EP2247542A4 - Système et procédé pour refroidir des plaques de verre chaudes recouvertes de semi-conducteur - Google Patents

Système et procédé pour refroidir des plaques de verre chaudes recouvertes de semi-conducteur

Info

Publication number
EP2247542A4
EP2247542A4 EP09705621A EP09705621A EP2247542A4 EP 2247542 A4 EP2247542 A4 EP 2247542A4 EP 09705621 A EP09705621 A EP 09705621A EP 09705621 A EP09705621 A EP 09705621A EP 2247542 A4 EP2247542 A4 EP 2247542A4
Authority
EP
European Patent Office
Prior art keywords
glass sheets
hot glass
cooling semiconductor
coated hot
semiconductor coated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP09705621A
Other languages
German (de)
English (en)
Other versions
EP2247542A1 (fr
Inventor
James E Heider
Gary T Faykosh
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
WILLARD and KELSEY SOLAR GROUP LLC
Original Assignee
WILLARD and KELSEY SOLAR GROUP LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by WILLARD and KELSEY SOLAR GROUP LLC filed Critical WILLARD and KELSEY SOLAR GROUP LLC
Publication of EP2247542A1 publication Critical patent/EP2247542A1/fr
Publication of EP2247542A4 publication Critical patent/EP2247542A4/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B29/00—Reheating glass products for softening or fusing their surfaces; Fire-polishing; Fusing of margins
    • C03B29/04—Reheating glass products for softening or fusing their surfaces; Fire-polishing; Fusing of margins in a continuous way
    • C03B29/06—Reheating glass products for softening or fusing their surfaces; Fire-polishing; Fusing of margins in a continuous way with horizontal displacement of the products
    • C03B29/08—Glass sheets
    • C03B29/10—Glass sheets being in a vertical position
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B25/00—Annealing glass products
    • C03B25/04—Annealing glass products in a continuous way
    • C03B25/06—Annealing glass products in a continuous way with horizontal displacement of the glass products
    • C03B25/08—Annealing glass products in a continuous way with horizontal displacement of the glass products of glass sheets
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B25/00—Annealing glass products
    • C03B25/04—Annealing glass products in a continuous way
    • C03B25/06—Annealing glass products in a continuous way with horizontal displacement of the glass products
    • C03B25/08—Annealing glass products in a continuous way with horizontal displacement of the glass products of glass sheets
    • C03B25/087—Annealing glass products in a continuous way with horizontal displacement of the glass products of glass sheets being in a vertical position
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B29/00—Reheating glass products for softening or fusing their surfaces; Fire-polishing; Fusing of margins
    • C03B29/04—Reheating glass products for softening or fusing their surfaces; Fire-polishing; Fusing of margins in a continuous way
    • C03B29/06—Reheating glass products for softening or fusing their surfaces; Fire-polishing; Fusing of margins in a continuous way with horizontal displacement of the products
    • C03B29/08—Glass sheets
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B35/00—Transporting of glass products during their manufacture, e.g. hot glass lenses, prisms
    • C03B35/14—Transporting hot glass sheets or ribbons, e.g. by heat-resistant conveyor belts or bands
    • C03B35/20—Transporting hot glass sheets or ribbons, e.g. by heat-resistant conveyor belts or bands by gripping tongs or supporting frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
EP09705621A 2008-01-28 2009-01-05 Système et procédé pour refroidir des plaques de verre chaudes recouvertes de semi-conducteur Withdrawn EP2247542A4 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/020,772 US20090191031A1 (en) 2008-01-28 2008-01-28 System and method for cooling semiconductor coated hot glass sheets
PCT/US2009/030072 WO2009097164A1 (fr) 2008-01-28 2009-01-05 Système et procédé pour refroidir des plaques de verre chaudes recouvertes de semi-conducteur

Publications (2)

Publication Number Publication Date
EP2247542A1 EP2247542A1 (fr) 2010-11-10
EP2247542A4 true EP2247542A4 (fr) 2012-08-29

Family

ID=40899411

Family Applications (1)

Application Number Title Priority Date Filing Date
EP09705621A Withdrawn EP2247542A4 (fr) 2008-01-28 2009-01-05 Système et procédé pour refroidir des plaques de verre chaudes recouvertes de semi-conducteur

Country Status (4)

Country Link
US (1) US20090191031A1 (fr)
EP (1) EP2247542A4 (fr)
CN (1) CN101959810A (fr)
WO (1) WO2009097164A1 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2317545A1 (fr) * 2009-10-30 2011-05-04 Applied Materials, Inc. Système et procédé de transport de substrat
IT1399480B1 (it) * 2010-03-15 2013-04-19 Stral S R L Apparecchiatura per la deposizione di materiale semiconduttore su vetro
FR3000502A1 (fr) * 2012-12-27 2014-07-04 Commissariat Energie Atomique Procede de traitement thermique d'une piece mince, notamment d'un composant optique mince

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1981560A (en) * 1933-02-27 1934-11-20 Corning Glass Works Method and apparatus for cooling glass
US3655233A (en) * 1969-02-14 1972-04-11 Pilkington Brothers Ltd Tongs for suspending glass sheets
US20050213950A1 (en) * 2004-03-23 2005-09-29 Canon Kabushiki Kaisha Cooling device, and apparatus and method for manufacturing image display panel using cooling device
US20070122936A1 (en) * 2004-04-01 2007-05-31 Viatron Technologies Inc. System for heat treatment of semiconductor device

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1951950A (en) * 1933-05-29 1934-03-20 Corning Glass Works Method and apparatus for cooling glass articles
FR1271096A (fr) * 1960-07-15 1961-09-08 Procédé de trempe des feuilles de verre et produits qui en résultent
US3391958A (en) * 1967-04-27 1968-07-09 Pittsburgh Plate Glass Co Glass gripping tongs with ballast
US4159842A (en) * 1975-03-10 1979-07-03 Ppg Industries, Inc. Supporting glass sheets
FR2488423A1 (fr) * 1980-08-06 1982-02-12 Saint Gobain Vitrage Procede et dispositif pour la regulation de la temperature d'une feuille de verre dans un four a plusieurs cellules
US4545327A (en) * 1982-08-27 1985-10-08 Anicon, Inc. Chemical vapor deposition apparatus
US4593644A (en) * 1983-10-26 1986-06-10 Rca Corporation Continuous in-line deposition system
US5016562A (en) * 1988-04-27 1991-05-21 Glasstech Solar, Inc. Modular continuous vapor deposition system
JP2948842B2 (ja) * 1989-11-24 1999-09-13 日本真空技術株式会社 インライン型ｃｖｄ装置
US5248349A (en) * 1992-05-12 1993-09-28 Solar Cells, Inc. Process for making photovoltaic devices and resultant product
US5607009A (en) * 1993-01-28 1997-03-04 Applied Materials, Inc. Method of heating and cooling large area substrates and apparatus therefor
US6013134A (en) * 1998-02-18 2000-01-11 International Business Machines Corporation Advance integrated chemical vapor deposition (AICVD) for semiconductor devices
JP4856308B2 (ja) * 2000-12-27 2012-01-18 キヤノンアネルバ株式会社 基板処理装置及び経由チャンバー
TW200737533A (en) * 2005-12-21 2007-10-01 Nat Science And Technology Dev Agency Low-cost and high performance solar cell manufacturing machine
US7572334B2 (en) * 2006-01-03 2009-08-11 Applied Materials, Inc. Apparatus for fabricating large-surface area polycrystalline silicon sheets for solar cell application

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1981560A (en) * 1933-02-27 1934-11-20 Corning Glass Works Method and apparatus for cooling glass
US3655233A (en) * 1969-02-14 1972-04-11 Pilkington Brothers Ltd Tongs for suspending glass sheets
US20050213950A1 (en) * 2004-03-23 2005-09-29 Canon Kabushiki Kaisha Cooling device, and apparatus and method for manufacturing image display panel using cooling device
US20070122936A1 (en) * 2004-04-01 2007-05-31 Viatron Technologies Inc. System for heat treatment of semiconductor device

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2009097164A1 *

Also Published As

Publication number Publication date
WO2009097164A1 (fr) 2009-08-06
EP2247542A1 (fr) 2010-11-10
CN101959810A (zh) 2011-01-26
US20090191031A1 (en) 2009-07-30

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Ipc: H01L 21/677 20060101ALI20120724BHEP

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