EP2141261A3 - Solution électrolytique de plaquage d'étain et procédé électrolytique de plaquage d'étain - Google Patents

Solution électrolytique de plaquage d'étain et procédé électrolytique de plaquage d'étain Download PDF

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Publication number
EP2141261A3
EP2141261A3 EP09155197A EP09155197A EP2141261A3 EP 2141261 A3 EP2141261 A3 EP 2141261A3 EP 09155197 A EP09155197 A EP 09155197A EP 09155197 A EP09155197 A EP 09155197A EP 2141261 A3 EP2141261 A3 EP 2141261A3
Authority
EP
European Patent Office
Prior art keywords
tin plating
electrolytic tin
plating method
plating
plating solution
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP09155197A
Other languages
German (de)
English (en)
Other versions
EP2141261B1 (fr
EP2141261A2 (fr
Inventor
Masaaki Imanari
Fai Lung Ting
Motoya Shimazu
Yasuo Ohta
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm and Haas Electronic Materials LLC
Original Assignee
Rohm and Haas Electronic Materials LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm and Haas Electronic Materials LLC filed Critical Rohm and Haas Electronic Materials LLC
Publication of EP2141261A2 publication Critical patent/EP2141261A2/fr
Publication of EP2141261A3 publication Critical patent/EP2141261A3/fr
Application granted granted Critical
Publication of EP2141261B1 publication Critical patent/EP2141261B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/30—Electroplating: Baths therefor from solutions of tin
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/16—Apparatus for electrolytic coating of small objects in bulk

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
EP09155197.8A 2008-06-12 2009-03-16 Solution électrolytique de placage d'étain et procédé électrolytique de placage d'étain Active EP2141261B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008154461A JP5583894B2 (ja) 2008-06-12 2008-06-12 電気錫めっき液および電気錫めっき方法

Publications (3)

Publication Number Publication Date
EP2141261A2 EP2141261A2 (fr) 2010-01-06
EP2141261A3 true EP2141261A3 (fr) 2010-07-28
EP2141261B1 EP2141261B1 (fr) 2017-03-01

Family

ID=41334608

Family Applications (1)

Application Number Title Priority Date Filing Date
EP09155197.8A Active EP2141261B1 (fr) 2008-06-12 2009-03-16 Solution électrolytique de placage d'étain et procédé électrolytique de placage d'étain

Country Status (6)

Country Link
US (1) US20100000873A1 (fr)
EP (1) EP2141261B1 (fr)
JP (1) JP5583894B2 (fr)
KR (1) KR101593475B1 (fr)
CN (1) CN101619470B (fr)
TW (1) TWI468554B (fr)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2395131A4 (fr) 2009-02-06 2013-02-06 Kenji Dewaki Bain de placage d'alliage contenant de l'argent et procédé de placage électrolytique utilisant celui-ci
JP4531128B1 (ja) * 2009-07-31 2010-08-25 謙治 出分 スズ含有合金メッキ浴、これを用いた電解メッキ方法および該電解メッキが堆積された基体
JP2012021224A (ja) * 2010-06-15 2012-02-02 Mitsubishi Shindoh Co Ltd 錫めっき液中のスラッジ発生防止方法
US8888984B2 (en) * 2012-02-09 2014-11-18 Rohm And Haas Electronic Materials Llc Plating bath and method
EP2740820A1 (fr) 2012-12-04 2014-06-11 Dr.Ing. Max Schlötter GmbH & Co. KG Electrolyte et procédé de séparation de couches pouvant être soudées
JP6133056B2 (ja) * 2012-12-27 2017-05-24 ローム・アンド・ハース電子材料株式会社 スズまたはスズ合金めっき液
US20150122662A1 (en) * 2013-11-05 2015-05-07 Rohm And Haas Electronic Materials Llc Plating bath and method
US20150122661A1 (en) * 2013-11-05 2015-05-07 Rohm And Haas Electronic Materials Llc Plating bath and method
WO2015084778A1 (fr) * 2013-12-05 2015-06-11 Honeywell International Inc. Solution de méthanesulfonate stanneux à ph ajusté
CN105755513A (zh) * 2016-04-28 2016-07-13 四川昊吉科技有限公司 一种镀锡防腐剂
JP6818520B2 (ja) 2016-11-11 2021-01-20 ローム・アンド・ハース電子材料株式会社 中性スズめっき液を用いたバレルめっきまたは高速回転めっき方法
JP6620858B2 (ja) * 2017-10-24 2019-12-18 三菱マテリアル株式会社 錫又は錫合金めっき堆積層の形成方法
WO2019082885A1 (fr) * 2017-10-24 2019-05-02 三菱マテリアル株式会社 Liquide de placage à base d'étain ou d'un alliage d'étain
WO2019121092A1 (fr) 2017-12-20 2019-06-27 Basf Se Composition pour électroplacage d'étain ou d'alliage d'étain comprenant un agent suppresseur
KR20210002514A (ko) 2018-04-20 2021-01-08 바스프 에스이 억제제를 포함하는 주석 또는 주석 합금 전기도금을 위한 조성물
CN109518233B (zh) * 2018-11-27 2020-07-14 东莞美坚化工原料有限公司 一种防止微型电子元器件粘片的导电溶液及其制备方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4135991A (en) * 1977-08-12 1979-01-23 R. O. Hull & Company, Inc. Bath and method for electroplating tin and/or lead
US4717460A (en) * 1983-12-22 1988-01-05 Learonal, Inc. Tin lead electroplating solutions
US20060051610A1 (en) * 2001-05-24 2006-03-09 Shipley Company, L.L.C. Tin plating
EP1754805A1 (fr) * 2005-08-19 2007-02-21 Rohm and Haas Electronic Materials LLC Solution électrolytique de zinc et méthode d'électroplacage de zinc

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE553400A (fr) * 1956-01-16
US3616306A (en) * 1969-11-19 1971-10-26 Conversion Chem Corp Tin plating bath and method
US4000047A (en) * 1972-11-17 1976-12-28 Lea-Ronal, Inc. Electrodeposition of tin, lead and tin-lead alloys
US4871429A (en) * 1981-09-11 1989-10-03 Learonal, Inc Limiting tin sludge formation in tin or tin/lead electroplating solutions
US4582576A (en) * 1985-03-26 1986-04-15 Mcgean-Rohco, Inc. Plating bath and method for electroplating tin and/or lead
US4885064A (en) * 1989-05-22 1989-12-05 Mcgean-Rohco, Inc. Additive composition, plating bath and method for electroplating tin and/or lead
JP2856857B2 (ja) * 1990-07-27 1999-02-10 石原薬品株式会社 錫、鉛または錫―鉛合金めっき浴
JP2001040498A (ja) * 1999-07-27 2001-02-13 Ne Chemcat Corp 錫−銅合金めっき皮膜で被覆された電子部品
JP2001234387A (ja) * 2000-02-17 2001-08-31 Yuken Industry Co Ltd 錫系電気めっきのウィスカー発生防止剤および防止方法
JP3910028B2 (ja) 2001-09-13 2007-04-25 株式会社村田製作所 チップ型セラミックス電子部品の電極形成法
JP2009516388A (ja) * 2005-11-18 2009-04-16 レプリソールス テクノロジーズ アーベー 多層構造の形成方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4135991A (en) * 1977-08-12 1979-01-23 R. O. Hull & Company, Inc. Bath and method for electroplating tin and/or lead
US4717460A (en) * 1983-12-22 1988-01-05 Learonal, Inc. Tin lead electroplating solutions
US20060051610A1 (en) * 2001-05-24 2006-03-09 Shipley Company, L.L.C. Tin plating
EP1754805A1 (fr) * 2005-08-19 2007-02-21 Rohm and Haas Electronic Materials LLC Solution électrolytique de zinc et méthode d'électroplacage de zinc

Also Published As

Publication number Publication date
TW201006966A (en) 2010-02-16
JP5583894B2 (ja) 2014-09-03
EP2141261B1 (fr) 2017-03-01
CN101619470B (zh) 2012-03-28
CN101619470A (zh) 2010-01-06
EP2141261A2 (fr) 2010-01-06
JP2009299123A (ja) 2009-12-24
KR101593475B1 (ko) 2016-02-12
KR20090129373A (ko) 2009-12-16
TWI468554B (zh) 2015-01-11
US20100000873A1 (en) 2010-01-07

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