TWI365967B - Heat-dissipating sheet and method for manufacturing heat-dissipating sheet - Google Patents
Heat-dissipating sheet and method for manufacturing heat-dissipating sheetInfo
- Publication number
- TWI365967B TWI365967B TW098118976A TW98118976A TWI365967B TW I365967 B TWI365967 B TW I365967B TW 098118976 A TW098118976 A TW 098118976A TW 98118976 A TW98118976 A TW 98118976A TW I365967 B TWI365967 B TW I365967B
- Authority
- TW
- Taiwan
- Prior art keywords
- dissipating sheet
- heat
- manufacturing
- manufacturing heat
- dissipating
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3737—Organic materials with or without a thermoconductive filler
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Ceramic Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008176611A JP4202409B1 (en) | 2008-07-07 | 2008-07-07 | Radiation sheet and method for producing the radiation sheet |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201007113A TW201007113A (en) | 2010-02-16 |
| TWI365967B true TWI365967B (en) | 2012-06-11 |
Family
ID=40239554
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW098118976A TWI365967B (en) | 2008-07-07 | 2009-06-06 | Heat-dissipating sheet and method for manufacturing heat-dissipating sheet |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP4202409B1 (en) |
| TW (1) | TWI365967B (en) |
| WO (1) | WO2010004662A1 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4256463B1 (en) * | 2008-10-16 | 2009-04-22 | 有限会社アイレックス | Heat dissipation structure |
| JP4564586B1 (en) | 2010-01-26 | 2010-10-20 | 有限会社アイレックス | Radiation sheet and method for producing the radiation sheet |
| JP5533531B2 (en) * | 2010-10-06 | 2014-06-25 | 東芝ライテック株式会社 | Lighting device using heat dissipation sheet |
| CN105144005A (en) * | 2013-04-22 | 2015-12-09 | 三菱电机株式会社 | Programmable logic controller system and programmable logic controller |
| KR102293885B1 (en) * | 2015-02-03 | 2021-08-26 | 삼성디스플레이 주식회사 | Display device |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61291649A (en) * | 1985-06-18 | 1986-12-22 | Nippon Telegr & Teleph Corp <Ntt> | High polymer film having high anisotropy in thermal conductivity and production thereof |
| DE4223887A1 (en) * | 1992-07-21 | 1994-01-27 | Basf Ag | Process for producing a polymer / metal or polymer / semiconductor composite |
| JP2001341239A (en) * | 2000-06-05 | 2001-12-11 | Kyodo Giken Kagaku Kk | Antistatic film, release film for pressure-sensitive self- adhesive tape or sheet using antistatic film, and pressure-sensitive self-adhesive tape or sheet |
| JP2002158481A (en) * | 2000-11-16 | 2002-05-31 | Dainippon Printing Co Ltd | Wave absorber |
| JP2002270741A (en) * | 2001-03-12 | 2002-09-20 | Nitto Shinko Kk | Heat radiating sheet and method for sticking electronic component to the heat radiating sheet |
-
2008
- 2008-07-07 JP JP2008176611A patent/JP4202409B1/en not_active Expired - Fee Related
- 2008-11-25 WO PCT/JP2008/071306 patent/WO2010004662A1/en active Application Filing
-
2009
- 2009-06-06 TW TW098118976A patent/TWI365967B/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| TW201007113A (en) | 2010-02-16 |
| JP2010016272A (en) | 2010-01-21 |
| WO2010004662A1 (en) | 2010-01-14 |
| JP4202409B1 (en) | 2008-12-24 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |