EP2117766A1

EP2117766A1 - Solder alloys and method for the repair of a component

Info

Publication number: EP2117766A1
Application number: EP08709220A
Authority: EP
Inventors: Paul Heinz; Robert Singer
Original assignee: MTU Aero Engines GmbH; Siemens AG
Current assignee: Siemens AG
Priority date: 2007-03-14
Filing date: 2008-02-26
Publication date: 2009-11-18
Also published as: JP2010520814A; US8613885B2; KR20120059653A; KR20100034729A; WO2008110454A1; KR101301232B1; JP5780703B2; US20100025454A1

Abstract

Many known solder alloys according to prior art utilize silicon or boron as melting point reducers, which, however, form brittle phases that have an undesirable effect on the thermo-mechanical properties. The solder alloy comprises gallium and/or germanium, preferably forming the Y' phase and having improved mechanical properties.

Description

Solder alloys and methods for repairing a component

The invention relates to solder alloys according to claims 1, 2, 3, 4, 5 and a method for repairing a component according to claim 55.

Components sometimes need to be repaired after manufacture, for example after casting or after they have been used and cracked.

There are various repair methods such. As the welding method, in which, however, a substrate material of the component with must be melted, which can lead to damage in particular of cast and directionally solidified components and for evaporation of components of the substrate material.

A soldering process works with respect to the temperature during the welding process and thus with respect to the melting temperature of the substrate material at lower temperatures. Nevertheless, the solder should have a high strength, so that the solder-filled crack or the recess does not lead to a weakening of the entire component at the high operating temperatures.

It is therefore an object of the invention to show a solder alloy and a method for repairing a component, which overcomes the above-mentioned problem.

The object is achieved by a solder made of a solder alloy according to claim 1, 2, 3, 4 or 5 and by a method according to claim 55.

In the subclaims further advantageous measures are listed, which can be combined with each other in an advantageous manner. Show it :

FIG. 1 shows two cross-sectional views of a component during and after a treatment with the solder according to the invention,

FIG. 2 shows in perspective a turbine blade,

FIG. 3 shows in perspective a combustion chamber,

FIG. 4 shows a gas turbine

Figure 5 is a list of superalloys.

FIG. 1 shows a component 1 which is treated with a solder 10 made of a solder alloy according to the invention. The component 1 comprises a substrate 4 which, in particular for components for high-temperature applications, in particular for turbine blades 120, 130 (FIG. 2) or combustion chamber elements 155 (FIG. 3) for steam or gas turbines 100 (FIG cobalt-based superalloy (Figure 5). The solder 10 can preferably be used for all alloys according to FIG.

These may preferably be the known materials PWA 1483, PWA 1484 or Rene N5.

Lot 10 is also used for blades for aircraft.

The substrate 4 has a crack 7 or a recess 7, which is to be filled by soldering. The cracks 7 or recesses 7 are preferably about 200 microns wide and can be up to 5mm deep. The solder 10 is made of a solder alloy in or in the

Applied near the recess 7 and by a heat treatment (+ T), the solder 10 melts below a melting temperature on the substrate 4 and fills the recess 7 completely.

The solder alloy 10 is nickel-based and therefore preferably has nickel (Ni) as the largest proportion.

Preferably, a binary system of Ni-Ge or Ni-Ga is used.

The content of gallium (Ga) is preferably at least 0.1wt%. Also preferably, the germanium content is at least 0.1wt%. Even these small proportions have an influence on the soldering behavior of nickel or a nickel alloy.

In addition to the remainder of nickel as well as gallium and / or germanium, further constituents chromium (Cr), cobalt (Co), aluminum (Al) and titanium (Ti), tungsten (W), molybdenum (Mo) or tantalum (Ta) may preferably be present, if used, in each case preferably used with a proportion of at least 0. lwt%.

The chromium content is preferably in a range of 2wt%

10wt%, in particular in a range of 3wt% - 9wt%, with particularly preferred embodiments having a chromium content of 4wt% or 8wt%, so that preferred chromium values also in a range from 3wt% to 5wt% or 7wt% to 9wt%, preferably at 8wt%.

Preferably, the content is also at 4wt% chromium.

The aluminum content is preferably in the range of 1% to 5% by weight, particularly preferably in the range of 2% by weight.

- 4wt%. A particularly good embodiment has a solder alloy with an aluminum content of 3wt%. The tungsten content is preferably in a range of 2wt% - 6wt%, more preferably in a range of 3wt% - 5wt%. Particularly good results were achieved with a tungsten content of 4wt%.

The cobalt content is in a range of 2wt% - 10wt%, more preferably in a range of 3wt% - 9wt%. Particularly preferred embodiments have a cobalt content of 4wt% or 8wt%, so that particularly preferred cobalt contents at 3wt% to 5wt% or 7wt% to

9wt%, especially at 8wt%. Preferably, the cobalt content is also 4wt%.

The gallium or germanium content is preferably at least 3wt%, more preferably at least 6wt%.

Preferably, the germanium or gallium content can be limited to a maximum value of 18wt%. Also preferably, the maximum content of gallium or germanium is 13wt%, most preferably this maximum content is 8wt%.

The proportion of gallium (Ga) in a nickel-base superalloy as a solder alloy is preferably between 28wt% and 35wt%.

The proportion of germanium is preferably between 18wt% and 28wt%, in particular 20wt%, 23wt%, 26wt% or 27wt%, in particular in binary systems, ie NiGe20, NiGe23 or NiGe26, in particular for monocrystalline solidification.

Preferably, the above list of ingredients for the solder is nickel, chromium, cobalt, tungsten, aluminum, gallium or germanium.

Preferably, either only gallium or germanium is used. In the following, advantageously used alloys are listed in a final composition, the alloy having either only germanium or only gallium or also germanium and gallium (G = gallium and / or germanium, therefore only Ga or only Ge or Ga and Ge):

Ni-Cr-G Ni-Co-G Ni-W-G Ni-Al-G

Ni-Cr-Co-G Ni-Cr-W-G Ni-Cr-Al-G Ni-Co-W-G Ni-Co-Al-G Ni-W-Al-G

Ni-Cr-Co-W-G Ni-Cr-Co-Al-G Ni-Cr-W-Al-G Ni-Co-W-Al-G

Ni-Cr-Co-W-Al-G.

The solder 10 preferably contains no boron.

Also preferably, the solder 10 does not contain zirconium.

Also, the addition of rhenium can preferably be dispensed with. Likewise, preferably no hafnium is used.

Preferably, the addition or presence of silicon and / or carbon is avoided as they form brittle phases in the solder. It is also preferred to avoid the addition or presence of iron and / or manganese since the elements form low melting or non-oxidizing phases. The solder 10 can be connected to the substrate 4 of the component 1, 120, 130, 155 in an isothermal or a temperature gradient method. A gradient method is then preferably provided when the substrate 4 has a directional structure, for example an SX or DS structure, such that the solder 10 subsequently has a directed structure. However, a directionally solidified structure in solder can also be carried out in an isothermal process.

Likewise, the component 1 need not have a directionally solidified structure (but a CC structure). Likewise, the solders in CC substrates of components in a CC structure can be soldered and solidified, the solders then being polycrystalline solidified (CC).

Especially for the polycrystalline solidification of the solders, the following solders are particularly interesting:

NiGe

NiGeW4A13

NiGeCo8W4

NiGeCr8W4

NiGeCr8Co8W4A13 NiGeCrδCoδ

NiGeCo8A13

NiGeCr8A13

NiGeCr4Co4W2All, 5.

The germanium content is 20wt% - 30wt%, in particular 26wt% or 27wt%. In the melting (isothermal method or gradient method), it is preferable to use an inert gas, especially argon, which reduces the chromium evaporation from the substrate 4 at the high temperatures, or uses a reducing gas (argon / hydrogen).

The solder 10 can also be applied over a large area to a surface of a component 1, 120, 130, 155 in order to achieve a thickening of the substrate 4, in particular in the case of hollow components. Preferably, the solder 10 is used to fill in cracks 7 or depressions 7.

The procedure and its parameters

When soldering a solder 10 under vacuum, which is often carried out when the solder 10 or the component 1, 120, 130, 155 oxidizes, preferably results from the use of inert gases (Ar, He, Ar / He, H2. ..) and / or the use of vacuum the problem of evaporation of components of the component 1, 120, 130, 155 or the solder 10 at too low a process pressure.

If the oxygen partial pressure P02 is too high, oxidation of the solder 10 or of the component 1, 120, 130, 155 takes place.

The method according to the invention therefore further preferably proposes to carry out the soldering process in a vacuum of a process chamber, preferably in an oven at an oxygen partial pressure p _O 2 of at most 10 ^-6 mbar (= 10 ^-4 Pa). The oxygen partial pressure p _O 2 is preferably at least 10 ^"7 mbar ^{(10" 5} Pa).

The total process pressure is preferably at most 100 mbar (= 10000 Pa), in particular at most 10 mbar (1000 Pa). The total process pressure is preferably at least 0, lmbar (10Pa).

Particularly good solder joints were achieved at a pressure of lmbar (= 100Pa). These pressure values are achieved, in particular, by virtue of the fact that the process chamber has a vacuum inside and is preferably pumped out permanently and preferably is purged with a pure inert gas, preferably argon (Ar) (Ar 5.0, preferably Ar 6.0) before soldering.

This preferably takes place for at least 10 hours, in particular for 48 hours, with a flow rate of preferably between 0.21 / min and 11 / min.

In this case, preference is given to using argon 6.0 (meaning an oxygen content of 5 × 10 ^{~ 7} in the process gas), which is preferably filtered through a gas cleaning cartridge, so that the oxygen and water content is reduced by a factor of 100, so that an oxygen content of 5 × 10 2 ^{~ 9 is achieved} in the process gas, which is introduced into the process chamber.

During the soldering process, argon is also preferably present within the pressure values described above.

The temperature during the soldering process is at least 1140 ^° C., in particular at least 1160 ^° C.

Further advantageous soldering temperatures are 1160 ⁰ C,

1180 ⁰ C, 1200 ° C, 1230 ° C and 1260 ° C. The maximum temperature is preferably 1280 ^° C., in particular maximum 1260 ^° C.

The duration of the soldering treatment is preferably at least 10 hours, especially at 48 hours.

FIG. 2 shows a perspective view of a moving blade 120 or guide blade 130 of a turbomachine that extends along a longitudinal axis 121.

The turbomachine may be a gas turbine of an aircraft or a power plant for power generation, a steam turbine or a compressor. The blade 120, 130 has along the longitudinal axis 121 consecutively a fastening region 400, a blade platform 403 adjacent thereto and an airfoil 406 and a blade tip 415. As a guide blade 130, the blade 130 may have at its blade tip 415 another platform (not shown).

In the mounting region 400, a blade root 183 is formed, which serves for attachment of the blades 120, 130 to a shaft or a disc (not shown). The blade root 183 is designed, for example, as a hammer head. Other designs as Christmas tree or Schwalbenschwanzfuß are possible. The blade 120, 130 has a leading edge 409 and a trailing edge 412 for a medium flowing past the airfoil 406.

In conventional blades 120, 130, in all regions 400, 403, 406 of the blade 120, 130, for example, massive metallic materials, in particular superalloys, are used, in particular the superalloys according to FIG. 5. Such superalloys are known, for example, from EP 1 204 776 B1, EP 1 306 454, EP 1 319 729 A1, WO 99/67435 or WO 00/44949; These documents are part of the disclosure regarding the chemical composition of the alloy. The blade 120, 130 can hereby be manufactured by a casting process, also by directional solidification, by a forging process, by a milling process or combinations thereof.

Workpieces with a monocrystalline structure or structures are used as components for machines which are exposed to high mechanical, thermal and / or chemical stresses during operation.

The production of such monocrystalline workpieces, for example, by directed solidification from the melt. These are casting processes in which the liquid metallic alloy to monocrystalline structure, ie the single-crystal workpiece, or directionally solidified. Here, dendritic crystals are aligned along the heat flow and form either a columnar grain structure (columnar, ie grains that run the entire length of the workpiece and here, in common parlance, referred to as directionally solidified) or a monocrystalline structure, ie the whole Workpiece consists of a single crystal. In these processes, it is necessary to avoid the transition to globulitic (polycrystalline) solidification, since non-directional growth necessarily produces transverse and longitudinal grain boundaries which negate the good properties of the directionally solidified or monocrystalline component. If the term generally refers to directionally solidified structures, it refers both to single crystals which have no grain boundaries or at most small-angle grain boundaries, and to columnar crystal structures which have grain boundaries which are probably in the longitudinal direction but no transverse grain boundaries. In these second-mentioned crystalline

Structures are also known as directionally rigidified structures

(directionally solidified structures).

Such methods are known from US Pat. No. 6,024,792 and EP

0 892 090 Al known; these writings are part of the disclosure with regard to the solidification process.

Likewise, the blades 120, 130 may have coatings against corrosion or oxidation, e.g. M is at least one element of the group iron (Fe), cobalt (Co), nickel (Ni), X is an active element and stands for yttrium (Y) and / or silicon and / or at least one element of the rare ones Earth, or hafnium (Hf)). Such alloys are known from EP 0 486 489 B1, EP 0 786 017 B1, EP 0 412 397 B1 or EP 1 306 454 A1, which should be part of this disclosure with regard to the chemical composition of the alloy. The density is preferably 95% of the theoretical density. A protective aluminum oxide layer (TGO = thermal grown oxide layer) is formed on the MCrAlX layer (as an intermediate layer or as the outermost layer).

Preferably, the layer composition comprises Co-30Ni-28Cr-8A1-0, 6Y-0, 7Si or Co-28Ni-24Cr-10Al-0, 6Y. In addition to these cobalt-based protective coatings, nickel-based protective layers such as Ni-10Cr-12Al-0.6Y-3Re or Ni-12Co-21Cr-IIAl-O, 4Y-2Re or Ni-25Co-17Cr-10Al-0.4Y-1 are also preferably used , 5RE.

On the MCrAlX may still be present a thermal barrier coating, which is preferably the outermost layer, and consists for example of Zrθ2, Y2Ü3-Zrθ2, i. it is not, partially or completely stabilized by yttrium oxide and / or calcium oxide and / or magnesium oxide. The thermal barrier coating covers the entire MCrAlX layer. By suitable coating methods, e.g. Electron beam evaporation (EB-PVD) produces stalk-shaped grains in the thermal barrier coating.

Other coating methods are conceivable, e.g. atmospheric plasma spraying (APS), LPPS, VPS or CVD. The thermal barrier coating may have porous, micro- or macro-cracked grains for better thermal shock resistance. The thermal barrier coating is therefore preferably more porous than the MCrAlX layer.

Refurbishment means that components 120, 130 may need to be stripped of protective layers after use (e.g., by sandblasting). This is followed by removal of the corrosion and / or oxidation layers or products. Optionally, even cracks in the component 120, 130 are repaired. This is followed by a re-coating of the component 120, 130 and a renewed use of the component 120, 130.

The blade 120, 130 may be hollow or solid. If the blade 120, 130 is to be cooled, it is hollow and may still film cooling holes 418 (indicated by dashed lines) on.

FIG. 3 shows a combustion chamber 110 of a gas turbine. The combustion chamber 110 is configured, for example, as a so-called annular combustion chamber, in which a plurality of burners 107 arranged in the circumferential direction around a rotation axis 102 open into a common combustion chamber space 154, which generate flames 156. For this purpose, the combustion chamber 110 is configured in its entirety as an annular structure, which is positioned around the axis of rotation 102 around.

To achieve a comparatively high efficiency, the combustion chamber 110 is designed for a comparatively high temperature of the working medium M of about 1000 ^° C. to 1600 ^° C. In order to lend a comparatively long service life to these operating parameters, which are unfavorable for the materials, the combustion chamber wall 153 is provided on its side facing the working medium M with an inner lining formed of heat shield elements 155.

Each heat shield element 155 made of an alloy is equipped on the working medium side with a particularly heat-resistant protective layer (MCrAlX layer and / or ceramic coating) or is made of high-temperature-resistant material (solid ceramic blocks).

These protective layers may be similar to the turbine blades, so for example MCrAlX means: M is at least one element of the group iron (Fe), cobalt (Co), nickel (Ni), X is an active element and stands for yttrium (Y) and / or silicon and / or at least one element of the rare earths, or hafnium (Hf). Such alloys are known from EP 0 486 489 B1, EP 0 786 017 B1, EP 0 412 397 B1 or EP 1 306 454 A1, which should be part of this disclosure with regard to the chemical composition of the alloy. On the MCrAlX may still be present, for example, a ceramic thermal barrier coating and consists for example of ZrO ₂ , Y2Ü3-Zrθ2, ie it is not, partially or fully ^¬ dig stabilized by yttria and / or calcium oxide and / or magnesium oxide.

By suitable coating methods, e.g. Electron beam evaporation (EB-PVD) produces stalk-shaped grains in the thermal barrier coating.

Other coating methods are conceivable, e.g. Atmospheric plasma spraying (APS), LPPS, VPS or CVD. The thermal barrier coating may have porous, micro- or macro-cracked grains for better thermal shock resistance.

Refurbishment means that heat shield elements 155 may be replaced after use by heat shielding elements 155

Protective layers must be freed (for example by sandblasting). This is followed by removal of the corrosion and / or oxidation layers or products. If necessary, cracks in the heat shield element 155 are also repaired. This is followed by a recoating of the heat shield elements 155 and a renewed use of the heat shield elements 155.

Due to the high temperatures inside the combustion chamber 110 may also be provided for the heat shield elements 155 and for their holding elements, a cooling system. The heat shield elements 155 are then, for example, hollow and possibly still have cooling holes (not shown) which open into the combustion chamber space 154.

FIG. 4 shows by way of example a gas turbine 100 in a longitudinal partial section.

The gas turbine 100 has inside a rotatably mounted about a rotation axis 102 rotor 103 with a shaft 101, which is also referred to as a turbine runner.

Along the rotor 103 successively follow an intake housing 104, a compressor 105, for example, a torus-like Combustion chamber 110, in particular annular combustion chamber, with a plurality of coaxially arranged burners 107, a turbine 108 and the exhaust housing 109th

The annular combustion chamber 110 communicates with an annular annular hot gas channel 111, for example. There, for example, four turbine stages 112 connected in series form the turbine 108.

Each turbine stage 112 is formed, for example, from two blade rings. As seen in the direction of flow of a working medium 113, in the hot gas channel 111 of a row of guide vanes 115, a series 125 formed of rotor blades 120 follows.

The guide vanes 130 are fastened to an inner housing 138 of a stator 143, whereas the moving blades 120 of a row 125 are attached to the rotor 103 by means of a turbine disk 133, for example.

Coupled to the rotor 103 is a generator or work machine (not shown).

During operation of the gas turbine 100, air 105 is sucked in and compressed by the compressor 105 through the intake housing 104. The compressed air provided at the turbine-side end of the compressor 105 is supplied to the burners 107 where it is mixed with a fuel. The mixture is then burned to form the working fluid 113 in the combustion chamber 110. From there, the working medium 113 flows along the hot gas channel 111 past the guide vanes 130 and the rotor blades 120. On the rotor blades 120, the working medium 113 expands in a pulse-transmitting manner, so that the rotor blades 120 drive the rotor 103 and drive the machine coupled to it.

The components exposed to the hot working medium 113 are subject to thermal loads during operation of the gas turbine 100. The guide vanes 130 and rotor blades 120 of the first turbine stage 112 seen in the direction of flow of the working medium 113 become, in addition to the annular combustion chamber 110 lining heat shield elements most thermally stressed.

To withstand the prevailing temperatures, they can be cooled by means of a coolant. Likewise, substrates of the components may have a directional structure, i. they are monocrystalline (SX structure) or have only longitudinal grains (DS structure). As the material for the components, in particular for the turbine blade 120, 130 and components of the combustion chamber 110, for example, iron-, nickel- or cobalt-based superalloys are used.

Such superalloys are known, for example, from EP 1 204 776 B1, EP 1 306 454, EP 1 319 729 A1, WO 99/67435 or WO 00/44949; These documents are part of the disclosure regarding the chemical composition of the alloys.

Also, the blades 120, 130 may be anti-corrosion coatings (MCrAlX; M is at least one element of the group iron (Fe), cobalt (Co), nickel (Ni), X is an active element and is yttrium (Y) and / or silicon , Scandium (Sc) and / or at least one element of the rare earth or hafnium). Such alloys are known from EP 0 486 489 B1, EP 0 786 017 B1, EP 0 412 397 B1 or EP 1 306 454 A1, which should be part of this disclosure with regard to the chemical composition.

On the MCrAlX may still be a thermal barrier layer is present, and consists for example of Zrθ2, Y2θ3-Zrθ2, i. it is not, partially or completely stabilized by yttria and / or calcium oxide and / or magnesium oxide.

The vane 130 has a guide vane foot (not shown here) facing the inner housing 138 of the turbine 108 and a vane head opposite the vane foot. The vane head is the rotor 103 facing and fixed to a mounting ring 140 of the stator 143.

Claims

claims

1. Soldering comprising:

Gallium (Ga) and / or germanium (Ge) remainder nickel.

2. Soldering comprising:

Gallium (Ga) and / or germanium (Ge),

The rest is nickel, which does not contain silicon.

3. Soldering comprising:

Gallium (Ga) and / or germanium (Ge), remainder nickel, but containing no carbon.

4. Soldering comprising:

Gallium (Ga) and / or germanium (Ge),

Remaining nickel, but containing no iron.

5. Soldering comprising:

Gallium (Ga) and / or germanium (Ge), remainder nickel, but containing no manganese.

A solder alloy according to claim 1, 2, 3, 4 or 5, comprising gallium (Ga) and no germanium (Ge).

A solder alloy according to claim 1, 2, 3, 4 or 5, which comprises germanium (Ge) and no gallium (Ga).

A solder alloy according to claim 1, 2, 3, 4 or 5, comprising gallium (Ga) and germanium (Ge).

9. solder alloy according to claim 1, 2, 3, 4, 5, 6, 7 or 8, wherein the gallium (Ga) or germanium (Ge) content is> 3wt%, in particular in the gallium or germanium Salary is 3wt%.

10. A solder alloy according to claim 1, 2, 3, 4, 5, 6 or 7, wherein the gallium (Ga) or germanium (Ge) content

≥ 6wt%, especially at the gallium or germanium content

6wt%.

A solder alloy according to one or more of the preceding claims, wherein the gallium (Ga) or germanium (Ge) content is <28wt%, in particular wherein the gallium or germanium content is <18wt%.

12. A solder alloy according to one or more of the preceding claims, wherein the gallium (Ga) or germanium (Ge) content <13wt%, in particular in which the gallium or germanium content is 13wt%.

13. A solder alloy according to one or more of the preceding claims, wherein the gallium (Ga) or germanium (Ge) content <8wt%, in particular in which the gallium or germanium content is 8wt%.

14. Soldering according to one or more of the preceding claims 1 to 8, which has 18wt% to 28wt%, in particular 20wt% germanium (Ge), very particularly 26wt% Ge.

15. A solder alloy according to claim 14, which has 21wt% to 25wt% germanium (Ge), in particular 23wt% germanium (Ge).

A solder alloy according to one or more of the preceding claims comprising from 28wt% to 35wt% gallium (Ga).

17. solder alloy according to one or more of the preceding claims, which contains chromium (Cr), in particular at least 0.1wt%.

18. solder alloy according to one or more of the preceding claims, the cobalt (Co) contains, in particular at least 0.1wt%.

19. Solder alloy according to one or more of the preceding claims, which contains aluminum (Al), in particular at least 0.1wt%.

20. Solder alloy according to one or more of the previous

Claims containing tungsten (W), in particular at least 0.1wt%.

21. Soldering alloy according to one or more of the preceding claims, containing titanium (Ti), in particular at least 0.1wt%.

22. solder alloy according to one or more of the preceding claims, the molybdenum (Mo) contains, in particular at least 0.1wt%.

23. Soldering according to one or more of the previous

Claims containing tantalum (Ta), in particular at least 0.1wt%.

24. A solder alloy according to one or more of claims 1 to 20, which consists of nickel (Ni) and gallium (Ga) or germanium (Ge) and a single further alloying element exclusively selected from the group: chromium (Cr), cobalt (Co), Tungsten (W) and aluminum (Al).

25. Solder alloy according to one of claims 1 to 20, which consists of nickel (Ni) and gallium (Ga) or germanium (Ge) and two further alloying elements exclusively selected from the group: chromium (Cr), cobalt (Co), tungsten (W ) and aluminum (Al).

26. A solder alloy according to any one of claims 1 to 20, which consists of nickel (Ni) and gallium (Ga) or germanium (Ge) and three further alloying additives exclusively selected from the group: chromium (Cr), cobalt (Co), tungsten (W ) and aluminum (Al).

27. A solder alloy according to any one of claims 1 to 20, which consists of nickel (Ni), chromium (Cr), cobalt (Co), tungsten (W), aluminum (Al) and gallium (Ga) or germanium (Ge).

Solder according to one or more of the preceding claims, which contains no boron (B) and / or no zirconium (Zr).

29. Soldering alloy according to one or more of the preceding claims, in which nickel (Ni) has the largest proportion by weight

30. solder alloy according to one or more of the preceding claims, in which nickel (Ni) has the largest volume fraction.

31. Soldering alloy according to one or more of the preceding claims, wherein the chromium content is 2wt% - 10wt%, in particular 3wt% - 9wt%, most especially 8wt%.

32. Solder alloy according to one or more of the preceding claims, wherein the aluminum content lwt% - 5wt%, in particular 2wt% - 4wt%, very particularly 3wt%, is.

33. Solder alloy according to one or more of the preceding claims, in which the tungsten content is 2% by weight - 6% by weight, in particular 3% by weight - 5% by weight, very particularly 4% by weight.

34. Solder alloy according to one or more of the preceding

Claims in which the cobalt content is 2wt% - 10wt%, especially 3wt% - 9wt%, most especially 8wt%.

35. Solder alloy according to one or more of the preceding claims, which consists of a binary system of nickel (Ni) and either of germanium (Ge) or gallium (Ga).

36. Solder alloy according to one or more of the preceding claims, which consists of a ternary system nickel (Ni), gallium (Ga) and germanium (Ge).

37. Soldering according to one or more of the preceding

Claims 3 to 36, which contains no silicon.

38. Solder alloy according to one or more of the preceding

Claims 2, 4 to 37, which contains no carbon.

39. Soldering according to one or more of the previous

Claims 2, 3, 5 to 38, which contains no iron.

40. Solder alloy according to one or more of the previous

Claims 2, 3, 4, 6 to 39 which does not contain manganese.

41. Solder alloy according to one or more of the previous

Claims that do not contain tungsten.

42. Solder alloy according to one or more of the preceding claims, wherein the aluminum content is between 1, 0wt% and 2.0wt%, in particular at l, 5wt%.

43. Solder alloy according to one or more of the preceding claims, in which the tungsten content is between 1% and 3% by weight, in particular 2% by weight.

44. Soldering according to one or more of the preceding

Claims in which the cobalt content is between 3wt% and 5wt%, in particular 4wt%.

45. Solder alloy according to one or more of the preceding claims, wherein the chromium content is between 3wt% and 5wt%, in particular 4wt%.

46. Solder alloy according to one or more of the preceding claims, wherein the solder alloy does not comprise chromium (Cr).

47. The solder alloy according to one or more of the preceding claims, wherein the solder alloy does not comprise cobalt (Co).

48. Solder alloy according to one or more of the preceding claims, wherein the solder alloy does not comprise aluminum (Al).

49. Solder alloy according to one or more of the preceding claims, wherein the solder alloy consists of nickel, germanium, tungsten and aluminum.

50. Solder alloy according to one or more of the preceding claims, wherein the solder alloy consists of nickel, germanium, cobalt and tungsten.

51. Solder alloy according to one or more of the preceding

Claims in which the solder alloy consists of nickel, germanium, chromium and tungsten.

52. Solder alloy according to one or more of the preceding claims, wherein the solder alloy consists of nickel, germanium, chromium and cobalt.

53. Solder alloy according to one or more of the preceding claims, wherein the solder alloy consists of nickel, germanium, cobalt and aluminum.

54. Solder alloy according to one or more of the preceding

Claims, wherein the solder alloy of nickel, germanium, chromium and

Aluminum exists.

55. A method for repairing a component (1), in which a solder (10) according to one or more of the preceding claims 1 to 54 and in particular a temperature of at least 1140 ⁰ C, very particularly at least 1160 ⁰ C, is used.

56. The method of claim 55, wherein the soldering process is performed isothermally.

57. The method of claim 55, wherein the soldering process is carried out by means of a temperature gradient.

58. The method of claim 55, 56 or 57, wherein the solder (40) directed, in particular monocrystalline, is solidified.

59. Method according to claim 55, wherein the solder (10) is used for the alloys PWA 1483, PWA 1484 or Rene N5.

60. The method according to claim 55, 56, 57, 58 or 59, in which a substrate (4) of the component (1, 120, 130, 155, directed, in particular monocrystalline, is solidified.

61. The method according to one or more of the preceding claims 55 to 60, wherein the temperature is 1160 ⁰ C.

62. The method according to one or more of the preceding claims 55 to 60, wherein the temperature is 1180 ⁰ C.

63. Method according to one or more of the preceding

Claims 55 to 60, wherein the temperature is 1200 ⁰ C.

64. Method according to one or more of the previous ones

Claims 55 to 60, wherein the temperature 1230 ⁰ C is.

65. Method according to one or more of the preceding

Claims 55 to 60, wherein the temperature 1260 ⁰ C is.

66. Method according to one or more of the preceding

Claims 55 to 60, wherein the temperature is 1280 ⁰ C.

67. Method according to one or more of the preceding

Claims 55 to 60, wherein the temperature is at most 1280 ⁰ C, in particular at most 1160 ⁰ C, is.

68. The method according to one or more of the preceding claims 55 to 67, wherein in a process chamber, a total pressure of less lOmbar (= 1000Pa), in particular of about lmbar (= 100Pa) is set.

69. The method according to one or more of the preceding claims 55 to 68, wherein the total pressure in the process chamber greater than 0, lmbar (= 10Pa), in particular greater lmbar (= 100Pa) is set.

70. The method according to one or more of the preceding claims 55 to 69, wherein prior to heating of the component (1, 120, 130, 155) in the process chamber with the solder (10) is carried out a purging of the process chamber with an inert gas, in particular for at least 10 hours (10 hours), especially for 48 hours (48 hours).

71. The method of claim 70, wherein the flow rate in the rinse is between 0.21 / min and 11 / min.

72. The method of claim 71, the throughput in the rinsing process is 11 / min.

73. The method of claim 70, 71 or 72, wherein an inert gas, in particular with a purity of 6.0, is filtered by a gas cleaning cartridge before entering the process chamber.

74. Method according to one or more of the preceding

Claims in which the duration of the soldering is at least 10 hours (10 hours), in particular at least 48 hours (48 hours).

75. The method according to one or more of the claims, wherein the solder (10) polycrystalline (CC) is solidified, in particular in CC components.