EP2312908B1 - Hotplate with sensors - Google Patents
Hotplate with sensors Download PDFInfo
- Publication number
- EP2312908B1 EP2312908B1 EP10187083.0A EP10187083A EP2312908B1 EP 2312908 B1 EP2312908 B1 EP 2312908B1 EP 10187083 A EP10187083 A EP 10187083A EP 2312908 B1 EP2312908 B1 EP 2312908B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- sensors
- heating elements
- cover plate
- grid
- hotplate according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000010438 heat treatment Methods 0.000 claims description 50
- 230000001939 inductive effect Effects 0.000 claims description 15
- 239000012528 membrane Substances 0.000 claims description 7
- 239000004020 conductor Substances 0.000 claims description 4
- 239000011888 foil Substances 0.000 claims description 4
- 230000003287 optical effect Effects 0.000 claims description 3
- 238000010411 cooking Methods 0.000 description 7
- 238000001514 detection method Methods 0.000 description 5
- 230000006698 induction Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000002241 glass-ceramic Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B6/00—Heating by electric, magnetic or electromagnetic fields
- H05B6/02—Induction heating
- H05B6/06—Control, e.g. of temperature, of power
- H05B6/062—Control, e.g. of temperature, of power for cooking plates or the like
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2213/00—Aspects relating both to resistive heating and to induction heating, covered by H05B3/00 and H05B6/00
- H05B2213/05—Heating plates with pan detection means
Description
Die Erfindung betrifft ein Kochfeld mit Sensoren nach dem Oberbegriff des Anspruchs 1. Ein solches Kochfeld ist aus der
Aus dem Stand der Technik sind Induktionskochfelder bekannt, die eine automatische Detektion von auf das Kochfeld aufgestellten Kochgeschirrelementen ermöglichen. Dazu werden entweder die Heizinduktoren des Kochfelds selbst als Sensoren genutzt oder es werden im Zentrum der Induktoren separate induktive Sensoren angeordnet, um das Kochgeschirrelement zu detektieren.Induction hobs are known from the prior art, which enable automatic detection of cooking utensils placed on the hob. For this purpose, either the Heizinduktoren the hob themselves are used as sensors or separate inductive sensors are arranged in the center of the inductors to detect the cookware element.
In beiden Fällen ist die Detektion des Kochgeschirrelements räumlich relativ niedrig auflösend. Die räumliche Auflösung ist durch den Abstand der Heizinduktoren begrenzt. Ferner ist die gleichzeitige Verwendung der Heizinduktoren als Sensoren mit einem zusätzlichen Aufwand verbunden, da die Heizinduktoren wahlweise mit einer Ausleseelektronik oder mit der Leistungselektronik verbunden werden müssen, was eine zusätzliche Schaltung und/oder zusätzliche Verkabelung erfordert. Ein hoher Montageaufwand durch aufwendige Verkabelung wird auch dann notwendig, wenn die Sensoren in die Heizelemente integriert werden.In both cases, the detection of the cookware element spatially relatively low resolution. The spatial resolution is limited by the distance between the heating inductors. Furthermore, the simultaneous use of the heating inductors as sensors is associated with an additional expense, since the heating inductors must either be connected to a readout electronics or to the power electronics, which requires additional circuitry and / or additional wiring. A high installation cost due to complex wiring is also necessary if the sensors are integrated into the heating elements.
Die
Aus der
Der Erfindung liegt daher insbesondere die Aufgabe zugrunde, in einer kostengünstigen Weise eine hochauflösende und montagefreundliche Topfdetektionsanordnung für ein Kochfeld bereitzustellen, wobei die räumliche Auflösung der Topfdetektoren verbessert werden soll.The invention is therefore in particular the object of providing a high-resolution and easy-to-install pot detection arrangement for a hob in a cost-effective manner, wherein the spatial resolution of the pot detectors to be improved.
Die Aufgabe wird insbesondere durch ein Kochfeld nach dem Anspruch 1 gelöst. Vorteilhafte Ausgestaltungen und Weiterbildungen der Erfindung ergeben sich aus den Unteransprüchen.The object is achieved in particular by a hob according to claim 1. Advantageous embodiments and modifications of the invention will become apparent from the dependent claims.
Die Erfindung geht insbesondere aus von einem Kochfeld mit einer Abdeckplatte, mehreren unter der Abdeckplatte anordneten Heizelementen und mehreren Sensoren zum Detektieren eines auf die Abdeckplatte aufgestellten Kochgeschirrelements, wobei die Sensoren in einer Schicht zwischen der Abdeckplatte und den Heizelementen angeordnet sind. Dadurch kann eine Unabhängigkeit der Sensoren von den Heizelementen erreicht werden. Die Anzahl, Verteilung, Größe und Verkabelung der Sensoren kann völlig unabhängig von der Anzahl, Verteilung und Größe der Heizelemente gestaltet werden und im Hinblick auf eine bessere und hochauflösendere Topfdetektion optimiert werden. Ferner kann die Montage und die Verkabelung vereinfacht werden.More particularly, the invention is directed to a hob having a cover plate, a plurality of heating elements disposed beneath the cover plate, and a plurality of sensors for detecting a cooking utensil mounted on the cover plate, the sensors being disposed in a layer between the cover plate and the heating elements. As a result, an independence of the sensors can be achieved by the heating elements. The number, distribution, size and cabling of the sensors can be made completely independent of the number, distribution and size of the heating elements and optimized for a better and higher-resolution pot detection. Furthermore, the assembly and the wiring can be simplified.
Die Sensoren können bezüglich ihres Sensortyps alle als kapazitive oder alle als optische Sensoren ausgebildet sein. Vorzugsweise sind sie alle als induktive Sensoren ausgebildet. Es kann auch vorgesehen sein, dass die Mehrzahl der Sensoren zumindest einen Sensor eines ersten Sensortyps und zumindest einen Sensor eines zweiten Sensortyps aufweist.With regard to their sensor type, the sensors can all be designed as capacitive or all as optical sensors. Preferably, they are all designed as inductive sensors. It can also be provided that the plurality of sensors has at least one sensor of a first sensor type and at least one sensor of a second sensor type.
Die Vorteile der Erfindung kommen insbesondere dann zum Tragen, wenn die Heizelemente Induktoren sind.The advantages of the invention are particularly useful when the heating elements are inductors.
Die räumliche Auflösung der Sensoranordnung ist gegenüber der Detektion mit Hilfe von Heizinduktoren verbessert, da der Abstand zwischen den benachbarten Sensoren kleiner ist als ein Abstand zwischen den benachbarten Heizelementen bzw. Heizinduktoren, wobei die Heizelemente und die Sensoren jeweils in einem Raster angeordnet sind, wobei das Raster der Sensoren engmaschiger als das Raster der Heizelemente ist. Auch die Rasterform kann sich unterscheiden. Beispielsweise können die Heizinduktoren bzw. Heizelemente in einem rechtwinkligen Raster angeordnet sein, während die Sensoren in einem Dreiecksnetz oder Wabennetz angeordnet sein können oder umgekehrt.The spatial resolution of the sensor arrangement is improved with respect to the detection by means of heating inductors, since the distance between the adjacent sensors smaller is as a distance between the adjacent heating elements or heating inductors, wherein the heating elements and the sensors are each arranged in a grid, wherein the grid of the sensors is more closely meshed than the grid of the heating elements. The raster shape can also differ. For example, the heating inductors or heating elements can be arranged in a rectangular grid, while the sensors can be arranged in a triangular mesh or honeycomb network, or vice versa.
In einer besonders kostengünstigen Ausgestaltung der Erfindung können die induktiven Sensoren aus serigrafisch hergestellten Leiterschleifen bestehen. Alternativ können die induktiven Sensoren aus flachen Folienkabeln hergestellt werden, die beispielsweise zur Verkabelung von LCD-Displays bekannt sind.In a particularly inexpensive embodiment of the invention, the inductive sensors may consist of serigraphic conductor loops. Alternatively, the inductive sensors may be fabricated from flat foil cables known, for example, for cabling LCD displays.
Die Bauteilvielfalt des Kochfelds kann reduziert werden, wenn die Induktoren auf einer Rückseite einer Abdeckplatte aufgebracht sind. Alternativ dazu können die Sensoren auf eine zwischen den Heizelementen und der Abdeckplatte angeordnete Trägermembran auf einem Trägersieb, einer Trägerfolie oder Trägerplatte aufgebracht sein. In allen Fällen können serigrafische Verfahren zum Aufdruck von Leiterbahnen verwendet werden, die beispielsweise aus Verfahren zum Herstellen von Heizungen für Autoscheiben bekannt sind.The variety of components of the hob can be reduced when the inductors are applied to a back of a cover plate. Alternatively, the sensors may be applied to a carrier membrane arranged between the heating elements and the cover plate on a carrier screen, a carrier foil or carrier plate. In all cases, serigraphic methods can be used to print printed circuit traces, which are known, for example, from methods for producing car window heaters.
Nach einer weiteren Ausgestaltung der Erfindung umfasst das Kochfeld eine Steuereinheit zur Auswertung der Signale der Sensoren zur Detektion des Kochgeschirrelements. Die Steuereinheit kann insbesondere dazu ausgelegt sein, neben den Signalen der Sensoren auch mittels der Induktoren erfasste Signale zur Detektion des Kochgeschirrelements zu nutzen. Dazu kann die Anzahl der notwendigen Sensoren bei einer vorgegebenen räumlichen Auflösung reduziert werden. Wenn die Sensoren in einem Raster angeordnet sind, können insbesondere diejenigen Rasterpunkte ausgespart werden, die den Mittelpunkten der Induktoren entsprechen. Die entsprechende Information kann durch die Messung der effektiven Gesamtinduktivität und/oder des Verlustwinkels des aus dem Heizinduktor und dem Kochgeschirrelement bestehenden Gesamtsystems ermittelt werden.According to a further embodiment of the invention, the hob comprises a control unit for evaluating the signals of the sensors for detecting the cooking utensil element. The control unit may in particular be designed to use signals detected by the inductors in addition to the signals from the sensors for detecting the cooking utensil element. For this purpose, the number of necessary sensors can be reduced at a given spatial resolution. If the sensors are arranged in a grid, in particular those grid points can be omitted, which correspond to the centers of the inductors. The corresponding information can be determined by measuring the total effective inductance and / or the loss angle of the overall system consisting of the heating inductor and the cookware element.
Weitere Vorteile ergeben sich aus der folgenden Zeichnungsbeschreibung. In der Zeichnung sind Ausführungsbeispiele der Erfindung dargestellt. Die Zeichnung, die Beschreibung und die Ansprüche enthalten zahlreiche Merkmale in Kombination.Further advantages emerge from the following description of the drawing. In the drawings, embodiments of the invention are shown. The drawing, the description and the claims contain numerous features in combination.
Es zeigen:
- Fig. 1
- ein Kochfeld mit einer Abdeckplatte, vier Heizelementen und einem Raster von induktiven Sensoren in einer schematischen Draufsicht,
- Fig. 2
- eine Schnittdarstellung des Kochfelds aus
Fig. 1 mit einem der induktiven Sensoren, - Fig. 3
- die Abdeckplatte des Kochfelds aus
Fig. 1 und 2 in einer Ansicht von der Rückseite, - Fig. 4
- eine Explosionsdarstellung eines erfindungsgemäßen Kochfelds nach einer weiteren Ausgestaltung der Erfindung, und
- Fig. 5
- ein Kochfeld nach einer weiteren Ausgestaltung der Erfindung mit ausgesparten Rasterpunkten.
- Fig. 1
- a hob with a cover plate, four heating elements and a grid of inductive sensors in a schematic plan view,
- Fig. 2
- a sectional view of the hob off
Fig. 1 with one of the inductive sensors, - Fig. 3
- the cover plate of the hob off
Fig. 1 and 2 in a view from the back, - Fig. 4
- an exploded view of a cooktop according to the invention according to a further embodiment of the invention, and
- Fig. 5
- a hob according to a further embodiment of the invention with recessed halftone dots.
Die
An der Rückseite 20 der Abdeckplatte 10 ist ferner eine Vielzahl von induktiven Sensoren 16 zum Detektieren einer Größe und Position des Kochgeschirrelements 14 auf der Abdeckplatte 10 angeordnet. Die Sensoren 16 sind in einer Schicht zwischen der Abdeckplatte 10 und den Heizelementen 12a - 12d angeordnet (
Die Sensoren 16 sind im Ausführungsbeispiel alle als induktive Sensoren 16 ausgebildet. Es kann auch vorgesehen sein, dass zumindest ein Sensor 16 ein kapazitiver und/oder zumindest ein Sensor 16 ein optischer Sensor ist.The
In dem in den
Die Treibereinheit 24 kann Messströme in den Sensoren 16 erzeugen, um die Induktivität und/oder einen Verlustwinkel eines aus den Leiterschleifen und dem Kochgeschirrelement 14 gebildeten Gesamtsystems zu detektieren und daraus auf die Anwesenheit des Kochgeschirrelements 14 zu schließen.The
Die Treibereinheit 24 wird genauso wie die hier nicht explizit dargestellte Leistungselektronik des Kochfelds von einer Steuereinheit 26 gesteuert, die als frei programmierbare Recheneinheit ausgebildet ist und die in alternativen Ausgestaltungen der Erfindung auch einstückig mit der Treibereinheit 24 ausgebildet sein kann.The
Die Heizelemente 12a-12b und die Sensoren 16 sind jeweils in einem Raster angeordnet, wobei das Raster der Sensoren 16 weitaus engmaschiger ist als das Raster der Heizelemente 12a - 12d. Eine Gitterkonstante bzw. ein Abstand zwischen zwei benachbarten Punkten des Rasters der Heizelemente 12a - 12d ist in dem in
Die
Da in den Mittelpunkten der Heizelemente 12a - 12d auch die höchsten Temperaturen auftreten, wird durch das Aussparen dieser Punkte auch die für die Sensoren 16 zu erwartende Maximaltemperatur reduziert. Als Folge können die Anforderungen an die Temperaturbeständigkeit der Sensoren 16 abgeschwächt werden und weitere Kosteneinsparungspotentiale erschlossen werden.Since the highest temperatures also occur in the center points of the
- 1010
- Abdeckplattecover
- 1212
- Heizelementheating element
- 1414
- KochgeschirrelementCookware element
- 1616
- Sensorsensor
- 1818
- Schichtlayer
- 2020
- Rückseiteback
- 2222
- Folienleitungfilm line
- 2424
- Treibereinheitdriver unit
- 2626
- Steuereinheitcontrol unit
- 2828
- Bedienelementoperating element
- 3030
- Trägermembransupport membrane
- 3232
- Anschlussconnection
Claims (11)
- Hotplate with a cover plate (10), a plurality of heating elements (12a - 12d) arranged below the cover plate (10) and a plurality of sensors (16) for detecting a cookware element (14) placed on the cover plate (10), wherein the sensors (16) are arranged in a layer (18) between the cover plate (10) and the heating elements (12a - 12d) and a distance between adjacent sensors (16) is less than a distance between adjacent heating elements (12a - 12d), wherein the heating elements (12a - 12d) and the sensors (16) are arranged in a grid in each case, characterised in that the grid of the sensors (16) is more finely-meshed than the grid of the heating elements (12a - 12d).
- Hotplate according to claim 1, characterised in that the heating elements (12a - 12d) are inductors.
- Hotplate according to one of the preceding claims, characterised in that the sensors (16) comprise inductive sensors (16), in particular the sensors (16) are all inductive sensors (16).
- Hotplate according to claim 3, characterised in that the inductive sensors (16) comprise serigraphically produced conductor loops.
- Hotplate according to claim 3 or 4, characterised in that the inductive sensors (16) comprise flat foil cables.
- Hotplate according to one of claims 3 to 5, characterised in that the inductive sensors (16) are attached to a rear side (20) of the cover plate (10).
- Hotplate according to one of claims 1 to 5, characterised in that the sensors (16) are placed on a support membrane arranged between the heating elements (12a - 12d) and the cover plate (10).
- Hotplate according to one of the preceding claims, characterised by a control unit (26) for evaluating the signals of the sensors (16) in order to detect the cookware element (14).
- Hotplate according to claims 2 and 8, characterised in that the control unit (26) is configured, in addition to the signals of the sensors (16), to also use signals captured by the heating elements (12a - 12d) in order to detect the cookware element (14).
- Hotplate according to claim 9, characterised in that the sensors (16) are arranged in a grid, wherein grid points which correspond to the centre points of the heating elements (12a - 12d) are omitted.
- Hotplate according to one of the preceding claims, characterised in that the sensors (16) comprise at least one capacitive sensor and/or at least one optical sensor.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP10187083.0A EP2312908B1 (en) | 2009-10-13 | 2010-10-11 | Hotplate with sensors |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP09382204 | 2009-10-13 | ||
ES200931011A ES2376566B1 (en) | 2009-10-13 | 2009-11-18 | COOKING FIELD WITH INDUCTIVE SENSORS. |
EP10187083.0A EP2312908B1 (en) | 2009-10-13 | 2010-10-11 | Hotplate with sensors |
Publications (2)
Publication Number | Publication Date |
---|---|
EP2312908A1 EP2312908A1 (en) | 2011-04-20 |
EP2312908B1 true EP2312908B1 (en) | 2017-08-02 |
Family
ID=43446455
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP10187083.0A Active EP2312908B1 (en) | 2009-10-13 | 2010-10-11 | Hotplate with sensors |
Country Status (2)
Country | Link |
---|---|
EP (1) | EP2312908B1 (en) |
ES (2) | ES2376566B1 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20160302263A1 (en) * | 2015-04-10 | 2016-10-13 | E.G.O. Elektro-Geraetebau Gmbh | Induction hob and flexible support for an induction hob |
WO2021045494A1 (en) | 2019-09-02 | 2021-03-11 | Samsung Electronics Co., Ltd. | Cooking apparatus and method for controlling the same |
Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2792951B1 (en) * | 2013-04-18 | 2019-11-06 | BSH Hausgeräte GmbH | Cooking top |
DE102014214795A1 (en) * | 2014-07-28 | 2016-01-28 | E.G.O. Elektro-Gerätebau GmbH | Method and device for detecting the position of a pot on an induction hob |
DE102014111899A1 (en) * | 2014-08-20 | 2016-02-25 | Miele & Cie. Kg | Cooking field device and method of operation |
DE102014224051A1 (en) | 2014-11-25 | 2016-05-25 | E.G.O. Elektro-Gerätebau GmbH | Induction hob and method for controlling an induction hob |
EP3035772B1 (en) | 2014-12-16 | 2017-08-09 | E.G.O. ELEKTRO-GERÄTEBAU GmbH | Induction heating device and method for controlling an induction heating coil |
ES2619112B1 (en) * | 2015-12-22 | 2018-04-10 | Bsh Electrodomésticos España, S.A. | Induction cooking field device with at least one capacitive sensor unit |
WO2018029002A1 (en) * | 2016-08-08 | 2018-02-15 | Arcelik Anonim Sirketi | Thin film heating cooker detecting cooking utensils with improved heating methods |
KR102052705B1 (en) * | 2017-06-26 | 2019-12-05 | 엘지전자 주식회사 | Induction heating apparatus |
KR102069583B1 (en) | 2017-06-26 | 2020-01-23 | 엘지전자 주식회사 | Induction heating apparatus and pot detection method thereof |
KR102052703B1 (en) * | 2017-06-26 | 2019-12-05 | 엘지전자 주식회사 | Pot detecting sensor and induction heating apparatus including thereof |
KR102069580B1 (en) * | 2017-06-26 | 2020-01-23 | 엘지전자 주식회사 | Pot detecting sensor and induction heating apparatus including thereof |
KR102052704B1 (en) | 2017-06-26 | 2019-12-05 | 엘지전자 주식회사 | Induction heating apparatus |
EP3490338B1 (en) * | 2017-11-22 | 2022-07-06 | Vestel Elektronik Sanayi ve Ticaret A.S. | Induction cooker, method for operating an induction cooker and controller for an induction cooker |
DE102017221341A1 (en) * | 2017-11-28 | 2019-05-29 | E.G.O. Elektro-Gerätebau GmbH | Pot detection sensor for an induction hob and induction hob |
KR102049864B1 (en) * | 2018-02-08 | 2019-11-28 | 엘지전자 주식회사 | Cooking appliance |
ES2754877A1 (en) * | 2018-10-18 | 2020-04-20 | Bsh Electrodomesticos Espana Sa | Induction Device (Machine-translation by Google Translate, not legally binding) |
ES2754821A1 (en) * | 2018-10-18 | 2020-04-20 | Bsh Electrodomesticos Espana Sa | Induction device (Machine-translation by Google Translate, not legally binding) |
ES2754873A1 (en) * | 2018-10-18 | 2020-04-20 | Bsh Electrodomesticos Espana Sa | Induction device (Machine-translation by Google Translate, not legally binding) |
EP3914862A1 (en) | 2019-01-23 | 2021-12-01 | GORENJE gospodinjski aparati, d.d. | Device for detecting cooking vessel characteristics and method for detecting cooking vessel characteristics |
DE102019214910A1 (en) * | 2019-09-27 | 2021-04-01 | E.G.O. Elektro-Gerätebau GmbH | Induction hob and method for controlling an induction hob |
DE102020109484A1 (en) | 2020-04-06 | 2021-10-07 | Miele & Cie. Kg | Inductive kitchen system |
EP4176695A1 (en) | 2020-07-01 | 2023-05-10 | BSH Hausgeräte GmbH | Induction cooking appliance |
US20230209665A1 (en) * | 2021-12-23 | 2023-06-29 | Whirlpool Corporation | Cooking article detection system with differential detection coils |
DE102022205386A1 (en) * | 2022-05-30 | 2023-11-30 | E.G.O. Elektro-Gerätebau GmbH | Induction hob with a support structure with antennas and/or sensors, method for producing such a support structure and a use of a support structure for an induction hob |
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IT1319292B1 (en) * | 2000-11-08 | 2003-10-10 | Whirlpool Co | DEVICE TO DETECT THE PLACEMENT OF COOKING TOOLS ON A COOKING HOB WITH DISCRETE AND DISTRIBUTED HEATING ELEMENTS. |
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ES2273595B1 (en) * | 2005-09-19 | 2007-12-16 | Bsh Electrodomesticos España, S.A. | DEVICE WITH A SENSOR SYSTEM TO DETERMINE THE POSITION OF A METAL OBJECT. |
JP4839786B2 (en) * | 2005-11-14 | 2011-12-21 | パナソニック株式会社 | Induction heating device |
ES2324450B1 (en) * | 2007-08-07 | 2010-05-25 | Bsh Electrodomesticos España, S.A. | COOKING FIELD WITH A SENSOR DEVICE AND PROCEDURE FOR THE DETECTION OF COOKING BATTERY ON A COOKING FIELD. |
-
2009
- 2009-11-18 ES ES200931011A patent/ES2376566B1/en not_active Revoked
-
2010
- 2010-10-11 EP EP10187083.0A patent/EP2312908B1/en active Active
- 2010-10-11 ES ES10187083.0T patent/ES2639022T3/en active Active
Non-Patent Citations (1)
Title |
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None * |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20160302263A1 (en) * | 2015-04-10 | 2016-10-13 | E.G.O. Elektro-Geraetebau Gmbh | Induction hob and flexible support for an induction hob |
WO2021045494A1 (en) | 2019-09-02 | 2021-03-11 | Samsung Electronics Co., Ltd. | Cooking apparatus and method for controlling the same |
EP3954179A4 (en) * | 2019-09-02 | 2022-05-18 | Samsung Electronics Co., Ltd. | Cooking apparatus and method for controlling the same |
Also Published As
Publication number | Publication date |
---|---|
EP2312908A1 (en) | 2011-04-20 |
ES2376566A1 (en) | 2012-03-15 |
ES2376566B1 (en) | 2013-01-29 |
ES2639022T3 (en) | 2017-10-25 |
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