EP2145292A2 - Support en forme de feuille comportant une piste conductrice et procédé de fabrication du support - Google Patents

Support en forme de feuille comportant une piste conductrice et procédé de fabrication du support

Info

Publication number
EP2145292A2
EP2145292A2 EP08734674A EP08734674A EP2145292A2 EP 2145292 A2 EP2145292 A2 EP 2145292A2 EP 08734674 A EP08734674 A EP 08734674A EP 08734674 A EP08734674 A EP 08734674A EP 2145292 A2 EP2145292 A2 EP 2145292A2
Authority
EP
European Patent Office
Prior art keywords
carrier
electrically conductive
contact point
sheet
conductive material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP08734674A
Other languages
German (de)
English (en)
Inventor
Hans Layer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3A Composites International AG
Original Assignee
Alcan Technology and Management Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alcan Technology and Management Ltd filed Critical Alcan Technology and Management Ltd
Publication of EP2145292A2 publication Critical patent/EP2145292A2/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H05K1/113—Via provided in pad; Pad over filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0323—Carbon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0329—Intrinsically conductive polymer [ICP]; Semiconductive polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates

Definitions

  • the invention relates to a sheet-like support made of a flexible material, with at least one conductor track arranged on one side of the support with at least one electrically conductive connection to a contact point.
  • the invention further relates to a method for producing a sheet-like carrier made of a flexible material, comprising at least one arranged on one side of the carrier track, at least one contact point on the other side of the carrier and an electrically conductive connection to a contact point opposite contact point on the conductor track ,
  • a commercially available blister pack is sealed with a plastic film with a printed circuit trace, a so-called printed circuit film
  • the blister is placed in a monitor which counteracts certain contact surfaces of the blister pack. If a tablet is pressed out of the blister pack, an interconnect and thus the current flow is irreversibly interrupted. status change is registered by the electronics of the monitor.
  • RFID Radio Frequency Identification
  • Known RFID tags consist of a carrier made of a plastic film with a transponder and an antenna in the form of a trace imprint.
  • the above-mentioned systems additionally have electrical contact surfaces and electrically conductive connections from and to the interconnects and, if appropriate, between interconnects. sections on.
  • the conductor tracks, the contact surfaces and the electrical connections are arranged on one and the same surface of the carrier.
  • the invention has for its object to provide a sheet-shaped support with a conductor path arranged on one side on the back with contact points for the conductor track and electrically connect the contact points in a simple and cost-effective manner with the contact points opposite contact points on the conductor track.
  • the at least one contact point is arranged on the other side of the carrier and the electrically conductive connection between the contact point and a contact point opposite the contact point on the conductor track is an opening in the carrier filled with an electrically conductive mass ,
  • the electrically conductive compound is preferably a lacquer containing at least one electrically conductive material.
  • the electrically conductive material may be a powder of metal and / or graphite or an intrinsically conductive polymer.
  • the contact pad on the back side of the carrier provided on the front side with the conductor track may be an aluminum foil connected to the carrier.
  • the sheet-shaped carrier can be a plastic film, paper or a laminate at least two of the aforementioned materials. Suitable plastic films are z. As films of PVC, polyamide, polyethylene, polypropylene and polyester.
  • the carrier (10) is provided at the intended contact point z. B. pierced with a needle and filled the opening (20) with an electrically conductive material.
  • Preferred fields of application of the sheet-like carrier according to the invention with the conductor track arranged on one side are smart blisters and RFID tags.
  • FIG. 1 shows the plan view of a sheet-shaped carrier with a conductor track as antenna for an RFID tag
  • FIG. 2 shows a section through the carrier of FIG. 1 along the line I-I in an enlarged view
  • FIG. 3 is a plan view of the back side of the carrier of FIG. 1;
  • FIG. 4 shows the plan view of a detail of a sheet-shaped carrier with two contacted conductor track sections
  • FIG. 5 shows a section through the carrier of Figure 4 along the line M-II in an enlarged view ..;
  • FIG. 6 is a section through another embodiment of the carrier gers of Fig. 4 along the line 11-11 in an enlarged view.
  • sheet-shaped carrier 10 rectangular cross-section is part of a not shown in the drawing for reasons of clarity RFI D-tags.
  • a plastic film of z. B. PVC-made carrier is on a first side, hereinafter referred to as front 12, with a conductor 16 made of an electrically conductive material, for. B. from a with a metallic powder such. B. silver powder, enriched paint, printed.
  • the conductor track 16 is arranged spirally as an antenna and has a connection point 18 at one of its ends. At the connection point 18, the carrier 10 has an opening 20 extending from the front side 12 to the rear side 14 in the form of a small-diameter tubular channel.
  • a contact strip 22 of an electrically conductive material EL extends through the opening of the opening 20, wherein the electrically conductive material EL through the opening 20 and out through the opening in the front side 12 of the carrier 10 to form a Contact point 24 via the adjacent conductor 16 pours.
  • the contacting of the connection point 18 is thus laid in the present example by the electrically conductive material EL from the contact point 24 of the conductor 16 on the front side of the carrier 10 via the opening 20 to the contact strip 22 on the back 14 of the carrier 10.
  • FIG. 4 shows a sheet-shaped carrier 10, on the front side 12 of which two electrically conductive interconnected conductor track sections 16 a, b run on the rear side 14.
  • the electrically conductive connection is made by the electrically conductive material EL from the contact points 24 a, b of the tracks 16 a, b on the front side 12 of the carrier 10 via the apertures 20 a, b to the two openings of the openings 20 a , B on the back 14 of the carrier 10th overlapping contact strip 22.
  • the sheet-shaped support 10 made of PVC is laminated on its rear side with an aluminum foil 26.
  • the electrically conductive connection between the two conductor track sections 16 a, b takes place here by the electrically conductive material EL from the contact points 24 a, b of the conductor track sections 16 a, b on the front side 12 of the carrier 10 via the openings 20 a, b for electrically conductive Aluminum foil 26 on the back 14 of the carrier 10.
  • the arrangement of a the openings of the openings 20 a, b on the back 14 of the carrier 10 cross-contact strip is unnecessary.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Manufacture Of Switches (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

L'invention concerne un support en forme de feuille (10) réalisé dans un matériau flexible, comportant une piste conductrice (16) disposée sur un côté (12) du support (10), pourvue d'une connexion électrique avec une zone de contact (22) disposée sur l'autre côté (14) du support (10). La connexion électrique entre la zone de contact (22) et un point de contact (24) situé sur la piste conductrice (16), opposé à la zone de contact (22), est un passage (20) réalisé dans le support (10), rempli d'une masse électroconductrice (EL).
EP08734674A 2007-04-10 2008-03-19 Support en forme de feuille comportant une piste conductrice et procédé de fabrication du support Withdrawn EP2145292A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CH5862007 2007-04-10
PCT/EP2008/002202 WO2008122347A2 (fr) 2007-04-10 2008-03-19 Support en forme de feuille comportant une piste conductrice et procédé de fabrication du support

Publications (1)

Publication Number Publication Date
EP2145292A2 true EP2145292A2 (fr) 2010-01-20

Family

ID=39769165

Family Applications (1)

Application Number Title Priority Date Filing Date
EP08734674A Withdrawn EP2145292A2 (fr) 2007-04-10 2008-03-19 Support en forme de feuille comportant une piste conductrice et procédé de fabrication du support

Country Status (2)

Country Link
EP (1) EP2145292A2 (fr)
WO (1) WO2008122347A2 (fr)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0818752A2 (fr) * 1996-07-08 1998-01-14 Fela Holding AG Carte à circuits (Inlet) pour des cartes à puces
DE19811578A1 (de) * 1998-03-17 1999-10-14 Siemens Ag Mehrlagige Leiterplatte sowie Verfahren zu deren Herstellung
US6421013B1 (en) * 1999-10-04 2002-07-16 Amerasia International Technology, Inc. Tamper-resistant wireless article including an antenna
US6973710B2 (en) * 2001-08-03 2005-12-13 Seiko Epson Corporation Method and apparatus for making devices

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO2008122347A3 *

Also Published As

Publication number Publication date
WO2008122347A2 (fr) 2008-10-16
WO2008122347A3 (fr) 2008-11-27

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Effective date: 20100615