EP2312908A1 - Hotplate with sensors - Google Patents

Hotplate with sensors Download PDF

Info

Publication number
EP2312908A1
EP2312908A1 EP10187083A EP10187083A EP2312908A1 EP 2312908 A1 EP2312908 A1 EP 2312908A1 EP 10187083 A EP10187083 A EP 10187083A EP 10187083 A EP10187083 A EP 10187083A EP 2312908 A1 EP2312908 A1 EP 2312908A1
Authority
EP
European Patent Office
Prior art keywords
sensors
heating elements
cover plate
hob
hob according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP10187083A
Other languages
German (de)
French (fr)
Other versions
EP2312908B1 (en
Inventor
Jose Alfonso Santolaria Lorenzo
Rene Schmalenstrot
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BSH Hausgeraete GmbH
Original Assignee
BSH Bosch und Siemens Hausgeraete GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BSH Bosch und Siemens Hausgeraete GmbH filed Critical BSH Bosch und Siemens Hausgeraete GmbH
Priority to EP10187083.0A priority Critical patent/EP2312908B1/en
Publication of EP2312908A1 publication Critical patent/EP2312908A1/en
Application granted granted Critical
Publication of EP2312908B1 publication Critical patent/EP2312908B1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B6/00—Heating by electric, magnetic or electromagnetic fields
    • H05B6/02—Induction heating
    • H05B6/06—Control, e.g. of temperature, of power
    • H05B6/062—Control, e.g. of temperature, of power for cooking plates or the like
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2213/00—Aspects relating both to resistive heating and to induction heating, covered by H05B3/00 and H05B6/00
    • H05B2213/05—Heating plates with pan detection means

Definitions

  • the invention relates to a hob with sensors according to the preamble of claim 1.
  • Induction hobs are known from the prior art, which enable automatic detection of cooking utensils placed on the hob.
  • either the Schuinduktoren the hob themselves are used as sensors or separate inductive sensors are arranged in the center of the inductors to detect the cookware element.
  • the detection of the cookware element spatially relatively low resolution.
  • the spatial resolution is limited by the distance between the heating inductors.
  • the simultaneous use of the heating inductors as sensors is associated with an additional expense, since the heating inductors must either be connected to a readout electronics or to the power electronics, which requires additional circuitry and / or additional wiring. A high installation cost due to complex wiring is also necessary if the sensors are integrated into the heating elements.
  • the invention is therefore in particular the object of providing a high-resolution and easy-to-install pot detection arrangement for a hob in a cost effective manner.
  • the invention is particularly based on a hob with a cover plate, a plurality of heating elements arranged under the cover plate and a plurality of sensors for detecting a cooking utensil element set up on the cover plate.
  • the sensors are arranged in a layer between the cover plate and the heating elements.
  • an independence of the sensors can be achieved by the heating elements.
  • the number, distribution, size and cabling of the sensors can be made completely independent of the number, distribution and size of the heating elements and optimized for a better and higher-resolution pot detection.
  • the assembly and the wiring can be simplified.
  • the sensors can all be designed as capacitive or all as optical sensors. Preferably, they are all designed as inductive sensors. It can also be provided that the plurality of sensors has at least one sensor of a first sensor type and at least one sensor of a second sensor type.
  • the advantages of the invention are particularly useful when the heating elements are inductors.
  • the spatial resolution of the sensor arrangement can be improved with respect to the detection by means of heating inductors in particular when a distance between the adjacent sensors is smaller than a distance between the adjacent heating elements or heating inductors.
  • the heating elements and the sensors can each be arranged in a grid, wherein the grid of the sensors can be more closely meshed than the grid of the heating elements.
  • the raster shape can also differ.
  • the heating inductors or heating elements can be arranged in a rectangular grid, while the sensors can be arranged in a triangular mesh or honeycomb network, or vice versa.
  • the inductive sensors may consist of serigraphic conductor loops.
  • the inductive sensors may be fabricated from flat foil cables known, for example, for cabling LCD displays.
  • the variety of components of the hob can be reduced when the inductors are applied to a back of a cover plate.
  • the sensors can open a carrier membrane arranged between the heating elements and the cover plate may be applied to a carrier screen, a carrier foil or carrier plate.
  • serigraphic methods can be used to print printed circuit traces, which are known, for example, from methods for producing car window heaters.
  • the hob comprises a control unit for evaluating the signals of the sensors for detecting the cooking utensil element.
  • the control unit may in particular be designed to use signals detected by the inductors in addition to the signals from the sensors for detecting the cooking utensil element. For this purpose, the number of necessary sensors can be reduced at a given spatial resolution. If the sensors are arranged in a grid, in particular those grid points can be omitted, which correspond to the centers of the inductors. The corresponding information can be determined by measuring the total effective inductance and / or the loss angle of the overall system consisting of the heating inductor and the cookware element.
  • FIGS. 1 to 3 show a hob with a cover plate 10 made of glass or glass ceramic and a plurality of under the cover plate arranged heating elements 12a - 12d.
  • the cooktop is an induction cooktop and the heating elements 12a-12d are inductors that generate a high-frequency magnetic field during operation of the cooktop that generates eddy currents in the bottom of a cookware element 14 to heat it.
  • a plurality of inductive sensors 16 for detecting a size and position of the cookware element 14 is further arranged on the cover plate 10.
  • the sensors 16 are arranged in a layer between the cover plate 10 and the heating elements 12a-12d ( Fig. 2 ), whose thickness is below about 1-2 mm, so as not to disturb the inductive coupling between the heating elements 12a-12d and the cooking utensil element 14 to be heated therefrom.
  • the sensors 16 are all configured as inductive sensors 16 in the exemplary embodiment. It can also be provided that at least one sensor 16 is a capacitive and / or at least one sensor 16 is an optical sensor.
  • this layer 18 is a serigraphically applied to the back 20 of the cover plate 10 layer of a conductive, suitable for screen printing paste, which can be cured or sintered after printing.
  • the inductive sensors 16 are therefore formed from serigraphic conductor loops, the ends of which are connected via flat foil lines 22 or thin copper wires glued to the back side 20 of the cover plate 10 to a driver unit 24 for operating the sensors 16 of the layer 18.
  • the driver unit 24 can generate measurement currents in the sensors 16 in order to detect the inductance and / or a loss angle of an overall system formed from the conductor loops and the cookware element 14 and to deduce the presence of the cookware element 14 from this.
  • the driver unit 24 is just like the not explicitly shown power electronics of the hob controlled by a control unit 26, which is designed as a freely programmable arithmetic unit and which may be formed integrally with the driver unit 24 in alternative embodiments of the invention.
  • the control unit also operates a graphical display (not shown) on which the position and size of the detected cookware elements is displayed and visualizes an association between the cookware element 14 and controls 28 of the hob.
  • the controls 28 may include printed on the back of the cover plate 10 electrodes, which are printed together with the sensors 16 on the cover plate 10.
  • the heating elements 12a-12b and the sensors 16 are each arranged in a grid, wherein the grid of the sensors 16 is much closer meshed than the grid of the heating elements 12a - 12d.
  • a lattice constant or a distance between two adjacent points of the grid of the heating elements 12a-12d is in the in Fig. 1 illustrated embodiment, four times as large as a lattice constant of the grid of the sensors 16.
  • the inventive concept is also applicable to matrix cooktops with a closer-meshed grid of heating elements 12a - 12d.
  • hobs comprise a large number of inductors, for example between 16 and 32 inductors.
  • the pitch of the sensor raster may be twice as narrow as the pitch of the inductors or heating elements 12a-12d.
  • FIGS. 4 and 5 show alternative embodiments of the invention. To avoid repetition, the following description of the figures is limited to differences to those in the FIGS. 1 to 3 illustrated embodiment. For a description of the consistent features, refer to the description of the FIGS. 1 to 3 directed.
  • Fig. 4 shows an exploded view of a hob according to a further embodiment of the invention.
  • the sensors 16 are mounted in a separable from the cover plate 10 layer 18 on a support membrane 30.
  • the support membrane 30 is, for example a temperature-resistant film and the sensors 16 may be printed on the carrier membrane 30 in screen printing.
  • the reading out of the sensors by the control unit 26 or the driver unit 24 is therefore particularly simple.
  • Fig. 5 shows a further alternative embodiment of the invention.
  • the sensors 16 are arranged in a grid, wherein those grid points are recessed, which correspond to the centers of the inductors or heating elements 12a - 12d. Since the heating elements 12a-12d can also be used as sensors, the information relating to the recessed halftone dots can be obtained by using the inductors 12a-12d as additional sensors.

Landscapes

  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Induction Heating Cooking Devices (AREA)
  • Cookers (AREA)

Abstract

The hob has heating elements (12a) i.e. inductors, arranged under a cover panel (10), and sensors (16) e.g. inductive-, capacitive- and/or optical sensors, for detecting a cooking utensil that is positioned on the cover panel. The sensors are arranged in a layer (18) between the cover panel and the heating elements, where a distance between the adjacent sensors is smaller than a distance between the adjacent heating elements. The heating elements and sensors arranged in corresponding patterns, and the sensors are attached on a rear side of the cover panel.

Description

Die Erfindung betrifft ein Kochfeld mit Sensoren nach dem Oberbegriff des Anspruchs 1.The invention relates to a hob with sensors according to the preamble of claim 1.

Aus dem Stand der Technik sind Induktionskochfelder bekannt, die eine automatische Detektion von auf das Kochfeld aufgestellten Kochgeschirrelementen ermöglichen. Dazu werden entweder die Heizinduktoren des Kochfelds selbst als Sensoren genutzt oder es werden im Zentrum der Induktoren separate induktive Sensoren angeordnet, um das Kochgeschirrelement zu detektieren.Induction hobs are known from the prior art, which enable automatic detection of cooking utensils placed on the hob. For this purpose, either the Heizinduktoren the hob themselves are used as sensors or separate inductive sensors are arranged in the center of the inductors to detect the cookware element.

In beiden Fällen ist die Detektion des Kochgeschirrelements räumlich relativ niedrig auflösend. Die räumliche Auflösung ist durch den Abstand der Heizinduktoren begrenzt. Ferner ist die gleichzeitige Verwendung der Heizinduktoren als Sensoren mit einem zusätzlichen Aufwand verbunden, da die Heizinduktoren wahlweise mit einer Ausleseelektronik oder mit der Leistungselektronik verbunden werden müssen, was eine zusätzliche Schaltung und/oder zusätzliche Verkabelung erfordert. Ein hoher Montageaufwand durch aufwendige Verkabelung wird auch dann notwendig, wenn die Sensoren in die Heizelemente integriert werden.In both cases, the detection of the cookware element spatially relatively low resolution. The spatial resolution is limited by the distance between the heating inductors. Furthermore, the simultaneous use of the heating inductors as sensors is associated with an additional expense, since the heating inductors must either be connected to a readout electronics or to the power electronics, which requires additional circuitry and / or additional wiring. A high installation cost due to complex wiring is also necessary if the sensors are integrated into the heating elements.

Der Erfindung liegt daher insbesondere die Aufgabe zugrunde, in einer kostengünstigen Weise eine hochauflösende und montagefreundliche Topfdetektionsanordnung für ein Kochfeld bereitzustellen.The invention is therefore in particular the object of providing a high-resolution and easy-to-install pot detection arrangement for a hob in a cost effective manner.

Die Aufgabe wird insbesondere durch ein Kochfeld nach dem Anspruch 1 gelöst. Vorteilhafte Ausgestaltungen und Weiterbildungen der Erfindung ergeben sich aus den Unteransprüchen.The object is achieved in particular by a hob according to claim 1. Advantageous embodiments and modifications of the invention will become apparent from the dependent claims.

Die Erfindung geht insbesondere aus von einem Kochfeld mit einer Abdeckplatte, mehreren unter der Abdeckplatte anordneten Heizelementen und mehreren Sensoren zum Detektieren eines auf die Abdeckplatte aufgestellten Kochgeschirrelements.The invention is particularly based on a hob with a cover plate, a plurality of heating elements arranged under the cover plate and a plurality of sensors for detecting a cooking utensil element set up on the cover plate.

Es wird vorgeschlagen, dass die Sensoren in einer Schicht zwischen der Abdeckplatte und den Heizelementen angeordnet sind. Dadurch kann eine Unabhängigkeit der Sensoren von den Heizelementen erreicht werden. Die Anzahl, Verteilung, Größe und Verkabelung der Sensoren kann völlig unabhängig von der Anzahl, Verteilung und Größe der Heizelemente gestaltet werden und im Hinblick auf eine bessere und hochauflösendere Topfdetektion optimiert werden. Ferner kann die Montage und die Verkabelung vereinfacht werden.It is proposed that the sensors are arranged in a layer between the cover plate and the heating elements. As a result, an independence of the sensors can be achieved by the heating elements. The number, distribution, size and cabling of the sensors can be made completely independent of the number, distribution and size of the heating elements and optimized for a better and higher-resolution pot detection. Furthermore, the assembly and the wiring can be simplified.

Die Sensoren können bezüglich ihres Sensortyps alle als kapazitive oder alle als optische Sensoren ausgebildet sein. Vorzugsweise sind sie alle als induktive Sensoren ausgebildet. Es kann auch vorgesehen sein, dass die Mehrzahl der Sensoren zumindest einen Sensor eines ersten Sensortyps und zumindest einen Sensor eines zweiten Sensortyps aufweist.With regard to their sensor type, the sensors can all be designed as capacitive or all as optical sensors. Preferably, they are all designed as inductive sensors. It can also be provided that the plurality of sensors has at least one sensor of a first sensor type and at least one sensor of a second sensor type.

Die Vorteile der Erfindung kommen insbesondere dann zum Tragen, wenn die Heizelemente Induktoren sind.The advantages of the invention are particularly useful when the heating elements are inductors.

Die räumliche Auflösung der Sensoranordnung kann gegenüber der Detektion mit Hilfe von Heizinduktoren insbesondere dann verbessert werden, wenn ein Abstand zwischen den benachbarten Sensoren kleiner ist als ein Abstand zwischen den benachbarten Heizelementen bzw. Heizinduktoren. Insbesondere können die Heizelemente und die Sensoren jeweils in einem Raster angeordnet sein, wobei das Raster der Sensoren engmaschiger als das Raster der Heizelemente sein kann. Auch die Rasterform kann sich unterscheiden. Beispielsweise können die Heizinduktoren bzw. Heizelemente in einem rechtwinkligen Raster angeordnet sein, während die Sensoren in einem Dreiecksnetz oder Wabennetz angeordnet sein können oder umgekehrt.The spatial resolution of the sensor arrangement can be improved with respect to the detection by means of heating inductors in particular when a distance between the adjacent sensors is smaller than a distance between the adjacent heating elements or heating inductors. In particular, the heating elements and the sensors can each be arranged in a grid, wherein the grid of the sensors can be more closely meshed than the grid of the heating elements. The raster shape can also differ. For example, the heating inductors or heating elements can be arranged in a rectangular grid, while the sensors can be arranged in a triangular mesh or honeycomb network, or vice versa.

In einer besonders kostengünstigen Ausgestaltung der Erfindung können die induktiven Sensoren aus serigrafisch hergestellten Leiterschleifen bestehen. Alternativ können die induktiven Sensoren aus flachen Folienkabeln hergestellt werden, die beispielsweise zur Verkabelung von LCD-Displays bekannt sind.In a particularly inexpensive embodiment of the invention, the inductive sensors may consist of serigraphic conductor loops. Alternatively, the inductive sensors may be fabricated from flat foil cables known, for example, for cabling LCD displays.

Die Bauteilvielfalt des Kochfelds kann reduziert werden, wenn die Induktoren auf einer Rückseite einer Abdeckplatte aufgebracht sind. Alternativ dazu können die Sensoren auf eine zwischen den Heizelementen und der Abdeckplatte angeordnete Trägermembran auf einem Trägersieb, einer Trägerfolie oder Trägerplatte aufgebracht sein. In allen Fällen können serigrafische Verfahren zum Aufdruck von Leiterbahnen verwendet werden, die beispielsweise aus Verfahren zum Herstellen von Heizungen für Autoscheiben bekannt sind.The variety of components of the hob can be reduced when the inductors are applied to a back of a cover plate. Alternatively, the sensors can open a carrier membrane arranged between the heating elements and the cover plate may be applied to a carrier screen, a carrier foil or carrier plate. In all cases, serigraphic methods can be used to print printed circuit traces, which are known, for example, from methods for producing car window heaters.

Nach einer weiteren Ausgestaltung der Erfindung umfasst das Kochfeld eine Steuereinheit zur Auswertung der Signale der Sensoren zur Detektion des Kochgeschirrelements. Die Steuereinheit kann insbesondere dazu ausgelegt sein, neben den Signalen der Sensoren auch mittels der Induktoren erfasste Signale zur Detektion des Kochgeschirrelements zu nutzen. Dazu kann die Anzahl der notwendigen Sensoren bei einer vorgegebenen räumlichen Auflösung reduziert werden. Wenn die Sensoren in einem Raster angeordnet sind, können insbesondere diejenigen Rasterpunkte ausgespart werden, die den Mittelpunkten der Induktoren entsprechen. Die entsprechende Information kann durch die Messung der effektiven Gesamtinduktivität und/oder des Verlustwinkels des aus dem Heizinduktor und dem Kochgeschirrelement bestehenden Gesamtsystems ermittelt werden.According to a further embodiment of the invention, the hob comprises a control unit for evaluating the signals of the sensors for detecting the cooking utensil element. The control unit may in particular be designed to use signals detected by the inductors in addition to the signals from the sensors for detecting the cooking utensil element. For this purpose, the number of necessary sensors can be reduced at a given spatial resolution. If the sensors are arranged in a grid, in particular those grid points can be omitted, which correspond to the centers of the inductors. The corresponding information can be determined by measuring the total effective inductance and / or the loss angle of the overall system consisting of the heating inductor and the cookware element.

Weitere Vorteile ergeben sich aus der folgenden Zeichnungsbeschreibung. In der Zeichnung sind Ausführungsbeispiele der Erfindung dargestellt. Die Zeichnung, die Beschreibung und die Ansprüche enthalten zahlreiche Merkmale in Kombination. Der Fachmann wird die Merkmale zweckmäßigerweise auch einzeln betrachten und zu sinnvollen weiteren Kombinationen zusammenfassen.Further advantages emerge from the following description of the drawing. In the drawings, embodiments of the invention are shown. The drawing, the description and the claims contain numerous features in combination. The person skilled in the art will expediently also consider the features individually and combine them into meaningful further combinations.

Es zeigen:

Fig. 1
ein Kochfeld mit einer Abdeckplatte, vier Heizelementen und einem Raster von induktiven Sensoren in einer schematischen Draufsicht,
Fig. 2
eine Schnittdarstellung des Kochfelds aus Fig. 1 mit einem der in- duktiven Sensoren,
Fig. 3
die Abdeckplatte des Kochfelds aus Fig. 1 und 2 in einer Ansicht von der Rückseite,
Fig. 4
eine Explosionsdarstellung eines erfindungsgemäßen Kochfelds nach einer weiteren Ausgestaltung der Erfindung, und
Fig. 5
ein Kochfeld nach einer weiteren Ausgestaltung der Erfindung mit ausgesparten Rasterpunkten.
Show it:
Fig. 1
a hob with a cover plate, four heating elements and a grid of inductive sensors in a schematic plan view,
Fig. 2
a sectional view of the hob off Fig. 1 with one of the inductive sensors,
Fig. 3
the cover plate of the hob off Fig. 1 and 2 in a view from the back,
Fig. 4
an exploded view of a cooktop according to the invention according to a further embodiment of the invention, and
Fig. 5
a hob according to a further embodiment of the invention with recessed halftone dots.

Die Figuren 1 bis 3 zeigen ein Kochfeld mit einer Abdeckplatte 10 aus Glas oder Glaskeramik und mehreren unter der Abdeckplatte angeordneten Heizelementen 12a - 12d. Das Kochfeld ist ein Induktionskochfeld und die Heizelemente 12a - 12d sind Induktoren, die im Betrieb des Kochfelds ein hochfrequentes Magnetfeld erzeugen, das Wirbelströme im Boden eines Kochgeschirrelements 14 bzw. Kochtopfs erzeugt, um diesen zu erhitzen.The FIGS. 1 to 3 show a hob with a cover plate 10 made of glass or glass ceramic and a plurality of under the cover plate arranged heating elements 12a - 12d. The cooktop is an induction cooktop and the heating elements 12a-12d are inductors that generate a high-frequency magnetic field during operation of the cooktop that generates eddy currents in the bottom of a cookware element 14 to heat it.

An der Rückseite 20 der Abdeckplatte 10 ist ferner eine Vielzahl von induktiven Sensoren 16 zum Detektieren einer Größe und Position des Kochgeschirrelements 14 auf der Abdeckplatte 10 angeordnet. Die Sensoren 16 sind in einer Schicht zwischen der Abdeckplatte 10 und den Heizelementen 12a - 12d angeordnet (Fig. 2), deren Dicke unterhalb von ca. 1-2 mm liegt, um die induktive Kopplung zwischen den Heizelementen 12a - 12d und dem davon zu beheizenden Kochgeschirrelement 14 nicht zu stören.On the back 20 of the cover plate 10, a plurality of inductive sensors 16 for detecting a size and position of the cookware element 14 is further arranged on the cover plate 10. The sensors 16 are arranged in a layer between the cover plate 10 and the heating elements 12a-12d ( Fig. 2 ), whose thickness is below about 1-2 mm, so as not to disturb the inductive coupling between the heating elements 12a-12d and the cooking utensil element 14 to be heated therefrom.

Die Sensoren 16 sind im Ausführungsbeispiel alle als induktive Sensoren 16 ausgebildet. Es kann auch vorgesehen sein, dass zumindest ein Sensor 16 ein kapazitiver und/oder zumindest ein Sensor 16 ein optischer Sensor ist.The sensors 16 are all configured as inductive sensors 16 in the exemplary embodiment. It can also be provided that at least one sensor 16 is a capacitive and / or at least one sensor 16 is an optical sensor.

In dem in den Figuren 1, 2 und 3 dargestellten Ausführungsbeispiel ist diese Schicht 18 eine serigrafisch auf die Rückseite 20 der Abdeckplatte 10 aufgebrachte Schicht aus einer leitfähigen, für den Siebdruck geeigneten Paste, die nach dem Druckvorgang gehärtet oder gesintert werden kann. Die induktiven Sensoren 16 sind daher aus serigrafisch hergestellten Leiterschleifen gebildet, deren Enden über flache Folienleitungen 22 oder dünne, auf die Rückseite 20 der Abdeckplatte 10 aufgeklebte Kupferdrähte mit einer Treibereinheit 24 zum Betreiben der Sensoren 16 der Schicht 18 verbunden sind.In the in the FIGS. 1, 2 and 3 illustrated embodiment, this layer 18 is a serigraphically applied to the back 20 of the cover plate 10 layer of a conductive, suitable for screen printing paste, which can be cured or sintered after printing. The inductive sensors 16 are therefore formed from serigraphic conductor loops, the ends of which are connected via flat foil lines 22 or thin copper wires glued to the back side 20 of the cover plate 10 to a driver unit 24 for operating the sensors 16 of the layer 18.

Die Treibereinheit 24 kann Messströme in den Sensoren 16 erzeugen, um die Induktivität und/oder einen Verlustwinkel eines aus den Leiterschleifen und dem Kochgeschirrelement 14 gebildeten Gesamtsystems zu detektieren und daraus auf die Anwesenheit des Kochgeschirrelements 14 zu schließen.The driver unit 24 can generate measurement currents in the sensors 16 in order to detect the inductance and / or a loss angle of an overall system formed from the conductor loops and the cookware element 14 and to deduce the presence of the cookware element 14 from this.

Die Treibereinheit 24 wird genauso wie die hier nicht explizit dargestellte Leistungselektronik des Kochfelds von einer Steuereinheit 26 gesteuert, die als frei programmierbare Recheneinheit ausgebildet ist und die in alternativen Ausgestaltungen der Erfindung auch einstückig mit der Treibereinheit 24 ausgebildet sein kann.The driver unit 24 is just like the not explicitly shown power electronics of the hob controlled by a control unit 26, which is designed as a freely programmable arithmetic unit and which may be formed integrally with the driver unit 24 in alternative embodiments of the invention.

Die Steuereinheit betreibt ferner ein grafisches Display (nicht dargestellt) auf dem die Position und Größe der detektierten Kochgeschirrelemente dargestellt wird und eine Zuordnung zwischen dem Kochgeschirrelement 14 und Bedienelementen 28 des Kochfelds visualisiert.The control unit also operates a graphical display (not shown) on which the position and size of the detected cookware elements is displayed and visualizes an association between the cookware element 14 and controls 28 of the hob.

Die Bedienelemente 28 können auf die Rückseite der Abdeckplatte 10 aufgedruckte Elektroden umfassen, die zusammen mit den Sensoren 16 auf die Abdeckplatte 10 aufgedruckt sind.The controls 28 may include printed on the back of the cover plate 10 electrodes, which are printed together with the sensors 16 on the cover plate 10.

Die Heizelemente 12a-12b und die Sensoren 16 sind jeweils in einem Raster angeordnet, wobei das Raster der Sensoren 16 weitaus engmaschiger ist als das Raster der Heizelemente 12a - 12d. Eine Gitterkonstante bzw. ein Abstand zwischen zwei benachbarten Punkten des Rasters der Heizelemente 12a - 12d ist in dem in Fig. 1 dargestellten Ausführungsbeispiel viermal so groß wie eine Gitterkonstante des Rasters der Sensoren 16. Der Erfindungsgedanke ist auch auf Matrix-Kochfelder mit einem engmaschigeren Raster von Heizelementen 12a - 12d anwendbar. Solche Kochfelder umfassen eine große Zahl von Induktoren, beispielsweise zwischen 16 und 32 Induktoren. In diesem Fall kann das Rastermaß des Sensorrasters doppelt so eng sein wie das Rastermaß der Induktoren bzw. Heizelemente 12a-12d.The heating elements 12a-12b and the sensors 16 are each arranged in a grid, wherein the grid of the sensors 16 is much closer meshed than the grid of the heating elements 12a - 12d. A lattice constant or a distance between two adjacent points of the grid of the heating elements 12a-12d is in the in Fig. 1 illustrated embodiment, four times as large as a lattice constant of the grid of the sensors 16. The inventive concept is also applicable to matrix cooktops with a closer-meshed grid of heating elements 12a - 12d. Such hobs comprise a large number of inductors, for example between 16 and 32 inductors. In this case, the pitch of the sensor raster may be twice as narrow as the pitch of the inductors or heating elements 12a-12d.

Die Figuren 4 und 5 zeigen alternative Ausführungsbeispiele der Erfindung. Um Wiederholungen zu vermeiden, beschränkt sich die nachfolgende Figurenbeschreibung auf Unterschiede zu dem in den Figuren 1 bis 3 dargestellten Ausführungsbeispiel. Zur Beschreibung der gleichbleibenden Merkmale wird auf die Beschreibung zu den Figuren 1 bis 3 verwiesen.The FIGS. 4 and 5 show alternative embodiments of the invention. To avoid repetition, the following description of the figures is limited to differences to those in the FIGS. 1 to 3 illustrated embodiment. For a description of the consistent features, refer to the description of the FIGS. 1 to 3 directed.

Fig. 4 zeigt eine Explosionsdarstellung eines Kochfelds nach einer weiteren Ausgestaltung der Erfindung. Die Sensoren 16 sind in einer von der Abdeckplatte 10 trennbaren Schicht 18 auf einer Trägermembran 30 angebracht. Die Trägermembran 30 ist beispielsweise eine temperaturresistente Folie und die Sensoren 16 können im Siebdruck auf die Trägermembran 30 aufgedruckt sein. Die gesamte Verkabelung der Sensoren 16 auf der Trägermembran 30 erfolgt über einen gemeinsamen Anschluss 32, der bei der Montage des Kochfelds einfach in einen entsprechenden Stecker eingesteckt werden kann. Das Auslesen der Sensoren durch die Steuereinheit 26 bzw. die Treibereinheit 24 ist daher besonders einfach. Fig. 4 shows an exploded view of a hob according to a further embodiment of the invention. The sensors 16 are mounted in a separable from the cover plate 10 layer 18 on a support membrane 30. The support membrane 30 is, for example a temperature-resistant film and the sensors 16 may be printed on the carrier membrane 30 in screen printing. The entire wiring of the sensors 16 on the support membrane 30 via a common terminal 32, which can be easily plugged into a corresponding connector during assembly of the hob. The reading out of the sensors by the control unit 26 or the driver unit 24 is therefore particularly simple.

Fig. 5 zeigt ein weiteres alternatives Ausführungsbeispiel der Erfindung. In diesem Ausführungsbeispiel der Erfindung sind die Sensoren 16 in einem Raster angeordnet, wobei diejenigen Rasterpunkte ausgespart sind, die den Mittelpunkten der Induktoren bzw. Heizelemente 12a - 12d entsprechen. Da die Heizelemente 12a - 12d ebenfalls als Sensoren genutzt werden können, kann die ausgesparten Rasterpunkte betreffende Information durch die Nutzung der Induktoren 12a - 12d als zusätzliche Sensoren gewonnen werden. Fig. 5 shows a further alternative embodiment of the invention. In this embodiment of the invention, the sensors 16 are arranged in a grid, wherein those grid points are recessed, which correspond to the centers of the inductors or heating elements 12a - 12d. Since the heating elements 12a-12d can also be used as sensors, the information relating to the recessed halftone dots can be obtained by using the inductors 12a-12d as additional sensors.

Da in den Mittelpunkten der Heizelemente 12a - 12d auch die höchsten Temperaturen auftreten, wird durch das Aussparen dieser Punkte auch die für die Sensoren 16 zu erwartende Maximaltemperatur reduziert. Als Folge können die Anforderungen an die Temperaturbeständigkeit der Sensoren 16 abgeschwächt werden und weitere Kosteneinsparungspotentiale erschlossen werden.Since the highest temperatures also occur in the center points of the heating elements 12a-12d, the omission of these points also reduces the maximum temperature to be expected for the sensors 16. As a result, the temperature stability requirements of the sensors 16 can be mitigated and further cost saving potentials can be developed.

Bezugszeichenreference numeral

1010
Abdeckplattecover
1212
Heizelementheating element
1414
KochgeschirrelementCookware element
1616
Sensorsensor
1818
Schichtlayer
2020
Rückseiteback
2222
Folienleitungfilm line
2424
Treibereinheitdriver unit
2626
Steuereinheitcontrol unit
2828
Bedienelementoperating element
3030
Trägermembransupport membrane
3232
Anschlussconnection

Claims (13)

Kochfeld mit einer Abdeckplatte (10), mehreren unter der Abdeckplatte (10) angeordneten Heizelementen (12a - 12d) und mehreren Sensoren (16) zum Detektieren eines auf die Abdeckplatte (10) aufgestellten Kochgeschirrelements (14), dadurch gekennzeichnet, dass die Sensoren (16) in einer Schicht (18) zwischen der Abdeckplatte (10) und den Heizelementen (12a - 12d) angeordnet sind.Hob with a cover plate (10), a plurality of heating elements (12a-12d) arranged below the cover plate (10) and a plurality of sensors (16) for detecting a cooking utensil element (14) mounted on the cover plate (10), characterized in that the sensors ( 16) in a layer (18) between the cover plate (10) and the heating elements (12a - 12d) are arranged. Kochfeld nach Anspruch 1, dadurch gekennzeichnet, dass die Heizelementen (12a - 12d) Induktoren sind.Hob according to claim 1, characterized in that the heating elements (12a - 12d) are inductors. Kochfeld nach einem der vorhergehenden Ansprüchen, dadurch gekennzeichnet, dass ein Abstand zwischen benachbarten Sensoren (16) kleiner ist als ein Abstand zwischen benachbarten Heizelementen (12a - 12d).Hob according to one of the preceding claims, characterized in that a distance between adjacent sensors (16) is smaller than a distance between adjacent heating elements (12a - 12d). Kochfeld nach Anspruch 3, dadurch gekennzeichnet, dass die Heizelemente (12a - 12d) und die Sensoren (16) jeweils in einem Raster angeordnet sind, wobei das Raster der Sensoren (16) engmaschiger ist als das Raster der Heizelemente (12a - 12d).Hob according to claim 3, characterized in that the heating elements (12a - 12d) and the sensors (16) are each arranged in a grid, wherein the grid of the sensors (16) is more closely meshed than the grid of the heating elements (12a - 12d). Kochfeld nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass die Sensoren (16) induktive Sensoren (16) umfassen, insbesondere alle induktive Sensoren (16) sind.Hob according to one of the preceding claims, characterized in that the sensors (16) comprise inductive sensors (16), in particular all inductive sensors (16). Kochfeld nach Anspruch 5, dadurch gekennzeichnet, dass die induktiven Sensoren (16) serigrafisch hergestellte Leiterschleifen umfassen.Hob according to claim 5, characterized in that the inductive sensors (16) comprise serigraphically produced conductor loops. Kochfeld nach Anspruch 5 oder 6, dadurch gekennzeichnet, dass die induktiven Sensoren (16) flache Folienkabel umfassen.Hob according to claim 5 or 6, characterized in that the inductive sensors (16) comprise flat foil cables. Kochfeld nach einem der Ansprüche 5 bis 7, dadurch gekennzeichnet, dass die induktiven Sensoren (16) auf eine Rückseite (20) der Abdeckplatte (10) aufgebracht sind.Hob according to one of claims 5 to 7, characterized in that the inductive sensors (16) on a rear side (20) of the cover plate (10) applied are. Kochfeld nach einem der Ansprüche 1 - 7, dadurch gekennzeichnet, dass die Sensoren (16) auf eine zwischen den Heizelementen (12a - 12d) und der Abdeckplatte (10) angeordnete Trägermembran aufgebracht sind.Hob according to one of claims 1-7, characterized in that the sensors (16) are mounted on a between the heating elements (12a - 12d) and the cover plate (10) arranged carrier membrane. Kochfeld nach einem der vorhergehenden Ansprüche, gekennzeichnet durch eine Steuereinheit (26) zur Auswertung der Signale der Sensoren (16) zur Detektion des Kochgeschirrelements (14).Cooking field according to one of the preceding claims, characterized by a control unit (26) for evaluating the signals of the sensors (16) for detecting the cooking utensil element (14). Kochfeld nach den Ansprüchen 2 und 10, dadurch gekennzeichnet, dass die Steuereinheit (26) dazu ausgelegt ist, neben den Signalen der Sensoren (16) auch von den Heizelementen (12a-12d) erfasste Signale zur Detektion des Kochgeschirrelements (14) zu nutzen.Cooking field according to claims 2 and 10, characterized in that the control unit (26) is adapted to use in addition to the signals of the sensors (16) also of the heating elements (12a-12d) detected signals for detecting the cooking utensil element (14). Kochfeld nach Anspruch 11, dadurch gekennzeichnet, dass die Sensoren (16) in einem Raster angeordnet sind, wobei diejenigen Rasterpunkte ausgespart sind, die den Mittelpunkten der Heizelemente (12a-12d) entsprechen.Hob according to claim 11, characterized in that the sensors (16) are arranged in a grid, wherein those grid points are recessed, which correspond to the centers of the heating elements (12a-12d). Kochfeld nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass die Sensoren (16) zumindest einen kapazitiven Sensor und/oder zumindet einen optischen Sensor umfassen.Hob according to one of the preceding claims, characterized in that the sensors (16) comprise at least one capacitive sensor and / or at least one optical sensor.
EP10187083.0A 2009-10-13 2010-10-11 Hotplate with sensors Active EP2312908B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP10187083.0A EP2312908B1 (en) 2009-10-13 2010-10-11 Hotplate with sensors

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP09382204 2009-10-13
ES200931011A ES2376566B1 (en) 2009-10-13 2009-11-18 COOKING FIELD WITH INDUCTIVE SENSORS.
EP10187083.0A EP2312908B1 (en) 2009-10-13 2010-10-11 Hotplate with sensors

Publications (2)

Publication Number Publication Date
EP2312908A1 true EP2312908A1 (en) 2011-04-20
EP2312908B1 EP2312908B1 (en) 2017-08-02

Family

ID=43446455

Family Applications (1)

Application Number Title Priority Date Filing Date
EP10187083.0A Active EP2312908B1 (en) 2009-10-13 2010-10-11 Hotplate with sensors

Country Status (2)

Country Link
EP (1) EP2312908B1 (en)
ES (2) ES2376566B1 (en)

Cited By (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2792951A3 (en) * 2013-04-18 2015-11-18 BSH Hausgeräte GmbH Household appliance operating device
DE102014214795A1 (en) * 2014-07-28 2016-01-28 E.G.O. Elektro-Gerätebau GmbH Method and device for detecting the position of a pot on an induction hob
EP2988573A1 (en) * 2014-08-20 2016-02-24 Miele & Cie. KG Cooking field device, and method for operating the same
DE102014224051A1 (en) * 2014-11-25 2016-05-25 E.G.O. Elektro-Gerätebau GmbH Induction hob and method for controlling an induction hob
EP3035772A1 (en) 2014-12-16 2016-06-22 E.G.O. ELEKTRO-GERÄTEBAU GmbH Induction heating device and method for controlling an induction heating coil
EP3079443A1 (en) 2015-04-10 2016-10-12 E.G.O. ELEKTRO-GERÄTEBAU GmbH Induction hob and flexible substrate for an induction hob
EP3185647A1 (en) * 2015-12-22 2017-06-28 BSH Hausgeräte GmbH Cooking hob device
WO2018029002A1 (en) * 2016-08-08 2018-02-15 Arcelik Anonim Sirketi Thin film heating cooker detecting cooking utensils with improved heating methods
EP3422809A1 (en) * 2017-06-26 2019-01-02 LG Electronics Inc. -1- Induction heating device
EP3422808A1 (en) * 2017-06-26 2019-01-02 LG Electronics Inc. -1- Induction heating device
EP3422811A1 (en) * 2017-06-26 2019-01-02 LG Electronics Inc. -1- Loaded-object sensor and induction heating device including loaded-object sensor
EP3422813A1 (en) * 2017-06-26 2019-01-02 LG Electronics Inc. -1- Cooking vessel sensor and induction heating device including a cooking vessel sensor
EP3490338A1 (en) * 2017-11-22 2019-05-29 Vestel Elektronik Sanayi ve Ticaret A.S. Induction cooker, method for operating an induction cooker and controller for an induction cooker
DE102017221341A1 (en) * 2017-11-28 2019-05-29 E.G.O. Elektro-Gerätebau GmbH Pot detection sensor for an induction hob and induction hob
ES2754873A1 (en) * 2018-10-18 2020-04-20 Bsh Electrodomesticos Espana Sa Induction device (Machine-translation by Google Translate, not legally binding)
ES2754877A1 (en) * 2018-10-18 2020-04-20 Bsh Electrodomesticos Espana Sa Induction Device (Machine-translation by Google Translate, not legally binding)
ES2754821A1 (en) * 2018-10-18 2020-04-20 Bsh Electrodomesticos Espana Sa Induction device (Machine-translation by Google Translate, not legally binding)
WO2020152499A1 (en) 2019-01-23 2020-07-30 Gorenje Gospodinjski Aparati, D.D. Device for detecting cooking vessel characteristics and method for detecting cooking vessel characteristics
US20210068208A1 (en) * 2019-09-02 2021-03-04 Samsung Electronics Co., Ltd. Cooking apparatus and method for controlling the same
EP3799527A1 (en) * 2019-09-27 2021-03-31 E.G.O. Elektro-Gerätebau GmbH Induction hob and method for controlling an induction hob
DE102020109484A1 (en) 2020-04-06 2021-10-07 Miele & Cie. Kg Inductive kitchen system
US11178732B2 (en) 2017-06-26 2021-11-16 Lg Electronics Inc. Induction heating device and method for sensing a cooking vessel on an induction heating device
WO2022002587A1 (en) 2020-07-01 2022-01-06 BSH Hausgeräte GmbH Induction cooking appliance
EP4203609A1 (en) * 2021-12-23 2023-06-28 Whirlpool Corporation Cooking article detection system with differential detection coils
EP4287770A1 (en) * 2022-05-30 2023-12-06 E.G.O. Elektro-Gerätebau GmbH Induction hob with a support structure with antennas and/or sensors, method for producing such a support structure and use of a support structure for an induction hob

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102049864B1 (en) * 2018-02-08 2019-11-28 엘지전자 주식회사 Cooking appliance

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3733108C1 (en) * 1987-09-30 1989-02-23 Bosch Siemens Hausgeraete Circuit arrangement for a pot (saucepan) recognition system with a pot recognition sensor
EP1087641A2 (en) * 1999-09-23 2001-03-28 Cherry GmbH Object detection system,which for example detects the presence of a metallic cooking ustensil on a non-metallic cooking surface
EP1206164A2 (en) * 2000-11-08 2002-05-15 Whirlpool Corporation Device for determining the location of cooking utensils on a cooking hob comprising discrete distributed heating elements
DE102006043182A1 (en) * 2005-09-19 2007-04-19 BSH Bosch und Siemens Hausgeräte GmbH Method for establishing the positional coordinates of a metallic cooking vessel on a glass ceramic hob has a primary inductance coil and a pair of oppositely wound secondary coils beneath the surface

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6350971B1 (en) * 2000-12-04 2002-02-26 General Electric Company Apparatus and method for detecting vessel movement on a cooktop surface
JP4839786B2 (en) * 2005-11-14 2011-12-21 パナソニック株式会社 Induction heating device
ES2324450B1 (en) * 2007-08-07 2010-05-25 Bsh Electrodomesticos España, S.A. COOKING FIELD WITH A SENSOR DEVICE AND PROCEDURE FOR THE DETECTION OF COOKING BATTERY ON A COOKING FIELD.

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3733108C1 (en) * 1987-09-30 1989-02-23 Bosch Siemens Hausgeraete Circuit arrangement for a pot (saucepan) recognition system with a pot recognition sensor
EP1087641A2 (en) * 1999-09-23 2001-03-28 Cherry GmbH Object detection system,which for example detects the presence of a metallic cooking ustensil on a non-metallic cooking surface
EP1206164A2 (en) * 2000-11-08 2002-05-15 Whirlpool Corporation Device for determining the location of cooking utensils on a cooking hob comprising discrete distributed heating elements
DE102006043182A1 (en) * 2005-09-19 2007-04-19 BSH Bosch und Siemens Hausgeräte GmbH Method for establishing the positional coordinates of a metallic cooking vessel on a glass ceramic hob has a primary inductance coil and a pair of oppositely wound secondary coils beneath the surface

Cited By (43)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2792951A3 (en) * 2013-04-18 2015-11-18 BSH Hausgeräte GmbH Household appliance operating device
DE102014214795A1 (en) * 2014-07-28 2016-01-28 E.G.O. Elektro-Gerätebau GmbH Method and device for detecting the position of a pot on an induction hob
EP2981154A1 (en) * 2014-07-28 2016-02-03 E.G.O. ELEKTRO-GERÄTEBAU GmbH Method and device for recognizing the position of a pot on an induction hob
EP2988573A1 (en) * 2014-08-20 2016-02-24 Miele & Cie. KG Cooking field device, and method for operating the same
DE102014224051A1 (en) * 2014-11-25 2016-05-25 E.G.O. Elektro-Gerätebau GmbH Induction hob and method for controlling an induction hob
EP3026981A1 (en) * 2014-11-25 2016-06-01 E.G.O. ELEKTRO-GERÄTEBAU GmbH Induction cooktop and method for controlling an induction cooktop
US10433375B2 (en) 2014-11-25 2019-10-01 E.G.O. Elektro-Geraetebau Gmbh Induction hob and method for controlling an induction hob
EP3035772A1 (en) 2014-12-16 2016-06-22 E.G.O. ELEKTRO-GERÄTEBAU GmbH Induction heating device and method for controlling an induction heating coil
US20160302263A1 (en) * 2015-04-10 2016-10-13 E.G.O. Elektro-Geraetebau Gmbh Induction hob and flexible support for an induction hob
CN106051846A (en) * 2015-04-10 2016-10-26 E.G.O.电气设备制造股份有限公司 Induction hob and flexible support for an induction hob
EP3079443A1 (en) 2015-04-10 2016-10-12 E.G.O. ELEKTRO-GERÄTEBAU GmbH Induction hob and flexible substrate for an induction hob
US10271386B2 (en) 2015-04-10 2019-04-23 E.G.O. Elektro-Geraetebau Gmbh Induction hob and flexible support for an induction hob
CN106051846B (en) * 2015-04-10 2019-07-12 E.G.O.电气设备制造股份有限公司 Electromagnetic oven and flexible support for electromagnetic oven
EP3185647A1 (en) * 2015-12-22 2017-06-28 BSH Hausgeräte GmbH Cooking hob device
WO2018029002A1 (en) * 2016-08-08 2018-02-15 Arcelik Anonim Sirketi Thin film heating cooker detecting cooking utensils with improved heating methods
US11178732B2 (en) 2017-06-26 2021-11-16 Lg Electronics Inc. Induction heating device and method for sensing a cooking vessel on an induction heating device
US11153938B2 (en) 2017-06-26 2021-10-19 Lg Electronics Inc. Cooking vessel sensor and induction heating device including a cooking vessel sensor
US11785680B2 (en) 2017-06-26 2023-10-10 Lg Electronics Inc. Induction heating device and method for sensing a cooking vessel on an induction heating device
US10869365B2 (en) 2017-06-26 2020-12-15 Lg Electronics Inc. Induction heating device
EP3422809A1 (en) * 2017-06-26 2019-01-02 LG Electronics Inc. -1- Induction heating device
EP3422813A1 (en) * 2017-06-26 2019-01-02 LG Electronics Inc. -1- Cooking vessel sensor and induction heating device including a cooking vessel sensor
US11202345B2 (en) 2017-06-26 2021-12-14 Lg Electronics Inc. Loaded-object sensor and induction heating device including loaded-object sensor
EP3422811A1 (en) * 2017-06-26 2019-01-02 LG Electronics Inc. -1- Loaded-object sensor and induction heating device including loaded-object sensor
EP3422808A1 (en) * 2017-06-26 2019-01-02 LG Electronics Inc. -1- Induction heating device
US11006485B2 (en) 2017-06-26 2021-05-11 Lg Electronics Inc. Induction heating device
US11770881B2 (en) 2017-06-26 2023-09-26 Lg Electronics Inc. Cooking vessel sensor and induction heating device including a cooking vessel sensor
EP3490338A1 (en) * 2017-11-22 2019-05-29 Vestel Elektronik Sanayi ve Ticaret A.S. Induction cooker, method for operating an induction cooker and controller for an induction cooker
DE102017221341A1 (en) * 2017-11-28 2019-05-29 E.G.O. Elektro-Gerätebau GmbH Pot detection sensor for an induction hob and induction hob
WO2020079611A1 (en) * 2018-10-18 2020-04-23 BSH Hausgeräte GmbH Induction device
WO2020079609A1 (en) * 2018-10-18 2020-04-23 BSH Hausgeräte GmbH Induction device
ES2754877A1 (en) * 2018-10-18 2020-04-20 Bsh Electrodomesticos Espana Sa Induction Device (Machine-translation by Google Translate, not legally binding)
ES2754873A1 (en) * 2018-10-18 2020-04-20 Bsh Electrodomesticos Espana Sa Induction device (Machine-translation by Google Translate, not legally binding)
US20210410238A1 (en) * 2018-10-18 2021-12-30 BSH Hausgeräte GmbH Induction device
WO2020079625A1 (en) * 2018-10-18 2020-04-23 BSH Hausgeräte GmbH Induction device
ES2754821A1 (en) * 2018-10-18 2020-04-20 Bsh Electrodomesticos Espana Sa Induction device (Machine-translation by Google Translate, not legally binding)
WO2020152499A1 (en) 2019-01-23 2020-07-30 Gorenje Gospodinjski Aparati, D.D. Device for detecting cooking vessel characteristics and method for detecting cooking vessel characteristics
US20210068208A1 (en) * 2019-09-02 2021-03-04 Samsung Electronics Co., Ltd. Cooking apparatus and method for controlling the same
EP3799527A1 (en) * 2019-09-27 2021-03-31 E.G.O. Elektro-Gerätebau GmbH Induction hob and method for controlling an induction hob
DE102019214910A1 (en) * 2019-09-27 2021-04-01 E.G.O. Elektro-Gerätebau GmbH Induction hob and method for controlling an induction hob
DE102020109484A1 (en) 2020-04-06 2021-10-07 Miele & Cie. Kg Inductive kitchen system
WO2022002587A1 (en) 2020-07-01 2022-01-06 BSH Hausgeräte GmbH Induction cooking appliance
EP4203609A1 (en) * 2021-12-23 2023-06-28 Whirlpool Corporation Cooking article detection system with differential detection coils
EP4287770A1 (en) * 2022-05-30 2023-12-06 E.G.O. Elektro-Gerätebau GmbH Induction hob with a support structure with antennas and/or sensors, method for producing such a support structure and use of a support structure for an induction hob

Also Published As

Publication number Publication date
EP2312908B1 (en) 2017-08-02
ES2639022T3 (en) 2017-10-25
ES2376566A1 (en) 2012-03-15
ES2376566B1 (en) 2013-01-29

Similar Documents

Publication Publication Date Title
EP2312908B1 (en) Hotplate with sensors
EP1876394B1 (en) Touch slider having a haptical relief pattern
EP0687131A2 (en) Control system for electrical heating apparatus
DE102008064731A1 (en) Hob with a movable heating element
EP2703728B1 (en) Hotplate device
EP2840867B1 (en) Hotplate device
EP3383135B1 (en) Cooking system for positioning an installation unit
WO2016046676A1 (en) Home appliance device comprising a sensor element, and method for manufacturing a sensor
EP1876515B1 (en) Operating device
DE102004059822B4 (en) Method for operating an induction hob
DE102008021943B4 (en) Electric device with large, transparent plate and capacitive control device
EP3352529B1 (en) Hotplate
DE19707664C5 (en) Apparatus and method for controlling or regulating the temperature of heated surfaces
DE4439777A1 (en) Sensor-controlled glass ceramic electric cooker
DE3446195C2 (en)
EP3028539B1 (en) Cooking hob devide
EP2763500B1 (en) Hob with a hotplate field and a conductor as surface boundary for electronic components
EP3784001B1 (en) Induction cooking system for induction cooking system comprising a temperature sensor, induction cooking system and method for operating the induction cooking system
DE102013202238A1 (en) Household appliance series and method for producing different-purpose household appliances
DE102018219969A1 (en) Hob device
EP3492819A1 (en) Hob system
EP2852248B1 (en) Device and method for pot detection
DE19744183B4 (en) instrument cluster
DE102011087216A1 (en) Cooktop i.e. glass ceramic stove top, has operating element for selecting cooking area and arranged in operating area, and sensor device i.e. camera, provided for detecting position of operating element and selected cooking area
EP0639743B1 (en) Cooking top

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

AX Request for extension of the european patent

Extension state: BA ME

17P Request for examination filed

Effective date: 20111020

RAP1 Party data changed (applicant data changed or rights of an application transferred)

Owner name: BSH HAUSGERAETE GMBH

17Q First examination report despatched

Effective date: 20170126

GRAP Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOSNIGR1

INTG Intention to grant announced

Effective date: 20170303

GRAS Grant fee paid

Free format text: ORIGINAL CODE: EPIDOSNIGR3

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

REG Reference to a national code

Ref country code: GB

Ref legal event code: FG4D

Free format text: NOT ENGLISH

REG Reference to a national code

Ref country code: CH

Ref legal event code: EP

Ref country code: AT

Ref legal event code: REF

Ref document number: 915738

Country of ref document: AT

Kind code of ref document: T

Effective date: 20170815

REG Reference to a national code

Ref country code: IE

Ref legal event code: FG4D

Free format text: LANGUAGE OF EP DOCUMENT: GERMAN

REG Reference to a national code

Ref country code: DE

Ref legal event code: R096

Ref document number: 502010013934

Country of ref document: DE

REG Reference to a national code

Ref country code: FR

Ref legal event code: PLFP

Year of fee payment: 8

REG Reference to a national code

Ref country code: ES

Ref legal event code: FG2A

Ref document number: 2639022

Country of ref document: ES

Kind code of ref document: T3

Effective date: 20171025

REG Reference to a national code

Ref country code: NL

Ref legal event code: MP

Effective date: 20170802

REG Reference to a national code

Ref country code: LT

Ref legal event code: MG4D

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: FI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170802

Ref country code: HR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170802

Ref country code: NO

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20171102

Ref country code: SE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170802

Ref country code: NL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170802

Ref country code: LT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170802

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: GR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20171103

Ref country code: PL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170802

Ref country code: IS

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20171202

Ref country code: BG

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20171102

Ref country code: LV

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170802

Ref country code: RS

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170802

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: CZ

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170802

Ref country code: DK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170802

Ref country code: RO

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170802

REG Reference to a national code

Ref country code: DE

Ref legal event code: R097

Ref document number: 502010013934

Country of ref document: DE

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SM

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170802

Ref country code: MC

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170802

Ref country code: SK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170802

Ref country code: EE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170802

REG Reference to a national code

Ref country code: CH

Ref legal event code: PL

PLBE No opposition filed within time limit

Free format text: ORIGINAL CODE: 0009261

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT

26N No opposition filed

Effective date: 20180503

REG Reference to a national code

Ref country code: IE

Ref legal event code: MM4A

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: CH

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20171031

Ref country code: LU

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20171011

Ref country code: LI

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20171031

REG Reference to a national code

Ref country code: BE

Ref legal event code: MM

Effective date: 20171031

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: BE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20171031

Ref country code: SI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170802

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: MT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170802

REG Reference to a national code

Ref country code: FR

Ref legal event code: PLFP

Year of fee payment: 9

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20171011

REG Reference to a national code

Ref country code: AT

Ref legal event code: MM01

Ref document number: 915738

Country of ref document: AT

Kind code of ref document: T

Effective date: 20171011

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: AT

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20171011

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: HU

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT; INVALID AB INITIO

Effective date: 20101011

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: CY

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20170802

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: MK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170802

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: TR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170802

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: PT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170802

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: AL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170802

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: GB

Payment date: 20231025

Year of fee payment: 14

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: ES

Payment date: 20231117

Year of fee payment: 14

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: IT

Payment date: 20231031

Year of fee payment: 14

Ref country code: FR

Payment date: 20231023

Year of fee payment: 14

Ref country code: DE

Payment date: 20231031

Year of fee payment: 14