EP2216417B1 - Heizvorrichtung zur Erwärmung einer metallenen Platine - Google Patents

Heizvorrichtung zur Erwärmung einer metallenen Platine Download PDF

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Publication number
EP2216417B1
EP2216417B1 EP10000379.7A EP10000379A EP2216417B1 EP 2216417 B1 EP2216417 B1 EP 2216417B1 EP 10000379 A EP10000379 A EP 10000379A EP 2216417 B1 EP2216417 B1 EP 2216417B1
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EP
European Patent Office
Prior art keywords
heating
segments
plate
heating device
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP10000379.7A
Other languages
German (de)
English (en)
French (fr)
Other versions
EP2216417A3 (de
EP2216417A2 (de
Inventor
Ulrich Salamon
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
L Schuler GmbH
Original Assignee
L Schuler GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by L Schuler GmbH filed Critical L Schuler GmbH
Priority to PL10000379T priority Critical patent/PL2216417T3/pl
Publication of EP2216417A2 publication Critical patent/EP2216417A2/de
Publication of EP2216417A3 publication Critical patent/EP2216417A3/de
Application granted granted Critical
Publication of EP2216417B1 publication Critical patent/EP2216417B1/de
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C21—METALLURGY OF IRON
    • C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
    • C21D1/00—General methods or devices for heat treatment, e.g. annealing, hardening, quenching or tempering
    • C21D1/34—Methods of heating
    • C—CHEMISTRY; METALLURGY
    • C21—METALLURGY OF IRON
    • C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
    • C21D9/00—Heat treatment, e.g. annealing, hardening, quenching or tempering, adapted for particular articles; Furnaces therefor
    • C21D9/46—Heat treatment, e.g. annealing, hardening, quenching or tempering, adapted for particular articles; Furnaces therefor for sheet metals
    • C—CHEMISTRY; METALLURGY
    • C21—METALLURGY OF IRON
    • C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
    • C21D1/00—General methods or devices for heat treatment, e.g. annealing, hardening, quenching or tempering
    • C21D1/62—Quenching devices
    • C21D1/673—Quenching devices for die quenching

Definitions

  • the invention relates to a heating device for heating a metal circuit board, with a lower heating unit and an upper heating unit, which are adjustable between a closed, the board receiving between them heating position and a spaced-apart release position, each heating unit coming into contact with the board in contact heated heating plate has.
  • a component from a metal circuit board for example by means of a hydraulic press, and to harden the material, it is necessary to heat the circuit board before the forming process.
  • a heating to a temperature above the Ac3 temperature is necessary.
  • One of the ways to bring the board to the desired temperature is the so-called contact heat treatment.
  • the board is inserted into a heater, which has a lower and an upper heating unit. Both heating units each have a heatable heating plate. In a release position, the two heating units have moved apart and so far apart that the board on the Heating plate of the lower heating unit can be placed.
  • the heating units are moved relative to each other, that the heating plates of the heating units on opposite sides of the board abut against this and these clamp between them with little force.
  • the heating plates are heated, so that this is heated due to the contact with the board.
  • the heating units are moved apart in the release position and the hot board is removed for further processing.
  • Such a heater is from the document WO / 2007/013279 A1 known.
  • the invention has for its object to provide a heater of the type mentioned for heating a metal circuit board, in which damage to the board due to thermal expansion is reliably avoided.
  • the heating plate of the lower and / or the upper heating unit has a plurality of heating segments, which are arranged in a predetermined grid relative to each other and which are displaceable relative to each other in the plane defined by a contact surface between the heating segments and the board.
  • the basic idea is to divide the heating plate of the lower or upper heating unit and in particular the heating plates of both heating units into a plurality of heating segments and to store them so that they can follow the movements of the board due to the thermal expansion, wherein between the heating segments as a result of the sections of different thermal expansions a relative displacement occurs, which is allowed.
  • the board to be heated is clamped between the two heating plates of the heater with little force.
  • the board warms up, it expands sideways in all directions in its plate plane.
  • the individual heating segments which are in tension with the board under voltage, are preferably floating and can follow the movement of the board, whereby a relative displacement between the heating segments, but no displacement between the board and the heating segments occurs. In this way it is avoided that the surface of the board is damaged when heated.
  • the heating segments are slidably supported on a support plate and in particular rest on this.
  • the frictional force between the board and the heating segments must be greater than the frictional force between the heating segments and the support plate.
  • the heating segments can carry a first sliding layer, which consists of zirconium oxide (ZrO 2 ), while the support plate carries an additional second sliding layer, which consists for example of aluminum oxide (Al 2 O 3 ).
  • ZrO 2 zirconium oxide
  • Al 2 O 3 aluminum oxide
  • other sliding layer materials are also possible and it can also be provided that the first sliding layer of the heating segments and the second sliding layer of the carrier plate consist of the same material.
  • the shape of the heating plates is usually adapted to the shape of the board to be heated.
  • the board has the shape of a rectangular plate of constant thickness.
  • the heating plates of the two heating units each have a corresponding rectangular shape. It lends itself here to form the heating segments with a rectangular contact surface and so arranged at a mutual distance in a grid formed of a plurality of juxtaposed rows, so that the heating plate is formed from a matrix of juxtaposed heating segments.
  • the heating of the individual heating elements is preferably carried out by means of an integrated resistance heating.
  • the Dividing the heating plate into a plurality of heating elements gives the possibility of forming each heating element with an independently controllable resistance heating so that the user of the heating device can individually decide for each heating element whether and, if so, to what temperature he would like to heat up this heating segment. In this way it is possible to heat the heating plate and thus also the board to partially different, user-defined temperatures.
  • a plurality of heating elements with respect to the control of their heating power to form a heating segment group, wherein the heating segments of a heating segment group can be controlled by the user of the heating device in its entirety.
  • a plurality of heating segment groups are provided which are separately controllable with respect to their heating power.
  • the lower and / or the upper heating unit has a heat-insulating jacket.
  • the heat-insulating jacket can completely surround the carrier plate and, moreover, can also be arranged on the side of the carrier plate facing away from the heating plate.
  • the heating segments are preferably freely movable and stored in particular floating. When the board is heated to the desired temperature, the heating segments take a position displaced from their starting position relative to one another or displaced from which they must be returned to their original position. Since the heating segments do not have their own drive device, a restoring device is provided in a development of the invention, by means of which the heating segments displaced relative to one another can be returned to their starting position.
  • the restoring device comprises on each side of the heating plate, a push plate, which is adjustable via a piston-cylinder unit. The heating plate or its heating segments acting on the outside thrust plates push the heating segments back to the starting position so that the desired grid is reached and another board can be heated.
  • the FIG. 1 shows a schematic side view of a heating device 10 according to the invention.
  • the heating device 10 has a lower heating unit 11 and an upper heating unit 13.
  • the lower heating unit 11 is mounted on a base plate 12 and comprises a lower insulating plate 19, on which a support plate 18 is located.
  • a heating plate 16 is arranged, which consists of a plurality of heating segments 21.
  • the lower heating unit 11 furthermore has an insulation jacket 20 which completely surrounds the insulation panel 19 and the support panel 18.
  • an upper cross member 14 is provided, which can be raised and lowered via a plurality of adjusting devices 15 in the form of piston-cylinder units, as indicated by the double arrow V in FIG. 1 is indicated.
  • the upper heating unit 13 is mounted, which has the basically same structure as the lower heating unit 11, but is oriented so that its heating plate 16 facing downward in the direction of the lower heating unit 11.
  • FIG. 1 shows the heater 10 in a release position in which the two heating units 11 and 13 are moved apart and spaced apart in the vertical direction.
  • a metal board P can be inserted be like it is in Fig. 1 is indicated schematically.
  • the board P is placed on the heating plate 16 of the lower heating unit 11, whereupon the upper heating unit 13 is lowered by activation of the adjusting devices 15 to the lower heating unit 11 until the two heating units 11 and 13 between their heating plates 16, the board P with low Clamping pressure. Subsequently, the heating plates 16 are heated, whereby the board P can be brought to a predetermined temperature.
  • the heating plate 16 is composed of a plurality of heating segments 21, each having a substantially cuboid shape and are arranged in the form of a matrix of a plurality of juxtaposed rows of heating segments.
  • the heating plate 16 consists of three rows of sixteen heating segments, however, both the number of rows and the number of heating segments per row thereof may differ and is essentially dependent on the field of application of the heating device.
  • the heating segments 16 are relative to each other in a plane defined by the contact surface of the heating segments 16 with the board P plane E (s. Fig.2 ), ie, mounted perpendicular to the opening and closing direction V of the heater 10 freely displaceable by each being independently displaceable.
  • the heating segments 21 each have an integrated heating element 23 (s. Figure 4 ) in the form of a resistance heater.
  • the heating segments 21 can either be controlled and heated independently of one another, alternatively For example, it is possible to combine a plurality of heating segments 21 into a heating segment group and to bring these each to a predetermined temperature.
  • the heating segments 21 of the heating segment matrix are preferably subdivided into a plurality of heating segment groups which can be controlled independently of one another with respect to their heating power.
  • FIG. 4 shows a schematic representation of the mounting of the heating segments 21.
  • the support plate 18 is located on the insulation plate 19.
  • a second sliding layer 22 for example, of alumina (Al 2 O 3 ) is formed.
  • the heating segment 16 carries on its lower, the support plate 18 side facing a first sliding layer, which may for example consist of zirconium oxide (ZrO 2 ).
  • ZrO 2 zirconium oxide
  • the upper heating unit 13 has a basically similar structure, and differs from this in that the heating segment 21, which is arranged below the carrier plate 18, engages over and engages over the carrier plate 18 via a holder 24. Accordingly, the support plate 18 carries on its upper side facing away from the heating segment 21, the second sliding layer in particular of aluminum oxide (Al 2 O 3 ), while the first sliding layer 17 is disposed on the support plate 18 facing side of the holder 24. Also, this first sliding layer may for example consist of zirconium oxide (ZrO 2 ).
  • the heater 10 is opened by the two heating units 11 and 13 are lifted apart or apart. Subsequently, the board P is removed. In this state, the heating segments 21 have one from their home position FIG. 3 shifted mutual alignment, which is determined by the expansion of the board P during heating. For the heating of the next board, the heating segments 21 must be returned to their original position, ie the matrix arrangement.
  • restoring devices 25 are arranged on all four sides of the heating segment matrix, which comprise a thrust plate 26 and a piston-cylinder unit 27 connected thereto. Upon activation of all four restoring devices 25, the heating segments 21 are again pushed together so far that they assume their original arrangement in the form of a rectangular matrix.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Control Of Resistance Heating (AREA)
  • Tunnel Furnaces (AREA)
  • Surface Heating Bodies (AREA)
EP10000379.7A 2009-02-07 2010-01-16 Heizvorrichtung zur Erwärmung einer metallenen Platine Active EP2216417B1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PL10000379T PL2216417T3 (pl) 2009-02-07 2010-01-16 Urządzenie grzejne do nagrzewania płytki metalowej

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102009007826A DE102009007826A1 (de) 2009-02-07 2009-02-07 Heizvorrichtung zur Erwärmung einer metallenen Platine

Publications (3)

Publication Number Publication Date
EP2216417A2 EP2216417A2 (de) 2010-08-11
EP2216417A3 EP2216417A3 (de) 2013-07-24
EP2216417B1 true EP2216417B1 (de) 2014-05-14

Family

ID=42200370

Family Applications (1)

Application Number Title Priority Date Filing Date
EP10000379.7A Active EP2216417B1 (de) 2009-02-07 2010-01-16 Heizvorrichtung zur Erwärmung einer metallenen Platine

Country Status (5)

Country Link
EP (1) EP2216417B1 (es)
DE (1) DE102009007826A1 (es)
ES (1) ES2488122T3 (es)
PL (1) PL2216417T3 (es)
PT (1) PT2216417E (es)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
PL2439289T3 (pl) * 2010-10-05 2017-06-30 Schwartz Gmbh Sposób i piec do obróbki cieplnej przedmiotów obrabianych
DE102011007489B4 (de) * 2011-04-15 2013-08-22 Spaleck-Stevens Innotech Gmbh & Co. Kg Anordnung zum flächigen Beheizen und Kühlen
DE102011102167A1 (de) * 2011-05-21 2012-11-22 Volkswagen Aktiengesellschaft Verfahren zur Herstellung eines Formbauteils mit mindestens zwei Gefügebereichen unterschiedlicher Duktilität und Erwärmungseinrichtung
JP5932431B2 (ja) * 2012-03-28 2016-06-08 中央発條株式会社 加熱装置及び加熱方法
DE102014101539B9 (de) 2014-02-07 2016-08-11 Benteler Automobiltechnik Gmbh Warmformlinie und Verfahren zur Herstellung von warmumgeformten Blechprodukten
DE102014006763A1 (de) 2014-05-08 2015-02-26 Daimler Ag Vorrichtung zum Erwärmen eines Leichtmetallbauteils
DE102016101975B4 (de) 2016-02-04 2017-10-19 Voestalpine Metal Forming Gmbh Vorrichtung zum Herstellen von gehärteten Stahlbauteilen und Verfahren zum Härten
ITUA20161493A1 (it) * 2016-03-09 2017-09-09 Cometal Eng S P A Forno conduttivo per il riscaldamento di una billetta o una lastra, ad esempio di alluminio
CN107488776A (zh) * 2017-08-31 2017-12-19 江苏密斯欧智能科技有限公司 一种板件淬火机构

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60174832A (ja) * 1984-02-17 1985-09-09 Sumitomo Metal Ind Ltd クラツド鋼板の加熱方法
US7165435B1 (en) * 2005-07-25 2007-01-23 Gm Global Technology Operations, Inc. Conduction preheating for hot-formed sheet metal panels
WO2007013279A1 (ja) * 2005-07-27 2007-02-01 Kikuchi Co., Ltd. 加熱装置及び加熱方法

Also Published As

Publication number Publication date
EP2216417A3 (de) 2013-07-24
PT2216417E (pt) 2014-07-03
EP2216417A2 (de) 2010-08-11
ES2488122T3 (es) 2014-08-26
DE102009007826A1 (de) 2010-08-19
PL2216417T3 (pl) 2014-10-31

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