EP2151149A1 - Chip-resistor-substrat - Google Patents

Chip-resistor-substrat

Info

Publication number
EP2151149A1
EP2151149A1 EP08736308A EP08736308A EP2151149A1 EP 2151149 A1 EP2151149 A1 EP 2151149A1 EP 08736308 A EP08736308 A EP 08736308A EP 08736308 A EP08736308 A EP 08736308A EP 2151149 A1 EP2151149 A1 EP 2151149A1
Authority
EP
European Patent Office
Prior art keywords
ceramic substrate
separation
predetermined breaking
breaking lines
lines
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
EP08736308A
Other languages
German (de)
English (en)
French (fr)
Inventor
Claus Peter Kluge
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ceramtec GmbH
Original Assignee
Ceramtec GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ceramtec GmbH filed Critical Ceramtec GmbH
Publication of EP2151149A1 publication Critical patent/EP2151149A1/de
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B28D1/221—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising by thermic methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/01—Mounting; Supporting
    • H01C1/012—Mounting; Supporting the base extending along and imparting rigidity or reinforcement to the resistive element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/006—Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistor chips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/0909—Preformed cutting or breaking line
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1121—Cooling, e.g. specific areas of a PCB being cooled during reflow soldering
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/15—Sheet, web, or layer weakened to permit separation through thickness

Definitions

  • the invention relates to a method for the targeted introduction of separation and / or predetermined breaking lines in ceramic substrates for subsequent separation, in which first in a thermal treatment or process step the separation and / or predetermined breaking line to be created locally and then heated with a Cooling medium is shock-like cooled so that in the ceramic substrate by this temperature change a targeted cracking or weakening material along the separation and / or predetermined breaking line.
  • Metal-ceramic substrates in the form of a multiple substrate are known, in which metallizations (metal areas) are provided on a common, for example large-area ceramic plate or layer, which are each assigned to individual substrates or which form metallizations of individual substrates.
  • metallizations metal areas
  • a common, for example large-area ceramic plate or layer which are each assigned to individual substrates or which form metallizations of individual substrates.
  • predetermined lines forming grooves are introduced by means of lasers, so that the multiple substrate along these predetermined breaking lines can be separated by mechanical breaking into the individual substrates.
  • a disadvantage here is that material, which evaporates when introducing the SoII- breaking lines forming grooves, again deposited on the substrate and so contamination of the multi-substrate, in particular the metal areas occurs, which can interfere with further processing.
  • DE 103 27 360 A1 discloses a method for producing a metal-ceramic substrate, in which (method) at least one metal surface is applied to at least one surface side of a ceramic, and after application of the at least one metal region, the metal-ceramic substrate. Substrate along at least one separation or break line in a thermal treatment or process step is heated and then cooled with a cooling medium shock-like so that in the metal-ceramic substrate by this temperature change targeted cracking or weakening occurs along the separation or predetermined breaking line.
  • the invention has for its object to improve a method according to the preamble of claim 1 so that the material which evaporates when introducing the separation and / or predetermined breaking lines, does not deposit on the multi-substrate, in particular not on the metallized areas or metal areas and so contamination of the multi-substrate, or their metal areas occurs, which would interfere with further processing.
  • a ceramic substrate produced by this method and a preferred use will be described. According to the invention this object is achieved with respect to the method by the features of claim 1.
  • the separation and / or predetermined breaking lines are introduced in the surface of the finished sintered ceramic substrate, i. Before the application of the metallized regions or metal regions, no material which evaporates when introducing the separation and / or predetermined breaking lines can deposit on the multi-substrate, in particular not on its metallized regions or metal regions, thus contaminating the multi-substrate or its metal regions cause.
  • a three-dimensional structure is used for the ceramic substrate.
  • a suitable geometry can be produced for each application.
  • Another inventive embodiment is characterized in that a planar structure is used for the ceramic substrate, preferably with lengths and widths of 1 to 30 cm and thicknesses of less than 2 mm. Especially with these dimensions, high-quality ceramic substrates can be achieved.
  • the energy input during the thermal treatment or process step is controlled so that the separation and / or predetermined breaking lines have a same or different Liehe depth of crack.
  • the crack depth By choosing the crack depth, the refractive power required for breaking can be set in a targeted manner.
  • the separation and / or predetermined breaking lines are introduced on at least two sides of the ceramic substrate.
  • the severance and / or break lines may face each other on two sides of the ceramic substrate, thereby enabling breakage from two sides.
  • the energy input during the thermal treatment or process step is controlled so that the separation and / or predetermined breaking lines do not run continuously from edge to edge of the ceramic substrate, but also have targeted interruptions. As a result, the strength of the ceramic substrate is improved before breaking.
  • rods are used for the ceramic substrate, for example, with cylindrical or rectangular or n-cornered structure or profiles with, for example U- or H- or L-shape. It can be so, depending on the application form, produce any three-dimensional ceramic substrates.
  • the energy input during the thermal treatment or process step is controlled so that the separation and / or predetermined breaking lines are almost invisible to the human eye and no deformation of the surface, as well as contamination along the separation or break line can be seen.
  • the external appearance of the ceramic substrate is flawless without visible separation and / or break lines.
  • the ceramic substrate according to the invention is a completely sintered ceramic on the entire surface, on the surface of which separation and / or predetermined breaking lines for singling are arranged.
  • the ceramic substrate has a three-dimensional structure, whereby the ceramic substrate is adaptable to all application forms.
  • the separation and / or predetermined breaking lines have the same or different crack depth, as a result of which the required refractive power can be selectively adjusted during break-off.
  • the separation and / or predetermined breaking lines are arranged on several sides of the ceramic substrate. This allows the ceramic substrate to be singulated at all imaginable places.
  • the separation and / or predetermined breaking lines do not run continuously from edge to edge of the ceramic substrate, but have targeted interruptions.
  • the separation can also be controlled. - A -
  • the ceramic substrate in the form of rods, for example, with cylindrical or rectangular or n-angular structure or profiles with, for example U- or H- or L-shape.
  • the ceramic substrate can be produced in all advantageous geometries.
  • the separation and / or predetermined breaking lines can also consist of a multiplicity of separation or predetermined breaking points arranged one behind the other, which thereby form a separating or predetermined breaking line. If the cutting lines and / or predetermined breaking lines are introduced with a laser, they always consist of a large number of shots, which in their entirety form a "line".
  • the separation and / or predetermined breaking lines are almost invisible to the human eye and there are no deformations of the surface, and to detect contamination along the separation or predetermined breaking line.
  • a preferred ceramic substrate is characterized in that suitable, a resistance defining, consisting of at least one component material areas and / or components are applied to the provided with separation and / or predetermined breaking lines ceramic substrate, and by breaking along the separation - And / or fracture lines individual components and / or component groups arise, which result in downstream methods chip resistors.
  • a resistive defining consisting of at least one component material areas and / or components are applied to the provided with separation and / or predetermined breaking lines ceramic substrate and By breaking along the separation and / or predetermined breaking lines, single or multiple contiguous components and / or component groups are produced, which result in chip resistors in downstream methods.
  • the components and / or component groups produced in this way which can be processed into chip resistors in downstream processes, are characterized by a rake-free surface and / or virtually smooth rupture edges.
  • At least one predetermined breaking line and / or perforation in the unsintered state by material displacement for example stamping or embossing or pressing, has been introduced on at least one side of the ceramic substrate on the ceramic substrate.
  • at least one predetermined breaking line and / or perforation for example by laser drilling or laser scribing or water jet cutting or drilling, has been introduced on the ceramic substrate on at least one side in the sintered state.
  • the predetermined breaking line and / or perforation can be introduced in the unsintered as well as in the sintered state with the mentioned methods.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Mining & Mineral Resources (AREA)
  • Mechanical Engineering (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Devices For Post-Treatments, Processing, Supply, Discharge, And Other Processes (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Ceramic Capacitors (AREA)
  • Laser Beam Processing (AREA)
EP08736308A 2007-04-25 2008-04-17 Chip-resistor-substrat Ceased EP2151149A1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102007019875 2007-04-25
PCT/EP2008/054638 WO2008132055A1 (de) 2007-04-25 2008-04-17 Chip-resistor-substrat

Publications (1)

Publication Number Publication Date
EP2151149A1 true EP2151149A1 (de) 2010-02-10

Family

ID=39731440

Family Applications (1)

Application Number Title Priority Date Filing Date
EP08736308A Ceased EP2151149A1 (de) 2007-04-25 2008-04-17 Chip-resistor-substrat

Country Status (7)

Country Link
US (1) US8496866B2 (ko)
EP (1) EP2151149A1 (ko)
JP (1) JP5637845B2 (ko)
KR (1) KR101534124B1 (ko)
CN (1) CN101690428B (ko)
DE (1) DE102008001229A1 (ko)
WO (1) WO2008132055A1 (ko)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101383254B1 (ko) * 2012-07-18 2014-04-10 삼화콘덴서공업주식회사 박막 커패시터의 제조방법
WO2015018425A1 (de) 2013-08-07 2015-02-12 Trumpf Laser- Und Systemtechnik Gmbh Verfahren zum bearbeiten eines plattenartigen werkstückes mit einer transparenten, gläsernen, glasartigen, keramischen und/oder kristallinen lage, trennvorrichtung für ein derartiges werkstück sowie produkt aus einem derartigen werkstück
US20180061536A1 (en) * 2016-08-26 2018-03-01 E I Du Pont De Nemours And Company Chip resistor
CN112863793B (zh) * 2021-01-12 2022-07-12 南充三环电子有限公司 一种大规格的陶瓷基板

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050082648A1 (en) * 2002-11-25 2005-04-21 Junya Naito Ceramic package and chip resistor, and method for manufacture thereof
US20050099835A1 (en) * 2003-11-04 2005-05-12 Electro Scientific Industries, Inc. Laser-based termination of passive electronic components

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0610645Y2 (ja) * 1990-01-19 1994-03-16 コーア株式会社 シート状セラミック基板
DE4319944C2 (de) * 1993-06-03 1998-07-23 Schulz Harder Juergen Mehrfach-Substrat sowie Verfahren zu seiner Herstellung
US6420678B1 (en) * 1998-12-01 2002-07-16 Brian L. Hoekstra Method for separating non-metallic substrates
US6327875B1 (en) * 1999-03-09 2001-12-11 Corning Incorporated Control of median crack depth in laser scoring
JP2001167902A (ja) * 1999-12-10 2001-06-22 Matsushita Electric Ind Co Ltd 抵抗器およびその製造方法
CN1308113C (zh) 2001-07-02 2007-04-04 维蒂克激光系统公司 在坚硬的非金属基底内烧蚀开口的方法和装置
KR100509651B1 (ko) * 2001-10-31 2005-08-23 미쓰보시 다이야몬도 고교 가부시키가이샤 반도체 웨이퍼의 스크라이브 라인의 형성방법 및스크라이브 라인의 형성장치
US6744009B1 (en) * 2002-04-02 2004-06-01 Seagate Technology Llc Combined laser-scribing and laser-breaking for shaping of brittle substrates
DE10327360B4 (de) 2003-06-16 2012-05-24 Curamik Electronics Gmbh Verfahren zum Herstellen eines Keramik-Metall-Substrates
DE10330179A1 (de) * 2003-07-02 2005-01-20 Jenoptik Automatisierungstechnik Gmbh Verfahren zum Trennen flacher Werkstücke aus Keramik
TW200621661A (en) * 2004-10-25 2006-07-01 Mitsuboshi Diamond Ind Co Ltd Method and device for forming crack

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050082648A1 (en) * 2002-11-25 2005-04-21 Junya Naito Ceramic package and chip resistor, and method for manufacture thereof
US20050099835A1 (en) * 2003-11-04 2005-05-12 Electro Scientific Industries, Inc. Laser-based termination of passive electronic components

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2008132055A1 *

Also Published As

Publication number Publication date
US20100221478A1 (en) 2010-09-02
DE102008001229A1 (de) 2008-10-30
CN101690428A (zh) 2010-03-31
KR20100017353A (ko) 2010-02-16
KR101534124B1 (ko) 2015-07-06
CN101690428B (zh) 2012-09-05
JP2010527141A (ja) 2010-08-05
WO2008132055A1 (de) 2008-11-06
JP5637845B2 (ja) 2014-12-10
US8496866B2 (en) 2013-07-30

Similar Documents

Publication Publication Date Title
DE102013223637B4 (de) Verfahren zum Behandeln eines lasertransparenten Substrats zum anschließenden Trennen des Substrats
DE102015120950B4 (de) Verfahren zum lasergestützten Ablösen eines Teilstücks von einem flächigen Glas- oder Glaskeramikelement, flächiges zumindest teilweise keramisiertes Glaselement oder Glaskeramikelement und Kochfläche umfassend ein flächiges Glas- oder Glaskeramikelement
DE102004024643B4 (de) Werkstückteilungsverfahren unter Verwendung eines Laserstrahls
WO2017009149A1 (de) Verfahren und vorrichtung zum lasergestützten abtrennen eines teilstücks von einem flächigen glaselement
DE102015111491A1 (de) Verfahren und Vorrichtung zum Abtrennen von Glas- oder Glaskeramikteilen
EP3416921A1 (de) VERFAHREN ZUR KANTENBEARBEITUNG VON GLASELEMENTEN UND VERFAHRENSGEMÄß BEARBEITETES GLASELEMENT
EP1924392A1 (de) Verfahren zum durchtrennen von spröden flachmaterialien mittels laser entlang einer zuvor erzeugten spur
EP3562790A1 (de) Verfahren zum trennen von substraten
WO2009036743A1 (de) Verfahren zum herstellen von schneidrädchen
WO2008132055A1 (de) Chip-resistor-substrat
EP2978561B1 (de) Verfahren zum abtragen von sprödhartem material mittels laserstrahlung
DE102012213071A1 (de) Vorgespanntes Substrat und Verfahren zu dessen Herstellung
DE102010032029B4 (de) Verfahren zum Trennen einer runden Planplatte aus sprödbrüchigem Material in mehrere rechteckige Einzelplatten mittels Laser
DE102014000299B3 (de) Verfahren zur Erzeugung von Durchgängen in einem metallischen Körper mittels Hochgeschwindigkeitsscherschneiden sowie dessen Verwendung
EP3875436B1 (de) Verfahren zum vorbereiten und/oder durchführen des trennens eines substratelements und substratteilelement
DE102020134451A1 (de) Verfahren zum Bearbeiten, insbesondere zum Vortrennen, eines flächigen Substrats
DE102009028259A1 (de) Verfahren zur Herstellung von piezoelektrischen Werkstücken
EP2626895B1 (de) Verfahren und Vorrichtung zum parallelen Trennen eines Werkstücks in mehere Teilstücke
DE102009000073A1 (de) Verfahren und Vorrichtung zur elektrochemischen Bearbeitung von Substraten
EP3738937B1 (de) Verfahren zum herstellen eines uhrglases mit mindestens einer ausnehmung und werkzeug für ein derartiges verfahren
DE102020123928A1 (de) Verfahren und Vorrichtung zum Zuschneiden von Glasfolien
EP1741517A1 (de) Vakuum-Spannvorrichtung zum Fixieren einer Nutzenplatte und entsprechendes Bearbeitungsverfahren
EP2843713B1 (de) Vorrichtung und Verfahren zur Herstellung eines Wafers mit einer Rissverlaufsbeeinflussung
EP4241946A2 (de) Stanzwerkzeug
DE102019107177A1 (de) Verfahren zur Herstellung von Sichteffekten auf einem Bedruckstoff

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20091125

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MT NL NO PL PT RO SE SI SK TR

AX Request for extension of the european patent

Extension state: AL BA MK RS

DAX Request for extension of the european patent (deleted)
17Q First examination report despatched

Effective date: 20101027

RAP1 Party data changed (applicant data changed or rights of an application transferred)

Owner name: CERAMTEC GMBH

REG Reference to a national code

Ref country code: DE

Ref legal event code: R003

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION HAS BEEN REFUSED

18R Application refused

Effective date: 20151214