Classifications

• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
  • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
  • H05K3/1258—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by using a substrate provided with a shape pattern, e.g. grooves, banks, resist pattern
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
  • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/0011—Working of insulating substrates or insulating layers
  • H05K3/0014—Shaping of the substrate, e.g. by moulding
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
  • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
  • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
  • H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/02—Details
  • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
  • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
  • H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/01—Dielectrics
  • H05K2201/0104—Properties and characteristics in general
  • H05K2201/0108—Transparent
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
  • H05K2203/01—Tools for processing; Objects used during processing
  • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
  • H05K2203/0108—Male die used for patterning, punching or transferring
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
  • H05K2203/01—Tools for processing; Objects used during processing
  • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
  • H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
  • H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T428/00—Stock material or miscellaneous articles
  • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension

Definitions

• the present invention describes a process which enables the production of small and smallest conductive structures on surfaces.
• Small and minute structures are considered in this context as structures created by the human
• the eye can only be perceived with the help of optical aids. This is achieved by the production of microchannels by (hot) embossing and / or
• Another approach to producing small and minute structures is to treat the substrate by suitable methods (e.g., plasma methods) such that regions of different wettability are formed, for example, using masks containing a negative of the structure to be formed.
• suitable methods e.g., plasma methods
• regions of different wettability are formed, for example, using masks containing a negative of the structure to be formed.
• structures with widths smaller than 5 ⁇ m could already be produced. However, complicated lithographic steps are necessary for these processes. [Nature Mater. 2004, 3, 171].
• Coating is applied to the substrate. This is then physically provided by impressing with a structure. The resulting structure is then cured by means of UV light. Furthermore, subsequent etching and hardening steps are provided. However, the exact nature of the conductive materials used in the resulting structures is not disclosed. This method is due to the many
• a simple, mechanical process for producing small structures without producing a conductive structure, in particular on polymers makes use of (hot) embossing or nanoscale impressions.
• stamps are pressed with pressure on the substrate and thus an impression of the negative of the structure of the stamp is achieved on the surface.
• the hot embossing of polymeric substrates with punches above the glass transition temperature of the polymer has already been used herein to produce structures with a diameter of 25nm.
• the stencil used also called master
• always completely reusable for embossing processes [Appl. Phys. Lett. 1995, 67, 3114; Adv. Mater. 2000, 12, 189; Appl. Phys. Lett. 2002, 81, 1955].
• a filling of fine structures can basically be brought about by using the capillary force, but their sensible use presupposes a targeted introduction of the filling material into the structure produced, in order to avoid material waste.
• the filling of small structures (or tubes, see J. Colloid Interface Sci. 1995, 172, 278) by means of capillary force has already been described, in particular with liquid
• Prepolymers e.g., polymethyl acrylate; J. Phys. Chem. B 1997, 101, 855
• aqueous solutions of biomolecules such as DNA in microfluidic devices
• filling such structures with material that is later rendered conductive has not yet been disclosed.
• Substrate surface and the use of conductive nanoparticles contained ink formulations with subsequent sintering of nanoparticles can be used to consistently conductive paths.
• a brief illustration of the process is given in FIG. 1.
• the invention relates to a method for producing electrically conductive
• Channels an ink, preferably a dispersion of conductive particles, is applied, can be produced with the conductive structures, the channels are filled by capillary force with the ink, and the ink is converted by introducing energy, in particular by thermal treatment, into conductive structures.
• the invention also relates to the substrates obtainable by the above novel process, which have structures having a dimension of not more than 25 ⁇ m in two dimensions.
• a press die or a press roll each provided with a raised microstructure (positive) is pressed onto the substrate, which is preferably a polymer substrate, in order to form a negative of the structure of the stamp into the surface of the stamp
• the stamp or the press roll preferably has at least the temperature of the glass transition point of the polymer substrate used. Particularly preferably, the punch or pressing roll temperature at least 20 0 C above the glass transition temperature. Further preferably, the stamp or the pressure roller has small structures on its surface, which have in one dimension a dimension of not more than 25 microns, preferably from 25 .mu.m to 100 nm, more preferably from 10 .mu.m to 100 nm, most preferably from 1 ⁇ m to 100 nm.
• the period of time of pressing the stamp into the substrate should be in particular 1 to 60 minutes, preferably 2 to 5 minutes, more preferably it is pressed in for 3 to 4 minutes. In contrast, the use of a press roller requires shorter press times, since a higher press pressure is used in this case. The production of embossed structures takes place here continuously.
• the relative speed from substrate to roll in this process is 10 to 0.00001 m / s, preferably 1 to 0.0001 m / s, particularly preferably 0.1 to 0.0001 m / s.
• the parameters of contact pressure, temperature and time of press-fitting correlate in such a way that with higher temperature or higher pressure, the press-in time can be reduced.
• correspondingly lower times and thus higher component throughputs with methods presented here are conceivable.
• the roll is pressed onto the substrate while the substrate is drawn under this roll and the roll rotates thereby, or the roll is driven and thus the substrate promoted by impressing the channels in the substrate.
• the ink consists of a solvent or a suspension liquid and an electrically conductive material or a precursor compound for an electrically conductive material.
• the ink may contain, for example, electrically conductive polymers, metals or metal oxides, carbon particles or semiconductors. Preference is given to an ink which contains nanoparticles of a conductive material, in particular of carbon nanotubes, and / or metal particles dispersed in a solvent, for example water, which lead to a continuously conductive structure as a result of mixing.
• the ink particularly preferably contains silver nanoparticles in water, which lead to a continuously conductive structure by sintering the silver particles. Suitable metal oxides are e.g. indium
• Semiconductors include, for example, zinc selenite, zinc tellurite, zinc sulfide, cadmium selenite, cadmium tellurite, cadmium sulfide, lead selenite, lead sulfide, lead tellurite and indium arsenite.
• the ink preferably used in the new process should wet the substrate as well as possible, i.
• the ink contains nanoparticles as described above, they should in particular be smaller than 1 ⁇ m, preferably smaller than 100 nm. More preferably, the nanoparticles are smaller than 80 nm, in particular smaller than 60 nm and have a bimodal particle size distribution.
• This ink is then metered into the channels created as described above.
• individual drops are metered into the channels.
• an inkjet printer with a print head whose print nozzles are arranged exactly above the channels and meter individual drops into the channels.
• the ink is dosed several times at regular intervals along the channels.
• the ink from the preferred inkjet printer may be continuously metered onto the substrate passing beneath the printhead. This is preferably done at appropriate intervals depending on the nature and shape of the channels on the substrate.
• continuous lines of ink oriented along the direction of travel of the substrate may be applied to a continuous stream of ink. With broken lines, for example, the dosage would be set for the duration of the interruption.
• the term interrupted line can also be understood as a line which does not run parallel to the direction of passage of the substrate, for example, B. at right angles to the direction of passage lines.
• juxtaposed pressure nozzles can be provided to fill the entire channel structure during a single passage.
• movable printheads are provided which follow the impressed channel structure during the relative movement of the substrate below them. This is the case, for example, if curved, preferably corrugated channels were impressed along the orientation of the substrate. If the printheads are movable perpendicular to the direction of travel of the substrate, oscillation of the printheads in a direction perpendicular to the substrate relative to this results in a wave motion.
• a wavy structure can be continuously filled with ink.
• this can also be extended to assembly versions in which the print heads briefly follow the passage direction of the substrate. That is, an apparatus of the printheads is provided which allows movement in two dimensions.
• the substrates useful in the method of the invention are substrates having moldable surfaces, e.g. Glass, ceramics or polymers, in particular transparent polymers. These substrates are electrical insulators. However, it is desirable to provide the components resulting from the substrate with conductive properties at least at certain points.
• Polymer materials often have special properties that make them preferred materials in many applications. This includes, for example, their comparatively high flexibility, which is often lower in comparison with inorganic materials with the same or similar mechanical load-bearing capacity, and the great freedom of design owing to the easier shaping of these materials.
• Materials eg polycarbonate, polypropylene, polymethyl methacrylate (PMMA) and some
• Polymers preferably to be used in the novel process are transparent and / or they have a high glass transition temperature.
• Polymers with a high glass transition temperature designate polymers having a glass transition temperature above 100 ° C.
• particular preference is given to using a polymer from the series: polycarbonate, polyurethane, polystyrene, polymethyl (meth) acrylate or polyethylene terephthalate.
• this post-treatment comprises the introduction of energy into the ink-filled channels produced.
• the polymer particles present in suspension in the solvent become e.g. fused together by heating the suspension on the substrate while the solvent evaporates.
• the post-treatment step is carried out at the melting temperature of the conductive polymer, more preferably above its melting temperature. This creates continuous tracks.
• the thermal aftertreatment of the substrate surface vaporizes the solvent between the dispersed carbon particles to obtain continuous, percolatable conductive carbon webs.
• the treatment step is carried out in the range of the evaporation temperature of the solvent contained in the ink, preferably above the evaporation temperature of the solvent. Once the percolation limit has been reached, the strip conductors according to the invention are formed.
• the aftertreatment is carried out by placing the entire component or specifically the printed conductors on a
• Solvent as close to the sintering temperature of the particles and is as low as possible to protect the substrate thermally.
• the solvent of the ink one having a boiling point of ⁇ 250 0 C, more preferably a temperature ⁇ 200 0 C, in particular a temperature ⁇ 100 0 C.
• temperatures specified here refer to boiling temperatures at a pressure of 1013 hPa preferred solvents are n-alkanes having up to 12 carbon atoms, alcohols having up to four carbon atoms, such as methanol, ethanol, propanol and butanol, ketones and aldehydes having up to five carbon atoms, such as acetone and propanal, water, and acetonitrile, dimethyl ether , Dimethylacetamide, dimethylformamide, N-methyl-pyrrolidone
• the sintering step is carried out at the indicated temperature until a continuous conductor has been formed.
• a sintering time of one minute to 24 hours is preferred, more preferably from five minutes to 8 hours, particularly preferably from two to eight hours.
• the invention also provides the use of an ink with which conductive structures can be produced for the production of substrates having on their surface conductive structures having in one dimension a dimension of not more than 25 microns, preferably from 20 microns to 100 nm, particularly preferably from 10 .mu.m to 100 nm, very particularly preferably from 1 .mu.m to 100 nm, wherein the ink is preferably a suspension of conductive particles, as described above, and the substrate is preferably transparent, for example glass, transparent ceramics or a transparent polymer as described above.
• Fig. 1 a diagram of the implementation of the inventive method by means of a punch with A) presses the top of the press ram in the substrate, B) lifting the ram, C) applying the ink in the formed channel of the substrate and D) sintering of the ink material in channel
• Fig. 2 a photomicrograph of a cross section through a polystyrene plate with embossed channels
• a grid of channels on a polymer substrate by pressing a grid structure (MASTER) in a polystyrene substrate having a glass transition temperature T g of 100 0 C (N5000, Shell AG) were prepared.
• the MASTER was heated to 180 0 C and by means of a small press (Tribotrak, DACA Instruments, Santa Barbara, CA, USA) for 3 min. long with a load of 3 kg pressed onto the substrate.
• the MASTER had a line spacing of 42 ⁇ m, seen in cross-section as the recesses in the MASTER appear as truncated triangles upside down ( Figure 2).
• the elevations in the MASTER have a height of 20 microns and are also in the
• a single drop of silver ink (Nanopaste TM, Harima Chemicals, Japan) was placed on one of the lines prepared as described above.
• the ink consists of a dispersion of silver nanoparticles of about 5 nm in average diameter
• Tetradecane Tetradecane.
• the capillary force immediately formed a line of ink in the channels. It could be obtained about 4 mm long uniform line.
• the precise positioning of the ink drop was achieved by means of an ink-jet system (Autodrop TM System, Microdrop Technologies, Norderstedt, Germany.) The system was equipped with a 68 ⁇ m die head. The maximum width of the resulting silver line was about
• the width was about 3.7 ⁇ m (see Fig. 3 base).
• the substrate was annealed for 1.5 hours at 200 0 C, whereby the ink was transferred existing line in a continuous made of sintered silver. The deviation between the width of the depressions at its bottom (3.7 ⁇ m) and the corresponding width of the upper edges of the MASTER
• Profiles (4.5 ⁇ m) can be explained by the swelling of the substrate under the influence of the ink solvent and the heating of the substrate during embossing. At a distance of 6 mm, a resistance of 2.5 ⁇ was measured on 4 parallel lines.
• a grid of channels was generated by pressing a grid in a polycarbonate film having a glass transition temperature T g of 205 0 C (Bayfol ®, Bayer MaterialScience AG), which was heated to 27Ü "C. Aiie further stamping parameters were as in Example 1. Likewise, In the same manner as in Example 1, a conductive line was produced obtained line width and lengths of the electrically conductive silver conductors were the same as those produced in Example 1 webs.
• Example 2 The procedure was as in Example 1, but instead of the embossing process with a press die, a press roll was used.
• Continuous structures on a 10 mm thick polycarbonate substrate (Makrolon, Bayer, Germany, glass transition temperature 148 ° C.) were generated by means of a roller mounted on a small press (Tribotrak, DACA Instruments, Santa Barbara, CA, USA).
• the custom-made roll mounted on the small press had raised line structures 10 ⁇ m wide and 3 mm apart.
• the surface of the substrate was heated to 60 0 C, while the roller had a temperature of 155 ° C.
• the pressure of the press was adjusted by means of a weight of 10 kg on the above-mentioned device.
• a roller-to-substrate relative advancing speed of 0.25 mm / s was selected.
• the substrate was pulled under the roller by means of a carriage to reach the above-mentioned relative speed.
• the contact pressure was sufficient to cause the roll on the substrate in a rotary motion.

Landscapes

• Engineering & Computer Science (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Manufacturing & Machinery (AREA)
• Chemical & Material Sciences (AREA)
• Computer Hardware Design (AREA)
• Physics & Mathematics (AREA)
• Condensed Matter Physics & Semiconductors (AREA)
• General Physics & Mathematics (AREA)
• Nanotechnology (AREA)
• Dispersion Chemistry (AREA)
• Power Engineering (AREA)
• Inks, Pencil-Leads, Or Crayons (AREA)
• Non-Insulated Conductors (AREA)
• Manufacturing Of Electric Cables (AREA)
• Micromachines (AREA)
• Application Of Or Painting With Fluid Materials (AREA)
• Manufacturing Of Printed Wiring (AREA)

Applications Claiming Priority (3)

Publications (1)

Family

ID=39929915

Family Applications (1)

Country Status (7)

Families Citing this family (19)

Family Cites Families (16)

• 2008
  • 2008-07-08 EP EP08784642A patent/EP2179633A1/de not_active Withdrawn
  • 2008-07-08 WO PCT/EP2008/005543 patent/WO2009010208A1/de active Application Filing
  • 2008-07-08 CN CN200880025345A patent/CN101755493A/zh active Pending
  • 2008-07-08 JP JP2010516400A patent/JP5606908B2/ja not_active Expired - Fee Related
  • 2008-07-08 KR KR1020107001083A patent/KR20100044176A/ko not_active Abandoned
  • 2008-07-11 US US12/171,513 patent/US20090061213A1/en not_active Abandoned
  • 2008-07-18 TW TW097127233A patent/TW200924576A/zh unknown

Non-Patent Citations (1)

Also Published As

Similar Documents

Legal Events