EP2153960A2 - Support, procédé et dispositif de fabrication de tranches de silicium, ainsi que l'utilisation de la tranche de silicium fabriquée - Google Patents

Support, procédé et dispositif de fabrication de tranches de silicium, ainsi que l'utilisation de la tranche de silicium fabriquée Download PDF

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Publication number
EP2153960A2
EP2153960A2 EP09010524A EP09010524A EP2153960A2 EP 2153960 A2 EP2153960 A2 EP 2153960A2 EP 09010524 A EP09010524 A EP 09010524A EP 09010524 A EP09010524 A EP 09010524A EP 2153960 A2 EP2153960 A2 EP 2153960A2
Authority
EP
European Patent Office
Prior art keywords
wafers
carrier
cleaning
wafer
passage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP09010524A
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German (de)
English (en)
Other versions
EP2153960A3 (fr
Inventor
Michael Peip
Till Dr. Spehr
Andreas Lesche
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fraunhofer Gesellschaft zur Forderung der Angewandten Forschung eV
Original Assignee
Wacker Schott Solar GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wacker Schott Solar GmbH filed Critical Wacker Schott Solar GmbH
Publication of EP2153960A2 publication Critical patent/EP2153960A2/fr
Publication of EP2153960A3 publication Critical patent/EP2153960A3/fr
Withdrawn legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work

Definitions

  • Wafers are very thin slices, typically thinner than 1 mm, cut from a block of material called a brick or ingot. In the case of further processing of the wafers into solar cells, the wafers typically only have a thickness of about 200 ⁇ m. In order to minimize the scrap of the material block, the cutting gap between the wafers is as narrow as possible, typically smaller than 180 .mu.m. At the same time, for example, wafers have a size of 125 mm * 125 mm (5 "wafers) or even 156 mm * 156 mm (6" wafers) or larger. For solar cells, in particular square multicrystalline wafers or monocrystalline wafers made from round ingots are used.
  • Wafers in particular for use in photovoltaics, are conventionally usually cut out of the material block by means of a multi-wire saw.
  • An example of such a saw discloses the document DE 697 08 168 T2 , The saw has a clamped wire field, by means of which a cylindrical or rectangular workpiece is cut transversely to its longitudinal direction into a plurality of thin slices (wafers).
  • the block of material is conventionally first adhered to a carrier, for example to a glass plate, which is adhesively bonded to a metallic machine carrier.
  • the composite is placed with the block of material down in a multi-wire saw.
  • the wire field of the Multi Wire saw is subjected to a mixture of a carrier liquid and abrasive particles acting as sawing particles, which at the same time have a cooling effect during cutting and are called the sawing sludge or sawing slurry.
  • the block of material is cut transversely to its longitudinal direction, cutting into the carrier without cutting it, but ensuring that the block of material is completely severed.
  • the cutting or sawing is effected by means of abrasive grains of, for example, SiC or diamond, which are slurried in a carrier liquid to a slurry. After cutting, the wafers hang next to each other on the carrier.
  • This entire assembly which is formed from wafers sawn material block and carrier is also referred to as wafer comb.
  • the adhesive bond carrier / wafer has to be loosened. This is done depending on the adhesive used in the acidic or basic range. Subsequently, the wafers are separated.
  • the carrier eg the glass plate
  • the carrier is usually discarded after the Entkitten.
  • the publication DE 10 2005 028 112 A1 discloses a method in which wafers after cutting are held apart by means of gear elements to hold the wafers and allow automatic dicing.
  • the object is achieved with a support for the production of wafers, which are cut from a block of material adhered to the support, wherein the support has at least one passage for supplying a rinsing fluid or cleaning agent between the wafers hanging on the support.
  • a passage in the sense of the invention makes it possible to supply a cleaning agent or rinsing fluid between the wafers hanging on the carrier. Therefore, it makes it possible to clean the wafers hanging on the carrier, in particular from still adhering saw slurries or sludges.
  • the interspaces between the wafers of the wafer comb can be completely freed of slurry, so that sawing slurries no longer adhere to the wafers during the subsequent handling, in particular during the subsequent uncut and singulation of the wafers, and thus substantially simplify a complete cleaning of the wafers and is enabled.
  • the rinsed sawing slurries can no longer form stains by reacting with the wafer surface due to the immediate post-cut cleaning, and therefore very short time in which they adhere to the wafers.
  • Cleaning immediately after cutting means that this occurs immediately after the sawing through of the material block (brick), in particular during the withdrawal of the wire field on the brick, or in a wafer comb cleaning unit immediately downstream of the saw.
  • the cleaning in particular during the retraction of the wire field immediately after the cutting of the brick has the advantage that the wire maintains a distance between the wafers hanging on the carrier.
  • the flushing from above which leads to a flow through the wafer interstices of the wafer comb with cleaning liquid, can be additionally assisted by a liquid supply to the sides of the wafer comb.
  • This additional application of cleaning fluid can be done on both sides, one-sided or alternating.
  • the lateral application of liquid has the advantage that the wafer comb is cleaned on all outer sides and counteracts the closing of the wafer interspaces above and below the outgoing wire fields.
  • the method according to the invention can also be used advantageously for wafers ⁇ 200 ⁇ m, it develops its particular advantages with wafers ⁇ 180 ⁇ m.
  • it is applicable to ⁇ 180 ⁇ m wafers, ⁇ 150 ⁇ m wafers, ⁇ 130 ⁇ m wafers, and also ⁇ 100 ⁇ m wafers, and the thinner the wafer of the wafer comb, the thinner the application of the method according to the invention increases.
  • Cleaning in a separate wafer comb cleaning unit has the advantage that the saw does not have to be constructed in a technically complicated manner and also that no machine running time of the saw for cleaning tasks is blocked.
  • the cleaning takes place from above, directly into the kerfs formed between the wafers. At least some of the wafers stick together after cutting into so-called tufts.
  • the gap near the carrier is maintained.
  • the cleaning agent has been introduced into the gap, it will flow off in as free of resistance as possible. Therefore, in particular in the case of adhering wafers, it will at least partially have a horizontal flow component and also a vertical flow component and therefore flow at least partially towards the wafer edge and downwards. It takes shegeschlämme from above with and rinsing them gradually at least partially laterally and downwards out.
  • the feeding of the rinsing or cleaning agent is carried out under pressure to remove remaining Sgeschlämme over the entire wafer surface.
  • the carrier is formed from one or more plates.
  • inexpensive plates can be used since the carrier is usually discarded after the removal of the wafers.
  • the block of material preferably has an arbitrary and in particular octagonal, square, quasi-square or round cross-section.
  • the carrier has a bonding surface which can be adhesively bonded to the material block, and the material block has a bondable surface to the carrier corresponding surface, so that after adhering the adhesive surface is applied substantially to the corresponding surface.
  • the passage extends in a longitudinal direction of the material block.
  • the passage extends over the entire length of the carrier.
  • the cleaning agent is therefore supplied from a wafer formed by the passageway in the longitudinal direction of the block of material.
  • cleaning agent can be supplied between all suspended wafers.
  • the passage is, for example, tubular and / or slit-shaped.
  • the passage extends vertically over the entire height of the carrier.
  • a passage is, for example, a borehole in a plate of the carrier or, if the passage extends over the entire length of the carrier, a gap between the plates of a carrier formed of a plurality of plates.
  • the carrier has a plurality of passages.
  • a plurality of passages are arranged in the carrier in the longitudinal direction and / or parallel to the longitudinal direction, so that the carrier has, for example, one or more rows of holes, or so that the carrier has a plurality of gaps preferably parallel to each other in the longitudinal direction.
  • the plurality of columns may extend vertically in part or over the entire carrier.
  • At least one passage extends with respect to the width of the carrier in its center.
  • the path of the cleaning agent from the center of the carrier width along the surface of the wafer to its wafer edge is the same on both sides, so that the cleaning agent is divided evenly on both sides.
  • a supply for supplying the cleaning agent is provided in the passage.
  • the feed is arranged, for example, at the passage or runs at least partially in the passage.
  • the feed is a tube.
  • the tube preferably has one or further preferably a plurality of openings through which the cleaning agent is guided into the passage.
  • the passage and / or the feed or the openings of the feed are at least partially provided as nozzles.
  • An inventive carrier is made of glass, a ceramic, a glass ceramic or plastic.
  • the carrier has a metallic sensor that indicates whether the block of material is completely severed.
  • the sensor is, for example, a wire or strip of metal that either indicates whether it has been broken, ie severed, or is in contact with the wire field.
  • the sensor preferably runs centrally in a groove of the carrier or in the passage and particularly preferably in the longitudinal direction of the carrier and with respect to the carrier width. Particularly preferably, it does not hinder the flow of the cleaning agent.
  • the wire never cuts unnecessarily deep into the carrier and eliminates visual inspection of whether the block of material is severed. As a result, the process stability is increased and the process or process duration is shortened.
  • the carrier is made in one piece.
  • the carrier is an injection molded part, preferably from the aforementioned materials.
  • the carrier is made in one piece from an injection molded part, wherein the passage extends in the longitudinal direction over the entire length of the carrier and is tubular with a downward gap, wherein the feed passes through the passage and a plurality Having openings through which the cleaning agent is fed into the passage and then between the wafer.
  • the passage is tubular and extends in the longitudinal direction, wherein it has no gap.
  • the gap is made only by sawing the wire into the carrier at the cut end after the wire has cut the block of material into wafers hanging on the carrier.
  • the wafers Since the wafers still hanging on the carrier are already being cleaned, the wafers are no longer damaged during their later subsequent handling by the rinsed sawing sludges, in particular abrasive grains. Also, staining due to sawing slurry reacting with the wafer surface is avoided. Subsequent cleaning systems are no longer contaminated by the rinsed shelälämme and by the cleaning time is reduced. A formation of stains on the wafer surface is thereby avoided.
  • the cleaning is done outside of the material block cutting device (multi wire saw).
  • the cleaning can be carried out in a storage unit of the wafer comb.
  • Such storage units are currently used for storage of the wafer comb in a liquid bath prior to the start of the prepurification and therefore need not be additionally manufactured.
  • the cleaning can be done in a pre-cleaning system.
  • Such pre-treatment plants have also been used to clean the wafer comb of slurry residues as well as to ensure the Entkittung.
  • the cleaning according to the invention from the top enables, on the one hand, the problem-free automatic singulation of the wafers after the uncut and, on the other hand, it provides particle- and stain-free wafers.
  • the cleaning outside of the material block cutting device in particular a multi-wire saw
  • measures can be realized in the cleaning, which improve the effectiveness of cleaning with the carrier according to the invention, but could not be realized in the saw design.
  • the wafers are separated after wafer comb cleaning and de-cementing.
  • the Entkittunsvons in acidic or basic medium
  • the Entkittunsrea may consist of several sub-steps. Since, according to the invention, the wafer comb has already been cleaned by slurry and enters the removal process, the further process steps, such as uncapping and singulation, are simplified. In addition, an automatic further treatment of the wafer (separation) is easily feasible.
  • the cleaning agent flows from above substantially along the entire cross section of the wafer surfaces.
  • the cleaning agent is supplied to the wafers under pressure. This can ensure that the cleaning agent can flow from the top at least partially to the lower edge of the wafer.
  • the pressure must be selected depending on the detergent used, the size of the wafer, the width of the gap and the desired degree of cleaning or the desired cleaning time.
  • the cleaning agent is recycled after its use for cleaning the wafer in a recycling plant and reused.
  • the carrier liquid for the slurry is preferably used oil, glycol or water or mixtures thereof, for the abrasive grains preferably SiC.
  • a liquid may preferably be used, for glycol-based and water-based slurries, deionized water is preferably used.
  • a cleaning agent for oil-based slurries it is a cleaning oil without additives.
  • the object is further achieved with a device for producing wafers with the method according to the invention.
  • the device therefore makes it possible to clean the wafers suspended on the carrier from above.
  • the device comprises a carrier according to the invention, so that the cleaning agent can be passed through the passage between the wafers hanging on the carrier.
  • the device at least partially comprises the supply for the cleaning agent, so that the supply to the Entkitten not completely with the carrier must be discarded.
  • the device completely comprises the supply.
  • the device for cleaning the wafer moves the supply into the passage of the carrier, for example in the gap between two plates, or the device moves the carrier for feeding.
  • the device comprises a multi-wire saw for cutting the wafers, in which the rinsing process can take place directly.
  • the Multi Wire saw contains all the elements necessary for a rinse, such as: B. connections for the rinsing liquid, collecting container or outflows for spent rinsing liquid and optionally spray hose, etc.
  • the same device can be used for sawing and cleaning the wafer.
  • the device preferably has nozzles on the sides not glued to the carrier.
  • cleaning agent can clean the outer surfaces and at least partially also the gaps between the wafers.
  • the cleaning agent in particular in eight- or rectangular, square or quasi-square material block cross-section, fed by lateral nozzles, which can be inclined and vertically and horizontally movable.
  • the lateral nozzles may be as long as the wafer comb and be vertically movable. In the case of obliquely positioned nozzles, these are preferably shorter than the wafer comb and horizontally movable, so that the entire wafer comb side surfaces are illuminated during the rinsing or cleaning process.
  • the rinsing or cleaning of the comb takes place in a liquid bath.
  • the cleaning or rinsing liquid emerges below the liquid surface of the bath.
  • the cleaning fluid can additionally be given a vertical outflow direction component by the nozzle design (eg 45 °).
  • the device is arranged during the cleaning in a liquid bath, in particular when cleaning the wafer comb in the storage unit. As a result, the surface tension, by which the wafers at least partially adhere to one another, is reduced.
  • the device and / or the liquid bath has an element for generating ultrasound and / or megasonic oscillators. Due to the ultra- or megasonic the adherence of the wafers is reduced and the cleaning additive supported and accelerated. Such oscillators are particularly combinable with the operation of the lateral nozzles.
  • the object is further achieved by using the wafer produced with the carrier according to the invention and / or with the method according to the invention and / or with the device according to the invention as a solar cell, as a semiconductor wafer or as a quartz wafer.
  • Fig. 1 shows a carrier 2 according to the invention in a front view, which is glued to a block of material 1.
  • the carrier 2 has a passage 3 in which a feed 4 extends at least partially.
  • the carrier 2 has a width 12 and a height 13.
  • Fig. 2 shows the carrier 2 of the invention Fig. 1 in side view.
  • On the carrier 14 having a length of material block 1 is glued, which extends in a longitudinal direction 7.
  • Fig. 3 shows the carrier 2 of the invention Fig. 1 in a perspective view before sticking to the longitudinal direction 7 extending material block 1.
  • the carrier 2 has the passage 3 with the at least partially extending in the passage 3 feed 4.
  • the carrier 2 is also in one piece, and may be made of an injection molded part. Its passage 3 extends in the longitudinal direction 7 over the entire length 14 of the carrier 2 and is tubular with a downward gap.
  • the carrier 2 has a two-part adhesive surface 10 which can be bonded to the material block 1, and the material block 1 has a corresponding surface 11 which can be bonded to the carrier 2. After sticking, the adhesive surface 10 abuts substantially on the corresponding surface 11. Since the adhesive surface 10 is divided into two due to the passage 3, it is smaller than the corresponding surface 11.
  • Fig. 4 shows a further carrier 2 according to the invention in a perspective view, which is adhered to a block of material 1.
  • Die Rushplatte 2 ist mit Mate Materialblock 1 dressing.
  • the carrier 2 is made of two plates. The plates may be made of glass, for example. Between the plates, a gap then forms the passage 3, which extends in the longitudinal direction 7 over the entire length 14 of the carrier 2.
  • the feed 4, which may be tubular with a circular cross-section, for example, runs in the gap or passage 3 formed between the plates.
  • the contact surface is 10 of the carrier 2 due to the passage 3 smaller than the corresponding surface 11 of the material block. 1
  • Fig. 5 shows a further carrier 2 according to the invention in a front view, which is glued to a round block of material 1.
  • the carrier 2 is manufactured in one piece from a semicircular plate, has a plurality of passages 3 and the multi-part adhesive surface 10 of the carrier 2 is after sticking to the corresponding surface 11 of the material block 1 at.
  • Fig. 6 schematically shows a carrier 2 according to the invention in side view, to which cut from a block of material 1 wafer 5 1 - 5 x hang.
  • the wafers 5 1 - 5 x are cut transversely to the longitudinal direction 7 of the material block 1, which is indicated by a dashed line. They cling to each other in clumps.
  • Fig. 7 schematically shows the carrier 2 of Fig. 6 in a perspective view.
  • the carrier 2 is manufactured in one piece and has a passage 3, in which a feed 4 is at least partially arranged, which extends in the longitudinal direction 7 of the material block 1.
  • the figure shows that close to the support 2, the gap 15 between the wafers 5 1 - 5 x is maintained and tapers at at least partially adhering wafers 5 1 - 5 x to the lower wafer edge.
  • the figure also shows the surfaces 6 12 - 6 ix of the wafers 5 1 - 5 x , along which the cleaning agent flows.
  • Fig. 8 shows an embodiment of the carrier 2 according to the invention in a perspective view. It shows the Fig. 8 (a) the complete carrier 2 while Fig. 8 (b) the section A from the Fig. 8 (a) shows.
  • the figure shows in particular the adhesive surfaces 10 of the carrier 2, which pass through the passage 3, which extends in the longitudinal direction 7 of the in Fig. 2 shown material block 1 and over the entire length 14 (s. Fig. 2 ) of the carrier 2 extends, is divided.
  • a feed 4 extends with a plurality of openings 8, through which the cleaning agent in the passage 3 and then between the not shown here wafer 5 1 - 5 x is supplied.
  • Fig. 9 shows a further embodiment of the support 2 according to the invention in a perspective view, wherein here the Fig. 9 (a) the complete carrier 2 and Fig. 9 (b) the section A from the Fig. 9 (a) shows.
  • the adhesive surface 10 of the carrier 2 with the passage 3 extending in the longitudinal direction 7 is shown.
  • another embodiment of a feed line 4 extends.
  • the openings 8 of the feed 4 are arranged in a perforated plate 20, which can be inserted separately into the passage 3.
  • Fig. 10 shows an association of inventive carrier 2 and wafer comb in a side view.
  • the wafer comb is represented here by the wafers 5 1 -5 x .
  • the association will, as in Fig. 10a ), cleaned by a horizontal, two-sided and / or central or one-sided liquid supply 4 from above. Cleaning is assisted by horizontal nozzles 16 which are arranged on both sides of the wafer comb and support the cleaning process by additionally adding cleaning liquid to the wafer comb laterally, wherein the nozzles 16 are moved in a displacement direction 17 from top to bottom.
  • the wafer comb hangs free in this case, so that the cleaning liquid flows down.
  • Fig. 10b shows the cleaning in a water bath with optimum liquid level 18.
  • the cleaning of the wafer comb can both for the composite Fig. 10a ) as well as for the composite Fig. 10b ), as exemplified in Fig. 10b ), under water by ultra or megasonic (vibrator not shown) are supported.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
EP09010524A 2008-08-14 2009-08-14 Support, procédé et dispositif de fabrication de tranches de silicium, ainsi que l'utilisation de la tranche de silicium fabriquée Withdrawn EP2153960A3 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE200810037652 DE102008037652A1 (de) 2008-08-14 2008-08-14 Träger, Verfahren und Vorrichtung zum Herstellen von Wafern sowie Verwendung der hergestellten Wafer

Publications (2)

Publication Number Publication Date
EP2153960A2 true EP2153960A2 (fr) 2010-02-17
EP2153960A3 EP2153960A3 (fr) 2012-01-25

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EP09010524A Withdrawn EP2153960A3 (fr) 2008-08-14 2009-08-14 Support, procédé et dispositif de fabrication de tranches de silicium, ainsi que l'utilisation de la tranche de silicium fabriquée

Country Status (2)

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EP (1) EP2153960A3 (fr)
DE (1) DE102008037652A1 (fr)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012007381A1 (fr) * 2010-07-15 2012-01-19 Gebr. Schmid Gmbh & Co. Support pour bloc de silicium, ensemble support comprenant ce support et procédé de fabrication de cet ensemble support
WO2012045686A1 (fr) * 2010-10-08 2012-04-12 Robert Bosch Gmbh Procédé et dispositif de fabrication d'éléments en forme de tranche, en particulier de plaquettes
EP2458626A1 (fr) 2010-11-29 2012-05-30 RENA GmbH Dispositif de nettoyage à retenue et procédé de nettoyage par section de tranches de silicium sciées
EP2711151A1 (fr) 2012-09-24 2014-03-26 Meyer Burger AG Procédé de fabrication de wafers
WO2014085656A1 (fr) * 2012-11-30 2014-06-05 Memc Singapore Pte, Ltd. Appareil et procédés de nettoyage de plaquette
CN107856210A (zh) * 2017-11-23 2018-03-30 江苏高照新能源发展有限公司 金刚线切割硅片用高效节能环保树脂板及脱胶处理方法

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DE102010050897B4 (de) * 2010-07-09 2014-05-22 Interpane Entwicklungs-Und Beratungsgesellschaft Mbh Trägervorrichtung und Verfahren zum Schneiden eines an der Trägervorrichtung befestigten Materialblocks
DE102011018523A1 (de) 2011-03-23 2012-09-27 Schott Solar Ag Herstellung von gesägten Wafern durch Vereinzelung mit einem kalten Fluid

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DE69708168T2 (de) 1996-02-06 2002-06-20 Hct Shaping Systems Sa Cheseau Drahtsägevorrichtung
DE102005028112A1 (de) 2005-06-13 2006-12-21 Schmid Technology Systems Gmbh Verfahren zur Positionierung und Lageerhaltung von Substraten, insbesondere von dünnen Siliziumwafern nach dem Drahtsägen zu deren Vereinzelung

Cited By (14)

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Publication number Priority date Publication date Assignee Title
CN103140336A (zh) * 2010-07-15 2013-06-05 吉布尔·施密德有限责任公司 硅块载体、具有该载体的载体装置和制造载体装置的方法
JP2013531388A (ja) * 2010-07-15 2013-08-01 ゲブリューダー シュミット ゲゼルシャフト ミット ベシュレンクテル ハフツング シリコンブロックのための支持体、そのような支持体を備えた支持体装置、及びそのような支持体装置の製造方法
WO2012007381A1 (fr) * 2010-07-15 2012-01-19 Gebr. Schmid Gmbh & Co. Support pour bloc de silicium, ensemble support comprenant ce support et procédé de fabrication de cet ensemble support
CN103140336B (zh) * 2010-07-15 2015-11-25 吉布尔·施密德有限责任公司 载体装置和制造载体装置的方法
WO2012045686A1 (fr) * 2010-10-08 2012-04-12 Robert Bosch Gmbh Procédé et dispositif de fabrication d'éléments en forme de tranche, en particulier de plaquettes
TWI462172B (zh) * 2010-11-29 2014-11-21 Rena Gmbh 固持／清潔裝置及用於切割過晶圓之帶狀清潔的方法
EP2458626A1 (fr) 2010-11-29 2012-05-30 RENA GmbH Dispositif de nettoyage à retenue et procédé de nettoyage par section de tranches de silicium sciées
DE102010052635A1 (de) 2010-11-29 2012-05-31 Rena Gmbh Halte-Reinigungsvorrichtung und Verfahren zum abschnittsweisen Reinigen gesägter Wafer
EP2711151A1 (fr) 2012-09-24 2014-03-26 Meyer Burger AG Procédé de fabrication de wafers
WO2014045108A1 (fr) 2012-09-24 2014-03-27 Meyer Burger Ag Procédé de fabrication de plaquettes
US20140150826A1 (en) * 2012-11-30 2014-06-05 Memc Singapore Pte. Ltd. (Uen200614794D) Wafer cleaning apparatus and methods
WO2014085656A1 (fr) * 2012-11-30 2014-06-05 Memc Singapore Pte, Ltd. Appareil et procédés de nettoyage de plaquette
CN104969338A (zh) * 2012-11-30 2015-10-07 Memc新加坡私人有限公司 晶片清洗装置和方法
CN107856210A (zh) * 2017-11-23 2018-03-30 江苏高照新能源发展有限公司 金刚线切割硅片用高效节能环保树脂板及脱胶处理方法

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DE102008037652A1 (de) 2010-04-29
EP2153960A3 (fr) 2012-01-25

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