Heizelemente integriert werden.In both cases, the detection of the cookware element spatially relatively low resolution. The spatial resolution is limited by the distance between the heating inductors. Furthermore, the simultaneous use of the heating inductors as sensors is associated with an additional expense, since the heating inductors must either be connected to a readout electronics or to the power electronics, which requires additional circuitry and / or additional wiring. A high installation cost due to complex wiring is also necessary if the sensors are integrated into the heating elements.

Die DE 37 33 108 C1 beschreibt ein Kochfeld mit einer Abdeckplatte, mehreren unter der Abdeckplatte angeordneten Heizelementen und mehreren Sensoren zum Detektieren eines auf die Abdeckplatte aufgestellten Kochgeschirrelements, wobei die Sensoren in einer Schicht zwischen der Abdeckplatte und den Heizelementen angeordnet sind und ein Abstand zwischen benachbarten Sensoren kleiner ist als ein Abstand zwischen benachbarten Heizelementen, wobei die Heizelemente und die Sensoren jeweils in einem Raster angeordnet sind.The DE 37 33 108 C1 describes a cooktop having a cover plate, a plurality of heating elements disposed beneath the cover plate, and a plurality of sensors for detecting a cookware element mounted on the cover plate, wherein the sensors are disposed in a layer between the cover plate and the heating elements and a distance between adjacent sensors is less than a distance between adjacent heating elements, wherein the heating elements and the sensors are each arranged in a grid.

Aus der DE 10 2006 043 182 A1 ist ein Kochfeld mit einer Abdeckplatte bekannt mit vier unter der Abdeckplatte angeordneten Heizelementen und vier Sensoren zur Erfassung einer Position eines auf die Abdeckplatte aufgestellten Kochgeschirrelements, wobei die Sensoren in einer Schicht zwischen der Abdeckplatte und den Heizelementen angeordnet sind. Die Heizelemente, die jeweils unter Kochzonen angeordnet sind, und die Sensoren, die jeweils über den Heizelementen angeordnet sind, sind jeweils in einem Raster angeordnet. Jedem Heizelement ist ein Sensor zugeordnet.From the DE 10 2006 043 182 A1 is a hob with a cover known with four arranged under the cover plate heating elements and four sensors for detecting a position of a set on the cover plate cooking utensil, the sensors arranged in a layer between the cover plate and the heating elements are. The heating elements, which are each arranged below cooking zones, and the sensors, which are each arranged above the heating elements, are each arranged in a grid. Each heating element is assigned a sensor.

Der Erfindung liegt daher insbesondere die Aufgabe zugrunde, in einer kostengünstigen Weise eine hochauflösende und montagefreundliche Topfdetektionsanordnung für ein Kochfeld bereitzustellen, wobei die räumliche Auflösung der Topfdetektoren verbessert werden soll.The invention is therefore in particular the object of providing a high-resolution and easy-to-install pot detection arrangement for a hob in a cost-effective manner, wherein the spatial resolution of the pot detectors to be improved.

Die Aufgabe wird insbesondere durch ein Kochfeld nach dem Anspruch 1 gelöst. Vorteilhafte Ausgestaltungen und Weiterbildungen der Erfindung ergeben sich aus den Unteransprüchen.The object is achieved in particular by a hob according to claim 1. Advantageous embodiments and modifications of the invention will become apparent from the dependent claims.

Die Erfindung geht insbesondere aus von einem Kochfeld mit einer Abdeckplatte, mehreren unter der Abdeckplatte anordneten Heizelementen und mehreren Sensoren zum Detektieren eines auf die Abdeckplatte aufgestellten Kochgeschirrelements, wobei die Sensoren in einer Schicht zwischen der Abdeckplatte und den Heizelementen angeordnet sind. Dadurch kann eine Unabhängigkeit der Sensoren von den Heizelementen erreicht werden. Die Anzahl, Verteilung, Größe und Verkabelung der Sensoren kann völlig unabhängig von der Anzahl, Verteilung und Größe der Heizelemente gestaltet werden und im Hinblick auf eine bessere und hochauflösendere Topfdetektion optimiert werden. Ferner kann die Montage und die Verkabelung vereinfacht werden.More particularly, the invention is directed to a hob having a cover plate, a plurality of heating elements disposed beneath the cover plate, and a plurality of sensors for detecting a cooking utensil mounted on the cover plate, the sensors being disposed in a layer between the cover plate and the heating elements. As a result, an independence of the sensors can be achieved by the heating elements. The number, distribution, size and cabling of the sensors can be made completely independent of the number, distribution and size of the heating elements and optimized for a better and higher-resolution pot detection. Furthermore, the assembly and the wiring can be simplified.

Die Sensoren können bezüglich ihres Sensortyps alle als kapazitive oder alle als optische Sensoren ausgebildet sein. Vorzugsweise sind sie alle als induktive Sensoren ausgebildet. Es kann auch vorgesehen sein, dass die Mehrzahl der Sensoren zumindest einen Sensor eines ersten Sensortyps und zumindest einen Sensor eines zweiten Sensortyps aufweist.With regard to their sensor type, the sensors can all be designed as capacitive or all as optical sensors. Preferably, they are all designed as inductive sensors. It can also be provided that the plurality of sensors has at least one sensor of a first sensor type and at least one sensor of a second sensor type.

Die Vorteile der Erfindung kommen insbesondere dann zum Tragen, wenn die Heizelemente Induktoren sind.The advantages of the invention are particularly useful when the heating elements are inductors.

Die räumliche Auflösung der Sensoranordnung ist gegenüber der Detektion mit Hilfe von Heizinduktoren verbessert, da der Abstand zwischen den benachbarten Sensoren kleiner ist als ein Abstand zwischen den benachbarten Heizelementen bzw. Heizinduktoren, wobei die Heizelemente und die Sensoren jeweils in einem Raster angeordnet sind, wobei das Raster der Sensoren engmaschiger als das Raster der Heizelemente ist. Auch die Rasterform kann sich unterscheiden. Beispielsweise können die Heizinduktoren bzw. Heizelemente in einem rechtwinkligen Raster angeordnet sein, während die Sensoren in einem Dreiecksnetz oder Wabennetz angeordnet sein können oder umgekehrt.The spatial resolution of the sensor arrangement is improved with respect to the detection by means of heating inductors, since the distance between the adjacent sensors smaller is as a distance between the adjacent heating elements or heating inductors, wherein the heating elements and the sensors are each arranged in a grid, wherein the grid of the sensors is more closely meshed than the grid of the heating elements. The raster shape can also differ. For example, the heating inductors or heating elements can be arranged in a rectangular grid, while the sensors can be arranged in a triangular mesh or honeycomb network, or vice versa.

In einer besonders kostengünstigen Ausgestaltung der Erfindung können die induktiven Sensoren aus serigrafisch hergestellten Leiterschleifen bestehen. Alternativ können die induktiven Sensoren aus flachen Folienkabeln hergestellt werden, die beispielsweise zur Verkabelung von LCD-Displays bekannt sind.In a particularly inexpensive embodiment of the invention, the inductive sensors may consist of serigraphic conductor loops. Alternatively, the inductive sensors may be fabricated from flat foil cables known, for example, for cabling LCD displays.

Die Bauteilvielfalt des Kochfelds kann reduziert werden, wenn die Induktoren auf einer Rückseite einer Abdeckplatte aufgebracht sind. Alternativ dazu können die Sensoren auf eine zwischen den Heizelementen und der Abdeckplatte angeordnete Trägermembran auf einem Trägersieb, einer Trägerfolie oder Trägerplatte aufgebracht sein. In allen Fällen können serigrafische Verfahren zum Aufdruck von Leiterbahnen verwendet werden, die beispielsweise aus Verfahren zum Herstellen von Heizungen für Autoscheiben bekannt sind.The variety of components of the hob can be reduced when the inductors are applied to a back of a cover plate. Alternatively, the sensors may be applied to a carrier membrane arranged between the heating elements and the cover plate on a carrier screen, a carrier foil or carrier plate. In all cases, serigraphic methods can be used to print printed circuit traces, which are known, for example, from methods for producing car window heaters.

Nach einer weiteren Ausgestaltung der Erfindung umfasst das Kochfeld eine Steuereinheit zur Auswertung der Signale der Sensoren zur Detektion des Kochgeschirrelements. Die Steuereinheit kann insbesondere dazu ausgelegt sein, neben den Signalen der Sensoren auch mittels der Induktoren erfasste Signale zur Detektion des Kochgeschirrelements zu nutzen. Dazu kann die Anzahl der notwendigen Sensoren bei einer vorgegebenen räumlichen Auflösung reduziert werden. Wenn die Sensoren in einem Raster angeordnet sind, können insbesondere diejenigen Rasterpunkte ausgespart werden, die den Mittelpunkten der Induktoren entsprechen. Die entsprechende Information kann durch die Messung der effektiven Gesamtinduktivität und/oder des Verlustwinkels des aus dem Heizinduktor und dem Kochgeschirrelement bestehenden Gesamtsystems ermittelt werden.According to a further embodiment of the invention, the hob comprises a control unit for evaluating the signals of the sensors for detecting the cooking utensil element. The control unit may in particular be designed to use signals detected by the inductors in addition to the signals from the sensors for detecting the cooking utensil element. For this purpose, the number of necessary sensors can be reduced at a given spatial resolution. If the sensors are arranged in a grid, in particular those grid points can be omitted, which correspond to the centers of the inductors. The corresponding information can be determined by measuring the total effective inductance and / or the loss angle of the overall system consisting of the heating inductor and the cookware element.

Weitere Vorteile ergeben sich aus der folgenden Zeichnungsbeschreibung. In der Zeichnung sind Ausführungsbeispiele der Erfindung dargestellt. Die Zeichnung, die Beschreibung und die Ansprüche enthalten zahlreiche Merkmale in Kombination.Further advantages emerge from the following description of the drawing. In the drawings, embodiments of the invention are shown. The drawing, the description and the claims contain numerous features in combination.

Es zeigen:

Fig. 1
ein Kochfeld mit einer Abdeckplatte, vier Heizelementen und einem Raster von induktiven Sensoren in einer schematischen Draufsicht,
Fig. 2
eine Schnittdarstellung des Kochfelds aus Fig. 1 mit einem der induktiven Sensoren,
Fig. 3
die Abdeckplatte des Kochfelds aus Fig. 1 und 2 in einer Ansicht von der Rückseite,
Fig. 4
eine Explosionsdarstellung eines erfindungsgemäßen Kochfelds nach einer weiteren Ausgestaltung der Erfindung, und
Fig. 5
ein Kochfeld nach einer weiteren Ausgestaltung der Erfindung mit ausgesparten Rasterpunkten.
Show it:
Fig. 1
a hob with a cover plate, four heating elements and a grid of inductive sensors in a schematic plan view,
Fig. 2
a sectional view of the hob off Fig. 1 with one of the inductive sensors,
Fig. 3
the cover plate of the hob off Fig. 1 and 2 in a view from the back,
Fig. 4
an exploded view of a cooktop according to the invention according to a further embodiment of the invention, and
Fig. 5
a hob according to a further embodiment of the invention with recessed halftone dots.

Die Figuren 1 bis 3 zeigen ein Kochfeld mit einer Abdeckplatte 10 aus Glas oder Glaskeramik und mehreren unter der Abdeckplatte angeordneten Heizelementen 12a - 12d. Das Kochfeld ist ein Induktionskochfeld und die Heizelemente 12a - 12d sind Induktoren, die im Betrieb des Kochfelds ein hochfrequentes Magnetfeld erzeugen, das Wirbelströme im Boden eines Kochgeschirrelements 14 bzw. Kochtopfs erzeugt, um diesen zu erhitzen.The FIGS. 1 to 3 show a hob with a cover plate 10 made of glass or glass ceramic and a plurality of under the cover plate arranged heating elements 12a - 12d. The cooktop is an induction cooktop and the heating elements 12a-12d are inductors that generate a high-frequency magnetic field during operation of the cooktop that generates eddy currents in the bottom of a cookware element 14 to heat it.

An der Rückseite 20 der Abdeckplatte 10 ist ferner eine Vielzahl von induktiven Sensoren 16 zum Detektieren einer Größe und Position des Kochgeschirrelements 14 auf der Abdeckplatte 10 angeordnet. Die Sensoren 16 sind in einer Schicht zwischen der Abdeckplatte 10 und den Heizelementen 12a - 12d angeordnet (Fig. 2), deren Dicke unterhalb von ca. 1-2 mm liegt, um die induktive Kopplung zwischen den Heizelementen 12a - 12d und dem davon zu beheizenden Kochgeschirrelement 14 nicht zu stören.On the back 20 of the cover plate 10, a plurality of inductive sensors 16 for detecting a size and position of the cookware element 14 is further arranged on the cover plate 10. The sensors 16 are arranged in a layer between the cover plate 10 and the heating elements 12a-12d ( Fig. 2 ), whose thickness is below about 1-2 mm, so as not to disturb the inductive coupling between the heating elements 12a-12d and the cooking utensil element 14 to be heated therefrom.

Die Sensoren 16 sind im Ausführungsbeispiel alle als induktive Sensoren 16 ausgebildet. Es kann auch vorgesehen sein, dass zumindest ein Sensor 16 ein kapazitiver und/oder zumindest ein Sensor 16 ein optischer Sensor ist.The sensors 16 are all configured as inductive sensors 16 in the exemplary embodiment. It can also be provided that at least one sensor 16 is a capacitive and / or at least one sensor 16 is an optical sensor.

In dem in den Figuren 1, 2 und 3 dargestellten Ausführungsbeispiel ist diese Schicht 18 eine serigrafisch auf die Rückseite 20 der Abdeckplatte 10 aufgebrachte Schicht aus einer leitfähigen, für den Siebdruck geeigneten Paste, die nach dem Druckvorgang gehärtet oder gesintert werden kann. Die induktiven Sensoren 16 sind daher aus serigrafisch hergestellten Leiterschleifen gebildet, deren Enden über flache Folienleitungen 22 oder dünne, auf die Rückseite 20 der Abdeckplatte 10 aufgeklebte Kupferdrähte mit einer Treibereinheit 24 zum Betreiben der Sensoren 16 der Schicht 18 verbunden sind.In the in the FIGS. 1, 2 and 3 illustrated embodiment, this layer 18 is a serigraphically applied to the back 20 of the cover plate 10 layer of a conductive, suitable for screen printing paste, which can be cured or sintered after printing. The inductive sensors 16 are therefore formed from serigraphic conductor loops, the ends of which are connected via flat foil lines 22 or thin copper wires glued to the back side 20 of the cover plate 10 to a driver unit 24 for operating the sensors 16 of the layer 18.

Die Treibereinheit 24 kann Messströme in den Sensoren 16 erzeugen, um die Induktivität und/oder einen Verlustwinkel eines aus den Leiterschleifen und dem Kochgeschirrelement 14 gebildeten Gesamtsystems zu detektieren und daraus auf die Anwesenheit des Kochgeschirrelements 14 zu schließen.The driver unit 24 can generate measurement currents in the sensors 16 in order to detect the inductance and / or a loss angle of an overall system formed from the conductor loops and the cookware element 14 and to deduce the presence of the cookware element 14 from this.

Die Treibereinheit 24 wird genauso wie die hier nicht explizit dargestellte Leistungselektronik des Kochfelds von einer Steuereinheit 26 gesteuert, die als frei programmierbare Recheneinheit ausgebildet ist und die in alternativen Ausgestaltungen der Erfindung auch einstückig mit der Treibereinheit 24 ausgebildet sein kann.The driver unit 24 is just like the not explicitly shown power electronics of the hob controlled by a control unit 26, which is designed as a freely programmable arithmetic unit and which may be formed integrally with the driver unit 24 in alternative embodiments of the invention.

Die Heizelemente 12a-12b und die Sensoren 16 sind jeweils in einem Raster angeordnet, wobei das Raster der Sensoren 16 weitaus engmaschiger ist als das Raster der Heizelemente 12a - 12d. Eine Gitterkonstante bzw. ein Abstand zwischen zwei benachbarten Punkten des Rasters der Heizelemente 12a - 12d ist in dem in Fig. 1 dargestellten Ausführungsbeispiel viermal so groß wie eine Gitterkonstante des Rasters der Sensoren 16. Der Erfindungsgedanke ist auch auf Matrix-Kochfelder mit einem engmaschigeren Raster von Heizelementen 12a - 12d anwendbar. Solche Kochfelder umfassen eine große Zahl von Induktoren, beispielsweise zwischen 16 und 32 Induktoren. In diesem Fall kann das Rastermaß des Sensorrasters doppelt so eng sein wie das Rastermaß der Induktoren bzw. Heizelemente 12a-12d.The heating elements 12a-12b and the sensors 16 are each arranged in a grid, wherein the grid of the sensors 16 is much closer meshed than the grid of the heating elements 12a - 12d. A lattice constant or a distance between two adjacent points of the grid of the heating elements 12a-12d is in the in Fig. 1 illustrated embodiment, four times as large as a lattice constant of the grid of the sensors 16. The inventive concept is also applicable to matrix cooktops with a closer-meshed grid of heating elements 12a - 12d. Such hobs comprise a large number of inductors, for example between 16 and 32 inductors. In this case, the pitch of the sensor raster may be twice as narrow as the pitch of the inductors or heating elements 12a-12d.

Die Figuren 4 und 5 zeigen alternative Ausführungsbeispiele der Erfindung. Um Wiederholungen zu vermeiden, beschränkt sich die nachfolgende Figurenbeschreibung auf Unterschiede zu dem in den Figuren 1 bis 3 dargestellten Ausführungsbeispiel. Zur Beschreibung der gleichbleibenden Merkmale wird auf die Beschreibung zu den Figuren 1 bis 3 verwiesen.The FIGS. 4 and 5 show alternative embodiments of the invention. To avoid repetition, the following description of the figures is limited to differences to those in the FIGS. 1 to 3 illustrated embodiment. As description The consistent features will be on the description of the FIGS. 1 to 3 directed.

Fig. 4 zeigt eine Explosionsdarstellung eines Kochfelds nach einer weiteren Ausgestaltung der Erfindung. Die Sensoren 16 sind in einer von der Abdeckplatte 10 trennbaren Schicht 18 auf einer Trägermembran 30 angebracht. Die Trägermembran 30 ist beispielsweise eine temperaturresistente Folie und die Sensoren 16 können im Siebdruck auf die Trägermembran 30 aufgedruckt sein. Die gesamte Verkabelung der Sensoren 16 auf der Trägermembran 30 erfolgt über einen gemeinsamen Anschluss 32, der bei der Montage des Kochfelds einfach in einen entsprechenden Stecker eingesteckt werden kann. Das Auslesen der Sensoren durch die Steuereinheit 26 bzw. die Treibereinheit 24. ist daher besonders einfach. Fig. 4 shows an exploded view of a hob according to a further embodiment of the invention. The sensors 16 are mounted in a separable from the cover plate 10 layer 18 on a support membrane 30. The carrier membrane 30 is, for example, a temperature-resistant film and the sensors 16 may be screen-printed onto the carrier membrane 30. The entire wiring of the sensors 16 on the support membrane 30 via a common terminal 32, which can be easily plugged into a corresponding connector during assembly of the hob. The reading out of the sensors by the control unit 26 or the driver unit 24 is therefore particularly simple.

Fig. 5 zeigt ein weiteres alternatives Ausführungsbeispiel der Erfindung. In diesem Ausführungsbeispiel der Erfindung sind die Sensoren 16 in einem Raster angeordnet, wobei diejenigen Rasterpunkte ausgespart sind, die den Mittelpunkten der Induktoren bzw. Heizelemente 12a - 12d entsprechen. Da die Heizelemente 12a - 12d ebenfalls als Sensoren genutzt werden können, kann die ausgesparten Rasterpunkte betreffende Information durch die Nutzung der Induktoren 12a - 12d als zusätzliche Sensoren gewonnen werden. Fig. 5 shows a further alternative embodiment of the invention. In this embodiment of the invention, the sensors 16 are arranged in a grid, wherein those grid points are recessed, which correspond to the centers of the inductors or heating elements 12a - 12d. Since the heating elements 12a-12d can also be used as sensors, the information relating to the recessed halftone dots can be obtained by using the inductors 12a-12d as additional sensors.

Da in den Mittelpunkten der Heizelemente 12a - 12d auch die höchsten Temperaturen auftreten, wird durch das Aussparen dieser Punkte auch die für die Sensoren 16 zu erwartende Maximaltemperatur reduziert. Als Folge können die Anforderungen an die Temperaturbeständigkeit der Sensoren 16 abgeschwächt werden und weitere Kosteneinsparungspotentiale erschlossen werden.Since the highest temperatures also occur in the center points of the heating elements 12a-12d, the omission of these points also reduces the maximum temperature to be expected for the sensors 16. As a result, the temperature stability requirements of the sensors 16 can be mitigated and further cost saving potentials can be developed.

Bezugszeichenreference numeral

1010
Abdeckplattecover
1212
Heizelementheating element
1414
KochgeschirrelementCookware element
1616
Sensorsensor
1818
Schichtlayer
2020
Rückseiteback
2222
Folienleitungfilm line
2424
Treibereinheitdriver unit
2626
Steuereinheitcontrol unit
2828
Bedienelementoperating element
3030
Trägermembransupport membrane
3232
Anschlussconnection

Claims (11)

  1. Hotplate with a cover plate (10), a plurality of heating elements (12a - 12d) arranged below the cover plate (10) and a plurality of sensors (16) for detecting a cookware element (14) placed on the cover plate (10), wherein the sensors (16) are arranged in a layer (18) between the cover plate (10) and the heating elements (12a - 12d) and a distance between adjacent sensors (16) is less than a distance between adjacent heating elements (12a - 12d), wherein the heating elements (12a - 12d) and the sensors (16) are arranged in a grid in each case, characterised in that the grid of the sensors (16) is more finely-meshed than the grid of the heating elements (12a - 12d).
  2. Hotplate according to claim 1, characterised in that the heating elements (12a - 12d) are inductors.
  3. Hotplate according to one of the preceding claims, characterised in that the sensors (16) comprise inductive sensors (16), in particular the sensors (16) are all inductive sensors (16).
  4. Hotplate according to claim 3, characterised in that the inductive sensors (16) comprise serigraphically produced conductor loops.
  5. Hotplate according to claim 3 or 4, characterised in that the inductive sensors (16) comprise flat foil cables.
  6. Hotplate according to one of claims 3 to 5, characterised in that the inductive sensors (16) are attached to a rear side (20) of the cover plate (10).
  7. Hotplate according to one of claims 1 to 5, characterised in that the sensors (16) are placed on a support membrane arranged between the heating elements (12a - 12d) and the cover plate (10).
  8. Hotplate according to one of the preceding claims, characterised by a control unit (26) for evaluating the signals of the sensors (16) in order to detect the cookware element (14).
  9. Hotplate according to claims 2 and 8, characterised in that the control unit (26) is configured, in addition to the signals of the sensors (16), to also use signals captured by the heating elements (12a - 12d) in order to detect the cookware element (14).
  10. Hotplate according to claim 9, characterised in that the sensors (16) are arranged in a grid, wherein grid points which correspond to the centre points of the heating elements (12a - 12d) are omitted.
  11. Hotplate according to one of the preceding claims, characterised in that the sensors (16) comprise at least one capacitive sensor and/or at least one optical sensor.
EP10187083.0A 2009-10-13 2010-10-11 Hotplate with sensors Active EP2312908B1 (en)

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Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP09382204 2009-10-13
ES200931011A ES2376566B1 (en) 2009-10-13 2009-11-18 COOKING FIELD WITH INDUCTIVE SENSORS.
EP10187083.0A EP2312908B1 (en) 2009-10-13 2010-10-11 Hotplate with sensors

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EP2312908B1 true EP2312908B1 (en) 2017-08-02

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160302263A1 (en) * 2015-04-10 2016-10-13 E.G.O. Elektro-Geraetebau Gmbh Induction hob and flexible support for an induction hob
WO2021045494A1 (en) 2019-09-02 2021-03-11 Samsung Electronics Co., Ltd. Cooking apparatus and method for controlling the same

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2792951B1 (en) * 2013-04-18 2019-11-06 BSH Hausgeräte GmbH Cooking top
DE102014214795A1 (en) * 2014-07-28 2016-01-28 E.G.O. Elektro-Gerätebau GmbH Method and device for detecting the position of a pot on an induction hob
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Also Published As

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EP2312908A1 (en) 2011-04-20
ES2376566A1 (en) 2012-03-15
ES2376566B1 (en) 2013-01-29
ES2639022T3 (en) 2017-10-25

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