EP2293381A1 - Antenna assembly - Google Patents
Antenna assembly Download PDFInfo
- Publication number
- EP2293381A1 EP2293381A1 EP09011000A EP09011000A EP2293381A1 EP 2293381 A1 EP2293381 A1 EP 2293381A1 EP 09011000 A EP09011000 A EP 09011000A EP 09011000 A EP09011000 A EP 09011000A EP 2293381 A1 EP2293381 A1 EP 2293381A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- circuit board
- antenna
- printed circuit
- narrow
- antenna section
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 claims abstract description 5
- 239000004020 conductor Substances 0.000 claims description 36
- 238000000034 method Methods 0.000 claims description 24
- 239000000463 material Substances 0.000 claims description 20
- 238000003801 milling Methods 0.000 claims description 13
- 238000005553 drilling Methods 0.000 claims description 8
- 238000005137 deposition process Methods 0.000 claims description 6
- 230000015572 biosynthetic process Effects 0.000 claims description 5
- 238000001465 metallisation Methods 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 18
- 229910052802 copper Inorganic materials 0.000 description 17
- 239000010949 copper Substances 0.000 description 17
- 238000005520 cutting process Methods 0.000 description 12
- 239000003989 dielectric material Substances 0.000 description 4
- 238000009966 trimming Methods 0.000 description 4
- 238000000059 patterning Methods 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 230000002500 effect on skin Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 230000005672 electromagnetic field Effects 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49016—Antenna or wave energy "plumbing" making
- Y10T29/49018—Antenna or wave energy "plumbing" making with other electrical component
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
Definitions
- the present invention relates to an antenna assembly comprising a printed circuit board and an antenna carried by the printed circuit board.
- Such antenna arrangements are basically known and are used, for example, as transmitting antennas in hand transmitters or electronic keys with which, for example, Motor vehicles can be locked and unlocked remotely or garage doors can be opened and closed.
- the known antenna arrangements prove to be disadvantageous in that they have a comparatively low antenna efficiency. That is, the useful transmission power radiated by the antenna is relatively small compared to the power consumption of the antenna required for this purpose.
- the present invention is therefore based on the object to provide an antenna arrangement of the type mentioned, which has an increased antenna efficiency.
- the antenna arrangement according to the invention comprises a printed circuit board which has an upper side and a lower side, and an antenna, in particular a ring antenna, which is supported by the printed circuit board and comprises at least one electrically conductive antenna section which is arranged on a narrow side of the printed circuit board which adjoins the upper side and / or lower side is.
- the efficiency of the antenna arrangement is impaired, in particular, by line losses in the line path of the antenna and by dielectric losses in the dielectric material of the circuit board.
- the reason for the problem of high line losses is not least the skin effect, which is particularly pronounced at frequencies suitable for the operation of the antenna arrangement.
- the skin effect refers to the phenomenon that an alternating current flowing inside a conductor increasingly counteracts eddy currents that are induced by the alternating current inside the conductor and thus reduce the net current flow, so that the current flow from the center of the conductor to the edge the head is relocated.
- essentially only the edge of the conductor contributes to the current conduction, and the effective resistance of the conductor increases.
- the power is not very efficient conducts, because the surface of the circuit board and thus also the conductor in this edge region usually have a high roughness and the current path is extended accordingly in this area.
- the printed circuit board carrying the antenna preferably consists entirely of electrically nonconductive, dielectric material.
- the circuit board may be laminated from a plurality of dielectric layers.
- the inventive construction of a conductive antenna section on a narrow side of the circuit board creates an electrical current path with good power line properties and thus reduces the line losses incurred by the antenna.
- An advantage of a narrow side mounted conductive antenna section here is that the antenna section itself does not take up space on the top or bottom. Thus, even with little space on the top and bottom of the circuit board, a relatively large electrically conductive antenna section can be realized and thus increased conductivity of the antenna can be achieved.
- a narrow-side antenna section is particularly advantageous if the antenna is an annular antenna and has a current path which extends at least substantially annularly in the plane of the printed circuit board.
- a narrow-side antenna section here has at least approximately the shape of a jacket segment, resulting in a particularly good Abstrahls characterizing leads and contributes to increased antenna efficiency.
- the antenna arrangement according to the invention thus has an improved antenna efficiency, which ultimately not only increases the antenna range, but also the energy consumption is reduced.
- the arranged on the narrow side conductive antenna portion preferably comprises a metallic material, in particular copper or gold.
- the conductive narrow-side antenna section is preferably a metallic layer, arranged on the narrow side, with a substantially constant thickness, which is, for example, several 10 ⁇ m.
- the narrow side of the printed circuit board adjoins the upper side and / or the lower side of the printed circuit board.
- the narrow side may extend substantially perpendicular to the top or bottom of the circuit board. It is preferable if the narrow side extends from the upper side to the lower side of the printed circuit board and thus thus through the printed circuit board. In this case, the narrow side provides a particularly large area for the arranged on the narrow side antenna section.
- the narrow side may delimit a hole of the printed circuit board extending through the printed circuit board, which is preferably elongate.
- the narrow side may form an outer side of the printed circuit board. If the narrow-side antenna section borders on a hole or an outer side of the printed circuit board, then there is less dielectric printed circuit board material in the direct vicinity of the narrow-side antenna section, whereby the dielectric losses of the electromagnetic field generated by a current flowing in the narrow-side antenna section are reduced.
- such narrow sides can be particularly easily formed, for example by holes are formed in the circuit board by a milling process or by the outer contour of the circuit board is cut by a milling process accordingly.
- the narrow-side antenna section does not form a closed electrically conductive ring. If the narrow side on which the antenna section is attached delimits a hole in the printed circuit board, the antenna section is preferably attached only to a partial region of the narrow side delimiting the hole, without forming a closed ring in the hole.
- Such a narrow-side antenna section can be produced in a simple manner by completely coating a narrow side delimiting a hole with electrically conductive material and subsequently removing unwanted electrically conductive material.
- the antenna section arranged on the narrow side is in accordance with a preferred embodiment with an antenna section running on the upper side and / or with one on the lower side extending antenna section connected.
- the narrow-side antenna section may be connected along its at least approximately entire length to the antenna section running on the upper or lower side.
- two narrow-side antenna sections are connected on opposite sides of an antenna section running on the top side or of an antenna section running on the underside.
- the two narrow-side and the upper and / or lower-side antenna section thus form two angles, in the peaks of which higher currents can flow, whereby the conductivity of the antenna section as a whole is increased even further.
- the antenna section arranged on the narrow side extends through the printed circuit board and connects an antenna section arranged on the upper side of the printed circuit board to an antenna section arranged on the lower side of the printed circuit board.
- an upper-side and a lower-side antenna section are interconnected by two opposite narrow-side antenna sections. In this way, four antenna section angles are formed and an even higher current flow and antenna efficiency are achieved.
- the antenna section arranged on the narrow side interrupts one of the top side and bottom side of the printed circuit board first antenna section electrically bridged.
- the narrow-side antenna section additionally connect the first antenna section to a second antenna section extending on the lower or upper side.
- An interruption of the antenna portion of the top or bottom of the circuit board may serve to accommodate other circuit parts mounted on the top or bottom of the circuit board, such as a circuit through the interruption to interconnect various circuit parts or components.
- the circuit board may carry other circuit parts, e.g. be made in common process steps with the antenna, for example, connecting lines and pads for more arranged on the circuit board circuit parts.
- antenna sections arranged on the top and / or bottom side of the printed circuit board can be connected in a common process step with the further circuit parts, such as e.g. Connecting lines and pads are formed.
- Such other circuit parts may e.g. to a drive circuit which applies a drive signal to the antenna mounted on the printed circuit board or, in the case of a receive antenna, to a receive and evaluate circuit.
- the antenna is preferably driven with frequencies in the range between 300 and 1000 MHz.
- Another object of the invention is a method having the features of claim 8.
- the inventive method can in particular for producing an antenna arrangement of the type described above. The advantages explained above thus apply accordingly.
- an electrically conductive material is applied to a narrow side of the printed circuit board which adjoins the upper side and / or the underside of the printed circuit board.
- the narrow side of the printed circuit board is produced by removing printed circuit board material, in particular by forming a, in particular elongated, hole in the printed circuit board, for example by a drilling or milling process. Drilling and milling processes for printed circuit boards are known per se and can be accomplished in a simple manner with available tools and machines.
- a plurality of holes are produced in the circuit board along the desired antenna track for a plurality of narrow-side antenna sections.
- Known drilling or milling machines can produce such a variety of holes with high precision and high speed using an electronic layout, such as a CAD layout.
- via holes and narrow side (s) simplifies the antenna array fabrication process by eliminating the need for a separate process step of removing printed circuit board material to create the narrow side (s).
- the via holes and the narrow side (s) can thus be produced in particular in one and the same machine tool, without the circuit board having to be temporarily removed from the working area of the machine.
- the layout file for creating the via holes can be simply added to the geometric data for drilling and / or milling to create the narrow side (s).
- the electrically conductive material is attached by a deposition process on the narrow side, in particular by means of a galvanic process.
- Electrodeposition processes can be used to produce layers of electrically conductive material on a narrow side which have high quality, high electrical conductivity and good adhesion to the printed circuit board material.
- copper and / or gold is deposited and more preferably a layer is deposited with at least approximately constant thickness, which may be, for example, between 30 and 100 microns.
- the narrow sides and the side walls delimiting the via holes are simultaneously coated with electrically conductive material in a common deposition process, since this does not require a separate deposition process for generating the antenna sections on the narrow sides.
- electrically conductive material attached to the narrow sides and / or adjacent circuit board material is subsequently removed in regions, for example by a milling process.
- unneeded electrically conductive material can be removed, e.g. electrically conductive material, which faces away from the antenna section, or reduce the weight and space requirement of the circuit board.
- removal of printed circuit board material can reduce dielectric losses.
- the narrow side may be created by forming a hole in the circuit board and removed after metallization of the narrow side circuit board material extending between the hole and an outside of the circuit board such that the narrow side itself becomes the outside of the circuit board.
- the outer contour of the printed circuit board is reduced by cutting until the narrow side becomes the outer side of the printed circuit board. This cutting of the printed circuit board towards the narrow side reduces the space requirement of the printed circuit board and the occurring dielectric losses. Since the narrow-side antenna section extends at least partially along the outer contour of the printed circuit board, a maximum antenna length or a maximum antenna diameter is also achieved for a given size.
- Fig. 1 to 6 show an antenna arrangement according to the invention in different stages of their production.
- Fig. 1a shows a plan view of the top of a circuit board 10, which comprises an upper and a lower side, on each of which a copper layer 14 has been applied.
- Fig. 1a shows holes 12 for through-connections 22 (vias) between circuit parts on the upper side and circuit parts on the underside of the printed circuit board 10.
- the via holes 12 can be produced, for example, by a drilling or milling process.
- Side walls 11 of the printed circuit board 10 delimit the via holes 12.
- Fig. 1b shows the circuit board 10 of Fig. 1a in a cross section along the line AA 'of Fig. 1a ,
- the copper layers 14, 14 ' can be seen, which are respectively applied to the top side and the bottom side of the printed circuit board 10.
- the thickness s of the copper layers 14, 14 'compared to the thickness d of the printed circuit board 10 is exaggerated.
- the thickness d of the printed circuit board 10 may for example be about 1.5 mm and the thickness s of the copper layers 14, 14 'each about 50 microns.
- Fig. 2a shows the circuit board 10 of Fig. 1 after slots 16 have been created in the circuit board 10.
- the elongated holes 16 extend along desired antenna conductor tracks and are bounded in each case circumferentially by a narrow side 18 of the printed circuit board 10.
- two elongated holes 16 run parallel to one another on opposite sides of an antenna conductor track, so that an elongate cantilevered web 19 of the printed circuit board is formed by two adjacent oblong holes 16 10 is limited, which can wear a top and bottom antenna section 24, 24 '.
- the slots 16 are produced by a milling process.
- the elongated holes 16 are milled perpendicular to the top and bottom of the circuit board 10, so that the elongated holes 16 defining narrow sides 18 and the top or bottom of the circuit board 10 form a substantially right angle.
- the drilling process for the via holes 12 and the milling process for the elongated holes 16 can be performed in a common process step in the same machine.
- the side walls 11 of the via holes 12 and the narrow sides 18 defined by the elongated holes 16 are coated by a deposition process with a conductive material, in the present embodiment with copper.
- Fig. 3a shows a plan view of the arrangement of Fig. 2a after the deposition, which can be done in a conventional manner by galvanization in a galvanic bath.
- the thickness of the deposited copper material may be several tens of microns, for example.
- the deposited on the narrow sides 18 copper material forms on the one hand narrow-side antenna sections 20 and the other unwanted or unneeded copper material 20 ', namely in the areas of the slots 16 delimiting narrow sides 18 which are remote from the desired narrow-side antenna section 20.
- the deposited in the via holes 12 copper forms the through-connections 22 (vias).
- Fig. 3b shows that the cross-section of a free-carrying printed circuit board web 19 is surrounded by conductive material all round, namely the copper layers 14, 14 'and the narrow-side antenna sections 20.
- the conductive material 14, 14', 20 surrounding the free-standing web 19 forms by its geometry an antenna current path with increased conductivity.
- the copper layer 14 on the upper side and the copper layer 14 'on the underside of the printed circuit board 10 are patterned in a suitable manner, for example by an etching process known per se, on the upper side and the lower side of the printed circuit board 10 electrically conductive antenna sections 24, 24 'as well as electrical connection lines 28 and electrical pads 26 for in addition to the antenna on the circuit board 10 to produce circuit parts ( Fig. 4 ).
- Fig. 4a, b, c show the printed circuit board 10 after patterning the copper layers 14, 14 '.
- Fig. 4a shows, on the upper side of the circuit board 10, an approximately annular antenna portion 24 is formed, which extends in regions along the narrow sides 18 of the slots 16 and thereby with the on the narrow sides 18 deposited conductive material of the narrow-side antenna sections 20 is in electrical contact.
- the two antenna sections 24, 24 'on the top and the bottom are as in Fig. 4b shown connected via the narrow-side antenna sections 20 with each other.
- the antenna conductor tracks 24, 24 'on the upper and lower sides of the printed circuit board 10 together with the narrow-side antenna sections 20 form a substantially annular antenna which, in particular in the region of the cantilevered webs 19, increases the conductivity due to the conductive material deposited on the narrow sides 18 dielectric losses due to the formation of the elongated holes 16 in the dielectric material of the printed circuit board 10 has.
- Fig. 4a a plurality of electrical connection surfaces 26 produced in the structuring step and electrical connection lines 28 are shown. These pads 26 and connecting lines 28 allow to attach electronic components for forming a driving circuit for driving the antenna on the printed circuit board 10.
- the antenna is connected to the drive circuit via the connection surface 26a and via a connection surface 26b located on the back side of the circuit board 10, which serves as the reference potential for the circuit.
- electronic components for example SMD components
- SMD components can be used in a manner known per se attached to the pads 26 and interconnected via the electrical connection lines 28.
- circuit parts on the upper side of the printed circuit board 10 are connected to one another by the interconnections 22 produced before the patterning process.
- the assembly of the components for forming the drive circuit can be carried out before or after a trimming step following the structuring step or also between two sub-steps of the trimming step. The trimming step is explained below.
- FIG. 5 schematically shows the cutting lines 30a, b, along which the circuit board 10 is cut.
- the cutting line 30a the outer contour of the circuit board 10 is defined so that the cutting line 30a adjacent narrow-side antenna portions 20 of the outer slots 16 now form the outer sides of the circuit board 10 and portions of the antenna sections 24, 24 'on the top and bottom directly to the Outside of the circuit board 10 adjacent. Unnecessary electrically conductive material 20 'and unnecessary printed circuit board material is removed in this case.
- the outer contour of the printed circuit board 10 can also be cut to size by allowing printed circuit board material extending between an outer slot 16 and an outer side of the printed circuit board 10 two cut out between the outside of the circuit board 10 and the slot 16 guided cuts.
- the printed circuit board 10 can preferably be roughly cut to an outer contour, which is something before the structuring of the copper layers 14, 14 ' greater than its gage, so that thin webs of the circuit board 10 remain, extending between the outer slots 16 and the outside of the circuit board 10. These are then cut out in a further trimming step following the structuring.
- Fig. 6a and b show the finished antenna assembly after cutting.
- the electrical conductivity of the antenna is increased by the narrow-side antenna sections 20, and the dielectric losses are reduced by the removal of dielectric material.
- outer narrow sides 18 of the printed circuit board 10 for narrow-side sections 20 of the antenna moreover, a maximum antenna diameter is achieved with a minimum space requirement of the antenna arrangement.
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- Details Of Aerials (AREA)
Abstract
Description
Die vorliegende Erfindung betrifft eine Antennenanordnung mit einer Leiterplatte und einer durch die Leiterplatte getragenen Antenne.The present invention relates to an antenna assembly comprising a printed circuit board and an antenna carried by the printed circuit board.
Derartige Antennenanordnungen sind grundsätzlich bekannt und kommen beispielsweise als Sendeantennen in Handsendern oder elektronischen Schlüsseln zum Einsatz, mit denen z.B. Kraftfahrzeuge ferngesteuert ver- und entriegelt oder Garagentore geöffnet und geschlossen werden können.Such antenna arrangements are basically known and are used, for example, as transmitting antennas in hand transmitters or electronic keys with which, for example, Motor vehicles can be locked and unlocked remotely or garage doors can be opened and closed.
Die bekannten Antennenanordnungen erweisen sich insofern als nachteilig, als sie einen vergleichsweise geringen Antennenwirkungsgrad aufweisen. Das heißt, die von der Antenne ausgestrahlte nutzbare Sendeleistung ist im Vergleich zu der dafür notwendigen Leistungsaufnahme der Antenne relativ gering.The known antenna arrangements prove to be disadvantageous in that they have a comparatively low antenna efficiency. That is, the useful transmission power radiated by the antenna is relatively small compared to the power consumption of the antenna required for this purpose.
Dies führt bei den bekannten Antennenanordnungen allgemein zu einer geringen Reichweite und zu einem hohen Energiebedarf der Antenne beziehungsweise zu einer entsprechend geringen Batterielaufzeit.In the case of the known antenna arrangements, this generally leads to a short range and to a high energy requirement of the antenna or to a correspondingly short battery life.
Der vorliegenden Erfindung liegt deshalb die Aufgabe zugrunde, eine Antennenanordnung der eingangs genannten Art zu schaffen, die einen erhöhten Antennenwirkungsgrad aufweist.The present invention is therefore based on the object to provide an antenna arrangement of the type mentioned, which has an increased antenna efficiency.
Zur Lösung dieser Aufgabe ist eine Antennenanordnung mit den Merkmalen des Anspruchs 1 vorgesehen.To solve this problem, an antenna arrangement with the features of claim 1 is provided.
Die erfindungsgemäße Antennenanordnung umfasst eine Leiterplatte, die eine Oberseite und eine Unterseite aufweist, sowie eine durch die Leiterplatte getragene Antenne, insbesondere Ringantenne, welche wenigstens einen elektrisch leitfähigen Antennenabschnitt umfasst, der an einer an die Oberseite und/oder die Unterseite angrenzenden Schmalseite der Leiterplatte angeordnet ist.The antenna arrangement according to the invention comprises a printed circuit board which has an upper side and a lower side, and an antenna, in particular a ring antenna, which is supported by the printed circuit board and comprises at least one electrically conductive antenna section which is arranged on a narrow side of the printed circuit board which adjoins the upper side and / or lower side is.
Erfindungsgemäß wurde erkannt, dass der Wirkungsgrad der Antennenanordnung insbesondere durch Leitungsverluste in der Leitungsbahn der Antenne sowie durch dielektrische Verluste im dielektrischen Material der Leiterplatte beeinträchtigt wird. Durch die Anordnung eines Antennenabschnitts an der Schmalseite lassen sich die beim Betrieb der Antenne auftretenden Leitungsverluste reduzieren und der Antennenwirkungsgrad somit erhöhen.According to the invention, it has been recognized that the efficiency of the antenna arrangement is impaired, in particular, by line losses in the line path of the antenna and by dielectric losses in the dielectric material of the circuit board. By arranging an antenna section on the narrow side, it is possible to reduce the line losses occurring during operation of the antenna and thus to increase the antenna efficiency.
Ursächlich für die Problematik der hohen Leitungsverluste ist nicht zuletzt der Skin-Effekt, der bei für den Betrieb der Antennenanordnung geeigneten Frequenzen besonders ausgeprägt ist. Der Skin-Effekt bezeichnet das Phänomen, dass einem im Inneren eines Leiters fließenden Wechselstrom bei hohen Frequenzen vermehrt Wirbelströme entgegenwirken, die durch den Wechselstrom im Inneren des Leiters induziert werden und den Nettostromfluss somit verringern, sodass der Stromfluss aus der Mitte des Leiters an den Rand des Leiters verlagert wird. In der Folge trägt bei hohen Frequenzen im Wesentlichen nur noch der Rand des Leiters zur Stromleitung bei, und der effektive Widerstand des Leiters erhöht sich.The reason for the problem of high line losses is not least the skin effect, which is particularly pronounced at frequencies suitable for the operation of the antenna arrangement. The skin effect refers to the phenomenon that an alternating current flowing inside a conductor increasingly counteracts eddy currents that are induced by the alternating current inside the conductor and thus reduce the net current flow, so that the current flow from the center of the conductor to the edge the head is relocated. As a result, at high frequencies, essentially only the edge of the conductor contributes to the current conduction, and the effective resistance of the conductor increases.
Ferner kommt hinzu, dass ein auf der Ober- oder Unterseite der Leiterplatte angeordneter Leiter in demjenigen Randbereich, in dem er mit der Ober- oder Unterseite in Berührung steht, den Strom nur wenig effizient leitet, weil die Oberfläche der Leiterplatte und damit auch die des Leiters in diesem Randbereich üblicherweise eine hohe Rauhigkeit aufweisen und der Strompfad in diesem Bereich entsprechend verlängert ist.In addition, an arranged on the top or bottom of the circuit board conductor in the edge region in which it is in contact with the top or bottom, the power is not very efficient conducts, because the surface of the circuit board and thus also the conductor in this edge region usually have a high roughness and the current path is extended accordingly in this area.
Die dielektrischen Verluste entstehen in der die Antenne tragenden Leiterplatte und hängen somit von den dielektrischen Verlusteigenschaften der die Leiterplatte bildenden Materialien ab. Im Rahmen der Erfindung besteht die die Antenne tragende Leiterplatte bevorzugt vollständig aus elektrisch nicht leitfähigem, dielektrischem Material. Die Leiterplatte kann beispielsweise aus mehreren dielektrischen Schichten laminiert sein.The dielectric losses occur in the circuit board carrying the antenna and thus depend on the dielectric loss properties of the materials forming the circuit board. In the context of the invention, the printed circuit board carrying the antenna preferably consists entirely of electrically nonconductive, dielectric material. For example, the circuit board may be laminated from a plurality of dielectric layers.
Die erfindungsgemäße Ausbildung eines leitfähigen Antennenabschnitts an einer Schmalseite der Leiterplatte schafft einen elektrischen Strompfad mit guten Stromleitungseigenschaften und reduziert somit die auftretenden Leitungsverluste der Antenne.The inventive construction of a conductive antenna section on a narrow side of the circuit board creates an electrical current path with good power line properties and thus reduces the line losses incurred by the antenna.
Ein Vorteil eines an einer Schmalseite angebrachten leitfähigen Antennenabschnitts ist hierbei, dass der Antennenabschnitt selbst keinen Platz auf der Ober- oder der Unterseite in Anspruch nimmt. Somit kann auch bei geringem Platzangebot auf der Ober- und Unterseite der Leiterplatte ein verhältnismäßig großer elektrisch leitfähiger Antennenabschnitt realisiert werden und damit eine erhöhte Leitfähigkeit der Antenne erreicht werden.An advantage of a narrow side mounted conductive antenna section here is that the antenna section itself does not take up space on the top or bottom. Thus, even with little space on the top and bottom of the circuit board, a relatively large electrically conductive antenna section can be realized and thus increased conductivity of the antenna can be achieved.
Ein schmalseitiger Antennenabschnitt ist insbesondere dann vorteilhaft, wenn die Antenne eine Ringantenne ist und einen Strompfad aufweist, der zumindest im Wesentlichen ringförmig in der Ebene der Leiterplatte verläuft. Ein schmalseitiger Antennenabschnitt weist hier zumindest annähernd die Form eines Mantelsegments auf, was zu einer besonders guten Abstrahlungscharakteristik führt und zu einem erhöhten Antennenwirkungsgrad beiträgt.A narrow-side antenna section is particularly advantageous if the antenna is an annular antenna and has a current path which extends at least substantially annularly in the plane of the printed circuit board. A narrow-side antenna section here has at least approximately the shape of a jacket segment, resulting in a particularly good Abstrahlscharakteristik leads and contributes to increased antenna efficiency.
Im Ergebnis besitzt die erfindungsgemäße Antennenanordnung also einen verbesserten Antennenwirkungsgrad, wodurch letztlich nicht nur die Antennenreichweite erhöht, sondern auch der Energiebedarf verringert ist.As a result, the antenna arrangement according to the invention thus has an improved antenna efficiency, which ultimately not only increases the antenna range, but also the energy consumption is reduced.
Vorteilhafte Ausführungsformen der Erfindung sind in den Unteransprüchen, der Beschreibung und den Zeichnungen beschrieben.Advantageous embodiments of the invention are described in the subclaims, the description and the drawings.
Der an der Schmalseite angeordnete leitfähige Antennenabschnitt weist bevorzugt ein metallisches Material auf, insbesondere Kupfer oder Gold. Bevorzugt ist der leitfähige schmalseitige Antennenabschnitt eine an der Schmalseite angeordnete metallische Schicht mit im Wesentlichen konstanter Dicke, welche zum Beispiel mehrere 10 µm beträgt.The arranged on the narrow side conductive antenna portion preferably comprises a metallic material, in particular copper or gold. The conductive narrow-side antenna section is preferably a metallic layer, arranged on the narrow side, with a substantially constant thickness, which is, for example, several 10 μm.
Gemäß einer Ausführungsform grenzt die Schmalseite der Leiterplatte an die Oberseite und/oder die Unterseite der Leiterplatte an. Die Schmalseite kann sich dabei im Wesentlichen senkrecht zur Ober- beziehungsweise Unterseite der Leiterplatte erstrecken. Bevorzugt ist es, wenn sich die Schmalseite von der Oberseite bis zu der Unterseite der Leiterplatte und somit also durch die Leiterplatte hindurch erstreckt. In diesem Fall stellt die Schmalseite eine besonders große Fläche für den an der Schmalseite angeordneten Antennenabschnitt zur Verfügung.According to one embodiment, the narrow side of the printed circuit board adjoins the upper side and / or the lower side of the printed circuit board. The narrow side may extend substantially perpendicular to the top or bottom of the circuit board. It is preferable if the narrow side extends from the upper side to the lower side of the printed circuit board and thus thus through the printed circuit board. In this case, the narrow side provides a particularly large area for the arranged on the narrow side antenna section.
Die Schmalseite kann ein sich durch die Leiterplatte hindurch erstreckendes Loch der Leiterplatte begrenzen, welches bevorzugt länglich ausgebildet ist. Alternativ kann die Schmalseite eine Außenseite der Leiterplatte bilden. Grenzt der schmalseitige Antennenabschnitt an ein Loch oder eine Außenseite der Leiterplatte, so ist weniger dielektrisches Leiterplattenmaterial in der direkten Umgebung des schmalseitigen Antennenabschnitts vorhanden, wodurch die dielektrischen Verluste des durch einen in dem schmalseitigen Antennenabschnitt fließenden Strom erzeugten elektromagnetischen Felds verringert werden. Außerdem lassen sich derartige Schmalseiten besonders einfach bilden, zum Beispiel indem Löcher in der Leiterplatte durch einen Fräsprozess gebildet werden beziehungsweise indem die äußere Kontur der Leiterplatte durch einen Fräsprozess entsprechend zugeschnitten wird.The narrow side may delimit a hole of the printed circuit board extending through the printed circuit board, which is preferably elongate. Alternatively, the narrow side may form an outer side of the printed circuit board. If the narrow-side antenna section borders on a hole or an outer side of the printed circuit board, then there is less dielectric printed circuit board material in the direct vicinity of the narrow-side antenna section, whereby the dielectric losses of the electromagnetic field generated by a current flowing in the narrow-side antenna section are reduced. In addition, such narrow sides can be particularly easily formed, for example by holes are formed in the circuit board by a milling process or by the outer contour of the circuit board is cut by a milling process accordingly.
Gemäß einer weiteren Ausführungsform bildet der schmalseitige Antennenabschnitt keinen geschlossenen elektrisch leitfähigen Ring. Begrenzt die Schmalseite, an welchem der Antennenabschnitt angebracht ist, ein Loch der Leiterplatte, ist der Antennenabschnitt vorzugsweise nur an einem Teilbereich der das Loch begrenzenden Schmalseite angebracht, ohne in dem Loch einen geschlossenen Ring zu bilden. Ein solcher schmalseitiger Antennenabschnitt kann in einfacher Weise durch vollständiges Beschichten einer ein Loch begrenzenden Schmalseite mit elektrisch leitfähigem Material und anschließendes Entfernen von unerwünschtem elektrisch leitfähigen Material erzeugt werden.According to a further embodiment, the narrow-side antenna section does not form a closed electrically conductive ring. If the narrow side on which the antenna section is attached delimits a hole in the printed circuit board, the antenna section is preferably attached only to a partial region of the narrow side delimiting the hole, without forming a closed ring in the hole. Such a narrow-side antenna section can be produced in a simple manner by completely coating a narrow side delimiting a hole with electrically conductive material and subsequently removing unwanted electrically conductive material.
Obwohl im Rahmen der Erfindung eine Antennenanordnung vorstellbar ist, die ausschließlich einen schmalseitigen Antennenabschnitt und keine ober- oder unterseitigen Antennenabschnitte aufweist, ist der an der Schmalseite angeordnete Antennenabschnitt gemäß einer bevorzugten Ausführungsform mit einem auf der Oberseite verlaufenden Antennenabschnitt und/oder mit einem auf der Unterseite verlaufenden Antennenabschnitt verbunden. Durch das Vorsehen des schmalseitigen Antennenabschnitts zusätzlich zu einem mit dem schmalseitigen Antennenabschnitt verbundenen, auf der Ober- und/oder Unterseite verlaufenden Antennenabschnitt wird die Leitfähigkeit der gesamten Anordnung deutlich erhöht.Although an antenna arrangement is conceivable within the scope of the invention which has only one narrow-side antenna section and no upper or lower-side antenna sections, the antenna section arranged on the narrow side is in accordance with a preferred embodiment with an antenna section running on the upper side and / or with one on the lower side extending antenna section connected. By providing the narrow-side antenna section in addition to an antenna section connected to the narrow-side antenna section and extending on the upper and / or lower side, the conductivity of the entire arrangement is markedly increased.
Der schmalseitige Antennenabschnitt kann entlang seiner zumindest annähernd gesamten Länge mit dem auf der Ober- oder Unterseite verlaufenden Antennenabschnitt verbunden sein.The narrow-side antenna section may be connected along its at least approximately entire length to the antenna section running on the upper or lower side.
Gemäß einer weiteren Ausführungsform sind zwei schmalseitige Antennenabschnitte auf gegenüberliegenden Seiten eines auf der Oberseite verlaufenden Antennenabschnitts oder eines auf der Unterseite verlaufenden Antennenabschnitts mit diesem verbunden. Die zwei schmalseitigen und der ober- beziehungsweise unterseitige Antennenabschnitt bilden somit zwei Winkel, in deren Scheiteln höhere Ströme fließen können, wodurch die Leitfähigkeit des Antennenabschnitts insgesamt noch weiter erhöht ist.According to a further embodiment, two narrow-side antenna sections are connected on opposite sides of an antenna section running on the top side or of an antenna section running on the underside. The two narrow-side and the upper and / or lower-side antenna section thus form two angles, in the peaks of which higher currents can flow, whereby the conductivity of the antenna section as a whole is increased even further.
Gemäß einer weiteren Ausführungsform erstreckt sich der an der Schmalseite angeordnete Antennenabschnitt durch die Leiterplatte hindurch und verbindet einen auf der Oberseite der Leiterplatte angeordneten Antennenabschnitt mit einem auf der Unterseite der Leiterplatte angeordneten Antennenabschnitt. Durch diese Anordnung werden ebenfalls zwei Antennenabschnittwinkel gebildet, in deren Scheiteln höhere Ströme fließen können und die zu einem erhöhten Antennenwirkungsgrad beitragen.According to a further embodiment, the antenna section arranged on the narrow side extends through the printed circuit board and connects an antenna section arranged on the upper side of the printed circuit board to an antenna section arranged on the lower side of the printed circuit board. By virtue of this arrangement, two antenna section angles are also formed, in the peaks of which higher currents can flow and which contribute to increased antenna efficiency.
Vorteilhafterweise sind ein oberseitiger und ein unterseitiger Antennenabschnitt durch zwei gegenüberliegende schmalseitige Antennenabschnitte miteinander verbunden. Auf diese Weise werden vier Antennenabschnittwinkel gebildet und ein noch höherer Stromfluss und Antennenwirkungsgrad erreicht.Advantageously, an upper-side and a lower-side antenna section are interconnected by two opposite narrow-side antenna sections. In this way, four antenna section angles are formed and an even higher current flow and antenna efficiency are achieved.
Gemäß einer weiteren Ausführungsform ist vorgesehen, dass der an der Schmalseite angeordnete Antennenabschnitt eine Unterbrechung eines auf der Oberseite oder auf der Unterseite der Leiterplatte verlaufenden ersten Antennenabschnitts elektrisch überbrückt. Dabei kann der schmalseitige Antennenabschnitt den ersten Antennenabschnitt zusätzlich mit einem zweiten, auf der Unter- beziehungsweise Oberseite verlaufenden Antennenabschnitt verbinden.According to a further embodiment, it is provided that the antenna section arranged on the narrow side interrupts one of the top side and bottom side of the printed circuit board first antenna section electrically bridged. In this case, the narrow-side antenna section additionally connect the first antenna section to a second antenna section extending on the lower or upper side.
Eine Unterbrechung des Antennenabschnitts der Ober- oder Unterseite der Leiterplatte kann dazu dienen, andere auf der Ober- oder Unterseite der Leiterplatte angebrachte Schaltungsteile aufzunehmen, wie beispielsweise eine durch die Unterbrechung hindurch verlaufende Leiterbahn zur Verbindung verschiedener Schaltungsteile oder Bauelemente.An interruption of the antenna portion of the top or bottom of the circuit board may serve to accommodate other circuit parts mounted on the top or bottom of the circuit board, such as a circuit through the interruption to interconnect various circuit parts or components.
So kann die Leiterplatte außer der Antenne noch weitere Schaltungsteile tragen, die z.B. in gemeinsamen Prozessschritten mit der Antenne hergestellt werden, beispielsweise Verbindungsleitungen und Anschlussflächen für weitere auf der Leiterplatte angeordnete Schaltungsteile.Thus, in addition to the antenna, the circuit board may carry other circuit parts, e.g. be made in common process steps with the antenna, for example, connecting lines and pads for more arranged on the circuit board circuit parts.
Auf der Ober- und/oder Unterseite der Leiterplatte angeordnete Antennenabschnitte können in diesem Fall in einem gemeinsamen Prozessschritt mit den weiteren Schaltungsteilen, wie z.B. Verbindungsleitungen und Anschlussflächen, gebildet werden.In this case, antenna sections arranged on the top and / or bottom side of the printed circuit board can be connected in a common process step with the further circuit parts, such as e.g. Connecting lines and pads are formed.
Solche weiteren Schaltungsteile können z.B. zu einer Ansteuerungsschaltung, welche die auf der Leiterplatte angebrachte Antenne mit einem Ansteuerungssignal beaufschlagt, oder, im Fall einer Empfangsantenne, einer Empfangs- und Auswerteschaltung gehören. Im Fall einer Sendeantenne wird die Antenne bevorzugt mit Frequenzen im Bereich zwischen 300 und 1000 MHz angesteuert.Such other circuit parts may e.g. to a drive circuit which applies a drive signal to the antenna mounted on the printed circuit board or, in the case of a receive antenna, to a receive and evaluate circuit. In the case of a transmitting antenna, the antenna is preferably driven with frequencies in the range between 300 and 1000 MHz.
Weiterer Gegenstand der Erfindung ist ein Verfahren mit den Merkmalen des Anspruchs 8. Das erfindungsgemäße Verfahren kann insbesondere zur Herstellung einer Antennenanordnung der voranstehend beschriebenen Art dienen. Die vorstehend erläuterten Vorteile gelten somit entsprechend.Another object of the invention is a method having the features of claim 8. The inventive method can in particular for producing an antenna arrangement of the type described above. The advantages explained above thus apply accordingly.
Bei dem erfindungsgemäßen Verfahren wird zur Bildung wenigstens eines Antennenabschnitts ein elektrisch leitfähiges Material an einer Schmalseite der Leiterplatte angebracht, welche an die Oberseite und/oder die Unterseite der Leiterplatte angrenzt.In the method according to the invention, to form at least one antenna section, an electrically conductive material is applied to a narrow side of the printed circuit board which adjoins the upper side and / or the underside of the printed circuit board.
Gemäß einer Ausführungsform wird die Schmalseite der Leiterplatte durch Entfernen von Leiterplattenmaterial erzeugt, insbesondere durch die Bildung eines, insbesondere langgestreckten, Loches in der Leiterplatte, beispielsweise durch einen Bohr- oder Fräsprozess. Bohr- und Fräsprozesse für Leiterplatten sind an sich bekannt und können in einfacher Weise mit verfügbaren Werkzeugen und Maschinen bewerkstelligt werden.According to one embodiment, the narrow side of the printed circuit board is produced by removing printed circuit board material, in particular by forming a, in particular elongated, hole in the printed circuit board, for example by a drilling or milling process. Drilling and milling processes for printed circuit boards are known per se and can be accomplished in a simple manner with available tools and machines.
Vorteilhafterweise werden in der Leiterplatte mehrere Löcher entlang der gewünschten Antennenleiterbahn für mehrere schmalseitige Antennenabschnitte erzeugt. Bekannte Bohr- oder Fräsmaschinen können eine solche Vielzahl von Löchern mit hoher Präzision und in hoher Geschwindigkeit anhand eines elektronischen Layouts, beispielsweise eines CAD-Layouts, erzeugen.Advantageously, a plurality of holes are produced in the circuit board along the desired antenna track for a plurality of narrow-side antenna sections. Known drilling or milling machines can produce such a variety of holes with high precision and high speed using an electronic layout, such as a CAD layout.
Besonders bevorzugt ist es, wenn das Entfernen von Leiterplattenmaterial zur Erzeugung der Schmalseite in einem gemeinsamen Prozessschritt mit der Bildung von Löchern für Durchverbindungen zwischen Schaltungsteilen auf der Oberseite und Schaltungsteilen auf der Unterseite der Leiterplatte, so genannte Vias, erfolgt.It is particularly preferred if the removal of printed circuit board material for generating the narrow side takes place in a common process step with the formation of holes for through connections between circuit parts on the upper side and circuit parts on the underside of the printed circuit board, so-called vias.
Durch die gemeinsame Erzeugung von Via-Löchern und Schmalseite(n) wird der Herstellungsprozess für die Antennenanordnung vereinfacht, indem kein separater Prozessschritt zum Entfernen von Leiterplattenmaterial zur Erzeugung der Schmalseite(n) durchgeführt zu werden braucht. Die Via-Löcher und die Schmalseite(n) können somit insbesondere in ein und derselben Werkzeugmaschine hergestellt werden, ohne dass die Leiterplatte zwischenzeitlich aus dem Arbeitsbereich der Maschine entfernt werden muss. Der Layoutdatei für das Erzeugen der Via-Löcher können hierzu einfach die geometrischen Daten für das Bohren und/oder Fräsen zur Erzeugung der Schmalseite(n) hinzugefügt werden.The co-generation of via holes and narrow side (s) simplifies the antenna array fabrication process by eliminating the need for a separate process step of removing printed circuit board material to create the narrow side (s). The via holes and the narrow side (s) can thus be produced in particular in one and the same machine tool, without the circuit board having to be temporarily removed from the working area of the machine. The layout file for creating the via holes can be simply added to the geometric data for drilling and / or milling to create the narrow side (s).
Gemäß einer vorteilhaften Ausführungsform wird das elektrisch leitfähige Material durch einen Abscheidungsprozess an der Schmalseite angebracht, insbesondere mittels eines galvanischen Verfahrens. Durch galvanische Abscheidungsprozesse können Schichten von elektrisch leitfähigem Material an einer Schmalseite erzeugt werden, die eine hohe Güte, eine hohe elektrische Leitfähigkeit und gute Adhäsion an dem Leiterplattenmaterial aufweisen. Bevorzugt wird Kupfer und/oder Gold abgeschieden und besonders bevorzugt wird eine Schicht mit zumindest näherungsweise konstanter Dicke abgeschieden, welche zum Beispiel zwischen 30 und 100 µm betragen kann.According to an advantageous embodiment, the electrically conductive material is attached by a deposition process on the narrow side, in particular by means of a galvanic process. Electrodeposition processes can be used to produce layers of electrically conductive material on a narrow side which have high quality, high electrical conductivity and good adhesion to the printed circuit board material. Preferably, copper and / or gold is deposited and more preferably a layer is deposited with at least approximately constant thickness, which may be, for example, between 30 and 100 microns.
Besonders bevorzugt ist es, wenn die Schmalseiten und die Seitenwände, welche die Via-Löcher begrenzen, gleichzeitig in einem gemeinsamen Abscheidungsprozess mit elektrisch leitfähigem Material beschichtet werden, da hierdurch kein separater Abscheidungsprozess für das Erzeugen der Antennenabschnitte an den Schmalseiten erforderlich ist.It is particularly preferred if the narrow sides and the side walls delimiting the via holes are simultaneously coated with electrically conductive material in a common deposition process, since this does not require a separate deposition process for generating the antenna sections on the narrow sides.
Bevorzugt wird an den Schmalseiten angebrachtes elektrisch leitfähiges Material und/oder daran angrenzendes Leiterplattenmaterial anschließend bereichsweise entfernt, zum Beispiel durch einen Fräsprozess.Preferably, electrically conductive material attached to the narrow sides and / or adjacent circuit board material is subsequently removed in regions, for example by a milling process.
Auf diese Weise lässt sich nicht benötigtes elektrisch leitfähiges Material beseitigen, z.B. elektrisch leitfähiges Material, welches dem Antennenabschnitt abgewandt ist, beziehungsweise das Gewicht und der Platzbedarf der Leiterplatte reduzieren. Außerdem lassen sich durch die Entfernung von Leiterplattenmaterial dielektrische Verluste reduzieren.In this way, unneeded electrically conductive material can be removed, e.g. electrically conductive material, which faces away from the antenna section, or reduce the weight and space requirement of the circuit board. In addition, the removal of printed circuit board material can reduce dielectric losses.
Beispielsweise kann die Schmalseite durch die Bildung eines Loches in der Leiterplatte erzeugt und nach der Metallisierung der Schmalseite Leiterplattenmaterial entfernt werden, welches sich zwischen dem Loch und einer Außenseite der Leiterplatte erstreckt, sodass die Schmalseite selbst zur Außenseite der Leiterplatte wird. Es wird also die Außenkontur der Leiterplatte durch Zuschneiden verkleinert, bis die Schmalseite zur Außenseite der Leiterplatte wird. Dieses Zuschneiden der Leiterplatte hin zur Schmalseite reduziert den Platzbedarf der Leiterplatte und die auftretenden dielektrischen Verluste. Da sich der schmalseitige Antennenabschnitt zumindest bereichsweise entlang der Außenkontur der Leiterplatte erstreckt, wird bei vorgegebener Baugröße außerdem eine maximale Antennenlänge beziehungsweise ein maximaler Antennendurchmesser erreicht.For example, the narrow side may be created by forming a hole in the circuit board and removed after metallization of the narrow side circuit board material extending between the hole and an outside of the circuit board such that the narrow side itself becomes the outside of the circuit board. Thus, the outer contour of the printed circuit board is reduced by cutting until the narrow side becomes the outer side of the printed circuit board. This cutting of the printed circuit board towards the narrow side reduces the space requirement of the printed circuit board and the occurring dielectric losses. Since the narrow-side antenna section extends at least partially along the outer contour of the printed circuit board, a maximum antenna length or a maximum antenna diameter is also achieved for a given size.
Nachfolgend wird die vorliegende Erfindung rein beispielhaft anhand einer vorteilhaften Ausführungsform unter Bezugnahme auf die beigefügten Zeichnungen beschrieben. Es zeigen:
- Fig. 1 a
- eine Leiterplattenanordnung nach dem Bohren von Via-Löchern;
- Fig. 1b
- eine Querschnittsansicht entlang der Linie A-A' von
Fig. 1 a; - Fig. 2a
- die Anordnung von
Fig. 1 nach dem Fräsen von Lang- löchern; - Fig. 2b
- eine Querschnittsansicht entlang der Linie A-A' von
Fig. 2a ; - Fig. 3a
- die Anordnung von
Fig. 2 nach dem Beschichten der Löcher mit leitfähigem Material; - Fig. 3b
- eine Querschnittsansicht entlang der Linie A-A' von
Fig. 3a ; - Fig. 4a
- die Anordnung von
Fig. 3 nach dem Strukturieren von Leiterbahnen; - Fig. 4b
- eine Querschnittsansicht entlang der Linie A-A' von
Fig. 4a ; - Fig. 4c
- eine Rückseitenansicht der Anordnung von
Fig. 4a ; - Fig. 5
- eine Zuschneidetrajektorie, entlang der die Leiterplat- tenanordnung von
Fig. 4 zugeschnitten wird; - Fig. 6a
- eine erfindungsgemäße Antennenanordnung, die durch das Verfahren von
Fig. 1-5 hergestellt worden ist; - Fig. 6b
- eine Querschnittsansicht der Antennenanordnung von
Fig. 6a entlang der Linie A-A' vonFig. 6a .
- Fig. 1 a
- a printed circuit board assembly after drilling via holes;
- Fig. 1b
- a cross-sectional view along the line AA 'of
Fig. 1 a; - Fig. 2a
- the arrangement of
Fig. 1 after milling long holes; - Fig. 2b
- a cross-sectional view along the line AA 'of
Fig. 2a ; - Fig. 3a
- the arrangement of
Fig. 2 after coating the holes with conductive material; - Fig. 3b
- a cross-sectional view along the line AA 'of
Fig. 3a ; - Fig. 4a
- the arrangement of
Fig. 3 after structuring of printed conductors; - Fig. 4b
- a cross-sectional view along the line AA 'of
Fig. 4a ; - Fig. 4c
- a rear view of the arrangement of
Fig. 4a ; - Fig. 5
- a cutting trajectory along which the printed circuit board arrangement of
Fig. 4 is tailored; - Fig. 6a
- an antenna arrangement according to the invention, by the method of
Fig. 1-5 has been prepared; - Fig. 6b
- a cross-sectional view of the antenna assembly of
Fig. 6a along the line AA 'ofFig. 6a ,
Im vorliegenden Ausführungsbeispiel werden die Langlöcher 16 durch einen Fräsprozess erzeugt. Die Langlöcher 16 werden senkrecht zu der Ober- und Unterseite der Leiterplatte 10 gefräst, sodass die die Langlöcher 16 begrenzenden Schmalseiten 18 und die Ober- beziehungsweise Unterseite der Leiterplatte 10 einen im Wesentlichen rechten Winkel bilden. Der Bohrprozess für die Via-Löcher 12 und der Fräsprozess für die Langlöcher 16 können in einem gemeinsamen Prozessschritt in derselben Maschine durchgeführt werden.In the present embodiment, the
Nach der Erzeugung der Via-Löcher 12 und der Langlöcher 16 werden die Seitenwände 11 der Via-Löcher 12 und die durch die Langlöcher 16 definierten Schmalseiten 18 durch einen Abscheidungsprozess mit einem leitfähigen Material, im vorliegenden Ausführungsbeispiel mit Kupfer, beschichtet.After the formation of the via holes 12 and the
Das an den Schmalseiten 18 abgeschiedene Kupfermaterial bildet zum einen schmalseitige Antennenabschnitte 20 und zum anderen unerwünschtes beziehungsweise nicht benötigtes Kupfermaterial 20', nämlich in den Bereichen der die Langlöcher 16 begrenzenden Schmalseiten 18, die dem gewünschten schmalseitigen Antennenabschnitt 20 abgewandt sind. Außerdem bildet das in den Via-Löchern 12 abgeschiedene Kupfer die Durchverbindungen 22 (Vias).The deposited on the
Nach der Abscheidung des leitfähigen Materials werden die Kupferschicht 14 auf der Oberseite und die Kupferschicht 14' auf der Unterseite der Leiterplatte 10 in geeigneter Weise strukturiert, z.B durch einen an sich bekannten Ätzprozess, um auf der Oberseite und der Unterseite der Leiterplatte 10 elektrisch leitfähige Antennenabschnitte 24, 24' sowie elektrische Verbindungsleitungen 28 und elektrische Anschlussflächen 26 für zusätzlich zu der Antenne auf der Leiterplatte 10 herzustellende Schaltungsteile zu schaffen (
Wie
Die Antennenleiterbahnen 24, 24' auf der Ober- und Unterseite der Leiterplatte 10 bilden zusammen mit den schmalseitigen Antennenabschnitten 20 eine im Wesentlichen ringförmige Antenne, die insbesondere im Bereich der freitragenden Stege 19 eine erhöhte Leitfähigkeit durch das an den Schmalseiten 18 abgeschiedene leitfähige Material sowie verringerte dielektrische Verluste durch die Bildung der Langlöcher 16 in dem dielektrischen Material der Leiterplatte 10 aufweist.The antenna conductor tracks 24, 24 'on the upper and lower sides of the printed
In
Zur Bildung der Ansteuerungsschaltung können in an sich bekannter Weise elektronische Bauelemente, beispielsweise SMD-Bauelemente, an den Anschlussflächen 26 angebracht und über die elektrischen Verbindungsleitungen 28 miteinander verschaltet werden. Wie
Nach der Strukturierung wird die Leiterplatte 10 auf die gewünschte Größe der Antennenanordnung zugeschnitten.
Anstatt die Außenkontur der Leiterplatte 10 ringsum, also nach einer geschlossenen Schneidelinie wie der Schneidelinie 30a zuzuschneiden, kann die Außenkontur der Leiterplatte 10 auch dadurch zugeschnitten werden, dass Leiterplattenmaterial, das sich zwischen einem außen gelegenen Langloch 16 und einer Außenseite der Leiterplatte 10 erstreckt, durch zwei zwischen der Außenseite der Leiterplatte 10 und dem Langloch 16 geführte Schnitte herausgeschnitten wird. In diesem Fall kann die Leiterplatte 10 bevorzugt bereits vor der Strukturierung der Kupferschichten 14, 14' grob auf eine Außenkontur zugeschnitten werden, die etwas größer als ihr Endmaß ist, sodass dünne Stege der Leiterplatte 10 verbleiben, die sich zwischen den äußeren Langlöchern 16 und der Außenseite der Leiterplatte 10 erstrecken. Diese werden dann in einem weiteren, auf die Strukturierung folgenden Zuschneideschritt herausgeschnitten.Instead of cutting the outer contour of the printed
Durch die Schneidelinien 30b wird außerdem an den innen gelegenen Langlöchern 16 unerwünschtes abgeschiedenes elektrisch leitfähiges Material 20' entfernt. Hierbei wird gegebenenfalls auch um das unerwünschte elektrisch leitfähige Material 20' herum gelegenes Leiterplattenmaterial entfernt.In addition, unwanted deposited electrically conductive material 20 'is removed by the cutting lines 30b at the inner elongated holes 16. In this case, if necessary, printed circuit board material located around the unwanted electrically conductive material 20 'is also removed.
- 1010
- Leiterplattecircuit board
- 1111
- SeitenwandSide wall
- 1212
- Via-LochVia-hole
- 14, 14'14, 14 '
- Kupferschichtcopper layer
- 1616
- LanglochLong hole
- 1818
- Schmalseitenarrow side
- 1919
- freitragender Stegcantilevered bridge
- 2020
- schmalseitiger Antennenabschnittnarrow-sided antenna section
- 20'20 '
- nicht benötigtes elektrisch leitfähiges Materialunneeded electrically conductive material
- 2222
- Durchverbindung (Via)Through connection (Via)
- 24, 24'24, 24 '
- Antennenabschnittantenna section
- 26,a,b26, a, b
- elektrische Anschlussflächeelectrical connection surface
- 2828
- elektrische Verbindungsleitungelectrical connection line
- 30a,b30a, b
- Schneideliniecutting line
- ss
- Dicke der KupferschichtThickness of the copper layer
- dd
- Dicke der LeiterplatteThickness of the printed circuit board
Claims (14)
dadurch gekennzeichnet, dass
sich die Schmalseite (18) von der Oberseite bis zu der Unterseite der Leiterplatte (10) erstreckt.Antenna arrangement according to Claim 1,
characterized in that
extending the narrow side (18) from the top to the bottom of the circuit board (10).
dadurch gekennzeichnet, dass
die Schmalseite (10) ein Loch (16) der Leiterplatte (10) begrenzt oder eine Außenseite der Leiterplatte (10) bildet.Antenna arrangement according to Claim 1 or 2,
characterized in that
the narrow side (10) delimits a hole (16) in the printed circuit board (10) or forms an outer side of the printed circuit board (10).
dadurch gekennzeichnet, dass
der schmalseitige Antennenabschnitt (20) mit einem auf der Oberseite verlaufenden Antennenabschnitt (24) und/oder mit einem auf der Unterseite verlaufenden Antennenabschnitt (24') verbunden ist.Antenna arrangement according to one of the preceding claims,
characterized in that
the narrow-side antenna section (20) is connected to an antenna section (24) running on the upper side and / or to an antenna section (24 ') running on the underside.
dadurch gekennzeichnet, dass
zwei schmalseitige Antennenabschnitte (20) auf gegenüberliegenden Seiten eines auf der Oberseite verlaufenden Antennenabschnitts (24) und/oder eines auf der Unterseite verlaufenden Antennenabschnitts (24') mit diesem verbunden sind.Antenna arrangement according to one of the preceding claims,
characterized in that
two narrow-side antenna sections (20) on opposite sides of an upper side extending antenna portion (24) and / or an underside extending antenna portion (24 ') are connected thereto.
dadurch gekennzeichnet, dass
der schmalseitige Antennenabschnitt (20) einen auf der Oberseite der Leiterplatte (10) angeordneten Antennenabschnitt (24) mit einem auf der Unterseite der Leiterplatte (10) angeordneten Antennenabschnitt (24') verbindet.Antenna arrangement according to one of the preceding claims,
characterized in that
the narrow-side antenna section (20) connects an antenna section (24) arranged on the upper side of the printed circuit board (10) to an antenna section (24 ') arranged on the lower side of the printed circuit board (10).
dadurch gekennzeichnet, dass
der schmalseitige Antennenabschnitt (20) eine Unterbrechung eines auf der Oberseite oder auf der Unterseite der Leiterplatte (10) verlaufenden Antennenabschnitts (24, 24') elektrisch überbrückt.Antenna arrangement according to one of the preceding claims,
characterized in that
the narrow-side antenna section (20) electrically bridges an interruption of an antenna section (24, 24 ') running on the upper side or on the lower side of the printed circuit board (10).
bei welchem Verfahren zur Bildung wenigstens eines Antennenabschnitts (20) ein elektrisch leitfähiges Material an einer Schmalseite (18) der Leiterplatte (10) angebracht wird, welche an die Oberseite und/oder die Unterseite angrenzt.A method of making an antenna assembly comprising a printed circuit board (10) having a top and a bottom and an antenna (20, 24, 24 ') carried by the printed circuit board (10), in particular for producing an antenna assembly according to any one of the preceding claims,
in which method for forming at least one antenna section (20), an electrically conductive material is attached to a narrow side (18) of the printed circuit board (10) which adjoins the upper side and / or the lower side.
dadurch gekennzeichnet, dass
die Schmalseite (18) der Leiterplatte (10) durch Entfernen von Leiterplattenmaterial erzeugt wird, insbesondere durch die Bildung eines mittels eines Bohr- oder Fräsprozesses erzeugten Loches (16) in der Leiterplatte (10).Method according to claim 8,
characterized in that
the narrow side (18) of the printed circuit board (10) is produced by removing printed circuit board material, in particular by forming a hole (16) in the printed circuit board (10) produced by means of a drilling or milling process.
dadurch gekennzeichnet, dass
das Entfernen von Leiterplattenmaterial zur Erzeugung der Schmalseite (18) in einem gemeinsamen Prozessschritt mit einer Bildung von Löchern (12) für Durchverbindungen (22) zwischen Schaltungsteilen (26, 28) auf der Oberseite und der Unterseite der Leiterplatte (10) erfolgt.Method according to claim 9,
characterized in that
the removal of printed circuit board material for the production of the narrow side (18) in a common process step with formation of holes (12) for through connections (22) between circuit parts (26, 28) on the top and the bottom of the circuit board (10).
dadurch gekennzeichnet, dass
das elektrisch leitfähige Material durch einen Abscheidungsprozess an der Schmalseite (18) angebracht wird, insbesondere mittels eines galvanischen Verfahrens.Method according to one of claims 8 to 10,
characterized in that
the electrically conductive material is applied by a deposition process on the narrow side (18), in particular by means of a galvanic process.
dadurch gekennzeichnet, dass
in dem Abscheidungsprozess gleichzeitig die Schmalseite (18) und Seitenwände (11), die Löcher (12) für Durchverbindungen (22) zwischen Schaltungsteilen (26, 28) auf der Oberseite und der Unterseite der Leiterplatte (10) begrenzen, mit elektrisch leitfähigem Material beschichtet werden.Method according to claim 11,
characterized in that
in the deposition process at the same time the narrow side (18) and side walls (11), the holes (12) for through connections (22) between circuit parts (26, 28) on the top and bottom of the circuit board (10) limit, coated with electrically conductive material become.
dadurch gekennzeichnet, dass
an der Schmalseite (18) angebrachtes elektrisch leitfähiges Material und/oder daran angrenzendes Leiterplattenmaterial bereichsweise entfernt werden, insbesondere durch einen Fräsprozess.Method according to one of claims 8 to 12,
characterized in that
on the narrow side (18) mounted electrically conductive material and / or adjacent circuit board material are removed in regions, in particular by a milling process.
dadurch gekennzeichnet, dass
die Schmalseite (18) durch die Bildung eines Loches (16) in der Leiterplatte (10) erzeugt wird und nach der Metallisierung der Schmalseite (18) Leiterplattenmaterial entfernt wird, welches sich zwischen dem Loch (16) und einer Außenseite der Leiterplatte (10) erstreckt, sodass die Schmalseite (18) selbst zur Außenseite der Leiterplatte (10) wird.Method according to claim 13,
characterized in that
the narrow side (18) is produced by the formation of a hole (16) in the printed circuit board (10) and after the metallization of the narrow side (18) printed circuit board material is removed which extends between the hole (16) and an outer side of the printed circuit board (10) extends, so that the narrow side (18) itself to the outside of the circuit board (10).
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP09011000.8A EP2293381B1 (en) | 2009-08-27 | 2009-08-27 | Antenna assembly |
US12/868,113 US20110050506A1 (en) | 2009-08-27 | 2010-08-25 | Antenna arrangement |
CN201010267410.4A CN102005642B (en) | 2009-08-27 | 2010-08-27 | Antenna assembly |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP09011000.8A EP2293381B1 (en) | 2009-08-27 | 2009-08-27 | Antenna assembly |
Publications (2)
Publication Number | Publication Date |
---|---|
EP2293381A1 true EP2293381A1 (en) | 2011-03-09 |
EP2293381B1 EP2293381B1 (en) | 2016-11-09 |
Family
ID=41130290
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP09011000.8A Active EP2293381B1 (en) | 2009-08-27 | 2009-08-27 | Antenna assembly |
Country Status (3)
Country | Link |
---|---|
US (1) | US20110050506A1 (en) |
EP (1) | EP2293381B1 (en) |
CN (1) | CN102005642B (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102016108868A1 (en) * | 2016-05-13 | 2017-11-16 | Kathrein Werke Kg | Adapter plate for HF structures |
FR3118836B1 (en) * | 2021-01-11 | 2024-03-29 | Hager Controls | Antenna device on printed circuit and method for producing antenna(s) on printed circuit(s) |
Citations (7)
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---|---|---|---|---|
DE19614362C1 (en) | 1996-04-11 | 1997-07-31 | Siemens Ag | Antenna, esp. for vehicle theft protection system |
EP1006572A1 (en) * | 1998-11-30 | 2000-06-07 | Siemens Aktiengesellschaft | Slotted damascene lines for low resistive wiring lines for integrated circuit |
GB2357905A (en) | 1999-12-01 | 2001-07-04 | Hi Key Ltd | Antenna formed on printed circuit board |
WO2004034512A1 (en) | 2002-10-08 | 2004-04-22 | Leopold Kostal Gmbh & Co. Kg | Electronic circuitry provided with an integrated antenna |
US20040119643A1 (en) * | 2002-12-19 | 2004-06-24 | Accton Technology Corporation | Planar inverted-f antenna and application system thereof |
US20060238421A1 (en) | 2001-06-01 | 2006-10-26 | Agere Systems Inc. | Low-loss substrate antenna structure and method of manufacture thereof |
US20070279879A1 (en) | 2006-05-30 | 2007-12-06 | Shinko Electric Industries Co., Ltd. | Wiring board and semiconductor apparatus |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
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SE9704795D0 (en) * | 1997-12-19 | 1997-12-19 | Allgon Ab | Directional coupler for high power RF signals |
TWI249978B (en) * | 2004-05-11 | 2006-02-21 | Via Tech Inc | Circuit substrate and manufacturing method of plated through slot thereof |
CN2881991Y (en) * | 2006-03-02 | 2007-03-21 | 汉达精密电子(昆山)有限公司 | Complementary phase regulation PCB antenna |
KR100806847B1 (en) * | 2006-09-12 | 2008-02-22 | 삼성전자주식회사 | Micro antenna and its manufacturing method |
US8983618B2 (en) * | 2008-10-31 | 2015-03-17 | Medtronic, Inc. | Co-fired multi-layer antenna for implantable medical devices and method for forming the same |
-
2009
- 2009-08-27 EP EP09011000.8A patent/EP2293381B1/en active Active
-
2010
- 2010-08-25 US US12/868,113 patent/US20110050506A1/en not_active Abandoned
- 2010-08-27 CN CN201010267410.4A patent/CN102005642B/en active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19614362C1 (en) | 1996-04-11 | 1997-07-31 | Siemens Ag | Antenna, esp. for vehicle theft protection system |
EP1006572A1 (en) * | 1998-11-30 | 2000-06-07 | Siemens Aktiengesellschaft | Slotted damascene lines for low resistive wiring lines for integrated circuit |
GB2357905A (en) | 1999-12-01 | 2001-07-04 | Hi Key Ltd | Antenna formed on printed circuit board |
US20060238421A1 (en) | 2001-06-01 | 2006-10-26 | Agere Systems Inc. | Low-loss substrate antenna structure and method of manufacture thereof |
WO2004034512A1 (en) | 2002-10-08 | 2004-04-22 | Leopold Kostal Gmbh & Co. Kg | Electronic circuitry provided with an integrated antenna |
US20040119643A1 (en) * | 2002-12-19 | 2004-06-24 | Accton Technology Corporation | Planar inverted-f antenna and application system thereof |
US20070279879A1 (en) | 2006-05-30 | 2007-12-06 | Shinko Electric Industries Co., Ltd. | Wiring board and semiconductor apparatus |
Also Published As
Publication number | Publication date |
---|---|
EP2293381B1 (en) | 2016-11-09 |
US20110050506A1 (en) | 2011-03-03 |
CN102005642B (en) | 2016-05-18 |
CN102005642A (en) | 2011-04-06 |
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