EP2293381B1 - Antenna assembly - Google Patents

Antenna assembly Download PDF

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Publication number
EP2293381B1
EP2293381B1 EP09011000.8A EP09011000A EP2293381B1 EP 2293381 B1 EP2293381 B1 EP 2293381B1 EP 09011000 A EP09011000 A EP 09011000A EP 2293381 B1 EP2293381 B1 EP 2293381B1
Authority
EP
European Patent Office
Prior art keywords
circuit board
antenna
narrow
hole
narrow side
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP09011000.8A
Other languages
German (de)
French (fr)
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EP2293381A1 (en
Inventor
Wolfgang Dörr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Delphi International Operations Luxembourg SARL
Original Assignee
Delphi International Operations Luxembourg SARL
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Delphi International Operations Luxembourg SARL filed Critical Delphi International Operations Luxembourg SARL
Priority to EP09011000.8A priority Critical patent/EP2293381B1/en
Priority to US12/868,113 priority patent/US20110050506A1/en
Priority to CN201010267410.4A priority patent/CN102005642B/en
Publication of EP2293381A1 publication Critical patent/EP2293381A1/en
Application granted granted Critical
Publication of EP2293381B1 publication Critical patent/EP2293381B1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q7/00Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/36Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49016Antenna or wave energy "plumbing" making
    • Y10T29/49018Antenna or wave energy "plumbing" making with other electrical component
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155Manufacturing circuit on or in base
    • Y10T29/49165Manufacturing circuit on or in base by forming conductive walled aperture in base

Definitions

  • the present invention relates to an antenna assembly comprising a printed circuit board and an antenna carried by the printed circuit board.
  • Such antenna arrangements are basically known and are used, for example, as transmitting antennas in hand transmitters or electronic keys with which, for example, Motor vehicles can be locked and unlocked remotely or garage doors can be opened and closed.
  • WO 2004/034512 A1 discloses an antenna arrangement according to the preamble of claim 1.
  • US 2007/0279879 A1 discloses a similar antenna arrangement.
  • US 2006/0238421 A1 discloses an antenna assembly having an antenna portion disposed on an upper side and an underside of a printed circuit board, wherein the upper and lower antenna portions are electrically connected to one another by a plurality of vias.
  • GB 2 357 905 A and DE 196 14 362 C1 each reveal similar antenna arrangements.
  • the known antenna arrangements prove to be disadvantageous in that they have a comparatively low antenna efficiency. That is, the useful transmission power radiated by the antenna is relatively small compared to the power consumption of the antenna required for this purpose.
  • the present invention is therefore based on the object to provide an antenna arrangement of the type mentioned, which has an increased antenna efficiency.
  • the antenna arrangement according to the invention comprises a printed circuit board which has an upper side and a lower side, and an antenna, in particular a ring antenna, which is supported by the printed circuit board and which comprises at least one electrically conductive antenna section which is arranged on a narrow side of the printed circuit board which adjoins the upper side and / or lower side is.
  • the efficiency of the antenna arrangement is impaired, in particular, by line losses in the line path of the antenna and by dielectric losses in the dielectric material of the circuit board.
  • the reason for the problem of high line losses is not least the skin effect, which is particularly pronounced at frequencies suitable for the operation of the antenna arrangement.
  • the skin effect refers to the phenomenon that an alternating current flowing inside a conductor increasingly counteracts eddy currents that are induced by the alternating current inside the conductor and thus reduce the net current flow, so that the current flow from the center of the conductor to the edge the head is relocated.
  • essentially only the edge of the conductor contributes to the current conduction, and the effective resistance of the conductor increases.
  • the power is not very efficient conducts, because the surface of the circuit board and thus also the conductor in this edge region usually have a high roughness and the current path is extended accordingly in this area.
  • the printed circuit board carrying the antenna preferably consists entirely of electrically nonconductive, dielectric material.
  • the circuit board may be laminated from a plurality of dielectric layers.
  • the inventive construction of a conductive antenna section on a narrow side of the circuit board creates an electrical current path with good power line properties and thus reduces the line losses incurred by the antenna.
  • An advantage of a narrow side mounted conductive antenna section here is that the antenna section itself does not take up space on the top or bottom. Thus, even with little space on the top and bottom of the circuit board, a relatively large electrically conductive antenna section can be realized and thus increased conductivity of the antenna can be achieved.
  • a narrow-side antenna section is particularly advantageous if the antenna is an annular antenna and has a current path which extends at least substantially annularly in the plane of the printed circuit board.
  • a narrow-side antenna section here has at least approximately the shape of a jacket segment, resulting in a particularly good Abstrahls characterizing leads and contributes to increased antenna efficiency.
  • the antenna arrangement according to the invention thus has an improved antenna efficiency, which ultimately not only increases the antenna range, but also the energy consumption is reduced.
  • the arranged on the narrow side conductive antenna portion preferably comprises a metallic material, in particular copper or gold.
  • the conductive narrow-side antenna section is preferably a metallic layer, arranged on the narrow side, with a substantially constant thickness, which is, for example, several 10 ⁇ m.
  • the narrow side of the printed circuit board adjoins the upper side and / or the lower side of the printed circuit board.
  • the narrow side may extend substantially perpendicular to the top or bottom of the circuit board. It is preferable if the narrow side extends from the upper side to the lower side of the printed circuit board and thus thus through the printed circuit board. In this case, the narrow side provides a particularly large area for the arranged on the narrow side antenna section.
  • the narrow side defines a hole extending through the printed circuit board through the printed circuit board, which is preferably elongate. If the narrow-side antenna section borders on a hole or an outer side of the printed circuit board, then there is less dielectric printed circuit board material in the direct vicinity of the narrow-side antenna section, whereby the dielectric losses of the electromagnetic field generated by a current flowing in the narrow-side antenna section are reduced.
  • such narrow sides can be particularly easily formed, for example by holes are formed in the circuit board by a milling process or by the outer contour of the circuit board is cut by a milling process accordingly.
  • the narrow-side antenna section does not form a closed electrically conductive ring.
  • the narrow side to which the antenna section is attached defines a hole of the circuit board, and the antenna section is attached only to a portion of the narrow side defining the hole without forming a closed ring in the hole.
  • Such a narrow-side antenna section can be produced in a simple manner by completely coating a narrow side delimiting a hole with electrically conductive material and subsequently removing unwanted electrically conductive material.
  • an antenna arrangement which has only a narrow-side antenna section and no upper or lower-side antenna sections
  • the antenna section arranged on the narrow side is connected according to the invention with an antenna section running on the upper side and with an antenna section running on the lower side.
  • the narrow-side antenna section may be connected along its at least approximately entire length to the antenna section running on the upper or lower side.
  • two narrow-side antenna sections are connected on opposite sides of an antenna section running on the top side or of an antenna section running on the underside.
  • the two narrow-side and the upper and / or lower-side antenna section thus form two angles, in the peaks of which higher currents can flow, whereby the conductivity of the antenna section as a whole is increased even further.
  • the antenna section arranged on the narrow side extends through the printed circuit board and connects an antenna section arranged on the upper side of the printed circuit board to an antenna section arranged on the lower side of the printed circuit board.
  • an upper-side and a lower-side antenna section are interconnected by two opposite narrow-side antenna sections. In this way, four antenna section angles are formed and an even higher current flow and antenna efficiency are achieved.
  • the antenna section arranged on the narrow side interrupts one of the top side and bottom side of the printed circuit board first antenna section electrically bridged.
  • the narrow-side antenna section additionally connect the first antenna section to a second antenna section extending on the lower or upper side.
  • An interruption of the antenna portion of the top or bottom of the circuit board may serve to accommodate other circuit parts mounted on the top or bottom of the circuit board, such as an interconnect passing through the interruption to interconnect various circuit parts or components.
  • the circuit board may carry other circuit parts, e.g. be made in common process steps with the antenna, for example, connecting lines and pads for more arranged on the circuit board circuit parts.
  • antenna sections arranged on the top and / or bottom side of the printed circuit board can be connected in a common process step with the further circuit parts, such as e.g. Connecting lines and pads are formed.
  • Such further circuit parts may, for example, belong to a drive circuit which applies a drive signal to the antenna mounted on the printed circuit board or, in the case of a receive antenna, to a receive and evaluate circuit.
  • the antenna is preferably driven with frequencies in the range between 300 and 1000 MHz.
  • Another object of the invention is a method having the features of claim 3.
  • the inventive method may in particular for producing an antenna arrangement of the type described above. The advantages explained above thus apply accordingly.
  • an electrically conductive material is attached to a narrow side of the printed circuit board which adjoins the upper side and / or the underside of the printed circuit board.
  • the narrow side of the circuit board is produced by removing printed circuit board material, in particular by forming a, in particular elongated, hole in the circuit board, for example by a drilling or milling process.
  • Drilling and milling processes for printed circuit boards are known per se and can be accomplished in a simple manner with available tools and machines.
  • a plurality of holes are produced in the circuit board along the desired antenna track for a plurality of narrow-side antenna sections.
  • Known drilling or milling machines can produce such a variety of holes with high precision and high speed using an electronic layout, such as a CAD layout.
  • the co-generation of via holes and narrow side (s) simplifies the manufacturing process for the antenna assembly by not requiring a separate process step for removing printed circuit board material to produce the narrow side (s).
  • the via holes and the narrow side (s) can thus be produced in particular in one and the same machine tool, without the circuit board having to be temporarily removed from the working area of the machine.
  • the layout file for creating the via holes can be simply added to the geometric data for drilling and / or milling to create the narrow side (s).
  • the electrically conductive material is attached by a deposition process on the narrow side, in particular by means of a galvanic process.
  • Electrodeposition processes can be used to produce layers of electrically conductive material on a narrow side which have high quality, high electrical conductivity and good adhesion to the printed circuit board material.
  • copper and / or gold is deposited and more preferably a layer is deposited with at least approximately constant thickness, which may be, for example, between 30 and 100 microns.
  • the narrow sides and the side walls delimiting the via holes are simultaneously coated with electrically conductive material in a common deposition process, since this does not require a separate deposition process for generating the antenna sections on the narrow sides.
  • electrically conductive material attached to the narrow sides and / or adjacent circuit board material is subsequently removed in regions, for example by a milling process.
  • unneeded electrically conductive material can be removed, e.g. electrically conductive material, which faces away from the antenna section, or reduce the weight and space requirement of the circuit board.
  • removal of printed circuit board material can reduce dielectric losses.
  • Fig. 1 to 6 show an antenna arrangement according to the invention in different stages of their production.
  • Fig. 1a shows a plan view of the top of a circuit board 10, which comprises an upper and a lower side, on each of which a copper layer 14 has been applied.
  • Fig. 1a shows holes 12 for through-connections 22 (vias, see Fig. 3 to 6 ) between circuit parts on the upper side and circuit parts on the underside of the printed circuit board 10.
  • the via holes 12 can be produced, for example, by a drilling or milling process.
  • Side walls 11 of the printed circuit board 10 delimit the via holes 12.
  • Fig. 1b shows the circuit board 10 of Fig. 1a in a cross section along the line AA 'of Fig. 1a ,
  • the copper layers 14, 14 ' can be seen, which are respectively applied to the top side and the bottom side of the printed circuit board 10.
  • the thickness s of the copper layers 14, 14 'compared to the thickness d of the printed circuit board 10 is exaggerated.
  • the thickness d of the printed circuit board 10 may for example be about 1.5 mm and the thickness s of the copper layers 14, 14 'each about 50 microns.
  • Fig. 2a shows the circuit board 10 of Fig. 1 after slots 16 have been created in the circuit board 10.
  • the elongated holes 16 extend along desired antenna conductor tracks and are bounded in each case circumferentially by a narrow side 18 of the printed circuit board 10.
  • two elongated holes 16 run parallel to one another on opposite sides of an antenna conductor track, so that an elongate cantilevered web 19 of the printed circuit board is formed by two adjacent oblong holes 16 10 is limited, which can wear a top and bottom antenna section 24, 24 '.
  • the slots 16 are produced by a milling process.
  • the elongated holes 16 are milled perpendicular to the top and bottom of the circuit board 10, so that the elongated holes 16 defining narrow sides 18 and the top or bottom of the circuit board 10 form a substantially right angle.
  • the drilling process for the via holes 12 and the milling process for the elongated holes 16 can be performed in a common process step in the same machine.
  • the side walls 11 of the via holes 12 and the narrow sides 18 defined by the elongated holes 16 are coated by a deposition process with a conductive material, in the present embodiment with copper.
  • Fig. 3a shows a plan view of the arrangement of Fig. 2a after the deposition, which can be done in a conventional manner by galvanization in a galvanic bath.
  • the thickness of the deposited copper material may be several tens of microns, for example.
  • the deposited on the narrow sides 18 copper material forms on the one hand narrow-side antenna sections 20 and the other unwanted or unneeded copper material 20 ', namely in the areas of the slots 16 delimiting narrow sides 18 which are remote from the desired narrow-side antenna section 20.
  • the deposited in the via holes 12 copper forms the through-connections 22 (vias).
  • Fig. 3b shows that the cross section of a free-carrying printed circuit board web 19 is surrounded by conductive material all around, namely the copper layers 14, 14 'and the narrow-side antenna sections 20.
  • the conductive material 14, 14', 20 surrounding the free-standing web 19 forms by its geometry an antenna current path with increased conductivity.
  • the copper layer 14 on the upper side and the copper layer 14 'on the underside of the printed circuit board 10 are patterned in a suitable manner, for example by an etching process known per se, on the upper side and the lower side of the printed circuit board 10 electrically conductive antenna sections 24, 24 'as well as electrical connection lines 28 and electrical pads 26 for in addition to the antenna on the circuit board 10 to produce circuit parts ( Fig. 4 ).
  • Fig. 4a, b . c show the printed circuit board 10 after patterning the copper layers 14, 14 '.
  • Fig. 4a shows, on the upper side of the circuit board 10, an approximately annular antenna portion 24 is formed, which extends in regions along the narrow sides 18 of the slots 16 and thereby with the on the narrow sides 18 deposited conductive material of the narrow-side antenna sections 20 is in electrical contact.
  • the two antenna sections 24, 24 'on the top and the bottom are as in Fig. 4b shown connected via the narrow-side antenna sections 20 with each other.
  • the antenna conductor tracks 24, 24 'on the upper and lower sides of the printed circuit board 10 together with the narrow-side antenna sections 20 form a substantially annular antenna which, in particular in the region of the cantilevered webs 19, increases the conductivity due to the conductive material deposited on the narrow sides 18 dielectric losses due to the formation of the elongated holes 16 in the dielectric material of the printed circuit board 10 has.
  • Fig. 4a a plurality of electrical connection surfaces 26 produced in the structuring step and electrical connection lines 28 are shown. These pads 26 and connecting lines 28 allow to attach electronic components for forming a driving circuit for driving the antenna on the printed circuit board 10.
  • the antenna is connected to the drive circuit via the connection surface 26a and via a connection surface 26b located on the back side of the circuit board 10, which serves as the reference potential for the circuit.
  • electronic components for example SMD components
  • SMD components can be used in a manner known per se attached to the pads 26 and interconnected via the electrical connection lines 28.
  • circuit parts on the upper side of the printed circuit board 10 are connected to one another by the interconnections 22 produced before the patterning process.
  • the assembly of the components for forming the drive circuit can be carried out before or after a trimming step following the structuring step or also between two sub-steps of the trimming step. The trimming step is explained below.
  • FIG. 5 schematically shows the cutting lines 30a, b, along which the circuit board 10 is cut.
  • the cutting line 30a the outer contour of the circuit board 10 is defined so that the cutting line 30a adjacent narrow-side antenna portions 20 of the outer slots 16 now form the outer sides of the circuit board 10 and portions of the antenna sections 24, 24 'on the top and bottom directly to the Outside of the circuit board 10 adjacent. Unnecessary electrically conductive material 20 'and unnecessary printed circuit board material is removed in this case.
  • the outer contour of the printed circuit board 10 can also be cut by passing printed circuit board material extending between an outer slot 16 and an outer side of the printed circuit board 10 two cut out between the outside of the circuit board 10 and the slot 16 guided cuts.
  • the printed circuit board 10 can preferably be roughly cut to an outer contour, which is something before the structuring of the copper layers 14, 14 ' greater than its gage, so that thin webs of the circuit board 10 remain, extending between the outer slots 16 and the outside of the circuit board 10. These are then cut out in a further trimming step following the structuring.
  • Fig. 6a and b show the finished antenna assembly after cutting.
  • the electrical conductivity of the antenna is increased by the narrow-side antenna sections 20, and the dielectric losses are reduced by the removal of dielectric material.
  • outer narrow sides 18 of the printed circuit board 10 for narrow-side sections 20 of the antenna moreover, a maximum antenna diameter is achieved with a minimum space requirement of the antenna arrangement.

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Description

Die vorliegende Erfindung betrifft eine Antennenanordnung mit einer Leiterplatte und einer durch die Leiterplatte getragenen Antenne.The present invention relates to an antenna assembly comprising a printed circuit board and an antenna carried by the printed circuit board.

Derartige Antennenanordnungen sind grundsätzlich bekannt und kommen beispielsweise als Sendeantennen in Handsendern oder elektronischen Schlüsseln zum Einsatz, mit denen z.B. Kraftfahrzeuge ferngesteuert ver- und entriegelt oder Garagentore geöffnet und geschlossen werden können.Such antenna arrangements are basically known and are used, for example, as transmitting antennas in hand transmitters or electronic keys with which, for example, Motor vehicles can be locked and unlocked remotely or garage doors can be opened and closed.

WO 2004/034512 A1 offenbart eine Antennenanordnung gemäß dem Oberbegriff des Anspruchs 1. US 2007/0279879 A1 offenbart eine ähnliche Antennenanordnung. WO 2004/034512 A1 discloses an antenna arrangement according to the preamble of claim 1. US 2007/0279879 A1 discloses a similar antenna arrangement.

US 2006/0238421 A1 offenbart eine Antennenanordnung mit einem auf einer Oberseite und einem auf einer Unterseite einer Leiterplatte angeordneten Antennenabschnitt, wobei der obere und der untere Antennenabschnitt durch mehrere Vias elektrisch miteinander verbunden sind.
GB 2 357 905 A und DE 196 14 362 C1 offenbaren jeweils ähnliche Antennenanordnungen.
US 2006/0238421 A1 discloses an antenna assembly having an antenna portion disposed on an upper side and an underside of a printed circuit board, wherein the upper and lower antenna portions are electrically connected to one another by a plurality of vias.
GB 2 357 905 A and DE 196 14 362 C1 each reveal similar antenna arrangements.

Die bekannten Antennenanordnungen erweisen sich insofern als nachteilig, als sie einen vergleichsweise geringen Antennenwirkungsgrad aufweisen. Das heißt, die von der Antenne ausgestrahlte nutzbare Sendeleistung ist im Vergleich zu der dafür notwendigen Leistungsaufnahme der Antenne relativ gering.The known antenna arrangements prove to be disadvantageous in that they have a comparatively low antenna efficiency. That is, the useful transmission power radiated by the antenna is relatively small compared to the power consumption of the antenna required for this purpose.

Dies führt bei den bekannten Antennenanordnungen allgemein zu einer geringen Reichweite und zu einem hohen Energiebedarf der Antenne beziehungsweise zu einer entsprechend geringen Batterielaufzeit.In the case of the known antenna arrangements, this generally leads to a short range and to a high energy requirement of the antenna or to a correspondingly short battery life.

Der vorliegenden Erfindung liegt deshalb die Aufgabe zugrunde, eine Antennenanordnung der eingangs genannten Art zu schaffen, die einen erhöhten Antennenwirkungsgrad aufweist.The present invention is therefore based on the object to provide an antenna arrangement of the type mentioned, which has an increased antenna efficiency.

Zur Lösung dieser Aufgabe ist eine Antennenanordnung mit den Merkmalen des Anspruchs 1 vorgesehen.To solve this problem, an antenna arrangement with the features of claim 1 is provided.

Die erfindungsgemäße Antennenanordnung umfasst eine Leiterplatte, die eine Oberseite und eine Unterseite aufweist, sowie eine durch die Leiterplatte getragene Antenne, insbesondere Ringantenne, welche wenigstens einen elektrisch leitfähigen Antennenabschnitt umfasst, der an einer an die Oberseite und/oder die Unterseite angrenzenden Schmalseite der Leiterplatte angeordnet ist.The antenna arrangement according to the invention comprises a printed circuit board which has an upper side and a lower side, and an antenna, in particular a ring antenna, which is supported by the printed circuit board and which comprises at least one electrically conductive antenna section which is arranged on a narrow side of the printed circuit board which adjoins the upper side and / or lower side is.

Erfindungsgemäß wurde erkannt, dass der Wirkungsgrad der Antennenanordnung insbesondere durch Leitungsverluste in der Leitungsbahn der Antenne sowie durch dielektrische Verluste im dielektrischen Material der Leiterplatte beeinträchtigt wird. Durch die Anordnung eines Antennenabschnitts an der Schmalseite lassen sich die beim Betrieb der Antenne auftretenden Leitungsverluste reduzieren und der Antennenwirkungsgrad somit erhöhen.According to the invention, it has been recognized that the efficiency of the antenna arrangement is impaired, in particular, by line losses in the line path of the antenna and by dielectric losses in the dielectric material of the circuit board. By arranging an antenna section on the narrow side, it is possible to reduce the line losses occurring during operation of the antenna and thus to increase the antenna efficiency.

Ursächlich für die Problematik der hohen Leitungsverluste ist nicht zuletzt der Skin-Effekt, der bei für den Betrieb der Antennenanordnung geeigneten Frequenzen besonders ausgeprägt ist. Der Skin-Effekt bezeichnet das Phänomen, dass einem im Inneren eines Leiters fließenden Wechselstrom bei hohen Frequenzen vermehrt Wirbelströme entgegenwirken, die durch den Wechselstrom im Inneren des Leiters induziert werden und den Nettostromfluss somit verringern, sodass der Stromfluss aus der Mitte des Leiters an den Rand des Leiters verlagert wird. In der Folge trägt bei hohen Frequenzen im Wesentlichen nur noch der Rand des Leiters zur Stromleitung bei, und der effektive Widerstand des Leiters erhöht sich.The reason for the problem of high line losses is not least the skin effect, which is particularly pronounced at frequencies suitable for the operation of the antenna arrangement. The skin effect refers to the phenomenon that an alternating current flowing inside a conductor increasingly counteracts eddy currents that are induced by the alternating current inside the conductor and thus reduce the net current flow, so that the current flow from the center of the conductor to the edge the head is relocated. As a result, at high frequencies, essentially only the edge of the conductor contributes to the current conduction, and the effective resistance of the conductor increases.

Ferner kommt hinzu, dass ein auf der Ober- oder Unterseite der Leiterplatte angeordneter Leiter in demjenigen Randbereich, in dem er mit der Ober- oder Unterseite in Berührung steht, den Strom nur wenig effizient leitet, weil die Oberfläche der Leiterplatte und damit auch die des Leiters in diesem Randbereich üblicherweise eine hohe Rauhigkeit aufweisen und der Strompfad in diesem Bereich entsprechend verlängert ist.In addition, an arranged on the top or bottom of the circuit board conductor in the edge region in which it is in contact with the top or bottom, the power is not very efficient conducts, because the surface of the circuit board and thus also the conductor in this edge region usually have a high roughness and the current path is extended accordingly in this area.

Die dielektrischen Verluste entstehen in der die Antenne tragenden Leiterplatte und hängen somit von den dielektrischen Verlusteigenschaften der die Leiterplatte bildenden Materialien ab. Im Rahmen der Erfindung besteht die die Antenne tragende Leiterplatte bevorzugt vollständig aus elektrisch nicht leitfähigem, dielektrischem Material. Die Leiterplatte kann beispielsweise aus mehreren dielektrischen Schichten laminiert sein.The dielectric losses occur in the circuit board carrying the antenna and thus depend on the dielectric loss properties of the materials forming the circuit board. In the context of the invention, the printed circuit board carrying the antenna preferably consists entirely of electrically nonconductive, dielectric material. For example, the circuit board may be laminated from a plurality of dielectric layers.

Die erfindungsgemäße Ausbildung eines leitfähigen Antennenabschnitts an einer Schmalseite der Leiterplatte schafft einen elektrischen Strompfad mit guten Stromleitungseigenschaften und reduziert somit die auftretenden Leitungsverluste der Antenne.The inventive construction of a conductive antenna section on a narrow side of the circuit board creates an electrical current path with good power line properties and thus reduces the line losses incurred by the antenna.

Ein Vorteil eines an einer Schmalseite angebrachten leitfähigen Antennenabschnitts ist hierbei, dass der Antennenabschnitt selbst keinen Platz auf der Ober- oder der Unterseite in Anspruch nimmt. Somit kann auch bei geringem Platzangebot auf der Ober- und Unterseite der Leiterplatte ein verhältnismäßig großer elektrisch leitfähiger Antennenabschnitt realisiert werden und damit eine erhöhte Leitfähigkeit der Antenne erreicht werden.An advantage of a narrow side mounted conductive antenna section here is that the antenna section itself does not take up space on the top or bottom. Thus, even with little space on the top and bottom of the circuit board, a relatively large electrically conductive antenna section can be realized and thus increased conductivity of the antenna can be achieved.

Ein schmalseitiger Antennenabschnitt ist insbesondere dann vorteilhaft, wenn die Antenne eine Ringantenne ist und einen Strompfad aufweist, der zumindest im Wesentlichen ringförmig in der Ebene der Leiterplatte verläuft. Ein schmalseitiger Antennenabschnitt weist hier zumindest annähernd die Form eines Mantelsegments auf, was zu einer besonders guten Abstrahlungscharakteristik führt und zu einem erhöhten Antennenwirkungsgrad beiträgt.A narrow-side antenna section is particularly advantageous if the antenna is an annular antenna and has a current path which extends at least substantially annularly in the plane of the printed circuit board. A narrow-side antenna section here has at least approximately the shape of a jacket segment, resulting in a particularly good Abstrahlscharakteristik leads and contributes to increased antenna efficiency.

Im Ergebnis besitzt die erfindungsgemäße Antennenanordnung also einen verbesserten Antennenwirkungsgrad, wodurch letztlich nicht nur die Antennenreichweite erhöht, sondern auch der Energiebedarf verringert ist.As a result, the antenna arrangement according to the invention thus has an improved antenna efficiency, which ultimately not only increases the antenna range, but also the energy consumption is reduced.

Vorteilhafte Ausführungsformen der Erfindung sind in den Unteransprüchen, der Beschreibung und den Zeichnungen beschrieben.Advantageous embodiments of the invention are described in the subclaims, the description and the drawings.

Der an der Schmalseite angeordnete leitfähige Antennenabschnitt weist bevorzugt ein metallisches Material auf, insbesondere Kupfer oder Gold. Bevorzugt ist der leitfähige schmalseitige Antennenabschnitt eine an der Schmalseite angeordnete metallische Schicht mit im Wesentlichen konstanter Dicke, welche zum Beispiel mehrere 10 µm beträgt.The arranged on the narrow side conductive antenna portion preferably comprises a metallic material, in particular copper or gold. The conductive narrow-side antenna section is preferably a metallic layer, arranged on the narrow side, with a substantially constant thickness, which is, for example, several 10 μm.

Gemäß einer Ausführungsform grenzt die Schmalseite der Leiterplatte an die Oberseite und/oder die Unterseite der Leiterplatte an. Die Schmalseite kann sich dabei im Wesentlichen senkrecht zur Ober- beziehungsweise Unterseite der Leiterplatte erstrecken. Bevorzugt ist es, wenn sich die Schmalseite von der Oberseite bis zu der Unterseite der Leiterplatte und somit also durch die Leiterplatte hindurch erstreckt. In diesem Fall stellt die Schmalseite eine besonders große Fläche für den an der Schmalseite angeordneten Antennenabschnitt zur Verfügung.According to one embodiment, the narrow side of the printed circuit board adjoins the upper side and / or the lower side of the printed circuit board. The narrow side may extend substantially perpendicular to the top or bottom of the circuit board. It is preferable if the narrow side extends from the upper side to the lower side of the printed circuit board and thus thus through the printed circuit board. In this case, the narrow side provides a particularly large area for the arranged on the narrow side antenna section.

Die Schmalseite begrenzt ein sich durch die Leiterplatte hindurch erstreckendes Loch der Leiterplatte, welches bevorzugt länglich ausgebildet ist. Grenzt der schmalseitige Antennenabschnitt an ein Loch oder eine Außenseite der Leiterplatte, so ist weniger dielektrisches Leiterplattenmaterial in der direkten Umgebung des schmalseitigen Antennenabschnitts vorhanden, wodurch die dielektrischen Verluste des durch einen in dem schmalseitigen Antennenabschnitt fließenden Strom erzeugten elektromagnetischen Felds verringert werden. Außerdem lassen sich derartige Schmalseiten besonders einfach bilden, zum Beispiel indem Löcher in der Leiterplatte durch einen Fräsprozess gebildet werden beziehungsweise indem die äußere Kontur der Leiterplatte durch einen Fräsprozess entsprechend zugeschnitten wird.The narrow side defines a hole extending through the printed circuit board through the printed circuit board, which is preferably elongate. If the narrow-side antenna section borders on a hole or an outer side of the printed circuit board, then there is less dielectric printed circuit board material in the direct vicinity of the narrow-side antenna section, whereby the dielectric losses of the electromagnetic field generated by a current flowing in the narrow-side antenna section are reduced. In addition, such narrow sides can be particularly easily formed, for example by holes are formed in the circuit board by a milling process or by the outer contour of the circuit board is cut by a milling process accordingly.

Erfindungsgemäß bildet der schmalseitige Antennenabschnitt keinen geschlossenen elektrisch leitfähigen Ring. Die Schmalseite, an welchem der Antennenabschnitt angebracht ist, begrenzt ein Loch der Leiterplatte und der Antennenabschnitt ist nur an einem Teilbereich der das Loch begrenzenden Schmalseite angebracht, ohne in dem Loch einen geschlossenen Ring zu bilden. Ein solcher schmalseitiger Antennenabschnitt kann in einfacher Weise durch vollständiges Beschichten einer ein Loch begrenzenden Schmalseite mit elektrisch leitfähigem Material und anschließendes Entfernen von unerwünschtem elektrisch leitfähigen Material erzeugt werden.According to the invention, the narrow-side antenna section does not form a closed electrically conductive ring. The narrow side to which the antenna section is attached defines a hole of the circuit board, and the antenna section is attached only to a portion of the narrow side defining the hole without forming a closed ring in the hole. Such a narrow-side antenna section can be produced in a simple manner by completely coating a narrow side delimiting a hole with electrically conductive material and subsequently removing unwanted electrically conductive material.

Obwohl eine Antennenanordnung vorstellbar ist, die ausschließlich einen schmalseitigen Antennenabschnitt und keine ober- oder unterseitigen Antennenabschnitte aufweist, ist der an der Schmalseite angeordnete Antennenabschnitt gemäß der Erfindung mit einem auf der Oberseite verlaufenden Antennenabschnitt und mit einem auf der Unterseite verlaufenden Antennenabschnitt verbunden. Durch das Vorsehen des schmalseitigen Antennenabschnitts zusätzlich zu einem mit dem schmalseitigen Antennenabschnitt verbundenen, auf der Ober- und Unterseite verlaufenden Antennenabschnitt wird die Leitfähigkeit der gesamten Anordnung deutlich erhöht.Although an antenna arrangement is conceivable which has only a narrow-side antenna section and no upper or lower-side antenna sections, the antenna section arranged on the narrow side is connected according to the invention with an antenna section running on the upper side and with an antenna section running on the lower side. By providing the narrow-side antenna section in addition to an antenna section connected to the narrow-side antenna section and extending on the upper and lower side, the conductivity of the entire arrangement is markedly increased.

Der schmalseitige Antennenabschnitt kann entlang seiner zumindest annähernd gesamten Länge mit dem auf der Ober- oder Unterseite verlaufenden Antennenabschnitt verbunden sein.The narrow-side antenna section may be connected along its at least approximately entire length to the antenna section running on the upper or lower side.

Gemäß einer weiteren Ausführungsform sind zwei schmalseitige Antennenabschnitte auf gegenüberliegenden Seiten eines auf der Oberseite verlaufenden Antennenabschnitts oder eines auf der Unterseite verlaufenden Antennenabschnitts mit diesem verbunden. Die zwei schmalseitigen und der ober- beziehungsweise unterseitige Antennenabschnitt bilden somit zwei Winkel, in deren Scheiteln höhere Ströme fließen können, wodurch die Leitfähigkeit des Antennenabschnitts insgesamt noch weiter erhöht ist.According to a further embodiment, two narrow-side antenna sections are connected on opposite sides of an antenna section running on the top side or of an antenna section running on the underside. The two narrow-side and the upper and / or lower-side antenna section thus form two angles, in the peaks of which higher currents can flow, whereby the conductivity of the antenna section as a whole is increased even further.

Gemäß der Erfindung erstreckt sich der an der Schmalseite angeordnete Antennenabschnitt durch die Leiterplatte hindurch und verbindet einen auf der Oberseite der Leiterplatte angeordneten Antennenabschnitt mit einem auf der Unterseite der Leiterplatte angeordneten Antennenabschnitt. Durch diese Anordnung werden ebenfalls zwei Antennenabschnittwinkel gebildet, in deren Scheiteln höhere Ströme fließen können und die zu einem erhöhten Antennenwirkungsgrad beitragen.According to the invention, the antenna section arranged on the narrow side extends through the printed circuit board and connects an antenna section arranged on the upper side of the printed circuit board to an antenna section arranged on the lower side of the printed circuit board. By virtue of this arrangement, two antenna section angles are also formed, in the peaks of which higher currents can flow and which contribute to increased antenna efficiency.

Gemäß der Erfindung sind ein oberseitiger und ein unterseitiger Antennenabschnitt durch zwei gegenüberliegende schmalseitige Antennenabschnitte miteinander verbunden. Auf diese Weise werden vier Antennenabschnittwinkel gebildet und ein noch höherer Stromfluss und Antennenwirkungsgrad erreicht.According to the invention, an upper-side and a lower-side antenna section are interconnected by two opposite narrow-side antenna sections. In this way, four antenna section angles are formed and an even higher current flow and antenna efficiency are achieved.

Gemäß einer weiteren Ausführungsform ist vorgesehen, dass der an der Schmalseite angeordnete Antennenabschnitt eine Unterbrechung eines auf der Oberseite oder auf der Unterseite der Leiterplatte verlaufenden ersten Antennenabschnitts elektrisch überbrückt. Dabei kann der schmalseitige Antennenabschnitt den ersten Antennenabschnitt zusätzlich mit einem zweiten, auf der Unter- beziehungsweise Oberseite verlaufenden Antennenabschnitt verbinden.According to a further embodiment, it is provided that the antenna section arranged on the narrow side interrupts one of the top side and bottom side of the printed circuit board first antenna section electrically bridged. In this case, the narrow-side antenna section additionally connect the first antenna section to a second antenna section extending on the lower or upper side.

Eine Unterbrechung des Antennenabschnitts der Ober- oder Unterseite der Leiterplatte kann dazu dienen, andere auf der Ober- oder Unterseite der Leiterplatte angebrachte Schaltungsteile aufzunehmen, wie beispielsweise eine durch die Unterbrechung hindurch verlaufende Leiterbahn zur Verbindung verschiedener Schaltungsteile oder Bauelemente.An interruption of the antenna portion of the top or bottom of the circuit board may serve to accommodate other circuit parts mounted on the top or bottom of the circuit board, such as an interconnect passing through the interruption to interconnect various circuit parts or components.

So kann die Leiterplatte außer der Antenne noch weitere Schaltungsteile tragen, die z.B. in gemeinsamen Prozessschritten mit der Antenne hergestellt werden, beispielsweise Verbindungsleitungen und Anschlussflächen für weitere auf der Leiterplatte angeordnete Schaltungsteile.Thus, in addition to the antenna, the circuit board may carry other circuit parts, e.g. be made in common process steps with the antenna, for example, connecting lines and pads for more arranged on the circuit board circuit parts.

Auf der Ober- und/oder Unterseite der Leiterplatte angeordnete Antennenabschnitte können in diesem Fall in einem gemeinsamen Prozessschritt mit den weiteren Schaltungsteilen, wie z.B. Verbindungsleitungen und Anschlussflächen, gebildet werden.In this case, antenna sections arranged on the top and / or bottom side of the printed circuit board can be connected in a common process step with the further circuit parts, such as e.g. Connecting lines and pads are formed.

Solche weiteren Schaltungsteile können z.B. zu einer Ansteuerungsschaltung, welche die auf der Leiterplatte angebrachte Antenne mit einem Ansteuerungssignal beaufschlagt, oder, im Fall einer Empfangsantenne, einer Empfangs- und Auswerteschaltung gehören. Im Fall einer Sendeantenne wird die Antenne bevorzugt mit Frequenzen im Bereich zwischen 300 und 1000 MHz angesteuert.Such further circuit parts may, for example, belong to a drive circuit which applies a drive signal to the antenna mounted on the printed circuit board or, in the case of a receive antenna, to a receive and evaluate circuit. In the case of a transmitting antenna, the antenna is preferably driven with frequencies in the range between 300 and 1000 MHz.

Weiterer Gegenstand der Erfindung ist ein Verfahren mit den Merkmalen des Anspruchs 3. Das erfindungsgemäße Verfahren kann insbesondere zur Herstellung einer Antennenanordnung der voranstehend beschriebenen Art dienen. Die vorstehend erläuterten Vorteile gelten somit entsprechend.Another object of the invention is a method having the features of claim 3. The inventive method may in particular for producing an antenna arrangement of the type described above. The advantages explained above thus apply accordingly.

Bei dem erfindungsgemäßen Verfahren wird zur Bildung wenigstens eines Antennenabschnitts ein elektrisch leitfähiges Material an einer Schmalseite der Leiterplatte angebracht, welche an die Oberseite und/oder die Unterseite der Leiterplatte angrenzt.In the method according to the invention, to form at least one antenna section, an electrically conductive material is attached to a narrow side of the printed circuit board which adjoins the upper side and / or the underside of the printed circuit board.

Gemäß der Erfindung wird die Schmalseite der Leiterplatte durch Entfernen von Leiterplattenmaterial erzeugt, insbesondere durch die Bildung eines, insbesondere langgestreckten, Loches in der Leiterplatte, beispielsweise durch einen Bohr- oder Fräsprozess. Bohr- und Fräsprozesse für Leiterplatten sind an sich bekannt und können in einfacher Weise mit verfügbaren Werkzeugen und Maschinen bewerkstelligt werden. Vorteilhafterweise werden in der Leiterplatte mehrere Löcher entlang der gewünschten Antennenleiterbahn für mehrere schmalseitige Antennenabschnitte erzeugt. Bekannte Bohr- oder Fräsmaschinen können eine solche Vielzahl von Löchern mit hoher Präzision und in hoher Geschwindigkeit anhand eines elektronischen Layouts, beispielsweise eines CAD-Layouts, erzeugen.According to the invention, the narrow side of the circuit board is produced by removing printed circuit board material, in particular by forming a, in particular elongated, hole in the circuit board, for example by a drilling or milling process. Drilling and milling processes for printed circuit boards are known per se and can be accomplished in a simple manner with available tools and machines. Advantageously, a plurality of holes are produced in the circuit board along the desired antenna track for a plurality of narrow-side antenna sections. Known drilling or milling machines can produce such a variety of holes with high precision and high speed using an electronic layout, such as a CAD layout.

Besonders bevorzugt ist es, wenn das Entfernen von Leiterplattenmaterial zur Erzeugung der Schmalseite in einem gemeinsamen Prozessschritt mit der Bildung von Löchern für Durchverbindungen zwischen Schaltungsteilen auf der Oberseite und Schaltungsteilen auf der Unterseite der Leiterplatte, so genannte Vias, erfolgt.It is particularly preferred if the removal of printed circuit board material for generating the narrow side takes place in a common process step with the formation of holes for through connections between circuit parts on the upper side and circuit parts on the underside of the printed circuit board, so-called vias.

Durch die gemeinsame Erzeugung von Via-Löchern und Schmalseite(n) wird der Herstellungsprozess für die Antennenanordnung vereinfacht, indem kein separater Prozessschritt zum Entfernen von Leiterplattenmaterial zur Erzeugung der Schmalseite(n) durchgeführt zu werden braucht. Die Via-Löcher und die Schmalseite(n) können somit insbesondere in ein und derselben Werkzeugmaschine hergestellt werden, ohne dass die Leiterplatte zwischenzeitlich aus dem Arbeitsbereich der Maschine entfernt werden muss. Der Layoutdatei für das Erzeugen der Via-Löcher können hierzu einfach die geometrischen Daten für das Bohren und/oder Fräsen zur Erzeugung der Schmalseite(n) hinzugefügt werden.The co-generation of via holes and narrow side (s) simplifies the manufacturing process for the antenna assembly by not requiring a separate process step for removing printed circuit board material to produce the narrow side (s). The via holes and the narrow side (s) can thus be produced in particular in one and the same machine tool, without the circuit board having to be temporarily removed from the working area of the machine. The layout file for creating the via holes can be simply added to the geometric data for drilling and / or milling to create the narrow side (s).

Gemäß einer vorteilhaften Ausführungsform wird das elektrisch leitfähige Material durch einen Abscheidungsprozess an der Schmalseite angebracht, insbesondere mittels eines galvanischen Verfahrens. Durch galvanische Abscheidungsprozesse können Schichten von elektrisch leitfähigem Material an einer Schmalseite erzeugt werden, die eine hohe Güte, eine hohe elektrische Leitfähigkeit und gute Adhäsion an dem Leiterplattenmaterial aufweisen. Bevorzugt wird Kupfer und/oder Gold abgeschieden und besonders bevorzugt wird eine Schicht mit zumindest näherungsweise konstanter Dicke abgeschieden, welche zum Beispiel zwischen 30 und 100 µm betragen kann.According to an advantageous embodiment, the electrically conductive material is attached by a deposition process on the narrow side, in particular by means of a galvanic process. Electrodeposition processes can be used to produce layers of electrically conductive material on a narrow side which have high quality, high electrical conductivity and good adhesion to the printed circuit board material. Preferably, copper and / or gold is deposited and more preferably a layer is deposited with at least approximately constant thickness, which may be, for example, between 30 and 100 microns.

Besonders bevorzugt ist es, wenn die Schmalseiten und die Seitenwände, welche die Via-Löcher begrenzen, gleichzeitig in einem gemeinsamen Abscheidungsprozess mit elektrisch leitfähigem Material beschichtet werden, da hierdurch kein separater Abscheidungsprozess für das Erzeugen der Antennenabschnitte an den Schmalseiten erforderlich ist.It is particularly preferred if the narrow sides and the side walls delimiting the via holes are simultaneously coated with electrically conductive material in a common deposition process, since this does not require a separate deposition process for generating the antenna sections on the narrow sides.

Bevorzugt wird an den Schmalseiten angebrachtes elektrisch leitfähiges Material und/oder daran angrenzendes Leiterplattenmaterial anschließend bereichsweise entfernt, zum Beispiel durch einen Fräsprozess.Preferably, electrically conductive material attached to the narrow sides and / or adjacent circuit board material is subsequently removed in regions, for example by a milling process.

Auf diese Weise lässt sich nicht benötigtes elektrisch leitfähiges Material beseitigen, z.B. elektrisch leitfähiges Material, welches dem Antennenabschnitt abgewandt ist, beziehungsweise das Gewicht und der Platzbedarf der Leiterplatte reduzieren. Außerdem lassen sich durch die Entfernung von Leiterplattenmaterial dielektrische Verluste reduzieren.In this way, unneeded electrically conductive material can be removed, e.g. electrically conductive material, which faces away from the antenna section, or reduce the weight and space requirement of the circuit board. In addition, the removal of printed circuit board material can reduce dielectric losses.

Gemäß der Erfindung kann die Schmalseite durch die Bildung eines Loches in der Leiterplatte erzeugt und nach der Metallisierung der Schmalseite Leiterplattenmaterial entfernt werden, welches sich zwischen dem Loch und einer Außenseite der Leiterplatte erstreckt, sodass die Schmalseite selbst zur Außenseite der Leiterplatte wird. Es wird also die Außenkontur der Leiterplatte durch Zuschneiden verkleinert, bis die Schmalseite zur Außenseite der Leiterplatte wird. Dieses Zuschneiden der Leiterplatte hin zur Schmalseite reduziert den Platzbedarf der Leiterplatte und die auftretenden dielektrischen Verluste. Da sich der schmalseitige Antennenabschnitt zumindest bereichsweise entlang der Außenkontur der Leiterplatte erstreckt, wird bei vorgegebener Baugröße außerdem eine maximale Antennenlänge beziehungsweise ein maximaler Antennendurchmesser erreicht. Nachfolgend wird die vorliegende Erfindung rein beispielhaft anhand einer vorteilhaften Ausführungsform unter Bezugnahme auf die beigefügten Zeichnungen beschrieben. Es zeigen:

Fig. 1a
eine Leiterplattenanordnung nach dem Bohren von Via-Löchern;
Fig. 1b
eine Querschnittsansicht entlang der Linie A-A' von Fig. 1 a;
Fig. 2a
die Anordnung von Fig. 1 nach dem Fräsen von Lang-löchern;
Fig. 2b
eine Querschnittsansicht entlang der Linie A-A' von Fig. 2a;
Fig. 3a
die Anordnung von Fig. 2 nach dem Beschichten der Löcher mit leitfähigem Material;
Fig. 3b
eine Querschnittsansicht entlang der Linie A-A' von Fig. 3a;
Fig. 4a
die Anordnung von Fig. 3 nach dem Strukturieren von Leiterbahnen;
Fig. 4b
eine Querschnittsansicht entlang der Linie A-A' von Fig. 4a;
Fig. 4c
eine Rückseitenansicht der Anordnung von Fig. 4a;
Fig. 5
eine Zuschneidetrajektorie, entlang der die Leiterplattenanordnung von Fig. 4 zugeschnitten wird;
Fig. 6a
eine erfindungsgemäße Antennenanordnung, die durch das Verfahren von Fig. 1-5 hergestellt worden ist;
Fig. 6b
eine Querschnittsansicht der Antennenanordnung von Fig. 6a entlang der Linie A-A' von Fig. 6a.
According to the invention, the narrow side can be created by forming a hole in the circuit board and removed after metallization of the narrow side circuit board material extending between the hole and an outside of the circuit board so that the narrow side itself becomes the outside of the circuit board. Thus, the outer contour of the printed circuit board is reduced by cutting until the narrow side becomes the outer side of the printed circuit board. This cutting of the printed circuit board towards the narrow side reduces the space requirement of the printed circuit board and the occurring dielectric losses. Since the narrow-side antenna section extends at least partially along the outer contour of the printed circuit board, a maximum antenna length or a maximum antenna diameter is also achieved for a given size. Hereinafter, the present invention will be described purely by way of example with reference to an advantageous embodiment with reference to the accompanying drawings. Show it:
Fig. 1a
a printed circuit board assembly after drilling via holes;
Fig. 1b
a cross-sectional view along the line AA 'of Fig. 1 a;
Fig. 2a
the arrangement of Fig. 1 after milling long holes;
Fig. 2b
a cross-sectional view along the line AA 'of Fig. 2a ;
Fig. 3a
the arrangement of Fig. 2 after coating the holes with conductive material;
Fig. 3b
a cross-sectional view along the line AA 'of Fig. 3a ;
Fig. 4a
the arrangement of Fig. 3 after structuring of printed conductors;
Fig. 4b
a cross-sectional view along the line AA 'of Fig. 4a ;
Fig. 4c
a rear view of the arrangement of Fig. 4a ;
Fig. 5
a cutting trajectory along which the printed circuit board assembly of Fig. 4 is tailored;
Fig. 6a
an antenna arrangement according to the invention, by the method of Fig. 1-5 has been prepared;
Fig. 6b
a cross-sectional view of the antenna assembly of Fig. 6a along the line AA 'of Fig. 6a ,

Fig. 1 bis 6 zeigen eine erfindungsgemäße Antennenanordnung in unterschiedlichen Stadien ihrer Herstellung. Fig. 1 to 6 show an antenna arrangement according to the invention in different stages of their production.

Fig. 1a zeigt eine Draufsicht auf die Oberseite einer Leiterplatte 10, die eine Ober- und eine Unterseite umfasst, auf denen jeweils eine Kupferschicht 14 aufgebracht wurde. Fig. 1a zeigt Löcher 12 für Durchverbindungen 22 (Vias, siehe Fig. 3 bis 6) zwischen Schaltungsteilen auf der Oberseite und Schaltungsteilen auf der Unterseite der Leiterplatte 10. Die Via-Löcher 12 können z.B. durch einen Bohr- oder Fräsprozess hergestellt werden. Seitenwände 11 der Leiterplatte 10 begrenzen die Via-Löcher 12. Fig. 1a shows a plan view of the top of a circuit board 10, which comprises an upper and a lower side, on each of which a copper layer 14 has been applied. Fig. 1a shows holes 12 for through-connections 22 (vias, see Fig. 3 to 6 ) between circuit parts on the upper side and circuit parts on the underside of the printed circuit board 10. The via holes 12 can be produced, for example, by a drilling or milling process. Side walls 11 of the printed circuit board 10 delimit the via holes 12.

Fig. 1b zeigt die Leiterplatte 10 von Fig. 1a in einem Querschnitt entlang der Linie A-A' von Fig. 1a. Neben einem Via-Loch 12 sind auch die Kupferschichten 14, 14' erkennbar, die auf der Oberseite und der Unterseite der Leiterplatte 10 jeweils aufgebracht sind. In Fig. 1b und auch in den übrigen Querschnittsdarstellungen ist die Dicke s der Kupferschichten 14, 14' im Vergleich zu der Dicke d der Leiterplatte 10 übertrieben groß dargestellt. Die Dicke d der Leiterplatte 10 kann beispielsweise ca. 1,5 mm und die Dicke s der Kupferschichten 14, 14'jeweils ca. 50 µm betragen. Fig. 1b shows the circuit board 10 of Fig. 1a in a cross section along the line AA 'of Fig. 1a , In addition to a via hole 12, the copper layers 14, 14 'can be seen, which are respectively applied to the top side and the bottom side of the printed circuit board 10. In Fig. 1b and also in the other cross-sectional views, the thickness s of the copper layers 14, 14 'compared to the thickness d of the printed circuit board 10 is exaggerated. The thickness d of the printed circuit board 10 may for example be about 1.5 mm and the thickness s of the copper layers 14, 14 'each about 50 microns.

Fig. 2a zeigt die Leiterplatte 10 von Fig. 1, nachdem Langlöcher 16 in der Leiterplatte 10 erzeugt wurden. Die Langlöcher 16 verlaufen entlang gewünschter Antennenleiterbahnen und werden jeweils umlaufend durch eine Schmalseite 18 der Leiterplatte 10 begrenzt. Abschnittsweise verlaufen jeweils zwei Langlöcher 16 parallel zueinander auf gegenüberliegenden Seiten einer Antennenleiterbahn, sodass durch zwei benachbarte Langlöcher 16 jeweils ein langgestreckter freitragender Steg 19 der Leiterplatte 10 begrenzt wird, der einen ober- und unterseitigen Antennenabschnitt 24, 24' tragen kann. Fig. 2a shows the circuit board 10 of Fig. 1 after slots 16 have been created in the circuit board 10. The elongated holes 16 extend along desired antenna conductor tracks and are bounded in each case circumferentially by a narrow side 18 of the printed circuit board 10. In each case, two elongated holes 16 run parallel to one another on opposite sides of an antenna conductor track, so that an elongate cantilevered web 19 of the printed circuit board is formed by two adjacent oblong holes 16 10 is limited, which can wear a top and bottom antenna section 24, 24 '.

Im vorliegenden Ausführungsbeispiel werden die Langlöcher 16 durch einen Fräsprozess erzeugt. Die Langlöcher 16 werden senkrecht zu der Ober- und Unterseite der Leiterplatte 10 gefräst, sodass die die Langlöcher 16 begrenzenden Schmalseiten 18 und die Ober- beziehungsweise Unterseite der Leiterplatte 10 einen im Wesentlichen rechten Winkel bilden. Der Bohrprozess für die Via-Löcher 12 und der Fräsprozess für die Langlöcher 16 können in einem gemeinsamen Prozessschritt in derselben Maschine durchgeführt werden.In the present embodiment, the slots 16 are produced by a milling process. The elongated holes 16 are milled perpendicular to the top and bottom of the circuit board 10, so that the elongated holes 16 defining narrow sides 18 and the top or bottom of the circuit board 10 form a substantially right angle. The drilling process for the via holes 12 and the milling process for the elongated holes 16 can be performed in a common process step in the same machine.

Nach der Erzeugung der Via-Löcher 12 und der Langlöcher 16 werden die Seitenwände 11 der Via-Löcher 12 und die durch die Langlöcher 16 definierten Schmalseiten 18 durch einen Abscheidungsprozess mit einem leitfähigen Material, im vorliegenden Ausführungsbeispiel mit Kupfer, beschichtet.After the formation of the via holes 12 and the elongated holes 16, the side walls 11 of the via holes 12 and the narrow sides 18 defined by the elongated holes 16 are coated by a deposition process with a conductive material, in the present embodiment with copper.

Fig. 3a zeigt eine Draufsicht auf die Anordnung von Fig. 2a nach der Abscheidung, welche in an sich bekannter Weise durch Galvanisierung in einem Galvanikbad erfolgen kann. Die Dicke des abgeschiedenen Kupfermaterials kann z.B. mehrere 10 µm betragen. Fig. 3a shows a plan view of the arrangement of Fig. 2a after the deposition, which can be done in a conventional manner by galvanization in a galvanic bath. The thickness of the deposited copper material may be several tens of microns, for example.

Das an den Schmalseiten 18 abgeschiedene Kupfermaterial bildet zum einen schmalseitige Antennenabschnitte 20 und zum anderen unerwünschtes beziehungsweise nicht benötigtes Kupfermaterial 20', nämlich in den Bereichen der die Langlöcher 16 begrenzenden Schmalseiten 18, die dem gewünschten schmalseitigen Antennenabschnitt 20 abgewandt sind. Außerdem bildet das in den Via-Löchern 12 abgeschiedene Kupfer die Durchverbindungen 22 (Vias).The deposited on the narrow sides 18 copper material forms on the one hand narrow-side antenna sections 20 and the other unwanted or unneeded copper material 20 ', namely in the areas of the slots 16 delimiting narrow sides 18 which are remote from the desired narrow-side antenna section 20. In addition, the deposited in the via holes 12 copper forms the through-connections 22 (vias).

Fig. 3b zeigt, dass der Querschnitt eines frei tragenden Leiterplattenstegs 19 ringsum von leitfähigem Material umgeben ist, nämlich von den Kupferschichten 14, 14'und den schmalseitigen Antennenabschnitten 20. Das den frei tragenden Steg 19 umgebende leitfähige Material 14, 14', 20 bildet durch seine Geometrie einen Antennenstrompfad mit erhöhter Leitfähigkeit. Fig. 3b shows that the cross section of a free-carrying printed circuit board web 19 is surrounded by conductive material all around, namely the copper layers 14, 14 'and the narrow-side antenna sections 20. The conductive material 14, 14', 20 surrounding the free-standing web 19 forms by its geometry an antenna current path with increased conductivity.

Nach der Abscheidung des leitfähigen Materials werden die Kupferschicht 14 auf der Oberseite und die Kupferschicht 14' auf der Unterseite der Leiterplatte 10 in geeigneter Weise strukturiert, z.B durch einen an sich bekannten Ätzprozess, um auf der Oberseite und der Unterseite der Leiterplatte 10 elektrisch leitfähige Antennenabschnitte 24, 24' sowie elektrische Verbindungsleitungen 28 und elektrische Anschlussflächen 26 für zusätzlich zu der Antenne auf der Leiterplatte 10 herzustellende Schaltungsteile zu schaffen (Fig. 4).After the deposition of the conductive material, the copper layer 14 on the upper side and the copper layer 14 'on the underside of the printed circuit board 10 are patterned in a suitable manner, for example by an etching process known per se, on the upper side and the lower side of the printed circuit board 10 electrically conductive antenna sections 24, 24 'as well as electrical connection lines 28 and electrical pads 26 for in addition to the antenna on the circuit board 10 to produce circuit parts ( Fig. 4 ).

Fig. 4a, b, c zeigen die Leiterplatte 10 nach dem Strukturieren der Kupferschichten 14, 14'. Zur besseren Orientierung ist die Ansicht auf die Unterseite der Leiterplatte 10 in Fig. 4c aus der Perspektive von oben, also von der Oberseite her durch die Leiterplatte 10 hindurch betrachtet, dargestellt, sodass vereinfacht erkennbar ist, welche Elemente auf der Oberseite der Leiterplatte 10 welchen Elementen auf der Unterseite der Leiterplatte 10 gegenüberliegen, ohne dass der Betrachter die spiegelverkehrte Perspektive berücksichtigen muss, die sich ergibt, wenn man die Leiterplatte 10 einmal von oben und einmal von unten betrachtet. Fig. 4a, b . c show the printed circuit board 10 after patterning the copper layers 14, 14 '. For better orientation, the view on the underside of the circuit board 10 in Fig. 4c from the perspective of the top, so viewed from the top through the circuit board 10 through, shown so that it is easy to see which elements on the top of the circuit board 10 which elements on the underside of the circuit board 10 are opposite, without the viewer the mirror-inverted perspective must take into account, which arises when looking at the circuit board 10 once from above and once from below.

Wie Fig. 4a zeigt, ist auf der Oberseite der Leiterplatte 10 ein annähernd ringförmiger Antennenabschnitt 24 ausgebildet, der bereichsweise entlang den Schmalseiten 18 der Langlöcher 16 verläuft und dabei mit dem an den Schmalseiten 18 abgeschiedenen leitfähigem Material der schmalseitigen Antennenabschnitte 20 in elektrischem Kontakt steht. Dem Antennenabschnitt 24 gegenüberliegend auf der Unterseite der Leiterplatte 10 ist ein im Wesentlichen identisch ausgestalteter Antennenabschnitt 24' ausgebildet, der ebenfalls mit dem leitfähigen Material des schmalseitigen Antennenabschnitts 20 in Verbindung steht. Die beiden Antennenabschnitte 24, 24' auf der Ober- und der Unterseite sind wie in Fig. 4b gezeigt über die schmalseitigen Antennenabschnitte 20 miteinander verbunden.As Fig. 4a shows, on the upper side of the circuit board 10, an approximately annular antenna portion 24 is formed, which extends in regions along the narrow sides 18 of the slots 16 and thereby with the on the narrow sides 18 deposited conductive material of the narrow-side antenna sections 20 is in electrical contact. The antenna section 24 opposite on the underside of the printed circuit board 10, a substantially identical ausgestalteter antenna section 24 'is formed, which is also in communication with the conductive material of the narrow-side antenna portion 20. The two antenna sections 24, 24 'on the top and the bottom are as in Fig. 4b shown connected via the narrow-side antenna sections 20 with each other.

Die Antennenleiterbahnen 24, 24' auf der Ober- und Unterseite der Leiterplatte 10 bilden zusammen mit den schmalseitigen Antennenabschnitten 20 eine im Wesentlichen ringförmige Antenne, die insbesondere im Bereich der freitragenden Stege 19 eine erhöhte Leitfähigkeit durch das an den Schmalseiten 18 abgeschiedene leitfähige Material sowie verringerte dielektrische Verluste durch die Bildung der Langlöcher 16 in dem dielektrischen Material der Leiterplatte 10 aufweist.The antenna conductor tracks 24, 24 'on the upper and lower sides of the printed circuit board 10 together with the narrow-side antenna sections 20 form a substantially annular antenna which, in particular in the region of the cantilevered webs 19, increases the conductivity due to the conductive material deposited on the narrow sides 18 dielectric losses due to the formation of the elongated holes 16 in the dielectric material of the printed circuit board 10 has.

In Fig. 4a sind mehrere in dem Strukturierungsschritt erzeugte elektrische Anschlussflächen 26 sowie elektrische Verbindungsleitungen 28 dargestellt. Diese Anschlussflächen 26 und Verbindungsleitungen 28 erlauben es, elektronische Bauelemente zur Bildung einer Ansteuerungsschaltung zur Ansteuerung der Antenne auf der Leiterplatte 10 anzubringen. Die Antenne ist mit der Ansteuerungsschaltung über die Anschlussfläche 26a verbunden sowie über eine sich auf der Rückseite der Leiterplatte 10 befindende Anschlussfläche 26b, die der Schaltung als Bezugspotential dient.In Fig. 4a a plurality of electrical connection surfaces 26 produced in the structuring step and electrical connection lines 28 are shown. These pads 26 and connecting lines 28 allow to attach electronic components for forming a driving circuit for driving the antenna on the printed circuit board 10. The antenna is connected to the drive circuit via the connection surface 26a and via a connection surface 26b located on the back side of the circuit board 10, which serves as the reference potential for the circuit.

Zur Bildung der Ansteuerungsschaltung können in an sich bekannter Weise elektronische Bauelemente, beispielsweise SMD-Bauelemente, an den Anschlussflächen 26 angebracht und über die elektrischen Verbindungsleitungen 28 miteinander verschaltet werden. Wie Fig. 4a, b und c zeigen, werden hierbei Schaltungsteile auf der Oberseite der Leiterplatte 10 durch die vor dem Strukturierungsprozess hergestellten Durchverbindungen 22 miteinander verbunden. Die Montage der Bauelemente zur Bildung der Ansteuerungsschaltung kann vor oder nach einem auf den Strukturierungsschritt folgenden Zuschneideschritt oder auch zwischen zwei Teilschritten des Zuschneideschritts erfolgen. Der Zuschneideschritt wird im Folgenden erläutert.To form the drive circuit, electronic components, for example SMD components, can be used in a manner known per se attached to the pads 26 and interconnected via the electrical connection lines 28. As Fig. 4a, b and c In this case, circuit parts on the upper side of the printed circuit board 10 are connected to one another by the interconnections 22 produced before the patterning process. The assembly of the components for forming the drive circuit can be carried out before or after a trimming step following the structuring step or also between two sub-steps of the trimming step. The trimming step is explained below.

Nach der Strukturierung wird die Leiterplatte 10 auf die gewünschte Größe der Antennenanordnung zugeschnitten. Fig. 5 zeigt schematisch die Schneidelinien 30a, b, entlang derer die Leiterplatte 10 zugeschnitten wird. Durch die Schneidelinie 30a wird die Außenkontur der Leiterplatte 10 so definiert, dass die der Schneidelinie 30a benachbarten schmalseitigen Antennenabschnitte 20 der außen gelegenen Langlöcher 16 nunmehr Außenseiten der Leiterplatte 10 bilden und Bereiche der Antennenabschnitte 24, 24' auf der Ober- und Unterseite direkt an die Außenseite der Leiterplatte 10 angrenzen. Nicht benötigtes elektrisch leitfähiges Material 20' und überflüssiges Leiterplattenmaterial wird hierbei entfernt.After patterning, the printed circuit board 10 is cut to the desired size of the antenna array. Fig. 5 schematically shows the cutting lines 30a, b, along which the circuit board 10 is cut. By the cutting line 30a, the outer contour of the circuit board 10 is defined so that the cutting line 30a adjacent narrow-side antenna portions 20 of the outer slots 16 now form the outer sides of the circuit board 10 and portions of the antenna sections 24, 24 'on the top and bottom directly to the Outside of the circuit board 10 adjacent. Unnecessary electrically conductive material 20 'and unnecessary printed circuit board material is removed in this case.

Anstatt die Außenkontur der Leiterplatte 10 ringsum, also nach einer geschlossenen Schneidelinie wie der Schneidelinie 30a zuzuschneiden, kann die Außenkontur der Leiterplatte 10 auch dadurch zugeschnitten werden, dass Leiterplattenmaterial, das sich zwischen einem außen gelegenen Langloch 16 und einer Außenseite der Leiterplatte 10 erstreckt, durch zwei zwischen der Außenseite der Leiterplatte 10 und dem Langloch 16 geführte Schnitte herausgeschnitten wird. In diesem Fall kann die Leiterplatte 10 bevorzugt bereits vor der Strukturierung der Kupferschichten 14, 14' grob auf eine Außenkontur zugeschnitten werden, die etwas größer als ihr Endmaß ist, sodass dünne Stege der Leiterplatte 10 verbleiben, die sich zwischen den äußeren Langlöchern 16 und der Außenseite der Leiterplatte 10 erstrecken. Diese werden dann in einem weiteren, auf die Strukturierung folgenden Zuschneideschritt herausgeschnitten.Instead of cutting the outer contour of the printed circuit board 10 all around, ie after a closed cutting line such as the cutting line 30a, the outer contour of the printed circuit board 10 can also be cut by passing printed circuit board material extending between an outer slot 16 and an outer side of the printed circuit board 10 two cut out between the outside of the circuit board 10 and the slot 16 guided cuts. In this case, the printed circuit board 10 can preferably be roughly cut to an outer contour, which is something before the structuring of the copper layers 14, 14 ' greater than its gage, so that thin webs of the circuit board 10 remain, extending between the outer slots 16 and the outside of the circuit board 10. These are then cut out in a further trimming step following the structuring.

Durch die Schneidelinien 30b wird außerdem an den innen gelegenen Langlöchern 16 unerwünschtes abgeschiedenes elektrisch leitfähiges Material 20' entfernt. Hierbei wird gegebenenfalls auch um das unerwünschte elektrisch leitfähige Material 20' herum gelegenes Leiterplattenmaterial entfernt.In addition, unwanted deposited electrically conductive material 20 'is removed by the cutting lines 30b at the inner elongated holes 16. In this case, if necessary, printed circuit board material located around the unwanted electrically conductive material 20 'is also removed.

Fig. 6a und b zeigen die fertige Antennenanordnung nach dem Zuschneiden. Bei dieser Antennenanordnung ist die elektrische Leitfähigkeit der Antenne durch die schmalseitigen Antennenabschnitte 20 erhöht, und die dielektrischen Verluste sind durch das Entfernen von dielektrischem Material verringert. Durch die Verwendung äußerer Schmalseiten 18 der Leiterplatte 10 für schmalseitige Abschnitte 20 der Antenne wird außerdem ein maximaler Antennendurchmesser bei minimalem Platzbedarf der Antennenanordnung erreicht. Fig. 6a and b show the finished antenna assembly after cutting. In this antenna arrangement, the electrical conductivity of the antenna is increased by the narrow-side antenna sections 20, and the dielectric losses are reduced by the removal of dielectric material. By using outer narrow sides 18 of the printed circuit board 10 for narrow-side sections 20 of the antenna, moreover, a maximum antenna diameter is achieved with a minimum space requirement of the antenna arrangement.

BezugszeichenlisteLIST OF REFERENCE NUMBERS

1010
Leiterplattecircuit board
1111
SeitenwandSide wall
1212
Via-LochVia-hole
14, 14'14, 14 '
Kupferschichtcopper layer
1616
LanglochLong hole
1818
Schmalseitenarrow side
1919
freitragender Stegcantilevered bridge
2020
schmalseitiger Antennenabschnittnarrow-sided antenna section
20'20 '
nicht benötigtes elektrisch leitfähiges Materialunneeded electrically conductive material
2222
Durchverbindung (Via)Through connection (Via)
24, 24'24, 24 '
Antennenabschnittantenna section
26,a,b26, a, b
elektrische Anschlussflächeelectrical connection surface
2828
elektrische Verbindungsleitungelectrical connection line
30a,b30a, b
Schneideliniecutting line
ss
Dicke der KupferschichtThickness of the copper layer
dd
Dicke der LeiterplatteThickness of the printed circuit board

Claims (8)

  1. Antenna assembly with a printed circuit board (10) having an upper side and lower side, and an antenna (20, 24, 24') carried by the circuit board (10) which comprises at least one electrically conductive antenna section (20), characterized in that
    a first antenna section (20) is arranged on a first narrow side (18) of the circuit board (10) adjoining the upper side and/or the lower side, wherein the first narrow side (18) bounds a hole (16) of the circuit board (10) and the first antenna section (20) is arranged only in a portion of the narrow side (18) bounding the hole (16) without forming a closed ring in the plane of the circuit board (10) within the hole (16),
    the first narrow side (18) is formed by a cantilevered section (19) of the circuit board (10) which comprises a second narrow side (18) opposite the first narrow side (18) forming an outside of the circuit board (10), wherein a second antenna section (20) is arranged at the second narrow side (18), and
    the first antenna section (20) and the second antenna section (20), together with antenna sections (24, 24') arranged on the upper side and lower side of the cantilevered section (19), form an annular antenna transverse to the plane of the circuit board.
  2. Antenna assembly according to claim 1,
    characterized in that
    the first narrow side (18) bounds an elongated hole (16) of the circuit board (10).
  3. A method for manufacturing an antenna assembly with a printed circuit board (10) having an upper side and lower side, and an antenna (20, 24, 24') carried by the circuit board (10), in which method an electrically conductive material is provided at narrow sides (18) of the circuit board (10) adjoining the upper side and/or the lower side for forming of antenna sections (20), wherein the narrow sides (18) of the circuit board (10) are created by removing circuit board material by forming holes (16) in the circuit board (10) by means of a drilling or milling operation,
    characterized in that
    the method is performed so that
    a first antenna section (20) of the manufactured antenna assembly is arranged only at a portion of the narrow side (18) bounding a first hole (16) without forming a closed ring in the plane of the circuit board (10) within the first hole (16),
    a second antenna section (20) is arranged at a second narrow side (18) of the circuit board (10) opposite the first narrow side (18), wherein the second narrow side (18) bounds a second hole (16) of the circuit board (10),
    following the attachment of the electrically conductive material at the first and second narrow side (18) material of the circuit board is removed in some areas, which extends between the second hole (16) and an outside of the circuit board (10) so that the second narrow side (18) itself becomes the outside of the circuit board (10).
  4. The method according to claim 3,
    characterized in that
    the first hole and/or the second hole (16) are/is an elongated hole (16).
  5. The method according to claim 3 or 4,
    characterized in that
    the removal of circuit board material for forming the narrow sides (18) is carried out in a common process step with formation of holes (12) for through-connections (22) between circuit parts (26, 28) on the upper side and the lower side of the circuit board (10).
  6. A method according to any of the claims 3 to 5,
    characterized in that
    the electrically conductive material is applied on the narrow sides (18) by a deposition process in particular by means of a galvanic process.
  7. A method according to claim 6,
    characterized in that
    in the deposition process at the same time the narrow sides (18) and the side walls (11), which bound holes (12) for through-connections (22) between circuit parts (26, 28) on the upper side and the lower side of the circuit board (10), are coated with electrically conductive material.
  8. A method according to any of the claims 3 to 7,
    characterized in that
    electrically conductive material applied on a narrow side (18) and/or adjoining circuit board material is removed in some areas, in particular by a milling process.
EP09011000.8A 2009-08-27 2009-08-27 Antenna assembly Active EP2293381B1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
EP09011000.8A EP2293381B1 (en) 2009-08-27 2009-08-27 Antenna assembly
US12/868,113 US20110050506A1 (en) 2009-08-27 2010-08-25 Antenna arrangement
CN201010267410.4A CN102005642B (en) 2009-08-27 2010-08-27 Antenna assembly

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP09011000.8A EP2293381B1 (en) 2009-08-27 2009-08-27 Antenna assembly

Publications (2)

Publication Number Publication Date
EP2293381A1 EP2293381A1 (en) 2011-03-09
EP2293381B1 true EP2293381B1 (en) 2016-11-09

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Family Applications (1)

Application Number Title Priority Date Filing Date
EP09011000.8A Active EP2293381B1 (en) 2009-08-27 2009-08-27 Antenna assembly

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Country Link
US (1) US20110050506A1 (en)
EP (1) EP2293381B1 (en)
CN (1) CN102005642B (en)

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Publication number Priority date Publication date Assignee Title
DE102016108868A1 (en) * 2016-05-13 2017-11-16 Kathrein Werke Kg Adapter plate for HF structures
FR3118836B1 (en) * 2021-01-11 2024-03-29 Hager Controls Antenna device on printed circuit and method for producing antenna(s) on printed circuit(s)

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US20050252683A1 (en) * 2004-05-11 2005-11-17 Chi-Hsing Hsu Circuit substrate and method of manufacturing plated through slot thereon

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GB2357905B (en) 1999-12-01 2004-02-11 Hi Key Ltd A radio receiver
US6759984B2 (en) 2001-06-01 2004-07-06 Agere Systems Inc. Low-loss printed circuit board antenna structure and method of manufacture thereof
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WO1999033139A2 (en) * 1997-12-19 1999-07-01 Allgon Ab Directional coupler for high power rf signals
US20050252683A1 (en) * 2004-05-11 2005-11-17 Chi-Hsing Hsu Circuit substrate and method of manufacturing plated through slot thereon

Also Published As

Publication number Publication date
CN102005642B (en) 2016-05-18
US20110050506A1 (en) 2011-03-03
CN102005642A (en) 2011-04-06
EP2293381A1 (en) 2011-03-09

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