EP2193010A4 - Polierkissen - Google Patents

Polierkissen

Info

Publication number
EP2193010A4
EP2193010A4 EP08795288.3A EP08795288A EP2193010A4 EP 2193010 A4 EP2193010 A4 EP 2193010A4 EP 08795288 A EP08795288 A EP 08795288A EP 2193010 A4 EP2193010 A4 EP 2193010A4
Authority
EP
European Patent Office
Prior art keywords
polishing pad
polishing
pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP08795288.3A
Other languages
English (en)
French (fr)
Other versions
EP2193010B1 (de
EP2193010A1 (de
Inventor
Kelly Newell
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CMC Materials Inc
Original Assignee
Cabot Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cabot Microelectronics Corp filed Critical Cabot Microelectronics Corp
Publication of EP2193010A1 publication Critical patent/EP2193010A1/de
Publication of EP2193010A4 publication Critical patent/EP2193010A4/de
Application granted granted Critical
Publication of EP2193010B1 publication Critical patent/EP2193010B1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
EP08795288.3A 2007-08-16 2008-08-13 Polierkissen Active EP2193010B1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US95629307P 2007-08-16 2007-08-16
PCT/US2008/009687 WO2009025748A1 (en) 2007-08-16 2008-08-13 Polishing pad

Publications (3)

Publication Number Publication Date
EP2193010A1 EP2193010A1 (de) 2010-06-09
EP2193010A4 true EP2193010A4 (de) 2013-10-16
EP2193010B1 EP2193010B1 (de) 2020-01-08

Family

ID=40378437

Family Applications (1)

Application Number Title Priority Date Filing Date
EP08795288.3A Active EP2193010B1 (de) 2007-08-16 2008-08-13 Polierkissen

Country Status (10)

Country Link
US (1) US20110183579A1 (de)
EP (1) EP2193010B1 (de)
JP (1) JP5307815B2 (de)
KR (1) KR101203789B1 (de)
CN (1) CN101778701B (de)
IL (1) IL203461A (de)
MY (1) MY154071A (de)
SG (1) SG183738A1 (de)
TW (1) TWI411495B (de)
WO (1) WO2009025748A1 (de)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8047899B2 (en) * 2007-07-26 2011-11-01 Macronix International Co., Ltd. Pad and method for chemical mechanical polishing
WO2011008499A2 (en) * 2009-06-30 2011-01-20 Applied Materials, Inc. Leak proof pad for cmp endpoint detection
JP5426469B2 (ja) * 2010-05-10 2014-02-26 東洋ゴム工業株式会社 研磨パッドおよびガラス基板の製造方法
US8657653B2 (en) 2010-09-30 2014-02-25 Nexplanar Corporation Homogeneous polishing pad for eddy current end-point detection
US8628384B2 (en) * 2010-09-30 2014-01-14 Nexplanar Corporation Polishing pad for eddy current end-point detection
CN102501187A (zh) * 2011-11-04 2012-06-20 厦门大学 区域压力调整抛光盘
US9067299B2 (en) 2012-04-25 2015-06-30 Applied Materials, Inc. Printed chemical mechanical polishing pad
JP2014104521A (ja) * 2012-11-26 2014-06-09 Toyo Tire & Rubber Co Ltd 研磨パッド
US9649742B2 (en) 2013-01-22 2017-05-16 Nexplanar Corporation Polishing pad having polishing surface with continuous protrusions
CN104044087B (zh) * 2014-06-18 2016-09-07 蓝思科技股份有限公司 一种蓝宝石抛光用铜盘及其修盘方法
CN106607749B (zh) * 2015-10-22 2019-01-22 中芯国际集成电路制造(上海)有限公司 一种阻挡型化学机械研磨垫及研磨装置
CN113103145B (zh) * 2015-10-30 2023-04-11 应用材料公司 形成具有期望ζ电位的抛光制品的设备与方法
US9925637B2 (en) * 2016-08-04 2018-03-27 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Tapered poromeric polishing pad
TWI595968B (zh) * 2016-08-11 2017-08-21 宋建宏 研磨墊及其製造方法
TWI650202B (zh) * 2017-08-22 2019-02-11 智勝科技股份有限公司 研磨墊、研磨墊的製造方法及研磨方法
US11685013B2 (en) * 2018-01-24 2023-06-27 Taiwan Semiconductor Manufacturing Company, Ltd. Polishing pad for chemical mechanical planarization
EP3887093A4 (de) * 2018-11-27 2022-08-17 3M Innovative Properties Company Polierpads sowie systeme und verfahren zur herstellung und verwendung davon
WO2022202008A1 (ja) * 2021-03-26 2022-09-29 富士紡ホールディングス株式会社 研磨パッド
CN113246015B (zh) * 2021-05-25 2022-09-20 万华化学集团电子材料有限公司 具有终点检测窗的抛光垫及其应用

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004009291A1 (en) * 2002-07-24 2004-01-29 Applied Materials, Inc. Polishing pad for endpoint detection and related methods
US20050060943A1 (en) * 2003-09-19 2005-03-24 Cabot Microelectronics Corporation Polishing pad with recessed window
JP2007118106A (ja) * 2005-10-26 2007-05-17 Toyo Tire & Rubber Co Ltd 研磨パッド及びその製造方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6171181B1 (en) * 1999-08-17 2001-01-09 Rodel Holdings, Inc. Molded polishing pad having integral window
JP2002001652A (ja) * 2000-06-22 2002-01-08 Nikon Corp 研磨パッド及び研磨装置及び素子製造方法
EP1252973B1 (de) * 2001-04-25 2008-09-10 JSR Corporation Lichtduchlässiges Polierkissen für eine Halbleiterschleife
WO2004028744A1 (en) * 2002-09-25 2004-04-08 Ppg Industries Ohio, Inc. Polishing pad with window for planarization
US6884156B2 (en) * 2003-06-17 2005-04-26 Cabot Microelectronics Corporation Multi-layer polishing pad material for CMP
US8066552B2 (en) * 2003-10-03 2011-11-29 Applied Materials, Inc. Multi-layer polishing pad for low-pressure polishing
JP4877448B2 (ja) * 2003-11-04 2012-02-15 Ｊｓｒ株式会社 化学機械研磨パッド
US7442116B2 (en) * 2003-11-04 2008-10-28 Jsr Corporation Chemical mechanical polishing pad
US7204742B2 (en) * 2004-03-25 2007-04-17 Cabot Microelectronics Corporation Polishing pad comprising hydrophobic region and endpoint detection port
KR20060051345A (ko) * 2004-09-22 2006-05-19 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스 인코포레이티드 유선형의 투시창을 구비한 씨엠피 패드
US7182670B2 (en) * 2004-09-22 2007-02-27 Rohm And Haas Electronic Materials Cmp Holdings, Inc. CMP pad having a streamlined windowpane
JP4620501B2 (ja) * 2005-03-04 2011-01-26 ニッタ・ハース株式会社 研磨パッド
KR20070018711A (ko) * 2005-08-10 2007-02-14 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스, 인코포레이티드 표면 요철이 감소된 창을 구비한 연마 패드

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004009291A1 (en) * 2002-07-24 2004-01-29 Applied Materials, Inc. Polishing pad for endpoint detection and related methods
US20050060943A1 (en) * 2003-09-19 2005-03-24 Cabot Microelectronics Corporation Polishing pad with recessed window
JP2007118106A (ja) * 2005-10-26 2007-05-17 Toyo Tire & Rubber Co Ltd 研磨パッド及びその製造方法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2009025748A1 *

Also Published As

Publication number Publication date
CN101778701A (zh) 2010-07-14
JP5307815B2 (ja) 2013-10-02
WO2009025748A1 (en) 2009-02-26
EP2193010B1 (de) 2020-01-08
US20110183579A1 (en) 2011-07-28
TW200922748A (en) 2009-06-01
IL203461A (en) 2014-11-30
SG183738A1 (en) 2012-09-27
KR20100068255A (ko) 2010-06-22
JP2010536583A (ja) 2010-12-02
EP2193010A1 (de) 2010-06-09
MY154071A (en) 2015-04-30
TWI411495B (zh) 2013-10-11
KR101203789B1 (ko) 2012-11-21
CN101778701B (zh) 2012-06-27

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