EP2069740A1 - Capteur de pression pour une detection de choc lateral et procede de conception d'une surface d'un materiel de protection pour un capteur de pression - Google Patents

Capteur de pression pour une detection de choc lateral et procede de conception d'une surface d'un materiel de protection pour un capteur de pression

Info

Publication number
EP2069740A1
EP2069740A1 EP07788040A EP07788040A EP2069740A1 EP 2069740 A1 EP2069740 A1 EP 2069740A1 EP 07788040 A EP07788040 A EP 07788040A EP 07788040 A EP07788040 A EP 07788040A EP 2069740 A1 EP2069740 A1 EP 2069740A1
Authority
EP
European Patent Office
Prior art keywords
pressure sensor
protective material
housing
pressure
sensor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP07788040A
Other languages
German (de)
English (en)
Inventor
Boris Adam
Ronny Ludwig
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of EP2069740A1 publication Critical patent/EP2069740A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/141—Monolithic housings, e.g. molded or one-piece housings
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/0007—Fluidic connecting means
    • G01L19/0038—Fluidic connecting means being part of the housing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/148—Details about the circuit board integration, e.g. integrated with the diaphragm surface or encapsulation

Definitions

  • the invention relates to a pressure sensor for a side impact sensing or a method for forming a surface of a protective material for a pressure sensor according to the preamble of the independent claims.
  • a pressure sensor for side impact detection is already known in which a channel allows a direct flow of air to a sensor element.
  • the sensor element can be protected by a membrane.
  • the channel is realized by means of several housing parts.
  • the manufacturing process is correspondingly simple to make, since a tool for creating the corresponding surface is once made and then can be used again and again.
  • the lateral access makes it possible to minimize or even eliminate the direct influence of corrosive media, such as moisture and also the direct influence of mechanical influences.
  • the pressure inlet duct can be designed in such a way that condensation water can easily flow outwards. This can be achieved by slants, curves and rejuvenation, etc.
  • the housing cover is simplified because it only has to have an opening.
  • the pressure sensor according to the invention allows the access opening in the bottom of the surrounding
  • the surface of the protective material such as epoxy
  • the formation of the invention can be carried out in anyway provided manufacturing step.
  • the protective material may be a resin such as epoxy or a plastic.
  • the integrated circuit which in the present case is designed as an ASIC, provides signal conditioning of the pressure signal and transmission to a control unit.
  • the pressure sensor element of which several, as well as a plurality of integrated circuits can be provided, is usually formed micromechanically, wherein a pressure change is expressed, for example, in a change in resistance of a Wheatstone bridge, which is a voltage change after the
  • the pressure sensor element is arranged in a so-called cavity, ie an opening or depression in the protective material subsequently.
  • the pressure inlet channel is ultimately formed from the interaction with a standard housing part, such as a lid or an overall housing.
  • the surface of the protective material nevertheless has a distinct structure, in particular one Well on that leads to the pressure sensor element. This channel according to the invention can expand to the pressure sensor element.
  • a cover is provided as the housing part, which has a first opening, so that this cover forms a first housing of the pressure sensor with the protective material.
  • the lid is then preferably connected to the protective material, so that the lid is mounted directly on top of the protective material and provides the cover for the pressure inlet channel.
  • a depression in the protective material provides the actual
  • the protective material with the cavity and the integrated circuit may be arranged in a second housing that surrounds the protective material.
  • This second housing has a second opening to communicate with the
  • first and second housings are connected via a first seal between the first and second openings. If only the second housing is present, then the protective material is connected to a corresponding seal with this second housing.
  • the protective material is sprayed or processed by a transfer molding process.
  • a transfer molding process it surrounds the at least one integrated circuit completely, while for the pressure sensor element a cavity is formed by a tool which at the same time also forms the surface of the
  • the housing thus represented thus represents a combination of a premold housing and a mold housing, wherein the arrangement for this application advantageously shown laterally to each other - A -
  • the cavity in the premold housing part allows retrofitting of the sensor element.
  • This housing is formed during the molding process by the shaping of the tool.
  • FIG. 1 shows a block diagram of the pressure sensor with connected components
  • FIG. 2 shows a first plan view of a first variant of the pressure sensor according to the invention, but without a sensor element
  • Figure 3 is a side view of the first variant, but without sensor element and ASIC
  • Figure 4 is a sectional view of the first variant, with sensor element and ASIC
  • FIG. 5 shows a further plan view of the first variant with lid
  • Figure 6 shows an interaction of the first and second housing of the invention
  • Figure 7 is a plan view of a second variant, but without sensor element
  • Figure 8 is a side view of a second variant, but without sensor element
  • Figure 9 is a sectional view of the second variant with sensor element and ASIC and Figure 10 shows the second variant in the installation with a surrounding housing and Figure 11 is a flow chart of the method according to the invention.
  • FIG. 1 shows a block diagram of the interaction of the pressure sensor according to the invention with other components of a personal protection system in a vehicle.
  • the pressure sensor PPS comprises the pressure sensor element DSE and an integrated circuit ASIC.
  • Pressure sensor element which is micromechanically manufactured as shown above, measures air pressure fluctuations, since such air pressure fluctuations in a side part of a vehicle for side impact detection can be utilized. In this case, a proportion of an adiabatic increase in air pressure can also be determined with a compression of the volume in the side part.
  • the integrated circuit ensures a work-up the pressure sensor signal, ie a gain, digitization and transmission via a line to a control unit SG, which controls one or more personal protection means PS.
  • the pressure sensor data is received in the control unit SG via an interface IF, which in the present case is embodied as a hardware. It is possible that this data will be received directly from the microcontroller.
  • the microcontroller ⁇ C is the central element of the control unit SG.
  • the microcontroller ⁇ C executes a triggering algorithm on the measured pressure sensor data.
  • other processor types, ASICs or discrete components can be used as an evaluation circuit.
  • the microcontroller .mu.C transmits a trigger signal to a drive circuit FLIC. This drive circuit provides in response to the trigger signal for activation of
  • the drive circuit FLIC has corresponding evaluation modules in order to be able to evaluate the software command of the microcontroller ⁇ C.
  • Parallel evaluations, in particular a plausibility check, have been omitted here for the sake of simplicity as well as other components necessary for the operation of the control unit SG, which, however, are not for the understanding of the
  • the pressure inlet channel for the pressure sensor element DSE is achieved by the design of the surface of the protective material in cooperation with a further housing part such as a lid or a housing surrounding the protective material. This is a particular simple realization of such a pressure inlet channel.
  • FIG. 2 shows a first variant in a plan view.
  • a leadframe 20, the z. B. can be translated as a carrier strip is already with respect to an integrated
  • Ummoldet circuit wherein in a further process step, a cavity 21 is provided into which the pressure sensor element is mounted in a further process step.
  • this cavity 21 and also a pressure inlet channel 22 are produced, so that a depression of the protective material, in this case of an epoxide, which was injected in comparison to the surface of the protective material 23 originated.
  • the diameter of this pressure inlet channel 22 widens to the cavity 21 in order to fully flow the pressure sensor element over the entire width.
  • the opposite end of this pressure inlet channel 22 is formed semicircular to correspond to a Druckeinlassöffhung in a housing.
  • the three legs arranged at the top and bottom on the left side are associated with the pressure sensor element in the cavity 21, not shown in FIG. 2, while the six legs located at the top and at the bottom are assigned to the integrated circuit.
  • FIG. 3 shows a side view or side view of this first variant.
  • the leadframe 30 of the pressure sensor element is concealed and therefore shown in dashed lines.
  • the fully ummoldete leadframe 33 of the integrated circuit is shown.
  • the pressure inlet channel 32 leads to an opening 31 above the pressure sensor element.
  • FIG. 4 shows a sectional view of the first variant.
  • An ASIC 43 is present fully ummoldet, here with an epoxy. However, it is also possible to use plastics such as PEEK or LCP.
  • a micromechanical Durcksensorelement 41 preferably secured with adhesive.
  • This housing cover 45 has an opening 44 through which the air pressure can penetrate into the pressure inlet channel in order to flow laterally on the sensor element 41.
  • the pressure sensor element 41 is surrounded by a passivation material 42, which forms a thin layer over the pressure-sensitive sensor membrane.
  • bonding wires 40 can be seen, which connect the sensor 41 with the leads present in the cavity and thus with the outside world.
  • FIG. 6 shows the first variant in cross-section and a connection via a seal to the second housing, which surrounds the protective material with the first housing.
  • This second housing 61 for example made of metal, has a pressure inlet 67, which is guided via seals 60 to the pressure inlet channel 63.
  • the housing cover 62 protects this channel 63 and forms it by its presence.
  • the housing cover 62 is in
  • the pressure inlet channel 63 allows lateral flow of the pressure sensor element 66.
  • an integrated circuit 64 In the fully rewetted state is an integrated circuit 64, which takes over the signal conditioning and transmission of the pressure sensor signal.
  • FIG. 7 shows a plan view of this second variant. Again, the lead frame 72 can be seen and a cavity 71, which is flowed from a pressure inlet channel 70 with the corresponding air pressure from the outside. Again, this pressure inlet passage 70 widens to the full width of the cavity 71 to flow with air pressure. The pressure inlet channel 70 is recessed in comparison to the remaining height of the protective layer 73.
  • FIG. 8 shows a side view or side view of this second variant. Since hidden, the leadframes of the pressure sensor element 80 and the integrated circuit 83 are shown in dashed lines. In the protective material 82, the pressure inlet passage 81 is formed. Clearly visible is the cavity 84, in which the nixht drawn
  • Pressure sensor element 80 is installed.
  • FIG. 9 shows a sectional illustration of this second variant.
  • the pressure sensor element 93 is installed in the cavity and is laterally flowed via a pressure inlet channel 90 with the air pressure from the outside.
  • the integrated circuit 92 is arranged in the protective material 91. Electrical connections to the pressure sensor element 93 have been omitted for the sake of simplicity, as well as the electrical connections to the outside.
  • FIG. 10 illustrates the use of the second variant in conjunction with a housing.
  • Circuit 101 and has a cavity, in which the pressure sensor element 104 is installed.
  • a pressure inlet channel 102 leads to a lateral flow of the pressure sensor element 104.
  • the housing 105 which may be a housing cover or housing bottom, has an opening 103.
  • the protective material 100 is via seals 106, preferably a circumferential seal, connected to the housing 105 such that the pressure can only reach the sensor element 105.
  • FIG. 11 shows in a flow chart the method according to the invention for forming the surface of the protective material and the method for further assembly.
  • Process step 130 is the Molden of the integrated circuit.
  • the design of the mold tool generates the cavity for the pressure sensor element and the surface depression for the pressure inlet channel.
  • the pressure sensor element is installed in the cavity and in method step 132, the resulting chip housing is installed in a surrounding housing, wherein a housing part then leads to the pressure inlet channel being realized.

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Fluid Pressure (AREA)
  • Air Bags (AREA)

Abstract

L'invention propose un capteur de pression pour une détection de choc latéral et un procédé de conception d'une surface d'un matériel de protection pour un capteur de pression. Un matériel de protection enveloppe ici complètement au moins un circuit de commutation intégré et le matériel de protection présente une cavité dans laquelle est monté au moins un élément de détection de pression, une surface du matériel de protection étant conçue de telle sorte qu'un canal d'admission de pression est produit par une coopération de la surface avec au moins un élément de boîtier. Le canal d'admission de pression permet un accès latéral sur au moins un élément de détection de pression.
EP07788040A 2006-09-15 2007-07-30 Capteur de pression pour une detection de choc lateral et procede de conception d'une surface d'un materiel de protection pour un capteur de pression Withdrawn EP2069740A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102006043323A DE102006043323A1 (de) 2006-09-15 2006-09-15 Drucksensor für eine Seitenaufprallsensierung und Verfahren zur Ausbildung einer Oberfläche eines Schutzmaterials für einen Drucksensor
PCT/EP2007/057839 WO2008031670A1 (fr) 2006-09-15 2007-07-30 Capteur de pression pour une dÉtection de choc latÉral et procÉdÉ de conception d'une surface d'un matériel de protection pour un capteur de pression

Publications (1)

Publication Number Publication Date
EP2069740A1 true EP2069740A1 (fr) 2009-06-17

Family

ID=38650045

Family Applications (1)

Application Number Title Priority Date Filing Date
EP07788040A Withdrawn EP2069740A1 (fr) 2006-09-15 2007-07-30 Capteur de pression pour une detection de choc lateral et procede de conception d'une surface d'un materiel de protection pour un capteur de pression

Country Status (5)

Country Link
US (1) US8353214B2 (fr)
EP (1) EP2069740A1 (fr)
JP (1) JP5156748B2 (fr)
DE (1) DE102006043323A1 (fr)
WO (1) WO2008031670A1 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008043644A1 (de) * 2008-11-11 2010-05-12 Robert Bosch Gmbh Drucksensor
US9021689B2 (en) * 2011-06-02 2015-05-05 Freescale Semiconductor, Inc. Method of making a dual port pressure sensor
DE102013208534A1 (de) * 2012-12-27 2014-07-03 Robert Bosch Gmbh Verfahren zum Herstellen eines Sensorgehäuses sowie entsprechendes Sensorgehäuse
DE102013217303A1 (de) * 2013-08-30 2015-03-05 Robert Bosch Gmbh Stanzgitter für ein Premold-Sensorgehäuse
FR3015026B1 (fr) * 2013-12-12 2016-01-29 Sc2N Sa Capteur de mesure

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57147027A (en) * 1981-03-06 1982-09-10 Nippon Denso Co Ltd Semiconductor pressure detector

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US5412994A (en) 1994-06-14 1995-05-09 Cook; James D. Offset pressure sensor
JPH08324379A (ja) 1995-05-30 1996-12-10 Toyota Motor Corp 車両用側面衝突検出装置
US5600071A (en) * 1995-09-05 1997-02-04 Motorola, Inc. Vertically integrated sensor structure and method
US5724229A (en) * 1996-03-27 1998-03-03 Unisys Corporation Electromechanical assembly having a lid which protects IC chips and holds contact springs
JPH10132677A (ja) * 1996-10-31 1998-05-22 Matsushita Electric Works Ltd 圧力センサ
JPH10132577A (ja) 1996-11-01 1998-05-22 Japan Aviation Electron Ind Ltd 光ファイバジャイロ
JP3620185B2 (ja) 1996-12-10 2005-02-16 株式会社デンソー 半導体センサ装置
JP3620184B2 (ja) 1996-12-09 2005-02-16 株式会社デンソー 圧力センサ
DE19923985B4 (de) 1999-05-25 2006-12-28 Siemens Ag Sensorbaugruppe mit einem an einer Wand montierbaren Gehäuse
DE10309713A1 (de) 2003-03-06 2004-09-16 Robert Bosch Gmbh Drucksensoranordnung zur Aufpralldetektion
DE10333964A1 (de) 2003-07-25 2005-02-24 Robert Bosch Gmbh Deckel für das Gehäuse einer Sensorbaugruppe mit einem Drucksensor
US7872686B2 (en) * 2004-02-20 2011-01-18 Flextronics International Usa, Inc. Integrated lens and chip assembly for a digital camera
US7162927B1 (en) * 2005-12-16 2007-01-16 Honeywell International Inc. Design of a wet/wet amplified differential pressure sensor based on silicon piezoresistive technology
US8155366B2 (en) * 2009-05-15 2012-04-10 Mwm Acoustics, Llc Transducer package with interior support frame

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57147027A (en) * 1981-03-06 1982-09-10 Nippon Denso Co Ltd Semiconductor pressure detector

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2008031670A1 *

Also Published As

Publication number Publication date
US20100307253A1 (en) 2010-12-09
WO2008031670A1 (fr) 2008-03-20
JP5156748B2 (ja) 2013-03-06
US8353214B2 (en) 2013-01-15
JP2010502999A (ja) 2010-01-28
DE102006043323A1 (de) 2008-03-27

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