EP2558244A2

EP2558244A2 - Solder alloy, soldering method and component

Info

Publication number: EP2558244A2
Application number: EP10713921A
Authority: EP
Inventors: Michael Ott; Sebastian Piegert
Original assignee: Siemens AG
Current assignee: Siemens AG
Priority date: 2010-04-12
Filing date: 2010-04-12
Publication date: 2013-02-20
Also published as: WO2011127958A2; US20130045129A1

Description

Solder alloy, soldering process and component

The invention relates to a solder alloy and a method for soldering.

Components sometimes need to be repaired after manufacture, for example after casting or after they have been used and cracked.

There are various repair methods such. As the welding process, in which, however, a substrate material of the component must be melted, which can lead to a damage ^¬ tion in particular of cast and directionally solidified components and for evaporation of components of the substrate material.

A soldering process works against the temperature at

Welding process and thus with respect to the melting temperature of the substrate material at lower temperatures.

The solder should still have a high strength, so that the solder filled with crack or depression does not weaken the entire component at the high

Operating temperatures leads.

It is therefore an object of the invention to show a solder alloy, which solves the above problem.

The object is achieved by a solder made of a solder alloy according to claim 1, by a method according to claim 60 and by a component according to claim 62.

The solder alloy consists of:

(1 -x -y) * base + x * lot + y * addition,

where 0.2 <x <0.8 and

0 <y <0.8 and (y <1-x) <(1-x),

wherein the base comprises:

3wt% - 20wt% chromium (Cr), in particular 9wt%,

0, lwt% - 20wt% cobalt (Co), especially 9wt%, 0, lwt% - 6wt% aluminum (AI), in particular 5wt%, 0, lwt% - 10wt% tungsten (W), in particular 9wt% and

optional

0, lwt% - 6wt% titanium (Ti), in particular <lwt%,

0, lwt% - 4wt% molybdenum (Mo), in particular lwt%,

0, lwt% - 6wt% tantalum (Ta), in particular 3wt% and

Nickel and

wherein the solder comprises:

0, lwt% - 10wt% chromium (Cr), in particular 4wt% - 8wt%,

0, lwt% - 10wt% cobalt (Co), in particular 4wt% - 8wt%,

0, lwt% - 6wt% aluminum (AI), especially l, 5wt%,

0, lwt% - 6wt% tungsten (W), in particular 3wt% and

Germanium (Ge) and / or gallium (Ga),

in particular 18wt% to 30wt% and

Nickel,

wherein the additive comprises:

0wt% - 0.015wt% boron (B), in particular <0.010wt%,

0wt% - 0, lwt% zirconium (Zr), in particular <0.075wt%,

0wt% - lwt% hafnium (Hf), especially ^ 0.075wt%,

0wt% - lwt% niobium (Nb), in particular <0.8wt%,

0wt% - 0.15wt% carbon (C), in particular <0, lwt%.

Further advantageous developments of the solder alloy are: it uses for the base only one element of the group titanium, molybdenum, tantalum, it uses for the base at least two elements of

Group titanium, molybdenum, tantalum,

in particular only two elements of this group, it has titanium, molybdenum and tantalum for the base, it is nickel-based at the base,

in particular it has nickel as the remainder for the base, • it is nickel-based in the lot,

In particular, the solder has nickel as the remainder,

• it is nickel based,

in particular, it has nickel as the remainder,

It does not contain any deliberate addition of boron (B),

in particular B <20 ppm,

It contains no silicon (Si),

• it has no zirconium (Zr),

• she has no hafnium (Hf),

• it has no niobium (Nb),

• it has no carbon (C),

• it does not contain titanium (Ti),

It contains no molybdenum (Mo),

• it does not contain tantalum (Ta),

It has the largest weight fraction for nickel (Ni),

It has gallium (Ga) and no germanium (Ge),

It has germanium (Ge) and no gallium (Ga),

It has gallium (Ga) and germanium (Ge),

It has at least 0.006wt% zirconium (Zr),

Advantageous values for zirconium (Zr), boron (B), carbon (C), molybdenum (Mo), gallium (Ga), germanium (Ge), nium (Hf), niobium (Nb), tungsten (W), tantalum (Ta), chromium (Cr), cobalt (Co), aluminum (AI), titanium (Ti) are listed in the subclaims, good solder results were obtained scored with

0.3 <x <0.5

and or

with y = 0

or with 0.2 <Y,

in particular 0.3 -S * -S 0.5, it does not contain manganese, it consists of nickel, germanium, chromium, aluminum, cobalt, tungsten and titanium, it consists of nickel, germanium, chromium, aluminum, cobalt, tungsten, Tantalum and titanium, it consists of nickel, germanium, chromium, aluminum, cobalt, tungsten, titanium, carbon and molybdenum, it consists of nickel, germanium, cobalt, chromium, titanium, tungsten, molybdenum, tantalum and aluminum, it consists of nickel , Germanium, chromium, aluminum, cobalt, carbon, molybdenum, tungsten, tantalum and

Titanium, it consists of nickel, carbon, germanium, chromium, cobalt, aluminum, molybdenum, tungsten, tantalum, niobium, titanium and zirconium, the method involves solidifying the solder alloy in a polycrystalline (CC) direction, in particular in the case of polycrystalline components, a further advantageous development of the method being that the solder (10) is directionally solidified.

The component contains a solder from the aforementioned solder alloy.

The component can be advantageous respectively weiterge forms ^¬ as follows, where these features advantageously be ^¬ can be combined arbitrarily with each other:

The substrate of the component is directionally solidified,

• the substrate of the component is not solidified directed · the chromium content of the solder alloy corresponds to the Chromge ^¬ halt of the substrate of the component,

The content of cobalt corresponds to the content of cobalt of the substrate of the component,

The aluminum content of the solder alloy is reduced compared to the aluminum content of the substrate of the component, in particular reduced by 10%, the titanium content of the solder alloy is lower than that

Titanium content of the substrate of the component, when the contents of germanium between 18Gew .-% and 30Gew .-%, in particular by at least 10% lower, the solder alloy has no molybdenum. In the dependent claims further advantageous measures are listed, which can be combined with each other in an advantageous manner with each other.

Show it:

Figure 1 is a cross-sectional view of a component after a

Treatment with the solder according to the invention,

FIG. 2 shows in perspective a turbine blade,

FIG. 3 shows in perspective a combustion chamber,

FIG. 4 shows a gas turbine

Figure 5 is a list of superalloys.

The figures and the description represent only embodiments of the invention.

FIG. 1 shows a component 1 which is treated with a solder 10 made of a solder alloy according to the invention.

The component 1 comprises a substrate 4 which, in particular for components for high-temperature applications, in particular for turbine blades 120, 130 (FIG. 2) or combustion chamber elements 155 (FIG. 3) for steam or gas turbines 100 (FIG cobalt-based superalloy (Figure 5).

The solder 10 can preferably be used for all alloys according to FIG. This can preferably be ^¬ knew materials PWA 1483, PWA 1484, his Rene 80 or Rene N5.

Lot 10 is also used for blades for aircraft. The substrate 4 has a crack 7 or a recess 7, which is to be filled by soldering. The cracks 7 or recesses 7 are preferably about 200 microns wide and can be up to 5mm deep.

In this case, the solder material 10 is applied from a solder alloy in or in the vicinity of the recess 7 and by a heat ^¬ treatment (+ T) melts the solder material 10 below a melting temperature of the substrate 4 and fills the Vertie ^¬ tion 7 completely.

The solder alloy consists of

(1 -x -y) * base + x * lot + y * addition,

where 0.2 <x <0.8 and

0 <y <0.8 and (y <1-x) <(1-x),

wherein the base comprises:

3wt% - 20wt% chromium (Cr), in particular 9wt%,

0, lwt% - 20wt% cobalt (Co), especially 9wt%,

0, lwt% - 6wt% aluminum (AI), in particular 5wt%,

0, lwt% - 10wt% tungsten (W), in particular 9wt% and

optional

0, lwt% - 6wt% titanium (Ti), in particular <lwt%,

0, lwt% - 4wt% molybdenum (Mo), in particular lwt%,

0, lwt% - 6wt% tantalum (Ta), in particular 3wt% and

Nickel and

wherein the solder comprises:

0, lwt% - 10wt% chromium (Cr), in particular 4wt% - 8wt%,

0, lwt% - 10wt% cobalt (Co), in particular 4wt% - 8wt%,

0, lwt% - 6wt% aluminum (AI), especially l, 5wt%,

0, lwt% - 6wt% tungsten (W), in particular 3wt% and

Germanium (Ge) and / or gallium (Ga),

in particular 18wt% to 30wt% and

Nickel,

wherein the additive comprises:

0wt% - 0.015wt% boron (B), in particular <0.010wt%,

0wt% - 0, lwt% zirconium (Zr), in particular <0.075wt%,

0wt% - lwt% hafnium (Hf), especially ^ 0.075wt%,

0wt% - lwt% niobium (Nb), in particular <0.8wt%,

0wt% - 0.15wt% carbon (C), in particular <0, lwt%. It is therefore a physical mixture of two (base and solder) or three (+ additional) powders. By the addition of germanium (Ge) is preferably dispensed with the addition of boron (B).

By the addition of germanium (Ge) is preferably dispensed with the addition of silicon (Si).

Preferably, the addition or the presence of Sili ^¬ zium and / or carbon is avoided because they form in the solder Sprödpha- sen.

It is also preferred to avoid the addition or presence of iron and / or manganese since the elements form low melting or non-oxidizing phases.

As melting point depressants can

Gallium (Ga) and no germanium (Ge) or

Germanium (Ge) and no gallium (Ga) or

Gallium (Ga) and germanium (Ge) are used.

The base has only one, two or three elements of the group titanium, molybdenum, tantalum.

The base is especially nickel-based.

The solder is especially nickel-based. Preferably, the alloy contains no zirconium (Zr), no

Hafnium (Hf), no manganese (Mn), no niobium (Nb) and / or carbon (C).

Advantageous levels of zirconium (Zr), boron (B), carbon are listed in the subclaims.

Good solder results were achieved with 0.3 -S x -S 0.5

and or y = 0

or

0.2 <Y,

in particular 0.3 -S Y -S 0.5.

Preferred values for molybdenum (Mo), gallium (Ga), germanium (Ge), hafnium (Hf), niobium (Nb), tungsten (W), tantalum (Ta), chromium (Cr), cobalt (Co), aluminum ( AI), Titanium (Ti) are listed in the subclaims.

The solder alloy is preferably made of nickel, germanium, chromium, aluminum, cobalt, tungsten and titanium.

Also preferably, the solder alloy consists of nickel, germanium, chromium, aluminum, cobalt, tungsten, tantalum and titanium.

Likewise preferably, the solder alloy consists of nickel, Ger ^¬ manium, cobalt, chromium, aluminum, tungsten, titanium, carbon and molybdenum.

Also preferably, the solder alloy consists of nickel, Ger ^¬ manium, cobalt, chromium, titanium, tungsten, molybdenum, tantalum and aluminum. Also preferably, the solder alloy consists of nickel, Ger ^¬ manium, chromium, aluminum, cobalt, carbon, molybdenum, tungsten, tantalum and titanium.

The solder alloy likewise preferably consists of nickel, carbon, germanium, chromium, cobalt, aluminum, molybdenum, tungsten, tantalum, niobium, titanium and zirconium.

Also, the addition of rhenium can preferably be dispensed with.

The solder material 10 can be connected to the substrate 4 of the component 1, 120, 130, 155 in an isothermal or a temperature gradient method. A gradient method tet then at preferably when the substrate 4 has a ge ^¬ directional structure, for example an SX or DS structure, so that the solder material 10 then has a directional structure. However, a directionally solidified structure in the solder can also be carried out in an isothermal process.

Likewise, the component 1 does not need to have directionally solidified structural ^¬ ture (but a CC structure).

Likewise, the solders in CC substrates of components in a CC structure can be soldered and solidified, the solders then being polycrystalline solidified (CC).

Especially for the polycrystalline solidification of the solders, the following solders are particularly interesting:

In the reflow (isothermal process or gradient process), an inert gas, especially argon, is preferably used, which reduces the chromium evaporation from the substrate 4 at the high temperatures, or a reducing gas (argon / hydrogen) is used.

The solder material 10 can also be applied over a large area to a surface of a component 1, 120, 130, 155 in order to achieve a thickening of the substrate 4, in particular in the case of hollow components. Preferably, the solder material 10 is ver ^{¬ used to} fill cracks 7 or recesses 7.

FIG. 2 shows a perspective view of a rotor blade 120 or guide blade 130 of a turbomachine that extends along a longitudinal axis 121.

The turbomachine may be a gas turbine of an aircraft or a power plant for electricity generation, a steam turbine or a compressor.

The blade 120, 130 has along the ^longitudinal axis 121 to each other, a securing region 400, an thereto adjacent blade platform 403 and an airfoil 406 and a blade tip 415.

As a guide blade 130, the blade 130 may have at its blade tip ^¬ 415 another platform (not shown).

In the mounting region 400, a blade root 183 is formed, which serves for attachment of the blades 120, 130 to a shaft or a disc (not shown).

The blade root 183 is, for example, as a hammerhead out staltet ^¬. Other designs as Christmas tree or Schwalbenschwanzfuß are possible.

The blade 120, 130 has for a medium which flows past the scene ^¬ felblatt 406, a leading edge 409 and a trailing edge 412.

In conventional blades 120, 130, in all regions 400, 403, 406 of the blade 120, 130, for example, ^massive metallic materials, in particular superalloys, are used, in particular the superalloys according to FIG. 5. Such superalloys are known, for example, from EP 1 204 776 B1, EP 1 306 454, EP 1 319 729 A1, WO 99/67435 or WO 00/44949.

The blade 120, 130 can be made by a casting process, also by directional solidification, by a forging process, by a milling process or combinations thereof.

Workpieces with a monocrystalline structure or structures are used as components for machines which are exposed to high mechanical, thermal and / or chemical stresses during operation.

The production of such monocrystalline workpieces, for example, by directed solidification from the melt. These are casting methods in which the liquid metallic alloy solidifies into a monocrystalline structure, ie a single-crystal workpiece, or directionally. Here, dendritic crystals are aligned along the heat flow and form either a columnar grain structure (columnar, ie grains that run the entire length of the workpiece and here, for general language use, referred to as directionally solidified) or a monocrystalline structure, ie the entire workpiece ^¬ is of a single crystal. In these methods, you have to transition to globular (polycrystalline) solidification avoided, since non-directional growth inevitably forms transverse and longitudinal grain boundaries ^¬ which solidified the directionally the good qualities or monocrystalline component nullify.

Is generally speaking of directionally solidified structures speech, so are both single crystals meant that have no grain boundaries or at most small angle grain boundaries, as well

Stem-crystal structures, which probably have longitudinally extending grain boundaries, but no transverse grain boundaries. These second-mentioned crystalline structures are also known as directionally solidified structures.

Such methods are known from US Pat. No. 6,024,792 and EP 0 892 090 A1.

Likewise, the blades 120, 130 may have coatings against corrosion or oxidation, e.g. B. (MCrAlX, M is at least one element of the group iron (Fe), cobalt (Co),

Nickel (Ni), X is an active element and stands for yttrium (Y) and / or silicon and / or at least one element of the rare earths, or hafnium (Hf)). Such alloys are known from EP 0 486 489 B1, EP 0 786 017 B1, EP 0 412 397 B1 or EP 1 306 454 A1.

The density is preferably 95% of the theoretical

Density.

A protective aluminum oxide layer (TGO = thermal grown oxide layer) is formed on the MCrAlX layer (as an intermediate layer or as the outermost layer). Preferably, the layer composition comprises Co-30Ni-28Cr-8A1-0, 6Y-0, 7Si or Co-28Ni-24Cr-10Al-0, 6Y. Besides these cobalt-based protective coatings, nickel-based protective layers such as Ni-10Cr-12Al-0.6Y-3Re or Ni-12Co-21Cr-IIAl-O, 4Y-2Re or Ni-25Co-17Cr-10A1-0, 4Y-1 are also preferably used , 5Re.

On the MCrAlX may still be present a thermal barrier coating, which is preferably the outermost layer, and consists for example of Zr0 ₂ , Y2Ü3-Zr02, ie it is not, partially ^¬ or fully stabilized by yttria

and / or calcium oxide and / or magnesium oxide.

The thermal barrier coating covers the entire MCrAlX layer.

By suitable coating methods, e.g. Electron beam evaporation (EB-PVD) produces stalk-shaped grains in the thermal barrier coating.

Other coating methods are conceivable, for example atmospheric plasma spraying (APS), LPPS, VPS or CVD. The heat insulating layer can ^¬ ner to have better thermal shock resistance porous, micro- or macro-cracked pERSonal. The thermal barrier coating is therefore preferably more porous than the

MCrAlX layer.

Refurbishment means that components 120, 130 may need to be deprotected after use (e.g., by sandblasting). This is followed by removal of the corrosion and / or oxidation layers or products. Optionally, even cracks in the component 120, 130 are repaired. This is followed by a re-coating of the component 120, 130 and a renewed use of the component 120, 130.

The blade 120, 130 may be hollow or solid. If the blade 120, 130 is to be cooled, it is hollow and also has, if necessary, film cooling holes 418 ^(indicated by dashed lines) on. FIG. 3 shows a combustion chamber 110 of a gas turbine.

The combustion chamber 110 is configured, for example, as so-called ^an annular ^combustion chamber, in which a plurality of in the circumferential direction about an axis of rotation 102 arranged burners 107 open into a common combustion chamber space 154 and generate flames 156th For this purpose, the combustion chamber 110 is configured in its entirety as an annular structure, which is positioned around the axis of rotation 102 around. To achieve a comparatively high efficiency, the combustion chamber 110 is designed for a comparatively high temperature of the working medium M of about 1000 ° C to 1600 ° C. To even under these unfavorable for the materials operating parameters, a relatively long service life loan to enable the combustion chamber wall 153 is provided on its side facing the ^working medium M facing side with a formed from heat shield elements 155. liner.

Each heat shield element 155 made of an alloy is equipped on the working fluid side with a particularly heat-resistant protective layer (MCrAlX layer and / or ceramic coating) or is made of high-temperature-resistant material (solid ceramic blocks).

These protective layers may be similar to the turbine blades, so for example MCrAlX means: M is at least one element of the group iron (Fe), cobalt (Co), nickel (Ni), X is an active element and stands for yttrium (Y) and / or silicon and / or at least one element of the rare earths, or hafnium (Hf). Such alloys are known from EP 0 486 489 B1, EP 0 786 017 B1, EP 0 412 397 B1 or EP 1 306 454 A1.

On the MCrAlX, for example, a ceramic Wär ^¬ medämmschicht be present and consists for example of ZrÜ2, Y203 ^~ Zr02, ie it is not, partially or completely stabilized by yttrium and / or calcium oxide and / or magnesium oxide. Suitable coating processes, such as electron beam evaporation (EB-PVD), produce stalk-shaped grains in the thermal barrier coating.

Other coating methods are conceivable, for example atmospheric plasma spraying (APS), LPPS, VPS or CVD. The heat insulation layer may have ^¬ porous, micro- or macro-cracked ^compatible grains for better thermal shock resistance.

Refurbishment means that heat shield elements 155 may be replaced after use by heat shielding elements 155

Protective layers must be freed (for example by sandblasting). This is followed by removal of the corrosion and / or oxidation layers or products. If necessary, cracks in the heat shield element 155 are also repaired.

Then recoated and the Hitzeschildele ^¬ elements 155, after use of the heat shield elements 155 is performed.

Due to the high temperatures inside the combustion chamber 110 may also be provided for the heat shield elements 155 and for their holding elements, a cooling system. The heat shield elements 155 are then, for example, hollow and possibly still have cooling holes (not shown) which open into the combustion chamber space 154.

FIG. 4 shows by way of example a gas turbine 100 in a longitudinal partial section.

The gas turbine 100 has inside a rotatably mounted about a rotation axis 102 rotor 103 with a shaft 101, which is also referred to as a turbine runner.

Along the rotor 103 follow one another an intake housing 104, a compressor 105, for example, a toroidal combustion chamber 110, in particular annular combustion chamber, with a plurality of coaxially arranged burners 107, a turbine 108 and the exhaust housing 109th

The annular combustion chamber 110 communicates with, for example, a ring-shaped hot gas channel 111. There, for example, form four successive turbine stages 112, the turbine 108th

Each turbine stage 112 is formed, for example, from two blade ^rings . As seen in the direction of flow of a working medium 113, in the hot gas channel 111 of a row of guide vanes 115, a series 125 formed of rotor blades 120 follows.

The guide vanes 130 are fastened to an inner housing 138 of a stator 143, whereas the moving blades 120 of a row 125 are attached to the rotor 103 by means of a turbine disk 133, for example.

Coupled to the rotor 103 is a generator or work machine (not shown). During operation of the gas turbine 100 104 air 135 is sucked by the compressor 105 through the intake housing and ver ^¬ seals. The 105 ^¬ be compressed air provided at the turbine end of the compressor is ge ^¬ leads to the burners 107, where it is mixed with a fuel. The mixture is then burned to form the working fluid 113 in the combustion chamber 110. From there, the working medium 113 flows along the hot gas channel 111 past the guide vanes 130 and the rotor blades 120. On the rotor blades 120, the working medium 113 expands in a pulse-transmitting manner so that the rotor blades 120 drive the rotor 103 and drive the machine coupled to it.

The components exposed to the hot working medium 113 are subject to thermal loads during operation of the gas turbine 100. The guide vanes 130 and rotor blades 120 of the first turbine stage 112, viewed in the flow direction of the working medium 113, are subjected to the greatest thermal stress in addition to the heat shield elements lining the annular combustion chamber 110.

To withstand the prevailing temperatures, they can be cooled by means of a coolant. Likewise, substrates of the components can have a directional structure, ie they are monocrystalline (SX structure) or have only longitudinal grains (DS structure).

Iron, nickel or cobalt-based superalloys are used as material for the components, in particular for the turbine blades 120, 130 and components of the combustion chamber 110.

Such superalloys are known, for example, from EP 1 204 776 B1, EP 1 306 454, EP 1 319 729 A1, WO 99/67435 or WO 00/44949.

Also, the blades 120, 130 may be anti-corrosion coatings (MCrAlX; M is at least one element of the group iron (Fe), cobalt (Co), nickel (Ni), X is an active element and is yttrium (Y) and / or silicon , Scandium (Sc) and / or at least one element of the rare earth or hafnium). Such alloys are known from EP 0 486 489 B1, EP 0 786 017 B1, EP 0 412 397 B1 or EP 1 306 454 A1. On the MCrAlX may still be present a thermal barrier coating, and consists for example of Zr02, Y203-Zr02, ie it is not, partially or completely stabilized by Ytt ^¬ riumoxid and / or calcium oxide and / or magnesium oxide.

The guide blade 130 has a guide blade root facing the inner housing 138 of the turbine 108 (not shown here) and a guide blade foot opposite

Guide vane head on. The vane head faces the rotor 103 and fixed to a mounting ring 140 of the stator 143.

Claims

claims

1. solder alloy

consisting of

(1 -x -y) * base + x * lot + y * addition,

where 0.2 <x <0.8 and

0 <y <0.8 and (y <1-x) <(1-x),

wherein the base comprises:

3wt% - 20wt% chromium (Cr), in particular 9wt%,

0, lwt% - 20wt% cobalt (Co), especially 9wt%,

0, lwt% - 6wt% aluminum (AI), in particular 5wt%,

0, lwt% - 10wt% tungsten (W), especially 9wt% and optional

0, lwt% - 6wt% titanium (Ti), in particular <lwt%,

0, lwt% - 4wt% molybdenum (Mo), in particular lwt%,

0, lwt% - 6wt% tantalum (Ta), in particular 3wt% and at least lwt% nickel and

wherein the solder comprises:

0, lwt% - 10wt% chromium (Cr), in particular 4wt% - 8wt%,

0, lwt% - 10wt% cobalt (Co), in particular 4wt% - 8wt%, 0, lwt% - 6wt% aluminum (AI), in particular l, 5wt%, 0, lwt% - 6wt% tungsten (W), in particular 3wt% and at least lwt% germanium (Ge) and / or gallium (Ga), in particular 18wt% to 30wt% and

at least 1% nickel,

wherein the additive comprises:

0wt% - 0.015wt% boron (B), in particular <0.010wt%,

0wt% - 0, lwt% zirconium (Zr), in particular <0.075wt%, 0wt% - lwt% hafnium (Hf), in particular <0.075wt%,

0wt% - lwt% niobium (Nb), in particular <0.8wt%,

0wt% - 0.15wt% carbon (C), in particular <0, lwt%.

2. solder alloy according to claim 1,

in which for the base only one element of the group titanium, molybdenum, tantalum is used.

3. solder alloy according to claim 1,

at the base for at least two elements of the group

Titanium, molybdenum, tantalum can be used

in particular, only two members of this group used the ^¬.

Solder alloy according to claim 1,

which has titanium, molybdenum and tantalum for the base

Solder alloy according to claim 1, 2, 3 or 4,

where the base is nickel based,

in particular in which the base has nickel as the remainder.

6. solder alloy according to claim 1, 2, 3, 4, or 5,

where the solder is nickel-based,

in particular, in which the solder has the remainder of nickel.

7. solder alloy according to claim 1, 2, 3, 4, 5 or 6,

which is nickel based,

in particular having the remainder nickel.

Solder alloy according to claim 1, 2, 3, 4, 5, 6 or 7, which does not contain any deliberate addition of boron (B),

especially <20ppm.

A solder alloy according to claim 1, 2, 3, 4, 5, 6, 7 or 8, which does not contain any deliberate addition of silicon (Si).

10. solder alloy according to claim 1, 2, 3, 4, 5, 6, 7, 8 or 9,

which has no deliberate addition of zircon (Zr).

11. solder alloy according to one or more of claims 1 to 10,

which has no deliberate addition of hafnium (Hf).

12. solder alloy according to one or more of claims 1 to 11,

which has no deliberate addition of niobium (Nb).

13. solder alloy according to one or more of the preceding claims,

which has no deliberate addition of carbon (C).

14. Soldering according to one or more of the preceding claims,

which does not contain any deliberate addition of titanium (Ti).

15. solder alloy according to one or more of the preceding claims,

which does not contain any deliberate addition of molybdenum (Mo).

16. solder alloy according to one or more of the preceding claims,

which does not contain a deliberate addition of tantalum (Ta).

17. Soldering according to one or more of the preceding claims,

in which nickel (Ni) has the largest proportion by weight.

18. solder alloy according to one or more of the preceding claims,

which has gallium (Ga) and no germanium (Ge).

19. Solder alloy according to one or more of the preceding claims,

which has germanium (Ge) and no gallium (Ga).

20. Solder alloy according to one or more of the preceding claims,

which has gallium (Ga) and germanium (Ge).

21. Solder alloy according to one or more of the preceding claims,

which has at least 0.006 wt% zirconium (Zr).

22. Solder alloy according to one or more of the preceding claims,

which has at most 0.025wt% zirconium (Zr).

23. Solder alloy according to one or more of the preceding claims,

having at least 0.003wt% boron (B).

24. Soldering according to one or more of the preceding claims,

having at most 0.012wt% boron (B).

25. Soldering alloy according to one or more of the preceding claims,

which has at least 0.03wt% carbon (C).

26. Soldering according to one or more of the preceding claims,

having at most 0,13wt% carbon (C).

27. Soldering according to one or more of the preceding claims,

where 0.3 <x <0.5.

28. Soldering according to one or more of the preceding claims,

where y = 0.

29. Soldering according to one or more of the preceding claims 1 to 20,

where 0.2 <y,

in particular 0.3 -S y -S 0.5.

30. solder alloy according to one or more of the preceding claims,

which does not contain any deliberate addition of manganese (Mn).

31. Soldering according to one or more of the preceding claims,

at least 0.08wt% molybdenum (Mo),

contains.

32. Solder alloy according to one or more of the preceding claims,

which contains a maximum of 3.2wt% molybdenum (Mo).

33. Solder alloy according to one or more of the preceding claims,

where the gallium (Ga) or germanium (Ge) content is 1, 5wt%,

especially at the gallium or germanium content

> 3wt%.

34. Solder alloy according to one or more of the preceding claims,

where the gallium (Ga) or germanium (Ge) content is> 6wt%.

35. Solder alloy according to one or more of the preceding claims,

at the gallium (Ga) or germanium (Ge) content

28wt%,

especially where the gallium or germanium content is <24wt%.

36. Solder alloy according to one or more of the preceding claims,

which has at least 0.02wt% hafnium (Hf).

37. Solder alloy according to one or more of the preceding claims,

containing at least 0,16wt% niobium (Nb).

38. Solder alloy according to one or more of the preceding claims,

containing max. 0.8wt% niobium (Nb).

39. Solder alloy according to one or more of the preceding claims,

which has a maximum of 1.2% hafnium.

40. Solder alloy according to one or more of the preceding claims,

containing at least 0,6wt% tungsten (W),

in particular 0.8wt%.

41. Solder alloy according to one or more of the preceding claims,

at the tungsten content maximum 3.2wt%,

especially maximum 2.8wt%.

42. Solder alloy according to one or more of the preceding claims,

containing at least 0.3wt% tantalum (Ta).

43. Solder alloy according to one or more of the preceding claims,

the maximum 3.5wt% tantalum (Ta),

especially 0.35wt% tantalum (Ta).

44. Solder alloy according to one or more of the preceding claims,

containing max. 0.12wt% carbon (C).

45. Solder alloy according to one or more of the preceding claims,

containing at least 0.03wt% carbon (C).

46. Solder alloy according to one or more of the preceding claims,

wherein the solder alloy consists of nickel, germanium, chromium, aluminum, cobalt, tungsten and titanium.

47. Solder alloy according to one or more of the preceding claims,

wherein the solder alloy consists of nickel, germanium, chromium, aluminum, cobalt, tungsten, tantalum and titanium.

48. Solder alloy according to one or more of the preceding claims,

wherein the solder alloy consists of nickel, germanium, chromium, aluminum, cobalt, tungsten, titanium, carbon and molybdenum.

49. Solder alloy according to one or more of the preceding claims,

wherein the solder alloy consists of nickel, germanium, cobalt, chromium, titanium, tungsten, molybdenum, tantalum and aluminum.

50. Solder alloy according to one or more of the preceding claims,

wherein the solder alloy consists of nickel, germanium, chromium, aluminum, cobalt, carbon, molybdenum, tungsten, tantalum and titanium.

51. Solder alloy according to one or more of the preceding claims,

wherein the solder alloy consists of nickel, carbon, Germa ^¬ nium, chromium, cobalt, aluminum, molybdenum, tungsten, tantalum, niobium, titanium and zircon.

52. Solder alloy according to one or more of the preceding claims,

containing at least 2.5wt% chromium (Cr).

53. Solder alloy according to one or more of the preceding claims,

which contains a maximum of 12wt% chromium (Cr).

54. Solder alloy according to one or more of the preceding claims,

containing at least l, 8wt% cobalt (Co).

55. Solder alloy according to one or more of the preceding claims,

containing max. 8wt% cobalt (Co).

56. Solder alloy according to one or more of the preceding claims,

containing at least 0.5wt% aluminum (AI).

57. Solder alloy according to one or more of the preceding claims,

which contains a maximum of 2.5wt% aluminum (AI).

58. Solder alloy according to one or more of the preceding claims,

which contains at least 0.1% titanium (Ti).

59. Solder alloy according to one or more of the preceding claims,

which contains a maximum of 4.0wt% titanium (Ti).

60th method,

in which a solder alloy according to one or more of the claims is used, and

in which solder (10) polycrystalline (CC) is solidified, in particular in CC components.

61. Procedure,

in which a solder alloy according to one or more of the claims is used, and

in which the solder (10) is directionally solidified,

especially in DS components.

62. component,

containing a solder of a solder alloy according to one or more of the preceding claims 1 to 59.

63. Component according to claim 62,

whose substrate (4) is directionally solidified.

64. Component according to claim 62,

whose substrate (4) is not directionally solidified.

65. Component according to one or more of the preceding claims 62 to 64,

in which the chromium content (Cr) of the solder alloy corresponds to the chromium content of the substrate (4) of the component (1, 120, 130, 155).

66. Component according to one or more of the preceding

Claims 62 to 65,

in which the content of cobalt (Co) corresponds to the content of cobalt of the substrate (4) of the component (1, 120, 130, 155).

67. Component according to one or more of the preceding

Claims 62 to 66,

in which the aluminum content (Al) of the solder alloy is reduced compared to the aluminum content of the substrate (4) of the component (1, 120, 130, 155),

especially reduced by 10%.

68. Component according to one or more of the preceding

Claims 62 to 67,

in which the titanium content (Ti) of the solder alloy is less than the titanium content of the substrate (4) of the component (1, 120,

130, 155),

if the content of germanium (Ge) is between 18% by weight and 30% by weight,

in particular the titanium content (Ti) is lower by at least 10 ~ 6.

69. Component according to one or more of the preceding

Claims 62 to 68,

wherein the solder alloy does not have molybdenum (Mo).