Classifications

• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
  • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
  • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
  • H05K3/3494—Heating methods for reflowing of solder
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
  • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
  • H05K2203/0736—Methods for applying liquids, e.g. spraying
  • H05K2203/0746—Local treatment using a fluid jet, e.g. for removing or cleaning material; Providing mechanical pressure using a fluid jet
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
  • H05K2203/08—Treatments involving gases
  • H05K2203/081—Blowing of gas, e.g. for cooling or for providing heat during solder reflowing

Definitions

• the invention relates to a device for the thermal treatment of workpieces according to the preamble of patent claim 1.
• the heat transfer to the printed circuit boards depends essentially on the temperature and the flow velocity of the gas within the process chamber.
• the fan motors of such convection modules are speed controlled to affect heat transfer rates.
• a device for reflow soldering in which the assembly to be soldered is transported along a transport plane through a heating field. Above the transport plane, a nozzle with a slot-shaped nozzle opening and a slot-shaped channel cross-section is provided, which essentially corresponds to the width of the assembly.
• the process gas jet is widened over a baffle which is spaced from the nozzle opening.
• the process gas is used in this device to supply the necessary amount of heat to the component. This has the disadvantage that a very large amount of process gas has to be introduced into the process chamber.
• the apparatus for the thermal treatment of workpieces in particular printed circuit boards equipped with electrical and electronic components or the like, has a process chamber in which at least one heating or cooling zone having a heating or cooling device is formed or arranged. It is possible, workpieces under heating or cooling along a transit route through these zones to transport.
• Such devices are preferably modular, with cooling and heating modules can be added one behind the other. Thus, a component which is transported along the various cooling or heating zones can be heated or cooled accordingly. The temperature in the various modules is measured with temperature sensors or pyrometers and can then be controlled.
• a pressurized gaseous fluid can be introduced via inlet openings into the heating or cooling zones.
• the gaseous fluid is blown through the inlet openings at a high speed in relation to the volume of the process chamber and tears the surrounding gas atmosphere in the process chamber in the region of the inlet openings.
• This larger and, in particular, highly swirled volumetric flow promotes in particular the radiant heat transfer from the heating or cooling to the workpieces and vice versa with an additional convective heat transfer.
• such a device makes it possible to increase the efficiency of heat transfer by increasing the amount of heat transferred by introducing a gas by convection.
• the gaseous fluid can consist of compressed air, but also of inert gas or other customary process gases, which are introduced through the inlet openings into the process chamber.
• the temperature of the gas is not crucial because of the low volume flow.
• preheated compressed air from a compressed air reservoir.
• the gas merely serves to set the gas in the chamber in motion.
• the inflow openings may be nozzle-shaped and corresponding to their openings Create flow type. It is provided by way of example to apply pressure to the fluid source by means of a compressor or a compressed gas cylinder or to connect it to an existing compressed air network.
• Another preferred embodiment provides to arrange the inflow openings on at least one wall of a hollow chamber which is connected to a pressurized fluid source.
• the hollow chamber can be arranged at any point in the process chamber, so that the fluid can be guided to almost any point of the process chamber via the inflow openings in the wall or the walls of the hollow chamber.
• the wall having the inflow openings is part of the outer wall of the process chamber.
• the arrangement of the pipe sections is basically arbitrary and depends essentially on where the process chamber, the fluid to be introduced is to be brought.
• the process chamber the fluid to be introduced is to be brought.
• Concentrating flow in the region of the passage it is provided according to a preferred embodiment, to arrange a plurality of pipe sections in the process chamber, which are substantially parallel to the passage line.
• the pipe sections can be arranged one behind the other and / or next to each other.
• a further preferred embodiment provides to arrange the pipe sections substantially transversely or at an angle to the passage of the workpieces.
• a different type of gas can be supplied to the continuous workpieces from different pipe sections in different areas of the process chamber.
• the arrangement of the inlet openings on the pipe sections is basically also arbitrary.
• the openings can be se be distributed statistically distributed to the pipe sections.
• the inlet openings are arranged on the pipe sections linearly one behind the other to ensure a uniform flow distribution and thus a uniform convection.
• the inlet openings may for example be arranged next to each other or angularly offset from each other.
• a broader flow characteristic can be generated, with the other parts of the process chamber can be achieved with a larger gas volume movement.
• each adjacent pipe sections between 10 mm and 100 mm, on the one hand, a sufficiently high gas flow rate can be generated and at the same time can radiate sufficient heat between the pipe sections.
• the pipe sections are arranged for example parallel.
• the distance of the pipe sections to the workpieces to be thermally treated is preferably between 20 mm and 50 mm.
• the pipe sections in their distance from each other and / or to arrange changeable from the workpieces to be treated. This can be done, for example, via a manually or motor-operated adjusting device, which can also be controlled or regulated depending on process parameters, such as temperature of the atmosphere of the process chamber or the like.
• the diameter of the inlet openings is particularly in consideration of the throw distance, the gas pressure and the distance of the inlet Set flow openings to each other. This is preferably between 2 mm and 0.01 mm, in particular between 0.5 mm and 0.05 mm.
• the incoming gas can entrain the ambient atmosphere in the process chamber and, as a result, generate a relatively high gas flow to the workpieces.
• the proposed small diameter allow high flow rates for the incoming gas with low gas consumption.
• the gas flow brings no amount of heat in the chamber, but only supports the heat transfer from the heated process gas atmosphere in the process chamber to the workpiece. Thus, in addition to the radiant heat transfer, a convective heat transfer.
• the distance between respectively adjacent inflow openings is preferably between 5 mm and 100 mm.
• a further preferred embodiment provides that the pressure difference between the process chamber and the pressurized fluid is between 1 bar and 50 bar. This allows high flow velocities to be generated through the inlet openings into the process chamber, which form the basis for a high degree of turbulence, a high effective volume flow to the workpieces to be treated and thus a high convective energy transfer. This pressure range also allows a high inflow, as well as the variation of the same.
• the heating or cooling device has at least one communiquénworks- or cooling element, wherein the pipe sections between the workpiece and the réellenitz- or cooling element are arranged.
• a wall area of the process chamber can also be used as area heating element. serve chamber, which is heated according to the outside or has an infrared heating element.
• the heating or cooling devices has at least one rod-shaped or tubular heating or cooling element.
• these can be tubes through which superheated steam, hot water or a cooling medium flows.
• the heating or cooling elements can be arranged between the pipe sections, between the pipe sections and the workpieces to be treated or between the pipe sections and a wall of the process chamber.
• FIG. 1 shows a process chamber with top and bottom arranged, adjacent pipe sections and heating or cooling elements.
• FIG. 3 shows a process chamber with piping sections and heating or cooling elements arranged at the top and at the bottom, wherein the heating elements are partially shielded with a reflector element;
• 4 shows a process chamber with a surface heating element in which a plurality of inflow openings are provided; 5 shows a section through a pipe section with two inlet openings;
• FIG. 7 shows a module with a register of pipe sections and a heating or cooling device
• FIG. 8 is a sectional view showing the arrangement of a register of piping sections and heating and cooling elements of the module shown in FIG. 7;
• FIG. 11 shows the arrangement of a plurality of tube registers and heating or cooling modules along a passage.
• the process chamber 1 shown in FIG. 1 is passed through in the middle by a transport unit 2, which enters the process chamber 1 through a first chamber opening 3, until the transport unit 2 emerges from the process chamber through the second chamber opening 4.
• a transport unit 2 which enters the process chamber 1 through a first chamber opening 3, until the transport unit 2 emerges from the process chamber through the second chamber opening 4.
• pipe sections 5 are provided, from which a gas flow 6 flows to the chamber axis.
• a heating element 7 is alternately provided, from which a heat radiation 8 also radiates to the center of the chamber, which is illustrated by the curved vector.
• This alternate arrangement of heat radiation elements 7 and pipe sections 5 increases the efficiency of heat transfer to a component. This is transported by the transport unit 2 along the passage path through the process chamber 1 and additionally by heated the gas flow 6, which was heated by contact with the heat radiation elements 7 and the heated by these surfaces within the process chamber.
• FIG. 2 illustrates the variable arrangement of the heating elements 7 and inlet openings 5 in relation to the passage section of the transport unit 2.
• a process chamber 1 is moved by a transport unit 2 from a first chamber opening 3 to a second chamber opening 4, the inlet openings 5 being in a first part and heating elements 7 are arranged in a first position 9, which is closer to the passage line, and in another part in a second position 10, which is further apart relative to the passage line.
• the lateral distance of the heating elements 7 and pipe sections 5 is also illustrated as variable by the distance between two pipe sections 5 has a first width 1 1 and a second width 12.
• a heating element 7 is provided alternately next to each inlet element 5 .
• reflector elements 13 are provided, which lie between the heating elements 7 and the passage section of the transport unit 2 and thus deflect the emanating from the heating elements 7 heat radiation 8 to the side, whereby a higher proportion of the heat radiation 8 directly to the pipe sections 5 and the inflow openings arranged therein arrives.
• the gas flow 6 can thereby be heated efficiently and move this absorbed amount of heat to the transport unit 2 and a component lying thereon.
• FIG. 4 shows a further possibility for heating the gas flow 6, with a variation of the flow.
• the process chamber 1 is parallel to the direction of the passage of the transport unit 2 on the walls of the process chamber 1, a surface heating element 14 is provided, which radiates the heat radiation in the process chamber 1 area.
• the inflow openings 5 are provided in front of the surface heating element 14 in order to move the amount of heat emitted by this to the transport unit 2.
• the effluent from the pipe sections 5 gas jet 6 is divided into a first partial beam 15 and a second partial beam 16, whereby a broader distribution of the gas flow and thus an increase in the volume flow is made possible.
• FIG. 5 shows the section through a pipe section 5 with an inlet opening 18 and next to it a further inlet opening 19.
• the gas flow is thereby divided into a first partial jet 15 and a second partial jet 16.
• This embodiment of a divided process gas jet is also indicated in FIG. 4, for example.
• the outer diameter 20 and the inner diameter 21 are unique characteristics for the pipe section, as it can be influenced at a fixed gas pressure, the flow rate or the flow shape.
• FIG. 6 shows a section through a pipeline section 5 with only one inflow opening 18, which only generates a first partial stream 17. This is particularly advantageous for locally generated flows.
• FIG. 7 shows a module according to the invention in which a pressurized fluid source 22 is connected to a pipe register consisting of five pipe sections 5. From each pipe section 5 flows a gaseous fluid. Furthermore, as a heating element 7, a heating coil is shown, which extends substantially over the surface of the tube register. The pressurized fluid source 22 shown enables a uniform distribution of the gas pressure in the various pipe sections 5 in the module.
• FIG. 8 shows a section through the module shown in FIG. 7, wherein a first partial jet 15 and a second partial jet 16, which are warmed up by the heat emitted by the heating elements 7, flow out of the pipeline sections 5. Furthermore, reflector elements 13 are provided, which ensure that the heat is efficiently moved to the pipe sections 5.
• Fig. 9 and Fig. 10 shows the arrangement of the pipe sections 5 with respect.
• Fig. 9 shows accordingly the arrangement of the pipe sections 5 parallel to the direction of the passage section 23 of the transport unit 2.
• Correspondingly rectangular is the arrangement the inlet openings 5 transversely to the direction of the passage section 23 in Fig. 10.
• FIG. 11 shows the embodiment of a soldering device with a plurality of heating or cooling modules arranged side by side, as explained in FIG. 7.
• a process chamber 1 of eight modules is constructed, each having a register of pipe sections 5 and a heating element 7 in the form of a heating coil. These can be connected via a connection element 24 to a pressurized fluid source and via a connection 25 to a heating device.
• the embodiment of the invention is not limited to the embodiments described in FIGS. 1 to 1 1, but also a plurality of variants is possible.
• the type and arrangement of the heating and cooling elements and the arrangement of the transport unit and the geometry of the process chamber may differ from the devices shown.
• the invention thus makes a decisive contribution to improving the efficiency of the heat transport in soldering devices, in addition to the heat radiation, the amount of heat transferred by the heated fluid flow is increased.
• Process chamber Transport unit First chamber opening Second chamber opening Pipe section Gas flow Heating element Heat radiation First position Second position First width Second width Reflector element Surface heating element First partial jet Second partial jet Single jet Inlet opening Additional inlet opening Outside diameter Inside diameter Pressurized fluid source Transport direction Connection to pressurized fluid source Connection to heater

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• Engineering & Computer Science (AREA)
• Manufacturing & Machinery (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Furnace Details (AREA)
• Electric Connection Of Electric Components To Printed Circuits (AREA)
• Tunnel Furnaces (AREA)

Applications Claiming Priority (3)

Publications (1)

Family

ID=39942628

Family Applications (1)

Country Status (13)

Families Citing this family (3)

Citations (2)

Family Cites Families (16)

• 2008
  • 2008-07-15 DE DE102008033225A patent/DE102008033225B3/de not_active Expired - Fee Related
  • 2008-09-01 DE DE202008011595U patent/DE202008011595U1/de not_active Expired - Lifetime
• 2009
  • 2009-05-18 EP EP09775874A patent/EP2301311A1/de not_active Withdrawn
  • 2009-05-18 KR KR1020107028649A patent/KR20110053403A/ko not_active Application Discontinuation
  • 2009-05-18 CN CN2009801276228A patent/CN102090157A/zh active Pending
  • 2009-05-18 WO PCT/DE2009/000675 patent/WO2010006568A1/de active Application Filing
  • 2009-05-18 AU AU2009270670A patent/AU2009270670A1/en not_active Abandoned
  • 2009-05-18 CA CA2725766A patent/CA2725766A1/en not_active Abandoned
  • 2009-05-18 UA UAA201101077A patent/UA100577C2/ru unknown
  • 2009-05-18 JP JP2011517745A patent/JP2011528171A/ja active Pending
  • 2009-05-18 US US13/003,910 patent/US20110117513A1/en not_active Abandoned
  • 2009-05-18 MX MX2011000253A patent/MX2011000253A/es not_active Application Discontinuation
  • 2009-05-18 EA EA201100123A patent/EA201100123A1/ru unknown
• 2011
  • 2011-01-06 IL IL210507A patent/IL210507A0/en unknown

Patent Citations (2)

Non-Patent Citations (1)

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