Classifications

• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/02—Details
  • H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
  • H10K30/00—Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation
  • H10K30/80—Constructional details
  • H10K30/81—Electrodes
  • H10K30/82—Transparent electrodes, e.g. indium tin oxide [ITO] electrodes
  • H10K30/83—Transparent electrodes, e.g. indium tin oxide [ITO] electrodes comprising arrangements for extracting the current from the cell, e.g. metal finger grid systems to reduce the serial resistance of transparent electrodes
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
  • H10K50/00—Organic light-emitting devices
  • H10K50/80—Constructional details
  • H10K50/805—Electrodes
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
  • H10K50/00—Organic light-emitting devices
  • H10K50/80—Constructional details
  • H10K50/85—Arrangements for extracting light from the devices
  • H10K50/856—Arrangements for extracting light from the devices comprising reflective means
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/01—Dielectrics
  • H05K2201/0104—Properties and characteristics in general
  • H05K2201/0108—Transparent
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
  • H05K2201/2054—Light-reflecting surface, e.g. conductors, substrates, coatings, dielectrics
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/22—Secondary treatment of printed circuits
  • H05K3/24—Reinforcing the conductive pattern
  • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
  • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
  • Y02E10/00—Energy generation through renewable energy sources
  • Y02E10/50—Photovoltaic [PV] energy
  • Y02E10/549—Organic PV cells

Definitions

• the invention relates to a substrate comprising a conductive mesh deposited on the substrate, a radiation source, a photocell, and production methods.
• the prior art discloses various applications of substrates which cary a network of conductor traces, in particular in order to realize an electrode, such that a voltage can be applied or tapped off between said electrode and a further electrode.
• substrates are known for the realization of electrochromic windows .
• the invention is based on the object of providing an improved substrate, a radiation source, a photocell, and corresponding production methods .
• Embodiments of the invention relate to a substrate comprising a conductive network of metallic conductor traces applied to the substrate, wherein the conductor traces have a first side, facing the substrate, and a second side, remote from the substrate, wherein the second side is provided with a reflective layer and wherein the substrate is transmissive.
• the mesh of the metallic conductor traces can be embodied in regular layout, in particular grid-shape layout, or in irregular layout, in particular in random layout .
• silver, gold, copper and/or aluminium are used for depositing the metallic conductor traces.
• the metallic conductive traces are applied for example by vapour deposition, with the aid of a magnetron or by a chemical or electrochemical reaction.
• the invention makes it possible to use copper for the realization of the conductor traces, which is particularly advantageous since there are inexpensive coating methods for coating the substrate with copper which do not require a vacuum, in particular electrochemical methods .
• the conductor traces have the following dimensions: thickness of a conductor trace 0.3-5 ⁇ m, width of a conductor trace 3-15 ⁇ m, distance between two conductor traces 50-1000 ⁇ m.
• Embodiments of the invention are particularly advantageous since, on account of the reflective layer, radiation incident on the conductor traces is reflected for example in the direction of an electrode.
• the efficiency can thereby be increased.
• the reflective layer comprises a metal such as, for example, silver, aluminium and/or nickel.
• the reflective layer is applied for example by means of vapour deposition, magnetron or by chemical or electrochemical reactions.
• the reflective layer is thin in comparison with the thickness of the conductor traces; in particular, the thickness of the reflective layer is less than 10% of the thickness of the conductor trace.
• the material of a reflective layer is chosen such that the layer is colourless .
• the second side of the conductor traces which is remote from the substrate, is provided with the reflective layer, but also completely or partly the side faces of the conductor traces that extend between the first and second sides.
• a lower layer is arranged between the first side of the conductor traces and the substrate.
• the lower layer does not extend over the substrate over the whole area, but rather is interrupted by the interspaces formed by the network.
• the lower layer can be embodied in radiation-absorbent fashion, in particular in black fashion, preferably in colour-neutral fashion. This is advantageous in order to conceal the conductor traces, such that the substrate does not get a colour cast. This is advantageous particularly when copper is used for the conductor traces .
• the lower layer is embodied in reflective fashion, which is advantageous particularly in applications of the invention for realizing radiation sources, in particular OLEDs, or photocells. What is achieved here by means of the reflective lower layer is that light modes propagating within the substrate are not absorbed, which further increases the efficiency.
• an emissive layer is arranged opposite the substrate.
• the emissive layer is embodied for the emission of radiation, in particular light.
• the emissive layer can be excited to effect emission for example by means of a suitable electric field.
• the radiation emitted by the emissive layer in the direction of the substrate partly passes through the interspaces formed by the network, such that this part of the radiation can be emitted through the substrate into the surroundings .
• Another part of the radiation does not impinge on the interspaces, however, but rather on the conductor traces. Where the conductor traces are provided with the reflective layer, this part of the radiation is reflected in the direction of the emissive layer.
• the emissive layer for its part, has a reflective layer, such as an electrode for example, then that part of the radiation which is reflected at the conductor traces is reflected again and is reflected back in the direction of the substrate, such that there is the possibility that this re-reflected portion of the radiation can be emitted through the interspaces into the surroundings.
• a reflective layer such as an electrode for example
• one or more layers situated on the substrate are imprinted; in particular, the lower layer and/or the conductor traces can be imprinted.
• a patterning step can then be obviated since the lower layer and/or the conductor traces are applied as a structure.
• the emissive layer is formed by an organic material.
• an OLED can be realized in this way.
• a photovoltaic layer is arranged opposite the substrate in order in this way to realize a photocell, in particular a solar cell.
• the efficiency of the photocell can once again be increased.
• the invention relates to a radiation source comprising an embodiment of a substrate according to the invention, in particular an OLED .
• the invention relates to a photocell, in particular a solar cell, comprising an embodiment of a substrate according to the invention.
• the invention relates to various methods for producing embodiments of the substrate according to the invention, the radiation source and/or the photocell.
• the production is effected by means of the following steps: applying a metallic whole layer to the substrate, patterning the metallic whole layer to realize the conductive network, applying the reflective layer at least to the second side of the conductor traces .
• the production is effected by means of the following steps: applying the lower layer to the substrate, patterning the lower layer, applying the metallic conductor traces to the patterned lower layer, applying the reflective layer at least to the second side of the conductor traces.
• the production is effected by means of the following steps: applying a metallic whole layer with a lower layer to the substrate, applying the reflective layer to that side of the metallic whole layer which is remote from the substrate, patterning the lower layer applied to the substrate, the metallic whole layer and the reflective layer to realize the conductive mesh.
• Figure 1 shows a schematic cross section of a first embodiment of a substrate according to the invention
• Figure 2 shows a schematic cross section of a further embodiment of a substrate according to the invention with an absorbent lower layer
• Figure 3 shows a schematic cross section of a further embodiment of a substrate according to the invention with a reflective lower layer
• Figure 4 shows a schematic cross section of a further embodiment of a substrate according to the invention with a lower layer and a reflective layer covering the side faces of the conductor traces,
• Figure 5 shows a schematic cross section of an embodiment of a radiation source according to the invention
• FIG. 6 shows a flowchart of embodiments of methods according to the invention
• FIGS 7A-C show an embodiment of a production method according to the invention
• Figures 8A-D show a further embodiment of a production method according to the invention
• Figures 9A-C show a further embodiment of a production method according to the invention.
• Figure 1 shows a substrate 100.
• the substrate is transmissive, that is to say that it permits incident radiation to pass through with only a small loss of intensity.
• the radiation can be light in the visible spectral range, for example.
• the substrate 100 can be a glass layer or a plurality of glass layers laminated onto one another.
• the substrate 100 can also be a layer composed of a transparent plastic.
• Metallic conductor traces are arranged on the substrate 100, two conductor traces 102 of which are shown by way of example in Figure 1.
• the conductor traces 102 are interconnected with one another such that a conductive network is formed.
• the network can be embodied in regular or irregular fashion.
• the conductor traces 102 can comprise silver, gold, aluminium and/or copper.
• the conductor traces 102 are preferably composed of copper.
• the conductor traces 102 have a first side 104, which faces the substrate 100.
• the conductor traces 102 are connected to the substrate 100 at their first sides 104, as illustrated in Figure 1.
• the conductor traces 102 furthermore have second sides 106, which are remote from the substrate 100. Side faces 108 of the conductor traces 102 extend between the first sides 104 and the second sides 106.
• a reflective layer 110 is in each case situated at least on the second sides 106 of the conductor tracks 102. The reflective layer 110 can also extend completely or partly over the side faces 108 of the conductor traces 102, as is the case in the embodiment shown in Figure 1.
• the reflective layer 110 can be composed for example of silver, aluminium and/or nickel.
• the reflective layer 110 is deposited as a silver and/or nickel layer on the conductor traces 102 by means of a chemical or electrochemical method.
• the reflective layer 110 has the advantage that light which is incident in the region of the conductor traces 102 in the direction of the first sides 104 and/or the side faces 108 is reflected, which is advantageous for various applications.
• the reflective layer 110 is preferably colourless in order to avoid a colour cast.
• Figure 2 shows an embodiment of the substrate in which only the second sides 106 are covered by the reflective layer 110.
• a lower layer 112 is situated between the first sides 104 and the substrate 100.
• the lower layer 112 is embodied in absorbent fashion here.
• the lower layer 112 is colour-neutral, in particular black.
• Figure 3 shows an embodiment of the substrate 100 in which the lower layer 112 is embodied in reflective fashion, in contrast to the embodiment of Figure 2. This has the advantage that a light mode 116 propagating in the substrate 100 is not absorbed, which has the advantage of an increase in efficiency, particularly for the realization of OLEDs and photocells .
• Figure 4 shows a further embodiment of the substrate 100 with an absorbent, black lower layer 112, and also a reflective layer 110 on the second side 106 of the conductor traces 102 and also the side faces 108 thereof.
• FIG 5 shows an embodiment of a radiation source 118 according to the invention.
• the radiation source 118 has a substrate 100, which carries a layer construction, for example in accordance with one of the embodiments in Figures 1 to 4.
• the conductor tracks 102 are coated with the reflective layer 110 at least on their second sides 106.
• the side faces 108 can also be coated with the reflective layer 110.
• the lower layer 112 can optionally be present between the conductor traces 102 and the substrate 100.
• the conductor traces 102 are followed by a layer 120.
• the layer 120 can be embodied in emissive fashion. Radiation 122 emitted by the layer 120 can emerge from the substrate 100 through the interspaces 124 formed between the conductor traces 102, for example for illumination purposes.
• the layer 120 can be an organic material which is excited to emit the radiation 122 if it is exposed to an electric field. Such organic materials are known per se for the production of OLEDs.
• the layer 120 can have an electrode 126.
• the electrode 126 is preferably embodied over the whole area and in reflective fashion.
• portions 122.1 of the radiation 122 impinge on the upper layer 110 situated on the second sides 106, then these portions 122.1 are reflected in the direction of the electrode 126, where they are reflected again, to be precise in the direction of the substrate 100, such that there is the possibility that these portions
• the interspaces 124 between the conductor traces 102 are filled by a planarization layer 128.
• the layer 120 is situated on said planarization layer 128.
• an electrical voltage is applied between the electrode 126 and the network formed by the conductor traces 102, such that the layer 120 is excited to emit the radiation 122.
• a photocell in particular a solar cell, can also be realized with the layer construction shown in Figure 5.
• the layer 120 is embodied as a photovoltaic layer, wherein a photovoltaic voltage in particular for power generation can be tapped off between the electrode 126 and the mesh formed from the metallic conductor traces 102.
• Figure 6 shows an embodiment of the method according to the invention.
• a substrate such as e.g. glass
• a structure is then applied to the substrate, to be precise for example a structure such as is shown in the embodiments in Figures 1 to 5.
• Step 202 can be carried out with the aid of various technologies; in particular, it is possible to use various patterning techniques, such as e.g. laser patterning or photolithographic techniques, or printing techniques that can make subsequent patterning completely or partly superfluous .
• various patterning techniques such as e.g. laser patterning or photolithographic techniques, or printing techniques that can make subsequent patterning completely or partly superfluous .
• Figures 7A-C show a first embodiment of a production method according to the invention.
• a whole-area lower layer 112 with a whole-area metallization is applied to the substrate 100.
• This coating of the substrate 100 is patterned, such that the conductor traces 102 are obtained, as shown in Figure 7B.
• the reflective layer 110 is applied ( Figure 7C) .
• the application of the various layers and also the patterning can be carried out with the aid of methods known per se from semiconductor technology.
• the patterning can be effected with the aid of photolithographic methods.
• Figure 8 shows an alternative production method.
• the substrate 100 is coated with the lower layer 112 (Figure 8A) .
• the lower layer 112 is then patterned ( Figure 8B) .
• Metal, such as copper, for example, is then deposited on the patterned lower layer 112.
• the copper can grow for example chemically or electrochemically ( Figure 8C) .
• the resultant conductor traces 102 are coated with the reflective layer 110 ( Figure 8D) .
• the production of the layer construction can be effected e.g. in accordance with US20050681950, US20060832598 and/or EP1714532.
• a thin lower layer having a thickness of ⁇ 100 run is applied.
• the lower layer can be e.g. aluminium (Al), nickel (Ni) or NiCr; the use of NiCr is advantageous, owing to the good adhesion promotion that can be achieved therewith.
• the patterning is effected by means of laser patterning or photolithography. o Electroplating of copper for producing the conductor traces .
• Figure 9 shows a further alternative production method.
• the starting point of the method ( Figure 9A) is identical to that of the method in accordance with Figure 7.
• the reflective layer 110 is applied to the metallization over the whole area ( Figure 9B) .
• the patterning is subsequently effected, with the result that the conductor traces 102 coated with the reflective layer 110 are obtained on the lower layer 112 ( Figure 9C) .

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• Physics & Mathematics (AREA)
• Optics & Photonics (AREA)
• Engineering & Computer Science (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Electromagnetism (AREA)
• Electroluminescent Light Sources (AREA)

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• 2008
  • 2008-04-30 DE DE102008021655A patent/DE102008021655B4/de not_active Withdrawn - After Issue
• 2009
  • 2009-03-28 EP EP09737780A patent/EP2272115A1/de not_active Withdrawn
  • 2009-03-28 WO PCT/EP2009/002288 patent/WO2009132736A1/en active Application Filing

Non-Patent Citations (2)

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