EP2218112A1 - Élément de thermorégulation pour modules photovoltaïques - Google Patents
Élément de thermorégulation pour modules photovoltaïquesInfo
- Publication number
- EP2218112A1 EP2218112A1 EP08848550A EP08848550A EP2218112A1 EP 2218112 A1 EP2218112 A1 EP 2218112A1 EP 08848550 A EP08848550 A EP 08848550A EP 08848550 A EP08848550 A EP 08848550A EP 2218112 A1 EP2218112 A1 EP 2218112A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- layer
- graphite
- tempering
- heat transfer
- photocell
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 90
- 239000010439 graphite Substances 0.000 claims abstract description 88
- 229910002804 graphite Inorganic materials 0.000 claims abstract description 88
- 230000005855 radiation Effects 0.000 claims abstract description 11
- 239000011265 semifinished product Substances 0.000 claims abstract description 11
- 238000005496 tempering Methods 0.000 claims description 30
- 239000011888 foil Substances 0.000 claims description 27
- 239000000853 adhesive Substances 0.000 claims description 14
- 230000001070 adhesive effect Effects 0.000 claims description 14
- 150000001875 compounds Chemical class 0.000 claims description 10
- 229910052751 metal Inorganic materials 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 10
- 238000009826 distribution Methods 0.000 claims description 8
- 239000002245 particle Substances 0.000 claims description 5
- 238000000197 pyrolysis Methods 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 5
- 239000011230 binding agent Substances 0.000 claims description 4
- 239000004033 plastic Substances 0.000 claims description 4
- 229920003023 plastic Polymers 0.000 claims description 4
- 239000000919 ceramic Substances 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 239000002243 precursor Substances 0.000 claims description 3
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 claims description 2
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 claims description 2
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims description 2
- 229920005830 Polyurethane Foam Polymers 0.000 claims description 2
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 claims description 2
- 239000011575 calcium Substances 0.000 claims description 2
- 229910052791 calcium Inorganic materials 0.000 claims description 2
- 239000006229 carbon black Substances 0.000 claims description 2
- 239000007849 furan resin Substances 0.000 claims description 2
- 238000003475 lamination Methods 0.000 claims description 2
- 239000011777 magnesium Substances 0.000 claims description 2
- 229910052749 magnesium Inorganic materials 0.000 claims description 2
- 239000007769 metal material Substances 0.000 claims description 2
- 150000002739 metals Chemical class 0.000 claims description 2
- 239000002557 mineral fiber Substances 0.000 claims description 2
- 229920001568 phenolic resin Polymers 0.000 claims description 2
- 239000005011 phenolic resin Substances 0.000 claims description 2
- 239000011295 pitch Substances 0.000 claims description 2
- 239000011496 polyurethane foam Substances 0.000 claims description 2
- 229920005749 polyurethane resin Polymers 0.000 claims description 2
- 239000011591 potassium Substances 0.000 claims description 2
- 229910052700 potassium Inorganic materials 0.000 claims description 2
- 239000000344 soap Substances 0.000 claims description 2
- 239000011734 sodium Substances 0.000 claims description 2
- 229910052708 sodium Inorganic materials 0.000 claims description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims 1
- 238000003763 carbonization Methods 0.000 claims 1
- 239000004020 conductor Substances 0.000 claims 1
- 239000004094 surface-active agent Substances 0.000 claims 1
- 239000002131 composite material Substances 0.000 abstract description 6
- 239000010410 layer Substances 0.000 description 93
- 238000000034 method Methods 0.000 description 10
- 230000006835 compression Effects 0.000 description 9
- 238000007906 compression Methods 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 9
- 239000000463 material Substances 0.000 description 8
- 238000001816 cooling Methods 0.000 description 7
- 239000002346 layers by function Substances 0.000 description 6
- 229910052799 carbon Inorganic materials 0.000 description 5
- 238000003825 pressing Methods 0.000 description 5
- 238000005056 compaction Methods 0.000 description 4
- 239000010408 film Substances 0.000 description 4
- 230000002687 intercalation Effects 0.000 description 4
- 238000009830 intercalation Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 239000005083 Zinc sulfide Substances 0.000 description 2
- 239000002318 adhesion promoter Substances 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 2
- 238000000280 densification Methods 0.000 description 2
- -1 graphite salts Chemical class 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 238000005304 joining Methods 0.000 description 2
- 238000010943 off-gassing Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- UMCMPZBLKLEWAF-BCTGSCMUSA-N 3-[(3-cholamidopropyl)dimethylammonio]propane-1-sulfonate Chemical compound C([C@H]1C[C@H]2O)[C@H](O)CC[C@]1(C)[C@@H]1[C@@H]2[C@@H]2CC[C@H]([C@@H](CCC(=O)NCCC[N+](C)(C)CCCS([O-])(=O)=O)C)[C@@]2(C)[C@@H](O)C1 UMCMPZBLKLEWAF-BCTGSCMUSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229920001651 Cyanoacrylate Polymers 0.000 description 1
- MWCLLHOVUTZFKS-UHFFFAOYSA-N Methyl cyanoacrylate Chemical compound COC(=O)C(=C)C#N MWCLLHOVUTZFKS-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000013543 active substance Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000005234 chemical deposition Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000002482 conductive additive Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 239000012809 cooling fluid Substances 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 239000013529 heat transfer fluid Substances 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-M hydrogensulfate Chemical compound OS([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-M 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 150000003961 organosilicon compounds Chemical class 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 229920000548 poly(silane) polymer Polymers 0.000 description 1
- 229920001709 polysilazane Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 239000002918 waste heat Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- DRDVZXDWVBGGMH-UHFFFAOYSA-N zinc;sulfide Chemical compound [S-2].[Zn+2] DRDVZXDWVBGGMH-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/052—Cooling means directly associated or integrated with the PV cell, e.g. integrated Peltier elements for active cooling or heat sinks directly associated with the PV cells
- H01L31/0521—Cooling means directly associated or integrated with the PV cell, e.g. integrated Peltier elements for active cooling or heat sinks directly associated with the PV cells using a gaseous or a liquid coolant, e.g. air flow ventilation, water circulation
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02S—GENERATION OF ELECTRIC POWER BY CONVERSION OF INFRARED RADIATION, VISIBLE LIGHT OR ULTRAVIOLET LIGHT, e.g. USING PHOTOVOLTAIC [PV] MODULES
- H02S40/00—Components or accessories in combination with PV modules, not provided for in groups H02S10/00 - H02S30/00
- H02S40/40—Thermal components
- H02S40/44—Means to utilise heat energy, e.g. hybrid systems producing warm water and electricity at the same time
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/60—Thermal-PV hybrids
Definitions
- the invention relates to a tempering for photovoltaic modules and semi-finished products for the production of this component.
- Photovoltaic modules and interconnected photovoltaic systems are used for the direct conversion of sunlight into electricity.
- special semiconductors such as solar silicon, zinc sulphide (ZnS) or gallium arsenide (GaAs), in which electrons are released by the impingement of photons, use so-called photocells.
- the efficiency of such photovoltaic systems is highly dependent on the amount of incident light and the temperature of the photocells, which are arranged in a photocell layer. Particularly in sunny areas between southern the 45th latitude and latitude are photovoltaic modules heats the thermal recombination of electrons released limit the standing for energy available temperature range to a maximum of about 70 0 C. INS easy to temperatures of more than 70 0 C. ,
- a photovoltaic device is known from document DE 199 23 196 A1, in which at least one cooling device through which liquid flows is arranged in front of the photocell layer with respect to the direction of radiation.
- the cooling device is intended to increase the yield of electrical energy by limiting the temperature of the photocells to a maximum of 50 ° C. and by the optical filtering action of the cooling fluid used and of the transparent covering materials for the usable spectral range of the sunlight. The overall efficiency is thereby improved by using the thermal energy absorbed by the cooling medium.
- the document DE 10 2004 043 205 A1 also describes a photovoltaic element which is provided with a temperature control.
- the temperature control is carried out via a temperature sensor which is attached to the photocell and attached to the rear or underside of the photocell, preferably liquid-flow tempering. The temperature should be removed via the temperature control medium.
- the advantage of the concentration of sunlight through mirrors on the surface of the photovoltaic module is that the yield of electrical energy is higher for the same area of the photovoltaic module than for non-concentrating systems.
- the concentration of sunlight leads to even higher temperatures in the photovoltaic module and thus to a lower efficiency in the conversion of radiant energy into electrical energy.
- the object of the present invention is to provide a temperature control body for photovoltaic modules which makes it possible to facilitate the heat transfer between the absorption surface and the heat transfer fluid.
- the photovoltaic modules equipped with the tempering body according to the invention can be used both in non-concentrating systems (flat-plate collectors) and in systems in which the incident solar radiation is concentrated by mirrors, lenses or similar devices on the surface of the photovoltaic modules.
- the use of heat dissipated by the photovoltaic module in the temperature control body according to the invention is possible.
- heat transfer tubes 3 through which temperature medium 2 flows are embedded in a layer 4 of compressed graphite expandate and connected to the surface of a photocell layer 1 remote from the solar radiation. Due to the embedding of the heat transfer tubes 3 in compressed graphite expand the entire pipe surface is available for heat transfer, therefore, the heat transfer resistance is significantly reduced.
- compressed graphite expander we mean a compressed graphite expandate with a density between 0.02 g / cm 3 and 0.5 g / cm 3 . Further advantageous embodiments are set forth in claims 2 to 13.
- a further object is to provide a semifinished product which can be used inter alia for the production of the tempering body according to the invention.
- this object is achieved by the layer composite semifinished product comprising a layer 4 of compressed graphite expandate having a density between 0.02 g / cm 3 and 0.5 g / cm 3 .
- Advantageous embodiments of this semifinished product are specified in claims 15 and 16. The advantages, details and variants of the invention will become apparent from the following detailed description and the figures.
- FIGS. 2a and 2c show tempering bodies for a photovoltaic flat collector according to the prior art.
- FIGS. 2a-2c show embodiments of a tempering body according to the invention for a photovoltaic flat collector
- Figures Ia and Ib show refrigerated photovoltaic modules according to the prior art.
- the photocell layer 1 the conversion of radiant energy of the sun into electrical energy takes place.
- the part of the solar energy that is not converted into electrical energy accumulates as heat, which leads to an increase in temperature of the photocell layer 1.
- the yield of electrical energy i. the ratio of electrical energy emitted to irradiated solar energy decreases, cooling devices are provided which are intended to prevent the heating of the photocell layer 1 beyond a certain maximum operating temperature.
- FIG. 1 a a photovoltaic module with a cooling device integrated in a housing, consisting of a heat sink 7 with cooling fins, which transmit the excess heat to a temperature control medium 2, is shown.
- FIG. 1b An alternative construction according to the prior art is shown in FIG. 1b: the photocell layer 1 is in thermal contact with a heat distribution layer 6, which transfers the excess heat to heat transfer tubes 3 through which temperature control medium 2 flows.
- the heat transfer between the heat sink 7 and the heat transfer tubes 3 is produced by a linear connection 8, usually as a welded or soldered joint.
- FIGS. 2a to 2c show various embodiments of the tempering body according to the invention.
- the heat transfer tubes 3 through which the temperature control medium 2 flows are embedded in a layer 4 of compressed expanded graphite. Between the solar radiation facing away from the surface of the photocell layer 1 and the layer 4 may optionally be provided further functional layers 6, whose function will be explained below. Also optional is a layer 5 of a heat-insulating material at the back of the layer 4.
- Graphite is characterized by its superposition of superimposed layers by a strong anisotropy of conductivity; the electrical and thermal conductivity along the layers is significantly greater than across the layers. This anisotropy is more pronounced the more dense the graphite is, i. the more the individual graphite platelets are aligned in parallel. However, if the graphite experiences only a small compression, the individual plates are not aligned completely parallel and thus the anisotropy of the conductivity is less pronounced.
- the production of expanded graphite is known.
- Graphite intercalation compounds (graphite salts), e.g. Graphite hydrogen sulfate, are shock-heated in an oven or by microwave.
- the volume of the particles increases by a factor of 200 to 400, and the bulk density drops to 2 to 20 g / l.
- the resulting graphite expandate consists of worm or accordion-shaped aggregates. If the graphite expandate is compressed again, then the individual aggregates entangle with one another to form a solid composite which, without the addition of a binder, forms self-supporting sheets, e.g. Films, webs or shaped articles, e.g. Plates, can be shaped.
- An alternative, also known from the prior art possibility for the production of moldings from compressed Graphitexpandat is to perform the thermal expansion of graphite intercalation compound or the graphite salt in a suitably designed mold.
- the mold must allow the escape of gases.
- the demands on the purity of the graphite expander for the component according to the invention are roughly comparable to those for known applications of graphite expander, for example in sealing technology.
- material with a carbon content of at least 98% is usually used.
- graphite expandate with a lower carbon content of about 90% can also be used for the component according to the invention.
- the expanded graphite is compressed relatively little and therefore has only a relatively weak anisotropy of the thermal conductivity.
- the compression is to make a compromise between the requirement for low anisotropy on the one hand, which requires the lowest possible compression, and the demand for mechanical strength on the other hand, which is no longer reliably given too low compression.
- layers 4 of compressed graphite expandate with a density between 0.02 and at most 0.5 g / cm 3 have proven particularly suitable.
- the tempering body According to the first method, graphite expandate obtained by thermal expansion of an expandable graphite intercalation compound is compacted into a flat structure.
- the compression can be discontinuous or continuous.
- discontinuous mode of operation individual sheets of compressed graphite expandate are obtained. Preference is given to shaping near-net shape sheets, ie sheets having the dimensions desired for the tempering body. Otherwise, the resulting sheets must be trimmed to the desired dimensions.
- the compaction takes place in a roller mill or in a calender. An endless sheet of compressed graphite expandate is obtained, from which sheets of the desired dimensions are cut.
- Such plates of compressed graphite expander form in a first variant of the invention, the layer 4 of the tempering body according to the invention. Due to its low compression, the plate material has a considerable compression reserve and is easily malleable. Therefore, the heat transfer tubes 3 for the temperature control medium 2 can be pressed easily into the plate surface.
- Graphite expandate is characterized by a high adaptability to adjacent surfaces, so that a close connection and thus a low heat transfer resistance between plate material and tube wall is guaranteed.
- the plate material undergoes compaction.
- the plate should therefore be such that the density of the plate after pressing the tubes is between 0.02 and 0.5 g / cm 3 with regard to the compaction of the graphite expandate.
- the heat transfer tubes 3 can be pressed so deep into the plate that they are flush with the plate surface. This embodiment is shown in Figures 2a and 2b. In the embodiment shown in FIG. 2a, the heat transfer tubes 3 have been pressed into the surface of the plate facing the solar irradiation. Between the surface of the photocell layer 1 facing away from the solar radiation and the plate top surface surface optionally further functional layers 6 can be provided, the function of which will be explained below.
- the heat transfer tubes 3 are pressed into the back of the plate.
- the advantage of this embodiment is that a closed, continuous surface is available for the contact with the surface of the photocell layer 1 remote from the solar radiation.
- the distance to be overcome across the plane of the plate by heat conduction between the photocell layer 1 and the heat transfer tubes 3 is greater than in the embodiment according to FIG. 2a. Therefore, the graphite layer remaining between the heat transfer tubes 3 and the surface of the photocell layer 1 facing away from the solar radiation should be as thin as possible. For stability reasons, however, a residual thickness of 1 to 2 mm is required.
- the embedding of the heat transfer tubes 3 in the back of the plate is preferably used in such cases when it is possible to dispense with the optional functional layers 6 which increase the distance between the heat transfer tubes 3 and the photocell layer 1.
- the tubes can also be laid between two superimposed layers 4 ', 4 "made of expanded graphite, which are then pressed together
- the layer 4 consists here of the two superimposed, pressed layers 4', 4", between which the tubes 6 are embedded ( Figure 2c). It has been found that such composites of two compressed layers 4 ', 4 "of compressed graphite expandate are very stable, they can not be separated again at the interface of the layers 4', 4". Sheets of compressed graphite expandate typically can be made to thicknesses between 2 and 50 mm.
- the choice of plate thickness depends essentially on the diameter of the pipes to be embedded and, if necessary, according to stability requirements.
- the layer 4 is formed by thermal expansion of expandable Graphiteinlagerungsstatten (graphite salts) in a ventable mold, in which the tubes are inserted. Either the tubes are first inserted into the mold and the mold is then filled with the expandable graphite intercalation compound, or the mold is first at least partially filled, and then the heat transfer tubes 3 are inserted. The heating takes place in this procedure, preferably by means of microwaves because of the thermal inertia of the mold. Age- natively, the mold can also be heated inductively.
- the layer 4 of this variant of the tempering according to the invention consists of in the mold with inserted therein heat transfer tubes 3 expanded graphite.
- the layer 4 is produced directly on the back of the photocell layer 1.
- the heat transfer tubes 3 are placed and pressed expanded graphite to the desired layer thickness.
- the amount of expanded graphite should be such that after compression, a material having a density in the range of 0.02 to 0.5 g / cm 3 is present.
- thermo conductivity of the graphite expander surrounding the tubes Thanks to the high thermal conductivity of the graphite expander surrounding the tubes and the large area available for the heat transfer between the graphite expander of the layer 4 and the heat transfer tubes 3, a lower thermal conductivity of the tube material can be accepted in the tempering element according to the invention.
- a lower thermal conductivity of the tube material can be accepted in the tempering element according to the invention.
- plastic pipes sufficient heat transfer.
- the relatively expensive copper tubes through possibly cheaper and easier to process tubes made of non-metallic materials, e.g. plastic or graphite-filled plastic.
- the surface of the layer 4 facing away from the solar radiation is optionally provided with a heat-insulating layer 5 as the rear wall.
- a heat-insulating layer 5 as the rear wall.
- layers of mineral fibers, polyurethane foam or plasterboard are provided for this purpose.
- the photocell layer 1 is applied, for example, to the layer 4 in which the heat transfer tubes 3 are already embedded.
- a semifinished product can first be produced by optionally providing the photocell layer 1 facing surface of the layer 4 with an adhesion promoter layer. In the compressed Graphitexpandat Mrs 4 of this semi-finished the heat transfer tubes 3 are then embedded.
- a particularly advantageous variant of the present invention is characterized in that a layer 6 for lateral heat distribution is provided between the surface of the layer 4 of compressed graphite expander facing the photocell layer 1.
- Particularly useful for the formation of the layer 6 is graphite foil, because this is characterized by a preferred heat conduction in the plane and is therefore very well suited to laterally distribute the heat to be dissipated by the photocell layer 1 laterally.
- Graphite foil like the plates described above, is made by compacting graphite expandate, but the degree of compaction of the graphite expandate in a graphite foil is higher.
- the density of the graphite sheets used according to the invention is at least 0.5 g / cm 3 , preferably at least 0.7 g / cm 3 .
- the surface of the layer 4, in which optionally already the heat transfer tubes 3 are embedded, and the layer 6 forming graphite foil are connected to each other by lamination or gluing with a permanent at the operating temperature of the photovoltaic modules adhesive.
- Corresponding heat-resistant adhesives for example based on acrylate resins, epoxy resins, polyurethanes or cyanoacrylate are commercially available. Expediently, a glued composite is heated to at least operating temperature before use and held at this temperature until any outgassing processes of the adhesive that would impair the operation of the photovoltaic module have come to a standstill.
- conductive adhesives which contain conductive particles.
- Such adhesives are in particular customary and commercially available for the production of electronically conductive adhesive bonds. Since, in general, those additives which have an electrical conductivity, such as, for example, carbon black or metal powder, are also distinguished by high thermal conductivity, these adhesives are also suitable for improving the thermal conductivity of the adhesive bond.
- other thermally conductive additives can be used.
- a thermally conductive compound can also be produced by adding particles of high thermal conductivity to an adhesive which is advantageous, but which is only slightly thermally conductive, because of its thermal resistance, for example, graphite flakes or particles obtained by grinding graphite foil.
- the adhesive used is a resin or a binder which is pyrolyzed (carbonized) after joining graphite layer 4 and graphite foil.
- the residues remaining after the pyrolysis form thermally conductive carbon bridges between the adjoining surfaces of the layer 4 and the film forming the layer 6.
- Carbonizable, i. Pyrolysable resins or binders for example, when leaving behind a high carbon yield, are phenolic resins, epoxy resins, furan resins, polyurethane resins and pitches.
- Another advantage of this variant is that all volatile constituents of the resin are expelled during the pyrolysis, so that there is no danger of outgassing during operation. Because of the high thermal load during pyrolysis, this method is only applicable if the heat transfer tubes 3 are not yet embedded in the layer 4.
- the heat transfer tubes 3 When this method is used, the heat transfer tubes 3 must be pressed into the layer 4 at the same time, otherwise they will be over-compacted.
- a further advantage of coating the surface of the layer 4 with a layer 6 of graphite foil is that graphite foil is less porous than the less densely compressed graphite expandate of the layer 4 due to the higher densification of the graphite expandate, and therefore has a closed, relatively smooth surface , This ensures that a very good connection with the photocell layer 1 is achieved.
- a metal foil can be laminated or glued onto the surface of the layer 4 facing the photocell layer 1 as a functional layer 6 for the lateral heat distribution.
- a metal layer produced by electrodeposition or a metal or ceramic layer produced by chemical deposition, sputtering or vapor deposition is suitable for lateral heat distribution.
- Suitable ceramic materials for the functional layer 6 for lateral heat distribution are, for example, silicon carbide, aluminum nitride and aluminum oxide.
- the functional layer 6 can also be produced by pyrolysis of thin films of organic precursor compounds. Examples of ceramic layers of pyrolyzed organic precursors are silicon dioxide, silicon carbide or silicon carbonitride layers of pyrolyzed polysilanes or polysilazanes.
- the present invention further provides the provision of layered composite semifinished products for the tempering bodies according to the invention.
- These semi-finished products include one
- Layer 4 of compressed graphite expandate having a density of between 0.02 g / cm 3 and 0.5 g / cm 3 or a laminate of graphite foil 6 and a layer of compressed graphite expander 4, wherein the graphite foil 6 between the photocell layer 1 and the layer 4 is located from graphite expander.
- the graphite foil 6 has a density of at least 0.5 g / cm 3 , preferably between 1.0 and 1.8 g / cm 3 .
- the combination of graphite foil 6 and layer 4 takes place by means of one of the methods already described above for the preparation of the tempering body.
- the semifinished product contains an adhesion promoter layer between photocell layer 1 and graphite foil 6 or compressed graphite expander layer 4.
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Photovoltaic Devices (AREA)
Abstract
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102007053225A DE102007053225A1 (de) | 2007-11-06 | 2007-11-06 | Temperierkörper für Photovoltaik-Module |
PCT/EP2008/065070 WO2009060034A1 (fr) | 2007-11-06 | 2008-11-06 | Élément de thermorégulation pour modules photovoltaïques |
Publications (1)
Publication Number | Publication Date |
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EP2218112A1 true EP2218112A1 (fr) | 2010-08-18 |
Family
ID=40512881
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP08848550A Withdrawn EP2218112A1 (fr) | 2007-11-06 | 2008-11-06 | Élément de thermorégulation pour modules photovoltaïques |
Country Status (7)
Country | Link |
---|---|
US (1) | US20100294362A1 (fr) |
EP (1) | EP2218112A1 (fr) |
JP (1) | JP2011503863A (fr) |
KR (1) | KR20100096130A (fr) |
CN (1) | CN101849294A (fr) |
DE (1) | DE102007053225A1 (fr) |
WO (1) | WO2009060034A1 (fr) |
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US9337360B1 (en) | 2009-11-16 | 2016-05-10 | Solar Junction Corporation | Non-alloyed contacts for III-V based solar cells |
DE102010041822A1 (de) | 2010-09-30 | 2012-04-05 | Sgl Carbon Se | Thermosolares Verkleidungselement |
DE102010000657B4 (de) * | 2010-03-05 | 2014-02-27 | Hans Thoma | Solarmodul mit einer Schmelzfolie und einer Vergussmasse aus Polyurethan sowie Herstellverfahren hierfür |
US9214586B2 (en) | 2010-04-30 | 2015-12-15 | Solar Junction Corporation | Semiconductor solar cell package |
DE102010039279A1 (de) | 2010-08-12 | 2012-02-16 | Ripal Gmbh | Anordnung zur Kühlung von Solarzellen |
US8962988B2 (en) | 2011-02-03 | 2015-02-24 | Solar Junction Corporation | Integrated semiconductor solar cell package |
US8859892B2 (en) | 2011-02-03 | 2014-10-14 | Solar Junction Corporation | Integrated semiconductor solar cell package |
DE102011055311A1 (de) * | 2011-11-11 | 2013-05-16 | Bernd Schneider | Verfahren zur Herstellung von Wärmetauscherkörpern und Wärmetauscherkörper für plattenförmige Solarmodule |
DE102012200485A1 (de) * | 2012-01-13 | 2013-07-18 | Osram Opto Semiconductors Gmbh | Organische lichtemittierende Vorrichtung und Verfahren zum Prozessieren einer organischen lichtemittierenden Vorrichtung |
DE202012012684U1 (de) * | 2012-02-14 | 2013-08-13 | Stellaris Energy Solutions Gmbh & Co. Kg | Wärmeübertragungsanordnung |
US20150020866A1 (en) * | 2012-03-30 | 2015-01-22 | Saint-Gobain Glass France | Photovoltaic module with cooling device |
DE102012216823A1 (de) * | 2012-09-19 | 2014-03-20 | HQNB Produktions- und Verwertungsgesellschaft UG (haftungsbeschränkt) | Thermoanordnung, Verfahren zum Herstellen einer Thermoanordnung und Verfahren zum Montieren einer Thermoanordnung |
JP5446022B2 (ja) * | 2013-03-06 | 2014-03-19 | 国立大学法人東北大学 | 光電変換部材 |
US20160185074A1 (en) * | 2013-08-12 | 2016-06-30 | Seiji Kagawa | Heat-dissipating film, and its production method and apparatus |
US10090420B2 (en) | 2016-01-22 | 2018-10-02 | Solar Junction Corporation | Via etch method for back contact multijunction solar cells |
US9680035B1 (en) | 2016-05-27 | 2017-06-13 | Solar Junction Corporation | Surface mount solar cell with integrated coverglass |
FR3054755A1 (fr) * | 2016-07-28 | 2018-02-02 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Module photovoltaique et panneau photovoltaique comprenant de tels modules |
DE202017100275U1 (de) * | 2017-01-09 | 2017-03-15 | Imerys Tc | Thermisch-Fotovoltaisches Solarsystem, Anlagen, die termisch-fotovoltaische Solarsystem umfassen, und deren Verwendung |
EP4388653A1 (fr) * | 2021-08-19 | 2024-06-26 | Florian Scherer | Structure de toit et paroi pour production combinée d'énergie et de chaleur |
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DE4309700C2 (de) | 1993-03-25 | 1995-02-23 | Sigri Great Lakes Carbon Gmbh | Verfahren zur Herstellung eines Schichtstoffes aus Metall und Graphit |
JPH10283650A (ja) * | 1997-04-02 | 1998-10-23 | Matsushita Electric Ind Co Ltd | レーザー光発生装置、該装置を備えた光ディスク読み取り書き込み装置、及びレーザー光発生装置の製造方法 |
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ITUD20060163A1 (it) * | 2006-06-26 | 2007-12-27 | Stefano Buiani | Impianto fotovoltaico |
US7939747B2 (en) * | 2007-04-06 | 2011-05-10 | Bradley Owen Stimson | Solar heating method and apparatus |
US20090101306A1 (en) * | 2007-10-22 | 2009-04-23 | Reis Bradley E | Heat Exchanger System |
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2007
- 2007-11-06 DE DE102007053225A patent/DE102007053225A1/de not_active Withdrawn
-
2008
- 2008-11-06 CN CN200880114979A patent/CN101849294A/zh active Pending
- 2008-11-06 EP EP08848550A patent/EP2218112A1/fr not_active Withdrawn
- 2008-11-06 US US12/741,601 patent/US20100294362A1/en not_active Abandoned
- 2008-11-06 KR KR1020107012279A patent/KR20100096130A/ko not_active Application Discontinuation
- 2008-11-06 JP JP2010532590A patent/JP2011503863A/ja active Pending
- 2008-11-06 WO PCT/EP2008/065070 patent/WO2009060034A1/fr active Application Filing
Non-Patent Citations (1)
Title |
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See references of WO2009060034A1 * |
Also Published As
Publication number | Publication date |
---|---|
DE102007053225A1 (de) | 2009-05-07 |
JP2011503863A (ja) | 2011-01-27 |
WO2009060034A1 (fr) | 2009-05-14 |
US20100294362A1 (en) | 2010-11-25 |
KR20100096130A (ko) | 2010-09-01 |
CN101849294A (zh) | 2010-09-29 |
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