EP2181164A2 - Unterschichtformulierung für nichtplattierbares substrat für stromlose metallisierung - Google Patents

Unterschichtformulierung für nichtplattierbares substrat für stromlose metallisierung

Info

Publication number
EP2181164A2
EP2181164A2 EP08741606A EP08741606A EP2181164A2 EP 2181164 A2 EP2181164 A2 EP 2181164A2 EP 08741606 A EP08741606 A EP 08741606A EP 08741606 A EP08741606 A EP 08741606A EP 2181164 A2 EP2181164 A2 EP 2181164A2
Authority
EP
European Patent Office
Prior art keywords
group
coating formulation
multifunctional
grade substrate
platable grade
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP08741606A
Other languages
English (en)
French (fr)
Other versions
EP2181164A4 (de
Inventor
Mohamad Nasir Mohamad Ibrahim
Coswald Stephen Sipaut
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Universiti Sains Malaysia (USM)
Original Assignee
Universiti Sains Malaysia (USM)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Universiti Sains Malaysia (USM) filed Critical Universiti Sains Malaysia (USM)
Publication of EP2181164A2 publication Critical patent/EP2181164A2/de
Publication of EP2181164A4 publication Critical patent/EP2181164A4/de
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/04—Polymeric products of isocyanates or isothiocyanates with vinyl compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D175/00—Coating compositions based on polyureas or polyurethanes; Coating compositions based on derivatives of such polymers
    • C09D175/04—Polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D4/00—Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; Coating compositions, based on monomers of macromolecular compounds of groups C09D183/00 - C09D183/16
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
    • C23C18/1872—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
    • C23C18/1886—Multistep pretreatment
    • C23C18/1893—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2073—Multistep pretreatment
    • C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal

Definitions

  • This invention is directed to a process for electrolessly plating a conductive metal to the surface of a nonconductive and a non-platable grade material.
  • this invention relates to a coating formulation for said non-platable grade substrate prior to undergoing electroless plating process and a method for applying said coaling formulation onto said non-platable grade substrate.
  • Electroless plating process is a well-known process whereby substrate, which is a nonconductive material, is coated with metal for various applications. It is an autocatalytic process in which ionic state metal is reduced chemically without the influence of electricity.
  • Acrylonitrile-butadiene-styrene (ABS) plastic for example, are coated with metal for not only decorative purposes such as motorcar accessories, furniture fittings, fashion jewelry and buttons but also for functional reasons such as housings of electrical appliances in order to achieve efficient shielding from emission or immission of electromagnetic v radiation.
  • ABS Acrylonitrile-butadiene-styrene
  • the superior 1 properties of coated metal on substrate materials with excelled characteristics of wear resistance, surface finishing and uniform coating thickness rendered electroless plating technique a wide application window as in aerospace, automotives, electronics, computers, machinery, oil and gas production and valve industries. However, this technique is limited by the indispensable reliance on platable grade substrates.
  • a coating formulation for non-platable grade substrate prior to undergoing electroless metal process wherein said coating formulation comprises a mixture of a multifunctional based monomer having allyl group or alkyl group or vinyl group or ether group or ester group or methacrylate group or acrylate group or - phthalate- group or a combination thereof, and diphenylmetane-4, 4-d ⁇ socyanate (MDI), said multifunctional based monomer does not include multifunctional monomer having hydroxyl group.
  • the ratio of said multifunctional based monomer is less than or equal to ( ⁇ ) said diphenylmetane-4, 4-diisocyanate (MDI).
  • said coating formulation comprises a mixture of a multifunctional based monomer having allyl group or aflcyl group or vinyl group or ether group or ester group or methacrylate group or acrylate group or phthalate group or combination thereof, and diphenylmetane-4, 4-diisocyanate (MDI) 3 said multifunctional based monomer does not include multifunctional monomer having hydroxyl group, are mixed in a vacuum chamber and left for about 30 minutes to allow the polymers to mix well and stabilize before being applied to said non-platable grade substrate.
  • MDI diphenylmetane-4, 4-diisocyanate
  • a method for applying said coating formulation in accordance with the present invention onto a non-platable grade substrate prior to undergoing electroless metal plating process comprises the steps of:
  • a coating formulation for non- platable grade substrate prior to undergoing electroless metal process comprises a mixture of a multifunctional monomer i.e. any monomer based on allyl group or aUryl group or vinyl group or ether group or ester group or methacrylate group or acrylate group or phthalate group and inclusive any possible combination of the said groups and, diphenylmetane-4, 4-d ⁇ socyanate (MDI).
  • a multifunctional monomer however does not include multifunctional monomer having hydroxyl group.
  • the ratio of said multifunctional monomer is less than or equal to ( ⁇ ) MDI.
  • the above mentioned coating formulation for non-platable grade is an innovative solution that compatibilizes adhesiveness between metal and non- platable grade substrate surfaces.
  • This coating formulation offers versatility and is applicable on virtually all types of materials regardless of it nature or origin such as semi-metals nice silicon, silicates, glasses, ceramics as well as non- metals like plastics, woods and shells.
  • said multifunctional monomer comprises of any monomer based on allyl group or alkyl group or vinyl group or ether group or ester group or methacrylate group or acrylate group or phthalate group and inclusive any possible combination of the said groups except for multifunctional monomer having hydroxyl group.
  • multifunctional monomer includes rriallylcyanurate (multifunctional monomer based allyl group), trimethylolpropane trimethacrylate (multifunctional monomer based alkyl group), poly(ethylene)glycol divinyl ether or ester (multifunctional monomer based vinyl group or ether group or ester group), triethylene glycol dimethacrylate or ethyleneglycol dimethacrylate ( multifunctional monomer based methacrylate group), polypropylene glycol (6) acrylate multifunctional monomer based acrylate group) and diallyl phthalate (DALP) (multifunctional monomer based phthalate ' group).
  • rriallylcyanurate multifunctional monomer based allyl group
  • trimethylolpropane trimethacrylate multifunctional monomer based alkyl group
  • poly(ethylene)glycol divinyl ether or ester multifunctional monomer based vinyl group or ether group or ester group
  • the monomer of diallyl phthalate (DALP) and diphenylmetane-4, 4- d ⁇ socyanate (MDT) from analytical grade are used for the preparation of said polymer solution.
  • Mixture of monomers preferably in the ratio of 1:2 for DALP: MDI is used.
  • the mixing process between these two liquids must be done inside a vacuum chamber and left for 30 minutes to allow the mixture to mix well and stabilize before it can readily be used.
  • the polymer solution must be kept inside vacuum bottle to avoid oxidation.
  • the ratio of said multifunctional monomer is less than or equal ( ⁇ ) to diphenyImetane-4, 4-d ⁇ socyanate (MDI), a more preferred ratio of 1:1 is favorable for multifunctional monomer based vinyl group or ether group or ester group such as poly(ethylene) glycol divinyl ether.
  • non-platable grade substrate such as wood
  • the conventional plating process i.e. etching, neutra ⁇ zarion, -activation, acceleration and plating is the same for any other metal plating.
  • plaster of Paris is coated with polymer formulation according to the present invention comprising a ratio of 1 : 2 of diallyl phthalate (DALP) and ch ' phenylmetane-4, 4-diisocyanate (MDI) from analytical grade.
  • DALP diallyl phthalate
  • MDI 4-diisocyanate
  • the plaster of Paris is then cured at room temperature for 8 hours and further dried in an oven for two days. After that, said plaster of Paris undergoing a conventional electroless plating process i.e. etching, neutralization, activation, acceleration and plating.
  • multifunctional monomer any monomer based on allyl group or alkyl group or vinyl group or ether group or ester group or methacrylate group or acrylate group or phthalate group and inclusive any possible combination of the said groups, except for multifunctional monomer having hydroxyl group
  • DALP diallyl phthalate
  • MDI 4-diisocyanate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • Inorganic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Chemically Coating (AREA)
EP08741606A 2007-04-10 2008-04-08 Unterschichtformulierung für nichtplattierbares substrat für stromlose metallisierung Withdrawn EP2181164A4 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
MYPI20070548 2007-04-10
PCT/MY2008/000029 WO2008123767A2 (en) 2007-04-10 2008-04-08 An undercoating layer formulation for non-platable grade substrate for electroless metal plating

Publications (2)

Publication Number Publication Date
EP2181164A2 true EP2181164A2 (de) 2010-05-05
EP2181164A4 EP2181164A4 (de) 2011-01-26

Family

ID=39831502

Family Applications (1)

Application Number Title Priority Date Filing Date
EP08741606A Withdrawn EP2181164A4 (de) 2007-04-10 2008-04-08 Unterschichtformulierung für nichtplattierbares substrat für stromlose metallisierung

Country Status (3)

Country Link
EP (1) EP2181164A4 (de)
CN (1) CN101743286A (de)
WO (1) WO2008123767A2 (de)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1347003A1 (de) * 2002-03-18 2003-09-24 Huntsman International Llc Strahlungshärtbare Harzzusammensetzung
WO2007000415A1 (de) * 2005-06-28 2007-01-04 Basf Aktiengesellschaft Beschichtungsmassen enthaltend 2,4'-diisocyanatodiphenylmethan

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002049982A1 (en) * 2000-12-18 2002-06-27 Bridgestone Corporation Film-reinforced glasses
US6512039B1 (en) * 2001-11-16 2003-01-28 Lord Corporation Adhesives for bonding peroxide-cured elastomers
DE10344449A1 (de) * 2003-09-25 2005-04-28 Henkel Kgaa Klebstoff-Zusammensetzung mit Barriere-Eigenschaften
US7368171B2 (en) * 2004-09-03 2008-05-06 H.B. Fuller Licensing & Financing, Inc. Laminating adhesive, laminate including the same, and method of making a laminate

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1347003A1 (de) * 2002-03-18 2003-09-24 Huntsman International Llc Strahlungshärtbare Harzzusammensetzung
WO2007000415A1 (de) * 2005-06-28 2007-01-04 Basf Aktiengesellschaft Beschichtungsmassen enthaltend 2,4'-diisocyanatodiphenylmethan

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2008123767A2 *

Also Published As

Publication number Publication date
WO2008123767A3 (en) 2008-12-11
WO2008123767A2 (en) 2008-10-16
CN101743286A (zh) 2010-06-16
EP2181164A4 (de) 2011-01-26

Similar Documents

Publication Publication Date Title
Liao et al. A facile method for preparing highly conductive and reflective surface-silvered polyimide films
US4622411A (en) Organopalladium-II-complex compounds
WO2007122869A1 (ja) 樹脂成形体に対するエッチング処理用組成物
US4830880A (en) Formation of catalytic metal nuclei for electroless plating
US9249512B2 (en) Process for coating a surface of a substrate made of nonmetallic material with a metal layer
US20090017319A1 (en) Metallised parts made from plastic material
US4832989A (en) Method of improving the bond strength of electrolessly deposited metal layers on plastic-material surfaces
US7964282B2 (en) Housing with a soft surface and method for making the housing
Yang et al. Electroless deposition of copper and nickel on poly (tetrafluoroethylene) films modified by single and double surface graft copolymerization
JPS61210183A (ja) 重合体表面に金属被覆を設ける方法
TWI438301B (zh) 成形品之鍍敷物及其製造方法
US7919147B2 (en) Coating method
US6156385A (en) Process for partial electroless plating
CN102037063B (zh) 绝缘树脂的调整方法及其利用
EP2181164A2 (de) Unterschichtformulierung für nichtplattierbares substrat für stromlose metallisierung
JP2019177311A (ja) ミリ波透過性加飾品、銀鏡膜及びその形成方法
Li et al. Electroless plating of copper on polyimide films modified by surface-initiated atom-transfer radical polymerization of 4-vinylpyridine
US20050230259A1 (en) Process for metallising support media made from plastic material
EP1572788B1 (de) Oberflächenbehandlung von polyacetalgegenständen
JPH06192842A (ja) 樹脂成形品の塗装方法
US3471320A (en) Conditioning of formed articles of acrylonitrile - butadiene - styrene terpolymer
KR100431248B1 (ko) 도전성 폴리머 조성물을 이용한 부도체의 도금방법
US20210238748A1 (en) Method of metal plating of polymer-containing substrates
CN115074711A (zh) 一种在环氧树脂表面制备高结合力金属层的方法
EP1426119A9 (de) Plasmaverfahren zur Oberflächenbehandlung von Substraten aus Silikon

Legal Events

Date Code Title Description
PUAJ Public notification under rule 129 epc

Free format text: ORIGINAL CODE: 0009425

PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20100216

AK Designated contracting states

Kind code of ref document: A2

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MT NL NO PL PT RO SE SI SK TR

AX Request for extension of the european patent

Extension state: AL BA MK RS

REG Reference to a national code

Ref country code: HK

Ref legal event code: DE

Ref document number: 1143829

Country of ref document: HK

A4 Supplementary search report drawn up and despatched

Effective date: 20101223

DAX Request for extension of the european patent (deleted)
STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN

18D Application deemed to be withdrawn

Effective date: 20141101

REG Reference to a national code

Ref country code: HK

Ref legal event code: WD

Ref document number: 1143829

Country of ref document: HK