EP2238608A4 - Large area nanopatterning method and apparatus - Google Patents

Large area nanopatterning method and apparatus

Info

Publication number
EP2238608A4
EP2238608A4 EP08871196A EP08871196A EP2238608A4 EP 2238608 A4 EP2238608 A4 EP 2238608A4 EP 08871196 A EP08871196 A EP 08871196A EP 08871196 A EP08871196 A EP 08871196A EP 2238608 A4 EP2238608 A4 EP 2238608A4
Authority
EP
European Patent Office
Prior art keywords
large area
nanopatterning method
area nanopatterning
nanopatterning
area
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP08871196A
Other languages
German (de)
French (fr)
Other versions
EP2238608A1 (en
Inventor
Boris Kobrin
Igor Landau
Boris Volf
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rolith Inc
Original Assignee
Rolith Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rolith Inc filed Critical Rolith Inc
Publication of EP2238608A1 publication Critical patent/EP2238608A1/en
Publication of EP2238608A4 publication Critical patent/EP2238608A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/42—Moulds or cores; Details thereof or accessories therefor characterised by the shape of the moulding surface, e.g. ribs or grooves
    • B29C33/424—Moulding surfaces provided with means for marking or patterning
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/62—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/50—Mask blanks not covered by G03F1/20 - G03F1/34; Preparation thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/60—Substrates
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
    • G03F7/2014—Contact or film exposure of light sensitive plates such as lithographic plates or circuit boards, e.g. in a vacuum frame
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/24—Curved surfaces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
EP08871196A 2008-01-22 2008-11-18 Large area nanopatterning method and apparatus Withdrawn EP2238608A4 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US1186108P 2008-01-22 2008-01-22
PCT/US2008/012901 WO2009094009A1 (en) 2008-01-22 2008-11-18 Large area nanopatterning method and apparatus

Publications (2)

Publication Number Publication Date
EP2238608A1 EP2238608A1 (en) 2010-10-13
EP2238608A4 true EP2238608A4 (en) 2012-02-22

Family

ID=40901352

Family Applications (1)

Application Number Title Priority Date Filing Date
EP08871196A Withdrawn EP2238608A4 (en) 2008-01-22 2008-11-18 Large area nanopatterning method and apparatus

Country Status (10)

Country Link
EP (1) EP2238608A4 (en)
JP (1) JP5102879B2 (en)
KR (1) KR20110008159A (en)
CN (2) CN101911249A (en)
AU (1) AU2008348353A1 (en)
CA (1) CA2709718A1 (en)
MX (1) MX2010007954A (en)
RU (1) RU2488188C2 (en)
TW (1) TWI518027B (en)
WO (1) WO2009094009A1 (en)

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US8518633B2 (en) 2008-01-22 2013-08-27 Rolith Inc. Large area nanopatterning method and apparatus
US8192920B2 (en) 2008-04-26 2012-06-05 Rolith Inc. Lithography method
US8334217B2 (en) 2008-06-09 2012-12-18 Rolith Inc. Material deposition over template
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US9465296B2 (en) * 2010-01-12 2016-10-11 Rolith, Inc. Nanopatterning method and apparatus
RU2012134344A (en) * 2010-01-12 2014-02-20 Борис КОБРИН METHOD AND DEVICE FOR FORMING A NANOPARTICLE
CN101846880B (en) * 2010-05-12 2012-05-30 上海交通大学 Nano photoetching method for exciting surface plasma
AT510217B1 (en) * 2010-08-13 2013-12-15 Hueck Folien Gmbh PROCESS FOR PARTIAL MATTING OF UV VARNISH LAYERS
RU2544280C2 (en) * 2010-08-23 2015-03-20 Ролит, Инк. Mask for near-field lithography and its manufacture
US9187839B2 (en) * 2010-10-07 2015-11-17 Michael Sheehy Process for the manufacture of sealed anodized aluminum components
CN102169819B (en) * 2011-01-14 2013-01-30 中国科学院物理研究所 Method of preparing nanometer metal structure
WO2013049367A2 (en) * 2011-09-30 2013-04-04 Rolith, Inc. Plasmonic lithography using phase mask
KR101260221B1 (en) * 2011-12-01 2013-05-06 주식회사 엘지화학 Mask
US9720330B2 (en) * 2012-04-17 2017-08-01 The Regents Of The University Of Michigan Methods for making micro- and nano-scale conductive grids for transparent electrodes and polarizers by roll to roll optical lithography
US20150336301A1 (en) 2012-05-02 2015-11-26 Rolith, Inc. Cylindrical polymer mask and method of fabrication
US9481112B2 (en) 2013-01-31 2016-11-01 Metamaterial Technologies Usa, Inc. Cylindrical master mold assembly for casting cylindrical masks
WO2013165915A1 (en) * 2012-05-02 2013-11-07 Rolith,Inc. Cylindrical polymer mask and method of fabrication
US9782917B2 (en) 2013-01-31 2017-10-10 Metamaterial Technologies Usa, Inc. Cylindrical master mold and method of fabrication
CN102759855A (en) * 2012-07-17 2012-10-31 西安交通大学 Single code channel absolute grating scale rolling and impressing mould manufacturing method
TWI474432B (en) * 2012-11-15 2015-02-21 Lextar Electronics Corp Die positioning device, die positioning system having the same, and die positioning method of led display board
RU2593463C2 (en) * 2013-12-23 2016-08-10 Станислав Викторович Хартов Method for producing conductive mesh micro- and nanostructures and structure therefor
US9244356B1 (en) 2014-04-03 2016-01-26 Rolith, Inc. Transparent metal mesh and method of manufacture
KR101636696B1 (en) 2014-05-23 2016-07-06 연세대학교 산학협력단 variable large area nano imaging OPTICAL HEAD AND IMAGING DEVICE using flexible nano film optical structure
WO2015183243A1 (en) 2014-05-27 2015-12-03 Rolith, Inc. Anti-counterfeiting features and methods of fabrication and detection
KR102252049B1 (en) * 2014-08-04 2021-05-18 삼성디스플레이 주식회사 Mask for photolithography, method of manufacturing the same and method of manufacturing substrate using the same
KR102240761B1 (en) 2015-01-29 2021-04-15 삼성디스플레이 주식회사 Variable mask
JP6808155B2 (en) * 2015-08-19 2021-01-06 国立大学法人 東京大学 Mother mold manufacturing method
TWI579640B (en) * 2015-10-15 2017-04-21 許銘案 Thin-film mask, fitting aids, fitting and exposure device and fitting method for the thin-film mask pasted on a curved substrate
CN106773531B (en) * 2017-01-03 2020-06-16 京东方科技集团股份有限公司 Impression roller in nano impression device and nano impression device
CN106547044B (en) * 2017-01-24 2019-03-01 深圳市华星光电技术有限公司 A kind of process equipment and manufacturing method of polaroid
CN106647192A (en) * 2017-03-10 2017-05-10 深圳市华星光电技术有限公司 Exposure equipment
CN109390263A (en) * 2017-08-07 2019-02-26 财团法人工业技术研究院 Element expansion transfer method and the equipment for implementing this transfer method
CN109901362B (en) 2017-12-11 2022-04-19 中国科学院光电技术研究所 Secondary imaging optical lithography method and apparatus
EP3732047A4 (en) * 2017-12-29 2021-09-29 3M Innovative Properties Company Nonplanar patterned nanostructured surface and printing methods for making thereof
KR102096606B1 (en) * 2018-08-29 2020-04-02 부산대학교 산학협력단 Fabrication of nanoimprint soft mold for cylinder surface and nano-imprint process for cylindrical surface
GB2576922B (en) * 2018-09-06 2021-10-27 Stensborg As An optical engine for an imprinter
CN109668631B (en) * 2018-12-11 2021-06-01 中国科学院光电技术研究所 Preparation method of large-area and low-cost superconducting nanowire single photon detector
CN111807320B (en) * 2019-04-10 2024-07-09 青岛九环新越新能源科技股份有限公司 Roller for rolling nano-scale pore structure material, roller set and rolling production line
TWI765276B (en) * 2020-06-12 2022-05-21 光群雷射科技股份有限公司 Manufacturing method of lens in transfer manner and manufacturing method of lens transfer layer

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See also references of WO2009094009A1 *

Also Published As

Publication number Publication date
MX2010007954A (en) 2010-11-05
CA2709718A1 (en) 2009-07-30
WO2009094009A1 (en) 2009-07-30
EP2238608A1 (en) 2010-10-13
JP2011526069A (en) 2011-09-29
CN101911249A (en) 2010-12-08
CN105171985A (en) 2015-12-23
TWI518027B (en) 2016-01-21
AU2008348353A1 (en) 2009-07-30
KR20110008159A (en) 2011-01-26
JP5102879B2 (en) 2012-12-19
RU2010134893A (en) 2012-02-27
RU2488188C2 (en) 2013-07-20
TW200932666A (en) 2009-08-01

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