EP2083473A1 - Antenna device - Google Patents

Antenna device Download PDF

Info

Publication number
EP2083473A1
EP2083473A1 EP09000532A EP09000532A EP2083473A1 EP 2083473 A1 EP2083473 A1 EP 2083473A1 EP 09000532 A EP09000532 A EP 09000532A EP 09000532 A EP09000532 A EP 09000532A EP 2083473 A1 EP2083473 A1 EP 2083473A1
Authority
EP
European Patent Office
Prior art keywords
base body
conductor
antenna
addition
wiring conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP09000532A
Other languages
German (de)
English (en)
French (fr)
Inventor
Susuma Nakajima
Masahiko Nakatsugawa
Keita Inaki
Tadaaki Onishi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alps Alpine Co Ltd
Original Assignee
Alps Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alps Electric Co Ltd filed Critical Alps Electric Co Ltd
Publication of EP2083473A1 publication Critical patent/EP2083473A1/en
Withdrawn legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
    • H01Q1/243—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2283—Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/362—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith for broadside radiating helical antennas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q11/00—Electrically-long antennas having dimensions more than twice the shortest operating wavelength and consisting of conductive active radiating elements
    • H01Q11/02—Non-resonant antennas, e.g. travelling-wave antenna
    • H01Q11/08—Helical antennas

Definitions

  • the present invention contains subject matter related to Japanese Patent Application No. 2008-015836 filed in the Japanese Patent Office on January 28, 2008, the entire contents of which being incorporated herein by reference.
  • the present invention relates to an antenna device suitable for a small antenna used for a mobile device.
  • This type of antenna device performs radio wave transmission and reception.
  • the device is mounted on a motherboard, and the board has a desired high-frequency circuit.
  • the device converts electric energy at a high frequency produced by a corresponding circuit into a radio wave and emits the radio wave in the air.
  • the device receives a radio wave in the air and converts the radio wave into electric energy at a high frequency to be input to a corresponding circuit.
  • the antenna device includes a radiation conductor mounted on a base body in a substantially prismatic shape, and the radiation conductor is formed in, for example, a spiral shape, has a central axis substantially aligned with a longitudinal axis of the base body, and emits a radio wave in the air (see JP-A-2005-210680 ).
  • the aforementioned energy has to be transmitted between the radiation conductor and a power supply wire of the motherboard without losses. Therefore, impedance matching is performed, and the radiation conductor and the power supply wire are connected to each other so as not to cause energy losses.
  • the antenna device disclosed in JP-A-2005-210680 has a problem in that the mother board needs a large space. This is because a circuit for the matching is mounted on the motherboard.
  • the antenna device includes: a base body mounted on a circuit board; a wiring conductor to which power is supplied, and a radiation conductor which is connected to the wiring conductor to radiate radio waves, each of which is provided on the base body; an insulation substrate mounted on the base body; and an electrical component which is mounted on the insulation substrate in a chip shape to be electrically connected to the wiring conductor.
  • the electrical component in the chip shape may not be directly mounted on the base body but mounted on the insulation substrate. Therefore, as compared with a case where the electrical component is directly mounted on the base body, high density packaging of the electrical component is possible.
  • the insulation substrate having the electrical component is not mounted on the circuit board but mounted on the base body. Therefore, as compared with a case where the insulation substrate is mounted on the circuit board, the circuit board requires a smaller space.
  • the base body may have a stepped portion formed from a top surface of the base body toward the circuit board to form a concave portion in which the insulation substrate is mounted, and the concave portion may be configured such that the electrical component is substantially at the same height as or lower than the top surface.
  • the concave portion is configured such that the electrical component is substantially at the same height as or lower than the top surface of the base body, a top portion of the electrical component does not protrude from the top surface of the base body.
  • the antenna device can be implemented to have a lower height.
  • the base body may be made of resin, and the wiring conductor may be made of metal to be formed integrally with the base body.
  • the wiring conductor made of metal is formed integrally with the base body made of resin, the wiring conductor cannot be easily separated from the base body, and this enhances reliability of the antenna device.
  • the wiring conductor is formed integrally with the base body, the wiring conductor cannot be formed in a very small pattern.
  • the electrical component is mounted on the insulation substrate. Accordingly, although the wiring conductor is formed integrally with the base body, high density packaging of the electrical component is possible.
  • the wiring conductor may have a convex portion which is exposed from the base body and connected to a terminal of the insulation substrate with solder.
  • a joint area between the convex portion and the solder increases, and the solder extends to surround the convex portion, so that joint strength between the convex portion and the solder can be increased.
  • connection between the wiring conductor and the insulation substrate is possible.
  • the convex portion may be formed by deforming the wiring conductor in a thickness direction.
  • the convex portion can be solidly formed.
  • the base body may have a plurality of holes.
  • a linear expansion coefficient of the conductor made of metal is different from that of the base body made of resin, a deformation due to thermal stress may occur in the antenna device.
  • a degree of the deformation can be controlled.
  • a mass of the resin is reduced, so that the lightweight antenna device can be implemented.
  • the antenna device could withstand drop impact. This result contributes to a reliability improvement of the antenna device.
  • the antenna device which allows high density packaging of the electrical component and is formed to have a lower height can be provided.
  • a chip antenna (antenna device) according to an embodiment is mounted on a motherboard (circuit board) 90.
  • the antenna 1 is included in a mobile device such as a mobile phone and can receive digital terrestrial television broadcasting.
  • the antenna 1 includes a base body 2 made of a dielectric material such as resin, and the base body 2 is formed substantially in a shape of a rectangular pipe.
  • the base body 2 has a top surface 4 and a bottom surface 6 formed in a substantially rectangular shape, and the bottom surface 6 faces the board 90.
  • longer sides of the top and bottom surfaces 4 and 6 are connected to corresponding side surfaces 10 and 10.
  • the side surface 10 has a stepped portion 12 formed in a lengthwise direction (longitudinal direction) of the base body 2. There is an increase in thickness of the stepped portion 12 in a direction from the top surface 4 toward the bottom surface 6. More specifically, an area of the bottom surface 6 is larger than that of the top surface 4, and a cross-section of the base body 2 in a width direction (transverse direction) substantially perpendicular to the lengthwise direction has a convex-up shape.
  • a concave portion 16 is formed between short sides of the top and bottom surfaces 4 and 6 and a rear end surface 22.
  • the base body 2 has the concave portion 16 caused by a stepped portion formed from the top surface 4 toward the board 90 on the rear end side of the antenna 1.
  • the concave portion 16 has a top surface 18 and a bottom surface 20 (see Figs. 4 and 5 ), and on the top surface 18, a matching circuit 80 is mounted (see Fig. 1 ).
  • the matching circuit 80 has an insulation substrate 82 with a predetermined circuit pattern.
  • the substrate 82 has the substantially the same size as the top surface 18, and an electrical component 84 in a chip shape is mounted on a surface of the substrate 82.
  • the concave portion 16 is configured such that the electrical component 84 is substantially at the same height as or lower than the top surface 4 of the base body 2.
  • the base body 2 according to the embodiment is provided with an insert-molded conductor pattern 30 formed by plating Ni/Au on Corson Cu, and portions of the pattern 30 are exposed from the base body 2.
  • the conductor pattern 30 is constituted by a radiation conductor 31 and a wiring conductor 50, and the radiation conductor 31 and the wiring conductor 50 are connected in the longitudinal direction of the base body 2.
  • the radiation conductor 31 according to the embodiment is formed in a spiral shape, and a central axis of the radiation conductor 31 is substantially aligned with a longitudinal axis of the base body 2.
  • a cross-section of the radiation conductor 31 in a width direction of the base body 2, that is, in a direction substantially perpendicular to a central axis of the spiral, is substantially octagonal.
  • the conductor 31 includes upper conductor portions 32 provided to the top surface 4 of the base body 2.
  • 8 conductor portions 32 including a radiation electrode 38 that is disposed on the front end side of the antenna 1 are disposed in the width direction of the base body 2 and extended in parallel with the board 90.
  • Each of the conductor portions 32 is provided with oblique sides 32a and 32a at both ends.
  • the radiation electrode 38 has a larger area than the 7 upper conductor portions 32 and radiates radio waves in the air.
  • the radiation conductor 31 includes lower conductor portions 34 provided to the bottom surface 6 of the base body 2.
  • 8 conductor portions 34 are disposed in the width direction of the base body 2. Specifically, of the corresponding conductor portions 34, one is disposed between the radiation electrode 38 and the upper conductor portion 32, one is disposed between the adjacent two upper conductor portions 32, and one is disposed between the upper conductor portion 32 and the wiring conductor 50.
  • the conductor portions 34 are extended in parallel with the board 90, and each of the conductor portions 34 is provided with oblique sides 34a and 34a at both ends.
  • the radiation electrode 38, the 7 upper conductor portions 32, and the 8 lower conductor portions 34 are disposed alternately in the central axial direction of the spiral with connection portions 36 interposed therebetween, as illustrated in Fig. 8 as well as in Fig. 7 .
  • an end of the radiation electrode 38 is connected to the connection portion 36, and the connection portion 36 is connected to an end of the lower conductor portion 34.
  • the other end of the lower conductor 34 is connected to another connection portion 36, and the connection portion 36 is connected to an end of the upper conductor portion 32.
  • connection portion 36 is connected to an end of another lower conductor portion 34.
  • the upper conductor portions 32, the lower conductor portions 34, and the connection portions 36 are connected in a direction from the front end side to the rear end side of the antenna 1.
  • connection portion 36 is formed integrally with the upper conductor portion 32 and the lower conductor portion 34 and constituted by an upper connection portion 36a connected to the oblique side 32a of the upper conductor portion 32, a lower connection portion 36b connected to the oblique side 34a of the lower conductor portion 34, and an intermediate connection portion 36c connecting the upper connection portion 36a to the lower connection portion 36b.
  • connection portion 36c is formed in the central axial direction of the spiral, and along with the conductor portions 32 and 34, extended to be parallel with the board 90. A lower surface of the connection portion 36c is engaged with the stepped portion 12 (see Fig. 5 ).
  • one intermediate connection portion 36c is connected to one upper connection portion 36a and one lower connection portion 36b and supports the upper conductor portion 32 and the lower conductor portion 34 with the oblique sides 32a and 34a interposed therebetween (see Figs. 7 and 8 ).
  • the upper conductor portion 32 supported by the upper connection portion 36a is supported by the other upper connection portion 36a provided to the other intermediate connection portion 36c with the oblique side 32a at the opposite side.
  • the other lower connection portion 36b provided to the other intermediate connection portion 36c supports the other lower conductor portion 34 adjacent to this upper conductor portion 32.
  • the radiation electrode 38, the 7 upper conductor portions 32, and the 8 lower conductor portions 34 are connected in the direction from the front end side to the rear end side of the antenna 1, and a plan view or a bottom view of the antenna 1 shows a substantially meander shape.
  • a length of the radiation conductor 31 corresponds to, for example, an about 1/4 wavelength of a radio wave.
  • the first to third lower conductor portions 34 from the front end side of the antenna 1 are each provided with a convex portion 42, and the eighth from the front end side of the antenna, that is, the first lower conductor portion 34 from the rear end side of the antenna 1 is also provided with a convex portion 42 (see Figs. 6 , 8 , and so on).
  • the convex portion 42 is formed by deforming the lower conductor portion 34 by a drawing process in a thickness direction thereof so as to have a substantially rectangular shape, and a longitudinal axis of each convex portion 42 is substantially perpendicular to the central axis of the spiral.
  • the four convex portions 42 protrude from the bottom surface 6 of the base body 2 toward the board 90 and are each exposed from the bottom surface 6 to be connected to an open wire of the board 90 with solder.
  • a boundary portion between the radiation conductor 31 and the wiring conductor 50 is divided into two branches. Specifically, as illustrated in Figs. 7 and 8 , at this branch point, first, an installation portion 46 extended from the lower conductor portion 34 is formed in a direction substantially perpendicular to the central axis of the spiral. Accordingly, the convex portion 42 formed at the installation portion 46 has substantially the same length as that of the other convex portion 42.
  • a connector 44 is provided.
  • the connector 44 is extended in the central axial direction of the spiral to be connected to the wiring conductor 50.
  • the wiring conductor 50 includes a power supply electrode 52, a GND electrode 54, and a circuit electrode 60.
  • the circuit electrode 60 is disposed at a vicinity of the connector 44
  • the GND electrode 54 is disposed to be adjacent to the rear end surface 22
  • the power supply electrode 52 is disposed between the GND electrode 54 and the circuit electrode 60.
  • the convex portion 64 of the circuit electrode 60, the power supply electrode 52, and the GND electrode 54 are formed by a drawing process to protrude from the bottom surface 22 toward the board 90 (see Figs. 4 , 8 , and so on) and exposed from the bottom surface 20.
  • the power supply electrode 52 is connected to a power supply wire of the board 90 with solder and is supplied with a power supply voltage or a control voltage from a high-frequency circuit such as a tuner module.
  • the GND electrode 54 and the convex portion 64 of the circuit electrode 60 are connected to a grounding wire of the board 90 and the open wire of the board 90 with solder, respectively.
  • the aforementioned convex portions 42 and 64 are formed at the radiation conductor 31 and the wiring conductor 50, respectively, and the antenna 1 according to the embodiment is supported by the convex portions 42 and 64 at both end portions in the longitudinal direction of the base body 2.
  • the convex portions may be formed at both ends (portions nearest to the front end surface 8 and the rear end surface 22) of the base body 2.
  • Convex portions 62 protruding upward from the top surface 18 are formed at the power supply electrode 52, the GND electrode 54, and the connector 44 of the circuit electrode 60.
  • the power supply electrode 52, the GND electrode 54, and the connector 44 of the circuit electrode 60 penetrate the top surface 18 and the bottom surface 20.
  • the total 6 convex portions 62 are formed by the drawing process and exposed from the top surface 18 to be connected to a terminal of the insulation substrate 82 with solder.
  • the wiring conductor 50 is connected to the power supply wire of the board 90 to be supplied with power and connected to the matching circuit 80.
  • the electrical component 84 of the matching circuit 80 performs matching so that energy losses during transmission between the power supply wire of the board 90 and the radiation conductor 31 do not occur.
  • a tuning circuit On the insulation substrate 82 according to the embodiment, in addition to the electrical component 84 for performing impedance matching, a tuning circuit is mounted.
  • the tuning circuit has a variable-capacitance diode. When a voltage applied to the diode is controlled, accurate channel selection or changing an effective length of the radiation conductor 31 is possible.
  • punching is performed on the thin plate to form the radiation conductor 31 and the wiring conductor 50.
  • a case where a single antenna 1 is manufactured is described. However, when a plurality of antennas 1 are to be manufactured, the punching is performed on a long thin plate to form a plurality of conductors 31 and 50.
  • a hoop material 70 is formed by using the thin plate.
  • the hoop material 70 is partitioned into a large frame 72 and a small frame 72 formed inside, and legs 79 are formed at the front end side and the rear end side of the antenna 1 for connection between the large frame 72 and the small frame 76.
  • the punching is performed to form the radiation conductor 31, that is, the aforementioned radiation electrode 38, the upper conductor portion 32, the lower conductor portion 34, the connection portion 36, and the connector 44 and to enable the connection portion 36 to be connected to the small frame 76.
  • the punching is performed to form the wiring conductor 50, that is, the power supply electrode 52, the GND electrode 54, and the circuit electrode 60 so as to enable the power supply electrode 52, the GND electrode 54, and the circuit electrode 60 to be connected to the small frame 76.
  • the wiring conductor 50 that is, the power supply electrode 52, the GND electrode 54, and the circuit electrode 60
  • pilot holes 74 and 78 are formed, respectively.
  • the leg 79 disposed at the front end side of the antenna 1 is pressed upward so that the radiation electrode 38 and the upper conductor portion 32 are disposed above the connection portion 36, and more particularly, the intermediate connection portion 36c. This is because the upper connection portion 36a is formed upward from the intermediate connection portion 36c.
  • the oblique side 32a and the like are formed, and the convex portions 62 of the power supply electrode 52, the GND electrode 54, and the circuit electrode 60 are formed.
  • the lower connection portion 36b is formed downward from the intermediate connection portion 36c so that the lower conductor portion 34 can be disposed below the intermediate connection portion 36c.
  • the oblique portion 34 is also formed.
  • corresponding portions of the connector 44, the power supply electrode 52, the GND electrode 54, and the circuit electrode 60 are formed downward. Additionally, as illustrated in Fig. 10 , the corresponding portions of the power supply electrode 52 and the GND electrode 54 are formed to protrude downward, simultaneously, the convex portion 64 is formed at the circuit electrode 60, and the convex portion 42 is formed at the lower conductor portion 34.
  • the small frame 76 is disposed inside a mold after performing the pressing. Specifically, two molds 2 having a ⁇ -shaped cross-section in the width direction of the base body 2 are prepared and disposed at upper and lower sides of the small frame 76 so that openings of the two molds face each other with the small frame 76 interposed therebetween. Accordingly, the radiation conductor 31 and the wiring conductor 50 are disposed inside the molds, and portions of the small frame 76 around the conductors and the leg 79 are disposed outside the molds.
  • an upper surface of the intermediate connection portion 36c comes in contact with a vicinity of the opening of the mold (movable side) disposed above the small frame 76.
  • a lower surface thereof is disposed inside a vicinity of the opening of the mold (fixed side) disposed below the small frame 76.
  • a resin is injected upward from the fixed side mold. Accordingly, the base body 2 in the shape of a substantially rectangular pipe is formed along with the concave portion 16 (see Fig. 11 ), and portions of the radiation conductor 31 and the wiring conductor 50 are buried in the base body 2.
  • a reference numeral 24 in Figs. 4 and 6 denotes an injection hole of the aforementioned resin.
  • connection portion 36a and the intermediate connection portion 36a of the connection portion 36 are exposed.
  • the lower surface of the intermediate connection portion 36a is not exposed ( Figs. 2 and 4 ). This is because the lower surface is disposed inside the vicinity of the opening of the mold and engaged with the stepped portion 12.
  • the base body 2 into which the radiation conductor 31 and the wiring conductor 50 are insert-molded, the aforementioned large frame 74, and the small frame 76 are cut.
  • a lower mold (die) 86 is disposed below the small frame 76, and the die 86 is attached to the side surface 10.
  • an upper mold (punch) 88 is disposed above the small frame 76.
  • an edge of the punch 88 comes in contact with the stepped portion 12, and the edge of the punch 88 is disposed inward from an edge of the die 86.
  • the punch 88 cuts the intermediate connection portion 36c from the small frame 76 disposed outside the stepped portion 12.
  • the punch 88 and the die 86 simultaneously cut the power supply electrode 52, the GND electrode 54, and the circuit electrode 60 from the small frame 76 and cut the radiation electrode 38 and the GND electrode 54 from the leg 79 and 79, respectively. Thereafter, when the matching circuit 80 or the insulation substrate 82 of the tuning circuit is mounted on the concave portion 16, the antenna 1 is completed.
  • the aforementioned base body 2 may have a plurality of holes.
  • a plurality of holes may be formed between the top surface 4 and the bottom surface 6 of the base body 2. Since a linear expansion coefficient of the radiation conductor 31 or the wiring conductor 50 that is made of metal is different from that of the base body 2 made of resin, a deformation due to thermal stress may occur in the antenna 1. However, when the aforementioned holes are provided, as compared with an antenna without holes, a degree of the deformation can be controlled. In addition, a mass of the resin is reduced, so that the lightweight antenna 1 can be implemented. As a result, for example, during a drop test, the antenna 1 could withstand drop impact. This result contributes to a reliability improvement of the antenna 1.
  • the electrical component 84 in the chip shape is not directly mounted on the base body 2 but mounted on the insulation substrate 82. Therefore, as compared with a case where the electrical component 84 is directly mounted on the base body 2, high density packaging of the electrical component 84 is possible.
  • the insulation substrate 82 having the electrical component 84 is not mounted on the motherboard 90 but mounted on the base body 2. Therefore, as compared with a case where the insulation substrate 82 is mounted on the motherboard 90, the motherboard 90 requires a smaller space.
  • the antenna 1 has the electrical component 84 for matching between the power supply wire of the motherboard 90 and the radiation conductor 31, as compared with a case without the electrical component 84, the antenna 1 can be easily adjusted, and this improves convenience of the antenna 1.
  • the base body 2 is provided with the concave portion 16 and the concave portion 16 is configured such that the electrical component 84 is substantially at the same height as or lower than the top surface 4 of the base body 2, a top portion of the electrical component 84 does not protrudes from the top surface 4.
  • the antenna 1 can be implemented to have a lower height.
  • the wiring conductor 50 made of metal is insert-molded into the base body 2 made of resin, the wiring conductor 50 cannot be easily separated from the base body 2.
  • the wiring conductor 50 is insert-molded into the base body 2, the wiring conductor 50 cannot be formed in a very small pattern.
  • the electrical component 84 is mounted on the insulation substrate 82. Accordingly, although the wiring conductor 50 is insert-molded into the base body 2, high density packaging of the electrical component 84 is possible.
  • the wiring conductor 50 has the convex portion 62 that is exposed from the base body 2 and connected to the terminal of the insulation substrate 82 with the solder, a joint area between the convex portion 62 and the solder increases, and the solder extends to surround the convex portion 62, so that joint strength between the convex portion 62 and the solder can be increased.
  • connection between the wiring conductor 50 and the insulation substrate 82 is possible.
  • the convex portion 62 when the convex portion 62 is formed by performing the drawing process, the convex portion 62 can be solidly formed.
  • the conductor pattern 30 made of metal which includes the radiation conductor 31 in addition to the wiring conductor 50 is inserted-molded into the base body 2, the conductor pattern 30 cannot be easily separated from the base body 2, and this enhances reliability of the antenna 1.
  • the conductor pattern 30 When the conductor pattern 30 is insert-molded into the base body 2, the conductor pattern 30 is buried in the base body 2, and the bottom surface 6 of the base body 2 becomes flat.
  • the conductor pattern 30 according to the embodiment has the convex portions 42 and 64, and the convex portions 42 and 64 are exposed from the base body 2 and connected to the wire of the board 90 with solder.
  • the convex portions 42 and 64 are disposed at the both end portions of the base body 2 in the longitudinal direction, a gap between the substantially center portion of the base body 2 in the longitudinal direction and the board 90 occurs. Specifically, even when bending occurs in the board 90, the substantially center portion of the base body 2 cannot easily contact to the board 90. In other words, impact of the base body 2 on the board 90 hardly occurs. Therefore, the base body 2 can be fixed to the board 90 more securely. As a result, during a drop test, the antenna 1 could withstand drop impact. This result contributes to a reliability improvement of the antenna 1.
  • the convex portions 42 and 64 are formed at the both ends of the base body 2 in the longitudinal direction, a gap between the substantially center portion of the base body 2 and the board 90 occurs.
  • the base body 2 can be supported with respect to the board 90 more stably.
  • each convex portion 42 and 64 is exposed from the base body, a size of each convex portion is limited. As described above, although the sizes of the convex portions 42 and 64 are limited, when three or more convex portions 42 and 64 are formed, joint strength between the convex portions 42 and 64 and the solder can be guaranteed.
  • the boundary portion between the radiation conductor 31 and the wiring conductor 50 is divided into the two branches, and a connection point (the connector 44) with the wiring conductor 50 is disposed on the central axis of the spiral.
  • the installation portion 46 is provided, the size of the convex portion 42 formed on the installation portion 46 is not small.
  • the radiation conductor 31 since the portions of the radiation conductor 31 are buried in the base body 2, as compared with a case where the radiation conductor 31 is formed on the surface of the base body 2, the radiation conductor 31 can be securely maintained in the base body 2. As a result, the radiation conductor 31 cannot be easily separated from the base body 2, the spiral pitch of the radiation conductor 31 can be accurately maintained.
  • the portions of the radiation conductor 31 can be easily buried in the base body 2.
  • the aforementioned oblique sides 32a and 34a are buried in the base body 2 in the shape of a substantially rectangular pipe, separation of the radiation conductor 31 from the base body 2 can be prevented.
  • the radiation conductor 31 is formed integrally with the lower conductor portion 34, the upper conductor portion 32, and the connection portion 36. Therefore, the radiation conductor 31 can be formed by using a single metal plate. Accordingly, as compared with a case where an upper portion and a lower portion of a radiation conductor are separately provided, the number of components can be reduced, and the strength thereof can be increased.
  • the number of components can further be reduced.
  • connection portion 36 has the intermediate connection portion 36c.
  • the intermediate connection portion 36c extends in the arrangement direction of the lower and upper conductor portions 34 and 32 and serves as a branch connection from which the lower and upper conductor portions 34 and 32 are divided. Therefore, the radiation conductor 31 can be formed in the spiral shape by using the single metal plate.
  • the length of the radiation conductor 31 can be maximized.
  • the lower connection portion 36b is formed downward from the intermediate connection portion 36c, so that the lower conductor portion 34 can be disposed below the intermediate connection portion 36c.
  • the upper conductor portion 32 is pressed upward, with respect to a point at which the upper connection portion 36a is formed upward from the intermediate connection portion 36c, the upper conductor portion 32 is disposed above the intermediate connection portion 36c. Accordingly, the radiation conductor 31 in the spiral shape can be easily formed.
  • connection portion 36 is maintained to be engaged with the stepped portion 12 formed at the side surface 10 of the base body 2, that is, to surround the stepped portion 12. Therefore, the radiation conductor 31 does not protrude from the side surface 10 of the base body 2 and thus does not affect the manufacturing efficiency, so that a desirable outer appearance can be formed.
  • the base body 2 can be stably mounted on the board 90.
  • the conductors 31 and 50 can be formed to be connected to the small frame 76.
  • the radiation conductor 31 and the wiring conductor 50 are insert-molded into the base body 2.
  • the lower surface of the intermediate connection portion 36c is engaged with the stepped portion 12.
  • the punch 88 is disposed at the stepped portion 12
  • the intermediate connection portion 36c is disposed between the stepped portion 12 and the punch 88
  • the die 86 is disposed at the base body 2 to cut the intermediate connection portion 36c from the small frame 76. Accordingly, the connection portion 36c does not protrude from the side surface 10 of the base body 2.
  • the aforementioned radiation electrode 38 has a larger area than the upper conductor portion 32, and a portion on which a strong electric field is exerted has a larger area. Therefore, a radiation efficiency of radio waves can be increased, and reception of radio waves can be increased due to transception characteristics.
  • the antenna 1 when the antenna 1 is provided to a mobile device, the antenna 1 is disposed at an outer surface of a housing of the mobile device. Therefore, a whip antenna that has to be extended to be used is not needed. Accordingly, a smaller or thinner mobile device can be easily implemented.
  • the radiation conductor 31 according to the embodiment is spiral, that is, helical.
  • the shape thereof is not limited thereto, and for example, a meander shape can be employed.
  • the antenna 1 may receive other signal waves in addition to the digital terrestrial television broadcasting and be included in a personal digital assistant (PDA) or a notebook.
  • PDA personal digital assistant

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Support Of Aerials (AREA)
  • Details Of Aerials (AREA)
EP09000532A 2008-01-28 2009-01-15 Antenna device Withdrawn EP2083473A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008015836A JP2009177660A (ja) 2008-01-28 2008-01-28 アンテナ装置

Publications (1)

Publication Number Publication Date
EP2083473A1 true EP2083473A1 (en) 2009-07-29

Family

ID=40592044

Family Applications (1)

Application Number Title Priority Date Filing Date
EP09000532A Withdrawn EP2083473A1 (en) 2008-01-28 2009-01-15 Antenna device

Country Status (2)

Country Link
EP (1) EP2083473A1 (ja)
JP (1) JP2009177660A (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20170117610A1 (en) * 2014-06-13 2017-04-27 Ntn Corporation Chip antenna

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003229717A (ja) 2002-02-04 2003-08-15 Murata Mfg Co Ltd アンテナ一体型高周波回路モジュール
JP2005210680A (ja) 2003-12-25 2005-08-04 Mitsubishi Materials Corp アンテナ装置
US20060135061A1 (en) * 2004-12-07 2006-06-22 Zhinong Ying Digital video broadcast-handheld (DVB-H) antennas for wireless terminals
WO2006134701A1 (ja) * 2005-06-17 2006-12-21 Murata Manufacturing Co., Ltd. アンテナ装置及び無線通信機
JP2008015836A (ja) 2006-07-06 2008-01-24 Konica Minolta Business Technologies Inc 画像形成装置、画像形成システム、および画像形成装置の制御方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003229717A (ja) 2002-02-04 2003-08-15 Murata Mfg Co Ltd アンテナ一体型高周波回路モジュール
JP2005210680A (ja) 2003-12-25 2005-08-04 Mitsubishi Materials Corp アンテナ装置
US20060135061A1 (en) * 2004-12-07 2006-06-22 Zhinong Ying Digital video broadcast-handheld (DVB-H) antennas for wireless terminals
WO2006134701A1 (ja) * 2005-06-17 2006-12-21 Murata Manufacturing Co., Ltd. アンテナ装置及び無線通信機
JP2008015836A (ja) 2006-07-06 2008-01-24 Konica Minolta Business Technologies Inc 画像形成装置、画像形成システム、および画像形成装置の制御方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20170117610A1 (en) * 2014-06-13 2017-04-27 Ntn Corporation Chip antenna
US10079426B2 (en) * 2014-06-13 2018-09-18 Ntn Corporation Chip antenna

Also Published As

Publication number Publication date
JP2009177660A (ja) 2009-08-06

Similar Documents

Publication Publication Date Title
US6943734B2 (en) Multi-band omni directional antenna
US9270027B2 (en) Notch-antenna array and method for making same
US6812892B2 (en) Dual band antenna
KR101744886B1 (ko) 마이크로 스트립 패치 안테나
EP3301758A1 (en) Antenna element
US7432859B2 (en) Multi-band omni directional antenna
CN107438919B (zh) 天线阵列组件、其构造方法及无线电终端
KR101319867B1 (ko) 대수주기 안테나
US11018434B2 (en) Antenna apparatus, and manufacturing method
CN111987422A (zh) 一种超低剖面多频宽带天线及通信设备
KR20110037782A (ko) 다중 대역을 가지는 차폐형 안테나 장치
CN103299482B (zh) 具有低无源互调的微带至空气带的转换件
US20080106485A1 (en) Portable electronic device and antenna thereof
US20100238076A1 (en) Printed antenna with improved mounting structure and electronic apparatus using the same
EP2083473A1 (en) Antenna device
EP2312688A2 (en) Wireless communication device and method of using the same
WO2022234748A1 (ja) アンテナ素子、電子機器及びアンテナ素子の製造方法
JP4904336B2 (ja) レーダ装置用アンテナおよびその製造方法
CN203968484U (zh) 高频信号线路及电子设备
CN115986382A (zh) 介质谐振器天线、介质谐振器天线模块和电子装置
CN110311208B (zh) 在pcb集成喇叭天线的无线通信设备、生产方法和用途
JP2009177661A (ja) アンテナ装置
US20050206578A1 (en) Dual band antenna
JP2009177662A (ja) アンテナ装置
CN201576754U (zh) 阵列式天线

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK TR

AX Request for extension of the european patent

Extension state: AL BA RS

AKX Designation fees paid
STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN

18D Application deemed to be withdrawn

Effective date: 20090730

REG Reference to a national code

Ref country code: DE

Ref legal event code: 8566