EP2216417B1 - Heater for heating a metal board - Google Patents

Heater for heating a metal board Download PDF

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Publication number
EP2216417B1
EP2216417B1 EP10000379.7A EP10000379A EP2216417B1 EP 2216417 B1 EP2216417 B1 EP 2216417B1 EP 10000379 A EP10000379 A EP 10000379A EP 2216417 B1 EP2216417 B1 EP 2216417B1
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EP
European Patent Office
Prior art keywords
heating
segments
plate
heating device
board
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EP10000379.7A
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German (de)
French (fr)
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EP2216417A3 (en
EP2216417A2 (en
Inventor
Ulrich Salamon
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L Schuler GmbH
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L Schuler GmbH
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Priority to PL10000379T priority Critical patent/PL2216417T3/en
Publication of EP2216417A2 publication Critical patent/EP2216417A2/en
Publication of EP2216417A3 publication Critical patent/EP2216417A3/en
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    • C—CHEMISTRY; METALLURGY
    • C21—METALLURGY OF IRON
    • C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
    • C21D1/00—General methods or devices for heat treatment, e.g. annealing, hardening, quenching or tempering
    • C21D1/34—Methods of heating
    • C—CHEMISTRY; METALLURGY
    • C21—METALLURGY OF IRON
    • C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
    • C21D9/00—Heat treatment, e.g. annealing, hardening, quenching or tempering, adapted for particular articles; Furnaces therefor
    • C21D9/46—Heat treatment, e.g. annealing, hardening, quenching or tempering, adapted for particular articles; Furnaces therefor for sheet metals
    • C—CHEMISTRY; METALLURGY
    • C21—METALLURGY OF IRON
    • C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
    • C21D1/00—General methods or devices for heat treatment, e.g. annealing, hardening, quenching or tempering
    • C21D1/62—Quenching devices
    • C21D1/673—Quenching devices for die quenching

Definitions

  • the invention relates to a heating device for heating a metal circuit board, with a lower heating unit and an upper heating unit, which are adjustable between a closed, the board receiving between them heating position and a spaced-apart release position, each heating unit coming into contact with the board in contact heated heating plate has.
  • a component from a metal circuit board for example by means of a hydraulic press, and to harden the material, it is necessary to heat the circuit board before the forming process.
  • a heating to a temperature above the Ac3 temperature is necessary.
  • One of the ways to bring the board to the desired temperature is the so-called contact heat treatment.
  • the board is inserted into a heater, which has a lower and an upper heating unit. Both heating units each have a heatable heating plate. In a release position, the two heating units have moved apart and so far apart that the board on the Heating plate of the lower heating unit can be placed.
  • the heating units are moved relative to each other, that the heating plates of the heating units on opposite sides of the board abut against this and these clamp between them with little force.
  • the heating plates are heated, so that this is heated due to the contact with the board.
  • the heating units are moved apart in the release position and the hot board is removed for further processing.
  • Such a heater is from the document WO / 2007/013279 A1 known.
  • the invention has for its object to provide a heater of the type mentioned for heating a metal circuit board, in which damage to the board due to thermal expansion is reliably avoided.
  • the heating plate of the lower and / or the upper heating unit has a plurality of heating segments, which are arranged in a predetermined grid relative to each other and which are displaceable relative to each other in the plane defined by a contact surface between the heating segments and the board.
  • the basic idea is to divide the heating plate of the lower or upper heating unit and in particular the heating plates of both heating units into a plurality of heating segments and to store them so that they can follow the movements of the board due to the thermal expansion, wherein between the heating segments as a result of the sections of different thermal expansions a relative displacement occurs, which is allowed.
  • the board to be heated is clamped between the two heating plates of the heater with little force.
  • the board warms up, it expands sideways in all directions in its plate plane.
  • the individual heating segments which are in tension with the board under voltage, are preferably floating and can follow the movement of the board, whereby a relative displacement between the heating segments, but no displacement between the board and the heating segments occurs. In this way it is avoided that the surface of the board is damaged when heated.
  • the heating segments are slidably supported on a support plate and in particular rest on this.
  • the frictional force between the board and the heating segments must be greater than the frictional force between the heating segments and the support plate.
  • the heating segments can carry a first sliding layer, which consists of zirconium oxide (ZrO 2 ), while the support plate carries an additional second sliding layer, which consists for example of aluminum oxide (Al 2 O 3 ).
  • ZrO 2 zirconium oxide
  • Al 2 O 3 aluminum oxide
  • other sliding layer materials are also possible and it can also be provided that the first sliding layer of the heating segments and the second sliding layer of the carrier plate consist of the same material.
  • the shape of the heating plates is usually adapted to the shape of the board to be heated.
  • the board has the shape of a rectangular plate of constant thickness.
  • the heating plates of the two heating units each have a corresponding rectangular shape. It lends itself here to form the heating segments with a rectangular contact surface and so arranged at a mutual distance in a grid formed of a plurality of juxtaposed rows, so that the heating plate is formed from a matrix of juxtaposed heating segments.
  • the heating of the individual heating elements is preferably carried out by means of an integrated resistance heating.
  • the Dividing the heating plate into a plurality of heating elements gives the possibility of forming each heating element with an independently controllable resistance heating so that the user of the heating device can individually decide for each heating element whether and, if so, to what temperature he would like to heat up this heating segment. In this way it is possible to heat the heating plate and thus also the board to partially different, user-defined temperatures.
  • a plurality of heating elements with respect to the control of their heating power to form a heating segment group, wherein the heating segments of a heating segment group can be controlled by the user of the heating device in its entirety.
  • a plurality of heating segment groups are provided which are separately controllable with respect to their heating power.
  • the lower and / or the upper heating unit has a heat-insulating jacket.
  • the heat-insulating jacket can completely surround the carrier plate and, moreover, can also be arranged on the side of the carrier plate facing away from the heating plate.
  • the heating segments are preferably freely movable and stored in particular floating. When the board is heated to the desired temperature, the heating segments take a position displaced from their starting position relative to one another or displaced from which they must be returned to their original position. Since the heating segments do not have their own drive device, a restoring device is provided in a development of the invention, by means of which the heating segments displaced relative to one another can be returned to their starting position.
  • the restoring device comprises on each side of the heating plate, a push plate, which is adjustable via a piston-cylinder unit. The heating plate or its heating segments acting on the outside thrust plates push the heating segments back to the starting position so that the desired grid is reached and another board can be heated.
  • the FIG. 1 shows a schematic side view of a heating device 10 according to the invention.
  • the heating device 10 has a lower heating unit 11 and an upper heating unit 13.
  • the lower heating unit 11 is mounted on a base plate 12 and comprises a lower insulating plate 19, on which a support plate 18 is located.
  • a heating plate 16 is arranged, which consists of a plurality of heating segments 21.
  • the lower heating unit 11 furthermore has an insulation jacket 20 which completely surrounds the insulation panel 19 and the support panel 18.
  • an upper cross member 14 is provided, which can be raised and lowered via a plurality of adjusting devices 15 in the form of piston-cylinder units, as indicated by the double arrow V in FIG. 1 is indicated.
  • the upper heating unit 13 is mounted, which has the basically same structure as the lower heating unit 11, but is oriented so that its heating plate 16 facing downward in the direction of the lower heating unit 11.
  • FIG. 1 shows the heater 10 in a release position in which the two heating units 11 and 13 are moved apart and spaced apart in the vertical direction.
  • a metal board P can be inserted be like it is in Fig. 1 is indicated schematically.
  • the board P is placed on the heating plate 16 of the lower heating unit 11, whereupon the upper heating unit 13 is lowered by activation of the adjusting devices 15 to the lower heating unit 11 until the two heating units 11 and 13 between their heating plates 16, the board P with low Clamping pressure. Subsequently, the heating plates 16 are heated, whereby the board P can be brought to a predetermined temperature.
  • the heating plate 16 is composed of a plurality of heating segments 21, each having a substantially cuboid shape and are arranged in the form of a matrix of a plurality of juxtaposed rows of heating segments.
  • the heating plate 16 consists of three rows of sixteen heating segments, however, both the number of rows and the number of heating segments per row thereof may differ and is essentially dependent on the field of application of the heating device.
  • the heating segments 16 are relative to each other in a plane defined by the contact surface of the heating segments 16 with the board P plane E (s. Fig.2 ), ie, mounted perpendicular to the opening and closing direction V of the heater 10 freely displaceable by each being independently displaceable.
  • the heating segments 21 each have an integrated heating element 23 (s. Figure 4 ) in the form of a resistance heater.
  • the heating segments 21 can either be controlled and heated independently of one another, alternatively For example, it is possible to combine a plurality of heating segments 21 into a heating segment group and to bring these each to a predetermined temperature.
  • the heating segments 21 of the heating segment matrix are preferably subdivided into a plurality of heating segment groups which can be controlled independently of one another with respect to their heating power.
  • FIG. 4 shows a schematic representation of the mounting of the heating segments 21.
  • the support plate 18 is located on the insulation plate 19.
  • a second sliding layer 22 for example, of alumina (Al 2 O 3 ) is formed.
  • the heating segment 16 carries on its lower, the support plate 18 side facing a first sliding layer, which may for example consist of zirconium oxide (ZrO 2 ).
  • ZrO 2 zirconium oxide
  • the upper heating unit 13 has a basically similar structure, and differs from this in that the heating segment 21, which is arranged below the carrier plate 18, engages over and engages over the carrier plate 18 via a holder 24. Accordingly, the support plate 18 carries on its upper side facing away from the heating segment 21, the second sliding layer in particular of aluminum oxide (Al 2 O 3 ), while the first sliding layer 17 is disposed on the support plate 18 facing side of the holder 24. Also, this first sliding layer may for example consist of zirconium oxide (ZrO 2 ).
  • the heater 10 is opened by the two heating units 11 and 13 are lifted apart or apart. Subsequently, the board P is removed. In this state, the heating segments 21 have one from their home position FIG. 3 shifted mutual alignment, which is determined by the expansion of the board P during heating. For the heating of the next board, the heating segments 21 must be returned to their original position, ie the matrix arrangement.
  • restoring devices 25 are arranged on all four sides of the heating segment matrix, which comprise a thrust plate 26 and a piston-cylinder unit 27 connected thereto. Upon activation of all four restoring devices 25, the heating segments 21 are again pushed together so far that they assume their original arrangement in the form of a rectangular matrix.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Control Of Resistance Heating (AREA)
  • Tunnel Furnaces (AREA)
  • Surface Heating Bodies (AREA)

Description

Die Erfindung betrifft eine Heizvorrichtung zur Erwärmung einer metallenen Platine, mit einer unteren Heizeinheit und einer oberen Heizeinheit, die zwischen einer geschlossenen, die Platine zwischen sich aufnehmenden Heizstellung und einer voneinander beabstandeten Freigabestellung verstellbar sind, wobei jede Heizeinheit eine mit der Platine in Kontakt tretende, beheizbare Heizplatte aufweist.The invention relates to a heating device for heating a metal circuit board, with a lower heating unit and an upper heating unit, which are adjustable between a closed, the board receiving between them heating position and a spaced-apart release position, each heating unit coming into contact with the board in contact heated heating plate has.

Um ein Bauteil aus einer metallenen Platine beispielsweise mittels einer hydraulischen Presse umzuformen und um das Material zu härten, ist es notwendig, die Platine vor dem Umformvorgang zu erwärmen. Bei einer üblichen Stahlplatine ist dazu eine Erwärmung auf eine Temperatur oberhalb der Ac3-Temperatur notwendig. Eine der Möglichkeiten, um die Platine auf die gewünschte Temperatur zu bringen, ist die sogenannte Kontaktwärmebehandlung. Dazu wird die Platine in eine Heizvorrichtung eingelegt, die eine untere und eine obere Heizeinheit besitzt. Beide Heizeinheiten besitzen jeweils eine beheizbare Heizplatte. In einer Freigabestellung sind die beiden Heizeinheiten auseinandergefahren und soweit voneinander beabstandet, dass die Platine auf die Heizplatte der unteren Heizeinheit aufgelegt werden kann. Dann werden die Heizeinheiten so relativ zueinander verfahren, dass die Heizplatten der Heizeinheiten auf gegenüberliegenden Seiten der Platine auf dieser anliegen und diese zwischen sich mit geringer Kraft einspannen. In dieser geschlossenen Heizstellung werden die Heizplatten erwärmt, so dass aufgrund des Kontaktes mit der Platine auch diese erwärmt wird. Nachdem die Platine eine ausreichende Temperatur erreicht hat, werden die Heizeinheiten in die Freigabestellung auseinander gefahren und die heiße Platine wird zur weiteren Bearbeitung entnommen.In order to reshape a component from a metal circuit board, for example by means of a hydraulic press, and to harden the material, it is necessary to heat the circuit board before the forming process. In a conventional steel board to a heating to a temperature above the Ac3 temperature is necessary. One of the ways to bring the board to the desired temperature is the so-called contact heat treatment. For this purpose, the board is inserted into a heater, which has a lower and an upper heating unit. Both heating units each have a heatable heating plate. In a release position, the two heating units have moved apart and so far apart that the board on the Heating plate of the lower heating unit can be placed. Then the heating units are moved relative to each other, that the heating plates of the heating units on opposite sides of the board abut against this and these clamp between them with little force. In this closed heating position, the heating plates are heated, so that this is heated due to the contact with the board. After the board has reached a sufficient temperature, the heating units are moved apart in the release position and the hot board is removed for further processing.

Eine solche Heizvorrichtung ist aus der Druckschrift WO/2007/013279 A1 bekannt.Such a heater is from the document WO / 2007/013279 A1 known.

Bei der Erwärmung der Platine dehnt sich diese insbesondere in ihrer Plattenebene aus. Diese Wärmedehnung ist von der Größe der Platine, der Art des Materials und der Erwärmungstemperatur abhängig und kann bis zu 50mm betragen. Aufgrund der Ausdehnung der Platine kommt es an der Kontaktfläche zwischen der Platine und der jeweiligen Heizplatte der unteren und oberen Heizeinheit zu einer Relativbewegung zwischen diesen Bauteilen, die im Randbereich der Platine am größten ist. Da die Heizplatten gegen die Platine gespannt sind, treten in der Kontaktfläche aufgrund dieser Relativbewegung große Reibungskräfte auf, die dazu führen können, dass die Oberfläche der Platine beschädigt wird. Dies ist insbesondere dann nachteilig, wenn die Platine eine außenseitige Beschichtung trägt.When heating the board, this expands in particular in their plate plane. This thermal expansion depends on the size of the board, the type of material and the heating temperature and can be up to 50mm. Due to the expansion of the board occurs at the contact surface between the board and the respective heating plate of the lower and upper heating unit to a relative movement between these components, which is greatest in the edge region of the board. Since the heating plates are stretched against the board, occur in the contact surface due to this relative movement large frictional forces, which can cause the surface of the board is damaged. This is particularly disadvantageous if the board carries an outside coating.

Der Erfindung liegt die Aufgabe zugrunde, eine Heizvorrichtung der genannten Art zur Erwärmung einer metallenen Platine zu schaffen, bei der eine Beschädigung der Platine infolge Wärmedehnungen zuverlässig vermieden ist.The invention has for its object to provide a heater of the type mentioned for heating a metal circuit board, in which damage to the board due to thermal expansion is reliably avoided.

Diese Aufgabe wird erfindungsgemäß durch eine Heizvorrichtung mit den Merkmalen des Anspruchs 1 gelöst. Dabei ist vorgesehen, dass die Heizplatte der unteren und/oder der oberen Heizeinheit eine Vielzahl von Heizsegmenten aufweist, die in einem vorbestimmten Raster relativ zueinander angeordnet sind und die in der von einer Kontaktfläche zwischen den Heizsegmenten und der Platine definierten Ebene relativ zueinander verschiebbar sind.This object is achieved by a heating device with the features of claim 1. It is provided that the heating plate of the lower and / or the upper heating unit has a plurality of heating segments, which are arranged in a predetermined grid relative to each other and which are displaceable relative to each other in the plane defined by a contact surface between the heating segments and the board.

Erfindungsgemäß wird von der Grundüberlegung ausgegangen, die Heizplatte der unteren oder der oberen Heizeinheit und insbesondere die Heizplatten beider Heizeinheiten in eine Vielzahl von Heizsegmenten zu unterteilen und diese so zu lagern, dass sie den Bewegungen der Platine infolge der Wärmedehnungen folgen können, wobei zwischen den Heizsegmenten infolge der abschnittsweise unterschiedlichen Wärmedehnungen eine Relativverschiebung auftritt, die zugelassen wird.According to the invention, the basic idea is to divide the heating plate of the lower or upper heating unit and in particular the heating plates of both heating units into a plurality of heating segments and to store them so that they can follow the movements of the board due to the thermal expansion, wherein between the heating segments as a result of the sections of different thermal expansions a relative displacement occurs, which is allowed.

Auch bei der erfindungsgemäßen Heizvorrichtung wird die zu erwärmende Platine zwischen den beiden Heizplatten der Heizvorrichtung mit geringer Kraft eingespannt. Bei Erwärmung der Platine dehnt sich diese in ihrer Plattenebene in allen Richtungen seitlich aus. Die einzelnen Heizsegmente, die mit der Platine unter Spannung in Anlage stehen, sind vorzugsweise schwimmend gelagert und können der Bewegung der Platine folgen, wodurch zwar eine relative Verschiebung zwischen den Heizsegmenten, aber keine Verschiebung zwischen der Platine und den Heizsegmenten auftritt. Auf diese Weise ist vermieden, dass die Oberfläche der Platine bei ihrer Erwärmung beschädigt wird.Also in the heating device according to the invention, the board to be heated is clamped between the two heating plates of the heater with little force. When the board warms up, it expands sideways in all directions in its plate plane. The individual heating segments, which are in tension with the board under voltage, are preferably floating and can follow the movement of the board, whereby a relative displacement between the heating segments, but no displacement between the board and the heating segments occurs. In this way it is avoided that the surface of the board is damaged when heated.

In einer möglichen Ausgestaltung der Erfindung ist vorgesehen, dass die Heizsegmente auf einer Trägerplatte verschieblich aufgelagert sind und insbesondere auf dieser aufliegen. Damit die Heizsegmente der Bewegung der Platine infolge ihrer Erwärmung folgen, muss die Reibungskraft zwischen der Platine und den Heizsegmenten größer sein als die Reibungskraft zwischen den Heizsegmenten und der Trägerplatte. In bevorzugter Ausgestaltung der Erfindung kann deshalb vorgesehen sein, dass zwischen der Trägerplatte und den Heizsegmenten zumindest eine Gleitschicht angeordnet ist. Beispielsweise können die Heizsegmente eine 1. Gleitschicht tragen, die aus Zirkoniumoxid (ZrO2) besteht, während die Trägerplatte eine zusätzliche 2. Gleitschicht trägt, die beispielsweise aus Aluminiumoxid (Al2O3) besteht. Es sind jedoch auch andere Gleitschichtmaterialien möglich und es kann auch vorgesehen sein, dass die 1. Gleitschicht der Heizsegmente und die 2. Gleitschicht der Trägerplatte aus dem gleichen Material bestehen.In a possible embodiment of the invention it is provided that the heating segments are slidably supported on a support plate and in particular rest on this. In order for the heating segments to follow the movement of the board due to its heating, the frictional force between the board and the heating segments must be greater than the frictional force between the heating segments and the support plate. In a preferred embodiment of the invention can therefore be provided that between the support plate and the heating segments at least one sliding layer is arranged. For example, the heating segments can carry a first sliding layer, which consists of zirconium oxide (ZrO 2 ), while the support plate carries an additional second sliding layer, which consists for example of aluminum oxide (Al 2 O 3 ). However, other sliding layer materials are also possible and it can also be provided that the first sliding layer of the heating segments and the second sliding layer of the carrier plate consist of the same material.

Die Form der Heizplatten ist üblicherweise an die Form der zu erwärmenden Platine angepasst. In der Regel besitzt die Platine die Form einer rechteckigen Platte konstanter Dicke. In diesem Fall besitzen auch die Heizplatten der beiden Heizeinheiten jeweils eine entsprechende rechteckige Form. Es bietet sich dabei an, die Heizsegmente mit einer rechteckigen Kontaktfläche auszubilden und so in gegenseitigen Abstand in einem aus mehreren nebeneinander liegenden Reihen gebildeten Raster anzuordnen, so dass die Heizplatte aus einer Matrix von nebeneinander angeordneten Heizsegmenten gebildet ist.The shape of the heating plates is usually adapted to the shape of the board to be heated. In general, the board has the shape of a rectangular plate of constant thickness. In this case, also have the heating plates of the two heating units each have a corresponding rectangular shape. It lends itself here to form the heating segments with a rectangular contact surface and so arranged at a mutual distance in a grid formed of a plurality of juxtaposed rows, so that the heating plate is formed from a matrix of juxtaposed heating segments.

Die Erwärmung der einzelnen Heizelemente erfolgt vorzugsweise mittels einer integrierten Widerstandsheizung. Die Unterteilung der Heizplatte in eine Vielzahl von Heizelementen gibt die Möglichkeit, jedes Heizelement mit einer unabhängig ansteuerbaren Widerstandsheizung auszubilden, so dass der Benutzer der Heizvorrichtung für jedes Heizelement individuell entscheiden kann, ob und gegebenenfalls auf welche Temperatur er dieses Heizsegment aufheizen möchte. Auf diese Weise ist es möglich, die Heizplatte und damit auch die Platine auf bereichsweise unterschiedliche, vom Benutzer festzulegende Temperaturen zu erwärmen.The heating of the individual heating elements is preferably carried out by means of an integrated resistance heating. The Dividing the heating plate into a plurality of heating elements gives the possibility of forming each heating element with an independently controllable resistance heating so that the user of the heating device can individually decide for each heating element whether and, if so, to what temperature he would like to heat up this heating segment. In this way it is possible to heat the heating plate and thus also the board to partially different, user-defined temperatures.

Um den steuerungstechnischen Aufwand zu verringern, kann alternativ auch vorgesehen sein, mehrere Heizelemente bezüglich der Steuerung ihrer Heizleistung zu einer Heizsegment-Gruppe zusammen zu fassen, wobei die Heizsegmente einer Heizsegment-Gruppe vom Benutzer der Heizvorrichtung in ihrer Gesamtheit angesteuert werden können. Vorzugsweise sind mehrere Heizsegment-Gruppen vorgesehen, die bezüglich ihrer Heizleistung separat ansteuerbar sind. Auf diese Weise ist zwar keine so feine Temperaturabstufung innerhalb der Heizplatte zu erreichen, wie es bei den einzeln ansteuerbaren Heizsegmenten der Fall ist, jedoch reicht es in der Praxis üblicherweise aus, die Platine in zwei bis fünf Bereiche unterschiedlicher Erwärmung zu erteilen. Dies lässt sich mit den genannten Heizsegment-Gruppen zuverlässig erreichen.In order to reduce the control engineering effort, it may alternatively also be provided to combine a plurality of heating elements with respect to the control of their heating power to form a heating segment group, wherein the heating segments of a heating segment group can be controlled by the user of the heating device in its entirety. Preferably, a plurality of heating segment groups are provided which are separately controllable with respect to their heating power. In this way, although not so fine a temperature gradation within the hot plate to achieve, as is the case with the individually controllable heating segments, but in practice it is usually sufficient to give the board in two to five areas of different heating. This can be reliably achieved with the mentioned heating segment groups.

Um die Wärmeverluste der Heizvorrichtung möglichst gering zu halten, kann in Weiterbildung der Erfindung vorgesehen sein, dass die untere und/oder die obere Heizeinheit einen wärmeisolierenden Mantel besitzt. Der wärmeisolierende Mantel kann die Trägerplatte vollständig umgeben und darüber hinaus auch auf der der Heizplatte abgewandten Seite der Trägerplatte angeordnet sein.In order to keep the heat losses of the heater as low as possible, it can be provided in a further development of the invention that the lower and / or the upper heating unit has a heat-insulating jacket. The heat-insulating jacket can completely surround the carrier plate and, moreover, can also be arranged on the side of the carrier plate facing away from the heating plate.

Die Heizsegmente sind vorzugsweise frei beweglich und insbesondere schwimmend gelagert. Wenn die Platine auf die gewünschte Temperatur aufgeheizt ist, nehmen die Heizsegmente eine aus ihrer Ausgangsstellung relativ zueinander verstellte bzw. verschobene Position ein, aus der sie wieder in ihre Ausgangslage zurückgestellt werden müssen. Da die Heizsegmente keine eigene Antriebsvorrichtung besitzen, ist in Weiterbildung der Erfindung eine Rückstelleinrichtung vorgesehen, mittels der die relativ zueinander verschobenen Heizsegmente wieder in ihre Ausgangsstellung zurückgestellt werden können. Vorzugsweise umfasst die Rückstelleinrichtung auf jeder Seite der Heizplatte eine Schubplatte, die über eine Kolben-Zylinder-Einheit verstellbar ist. Die die Heizplatte bzw. deren Heizsegmente außenseitig beaufschlagenden Schubplatten schieben die Heizsegmente wieder so in die Ausgangsstellung zurück, dass das gewünschte Raster erreicht ist und eine weitere Platine erwärmt werden kann.The heating segments are preferably freely movable and stored in particular floating. When the board is heated to the desired temperature, the heating segments take a position displaced from their starting position relative to one another or displaced from which they must be returned to their original position. Since the heating segments do not have their own drive device, a restoring device is provided in a development of the invention, by means of which the heating segments displaced relative to one another can be returned to their starting position. Preferably, the restoring device comprises on each side of the heating plate, a push plate, which is adjustable via a piston-cylinder unit. The heating plate or its heating segments acting on the outside thrust plates push the heating segments back to the starting position so that the desired grid is reached and another board can be heated.

Weitere Einzelheiten und Merkmale der Erfindung sind aus der folgenden Beschreibung eines Ausführungsbeispiels unter Bezugnahme auf die Zeichnung ersichtlich. Es zeigen:

Fig. 1
eine schematische Seitenansicht der erfindungsge- mäßen Heizvorrichtung,
Fig. 2
eine vergrößerte schematische Seitenansicht der unteren Heizeinheit,
Fig. 3
eine Aufsicht auf die Heizplatte mit den Heizseg- menten,
Fig. 4
eine schematische Darstellung der verschieblichen Lagerung der Heizsegmente und
Fig. 5
eine Aufsicht auf die Heizsegmente mit einer Rückstelleinrichtung.
Further details and features of the invention will become apparent from the following description of an embodiment with reference to the drawings. Show it:
Fig. 1
a schematic side view of the inventive heater,
Fig. 2
an enlarged schematic side view of the lower heating unit,
Fig. 3
a view of the heating plate with the Heizseg- elements,
Fig. 4
a schematic representation of the displaceable mounting of the heating segments and
Fig. 5
a plan view of the heating segments with a return device.

Die Figur 1 zeigt eine schematische Seitenansicht einer erfindungsgemäßen Heizvorrichtung 10. Die Heizvorrichtung 10 weist eine untere Heizeinheit 11 und eine obere Heizeinheit 13 auf. Die untere Heizeinheit 11 ist auf eine Grundplatte 12 aufgelagert und umfasst eine untere Isolationsplatte 19, auf der eine Trägerplatte 18 liegt. Auf der Trägerplatte 18 ist eine Heizplatte 16 angeordnet, die aus einer Vielzahl von Heizsegmenten 21 besteht. Die untere Heizeinheit 11 weist ferner einen die Isolationsplatte 19 und die Trägerplatte 18 vorzugsweise vollständig umgebenden Isolationsmantel 20 auf.The FIG. 1 shows a schematic side view of a heating device 10 according to the invention. The heating device 10 has a lower heating unit 11 and an upper heating unit 13. The lower heating unit 11 is mounted on a base plate 12 and comprises a lower insulating plate 19, on which a support plate 18 is located. On the support plate 18, a heating plate 16 is arranged, which consists of a plurality of heating segments 21. The lower heating unit 11 furthermore has an insulation jacket 20 which completely surrounds the insulation panel 19 and the support panel 18.

Mit Abstand oberhalb der unteren Heizeinheit 11 ist ein oberer Querträger 14 vorgesehen, der über mehrere Verstellvorrichtungen 15 in Form von Kolben-Zylinder-Einheiten angehoben und abgesenkt werden kann, wie es durch den Doppelpfeil V in Figur 1 angedeutet ist. Am oberen Querträger 14 ist die obere Heizeinheit 13 gelagert, die den grundsätzlich gleichen Aufbau wie die untere Heizeinheit 11 besitzt, jedoch so ausgerichtet ist, dass ihre Heizplatte 16 nach unten in Richtung der unteren Heizeinheit 11 weist.At a distance above the lower heating unit 11, an upper cross member 14 is provided, which can be raised and lowered via a plurality of adjusting devices 15 in the form of piston-cylinder units, as indicated by the double arrow V in FIG. 1 is indicated. At the upper cross member 14, the upper heating unit 13 is mounted, which has the basically same structure as the lower heating unit 11, but is oriented so that its heating plate 16 facing downward in the direction of the lower heating unit 11.

Figur 1 zeigt die Heizvorrichtung 10 in einer Freigabestellung, in der die beiden Heizeinheiten 11 und 13 auseinandergefahren und in vertikaler Richtung voneinander beabstandet sind. In den Zwischenraum zwischen die beiden Heizeinheiten 11 und 13 kann eine metallene Platine P eingelegt werden, wie es in Fig. 1 schematisch angedeutet ist. Üblicherweise wird die Platine P auf die Heizplatte 16 der unteren Heizeinheit 11 aufgelegt, woraufhin die obere Heizeinheit 13 durch Aktivierung der Verstellvorrichtungen 15 auf die untere Heizeinheit 11 soweit abgesenkt wird, bis die beiden Heizeinheiten 11 und 13 zwischen ihren Heizplatten 16 die Platine P mit geringem Druck einspannen. Anschließend werden die Heizplatten 16 erwärmt, wodurch auch die Platine P auf eine vorbestimmte Temperatur gebracht werden kann. FIG. 1 shows the heater 10 in a release position in which the two heating units 11 and 13 are moved apart and spaced apart in the vertical direction. In the space between the two heating units 11 and 13, a metal board P can be inserted be like it is in Fig. 1 is indicated schematically. Usually, the board P is placed on the heating plate 16 of the lower heating unit 11, whereupon the upper heating unit 13 is lowered by activation of the adjusting devices 15 to the lower heating unit 11 until the two heating units 11 and 13 between their heating plates 16, the board P with low Clamping pressure. Subsequently, the heating plates 16 are heated, whereby the board P can be brought to a predetermined temperature.

Die Figuren 2 und 3 zeigen, dass die Heizplatte 16 aus einer Vielzahl von Heizsegmenten 21 aufgebaut ist, die jeweils eine im wesentlichen quaderförmige Gestalt besitzen und in Form einer Matrix aus mehreren nebeneinander angeordneten Reihen von Heizsegmenten angeordnet sind. Im dargestellten Ausführungsbeispiel besteht die Heizplatte 16 aus drei Reihen zu jeweils sechzehn Heizsegmenten, jedoch kann sowohl die Anzahl der Reihen als auch die Anzahl der Heizsegmente pro Reihe davon abweichen und ist im wesentlichen von dem Einsatzgebiet der Heizvorrichtung abhängig.The Figures 2 and 3 show that the heating plate 16 is composed of a plurality of heating segments 21, each having a substantially cuboid shape and are arranged in the form of a matrix of a plurality of juxtaposed rows of heating segments. In the illustrated embodiment, the heating plate 16 consists of three rows of sixteen heating segments, however, both the number of rows and the number of heating segments per row thereof may differ and is essentially dependent on the field of application of the heating device.

Die Heizsegmente 16 sind relativ zueinander in einer von der Kontaktfläche der Heizsegmente 16 mit der Platine P aufgespannten Ebene E (s.Fig.2), d.h. senkrecht zur Öffnungs- und Schließrichtung V der Heizvorrichtung 10 frei verschieblich gelagert, indem sie jeweils unabhängig voneinander verschiebbar sind.The heating segments 16 are relative to each other in a plane defined by the contact surface of the heating segments 16 with the board P plane E (s. Fig.2 ), ie, mounted perpendicular to the opening and closing direction V of the heater 10 freely displaceable by each being independently displaceable.

Die Heizsegmente 21 besitzen jeweils ein integriertes Heizelement 23 (s.Fig.4) in Form einer Widerstandsheizung. Dabei können die Heizsegmente 21 entweder alle unabhängig voneinander angesteuert und aufgeheizt werden, alternativ ist es möglich, mehrere Heizsegmente 21 zu einer Heizsegment-Gruppe zusammen zu fassen und diese jeweils auf eine vorbestimmte Temperatur zu bringen. Vorzugsweise sind die Heizsegmente 21 der Heizsegment-Matrix in mehrere Heizsegment-Gruppen unterteilt, die unabhängig voneinander hinsichtlich ihrer Heizleistung angesteuert werden können.The heating segments 21 each have an integrated heating element 23 (s. Figure 4 ) in the form of a resistance heater. In this case, the heating segments 21 can either be controlled and heated independently of one another, alternatively For example, it is possible to combine a plurality of heating segments 21 into a heating segment group and to bring these each to a predetermined temperature. The heating segments 21 of the heating segment matrix are preferably subdivided into a plurality of heating segment groups which can be controlled independently of one another with respect to their heating power.

Figur 4 zeigt eine schematische Darstellung der Lagerung der Heizsegmente 21. Bei der unteren Heizeinheit 11 liegt die Trägerplatte 18 auf der Isolationsplatte 19. Auf der Oberseite der Trägerplatte 18 ist eine 2. Gleitschicht 22 beispielsweise aus Aluminiumoxid (Al2O3) ausgebildet. Das Heizsegment 16 trägt auf seiner unteren, der Trägerplatte 18 zugewandten Seite eine 1. Gleitschicht, die beispielsweise aus Zirkoniumoxid (ZrO2) bestehen kann. Wie Figur 4 zeigt, liegen die beiden Gleitschichten 17 und 22 aufeinander, wodurch eine leichtgängige Verschiebung des Heizsegmentes 21 relativ zur Trägerplatte 18 gewährleistet ist. FIG. 4 shows a schematic representation of the mounting of the heating segments 21. In the lower heating unit 11, the support plate 18 is located on the insulation plate 19. On the upper side of the support plate 18, a second sliding layer 22, for example, of alumina (Al 2 O 3 ) is formed. The heating segment 16 carries on its lower, the support plate 18 side facing a first sliding layer, which may for example consist of zirconium oxide (ZrO 2 ). As FIG. 4 shows, the two sliding layers 17 and 22 to each other, whereby a smooth displacement of the heating segment 21 is ensured relative to the support plate 18.

Die obere Heizeinheit 13 besitzt einen prinzipiell gleichartigen Aufbau, und unterscheidet sich von diesem dadurch, dass das Heizsegment 21, das unterhalb der Trägerplatte 18 angeordnet ist, über einen Halter 24 die Trägerplatte 18 durchgreift und übergreift. Dementsprechend trägt die Trägerplatte 18 auf ihrer oberen, dem Heizsegment 21 abgewandten Seite die 2. Gleitschicht insbesondere aus Aluminiumoxid (Al2O3), während die 1. Gleitschicht 17 auf der der Trägerplatte 18 zugewandten Seite des Halters 24 angeordnet ist. Auch diese 1. Gleitschicht kann beispielsweise aus Zirkoniumoxid (ZrO2) bestehen.The upper heating unit 13 has a basically similar structure, and differs from this in that the heating segment 21, which is arranged below the carrier plate 18, engages over and engages over the carrier plate 18 via a holder 24. Accordingly, the support plate 18 carries on its upper side facing away from the heating segment 21, the second sliding layer in particular of aluminum oxide (Al 2 O 3 ), while the first sliding layer 17 is disposed on the support plate 18 facing side of the holder 24. Also, this first sliding layer may for example consist of zirconium oxide (ZrO 2 ).

Wenn die Platine P in die Heizvorrichtung 10 zwischen den Heizplatten 16 der beiden Heizeinheiten 11 und 13 eingespannt ist und erwärmt wird, dehnt sie sich in ihrer Plattenebene aus. Dies führt zu einer Verschiebung der Heizsegmente 21 in einer zur Plattenebene parallelen Ebene, da die Reibungskräfte an der Kontaktfläche eines Heizsegmentes 21 mit der Platine P größer sind als die Reibungskräfte des Heizsegmentes 21 an der Trägerplatte 18, da diese Reibungskräfte durch die Gleitschichten 17, 22 wesentlich herabgesetzt sind.When the board P is clamped in the heater 10 between the heating plates 16 of the two heating units 11 and 13 is and warms, it expands in its plate plane. This leads to a displacement of the heating segments 21 in a plane parallel to the plate plane, since the frictional forces at the contact surface of a heating segment 21 with the board P are greater than the frictional forces of the heating segment 21 on the support plate 18, since these frictional forces by the sliding layers 17, 22nd are significantly reduced.

Nach Beendigung der Erwärmung der Platine P wird die Heizvorrichtung 10 geöffnet, indem die beiden Heizeinheiten 11 und 13 voneinander abgehoben bzw. auseinandergefahren werden. Anschließend wird die Platine P entnommen. In diesem Zustand weisen die Heizsegmente 21 eine aus ihrer Ausgangsposition gemäß Figur 3 verschobene gegenseitige Ausrichtung auf, die durch die Ausdehnung der Platine P bei der Erwärmung bestimmt ist. Für die Erwärmung der nächsten Platine müssen die Heizsegmente 21 wieder in ihre Ausgangsposition, d.h. die Matrix-Anordnung zurückgeführt werden. Gemäß Figur 5 sind dafür auf allen vier Seiten der Heizsegmente-Matrix jeweils Rückstelleinrichtungen 25 angeordnet, die eine Schubplatte 26 und eine damit verbundene Kolben-Zylinder-Einheit 27 umfassen. Bei Aktivierung aller vier Rückstelleinrichtungen 25 werden die Heizsegmente 21 wieder soweit zusammengeschoben, dass sie ihre ursprüngliche Anordnung in Form einer rechteckigen Matrix einnehmen.After completion of the heating of the board P, the heater 10 is opened by the two heating units 11 and 13 are lifted apart or apart. Subsequently, the board P is removed. In this state, the heating segments 21 have one from their home position FIG. 3 shifted mutual alignment, which is determined by the expansion of the board P during heating. For the heating of the next board, the heating segments 21 must be returned to their original position, ie the matrix arrangement. According to FIG. 5 For this purpose, restoring devices 25 are arranged on all four sides of the heating segment matrix, which comprise a thrust plate 26 and a piston-cylinder unit 27 connected thereto. Upon activation of all four restoring devices 25, the heating segments 21 are again pushed together so far that they assume their original arrangement in the form of a rectangular matrix.

Claims (14)

  1. Heating device for heating a metal plate (P), having a lower heating unit (11) and an upper heating unit (13), which can be displaced between a closed heating position holding the plate (P) between themselves and a release position spaced apart from each other, each heating unit (11, 13) having a heatable heating plate (16) coming into contact with the plate (P), and the heating plate (16) of the lower and/or the upper heating unit (11, 13) having a multiplicity of heating segments (21), which are arranged in a predetermined pattern relative to one another, characterized in that the said heating segments (21) can be displaced relative to each other in the plane (E) defined by a contact surface between the heating segments (21) and the plate (P).
  2. Heating device according to Claim 1, characterized in that the heating segments (21) are mounted in a floating manner.
  3. Heating device according to Claim 1 or 2, characterized in that the heating segments (21) rest on a supporting plate (18) such that they can be displaced.
  4. Heating device according to Claim 3, characterized in that at least one sliding layer (17, 22) is arranged between the supporting plate (18) and the heating segments (21).
  5. Heating device according to one of Claims 1 to 4, characterized in that the heating segments (21) bear a first sliding layer (17).
  6. Heating device according to Claim 5, characterized in that the first sliding layer (17) consists of zirconium oxide (ZrO2).
  7. Heating device according to one of Claims 1 to 6, characterized in that the supporting plate (18) bears a second sliding layer (22).
  8. Heating device according to Claim 7, characterized in that the second sliding layer (22) consists of aluminium oxide (Al2O3).
  9. Heating device according to one of Claims 1 to 8, characterized in that the heating segments (21) have a rectangular contact surface and are arranged at mutual spacings in a pattern formed of multiple rows lying beside one another.
  10. Heating device according to one of Claims 1 to 9, characterized in that the heating output of each heating segment (21) can be driven separately.
  11. Heating device according to one of Claims 1 to 9, characterized in that, with respect to the control of their heating output, a plurality of heating segments (21) are combined into a heating segment group.
  12. Heating device according to Claim 11, characterized in that a plurality of heating segment groups, which can be driven separately with respect to their heating output, are provided.
  13. Heating device according to one of Claims 1 to 12, characterized in that the lower and/or the upper heating unit (11, 13) have/has a thermally insulating jacket (19, 20).
  14. Heating device according to one of Claims 1 to 13, characterized in that a resetting device (25), by means of which the heating segments (21) displaced relative to one another can be reset to an initial position, is provided.
EP10000379.7A 2009-02-07 2010-01-16 Heater for heating a metal board Active EP2216417B1 (en)

Priority Applications (1)

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PL10000379T PL2216417T3 (en) 2009-02-07 2010-01-16 Heater for heating a metal board

Applications Claiming Priority (1)

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DE102009007826A DE102009007826A1 (en) 2009-02-07 2009-02-07 Heating device for heating a metal circuit board

Publications (3)

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EP2216417A2 EP2216417A2 (en) 2010-08-11
EP2216417A3 EP2216417A3 (en) 2013-07-24
EP2216417B1 true EP2216417B1 (en) 2014-05-14

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ES (1) ES2488122T3 (en)
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PL2439289T3 (en) * 2010-10-05 2017-06-30 Schwartz Gmbh Method and furnace for treating workpieces
DE102011007489B4 (en) * 2011-04-15 2013-08-22 Spaleck-Stevens Innotech Gmbh & Co. Kg Arrangement for surface heating and cooling
DE102011102167A1 (en) * 2011-05-21 2012-11-22 Volkswagen Aktiengesellschaft Producing molded component with two structural regions of different ductility which are made of flat or preformed circuit board of hardenable steel, comprises heating circuit board in first region, shaping circuit board and partially curing
JP5932431B2 (en) * 2012-03-28 2016-06-08 中央発條株式会社 Heating apparatus and heating method
DE102014101539B9 (en) 2014-02-07 2016-08-11 Benteler Automobiltechnik Gmbh Hot forming line and method of making hot formed sheet metal products
DE102014006763A1 (en) 2014-05-08 2015-02-26 Daimler Ag Device for heating a light metal component
DE102016101975B4 (en) 2016-02-04 2017-10-19 Voestalpine Metal Forming Gmbh Apparatus for producing hardened steel components and method for hardening
ITUA20161493A1 (en) * 2016-03-09 2017-09-09 Cometal Eng S P A CONDUCTIVE OVEN FOR THE HEATING OF A BILLET OR A SHEET, AS AN EXAMPLE OF ALUMINUM
CN107488776A (en) * 2017-08-31 2017-12-19 江苏密斯欧智能科技有限公司 A kind of plate quenching mechanism

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JPS60174832A (en) * 1984-02-17 1985-09-09 Sumitomo Metal Ind Ltd Heating method of clad steel plate
US7165435B1 (en) * 2005-07-25 2007-01-23 Gm Global Technology Operations, Inc. Conduction preheating for hot-formed sheet metal panels
WO2007013279A1 (en) * 2005-07-27 2007-02-01 Kikuchi Co., Ltd. Heating device and heating method

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EP2216417A3 (en) 2013-07-24
PT2216417E (en) 2014-07-03
EP2216417A2 (en) 2010-08-11
ES2488122T3 (en) 2014-08-26
DE102009007826A1 (en) 2010-08-19
PL2216417T3 (en) 2014-10-31

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